JP2018044864A - Detector, detection method, lithography device and method of manufacturing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a detector capable of accurately detecting a mark on a movable object when detecting the mark before settling of the movable object.SOLUTION: This invention relates to a detector 25 which detects a position of a mark on movable objects 3 and 4a. The detector 25 includes: specifying means 24 which specifies timing at which a speed of the objects 3 and 4a is reduced to a prescribed value or lower before the objects 3 and 4a are settled after arriving at a target position; imaging members 13 and 16 which capture images of the mark at the timing specified by the specifying means 24; and detection members 22 and 23 which detect the position of the mark on the basis of imaging results obtained by the imaging members 13 and 16 and position information of the objects 3 and 4a at the timing.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a detection apparatus, a detection method, a lithographic apparatus, and an article manufacturing method.

  The exposure apparatus positions the substrate under exposure based on the positions of the alignment marks formed on the substrate on the stage top plate and the reference marks (hereinafter referred to as marks) provided on the stage top plate, which are detected in advance. Therefore, in order to reduce the overlay error between the already formed pattern and the newly formed pattern, it is important to accurately detect the mark position.

  In order to detect the position of the mark with high accuracy, it is preferable that the stage top plate holding the substrate at the time of detection has less vibration. Therefore, after the stage top plate is set, that is, after the deviation of the position of the stage top plate from the target position converges to a predetermined range (after set), detection of the mark position is started.

  Patent Document 1 describes a method of detecting a mark while the stage top is vibrating when determining the in-focus position of the mark. Specifically, while the stage top plate moves the substrate in the optical axis direction, the light source emits pulsed light toward the mark a plurality of times, and with respect to the target position of the stage top plate for each moment when the pulsed light is emitted. Deviation is measured. It describes that the focus position of a mark is determined based on the imaging results of a plurality of marks obtained by the emission of pulsed light and the deviation of the stage top.

Japanese Patent Laid-Open No. 11-40491

  In Patent Document 1, since a mark is detected every predetermined time within a predetermined time regardless of the speed of the stage top (the change in the position of the stage top per unit time), an image obtained by imaging is obtained. There is a risk of blurring.

  Therefore, an object of the present invention is to provide a detection device that can detect a mark with high accuracy when a mark on the object is detected before settling of the movable object.

  The detection apparatus according to the present invention is a detection apparatus that detects a position of a mark on a movable object, and the speed of the object is a predetermined value after the object reaches a target position and is set. Based on specifying means for specifying the following timing, imaging means for imaging the mark at the timing specified by the specifying means, an imaging result obtained by the imaging means, and position information of the object at the timing Detecting means for detecting the position of the mark.

  According to the present invention, when a mark on an object is detected before settling of the movable object, the mark can be detected with high accuracy.

It is a figure which shows the structure of the exposure apparatus which concerns on 1st Embodiment. It is a figure which shows arrangement | positioning of the mark on a top plate. It is a figure which shows the deviation of the position of a top plate. It is a flowchart which shows the detection method of the position of a mark. It is a figure which shows the imaging timing in 1st Embodiment. It is a figure which shows the detection signal concerning 1st Embodiment. It is a figure which shows the detection signal concerning 2nd Embodiment. It is a figure which shows the detection timing of the mark in 3rd Embodiment.

(First embodiment)
Hereinafter, an embodiment in which the detection apparatus according to the first embodiment is applied to an exposure apparatus will be described. However, the detection apparatus of the present invention can also be applied to other apparatuses described later. In addition, the same reference number is attached | subjected about the same member in each figure.

  FIG. 1 is a view showing a configuration of the exposure apparatus 100. A vertical axis is a Z axis, and two axes orthogonal to each other in a plane perpendicular to the Z axis are an X axis and a Y axis.

  The exposure apparatus 100 is a scanning exposure apparatus, and exposes the substrate 3 while scanning the reticle 1 and the substrate (object) 3 in synchronization with the Y-axis direction using the reticle stage 2 and the substrate stage 4. A latent image pattern of a resist (not shown) is formed on 3.

