JP6779721B2 - Detection equipment, detection methods, lithography equipment, and manufacturing methods for articles - Google Patents

Description

The present invention relates to a detection device, a detection method, a lithography device, and a method for manufacturing an article.

The exposure apparatus positions the substrate under exposure based on the positions of the alignment marks formed on the substrate on the stage top plate and the reference marks (hereinafter referred to as marks) provided on the stage top plate, which are detected in advance. Therefore, in order to reduce the overlay error between the already formed pattern and the newly formed pattern, it is important to accurately detect the position of the mark.

In order to accurately detect the position of the mark, it is preferable that the vibration of the stage top plate holding the substrate at the time of detection is small. Therefore, the position of the mark is started to be detected after the stage top plate has been set, that is, after the deviation of the position of the stage top plate from the target position has converged within a predetermined range (after setting).

Patent Document 1 describes a method of detecting a mark while the stage top plate is vibrating when determining the focusing position of the mark. Specifically, while the stage top plate moves the substrate in the optical axis direction, the light source emits pulsed light a plurality of times toward the mark, and the target position of the stage top plate is emitted at each moment when the pulsed light is emitted. The deviation is measured. It is described that the focusing position of the marks is determined based on the imaging results of the plurality of marks obtained by emitting the pulsed light and the deviation of the stage top plate.

Japanese Unexamined Patent Publication No. 11-40491

In Patent Document 1, since the mark is detected at regular intervals within a predetermined time regardless of the speed of the stage top plate (change in the position of the stage top plate per unit time), the image obtained by imaging is obtained. There is a risk of blurring.

Therefore, an object of the present invention is to provide a detection device capable of accurately detecting a mark on a movable object before the setting of the object.

The detection device according to the present invention is a detection device that detects the position of a mark on a movable object, and the deviation of the object with respect to the target position within a predetermined range after the object first reaches the target position. A specific means for specifying a plurality of timings at which the velocity of the object becomes equal to or lower than a predetermined value until convergence, an imaging means for imaging the mark at the plurality of timings specified by the specific means, and the imaging. have a, a detecting means for detecting a position of the mark indicating the waveform of the detection signal based on a detection signal obtained from the captured image by the means, the detection means, the deviation in the plurality of timing Based on this, the position of the mark indicated by the waveform of the detection signal is corrected .

According to the present invention, when the mark on the movable object is detected before the setting of the movable object, the mark can be detected with high accuracy.

It is a figure which shows the structure of the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows the arrangement of the mark on the top plate. It is a figure which shows the deviation of the position of the top plate. It is a flowchart which shows the detection method of the position of a mark. It is a figure which shows the imaging timing in 1st Embodiment. It is a figure which shows the detection signal which concerns on 1st Embodiment. It is a figure which shows the detection signal which concerns on 2nd Embodiment. It is a figure which shows the detection timing of the mark in 3rd Embodiment.

(First Embodiment)
Hereinafter, an embodiment in which the detection device according to the first embodiment is applied to an exposure device will be described, but the detection device of the present invention can also be applied to other devices described later. In addition, the same reference number is given to the same member in each figure.

FIG. 1 is a diagram showing a configuration of an exposure apparatus 100. The axis in the vertical direction is the Z axis, and the two axes orthogonal to each other in the plane perpendicular to the Z axis are the X axis and the Y axis.

The exposure apparatus 100 is a scanning exposure apparatus, and the substrate 3 is exposed while scanning the reticle 1 and the substrate (object) 3 in synchronization with the Y-axis direction using the reticle stage 2 and the substrate stage 4. 3 A latent image pattern of a resist (not shown) is formed on the resist.

The illumination optical system 5 illuminates the reticle 1 with light emitted from a light source (not shown). The light source is, for example, a mercury lamp, a KrF excimer laser light source, an ArF excimer laser light source, or the like. The projection optical system 6 projects an image obtained by reducing the pattern image formed on the reticle 1 to a predetermined magnification on the substrate 3.

