JP2004186283A - Positioning device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a positioning device which can realize the accurate positioning of a substance on the basis of low cost and space saving. <P>SOLUTION: In step 403, alignment is conducted to realize measurement of coordinates of wafer with excellent accuracy. In step 404, measurement of time is started from execution of alignment with a timer. Next, when observation has been completed at all observation points in step 405, the wafer is unloaded to complete the observation with the wafer transfer system in step 410. If the observation points still exist, the process goes to step 406. In step 408, the passage of time from the end of alignment is calculated by reading the timer in the step 408. If the predetermined time registered in a control device has passed (time until re-alignment), the process returns to the step 403 to execute the alignment again. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a positioning device that positions a sample at a predetermined position.
[0002]
[Prior art]
For example, in a visual inspection apparatus, an observation point on a sample (wafer) whose coordinates are designated is observed by an observation system such as a microscope. At this time, after the wafer is transferred onto a stage that can be driven in the X and Y directions, rough positioning (pre-alignment) is performed using the outer edge of the wafer. However, in recent years, wafers have become larger in diameter, and the degree of integration has been increasing year by year. In order to observe such a fine pattern on the wafer, when performing high-magnification observation, it is necessary to accurately move the observation point of the wafer to the observation position of the observation system.
[0003]
Therefore, the relationship between the coordinate system of the wafer and the coordinate system of the stage is obtained by measuring the position of an alignment mark whose coordinates on the wafer are known, and the deviation is corrected (alignment). After the above alignment is performed on the wafer to be observed, the observation point on the wafer is moved to the observation position of the observation system by the XY stage using the result of the alignment. Then, the operator observes the wafer observation point.
[0004]
[Problems to be solved by the invention]
However, in the prior art described above, after the alignment is performed, when the operator has left the apparatus and the time has elapsed since the alignment was performed, the sample or the apparatus expands and contracts due to factors such as heat. In addition, there is a problem that the accuracy of moving a predetermined position (for example, an observation point) on a sample to a predetermined position (for example, an observation position of an observation system) on the apparatus is reduced. In this case, for example, when observing with an observation system such as a microscope, there is a problem that the observation point of the sample does not enter the field of view of the observation system.
[0005]
In order to solve the above problems, it has been practiced to move the heat source away from the device or to surround the device in a constant temperature room. However, these methods have a problem that the cost is high and the apparatus itself is large. The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a positioning device capable of realizing accurate positioning of an object at low cost and in a small space.
[0006]
[Means for Solving the Problems]
A first means for solving the above problems is a mounting means for mounting a sample, an alignment means for recognizing a sample coordinate system of the sample mounted on the mounting means, and Moving means for relatively moving a predetermined position based on the sample coordinate system to the predetermined position in the apparatus; calculating means for calculating a moving amount by the moving means based on the sample coordinate system recognized by the alignment means; and Elapsed time measuring means for measuring the elapsed time after performing the operation of recognizing the system, and control means for causing the alignment means to again perform the operation of recognizing the sample coordinate system based on the output of the elapsed time measuring means. A positioning device (Claim 1) characterized by having:
[0007]
In this means, the control means for causing the alignment means to again perform the operation of recognizing the sample coordinate system based on the output of the elapsed time measuring means for measuring the elapsed time after the alignment means performs the operation of recognizing the sample coordinate system. Even if the position of the aligned object shifts due to a change in temperature or the like with the lapse of time, the recognition of the sample coordinate system again allows accurate And so on.
[0008]
A second means for solving the problem is the first means, wherein the control means causes the alignment means to perform the operation again when the elapsed time reaches a predetermined time. It is a feature (claim 2).
[0009]
In this means, when the elapsed time reaches a predetermined time, the control means causes the alignment means to perform an operation of recognizing the sample coordinate system again. Even if the position of the aligned object is shifted due to the above-mentioned factors, the position can be accurately corrected again if necessary based on the recognition of the sample coordinate system again. Note that the “predetermined time” may be constant, or may be changed according to other conditions as in the third means and the fourth means described later.
[0010]
A third means for solving the above-mentioned problem is the second means, wherein the elapsed time measuring means further measures an elapsed time since the power of the apparatus is turned on, and the control means comprises: The predetermined time is changed based on a measurement result of an elapsed time after the power is turned on (claim 3).
