CN109690419A - Detection device, detection method, patterning apparatus and article manufacturing method - Google Patents
Detection device, detection method, patterning apparatus and article manufacturing method Download PDFInfo
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- CN109690419A CN109690419A CN201780055797.7A CN201780055797A CN109690419A CN 109690419 A CN109690419 A CN 109690419A CN 201780055797 A CN201780055797 A CN 201780055797A CN 109690419 A CN109690419 A CN 109690419A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to the detection devices (25) that the position to the label on moveable object (3,4a) is detected.Detection device (25) includes control unit (24), it has as the function of determining mechanism, during from object (3,4a) reach target position until stablizing, determine that the speed of object (3,4a) becomes specified value opportunity below；Photographic unit (13,16) shoots label on the opportunity determined by control unit (24)；And testing agency (22,23), the position of label is detected based on the location information of the shooting result and the object on above-mentioned opportunity (3,4a) that are obtained by photographic unit (13,16).
Description
Technical field
The present invention relates to detection device, detection method, lithographic equipment and article manufacturing methods.
Background technique
In exposure device, alignment mark is formed by based on the substrate on the microscope carrier top plate being previously detected, is located at load
The position of reference mark (hereinafter referred to as marking) on platform top plate, positions the substrate during exposure.Thus, in order to reduce
The coincidence error of the pattern formed and the pattern newly formed, it is critically important for accurately detecting the position of label.
In order to accurately detect the position of label, when detection, keeps the vibration of the microscope carrier top plate of substrate few better.Thus,
After microscope carrier stability of cavern roof, i.e., after the position of microscope carrier top plate is restrained within the specified scope relative to the deviation of target position
(after stabilization) starts the position of detection label.
Patent document 1 is disclosed when determining the focal position of label in the just directly inspection under vibrating conditions of microscope carrier top plate
The method of mark note.Specifically, keep substrate light source while optical axis direction is mobile more towards label transmitting in microscope carrier top plate
Subpulse light, and the microscope carrier top plate of each moment of the pulsed light emission is measured relative to the deviation of target position.
It records, mark is determined based on the deviation of the shooting result of multiple labels and microscope carrier top plate obtained by the transmitting by pulsed light
The focal position of note.
In patent document 1, no matter the speed (change in location of microscope carrier top plate per unit time) of microscope carrier top plate it is big
It is small how, the detection being all just marked every the set time before the deadline, thus become in the presence of the obtained image of shooting
A possibility that fuzzy.
In the case where the purpose of the present invention is to provide the label on the object is detected before moveable object is stablized
The detection device of label can accurately be detected.
Citation
Patent document
Patent document 1: Japanese Unexamined Patent Publication 11-40491 bulletin
Summary of the invention
Detection device according to the present invention is detected for the position to the label on moveable object, special
Sign is that the detection device includes determining mechanism, the determination mechanism from above-mentioned object reach target position up to stabilizing to
During only, determine that the speed of above-mentioned object becomes specified value opportunity below；Photographic unit, the photographic unit is by above-mentioned true
Determining the opportunity that mechanism determines shoots above-mentioned label；And testing agency, the testing agency are based on by above-mentioned camera
The location information of the above-mentioned object of shooting result and above-mentioned opportunity that structure obtains detects the position of above-mentioned label.
Detailed description of the invention
Fig. 1 is the figure for showing the composition of exposure device involved in the 1st embodiment.
Fig. 2 is the figure for showing the configuration of the label on top plate.
Fig. 3 is the figure for showing the deviation of position of top plate.
Fig. 4 is the flow chart of the detection method of the position of flag activation.
Fig. 5 is the figure for showing the right moment for camera in the 1st embodiment.
Fig. 6 is the figure for showing detection signal involved in the 1st embodiment.
Fig. 7 A is the figure for showing the result for being displaced the waveform of detection signal involved in the 2nd embodiment.
Fig. 7 B is the figure for showing the final waveform of detection signal involved in the 2nd embodiment.
Fig. 8 is the figure for showing the detection opportunity of the label in the 3rd embodiment.
Specific embodiment
Embodiment 1
Hereinafter, the embodiment that detection device involved in the 1st embodiment is applied to exposure device is illustrated,
But detection device of the invention also can be applied to other aftermentioned devices.In addition, in the various figures, marking phase to identical component
Same appended drawing reference.
