KR20190041516A - Detection device, detection method, patterning device, and manufacturing method of article - Google Patents

Abstract

The present invention relates to a detection device (25) for detecting the position of a mark on a movable object (3, 4a). The detecting device 25 has a function as a specifying means for specifying a timing at which the velocity of the objects 3 and 4a becomes equal to or less than a predetermined value during the time from when the objects 3 and 4a reach the target position to when they are corrected (13, 16) for picking up a mark at a timing specified by the control unit (24), and an image pickup result obtained by the image pickup means (13, 16) and an object 3, 4a) for detecting the position of the mark on the basis of the positional information of the mark (2, 3, 4a).

Description

Detection device, detection method, patterning device, and manufacturing method of article

The present invention relates to a detection device, a detection method, a lithographic apparatus, and a method of manufacturing an article.

In the exposure apparatus, the substrate under exposure is positioned based on the alignment mark formed on the substrate on the stage top plate and the position of the reference mark (hereinafter referred to as a mark) provided on the stage top plate. Therefore, in order to reduce the overlapping error between the pattern already formed and the pattern newly formed, it is important to detect the position of the mark with high accuracy.

In order to detect the position of the mark with high accuracy, it is preferable that the vibration of the stage top plate holding the substrate at the time of detection is small. Therefore, after the stage ceiling plate is corrected, i.e., the deviation of the position of the stage ceiling plate with respect to the target position converges to a predetermined range (corrected), the position of the mark is detected.

Patent Document 1 discloses a method of detecting a mark in a state in which the stage ceiling plate vibrates when determining the poaching position of the mark. Specifically, the stage top plate displaces the substrate in the direction of the optical axis while the light source emits the pulse light a plurality of times toward the mark, and the deviation of the stage ceiling plate with respect to the target position is measured every time the pulse light is emitted. It is described that the focusing position of the mark is determined based on the imaging result of a plurality of marks obtained by the emission of the pulsed light and the deviation of the stage ceiling plate.

In Patent Document 1, since mark detection is performed at predetermined time intervals within a predetermined time regardless of the magnitude of the speed of the stage top plate (the change of the position of the stage top plate per unit time), there is a fear that the image obtained by the image pick- have.

An object of the present invention is to provide a detection device capable of detecting a mark with high accuracy when detecting a mark on the object before correction of a movable object.

Japanese Patent Laid-Open No. 11-40491

A detection device according to the present invention is a detection device that detects the position of a mark on a movable object and detects a timing at which the speed of the object becomes less than or equal to a predetermined value until the object reaches the target position and is corrected An image pickup means for picking up the mark at a timing specified by the specifying means, and a control means for controlling the position of the mark based on the image pickup result obtained by the image pickup means and the positional information of the object at the timing, And a detection means for detecting the detection signal.

1 is a diagram showing the configuration of an exposure apparatus according to the first embodiment.
2 is a view showing the arrangement of marks on the ceiling plate.
3 is a view showing the deviation of the position of the ceiling plate.
4 is a flowchart for explaining a method of detecting the position of a mark.
5 is a diagram showing the imaging timing in the first embodiment.
6 is a diagram showing a detection signal according to the first embodiment.
7A is a diagram showing the result of shifting the waveform of the detection signal according to the second embodiment.
7B is a diagram showing the final waveform of the detection signal according to the second embodiment.
Fig. 8 is a diagram showing the detection timing of a mark in the third embodiment. Fig.

Example  One

Hereinafter, an embodiment in which the detection apparatus according to the first embodiment is applied to an exposure apparatus will be described, but the detection apparatus of the present invention is also applicable to other apparatuses described later. In the drawings, the same members are denoted by the same reference numerals.

Fig. 1 is a diagram showing the configuration of the exposure apparatus 100. Fig. The axis in the vertical direction is the Z axis, and the two axes orthogonal to each other in the plane perpendicular to the Z axis are called the X axis and the Y axis.