The reticle stage 2 moves the reticle 1 in the 6-axis direction. The reticle 1 is positioned by an actuator such as a linear motor or a pulse motor.

The substrate stage 4 moves the substrate 3 in the 6-axis direction. The substrate stage 4 includes a stage top plate (movable object) 4a (hereinafter referred to as a top plate 4a) that holds the substrate 3 and moves together with the substrate 3, and a drive mechanism (moving means) 4b that moves the top plate 4a. And have. The drive mechanism 4b also positions the substrate 3 and the top plate 4a by an actuator such as a linear motor or a pulse motor.

At least one of the reticle stage 2 and the substrate stage 4 may include a coarse movement drive system having a long stroke length and a fine movement drive system having a short stroke length. The 6-axis directions are the X-axis direction, the Y-axis direction, the Z-axis direction, and the rotation directions (θX, θY, θZ) around these axes.

The interferometer 9 emits laser light and detects the interference light between the reflected light reflected by the mirror 7 provided on the reticle stage 2 and the reference light. The position (position information) of the reticle stage 2 is measured based on the detection result.

The interferometer 10 is a measuring means for measuring the position (position information) of the top plate 4a during exposure. The laser beam is emitted, and the interference light between the reflected light reflected by the mirror 8 provided on the substrate stage 4 and the reference light is detected. The interferometer 10 measures the position of the top plate 4a based on the detection result.

Based on the measurement results of the interferometer 9 and the interferometer 10, the control unit described later controls the positions of the reticle stage 2 and the substrate stage 4.

The focus system 15 measures the position of the substrate in the Z direction by receiving the reflected light of the light obliquely incident on the substrate 3.

The detection device 25 detects the position of the mark on the top plate 4a. The top plate 4a includes the top of the substrate 3 and the reference plate 11 described later. In the present embodiment, the detection device 25 is an alignment system 13, a processing unit (detection means) 22 that processes the imaging result by the alignment system 13, the alignment system 16, and a processing unit (detection means) that processes the imaging result by the alignment system 13. ) 23.

The marks imaged by the alignment system 13 and the alignment system 16 will be described. FIG. 2 is a view of the top plate 4a viewed from above (+ Z direction). A plurality of shot regions 14 are formed on the substrate 3. The shot region 14 is a unit region of the base layer for which the pattern has already been formed, and is formed at intervals of the scribe lines 20. One shot area 14 has a size of, for example, about 26 mm × 33 mm, and includes one or a plurality of chip size patterns desired by the user. In the scribe line 20, a plurality of marks 19 are formed between each side of each shot area 14.

A reference plate 11 is provided on the top plate 4a in addition to the substrate 3. The height of the upper surface of the reference plate 11 is substantially the same as the height of the surface of the substrate 3. Marks 17 and 18 are formed on the upper surface of the reference plate 11.

Returning to the description of FIG. The alignment system 13 includes an illumination system that illuminates the reference marks (not shown) and marks 17 and 18 provided on the reticle 1 via the projection optical system 6, and the reference marks and marks 17 provided on the reticle 1. , A light receiving system that receives the reflected light from 18. The light receiving system has an image sensor such as a CMOS sensor or a CCD, and the light receiving system simultaneously images a reference mark and marks 17 and 18 provided on the reticle 1. The image sensor inputs the image pickup result to the processing unit 22.

The processing unit 23 calculates the positions of the marks 17 and 18 with respect to the reference mark of the reticle 1 based on the imaging result. The processing unit 22 inputs the calculation result (detection result) to the control unit 24.

The alignment system 16 illuminates the mark 17 outside the axis of the exposure light and the mark 19 corresponding to the representative shot area 14 among the plurality of shot areas 14, and the reflected light from the marks 17 and 19. It is equipped with a light receiving system that receives light. The light receiving system has an image sensor such as a CMOS sensor or a CCD, and images marks 17 and 19. The image sensor inputs the image pickup result (detection signal) to the processing unit 23. The processing unit 23 calculates the positions of the marks 17 and 19 based on the imaging result. The processing unit 22 inputs the calculation result to the control unit 24.

