JP5137879B2 - Exposure apparatus and device manufacturing method - Google Patents

Description

  The present invention relates to an exposure apparatus and a device manufacturing method, and more particularly to an exposure apparatus that sequentially exposes a plurality of shot areas of a substrate coated with a photosensitive agent via a projection optical system and a device manufacturing method using the exposure apparatus.

  When a device such as a semiconductor device, a liquid crystal display device, or a thin film magnetic head is manufactured by a lithography process, an exposure apparatus that transfers an original pattern onto a photosensitive substrate via a projection optical system is used. The exposure apparatus is required to have higher resolving power as the device becomes finer and higher in density.

  The projection resolution of the pattern depends on the numerical aperture (NA) of the projection optical system and the exposure wavelength, and can be enhanced by increasing the NA of the projection optical system or shortening the exposure wavelength. As for the exposure wavelength, for example, the shorter wavelength is progressing in the order of g-line, i-line, and excimer laser light. Excimer laser light has been shortened to 248 nm, 193 nm, and further 157 nm.

  As is well known, exposure apparatus methods include a step-and-repeat method and a step-and-scan method. The step-and-scan method is called a scanning exposure apparatus. In particular, in the step-and-scan method, the surface of the substrate can be adjusted to the optimum exposure image plane position while performing scanning exposure, so that a reduction in exposure accuracy due to poor flatness of the substrate can be reduced. it can.

  In the scanning exposure apparatus, the surface position of the exposure target area can be measured and corrected to the image plane position before the exposure target area (shot area) reaches the irradiation area of the slit-shaped exposure light (hereinafter referred to as slit light). . The surface position means a position in the optical axis direction of the projection optical system.

  The surface position can be measured using, for example, a light oblique incident surface position detection device or a gap sensor such as an air microsensor or a capacitance sensor. Furthermore, not only the height position but also a plurality of measurement points can be arranged or defined to measure the surface inclination.

  9 and 10 are diagrams illustrating examples of arrangement of measurement points. In the example shown in FIG. 9, three measurement points of the surface position detection device are arranged in front and rear in the scanning drive direction (Y direction) of the slit light 900. In the example shown in FIG. 10, five measurement points of the surface position detection device are arranged forward and backward in the scanning drive direction (Y direction) of the slit light 900. The reason why the measurement points are arranged in front and rear in the slit direction is that the scanning for exposure is performed in both the + Y direction and the −Y direction, and the surface position of the substrate is measured immediately before the exposure in either direction. It is. Japanese Patent Application Laid-Open No. 2004-228561 discloses a focus and tilt measurement method in scanning exposure.

  Patent Document 2 discloses a method for obtaining wafer plane information in advance by a focus detection system provided separately from the exposure apparatus, and controlling and driving focus and tilt using the plane information. Yes.

  The depth of focus has become extremely small in accordance with the trend toward miniaturization, and the demand for the accuracy of aligning the surface of the substrate to be exposed with the best imaging plane, the so-called focus accuracy, has become increasingly severe.

  In particular, it has been found that the focus detection accuracy of the exposure target region becomes a problem for a substrate having a poor surface shape accuracy. As a numerical example, the control requirement of the flatness of the substrate with respect to the depth of focus of the exposure apparatus is generally 1/10 to 1/5 of the depth of focus, and 0.04 μm when the depth of focus is 0.4 μm. ~ 0.08 μm. As illustrated in FIG. 7, when the substrate surface position is corrected based on the information of the measurement points FP1, FP2, and FP3 arranged at equal intervals, there is no substrate surface position information between the measurement points. Accordingly, defocusing occurs by the amount of deviation Δ between the plane obtained from the surface position information of FP1, FP2, and FP3 and the actual surface position of the substrate. Such a defocus factor is called a focus sampling error.