  The illumination optical system 5 illuminates the reticle 1 with light emitted from a light source (not shown). The light source is, for example, a mercury lamp, a KrF excimer laser light source, an ArF excimer laser light source, or the like. The projection optical system 6 projects an image obtained by reducing the pattern image formed on the reticle 1 to a predetermined magnification on the substrate 3.

  The reticle stage 2 moves the reticle 1 in six axis directions. The reticle 1 is positioned by an actuator such as a linear motor or a pulse motor.

  The substrate stage 4 moves the substrate 3 in six axis directions. The substrate stage 4 includes a stage top plate (movable object) 4a (hereinafter referred to as a top plate 4a) that holds the substrate 3 and moves with the substrate 3, and a drive mechanism (moving means) 4b that moves the top plate 4a. And have. The drive mechanism 4b also positions the substrate 3 and the top plate 4a by an actuator such as a linear motor or a pulse motor.

  At least one of the reticle stage 2 and the substrate stage 4 may include a coarse motion drive system having a long stroke length and a fine motion drive system having a short stroke length. The six-axis directions are the X-axis direction, the Y-axis direction, the Z-axis direction, and the rotation directions (θX, θY, θZ) around these axes.

  The interferometer 9 emits laser light and detects interference light between the reflected light reflected by the mirror 7 provided on the reticle stage 2 and the reference light. Based on the detection result, the position (position information) of the reticle stage 2 is measured.

  The interferometer 10 is a measuring means for measuring the position (position information) of the top 4a during exposure. Laser light is emitted, and interference light between the reflected light reflected by the mirror 8 provided on the substrate stage 4 and the reference light is detected. The interferometer 10 measures the position of the top 4a based on the detection result.

  Based on the measurement results obtained by the interferometer 9 and the interferometer 10, a control unit described later controls the positions of the reticle stage 2 and the substrate stage 4.

  The focus system 15 receives the reflected light of the light incident obliquely with respect to the substrate 3 to measure the position of the substrate in the Z direction.

  The detection device 25 detects the position of the mark on the top plate 4a. The top plate 4a includes the substrate 3 and the reference plate 11 described later. In the present embodiment, the detection device 25 includes an alignment system 13, a processing unit (detection unit) 22 that processes the imaging result of the alignment system 13, an alignment system 16, and a processing unit (detection unit) that processes the imaging result of the alignment system 13. 23).

  The marks imaged by the alignment system 13 and the alignment system 16 will be described. FIG. 2 is a view of the top 4a as viewed from above (+ Z direction). A plurality of shot regions 14 are formed on the substrate 3. The shot region 14 is a unit region of the underlying layer on which the pattern has already been formed, and is formed with an interval between the scribe lines 20. One shot region 14 has a size of about 26 mm × 33 mm, for example, and includes one or a plurality of chip size patterns desired by the user. On the scribe line 20, a plurality of marks 19 are formed between each side of each shot region 14.

  In addition to the substrate 3, a reference plate 11 is provided on the top plate 4a. The height of the upper surface of the reference plate 11 is substantially the same as the height of the surface of the substrate 3. Marks 17 and 18 are formed on the upper surface of the reference plate 11.

  Returning to the description of FIG. The alignment system 13 includes a reference mark (not shown) provided on the reticle 1 via the projection optical system 6 and an illumination system that illuminates the marks 17 and 18, and a reference mark and mark 17 provided on the reticle 1. , 18 and a light receiving system for receiving the reflected light. The light receiving system includes an image sensor such as a CMOS sensor or a CCD, and the light receiving system images the reference marks and marks 17 and 18 provided on the reticle 1 simultaneously. The imaging element inputs the imaging result to the processing unit 22.

  The processing unit 23 calculates the positions of the marks 17 and 18 with respect to the reference mark of the reticle 1 based on the imaging result. The processing unit 22 inputs the calculation result (detection result) to the control unit 24.