The control unit 24 obtains the position of the mark 17 with respect to the reference mark of the reticle 1 in the alignment system 13 and the position of the mark 19 with respect to the mark 17 in the alignment 16. As a result, the position of the mark 19 with respect to the reference mark of the reticle is obtained. As a result, the relative position between the reticle 1 and each shot region 14 can be obtained, and synchronous control between the reticle stage 2 and the substrate stage 4 during exposure becomes possible.

The control unit 24 includes a CPU, a memory, and the like, and is connected to processing units 22, 23, interferometers 9, 10, a reticle stage 2, a substrate stage 4, and a focus system 15. The program shown in the flowchart of FIG. 4 described later is stored in the memory of the control unit 24. The CPU reads the program from the memory and executes the program by controlling the components connected to the control unit 24.

Further, the control unit 24 uses the image pickup elements of the alignment systems 13 and 16 to image the marks 17, 18 and 19 based on the measurement result of the position of the top plate 4a by the interferometer 10 (position information of the top plate 4a). ) Is indicated by the imaging timing (timing). In the memory of the control unit 24, a predetermined value of the speed of the top plate 4a, which is a threshold value of whether or not the alignment systems 13 and 16 should image the marks 17, 18 and 19, is stored. Further, the set total time to be imaged is stored.

The control unit 24 has a function as a specific means for specifying the imaging timing. From the measurement result of the position of the top plate 4a by the interferometer 10, the speed of the top plate 4a (change in the position of the top plate 4a with respect to the target deviation per unit time) and the predetermined value are compared in real time. As a result of the comparison, the imaging timing is specified when the speed of the top plate 4a becomes equal to or lower than a preset predetermined position. That is, the start time of the imaging timing is estimated. The control unit 24 sends the position information of the top plate 4a necessary for calculating the marks 17, 18 and 19 to the processing units 22 and 23. The position information may be the output itself of the interferometers 9 and 10, or may be deviation information with respect to the target position.

FIG. 3 is a diagram showing the relationship between the elapsed time (horizontal axis) after the top plate 4a reaches the target position and the deviation (vertical axis) of the top plate 4a with respect to the target position. Here, the target position is a target position in the XY plane (plane along the substrate). The deviation shall indicate only the position deviation in the Y-axis direction. Further, in the following description, "reached the target position" means that the top plate 4a reaches the target position for the first time after being moved toward the target position by the drive mechanism 4b, and the top plate 4a reaches the target. It does not indicate a completely stationary state at the position. That is, even after reaching the target position, the top plate 4a vibrates with a deviation from the target position.

The time Ts indicates the end time between the time when the top plate 4a reaches the target position and the time when the top plate 4a is settled. That is, the time Ts is the time when the top plate 4a is set, and the deviation of the position of the top plate 4a from the target position (positional deviation of the top plate 4a) converges and converges within the allowable range (predetermined range) Ea. Indicates the time. The predetermined range Ea is determined by, for example, the vibration state that the top plate 4a should satisfy when the position of the mark 19 is detected by continuously imaging the mark 19 in the alignment 16.

(How to detect the position of the mark)
Next, the detection method according to the first embodiment will be described with reference to FIGS. 4 and 5 by taking the method of detecting the mark 19 by the alignment system 16 as an example. FIG. 4 is a flowchart showing a method of detecting the mark 19, and FIG. 5 is a diagram for explaining the imaging timing by the imaging element of the alignment system 16.

In S101, the control unit 24 always determines whether or not the drive mechanism 4b has reached the target position after starting the positioning of the top plate 4a to the target position. The process of S101 is continued until YES is determined in S101, and when YES is determined, the process proceeds to S102.