  In order to reduce the focus sampling error, the focus sampling interval should be reduced. Here, the focus sampling interval can be determined based on, for example, the detection region of the measurement sensor, the measurement scan speed, the sampling period corresponding to the residual vibration mode of the exposure apparatus structure, the control frequency of the control system, and the like. . For example, consider a case in which measurement points are arranged at intervals of 1 mm in the scan direction, and measurement points of an oblique incidence system are arranged at intervals of 1 mm in a direction orthogonal to the scan direction. In this case, the plane information of the entire range of the substrate is obtained as information mapped to a grid having a 1 mm interval in the scanning direction and a 1 mm interval in a direction orthogonal to the scanning direction.

  However, at the production site, products of various chip sizes are produced by introducing shrink plates, cut-down plates, etc. according to the diversification and miniaturization trend of chips. Therefore, in the arrangement of the measurement points depending on the performance or configuration of the apparatus as described above, the positional relationship between the shots and the measurement points changes every time the shots are straddled. As a result, local defocusing occurs when the distance between the measurement area and the peripheral portion of the shot, particularly the exposure start position and the exposure end position, increases. Note that the shot region is a region including one or a plurality of chip regions.

JP 09-045609 A JP 2004-071851 A

  The present invention has been made with the above problem recognition as an opportunity.For example, it is possible to reduce a disadvantage, for example, local defocus, caused by a difference in positional relationship between a shot area and a measurement point among a plurality of shot areas. Objective.

The exposure apparatus of the present invention is configured to sequentially expose a plurality of shot areas of a substrate coated with a photosensitive agent via a projection optical system, and in a plurality of continuous shot areas in a state where the substrate is driven to scan. The surface position of the substrate is controlled so that the exposure area of the substrate matches the image plane of the projection optical system based on the measurement device that measures the surface position of the measurement point defined in A distance M from the edge of the shot area to the measurement point in the shot area is common in the plurality of shot areas, and the interval between the adjacent measurement points in the shot area is a common first distance P Thus, a plurality of measurement points are defined for each of the plurality of shot areas so that the distance between the last measurement point in the shot area and the first measurement point in the next shot is the second distance D, and the measurement The container Measures the surface position of measurement points in at least two shot areas arranged continuously along the scanning drive direction, with the substrate being scanned and driven at a constant speed without acceleration and deceleration for each area. When the length of the shot area in the scanning direction is L and the arrangement pitch of the shot area in the scanning direction is Y pitch ,
K = INT ((LM) / P),
D = Ypitch-K × P
Meet.

An exposure apparatus according to a preferred embodiment of the present invention can be configured as an exposure apparatus that sequentially exposes a plurality of shot regions of a substrate coated with a photosensitive agent via a projection optical system. The exposure apparatus includes a measuring device that measures a surface position of measurement points defined in a plurality of continuous shot regions in a state where the substrate is driven to scan, and a substrate coverage based on a measurement result by the measuring device. Ru and a control unit exposure regions to control the surface position of the substrate to match the image plane of the projection optical system. Here, at least one measurement point is defined for each of the plurality of shot areas, and the arrangement of the measurement points is common in the plurality of shot areas. It is preferable that the distance from the end of the shot area to the measurement point in the shot area is common to the plurality of shot areas. The interval between adjacent measurement points in the shot area is a common first distance, and the interval between the last measurement point in the shot area and the first measurement point in the next shot is the second distance, A plurality of measurement points are preferably defined. The measuring device preferably measures the heights of the measurement points in at least two shot regions arranged continuously along the scanning drive direction in a state where the substrate is scanned and driven at a constant speed. Preferably, the measuring instrument measures the heights of the measurement points in the first and second shot regions arranged continuously along the scanning drive direction in a state where the substrate is scanned and driven at a constant speed. The measuring instrument measures adjacent measurement points in the first shot area and adjacent measurement points in the second shot area at a common first time interval, and determines the last measurement point in the first shot. It is preferable to secure a second time interval between the time to measure and the time to measure the first measurement point in the second shot. The exposure apparatus preferably includes a substrate stage that holds a substrate and moves between an exposure station for exposing the substrate and a measurement station for performing measurement by the measuring instrument. Preferably, a plurality of the substrate stages are provided, and the substrate exposure processing at the exposure station and the substrate measurement processing at the measurement station are performed in parallel.