Fig. 1 is the figure for showing the composition of exposure device 100.The axis of vertical direction is set as Z axis, it will be vertical with the Z axis
Plane in mutually orthogonal 2 axis be set as X-axis and Y-axis.
Exposure device 100 is scanning exposure apparatus, using reticle stage 2 and baseplate carrier 4, makes 1 He of graticule
Substrate (object) 3 is synchronously carried out scanning in Y direction, while being exposed to substrate 3, to be formed on the substrate 3 against corrosion
The latent image pattern of agent (not shown).
Lamp optical system 5 illuminates graticule 1 using from the light of light source injection (not shown).Light source is, for example, water
Silver-colored lamp, KrF quasi-molecule laser source, ArF quasi-molecule laser source etc..Projection optical system 6 is projected through shape on substrate 3
Image obtained by regulation multiplying power is dwindled into the pattern image of graticule 1.
Reticle stage 2 keeps graticule 1 mobile in 6 axis directions.By actuators such as linear motor or impulse motors to mark
Line piece 1 is positioned.
Baseplate carrier 4 keeps substrate 3 mobile in 6 axis directions.Baseplate carrier 4, which includes, to be kept substrate 3 and moves together with substrate 3
Dynamic microscope carrier top plate (moveable object) 4a (hereinafter referred to as top plate 4a)；And the driving mechanism for keeping top plate 4a mobile (is moved
Motivation structure) 4b.Driving mechanism 4b determines substrate 3 and top plate 4a also by actuators such as linear motor or impulse motors
Position.
At least one party in reticle stage 2 and baseplate carrier 4 can also have the long coarse motion driving system of stroke length
System and the short fine motion drive system of stroke length.In addition, so-called 6 axis direction, refer to X-direction, Y direction, Z-direction with
And around the direction of rotation (θ X, θ Y, θ Z) of these axis.
Interferometer 9 projects laser, to the reflected light and reference light reflected by being located at the reflecting mirror 7 on reticle stage 2
Interference light detected.The position (location information) of reticle stage 2 is measured based on testing result.
Interferometer 10 is the measuring mechanism that the position (location information) of top plate 4a is measured during exposure.Laser is projected, it is right
Interference light by being located at reflected light and reference light that the reflecting mirror 8 on baseplate carrier 4 reflects is detected.Interferometer 10 is based on
Testing result measures the position of top plate 4a.
Based on the measurement result obtained by interferometer 9 and interferometer 10, aftermentioned control unit to reticle stage 2 with
And the position of baseplate carrier 4 is controlled.
Reflected light of the focus system 15 by reception relative to the light of 3 oblique incidence of substrate, to the position of the Z-direction of substrate
It measures.
Detection device 25 detects the position of the label on top plate 4a.In addition, also being wrapped on so-called top plate 4a
It includes on substrate 3 and on aftermentioned reference plate 11.In the present embodiment, detection device 25 has to Barebone 13, right
The processing unit (testing agency) 22 that is handled by the shooting result obtained to Barebone 13, to Barebone 16 and to by right
The processing unit (testing agency) 23 that the shooting result that Barebone 13 obtains is handled.
The system that is aligned 13 and the label shot to Barebone 16 are illustrated.Fig. 2 is watched from upper (+Z direction)
The figure of top plate 4a.It is formed with multiple exposure areas 14 on the substrate 3.Exposure area 14 is the substrate layer for having formed good pattern
Unit area is spaced apart alternately forming for scribe line 20.1 exposure area 14 is, for example, the size of 26mm × 33mm or so, packet
Include the pattern of chip size desired by one or more users.In scribe line 20, between each side of each exposure area 14
It is formed with multiple labels 19.
On top plate 4a, reference plate 11 is additionally provided with other than substrate 3.The height and substrate 3 of the upper surface of reference plate 11
Surface height it is roughly the same.Label 17,18 is formed in the upper surface of reference plate 11.
It is back to the explanation of Fig. 1.Have to Barebone 13: via projection optical system 6 to the fiducial mark for being set to graticule 1
Remember the lighting system of (not shown) and label 17,18 irradiation lights；And it receives from the reference mark and label for being set to graticule 1
17, the receiving system of 18 reflected light.The receiving system has a capturing elements such as cmos sensor, CCD, and the receiving system is to setting
It is shot simultaneously in the reference mark and label 17,18 of graticule 1.Shooting result is inputed to processing unit 22 by capturing element.