In S102, the control unit 24 specifies the imaging timing based on the measurement result of the position of the top plate 4a by the interferometer 10. Specifically, the threshold value stored in the memory is compared with the speed of the top plate 4a obtained from the measurement result of the interferometer 10, and the start time of the imaging timing is estimated. Here, the control unit 24 can image the mark 19 in a state relatively close to the stationary state of the top plate 4a by specifying the time zone in which the speed of the top plate 4a is equal to or less than a predetermined value. As a result, an imaging result with less blurring can be obtained as compared with the case where the speed of the top plate 4a is high. That is, an image in which the boundary between the mark 19 and the portion other than the mark 19 is clear can be obtained.

In FIG. 5, the imaging timings T1 to T10 are time zones in which the mark 19 should be imaged. In S103, based on the instruction from the control unit 24, the alignment system 16 starts imaging from the start time of the imaging timing estimated by the control unit 24. Similarly, when the end time of the imaging timing estimated by the control unit 24 is reached, the alignment system 16 ends the first imaging of the mark 19.

Here, the alignment system 16 controls the start and end of imaging of the mark 19 by controlling the emission timing (turning on and off timing) of the illumination light that the floodlight system illuminates the mark 19. Alternatively, the start and end of imaging may be controlled by constantly emitting the illumination light from the projection system and controlling the opening / closing timing of the electronic shutter of the image pickup device. In this way, the mark 19 can be imaged only while the speed of the top plate 4a is equal to or less than a predetermined value, and a plurality of imaging results can be obtained. The imaging result output by the alignment system 16 is input to the processing unit 23.

In S105, the control unit 24 determines whether or not the total imaging time has reached a predetermined imaging time stored in the memory, and repeats S102 to S104 until the predetermined imaging time is reached to image the same mark 19. .. At this time, as shown in FIG. 5, if the deviation of the top plate 4a converges within the threshold value Ea, the mark 19 may be continuously imaged. When the predetermined imaging time is reached, the process proceeds to the step of S106. When it is determined YES in S105, the substrate stage 4 starts moving the top plate 4a toward another target position.

In S106, according to the instruction from the control unit 24, the processing unit 23 calculates (detects) the position of the mark 19 based on the position information of the top plate 4a at each imaging timing and the imaging result in S104. First, the processing unit 23 calculates the position of the mark 19 indicated by each imaging result. FIG. 6 is a diagram showing waveforms of detection signals obtained from images acquired at imaging timings T1 to Tn. Calculate the center position of each waveform. Next, the deviation of the position of the top plate 4a at each imaging timing is acquired via the control unit 24. Using the acquired deviation as an offset value, the position of the mark obtained from the imaging result is corrected.

For example, when the position of the mark 19 obtained from the imaging result at the imaging timing T1 indicates Y1 and the average value of the deviations of the positions of the top plates 4a during the imaging timing T1 is ΔY, Y1'= Y1-ΔY. Calculated as a temporary position of the mark 19. Similarly, the temporary positions Y2'to Y10' of the mark are calculated from the imaging results obtained at each of the imaging timings T2 to T10.

In S107, the processing unit 23 calculates the position of the mark 19 according to the instruction from the control unit 24. For example, the average position of Y1'to Y10' is the position of the mark 10. The calculation result is input to the control unit 24, and the control unit 24 stores the detected position of the mark 19 in the memory. This completes the detection. After that, the positions of the other marks 19 are detected in the same manner.

The waveform indicated by the imaging result obtained at one imaging timing has a smaller S / N ratio of the detection signal obtained from the imaging result than the case where the mark 19 is imaged only once in a continuous time after setting. However, by utilizing a plurality of imaging results obtained at a plurality of imaging timings, it is possible to secure desired accuracy in detecting the position of the mark 19. The processing unit 23 calculates the X position of the mark 19 in the same manner as the Y position based on the imaging results obtained at the imaging timings T1 to T10.