  The device manufacturing method of the present invention includes an exposure step of exposing a substrate using the above exposure apparatus, a developing step of developing the exposed substrate, and a processing step of processing the developed substrate.

  According to the present invention, for example, it is possible to reduce a disadvantage, for example, local defocus, due to a difference in positional relationship between a shot area and a measurement point between a plurality of shot areas.

It is a figure which shows schematic structure of the exposure apparatus of suitable embodiment of this invention. It is a figure which illustrates the light beam for surface position detection of a 1st surface position detection unit. It is a figure which illustrates the measurement order of the to-be-exposed area | region of a board | substrate. It is a figure which shows the example of arrangement | positioning of the measurement point in the surface position detection method of suitable embodiment of this invention. It is a figure which shows the example of arrangement | positioning of the measurement point in the surface position detection method of suitable embodiment of this invention. It is a top view which shows the selection example of the sample shot for evaluating the surface state of the to-be-exposed area | region of a board | substrate. It is a figure which shows typically a mode that a focus measurement is carried out with a rough space | interval on a substrate surface. It is a flowchart which shows operation | movement of the exposure apparatus of suitable embodiment of this invention. It is a figure which shows the example of arrangement | positioning of a measurement point. It is a figure which shows the example of arrangement | positioning of a measurement point. It is a figure which shows the flow of the whole manufacturing process of a semiconductor device. It is a figure which shows the detailed flow of a wafer process.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to a preferred embodiment of the present invention. The present invention is suitable for application to a scanning exposure apparatus, and an example in which the present invention is applied to a scanning exposure apparatus will be described below.

  An original (reticle) 2 having a pattern is held by an original stage (reticle stage) 3 and driven to scan. The original 2 is emitted from the illumination optical system 8 and illuminated by slit light obtained by molding with a slit member. Thereby, an image of the pattern of the original 2 is formed on the image plane of the projection optical system 1 by the slit light. A substrate (wafer) 4 coated with a photosensitive agent (photoresist) is positioned on the image plane. Below, the board | substrate with which the photosensitive agent was apply | coated is only described as a board | substrate.

  A plurality of shot areas are arranged on the substrate 4. Each shot area includes one or a plurality of chip areas. The exposure apparatus is configured to sequentially expose a plurality of shot areas on the substrate via the projection optical system 1. The substrate 4 is held by a substrate chuck 5.

  The substrate chuck 5 is mounted on the exposure stage mechanism 6. The exposure stage mechanism 6 can be configured as an apparatus capable of driving the substrate 4 in six axes. The exposure stage mechanism 6 includes an XY stage that can be driven in the X and Y axes, a leveling stage that can be driven in the Z axis, driven around the X and Y axes, a rotary stage that can be driven around the Z axis, and the like. It is comprised including. Note that the Z axis coincides with the optical axis AX of the projection optical system 1. The exposure stage mechanism 6 is disposed on the surface plate 7.

  The first surface position detection unit 50 that detects the surface position (or height position, Z-axis direction position) and inclination of the substrate 4 includes elements 10 to 19. The light source 10 may include a white lamp or a high-intensity light emitting diode having a plurality of different peak wavelengths. The light beam emitted from the light source 10 is collimated by the collimator lens 11 into a parallel light beam having a substantially uniform cross-sectional intensity distribution.

  The light beam emitted from the collimator lens 11 passes through the slit member 12, the optical system 13, and the mirror 14 and enters a plurality of measurement points (here, 25 are explained) on the surface of the substrate 4. The slit member 12 has a prism shape, and is configured by bonding a pair of prisms so that their slopes face each other, and a light-shielding film made of chromium or the like is provided on the bonding surface. In this light shielding film, openings (for example, pinholes) corresponding to the number of measurement points are formed.

  The optical system 13 is a bi-telecentric optical system. The surface of the light shielding film having 25 pinholes provided in the slit member 12 and the surface of the substrate 4 satisfy the Scheimpflug's condition for the optical system 13.

  The incident angle Φ of 25 light beams on the surface of the substrate 4 (an angle with respect to a line perpendicular to the surface of the substrate 4) is 70 ° or more.