Processing unit 23 be based on shooting result, calculate label 17,18 reticle relatives 1 reference mark position.Processing unit
Calculated result (testing result) is inputed to control unit 24 by 22.
Have to Barebone 16: to outside the axis of exposure light to label 17 and with the representative among multiple exposure areas 14
The lighting system of corresponding 19 irradiation light of label in exposure area 14 of property；And receive the reflected light from label 17,19
Receiving system.The receiving system has the capturing elements such as cmos sensor, CCD, shoots to label 17,19.Capturing element
Shooting result (detection signal) is inputed into processing unit 23.Processing unit 23 calculates the position of label 17,19 based on shooting result.
Calculated result is inputed to control unit 24 by processing unit 22.
Control unit 24 is passed through by finding out position of the label 17 relative to the reference mark of graticule 1 to Barebone 13
Position of the label 19 relative to label 17 is found out to Barebone 16.Fiducial mark of the label 19 relative to graticule is found out as a result,
The position of note.The relative position for finding out graticule 1 Yu each exposure area 14 as a result, the graticule during can be realized exposure carry
The synchronously control of platform 2 and baseplate carrier 4.
Control unit 24 includes CPU, memory etc., with processing unit 22,23, interferometer 9,10, reticle stage 2, substrate load
Platform 4, focus system 15 connect.Program shown in the flow chart of aftermentioned Fig. 4 is stored in the memory of control unit 24.CPU
From the memory reading program, program is executed by being controlled the constituent element connecting with control unit 24.
In turn, the measurement result (position of top plate 4a of position of the control unit 24 based on the top plate 4a obtained by interferometer 10
Confidence breath), it determines (period) at the time of expression shoots label 17,18,19 by the capturing element to Barebone 13,16
Right moment for camera (opportunity).In the memory of control unit 24, be stored with as judge whether it is to Barebone 13,16 cope with mark
17, the specified value of the threshold value on 18,19 opportunitys shot, top plate 4a speed.In turn, it is stored with should shooting of setting
Total time.
Control unit 24 has the function as the determination mechanism for determining right moment for camera.According to the top obtained by interferometer 10
The measurement result of the position of plate 4a, in real time to the speed of top plate 4a (per unit of the position of top plate 4a relative to target deviation
The variation of time) it is compared with the specified value.According to the result of the comparison, the speed of top plate 4a is become into preset regulation
Position opportunity below is determined as right moment for camera.That is, at the beginning of presumption right moment for camera.Control unit 24 will mark
17, the location information of top plate 4a needed for 18,19 calculating is sent to processing unit 22,23.The location information is either interference
The output of meter 9,10 itself, is also possible to the deviation information relative to target position.
Fig. 3 is to show to pass through time (horizontal axis) and top plate 4a relative to target position from top plate 4a reaches target position
Deviation (longitudinal axis) relationship figure.Here, so-called target position, refers to the target position in X/Y plane (along the plane of substrate)
It sets.Deviation only indicates the position deviation of Y direction.In addition, in the following description, it is so-called " reaching target position ", refer to logical
When mechanism of overdriving 4b makes top plate 4a reach target position for the first time later towards target position is mobile, not indicate that top plate 4a exists
The totally stationary state in the target position.Even if top plate 4a also can be relative to that is, after reaching target position
Target position along with deviation vibrates.
Moment Ts indicates the finish time from top plate 4a reaches target position during stablizing.That is, moment Ts is
Top plate 4a stablize at the time of, indicate top plate 4a position relative to target position deviation (position deviation of top plate 4a) convergence and
At the time of being converged in permissible range (prescribed limit) Ea.Such as by by Barebone 16 continuously to label 19 shoot come
In the case where the position for detecting label 19, prescribed limit Ea is determined according to the vibrational state that top plate 4a should meet.
(detection method of the position of label)
Then, by taking the detection method by the label 19 carried out to Barebone 16 as an example, implemented using Fig. 4, Fig. 5 to the 1st
Detection method involved in mode is illustrated.Fig. 4 is the flow chart of the detection method of flag activation 19, and Fig. 5 is to illustrate to be aligned
The figure of the right moment for camera of the capturing element of system 16.