In this way, the position of the mark 19 is detected by using the imaging result of the mark 19 at the imaging timing before the setting of the top plate 4a and the speed of the substrate stage 4 is equal to or less than a predetermined value and the position information of the top plate 4a at the time of imaging. .. Since the image is taken in a time zone when the image blur is small, the position of the mark can be detected with high accuracy even when the mark is detected before the top plate 4a is set. Compared with the case where the imaging of the mark 19 is started after waiting for the setting of the top plate 4a, the end time of the imaging of the mark 19 can be earlier. Since the time required for imaging each mark 19 can be reduced, the total time required for detecting the positions of a plurality of marks 19 can be reduced.

In S107, it is preferable that the processing unit 23 calculates the position of the mark 19 based on the result of weighting the temporary positions Y1'to Y10' according to the elapsed time. For example, it is preferable to calculate the position of the mark 19 by weighting the value obtained at the imaging timing T10, which is less affected by the vibration of the top plate 4a and has higher reliability than the imaging timing T1.

As the position deviation of the substrate stage 4 converges, the duration of imaging at each imaging timing becomes longer. In this way, the time for continuing imaging at the imaging timing per imaging may be constant without weighting the imaging time of the mark 19 per imaging. In parallel with S102 to S105, the processing unit 23 may perform the calculation processing of S107 based on the imaging result already obtained.

[Second Embodiment]
In the method for detecting the position of the mark 19 according to the second embodiment, the position of the mark 19 is calculated based on the result of superimposing a plurality of imaging results obtained at a plurality of imaging timings T1 to T10. Since the steps of S101 to S105 are the same as those of the first embodiment, the description thereof will be omitted, and only the steps to be executed instead of S106 and S107 will be described.

First, the processing unit 23 shifts the waveform of the detection signal obtained from each of the imaging results of the imaging timings T1 to T10 without obtaining the center position of the waveform. The shift amount at this time is an amount corresponding to the average position of the deviation of the position of the top plate 4a at each of the imaging timings T1 to T10. FIG. 7A shows the results of shifting each waveform side by side.

Next, the processing unit 23 superimposes the shifted waveform. That is, the detection signals are added together, and the final waveform shown in FIG. 7B is acquired. By adding the detection signals, the position of the mark 19 can be calculated based on the detection signal having a larger S / N ratio than the detection signal obtained at one imaging timing. Finally, the processing unit 23 outputs the position indicated by the center position of the waveform on the image sensor from the final waveform as the position Y'of the mark 19. The position Y'is input to the control unit 24, and the control unit 24 stores the detected position of the mark 19 in the memory.

In this way, the position of the mark 19 is detected by using the imaging result of the mark 19 at the imaging timing before the setting of the top plate 4a and the speed of the substrate stage 4 is equal to or less than a predetermined value and the position information of the top plate 4a at the time of imaging. .. Since the image is taken in a time zone when the image blur is small, the position of the mark can be detected with high accuracy even when the mark is detected before the top plate 4a is set. Compared with the case where the imaging of the mark 19 is started after waiting for the setting of the top plate 4a, the end time of the imaging of the mark 19 can be earlier. Since the time required for imaging each mark 19 can be reduced, the total time required for detecting the positions of a plurality of marks 19 can be reduced.

Even when the performance of the image sensor used for imaging the mark 19 is inferior to that of the first embodiment, the position of the mark 19 is detected by imaging the mark 19 only once for a continuous time after the top plate 4a is set. The position of the mark 19 can be detected with at least the same accuracy as.

[Third Embodiment]
In the third embodiment, the Z position of the substrate 3 is also detected by detecting the Z positions (positions in the Z axis direction) of the marks 17 and 18 from the imaging result by the alignment system 13. The imaging timing differs depending on the direction of the detection target at the positions of the marks 17 and 18. That is, it is an embodiment showing a case where the imaging timing is different between the case where the position in the XY axis direction is detected and the case where the position in the Z axis direction is detected. Further, a case where the threshold value indicating the setting of the top plate 4a is also different will be described. Since the configuration of the exposure apparatus 100 including the detection apparatus 25 is the same as that of the first embodiment, detailed description thereof will be omitted.