[0011]
The temperature of the device rapidly changes until a certain time elapses after the power of the device is turned on, but the temperature change stabilizes with time. Therefore, in the present means, for example, the "predetermined time" is shortened immediately after the power is turned on, and the "predetermined time" is lengthened as time elapses after the power is turned on, so that the temperature change When the temperature is rapid, the operation of recognizing the sample coordinate system is performed by the alignment means every short time, and when the temperature change is moderate, the time until the operation of recognizing the sample coordinate system is performed by the alignment means is increased. Useless recognition can be prevented.
[0012]
A fourth means for solving the above-mentioned problem is the second means, wherein the elapsed time measuring means further measures an elapsed time since the power of the illumination light source is turned on, and the control means The predetermined time is changed based on a measurement result of an elapsed time from when the power of the illumination light source is turned on (claim 4).
[0013]
The basic idea of this means is the same as that of the third means, except that the "predetermined time" is changed in accordance with the elapsed time since the power of the illumination light source is turned on. And means different. Particularly, in the observation means, it is mainly the illumination light source that gives a temperature change that leads to a shift of the observation point. Therefore, according to this means, almost the same operation and effect as those of the third means can be obtained.
[0014]
A fifth means for solving the above-mentioned problem is a mounting means for mounting a sample, an alignment means for recognizing a sample coordinate system of the sample mounted on the mounting means, and A moving means for relatively moving a predetermined position based on the sample coordinate system recognized by the alignment means, a calculating means for calculating a moving amount by the moving means, and a temperature of a predetermined portion of the apparatus. Temperature measurement means for measuring, when the difference between the temperature measured by the temperature measurement means and the temperature measured during the operation of recognizing the sample coordinate system by the alignment means is equal to or more than a predetermined value, the alignment again And a control means for performing the operation by means.
[0015]
As described above, it is mainly the temperature change that disturbs the position of the aligned object. Therefore, in the present means, when the difference between the temperature measured by the temperature measuring means and the temperature measured at the time of the operation of recognizing the sample coordinate system by the alignment means becomes equal to or more than a predetermined value, the sample coordinate is again sent to the alignment means. It has control means for performing an operation of recognizing the system. Therefore, even when the position of the aligned object is shifted due to a change in temperature or the like, the position can be accurately corrected again as needed by re-recognizing the sample coordinate system.
[0016]
Sixth means for solving the above-mentioned problem is a mounting means for mounting a sample, an alignment means for recognizing a sample coordinate system of the sample mounted on the mounting means, and Moving means for relatively moving a predetermined position based on the position of the apparatus to a predetermined position in the apparatus; calculating means for calculating an amount of movement by the moving means based on the sample coordinate system recognized by the alignment means; and time measuring means for measuring time And a control means for causing the alignment means to recognize the sample coordinate system again at predetermined time intervals based on the measurement result of the time measuring means. It is.
[0017]
Since this means has a control means for recognizing the sample coordinate system by the alignment means at predetermined time intervals, the position of the aligned object may be shifted due to a change in temperature or the like. In addition, by re-recognizing the sample coordinate system, the position can be accurately corrected as necessary.
[0018]
A seventh means for solving the above-mentioned problem is any one of the first means to the sixth means, further comprising a confirmation means, wherein the control means re-executes the sample coordinate system by the alignment means. Before performing an operation for recognizing the information, the fact that the operation is to be performed is output to the confirmation unit, and the operation is performed when an input is received from the confirmation unit. ).
[0019]
In the first means to the sixth means, the alignment means automatically recognizes the sample coordinate system when the condition is satisfied. In this means, the fact that such an operation is to be performed is output to the confirmation means, and such an operation is performed after input from the confirmation means, so that the operator does not know However, it is possible to prevent the operation of recognizing the sample coordinate system from suddenly starting.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an example of an embodiment of the present invention will be described using a wafer appearance inspection apparatus as an example. FIG. 1 is an overall configuration diagram of a visual inspection apparatus as an example of an embodiment of the present invention. In FIG. 1, a wafer 107 observed by an eyepiece 101 is transported and placed on a wafer holder 108 on an XYθ stage 109 by a wafer transport unit (not shown). The mounting position of the wafer 107 on the wafer holder 108 differs depending on the transfer position accuracy of the wafer transfer unit and the transfer position accuracy of the wafer holder 108.