In S101, control unit 24 judge always driving mechanism 4b from start top plate 4a to the positioning of target position whether
Reach target position.Before S101 is judged as YES, the process for all persistently carrying out S101 is being judged to enter after being
S102。
In S102, control unit 24 is determined based on the measurement result of the position of the top plate 4a obtained by interferometer 10 to be clapped
Take the photograph opportunity.Specifically, to the speed of the threshold value for being stored in memory and the top plate 4a obtained from the measurement result of interferometer 10
It is compared, at the beginning of estimating right moment for camera.Here, being that specified value is below by speed of the control unit 24 to top plate 4a
Time-bands carry out right moment for camera and determine, can be shot with the state of the relatively stationary state of top plate 4a to label 19.
It can get the fireballing situation compared to top plate 4a as a result, and obscure few shooting result.That is, can get label 19 with not
It is the distinct image in the boundary of the part of label 19.
In Fig. 5, right moment for camera T1~T10 is the time-bands that should be shot to label 19.In S103, based on coming from
The instruction of control unit 24, to Barebone 16 since at the beginning of the right moment for camera estimated by control unit 24 shoot.Equally,
If reaching the finish time of the right moment for camera estimated by control unit 24, terminate the 1st shooting of label 19 to Barebone 16.
Here, (lighting and being put out to Barebone 16 by luminous opportunity of the illumination light to light projection system exposure label(l)ing 19
The opportunity of lamp) it is controlled, to control the beginning and end of the shooting of label 19.Alternatively, can also by make in advance come
It shines always from the illumination light of light projection system and the opening and closing opportunity of the electronic shutter of capturing element is controlled, to control bat
The beginning and end taken the photograph.Label 19 is shot in this way, only becoming specified value period below in the speed of top plate 4a, energy
Enough obtain multiple shooting results.The shooting result exported to Barebone 16 is input to processing unit 23.
In S105, when whether the total shooting time of the judgement of control unit 24 reaches the defined shooting that memory is stored
Between, it is repeatedly carried out S102~S104 always before the shooting time as defined in reaching, the same label 19 is shot.This
When, it can also be as shown in Figure 5, in the case where the deviation of top plate 4a is converged within threshold value Ea, unceasingly to label 19
It is shot.The stage of the shooting time as defined in reaching, into the process of S106.In addition, be judged as YES in S105
Moment, baseplate carrier 4 start to keep top plate 4a mobile towards other target positions.
In S106, according to the instruction from control unit 24, the position of top plate 4a of the processing unit 23 based on each right moment for camera
Shooting result in confidence breath and S104, is calculated (detection) to the position of label 19.Firstly, processing unit 23 calculates each bat
Take the photograph the position of label 19 represented by result.Fig. 6 is inspection obtained from showing the image obtained according to machine T1~Tn when shooting
Survey the figure of the waveform of signal.Calculate the center of each waveform.Then, the top of each right moment for camera is obtained via control unit 24
The deviation of the position of plate 4a.Using acquired deviation as deviant, the position of the label obtained according to shooting result is carried out
Amendment.
For example, during position the expression Y1, right moment for camera T1 of the label 19 that machine T1 is obtained according to shooting result when shooting
Top plate 4a position deviation average value be Δ Y in the case where, Y1 '=Y1- is calculated as the temporary position of label 19
ΔY.Equally, calculated according to the shooting result that machine T2~T10 is respectively obtained when shooting the temporary position Y2 ' of label~
Y10’。
In S107, according to the instruction from control unit 24, processing unit 23 calculates the position of label 19.For example, Y1 '~
The mean place of Y10 ' is the position of label 10.Calculated result is inputed into control unit 24, the label that control unit 24 will test
19 position is stored in memory.In this way, terminating detection.Then, the position of other labels 19 is similarly detected.
With in the time continuous after the waveform stabilization shown in the shooting result that No. 1 right moment for camera obtains to label 19 only
The situation that shooting is 1 time is compared, and the S/N of the detection signal obtained from shooting result is than small.But by using in multiple shooting
Multiple shooting results that machine obtains can ensure expectation quality about the detection of the position of label 19.Processing unit 23 is based on clapping
The shooting result that opportunity T1~T10 is obtained is taken the photograph, the X position of label 19 is calculated in the same manner as Y location.
In this way, using top plate 4a stablize before and baseplate carrier 4 speed be specified value right moment for camera below label
The location information of top plate 4a when 19 shooting result and shooting, detects the position of label 19.Due in image
Few time-bands are obscured to be shot, so, it, also can be accurately even if detect label before top plate 4a stablizes
Detect the position of label.It, can be the bat of label 19 compared with the case where waiting top plate 4a to stablize the shooting of re-starting tag 19
The finish time taken the photograph shifts to an earlier date.Time needed for shot mark 19 one by one capable of being cut down, so as to cut down multiple labels 19
Overall time needed for position detection.