In FIG. 8, the settling time Ts is the time when the top plate 4a reaches the target position and converges. In the waveform 30, the timing at which the speed of the top plate 4a becomes equal to or less than a predetermined value is indicated by a thick line. On the other hand, the broken line waveform 32 shows the deviation of the position in the Z-axis direction. The time at which the position deviation of the waveform 32 converges to the threshold value Ec is the settling time Tc. In the waveform 32, the timing at which the speed in the Z-axis direction per unit time becomes equal to or less than a predetermined value is indicated by a thick line. Since the permissible deviation differs depending on the direction, the threshold value is set to Ec> Ea.

As shown in the waveform 30 and the waveform 32, the time when the fluctuation width of the amplitude of the waveform is large may differ depending on the direction. In such a case, the imaging timing is different depending on the direction of the position of the detection target. For example, in the case of FIG. 8, the waveform 30 has a delay of about 1/4 period as compared with the waveform 32.

The control unit 24 specifies an imaging timing at which the speed of the top plate 4a in the Z-axis direction is equal to or less than a predetermined position and an imaging timing at which the speed of the top plate 4a in the X-axis direction is equal to or less than a predetermined value. Then, the processing unit 22 calculates the position in the Z-axis direction by using a plurality of imaging results obtained at the imaging timing at which the speed in the Z-axis direction of the top plate 4a is equal to or less than a predetermined position. On the other hand, the position in the X-axis direction is calculated by using a plurality of imaging results obtained at the imaging timing when the speed in the X-axis direction of the top plate 4a is equal to or less than a predetermined value. The method of calculating the position of the mark 19 from the imaging result is the same as the steps of S107 and S108 in the first embodiment.

In this embodiment as well, the same effect as in the first embodiment can be obtained. Further, based on the imaging results acquired at different imaging timings, the positions in the biaxial directions can be detected respectively.

(Other embodiments)
The detection device 25 may be applied to other devices that align by looking at the marks on the object. For example, it may be mounted on a device for inspecting a semiconductor circuit, a wafer inspection device, a defect inspection device, or the like.

In the first to third embodiments, the case where the control unit 24 specifies a plurality of imaging timings has been described, but the number of imaging timings specified by the control unit 24 and the number of times the alignment system 16 performs imaging may be only once. Good. Further, not limited to the alignment system 16 of the first and second embodiments, the above-mentioned mark detection method may be carried out by the alignment system 13. At least one of the alignment systems 13 and 16 may execute the above-mentioned method for detecting the position of the mark.

Although the embodiment in which the mark 19 is imaged only at the imaging timing by the lighting control of the illumination light or the electronic shutter has been described, other methods may be adopted. For example, the image sensor may always image the mark 19, and when the processing unit 23 calculates the position of the mark 19, the image sensor may extract only the imaging result at the imaging timing specified by the control unit 24 and perform the calculation. Good.

The alignment system 13 is a detection system of a method of detecting the light reflected by the marks 17 and 18, but may be a detection system of a method of detecting the light diffracted through the marks 17 and 18. In this case, the light projecting system of the alignment system 13 may be arranged above the reticle 1, and the image sensor as the light receiving system may be arranged inside the top plate 4.

As long as it has the respective functions of the processing units 22 and 23, it may be composed of one processing unit. Alternatively, the control unit 24 may have the functions of the processing units 22 and 23.

The detection device 25 is not limited to the exposure device 100, which is a scanning exposure device, and can be applied to other lithography devices (patterning devices) that form a pattern on a substrate. The lithography apparatus may be, for example, a stepper that forms a latent image pattern of a resist on a substrate by exposing the substrate 3 to a fixed reticle 1 while driving the substrate 3 in a step-and-repeat manner. Alternatively, it may be an imprint device that forms a concavo-convex pattern on the substrate using a mold, a drawing device that forms a latent image pattern on the substrate by irradiating a charged particle beam, or the like.