The exposure apparatus 100 is a scanning exposure apparatus and is configured to scan the reticle 1 and the substrate (object) 3 in synchronism with each other in the Y-axis direction using the reticle stage 2 and the substrate stage 4, ) To form a latent image pattern of a resist (not shown) on the substrate 3. Then,

The illumination optical system 5 illuminates the reticle 1 with light emitted from a light source (not shown). The light source is, for example, a mercury lamp, a KrF excimer laser light source, or an ArF excimer laser light source. The projection optical system 6 projects an image obtained by reducing a pattern image formed on the reticle 1 to a predetermined magnification on the substrate 3. [

The reticle stage 2 moves the reticle 1 in the six-axis direction. The reticle 1 is positioned by an actuator such as a linear motor or a pulse motor.

The substrate stage 4 moves the substrate 3 in the six-axis direction. The substrate stage 4 includes a stage top plate (movable object) 4a (hereinafter referred to as a top plate 4a) that holds the substrate 3 and moves together with the substrate 3, And a driving mechanism (moving means) 4b for moving the driving mechanism 4b. The drive mechanism 4b positions the substrate 3 and the ceiling plate 4a by an actuator such as a linear motor or a pulse motor.

At least one of the reticle stage 2 and the substrate stage 4 may be provided with a coarse driving system with a long stroke length and a fine driving system with a short stroke length. The six-axis direction is the X-axis direction, the Y-axis direction, the Z-axis direction, and the rotational directions (? X,? Y,? Z) around these axes.

The interferometer 9 emits laser light and detects the reflected light reflected by the mirror 7 provided on the reticle stage 2 and the interference light of the reference light. (Position information) of the reticle stage 2 is measured based on the detection result.

The interferometer 10 is a measuring means for measuring the position (positional information) of the ceiling plate 4a during exposure. And detects the interference light of the reflected light reflected by the mirror 8 provided on the substrate stage 4 and the reference light. The interferometer 10 measures the position of the ceiling plate 4a based on the detection result.

Based on the measurement results by the interferometer 9 and the interferometer 10, a control section, which will be described later, controls the positions of the reticle stage 2 and the substrate stage 4. [

The focus system 15 measures the position of the substrate in the Z direction by receiving reflected light of light obliquely incident on the substrate 3.

The detecting device 25 detects the position of a mark on the ceiling plate 4a. In addition, the top plate 4a also includes a substrate 3 and a reference plate 11 described later. The detection device 25 includes an alignment system 13, a processing unit (detection means) 22 for processing an image pickup result by the alignment system 13, an alignment system 16, and an alignment system (Detection means) 23 for processing the image pickup result by the image pickup means 13 (13).

The marks captured by the alignment system 13 and the alignment system 16 will be described. 2 is a view of the ceiling plate 4a viewed from above (+ Z direction). On the substrate 3, a plurality of shot regions 14 are formed. The shot area 14 is a unit area of a base layer on which a pattern is already formed, and is formed with a gap between the scribe lines 20. One shot area 14 has a size of, for example, about 26 mm x 33 mm, and includes one or more patterns of the chip size desired by the user. In the scribe line 20, a plurality of marks 19 are formed between respective sides of the respective shot regions 14.

On the ceiling plate 4a, a reference plate 11 is provided in addition to the substrate 3. The height of the upper surface of the reference plate 11 is almost the same as the height of the surface of the substrate 3. [ On the upper surface of the reference plate 11, marks 17 and 18 are formed.

Returning to the description of Fig. The alignment system 13 includes an illumination system for illuminating a reference mark (not shown) and marks 17 and 18 provided on the reticle 1 via the projection optical system 6, And a light receiving system for receiving reflected light from the marks 17 and 18. The light receiving system has an image pickup element such as a CMOS sensor or a CCD, and the light receiving system simultaneously picks up a reference mark and marks 17 and 18 provided on the reticle 1. [ The image pickup device inputs the image pickup result to the processing unit (22).

The processing section 23 calculates the positions of the marks 17 and 18 with respect to the reference marks of the reticle 1 based on the imaging results. The processing section 22 inputs the calculation result (detection result) to the control section 24.