  On the surface of the substrate 4, a plurality of shot regions having the same pattern structure are arranged or defined as illustrated in FIG. The 25 light fluxes that have passed through the optical system 13 are incident on the measurement points independent of each other in the pattern area, as illustrated in FIG. The 25 measurement points in FIG. 2 are arranged in the X direction so as to cover the width of the slit light on the substrate (the length in the direction perpendicular to the scanning direction). For example, the time required for measurement can be reduced to about ½ by arranging the measurement points so as to cover a region twice the width of the slit light on the substrate.

  The optical axis of the measurement light beam is rotated by θ ° (for example, 22.5 °) in the XY plane from the X direction so that 25 measurement points are observed independently from each other in the plane of the substrate 4. Can be arranged in different directions.

  Next, the reflected light beam from the substrate 4 passes through the mirror 15, the light receiving optical system 16, and the correction optical system group 18 and forms an image on the detection surface of the optical sensor 19. The light receiving optical system 16 is configured as a bi-telecentric optical system, and a stopper diaphragm 17 is disposed therein. The stopper diaphragm 17 is provided in common for 25 measurement points, and cuts high-order diffracted light (noise light) generated by the circuit pattern existing on the substrate 4.

  The 25 light beams that have passed through the light receiving optical system 16 have their optical axes parallel to each other, and are re-imaged on the detection surface of the photoelectric sensor 19 by 25 individual correction lenses of the correction optical system group 18. 25 spots are formed.

  The elements 16 to 18 are tilted and corrected so that each measurement point on the surface of the substrate 4 and the detection surface of the photoelectric sensor 19 are conjugate to each other. Therefore, the position of the pinhole image on the detection surface does not change due to the local inclination of each measurement point, and the pinhole on the detection surface responds to the height change of each measurement point in the optical axis direction AX. The position of the image changes.

  Here, the photoelectric sensor 19 can be composed of, for example, 25 one-dimensional CCD line sensors, but the same effect can be obtained even when a plurality of two-dimensional position detection elements are arranged.

  As shown in FIG. 1, the original 2 is held by the stage of the original stage mechanism 3, and then scanned at a constant speed in the direction of the arrow 3a (Y-axis direction) in a plane perpendicular to the optical axis AX of the projection optical system 1. Driven. At this time, the original 2 is corrected and driven so as to maintain the target coordinate position in the direction orthogonal to the arrow 3a (x-axis direction).

  Position information in the X direction and Y direction of the stage of the original stage mechanism 3 is measured by irradiating the XY bar mirror 20 fixed to the original stage mechanism 3 with a plurality of laser beams from the interference system 21.

  The illumination optical system 8 can be composed of, for example, a light source that generates pulsed light such as an excimer laser, a beam shaping optical system, an optical integrator, a collimator, and a mirror. The illumination optical system 8 can be formed of a material that efficiently transmits or reflects pulsed light in the far ultraviolet region.

  The beam shaping optical system shapes the cross-sectional shape (including dimensions) of the incident beam. The optical integrator illuminates the original 2 with uniform illuminance with uniform light distribution characteristics of the light flux.

  A slit-shaped illumination area is defined by a masking blade (not shown) in the illumination optical system 8, and slit light including pattern information is formed. An exposure station is composed of elements directly related to exposure, such as the illumination optical system 8, the projection optical system 1, and the surface plate 7.

  The substrate chuck 5 has a reference surface 9 in a part thereof. On the surface plate 7 or a surface plate provided separately, another measurement stage mechanism 22 that can be freely moved in the six-axis directions is disposed in the same manner as the exposure stage mechanism 6 on the surface plate.

  The substrate 4 to be processed is first placed on the substrate chuck mechanism 5 mounted on the measurement stage mechanism 22 and held by the substrate chuck 5 by means such as vacuum suction or electrostatic suction. The surface position of each shot area of the substrate 4 is measured by the first surface position detection unit 50 with reference to the reference surface 9 on the substrate chuck 5. The measurement result is stored in the memory 130. A measurement station is configured by elements such as the first surface position detection unit 50 and the measurement stage mechanism 22.