The exposure light of the exposure apparatus 100 can be selected from various light rays such as g-line (wavelength 436 nm), i-line (wavelength 365 nm), ArF laser light (wavelength 193 nm), and EUV light (wavelength 13 nm).

The detection device 25 may be mounted on another device that needs to detect the position of the mark.

[Embodiment relating to a method for manufacturing an article]
The pattern of the cured product formed by using the lithographic apparatus is used permanently for at least a part of various articles or temporarily in manufacturing various articles.

The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like.

Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA.

Examples of the mold include a mold for imprinting.

The cured product pattern is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after etching or ion implantation in the substrate processing process. The processing step may further include other well-known processing steps (development, oxidation, film formation, vapor deposition, flattening, resist stripping, dicing, bonding, packaging, etc.).

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and modifications can be made within the scope of the gist thereof.

3 Substrate 4a Top plate (object)
13, 16 Alignment system 17, 18, 19 Mark 22, 23 Processing unit 24 Control unit 25 Detection device T1 to T10 Imaging timing

Claims (9)

A detector that detects the position of a mark on a movable object.
A specific means for specifying a plurality of timings at which the velocity of the object becomes equal to or less than a predetermined value between the time when the object first reaches the target position and the time when the deviation of the object with respect to the target position converges within a predetermined range. ,
An imaging means that images the mark at the plurality of timings specified by the specific means, and
Have a, a detecting means for detecting a position of the mark indicating the waveform of the detection signal based on a detection signal obtained from the captured image by the imaging means,
The detection means is a detection device characterized in that the position of the mark indicated by the waveform of the detection signal is corrected based on the deviation at the plurality of timings . The detection device according to claim 1, wherein the specifying means specifies the plurality of timings based on the position information of the object. Before Symbol detection means detects the position of the mark on the basis of a detection signal obtained from the captured image by the image pickup means at each of said plurality of timing, based on the deviation in each of the plurality of timing The detection device according to claim 1 or 2, wherein the position of the detected mark is corrected . The detection means is based on the result of superimposing a plurality of detection signals obtained from an image captured by the imaging means at each of the plurality of timings by shifting the deviation of the object at each of the plurality of timings. The detection device according to claim 1 or 2 , wherein the position of the mark indicated by the waveform of the detection signal is corrected . The imaging means is any one of claims 1 to 4, characterized in that the object is to extend the time to continue the imaging of the marks as the first course of the reached Teka et time increases to the target position The detection device described in. The imaging means is characterized in that the mark is imaged at the plurality of timings by controlling the opening / closing timing of the electronic shutter of the imaging means or the emission timing of light from a light source that illuminates the mark. The detection device according to any one of claims 1 to 5 . A patterning device that forms a pattern on a substrate.
The detection device according to any one of claims 1 to 6 .
A moving means for moving an object provided with a mark to be detected by the detection device, and
A measuring means for measuring the position of the object and
A patterning apparatus characterized by having. A detection method that detects the position of a mark provided on a movable object.
A specific step of specifying a plurality of timings at which the velocity of the object becomes equal to or less than a predetermined value between the time when the object first reaches the target position and the time when the deviation of the object with respect to the target position converges within a predetermined range. ,
An imaging step of imaging the mark at the plurality of timings specified in the specific step,
On the basis of the detection signal obtained from the captured image in the imaging step, have a, a detection step of detecting a position of the mark indicating the waveform of the detection signal,
The detection step comprises correcting the position of the mark indicated by the waveform of the detection signal based on the deviation at the plurality of timings . It is a manufacturing method of goods
A forming step of forming a pattern on the substrate by using the patterning apparatus according to claim 7 .
A processing step of processing the substrate formed of a pattern in the forming step,
A manufacturing process for manufacturing an article from the substrate processed in the processing step, and
A method of manufacturing an article, which comprises having.

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