The alignment system 16 includes an illumination system for illuminating a mark 17 corresponding to a representative shot area 14 among the plurality of shot areas 14 and light outside the axis of exposure light, And a light receiving system for receiving the reflected light from the light source. The light receiving system has an image pickup element such as a CMOS sensor or a CCD, and picks up images of the marks 17 and 19. The imaging device inputs the imaging result (detection signal) to the processing unit 23. [ The processing section 23 calculates the positions of the marks 17 and 19 based on the imaging results. The processing section 22 inputs the calculation result to the control section 24.

The control unit 24 determines the position of the mark 17 with respect to the reference mark of the reticle 1 with the alignment system 13 and the position of the mark 19 with respect to the mark 17 with the alignment 16. Thus, the position of the mark 19 with respect to the reference mark of the reticle is obtained. Thereby, the relative positions of the reticle 1 and each shot area 14 are obtained, and synchronous control of the reticle stage 2 and the substrate stage 4 during exposure can be performed.

The control unit 24 includes a CPU and a memory and is connected to the processing units 22 and 23, the interferometers 9 and 10, the reticle stage 2, the substrate stage 4, and the focus system 15. In the memory of the control section 24, the program shown in the flowchart of Fig. 4 to be described later is stored. The CPU reads the program from the memory and controls the components connected to the control unit 24 to execute the program.

The control unit 24 controls the image pickup elements of the alignment systems 13 and 16 based on the measurement result of the position of the ceiling plate 4a by the interferometer 10 (position information of the ceiling plate 4a) (Timing) at which an image of the subject (subject) 19, 19 is taken. The memory of the control section 24 stores a predetermined value of the speed of the ceiling plate 4a which is a threshold value for whether or not the alignment systems 13 and 16 should capture the marks 17, 18 and 19. In addition, the set total time to be imaged is stored.

The control unit 24 has a function as specifying means for specifying the imaging timing. From the measurement result of the position of the ceiling plate 4a by the interferometer 10, the speed of the ceiling plate 4a in real time (the change of the position of the ceiling plate 4a with respect to the target deviation per unit time) is compared with the predetermined value. As a result of the comparison, the timing at which the speed of the ceiling plate 4a becomes equal to or less than a preset predetermined position is specified as the imaging timing. That is, the start time of the imaging timing is estimated. The control unit 24 sends the position information of the ceiling plate 4a required for calculation of the marks 17, 18 and 19 to the processing units 22 and 23. The position information may be the output of the interferometers 9 and 10 or the deviation information with respect to the target position.

3 is a diagram showing the relationship between the elapsed time (horizontal axis) after the top plate 4a has reached the target position and the deviation (vertical axis) with respect to the target position of the top plate 4a. Here, the target position is a target position in the XY plane (plane along the substrate). And the deviation represents only the positional deviation in the Y-axis direction. In the following description means that the top plate 4a reaches the target position for the first time after the top plate 4a is moved toward the target position by the drive mechanism 4b and the top plate 4a ) Does not indicate a state where it completely stops at the target position. That is, even after the target position is reached, the ceiling plate 4a vibrates with a deviation from the target position.

The time Ts represents the end time of the time from when the ceiling plate 4a reaches the target position to when it is corrected. That is, the time Ts is the time at which the ceiling plate 4a is corrected, and the deviation (position deviation of the ceiling plate 4a) with respect to the position of the target of the position of the ceiling plate 4a is converged and converged within the allowable range . The predetermined range Ea is determined by the vibration state to be satisfied by the ceiling plate 4a when the position of the mark 19 is detected by, for example, imaging the mark 19 continuously with the alignment 16. [

(Detection method of mark position)

Next, the detection method according to the first embodiment will be described with reference to Figs. 4 and 5 as an example of the detection method of the mark 19 by the alignment system 16. Fig. Fig. 4 is a flowchart for explaining the detection method of the mark 19, and Fig. 5 is a view for explaining the imaging timing by the imaging element of the alignment system 16. Fig.

In S101, the control unit 24 always judges whether or not the drive mechanism 4b has reached the target position after starting the positioning of the ceiling plate 4a to the target position. The process of S101 is continued until it is determined as YES in S101, and the process proceeds to S102 when it is determined to be YES.