It is further preferred, that in S107, processing unit 23 be based on according to by the time to temporary position Y1 '~Y10 ' into
Went weighting as a result, calculating the position of label 19.Preferably, for example, right moment for camera T1 is compared, to the vibration in top plate 4a
The obtained value of small and high reliablity the right moment for camera T10 of influence be weighted, calculate the position of label 19.
The duration of the shooting of the right moment for camera obtained with the position deviation convergence of baseplate carrier 4 is elongated.In this way,
The shooting time of every 1 label 19 can not also be all weighted, but will persistently be shot in every 1 right moment for camera
Time is set as constant.It can also be carried out by processing unit 23 based on obtained shooting result with S102~S105 concurrently
The calculation processing of S107.
Embodiment 2
In the detection method of the position of the label 19 involved in the 2nd embodiment, being based on will be in multiple right moment for camera T1
Multiple shooting results that~T10 is obtained are superimposed together as a result, calculating the position of label 19.The process of S101~S105 due to
In a same manner as in the first embodiment, so omitting the description, process only is performed with regard to substitution S106 and S107 and is illustrated.
Firstly, processing unit 23 makes the waveform of the detection signal obtained according to the respective shooting result of right moment for camera T1~T10
The center of waveform is calculated in displacement without asking.Displacement at this time is the position with the respective top plate 4a of right moment for camera T1~T10
Deviation the corresponding amount of mean place.Fig. 7 A shows the result after being displaced each waveform side by side.
Then, the waveform after displacement is overlapped by processing unit 23.That is, carrying out the addition of detection signal, obtain shown in Fig. 7 B
Final waveform.It, can be based on compared to the S/N with detection signal that No. 1 right moment for camera obtains by being added to detection signal
The position of label 19 is calculated than bigger detection signal.Finally, processing unit 23 will be on capturing element by wave from final waveform
Position represented by the center of shape exports and the position Y ' as label 19.Position Y ' is input to control unit 24, control
The position storage for the label 19 that portion 24 will test is in memory.
In this way, using top plate 4a stabilization before and baseplate carrier 4 speed be specified value right moment for camera below mark
The location information of top plate 4a when the shooting result of note 19 and shooting, detects the position of label 19.Due in image
Few time-bands are obscured to be shot, so, it, also being capable of high-precision even if detect label before top plate 4a stablizes
The position of ground detection label.It, can be by label 19 compared with the case where waiting top plate 4a to stablize the shooting of re-starting tag 19
The finish time of shooting shifts to an earlier date.Time needed for shot mark 19 one by one capable of being cut down, so as to cut down multiple labels 19
Position detection needed for overall time.
Even if in the case that the performance of the capturing element used in the shooting of label 19 compared with the 1st embodiment is poor,
Also can with the case where only shooting 1 position to detect label 19 to label 19 in continuous time after top plate 4a stablizes extremely
Few same precision, detects the position of label 19.
Embodiment 3
In the 3rd embodiment, by the Z location (Z for detecting label 17,18 according to the shooting result to Barebone 13
The position of axis direction), also carry out the detection of the Z location of substrate 3.According to the direction of the test object of the position of label 17,18, clap
Take the photograph opportunity difference.That is, being feelings the case where indicating the position according to detection XY axis direction with the position of detection Z-direction
Condition and the embodiment of the occasion that keeps right moment for camera different.In turn, to indicating the stable threshold value of top plate 4a also different situation
It is illustrated.Due to the exposure device 100 including detection device 25 composition in a same manner as in the first embodiment, so omit
It is described in detail.
For Fig. 8, top plate 4a reaches target position, stablizes moment Ts at the time of convergence.In waveform 30, with thick line table
Show that the speed of top plate 4a becomes specified value opportunity below.On the other hand, the waveform 32 of dotted line indicates the inclined of the position of Z-direction
Difference.About waveform 32, position deviation is to stablize moment Tc at the time of converging threshold value Ec.In waveform 32, indicate every with thick line
The speed of the Z-direction of unit time becomes specified value opportunity below.Since allowable deviation is different according to direction, institute
Ec > Ea is set as with threshold value.
Sometimes as shown in waveform 30 and waveform 32, at the time of according to direction, the runout amplitude of the amplitude of waveform is big
It can be different.In this case, made right moment for camera different according to the direction of the position of test object.Such as the feelings in Fig. 8
Under condition, waveform 30 is compared to waveform 32 with the such delay of 1/4 period.