  Here, for example, a metal thin film or a metal plate is attached on the surface of the substrate chuck 5 so that the reference surface 9 on the substrate chuck 5 has substantially the same height as the surface of the substrate 4 in order to improve measurement accuracy. Can be configured.

  When the measurement process on the measurement stage mechanism 22 is completed, the substrate 4 is sent from the measurement stage mechanism 22 onto the exposure stage mechanism 6 while being held by the substrate chuck 5. The exposure apparatus may include two substrate chucks 5 and exchange them between the exposure stage mechanism 6 and the measurement stage mechanism 22. Alternatively, the exposure apparatus may be configured to include at least one (for example, two) substrate stage mechanism 5 and move it between the exposure station and the measurement station.

  On the exposure stage mechanism 6, focusing processing is performed so that the surface of the substrate 4 held by the substrate chuck 5 coincides with the image plane of the projection optical system 1. Roughly speaking, in the focusing process, the surface position of the substrate 4 is adjusted by the exposure stage mechanism 6 while the height of the substrate 4 is measured by the second surface position detection unit 100 using the reference surface 9.

  Specifically, for example, focusing processing can be performed using the focusing mark 23 and the reference surface 9 provided in the pattern area of the original 2 or in the boundary area thereof. The mark 23 includes, for example, a pinhole. Light from the illumination optical system 8 having the same wavelength as the exposure light passes through the pinhole, and forms an image near the reference plane 9 on the substrate chuck 5 by the projection optical system 1. . Then, the light reflected by the reference plane 9 is re-imaged in the vicinity of the mark 23 by the projection optical system 3 again. At this time, the in-focus state is detected while moving the Z stage incorporated in the exposure stage mechanism 6. When the original 2 and the reference surface 9 are completely in focus, the amount of light passing through the pinhole 23 is maximized. The light passing through the pinhole 23 enters the detector 26 through the half mirror 24 and the condenser lens 25. Therefore, the amount of light passing through the pinhole 23 is detected by the detector 26. The detection result is provided to the main control unit 110. The main control unit 110 controls the exposure stage 6 via the driver 120a so as to stop the Z stage at a position where the amount of light detected by the detector 26 is maximized. This completes the focusing process.

  When the focusing process is completed, the following exposure process is performed. That is, the main control unit 110 controls the exposure stage 6 via the driver 120a, moves the substrate chuck 4 in the XY plane, and sequentially moves a plurality of shot areas of the substrate 4 to the exposure position to perform exposure. The At this time, the surface of the shot region is an image of the projection optical system 1 based on the surface position information (position information with reference to the reference surface 9) of the substrate 4 that has already been measured on the measurement stage mechanism 22 and stored in the memory 130. Matched to the face. This is done by the main controller 110 driving the Z stage of the exposure stage 6 via the driver 120a.

  Next, measurement processing in the measurement system will be described with reference to FIGS.

  In the measurement system, the surface position is measured over the entire area of the substrate 4. For example, while the substrate 4 is scanned and driven by the measurement stage mechanism 22 in the order illustrated in FIG. 3, the surface position of the substrate 4 is measured in synchronization therewith.

  Specifically, after accelerating the substrate before the shot area 300 and reaching a specified speed, the measurement points in the shot area 300 are sequentially measured at a constant speed. When the measurement in the shot area 300 is completed, the substrate is moved in the X direction while decelerating quickly and moved to the next row. Then, after accelerating the substrate before the shot 301 and reaching the specified speed, the surface positions of a plurality of shots arranged in the Y direction are sequentially measured as the shot 301, the shot 302, and the shot 303 at a constant speed. . After that, it moves in the X direction while quickly decelerating and moves to the next row. When the acceleration start point is reached, the substrate is accelerated in the opposite direction, and a plurality of shots in the Y direction are sequentially measured at a constant speed. The above procedure is repeated until the final shot area. In this way, it is not necessary to accelerate / decelerate the stage for each shot, so that high throughput can be obtained.

  Next, measurement point arrangement during constant speed scanning will be described with reference to FIG.