In S102, the control unit 24 specifies the imaging timing on the basis of the measurement result of the position of the ceiling plate 4a by the interferometer 10. Specifically, the start time of the imaging timing is estimated by comparing the threshold value stored in the memory with the speed of the ceiling plate 4a obtained from the measurement result of the interferometer 10. Here, by specifying the time zone in which the speed of the ceiling plate 4a is equal to or lower than the predetermined value at the imaging timing, the mark 19 can be captured relatively close to the stopped state of the ceiling plate 4a. Thereby, an imaging result with less fluctuation is obtained compared with the case where the speed of the ceiling plate 4a is high. That is, a clear image of the boundary between the mark 19 and the portion other than the mark 19 is obtained.

In Fig. 5, the imaging timings T1 to T10 are the time zones in which the marks 19 should be picked up. In S103, on the basis of an instruction from the control unit 24, the alignment system 16 starts imaging from the start time of the imaging timing estimated by the control unit 24. Similarly, when the end time of the imaging timing estimated by the control section 24 is reached, the alignment system 16 ends the first imaging of the mark 19. [

Here, the alignment system 16 controls the start and end of the imaging of the mark 19 by controlling the emission timings (timing of turning on and off) of illumination light for illuminating the mark 19 by the light projecting system. Alternatively, the opening and closing timings of the electronic shutter of the image pickup element may be controlled while the illumination light from the light projecting system is always emitted, thereby controlling the start and end of the image pickup. In this way, the mark 19 can be picked up only while the speed of the ceiling plate 4a is not more than the predetermined value, and a plurality of image pickup results can be obtained. The imaging result output by the alignment system 16 is input to the processing unit 23. [

In S105, the control unit 24 determines whether or not the total imaging time has reached a predetermined imaging time stored in the memory, repeats S102 to S104 until the predetermined imaging time is reached, . At this time, as shown in Fig. 5, when the deviation of the ceiling plate 4a is converged within the threshold value Ea, the mark 19 may be continuously picked up. When the predetermined imaging time has been reached, the process proceeds to step S106. Further, at the time when it is determined as YES in S105, the substrate stage 4 starts to move the ceiling plate 4a toward another target position.

The processing unit 23 calculates the position of the mark 19 based on the positional information of the ceiling plate 4a at each imaging timing and the imaging result in S104 in accordance with the instruction from the control unit 24 (Detected). First, the processing section 23 calculates the position of the mark 19 indicated by each imaging result. 6 is a diagram showing waveforms of detection signals obtained from phases acquired at the imaging timings T1 to Tn. The center position of each waveform is calculated. Next, deviation of the position of the ceiling plate 4a at each imaging timing is acquired through the control section 24. [ The obtained deviation is used as an offset value, and the position of the mark obtained from the imaging result is corrected.

For example, when the position of the mark 19 obtained from the imaging result at the imaging timing T1 is Y1 and the average value of the deviation of the position of the ceiling plate 4a during the imaging timing T1 is? Y, Y1 '= Y1- And ΔY is calculated as the temporary position of the mark 19. Similarly, the temporary positions Y2 'to Y10' of the marks are calculated from the imaging results obtained at each of the imaging timings T2 to T10.

In step S107, the processing section 23 calculates the position of the mark 19 in accordance with an instruction from the control section 24. [ For example, the average position of Y1 'to Y10' is the position of the mark 10. The calculation result is input to the control unit 24, and the control unit 24 stores the position of the detected mark 19 in the memory. Thus, the detection ends. Thereafter, the position of the other mark 19 is also detected.

The S / N ratio of the detection signal obtained from the image pickup result is smaller than that in the case where the mark 19 is picked up only once in the continuous time after correction, in the waveform indicated by the image pickup result obtained at one image pickup timing. However, by using a plurality of imaging results obtained at a plurality of imaging timings, a desired accuracy can be secured with respect to the detection of the position of the mark 19. [ The processing section 23 calculates the X position of the mark 19, like the Y position, based on the imaging results obtained at the imaging timings T1 to T10.