Control unit 24 determines that the speed of the Z-direction of top plate 4a becomes specified position right moment for camera below and top respectively
The speed of the X-direction of plate 4a becomes specified value right moment for camera below.Also, processing unit 22 is using in the Z axis side of top plate 4a
To speed become multiple shooting results that specified position right moment for camera below obtains, calculate the position of Z-direction.Another party
Face becomes multiple shooting results that specified value right moment for camera below obtains using the speed of the X-direction in top plate 4a, calculates
The position of X-direction.In addition, according in the calculation method of the position of the label 19 of shooting result and the 1st embodiment S107,
The process of S108 is same.
In the present embodiment, it also can get effect in a same manner as in the first embodiment.It in turn, can be based on different
The shooting result that right moment for camera obtains, detects the position of 2 axis directions respectively.
Other embodiments
Detection device 25 can also be applied on other devices for marking to be aligned on observation object.Such as it can be with
It is equipped on semiconductor circuit inspecting device, wafer inspector, flaw detection apparatus etc..
In the 1st~the 3rd embodiment, the case where determination multiple right moments for camera of control unit 24, is illustrated, but controls
The number for the right moment for camera that portion 24 processed determines and the number shot to Barebone 16 are also possible to only 1 time.In addition, not
Be limited to the first and second embodiments to Barebone 16, can also be by implementing the detection method of label above-mentioned to Barebone 13.
As long as the detection method by the position for executing label above-mentioned at least one party in Barebone 13,16.
To by the lighting control of illumination light or the electronic shutter embodiment that only machine shoots label 19 when shooting into
Explanation is gone, but can also be using method in addition to this.For example, capturing element can always in advance clap label 19
Take the photograph, processing unit 23 calculate label 19 position when only extract the shooting result for the right moment for camera determined by control unit 24 come into
Row calculates.
To Barebone 13 be the mode for detecting the light reflected by label 17,18 detection system it is saturating but it is also possible to be detection
Cross the detection system of label 17,18 and the mode of the light of diffraction.In such a case it is possible to by matching to the light projection system of Barebone 13
It sets in the top of graticule 1, the capturing element as receiving system is configured in the inside of top plate 4.
If having processing unit 22,23 respective functions, can also be made of 1 processing unit.Alternatively, control unit 24 can also
To have the function of processing unit 22,23.
Detection device 25 is not limited to the exposure device 100 as scanning exposure apparatus, can also be applied in substrate
Upper other lithographic equipments (patterning apparatus) for forming pattern.Lithographic equipment for example can be litho machine, by relative to fixation
Graticule 1 in a manner of Step-and-repeat drive substrate 3 simultaneously substrate 3 is exposed, on substrate formed resist sub-image
Pattern.Alternatively, being also possible to form the imprinting apparatus of relief pattern on substrate using mold, by the irradiation of charged particle line
The describing device etc. of latent image pattern is formed on substrate.
In addition, the exposure light of exposure device 100 for example can be from g line (wavelength 436nm), i line (wavelength 365nm), ArF
It is selected in the various light such as laser (wavelength 193nm), EUV light (wavelength 13nm).
Detection device 25 can also be equipped on other devices for needing to be detected to the position of label.
Embodiment involved in article manufacturing method
The pattern of the hardening thing formed using lithographic equipment is unvaryingly used at least part of various articles, or
It is temporarily used when manufacturing various articles.
So-called article refers to circuit element, optical element, MEMS, memory element, sensor or mold etc..
As circuit element, the volatibility as DRAM, SRAM, flash memory, MRAM or non-volatile half can be enumerated
Conductor memory, or semiconductor element etc. as LSI, CCD, imaging sensor, FPGA.
As mold, the mold etc. of coining can be enumerated.
The pattern of hardening thing is used directly as at least part of component parts of above-mentioned article, or as against corrosion
Agent exposure mask is temporarily used.After having carried out etching or ion implanting etc. in the manufacturing procedure of substrate, resist is covered
Film removes.Manufacturing procedure can also include that other known treatment process are (development, oxidation, film forming, vapor deposition, smooth processing, against corrosion
Agent removing, cutting, combination, encapsulation etc.).
The present invention is not limited to above embodiment, can be in the case where not departing from design and range of the invention
It makes various changes and deforms.Therefore, claim below has been attached to for open the scope of the present invention.