  The interval P between the measurement points in the operation drive direction can be determined according to, for example, the detection area (average area) of the first surface position detection unit 50, the measurement scan speed, or the like. Here, the surface position can be detected as an average value of the surface positions in the detection region of the substrate. Therefore, the detection area can be understood as an average area.

  In the shot area, the measurement points are arranged or defined at substantially equal intervals according to the sample pitch P. The first measurement point in the first shot area 401 is arranged with a necessary and sufficient margin M secured from the shot end in consideration of the average effect of the surface position in the detection area by the first surface position detection unit 50. The Also in the subsequent shot area, the first measurement point is arranged at a position where a margin M is secured from the shot end.

Next, an interval D between the last measurement point in the shot area 401 and the first measurement point in the next shot area 402 is determined. Here, the length of one shot area in the scanning direction (scanning length) L, and Ypitch the arrangement pitch of the shot areas in the scanning direction.

If the number of measurement point intervals in the shot area is K [pieces],
K = INT ((LM) / P)
It is. Note that INT () is an arithmetic symbol that rounds off the decimal part.

The interval D is
D = Ypitch-K × P
It is.

Assuming that the scan speed is S, the time interval (hereinafter referred to as the intra-shot measurement time interval) T1 between the timing for measuring one measurement point and the timing for measuring the next measurement point in the shot region is P / S. Further, a time interval (hereinafter referred to as an inter-shot measurement time interval) T2 between a timing for measuring the last measurement point in the shot region and a timing for measuring the measurement point in the next shot region is D / S. Therefore, the difference (hereinafter, timing change amount) ΔT between the measurement time interval T2 between shots and the measurement time interval T1 within shots is
ΔT = T2−T1 = (DP) / S
It becomes. In other words, a time obtained by adding ΔT to the in-shot measurement time interval T1 is waited after the last measurement point in the shot area is measured until the first measurement point in the next shot area is measured.

  For example, the distance Ypitch between adjacent shots is 33 [mm], the scan length L is 33 [mm], the margin M is 0.3 [mm], and the sample pitch P is 0.4 [mm]. In this case, the number of measurement points in the shot is K + 1 = INT ((33−0.3) /0.4) + 1 = 82 [pieces], and 0.3 [mm] at the exposure end position. Margin is secured.

  However, in the method in which the intervals in the scanning drive direction of all the measurement points on the substrate are all the same interval, the position of the measurement point in the next shot area is the position of the last measurement point in the previous shot area. Dependent. Therefore, for the first measurement point of the next shot area, a sufficient margin from the end of the shot area cannot be obtained, which may cause a reduction in measurement accuracy.

  On the other hand, in a preferred embodiment of the present invention, a time T2 obtained by adding ΔT to a measurement time interval T1 in a shot is provided as a measurement time interval between shot regions. This means that a margin M is secured from the shot end to the first measurement point in all shots. Thereby, the arrangement of measurement points is made common in all shot areas, and the surface position can be measured under the same conditions for all shot areas.

  Here, by performing scan driving with acceleration, constant speed and deceleration for each shot, it becomes easy to determine measurement points near the exposure start position and end position for each shot. However, in this case, since acceleration / deceleration is required for each shot, the throughput can be reduced. Therefore, for shot regions belonging to one row, it is preferable to measure the surface position while scanning the substrate at a constant speed.

  As illustrated in FIG. 5, the shot area may include a complete shot area and an incomplete shot area (missing shot area). The incomplete shot area means a shot area that partially protrudes from the effective area in the substrate. In such a shot layout, for example, an arbitrary position (for example, an end) of the complete shot area 502 to be measured first among shot areas arranged along the scanning drive direction can be used as a reference position. Then, the measurement timing of the measurement points of the incomplete shot area 501 and the subsequent complete shot area 503 may be determined based on the positional relationship with respect to the reference position.

  In order to correct the difference in the focus measurement value due to the difference in the surface state at each measurement point, it is preferable to previously determine a correction offset value by measurement. In the exposure process for each shot area, the measurement value for each measurement point may be corrected based on this offset value.