The image of the mark 19 in the imaging timing at which the velocity of the substrate stage 4 is equal to or lower than the predetermined value and the position information of the ceiling plate 4a at the time of imaging are used to correct the mark 19 are detected. The position of the mark can be detected with high accuracy even when the mark is detected before correction of the ceiling plate 4a. The ending time of the imaging of the mark 19 can be made faster than when the imaging of the mark 19 is started by waiting for correction of the ceiling plate 4a. Since it is possible to reduce the time required for the imaging of each mark 19, the total time required for the position detection of the plurality of marks 19 can be reduced.

In step S107, the processing section 23 preferably calculates the position of the mark 19 based on the result of weighting the temporary positions Y1 'to Y10' according to the elapsed time. For example, it is preferable to calculate the position of the mark 19 by focusing on the value obtained at the imaging timing T10, which is less affected by the vibration of the ceiling plate 4a than the imaging timing T1, and which is highly reliable.

As the positional deviation of the substrate stage 4 converges, the duration of imaging at the imaging timing to be written is prolonged. As described above, the time for continuing the imaging at the imaging timing per one time may be fixed without weighting the imaging time of the mark 19 per one time. In parallel with S102 to S105, the processing unit 23 may perform the calculation processing of S107 on the basis of the already obtained imaging result.

Example  2

In the method of detecting the position of the mark 19 according to the second embodiment, the position of the mark 19 is calculated based on the result of superimposing a plurality of imaging results obtained at the plurality of imaging timings T1 to T10. The steps S101 to S105 are the same as those of the first embodiment, so that the description thereof will be omitted and only the steps executed in place of S106 and S107 will be described.

First, the processing section 23 shifts the waveform of the detection signal obtained from the respective imaging results of the imaging timings T1 to T10 without obtaining the center position of the waveform. The amount of shift at this time is an amount corresponding to the average position of the deviation of the position of the ceiling plate 4a in each of the imaging timings T1 to T10. FIG. 7A shows the arrangement of the results of shifting each waveform.

Next, the processing section 23 superimposes the waveform after the shift. That is, the detection signals are all summed up to obtain the final waveform shown in Fig. 7B. By combining all of the detection signals, the position of the mark 19 can be calculated based on the detection signal having a larger S / N ratio as compared with the detection signal obtained at one imaging timing. Finally, the processing section 23 outputs the position indicated by the center position of the waveform on the image pickup element from the final waveform as the position Y 'of the mark 19. The position Y 'is input to the control unit 24, and the control unit 24 stores the position of the detected mark 19 in the memory.

The image of the mark 19 in the imaging timing at which the velocity of the substrate stage 4 is equal to or lower than the predetermined value and the position information of the ceiling plate 4a at the time of imaging are used to correct the mark 19 are detected. The position of the mark can be detected with high accuracy even when the mark is detected before the ceiling plate 4a is corrected. The ending time of the imaging of the mark 19 can be made faster than when the imaging of the mark 19 is started by waiting for correction of the ceiling plate 4a. Since it is possible to reduce the time required for the imaging of each mark 19, the total time required for the position detection of the plurality of marks 19 can be reduced.

Even when the performance of the imaging device used for imaging the mark 19 is lower than that of the first embodiment, the mark 19 is imaged only once in the continuous time after the correction of the top plate 4a, It is possible to detect the position of the mark 19 with at least the same accuracy as the detection.

Example  3

The Z position of the substrate 3 is also detected by detecting the Z position (the position in the Z-axis direction) of the marks 17 and 18 from the image pickup result by the alignment system 13 in the third embodiment. The imaging timings are different depending on the direction of the detection target of the position of the marks 17 and 18. [ That is, this embodiment shows a case where the imaging timing is different in the case of detecting the position in the XY-axis direction and the case of detecting the position in the Z-axis direction. A description will be given of a case in which the threshold value indicating the correction of the ceiling plate 4a is made different. Since the configuration of the exposure apparatus 100 including the detection device 25 is the same as that of the first embodiment, a detailed description thereof will be omitted.

8 shows the time at which the ceiling plate 4a reaches the target position and converges at the corrected time Ts. In the waveform 30, the timing at which the velocity of the ceiling plate 4a becomes equal to or less than a predetermined value is indicated by a thick line. On the other hand, the waveform 32 of the broken line indicates the deviation of the position in the Z-axis direction. The time at which the position deviation converges to the threshold value Ec with respect to the waveform 32 is the corrected time Tc. In the waveform 32, the timing at which the velocity in the Z-axis direction per unit time becomes equal to or less than a predetermined value is indicated by a bold line. Since the tolerance varies depending on the direction, the threshold value is set to Ec > Ea.