  The alignment system 16 illuminates the mark 19 corresponding to the representative shot region 14 out of the mark 17 and the plurality of shot regions 14 outside the axis of the exposure light, and the reflected light from the marks 17 and 19. And a light receiving system for receiving light. The light receiving system includes an image sensor such as a CMOS sensor or a CCD, and images the marks 17 and 19. The imaging element inputs the imaging result (detection signal) to the processing unit 23. The processing unit 23 calculates the positions of the marks 17 and 19 based on the imaging result. The processing unit 22 inputs the calculation result to the control unit 24.

  The control unit 24 obtains the position of the mark 17 with respect to the reference mark of the reticle 1 by the alignment system 13 and the position of the mark 19 with respect to the mark 17 by the alignment 16. Thereby, the position of the mark 19 with respect to the reference mark of the reticle is obtained. Thereby, the relative position between the reticle 1 and each shot area 14 is obtained, and the synchronous control of the reticle stage 2 and the substrate stage 4 during exposure can be performed.

  The control unit 24 includes a CPU and a memory, and is connected to the processing units 22 and 23, the interferometers 9 and 10, the reticle stage 2, the substrate stage 4, and the focus system 15. The memory of the control unit 24 stores a program shown in the flowchart of FIG. The CPU reads the program from the memory and executes the program by controlling the components connected to the control unit 24.

  Further, the control unit 24 captures the marks 17, 18, and 19 with the imaging elements of the alignment systems 13 and 16 based on the measurement result of the position of the top 4a by the interferometer 10 (position information of the top 4a). ) Is specified. The memory of the control unit 24 stores a predetermined value of the speed of the top 4a that serves as a threshold for determining whether or not the alignment systems 13 and 16 are to image the marks 17, 18, and 19. Furthermore, the set total time to be imaged is stored.

  The control unit 24 has a function as specifying means for specifying the imaging timing. From the measurement result of the position of the top 4a by the interferometer 10, the speed of the top 4a (change in the position of the top 4a per unit time with respect to the target deviation) and the predetermined value are compared in real time. As a result of the comparison, the imaging timing is specified as the timing at which the speed of the top 4a falls below a predetermined position set in advance. That is, the start time of the imaging timing is estimated. The control unit 24 sends the position information of the top plate 4 a necessary for calculating the marks 17, 18, 19 to the processing units 22, 23. The position information may be the outputs of the interferometers 9 and 10 or deviation information with respect to the target position.

  FIG. 3 is a diagram illustrating a relationship between an elapsed time (horizontal axis) after the top 4a reaches the target position and a deviation (vertical axis) of the top 4a with respect to the target position. Here, the target position is a target position on the XY plane (a plane along the substrate). The deviation indicates only the position deviation in the Y-axis direction. In the following description, “having reached the target position” means that the top plate 4a has reached the target position for the first time after the top plate 4a is moved toward the target position by the drive mechanism 4b. It does not indicate a completely stationary position. That is, even after reaching the target position, the top 4a vibrates with a deviation from the target position.

  Time Ts indicates an end time from when the top 4a reaches the target position until it settles. That is, the time Ts is the time when the top plate 4a is settled, and the deviation of the position of the top plate 4a from the target position (the position deviation of the top plate 4a) converges and converges within the allowable range (predetermined range) Ea. Indicates the time. The predetermined range Ea is determined by, for example, the vibration state that the top 4a should satisfy when the position of the mark 19 is detected by continuously imaging the mark 19 with the alignment 16.

(Mark position detection method)
Next, the detection method according to the first embodiment will be described with reference to FIGS. 4 and 5 by taking the detection method of the mark 19 by the alignment system 16 as an example. FIG. 4 is a flowchart showing a method for detecting the mark 19, and FIG. 5 is a diagram for explaining imaging timing by the imaging device of the alignment system 16.