  In order to detect the deviation of the position (Z) and tilt (α, β) in the Z direction of the exposed area of the substrate 4, the relationship between the illumination area shape and the pattern structure (actual step) of the exposed area is considered. Must. Here, the cause of detection error due to the influence of interference between the light reflected by the resist surface of the substrate 4 and the light reflected by the substrate surface of the substrate 4 can be considered. The influence depends on the material of the substrate surface, which is a pattern structure in a broad sense, and becomes an amount that cannot be ignored with a highly reflective wiring material such as Al.

  In addition, when a capacitance sensor is used as a surface position detection sensor, it is known that a GaAs substrate used as a substrate for a high-speed element or a light emitting diode has a large measurement offset unlike a Si substrate.

  In the exposure apparatus illustrated in FIG. 1, an offset value (correction value) for correcting an error of a focus measurement value due to a difference in surface state of a measurement point, that is, an error depending on a pattern structure is obtained. Specifically, the offset value can be calculated using the surface position measurement values measured while scanning the substrate for a plurality of sample shot regions 601 to 608 (FIG. 6). The measurement data at each measurement point stored in the memory 130 is corrected using an offset value (correction value) corresponding to the pattern structure at each measurement point.

  The sample shot arrangement in FIG. 6 is an example, and the number and arrangement of the sample shot areas are not limited to this.

  Hereinafter, a surface position detection method and an exposure method according to a preferred embodiment of the present invention will be described with reference to FIG. The following processing is controlled by the main control unit 110.

  Here, in the exposure apparatus illustrated in FIG. 1, a light emitting diode (LED) is used as the light source 10, and a one-dimensional CCD sensor is used as the optical sensor 19.

  In step 801, when the main control unit 110 receives a start command, a series of processes is started. In step 802, the substrate is placed on the chuck 5 on the measurement stage 22 and held by the chuck 5.

  In step 803, the main control unit 110 performs shots based on the reference scan measurement area size (including L), shot arrangement information (including Ypitch), scan speed S, and CCD accumulation time. The internal measurement time interval T1 and the timing change amount ΔT are obtained and stored in the memory 130.

  In step 804, under the control of the main control unit 110, measurement of the entire surface of the substrate is performed while performing constant velocity scanning for each column in the order illustrated in FIG. Surface position information (position information with reference to the reference surface 9) as a measurement result is stored in the memory 130.

  In step 805, the main control unit 110 calculates an offset value (correction value) for correcting a measurement error factor that depends on the pattern structure (actual step in the exposure target region, material of the substrate). For example, as illustrated in FIG. 6, the main control unit 119 performs calculation using surface position measurement values (surface position data) for a plurality of shaded sample shot (601 to 608) regions. By this calculation, the main control unit 119 calculates an offset value (correction value) for correcting an error depending on the pattern structure. In step 806, the main control unit 110 stores the calculated offset value (correction value) in the memory 130.

  In step 807, the substrate is transferred onto the exposure stage 6 while being held by the substrate chuck 5.

  In step 808, the Z stage of the exposure stage 6 is driven for focusing using the reticle focusing mark 23 and the reference surface 9 on the substrate chuck.

  In step 809, the main control unit 110 corrects the surface position information with reference to the reference surface on the substrate chuck 5 using the correction value, and corrects the surface of the substrate 4 to match the optimum exposure image surface position. The driving amount is calculated. Then, the main control unit 110 performs scan exposure of the shot area while correcting the surface position of the substrate 4 according to the correction drive amount.

  In step 810, it is determined whether or not the exposure of all shots on the substrate has been completed. If not, the process returns to step 809. If exposure of all shots is completed, the process proceeds to step 811. In step 811, the substrate is unloaded from the exposure stage 6, and in step 812, a series of exposure sequences is completed.

  In addition, although said embodiment illustrates the exposure apparatus in which a measurement stage and an exposure stage exist separately, this is only one application example of this invention. The exposure apparatus of the present invention may be configured such that, for example, one or a plurality of stages are used as both a measurement stage and an exposure stage. Alternatively, the exposure apparatus of the present invention may be configured to include one or a plurality of measurement stages and a plurality of exposure stages.