There may be a case in which the wobble width of the amplitude of the waveform is different in the direction along the direction as shown by the waveform 30 and the waveform 32. In such a case, the imaging timing is made different depending on the direction of the position of the detection object. For example, in the case of FIG. 8, the waveform 30 involves a delay of 1/4 cycle compared to the waveform 32.

The control unit 24 specifies the imaging timing at which the velocity of the ceiling plate 4a in the Z axis direction becomes equal to or less than the predetermined position and the imaging timing at which the velocity in the X axis direction of the ceiling plate 4a is equal to or smaller than the predetermined value. The position of the processing section 22 in the Z axis direction is calculated by using a plurality of imaging results obtained at the imaging timing at which the velocity of the ceiling plate 4a in the Z axis direction becomes a predetermined position or less. On the other hand, the position in the X-axis direction is calculated by using a plurality of imaging results obtained at the imaging timing at which the speed of the ceiling plate 4a in the X-axis direction becomes a predetermined value or less. The method of calculating the position of the mark 19 from the imaging result is the same as the steps of S107 and S108 in the first embodiment.

In this embodiment, the same effect as that of the first embodiment can be obtained. Further, based on the image pickup results obtained at different imaging timings, the positions in the two axial directions can be respectively detected.

Other Example

The detection device 25 may be applied to other devices that align and align the marks on the object. For example, it may be mounted on an apparatus for inspecting a semiconductor circuit, a wafer inspecting apparatus, a defect inspecting apparatus, or the like.

In the first to third embodiments, the case where the control section 24 specifies a plurality of imaging timings has been described. However, the number of imaging timings specified by the control section 24 and the number of imaging times of the alignment system 16 are set to 1 It may be a recurrence. Further, the above-described mark detection method may be performed by the alignment system 13 instead of the alignment system 16 of the first and second embodiments. At least one of the alignment systems 13 and 16 needs to execute the aforementioned method of detecting the position of the mark.

An embodiment has been described in which the mark 19 is imaged only at the imaging timing by the lighting control of the illumination light or the electronic shutter, but other methods may be employed. For example, when the processing section 23 calculates the position of the mark 19, the image pickup element always picks up the mark 19 and extracts only the imaging result at the imaging timing specified by the control section 24 .

The alignment system 13 is a detection system that detects light reflected by the marks 17 and 18, but may be a detection system that detects light diffracted by passing through the marks 17 and 18. In this case, the light emitting system of the alignment system 13 may be disposed above the reticle 1, and the image pickup element serving as a light receiving system may be disposed inside the ceiling plate 4. [

But may include one processing section as long as it has the functions of the processing sections 22 and 23, respectively. Alternatively, the control unit 24 may have the functions of the processing units 22 and 23.

The detection device 25 is not limited to the exposure apparatus 100 which is a scanning exposure apparatus, but can be applied to other lithography apparatuses (patterning apparatuses) that form a pattern on a substrate. The lithographic apparatus may be a stepper for forming a latent image pattern of a resist on a substrate by exposing the substrate 3 while driving the substrate 3 in a step-and-repeat manner with respect to a fixed reticle 1, for example. Alternatively, it may be an imprint apparatus for forming a concave-convex pattern on a substrate by using a mold, or a drawing apparatus for forming a latent image pattern on a substrate by irradiation of a charged particle beam.

The exposure light of the exposure apparatus 100 is irradiated with various kinds of light such as g-line (wavelength 436 nm), i-line (wavelength 365 nm), ArF laser light (wavelength 193 nm), EUV light It is selectable from light.

The detecting device 25 may be mounted on other apparatuses which need to detect the position of the mark.

A method of manufacturing an article Example

The pattern of the cured product formed by using the lithographic apparatus is used temporarily, at least partly, of various articles or when various articles are produced.

An article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold.