The Japanese patent application laid that the application was proposed by September 14th, 2016 advocates it based on being willing to 2016-179919
Priority here cites its whole contents.
Claims (13)
1. a kind of detection device is detected for the position to the label on moveable object, which is characterized in that the detection
Device includes
Determine mechanism, which determines above-mentioned during from above-mentioned object reaches target position until stablizing
The speed of object becomes specified value opportunity below；
Photographic unit, the photographic unit shoot above-mentioned label on the opportunity determined by above-mentioned determining mechanism；And
Testing agency, the testing agency is based on the shooting result obtained by above-mentioned photographic unit and the above-mentioned object on above-mentioned opportunity
Location information detects the position of above-mentioned label.
2. detection device as described in claim 1, which is characterized in that
Above-mentioned determining mechanism determines above-mentioned opportunity based on the location information of above-mentioned object.
3. detection device as described in claim 1, which is characterized in that
Above-mentioned determining mechanism determines multiple above-mentioned opportunitys,
Above-mentioned label detects based on the respective shooting result from above-mentioned photographic unit of multiple opportunitys in above-mentioned testing agency
Position.
4. detection device as claimed in claim 3, which is characterized in that
Multiple above-mentioned labels corresponding with the multiple shooting results obtained on above-mentioned multiple opportunitys detect in above-mentioned testing agency
Temporary position, the position of above-mentioned label is detected based on multiple temporary position.
5. detection device as claimed in claim 3, which is characterized in that
Above-mentioned testing agency is detected based on by the multiple shooting results obtained on above-mentioned multiple opportunitys result superimposed together
The position of above-mentioned label.
6. detection device as claimed in claim 4, which is characterized in that
Above-mentioned testing agency is weighted the multiple shooting results respectively obtained on above-mentioned multiple opportunitys to detect above-mentioned label
Position.
7. detection device as claimed in claim 3, which is characterized in that
Above-mentioned photographic unit passes through the time according to what is started from the time for reaching above-mentioned target position, on above-mentioned multiple opportunitys point
Not it is weighted the shooting duration of above-mentioned label.
8. detection device as described in claim 1, which is characterized in that
According to the direction of the test object of the position of above-mentioned label, above-mentioned opportunity is different.
9. detection device as described in claim 1, which is characterized in that
Above-mentioned photographic unit controls the opening and closing opportunity of the electronic shutter of above-mentioned photographic unit or from shining above-mentioned label
On the luminous opportunity of the light of bright light source, above-mentioned label is shot on above-mentioned opportunity.
10. detection device as described in claim 1, which is characterized in that
From above-mentioned object reach target position until stablize until during, refer to from above-mentioned object reach target position directly
During until the position of above-mentioned object is relative to the deviation convergence within the specified scope of above-mentioned target position.
11. a kind of patterning apparatus, for forming pattern on substrate, which is characterized in that the patterning apparatus includes
Detection device, the detection device detect the position of the label on moveable object；
Mobile mechanism, the mobile mechanism move the market object that sets of the test object as above-mentioned detection device；And
Measuring mechanism, the measuring mechanism measure the position of above-mentioned object,
Above-mentioned detection device includes
Determine mechanism, which determines above-mentioned during from above-mentioned object reaches target position until stablizing
The speed of object becomes specified value opportunity below；
Photographic unit, the photographic unit shoot above-mentioned label on the opportunity determined by above-mentioned determining mechanism；And
Testing agency, the testing agency is based on the shooting result obtained by above-mentioned photographic unit and the above-mentioned object on above-mentioned opportunity
Location information detects the position of above-mentioned label.
12. a kind of detection method is detected for the position to the label being located on moveable object, which is characterized in that
The detection method includes
It determines process, during from above-mentioned object reaches target position until stablizing, determines the speed of above-mentioned object
As specified value opportunity below；
Process is shot, above-mentioned label is shot on the above-mentioned opportunity determined by above-mentioned determining process；And
Detect process, the position letter of the above-mentioned object based on the shooting result and above-mentioned opportunity that are shot by above-mentioned shooting process
It ceases to detect the position of above-mentioned label.