  In S101, the control unit 24 always determines whether or not the drive mechanism 4b has reached the target position after the positioning of the top plate 4a to the target position has started. The process of S101 is continued until YES is determined in S101, and if YES is determined, the process proceeds to S102.

  In S102, the control unit 24 specifies the imaging timing based on the measurement result of the position of the top 4a by the interferometer 10. Specifically, the threshold stored in the memory and the speed of the top 4a obtained from the measurement result of the interferometer 10 are compared, and the start time of the imaging timing is estimated. Here, the control unit 24 specifies the imaging timing in a time zone in which the speed of the top 4a is equal to or less than a predetermined value, so that the mark 19 can be imaged in a state relatively close to the top 4a. Thereby, an imaging result with less blur is obtained as compared with the case where the speed of the top 4a is high. That is, an image with a clear boundary between the mark 19 and the portion that is not the mark 19 is obtained.

  In FIG. 5, imaging timings T <b> 1 to T <b> 10 are time zones when the mark 19 is to be imaged. In S <b> 103, based on an instruction from the control unit 24, the alignment system 16 starts imaging from the start time of the imaging timing estimated by the control unit 24. Similarly, when the end time of the imaging timing estimated by the control unit 24 is reached, the alignment system 16 ends the first imaging of the mark 19.

  Here, the alignment system 16 controls the start and end of imaging of the mark 19 by controlling the light emission timing (lighting and extinguishing timing) of the illumination light that illuminates the mark 19 by the light projecting system. Alternatively, the illumination light from the light projecting system may be always emitted, and the start and end of imaging may be controlled by controlling the opening / closing timing of the electronic shutter of the imaging device. In this way, it is possible to capture the mark 19 only while the speed of the top 4a is equal to or lower than the predetermined value, and obtain a plurality of imaging results. The imaging result output from the alignment system 16 is input to the processing unit 23.

  In S105, the control unit 24 determines whether or not the total imaging time has reached a predetermined imaging time stored in the memory, and repeats S102 to S104 until the predetermined imaging time is reached, and images the same mark 19. . At this time, as shown in FIG. 5, when the deviation of the top 4a converges within the threshold value Ea, the mark 19 may be continuously imaged. When the predetermined imaging time is reached, the process proceeds to step S106. Note that when YES is determined in S105, the substrate stage 4 starts to move the top 4a toward another target position.

  In S106, according to the instruction from the control unit 24, the processing unit 23 calculates (detects) the position of the mark 19 based on the position information of the top 4a at each imaging timing and the imaging result in S104. First, the processing unit 23 calculates the position of the mark 19 indicated by each imaging result. FIG. 6 is a diagram illustrating waveforms of detection signals obtained from images acquired at imaging timings T1 to Tn. The center position of each waveform is calculated. Next, the position deviation of the top 4a at each imaging timing is acquired via the control unit 24. The position of the mark obtained from the imaging result is corrected using the obtained deviation as an offset value.

  For example, when the position of the mark 19 obtained from the imaging result at the imaging timing T1 indicates Y1, and the average deviation of the position of the top 4a during the imaging timing T1 is ΔY, Y1 ′ = Y1−ΔY is set. Calculated as the temporary position of the mark 19. Similarly, mark temporary positions Y2 'to Y10' are calculated from the imaging results obtained at imaging timings T2 to T10.

  In S <b> 107, the processing unit 23 calculates the position of the mark 19 in accordance with an instruction from the control unit 24. For example, the average position of Y1 ′ to Y10 ′ is the position of the mark 10. The calculation result is input to the control unit 24, and the control unit 24 stores the detected position of the mark 19 in the memory. This completes the detection. Thereafter, the positions of the other marks 19 are detected in the same manner.