Examples of the electric circuit element include a semiconductor memory such as a volatile or nonvolatile semiconductor memory such as a DRAM, an SRAM, a flash memory, and an MRAM, and a semiconductor element such as an LSI, a CCD, an image sensor, and an FPGA.

Examples of molds include molds for imprinting.

The pattern of the cured product is used as a constituent member of at least a part of the article as it is, or temporarily used as a resist mask. After etching or ion implantation is performed in the processing step of the substrate, the resist mask is removed. The fabrication process may also include other known fabrication processes (development, oxidation, deposition, deposition, planarization, resist stripping, dicing, bonding, packaging, etc.).

The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention. Accordingly, the following claims are appended to disclose the scope of the invention.

The present application claims priority based on Japanese Patent Application No. 2016-179919 filed on September 14, 2016, the entire contents of which are incorporated herein by reference.

Claims (13)

A detecting device for detecting the position of a mark on a movable object,
Specifying means for specifying a timing at which the speed of the object becomes equal to or less than a predetermined value during a period from when the object reaches the target position until the object is corrected;
An imaging means for imaging the mark at a timing specified by the specifying means;
And detection means for detecting the position of the mark based on the imaging result obtained by the imaging means and the positional information of the object at the timing. The method according to claim 1,
And the specifying means specifies the timing based on position information of the object. The method according to claim 1,
Wherein said specifying means specifies a plurality of said timings,
Wherein the detection means detects the position of the mark based on the imaging result from the imaging means in each of a plurality of timings. The method of claim 3,
Wherein the detecting means detects a plurality of temporary positions of the mark corresponding to each of the plurality of imaging results obtained at the plurality of timings and detects the position of the mark based on the plurality of temporary positions. The method of claim 3,
Wherein the detecting means detects the position of the mark based on a result of superimposing a plurality of imaging results obtained at the plurality of timings. 5. The method of claim 4,
Wherein the detection means detects a position of the mark by assigning weights to a plurality of imaging results obtained at each of the plurality of timings. The method of claim 3,
Wherein the image pickup means weights the time for continuing the imaging of the mark in each of the plurality of timings based on the elapsed time from the time when the target position is reached. The method according to claim 1,
And the timing is different according to the direction of the detection target of the position of the mark. The method according to claim 1,
Wherein the imaging unit controls the opening and closing timing of the electronic shutter of the imaging unit or the light emission timing of the light from the light source illuminating the mark to pick up the mark at the timing. The method according to claim 1,
During the time from when the object reaches the target position until the object is corrected until the object reaches the target position and the deviation of the position of the object with respect to the target position converges within a predetermined range, . A patterning apparatus for forming a pattern on a substrate,
A detection device for detecting a position of a mark on a movable object,
Moving means for moving an object provided with a mark to be detected by the detection device,
A measurement means for measuring the position of the object
Lt; / RTI &
The detection device includes:
Specifying means for specifying a timing at which the speed of the object becomes equal to or less than a predetermined value during a period from when the object reaches the target position until the object is corrected;
An imaging means for imaging the mark at a timing specified by the specifying means;
And detection means for detecting the position of the mark based on the imaging result obtained by the imaging means and the positional information of the object at the timing. A detecting method for detecting a position of a mark provided on a movable object,
A step of specifying a timing at which the speed of the object becomes equal to or less than a predetermined value from when the object reaches the target position until the object is corrected;
Capturing the mark at the timing specified in the process;
And detecting the position of the mark based on the imaging result obtained in the process and the positional information of the object in the timing. A method of manufacturing an article,
A step of forming a pattern on the substrate using a patterning device for forming a pattern on the substrate;
A step of processing a substrate on which a pattern is formed in the step,
Wherein the patterning device comprises:
A detection device for detecting a position of a mark on a movable object,
Moving means for moving an object provided with a mark to be detected by the detection device,
And measurement means for measuring the position of the object,
The detection device includes:
Specifying means for specifying a timing at which the speed of the object becomes equal to or less than a predetermined value during a period from when the object reaches the target position until the object is corrected;
An imaging means for imaging the mark at a timing specified by the specifying means;
And detection means for detecting the position of the mark based on the imaging result obtained by the imaging means and the positional information of the object at the timing.

Images