13. a kind of article manufacturing method comprising:
Pattern formation process forms pattern using the patterning apparatus of pattern is formed on substrate on aforesaid substrate；And
Treatment process handles the substrate for foring pattern by above-mentioned pattern formation process,
Article is manufactured from treated aforesaid substrate,
Above-mentioned patterning apparatus includes
Detection device, the detection device detect the position of the label on moveable object；
Mobile mechanism, the mobile mechanism move the market object that sets of the test object as above-mentioned detection device；And
Measuring mechanism, the measuring mechanism measure the position of above-mentioned object,
Above-mentioned detection device includes
Determine mechanism, which determines above-mentioned during from above-mentioned object reaches target position until stablizing
The speed of object becomes specified value opportunity below；
Photographic unit, the photographic unit shoot above-mentioned label on the opportunity determined by above-mentioned determining mechanism；And
Testing agency, the testing agency is based on the shooting result obtained by above-mentioned photographic unit and the above-mentioned object on above-mentioned opportunity
Location information detects the position of above-mentioned label.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-179919 | 2016-09-14 | ||
| JP2016179919A JP6779721B2 (en) | 2016-09-14 | 2016-09-14 | Detection equipment, detection methods, lithography equipment, and manufacturing methods for articles |
| PCT/JP2017/029939 WO2018051744A1 (en) | 2016-09-14 | 2017-08-22 | Detection device, detection method, patterning device, and method for manufacturing article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109690419A true CN109690419A (en) | 2019-04-26 |
| CN109690419B CN109690419B (en) | 2021-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780055797.7A Active CN109690419B (en) | 2016-09-14 | 2017-08-22 | Detection device, detection method, patterning device, and article manufacturing method |
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| Country | Link |
|---|---|
| JP (1) | JP6779721B2 (en) |
| KR (1) | KR102214771B1 (en) |
| CN (1) | CN109690419B (en) |
| WO (1) | WO2018051744A1 (en) |
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| JP6919623B2 (en) * | 2018-04-26 | 2021-08-18 | オムロン株式会社 | Control systems, control methods, and control programs |
| JP7172151B2 (en) * | 2018-06-11 | 2022-11-16 | オムロン株式会社 | Control systems, controllers and programs |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0444209A (en) * | 1990-06-07 | 1992-02-14 | Matsushita Electric Ind Co Ltd | Exposing method |
| JPH10335232A (en) * | 1997-05-28 | 1998-12-18 | Canon Inc | Alignment device and method, and exposure system provided therewith |
| JPH1140491A (en) * | 1997-07-17 | 1999-02-12 | Canon Inc | Detection of focusing position |
| JP2007115801A (en) * | 2005-10-19 | 2007-05-10 | Nikon Corp | Mark position measuring device, mark position measuring method, exposure device, and exposure method |
| JP2009026976A (en) * | 2007-07-20 | 2009-02-05 | Canon Inc | Exposure device and device manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005337912A (en) * | 2004-05-27 | 2005-12-08 | Nikon Corp | Position measuring apparatus, exposure apparatus, and device manufacturing method |
| JP2015128132A (en) | 2013-11-28 | 2015-07-09 | キヤノン株式会社 | Method for creating drawing data, drawing device, drawing method and method of manufacturing article |
-
2016
- 2016-09-14 JP JP2016179919A patent/JP6779721B2/en active Active
-
2017
- 2017-08-22 CN CN201780055797.7A patent/CN109690419B/en active Active
- 2017-08-22 WO PCT/JP2017/029939 patent/WO2018051744A1/en active Application Filing
- 2017-08-22 KR KR1020197008814A patent/KR102214771B1/en active IP Right Grant
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0444209A (en) * | 1990-06-07 | 1992-02-14 | Matsushita Electric Ind Co Ltd | Exposing method |
| JPH10335232A (en) * | 1997-05-28 | 1998-12-18 | Canon Inc | Alignment device and method, and exposure system provided therewith |
| JPH1140491A (en) * | 1997-07-17 | 1999-02-12 | Canon Inc | Detection of focusing position |
| JP2007115801A (en) * | 2005-10-19 | 2007-05-10 | Nikon Corp | Mark position measuring device, mark position measuring method, exposure device, and exposure method |
| JP2009026976A (en) * | 2007-07-20 | 2009-02-05 | Canon Inc | Exposure device and device manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6779721B2 (en) | 2020-11-04 |
| CN109690419B (en) | 2021-09-14 |
| JP2018044864A (en) | 2018-03-22 |
| KR20190041516A (en) | 2019-04-22 |
| WO2018051744A1 (en) | 2018-03-22 |
| KR102214771B1 (en) | 2021-02-10 |
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