  The waveform indicated by the imaging result obtained at one imaging timing has a smaller S / N ratio of the detection signal obtained from the imaging result than when imaging the mark 19 only once in a continuous time after settling. However, by using a plurality of imaging results obtained at a plurality of imaging timings, it is possible to ensure a desired accuracy regarding the detection of the position of the mark 19. The processing unit 23 calculates the X position of the mark 19 in the same manner as the Y position based on the imaging results obtained at the imaging timings T1 to T10.

  In this way, the position of the mark 19 is detected using the imaging result of the mark 19 and the position information of the top board 4a at the time of imaging before the top plate 4a is set and the speed of the substrate stage 4 is equal to or less than a predetermined value. . Since the image is picked up in a time zone with less image blur, the position of the mark can be detected with high accuracy even when the mark is detected before the top plate 4a is set. Compared to the case where the imaging of the mark 19 is started after waiting for the settling of the top 4a, the end time of the imaging of the mark 19 can be advanced. Since the time required for imaging each mark 19 can be reduced, the total time required for detecting the positions of the plurality of marks 19 can be reduced.

  In S107, it is preferable that the processing unit 23 calculates the position of the mark 19 based on the result of weighting the temporary positions Y1 'to Y10' according to the elapsed time. For example, it is preferable to calculate the position of the mark 19 by weighting the value obtained at the imaging timing T10 that is less affected by the vibration of the top 4a and has higher reliability than the imaging timing T1.

  As the positional deviation of the substrate stage 4 converges, the duration of imaging at the imaging timing for writing is lengthened. In this way, it is possible to make the time during which imaging is continued at the imaging timing per time constant without weighting the imaging time of the mark 19 per time. In parallel with S102 to S105, the processing unit 23 may perform the calculation process of S107 based on the already obtained imaging result.

[Second Embodiment]
In the method for detecting the position of the mark 19 according to the second embodiment, the position of the mark 19 is calculated based on the result of superimposing a plurality of imaging results obtained at a plurality of imaging timings T1 to T10. Since the steps S101 to S105 are the same as those in the first embodiment, the description thereof will be omitted, and only the steps executed instead of S106 and S107 will be described.

  First, the processing unit 23 shifts the waveform of the detection signal obtained from the imaging results of the imaging timings T1 to T10 without obtaining the center position of the waveform. The shift amount at this time is an amount corresponding to the average position deviation of the top plate 4a at each of the imaging timings T1 to T10. FIG. 7A shows the results of shifting the respective waveforms side by side.

  Next, the processing unit 23 superimposes the shifted waveform. That is, the detection signals are added together to obtain the final waveform shown in FIG. By adding the detection signals, the position of the mark 19 can be calculated based on a detection signal having a large S / N ratio compared to the detection signal obtained at one imaging timing. Finally, the processing unit 23 outputs the position indicated by the center position of the waveform on the image sensor from the final waveform as the position Y ′ of the mark 19. The position Y ′ is input to the control unit 24, and the control unit 24 stores the detected position of the mark 19 in the memory.

  In this way, the position of the mark 19 is detected using the imaging result of the mark 19 and the position information of the top board 4a at the time of imaging before the top plate 4a is set and the speed of the substrate stage 4 is equal to or less than a predetermined value. . Since the image is picked up in a time zone with less image blur, the position of the mark can be detected with high accuracy even when the mark is detected before the top plate 4a is set. Compared to the case where the imaging of the mark 19 is started after waiting for the settling of the top 4a, the end time of the imaging of the mark 19 can be advanced. Since the time required for imaging each mark 19 can be reduced, the total time required for detecting the positions of the plurality of marks 19 can be reduced.

  Even when the performance of the image sensor used to image the mark 19 is inferior to that of the first embodiment, the image of the mark 19 is detected only once for a continuous time after the top 4a is set, and the position of the mark 19 is detected. The position of the mark 19 can be detected with at least the same accuracy.