  In the embodiment shown in FIG. 8, step 801 to step 811 may be executed in that order, or in parallel with the scan exposure after step 807, the next substrate is carried into the measurement stage, and the processing from step 801 to step 806 is performed. May be. In this case, since the substrate can be continuously processed without waste, highly efficient exposure processing is possible.

  Next, a device manufacturing process using the above exposure apparatus will be described. FIG. 11 is a diagram showing a flow of an entire manufacturing process of a semiconductor device. In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (reticle fabrication), a reticle (also referred to as an original or a mask) is fabricated based on the designed circuit pattern. On the other hand, in step 3 (wafer manufacture), a wafer (also referred to as a substrate) is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the reticle and wafer. The next step 5 (assembly) is called a post-process, and is a process for forming a semiconductor chip using the wafer produced in step 4, and is an assembly process (dicing, bonding), packaging process (chip encapsulation), etc. Process. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. Through these steps, the semiconductor device is completed and shipped (step 7).

  FIG. 12 shows a detailed flow of the wafer process. In step 11 (oxidation), the wafer surface is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), an electrode is formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist process), a photosensitive agent is applied to the wafer. In step 16 (exposure), the above exposure apparatus is used to expose a wafer coated with a photosensitive agent through a mask on which a circuit pattern is formed, thereby forming a latent image pattern on the resist. In step 17 (development), the latent image pattern transferred to the wafer is developed to form a resist pattern. In step 18 (etching), the layer or substrate under the resist pattern is etched through the portion where the resist pattern is opened. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

DESCRIPTION OF SYMBOLS 1 Projection optical system 2 Original 3 Original plate stage mechanism 4 Substrate 5 Substrate chuck 6 Exposure stage mechanism 7 Surface plate 8 Illumination optical system 9 Reference surface 10 Light source 11 Collimator lens 12 Slit members 13 and 16 Optical systems 14 and 15 Mirror 17 Stopper stop 18 Correction optical system group 19 Photoelectric sensor 20 XY bar mirror 21 Interferometer 22 Measuring stage mechanism 23 Focusing mark 24 Half mirror 25 Condensing lens 26 Detectors 27a and 27b Stage bar mirrors 28a and 28b Interferometer 50 First surface position detection unit 100 Second surface position detection unit 110 Main control unit 120a, 120b Driver 130 Memory

Claims (4)

An exposure apparatus that sequentially exposes a plurality of shot areas of a substrate coated with a photosensitive agent via a projection optical system,
A measuring instrument that measures the surface positions of measurement points defined in a plurality of continuous shot areas in a state where the substrate is driven to scan;
A controller for controlling the surface position of the substrate based on the measurement result by the measuring instrument so that the exposed area of the substrate coincides with the image plane of the projection optical system;
The distance M from the end of the shot area to the measurement point in the shot area is common in the plurality of shot areas, and the interval between the adjacent measurement points in the shot area becomes the common first distance P, and the last in the shot area A plurality of measurement points are defined for each of the plurality of shot areas such that the distance between the measurement point of the first measurement point and the first measurement point in the next shot is the second distance D.
The measuring instrument is a measuring point in at least two shot areas arranged continuously along the scanning drive direction in a state where the substrate is scanned and driven at a constant speed without being accelerated and decelerated for each shot area. Measure the surface position of
When the length of the shot area in the scanning direction is L and the arrangement pitch of the shot areas in the scanning direction is Ypitch,
K = INT ((LM) / P),
D = Ypitch-K × P
An exposure apparatus characterized by satisfying: The exposure apparatus according to claim 1, further comprising a substrate stage that moves between an exposure station that holds the substrate and exposes the substrate and a measurement station that performs measurement by the measuring instrument. . The exposure apparatus according to claim 2, comprising a plurality of the substrate stages, wherein a substrate exposure process at the exposure station and a substrate measurement process at the measurement station are performed in parallel. A device manufacturing method comprising:
An exposure step of exposing a substrate using the exposure apparatus according to any one of claims 1 to 3, a development step of developing the exposed substrate,
A processing step of processing the developed substrate;
A device manufacturing method comprising:

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