[Third Embodiment]
In the third embodiment, the Z position of the substrate 3 is also detected by detecting the Z positions (positions in the Z-axis direction) of the marks 17 and 18 from the imaging results of the alignment system 13. The imaging timing varies depending on the direction of the detection target of the positions of the marks 17 and 18. That is, this is an embodiment showing a case where the imaging timing is different between when the position in the XY axis direction is detected and when the position in the Z axis direction is detected. Furthermore, the case where the threshold value which shows the settling of the top plate 4a is varied will be described. Since the configuration of the exposure apparatus 100 including the detection apparatus 25 is the same as that of the first embodiment, a detailed description thereof will be omitted.

  In FIG. 8, the time at which the top 4a converges when it reaches the target position is the settling time Ts. In the waveform 30, the timing at which the speed of the top 4a becomes a predetermined value or less is indicated by a thick line. On the other hand, a broken line waveform 32 indicates a deviation in position in the Z-axis direction. The time at which the positional deviation for the waveform 32 converges to the threshold value Ec is the settling time Tc. In the waveform 32, the timing at which the speed in the Z-axis direction per unit time falls below a predetermined value is indicated by a thick line. Since the allowable deviation varies depending on the direction, the threshold is set to Ec> Ea.

  As shown in the waveform 30 and the waveform 32, the time at which the amplitude fluctuation of the waveform is large may be different depending on the direction. In such a case, the imaging timing is varied according to the direction of the position of the detection target. For example, in the case of FIG. 8, the waveform 30 is delayed by about ¼ period compared to the waveform 32.

  The control unit 24 specifies an imaging timing at which the speed of the top plate 4a in the Z-axis direction is equal to or lower than a predetermined position and an imaging timing at which the speed of the top plate 4a in the X-axis direction is equal to or lower than a predetermined value. Then, the processing unit 22 calculates the position in the Z-axis direction using a plurality of imaging results obtained at an imaging timing at which the speed of the top plate 4a in the Z-axis direction is equal to or lower than a predetermined position. On the other hand, the position in the X-axis direction is calculated using a plurality of imaging results obtained at an imaging timing at which the speed of the top plate 4a in the X-axis direction is a predetermined value or less. The method for calculating the position of the mark 19 from the imaging result is the same as the steps S107 and S108 in the first embodiment.

  Also in this embodiment, the same effect as the first embodiment can be obtained. Furthermore, based on the imaging results acquired at different imaging timings, the positions in the biaxial direction can be detected respectively.

(Other embodiments)
The detection device 25 may be applied to other devices that perform alignment by looking at the mark on the object. For example, you may mount in the apparatus for a semiconductor circuit inspection, a wafer inspection apparatus, a defect inspection apparatus, etc.

  In the first to third embodiments, the case where the control unit 24 specifies a plurality of imaging timings has been described. However, the number of imaging timings specified by the control unit 24 and the number of times the alignment system 16 performs imaging may be only one. Good. Further, not only the alignment system 16 of the first and second embodiments, but also the above-described mark detection method may be implemented by the alignment system 13. The above-described mark position detection method may be executed on at least one of the alignment systems 13 and 16.

  Although the embodiment has been described in which the mark 19 is imaged only with the imaging timing by the illumination light lighting control and the electronic shutter, other methods may be adopted. For example, the image sensor always captures the mark 19, and when the processing unit 23 calculates the position of the mark 19, only the imaging result at the imaging timing specified by the control unit 24 may be extracted and calculated. Good.

  The alignment system 13 is a detection system that detects light reflected by the marks 17 and 18, but may be a detection system that detects light diffracted through the marks 17 and 18. In this case, the light projecting system of the alignment system 13 may be disposed above the reticle 1, and the image sensor as the light receiving system may be disposed inside the top plate 4.

  As long as each function of the processing units 22 and 23 is provided, the processing units 22 and 23 may be configured by one processing unit. Alternatively, the control unit 24 may have the functions of the processing units 22 and 23.

  The detection apparatus 25 is not limited to the exposure apparatus 100 that is a scanning exposure apparatus, and can be applied to other lithography apparatuses (patterning apparatuses) that form a pattern on a substrate. The lithographic apparatus may be, for example, a stepper that forms a latent image pattern of a resist on a substrate by exposing the substrate 3 to the fixed reticle 1 while driving the substrate 3 in a step-and-repeat manner. Alternatively, an imprint apparatus that forms a concavo-convex pattern on a substrate using a mold, a drawing apparatus that forms a latent image pattern on a substrate by irradiation with a charged particle beam, or the like may be used.

  Further, the exposure light of the exposure apparatus 100 can be selected from various rays such as g-line (wavelength 436 nm), i-line (wavelength 365 nm), ArF laser light (wavelength 193 nm), EUV light (wavelength 13 nm), and the like.

  The detection device 25 may be mounted on another device that needs to detect the position of the mark.

[Embodiment related to article manufacturing method]
A pattern of a cured product formed using a lithographic apparatus is used permanently on at least a part of various articles, or temporarily when various articles are manufactured.

  The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold.

  Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA.

  Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed. The processing steps may further include other known processing steps (development, oxidation, film formation, vapor deposition, planarization, resist stripping, dicing, bonding, packaging, etc.).

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

3 Substrate 4a Top plate (object)
13, 16 Alignment system 17, 18, 19 Mark 22, 23 Processing unit 24 Control unit 25 Detector T1-T10 Imaging timing

Claims (13)

A detection device for detecting a position of a mark on a movable object,
A specifying means for specifying a timing at which the speed of the object is equal to or lower than a predetermined value during a period from when the object reaches a target position until settling;
Imaging means for imaging the mark at a timing specified by the specifying means;
A detection apparatus comprising: a detection unit configured to detect a position of the mark based on an imaging result obtained by the imaging unit and position information of the object at the timing.   The detection device according to claim 1, wherein the specifying unit specifies the timing based on position information of the object. The specifying means specifies a plurality of the timings;
The detection device according to claim 1, wherein the detection unit detects a position of the mark based on an imaging result from the imaging unit at each of a plurality of timings.   The detecting means detects a plurality of temporary positions of the mark corresponding to each of a plurality of imaging results obtained at the plurality of timings, and detects the position of the mark based on the plurality of temporary positions. The detection device according to claim 3.   The detection device according to claim 3, wherein the detection unit detects the position of the mark based on a result of superimposing a plurality of imaging results obtained at the plurality of timings.   6. The detection unit according to claim 4, wherein the detection unit weights a plurality of imaging results obtained at each of the plurality of timings to detect the position of the mark. Detection device.   7. The imaging device according to claim 3, wherein the imaging unit weights a time during which the imaging of the mark is continued at each of the plurality of timings according to an elapsed time from the time when the target position is reached. The detection device according to claim 1.   The detection apparatus according to claim 1, wherein the timing differs according to a direction of a detection target of the mark position.   The imaging means controls the opening / closing timing of an electronic shutter of the imaging means or the light emission timing of light from a light source that illuminates the mark, and images the mark at the timing. Item 9. The detection device according to any one of Items 1 to 8.   The period from when the object reaches the target position to the settling time is from the time when the object reaches the target position until the deviation of the position of the object from the target position converges within a predetermined range. The detection device according to claim 1, wherein A patterning device for forming a pattern on a substrate,
The detection device according to any one of claims 1 to 10,
Moving means for moving an object provided with a mark to be detected by the detection device;
Measuring means for measuring the position of the object;
A patterning apparatus comprising: A detection method for detecting the position of a mark provided on a movable object,
Identifying the timing at which the speed of the object is equal to or less than a predetermined value during the period from when the object reaches a target position until settling;
Imaging the mark at the timing specified in the step;
And a step of detecting the position of the mark based on the imaging result captured in the step and the position information of the object at the timing. A method for manufacturing an article, comprising:
Forming a pattern on the substrate using the patterning device according to claim 11;
And a step of processing the substrate on which the pattern is formed in the step.

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