[0021]
Pre-alignment is performed to roughly correct this deviation. In the pre-alignment, the wafer 107 on the wafer holder 108 is rotationally driven by a control signal output from the position control device 106, and the sensor 200 detects the outer edge of the rotationally driven wafer 107. The control device 113 receives the output signal of the sensor 200, roughly detects the position where the wafer 107 is placed on the wafer holder 108, and adjusts the position so that the position becomes substantially a predetermined position with respect to the objective lens 105. The XYθ stage 109 is operated via the position control device 106 to perform correction, and the notch position of the wafer 107 is arranged in a predetermined direction.
[0022]
The XYθ stage 109 is driven in the vertical direction in the drawing (Y direction) and in the horizontal direction in the drawing (X direction) by the position control device 106 according to a control signal output from the control device 113, and moves the wafer 107 directly below the objective lens 105. To allow the eyepiece 101 to observe the designated observation position of the wafer 107. The observation designated position may be a predetermined position or a desired position input by the operator.
The display confirmation device 115 can display information necessary for the operator to perform an operation, and has a switch for receiving an operation from the operator.
[0023]
An image of the wafer 107 obtained by the objective lens 105 is formed on the imaging surface of the camera 103 via the half mirror 104. The output signal of the camera 103 is input to the image processing device 102, subjected to predetermined image processing, and the output signal is input to the control device 113.
[0024]
When the observation of a certain observation point is completed, the operator operates a switch of the display confirmation device 115. Then, when there is another observation designated position, the control device moves the new observation designated position immediately below the objective lens 105 so that observation is possible. By repeating this, the observer can observe the observation point. The wafer 107 for which observation has been completed is carried out of the wafer holder 108 by wafer transfer means (not shown).
Output signals of the thermometer 110, the timer A111, and the timer B112 are input to the control device 113.
[0025]
As described above, the placement position of the wafer 107 on the wafer holder 108 can only be roughly determined by pre-alignment. For this reason, an alignment process is performed to improve the movement accuracy to the observation point on the wafer 107.
[0026]
FIG. 2 is an explanatory diagram of the alignment, and FIG. 3 is a flowchart of the alignment process. FIG. 2 shows a state where two alignment marks 203 and 205 marked on the wafer 107 are observed at positions 206 and 207, respectively, shifted from ideal positions in the directions of vectors 209 and 210. . Here, the design coordinates (positions in the wafer coordinate system) of the alignment marks 203 and 205 are known in advance. The broken line in FIG. 2 indicates an ideal position in calculation, and the solid line indicates a position actually observed.
[0027]
Hereinafter, the alignment will be described with reference to the flowchart of FIG. In step 301, the control device 113 sets the camera based on the amount of shift between the center of the wafer 107 and the rotation center of the wafer holder 108 and the coordinate value of the alignment mark in the design calculation, calculated by the above-described pre-alignment process. The XYθ stage 109 is moved to the coordinates (position in the coordinate system of the stage) at which the alignment mark 203 is assumed to be imaged at the imaging center of 103.
[0028]
In step 302, the alignment mark 206 at this time is imaged using the camera 103. In step 303, the image processing apparatus 102 shifts the image of the alignment mark 206 from the imaging center of the camera 103 (step 303). The vector 209) in FIG. 2 is calculated, and the shift amount in the X and Y directions is stored.
[0029]
In step 304, the control device 113 determines whether there is another alignment mark whose coordinate position on the wafer 107 is known, and if so, returns to step 301, and returns to step 301 for the remaining alignment mark 205. The same processing as described above is performed, and if there is no such processing, the process proceeds to step 305.
[0030]
In this way, the vectors of the shift amounts 209 and 210 are calculated for each of the alignment marks 203 and 205, and the shift amounts of the respective vectors in the X and Y directions are stored in the control device 113.
[0031]
In step 305, the shift amount of the observation point 204 on the wafer 107 is calculated from the shift amount of each alignment mark in the X and Y directions obtained as described above. For example, when the (X, Y) values of the vectors 209 and 210 in FIG. 2 are (1, 1) and (2, 2), respectively, the distances from the alignment marks 203 and 205 are equal. The shift amount of a certain observation point 204 is (1.5, 1.5).
[0032]
Therefore, the control device 113 drives the XYθ stage 109 via the position control device 106 using the above-mentioned shift amount as a correction parameter to observe the observation point 204, for example, so that the observation point 204 is Control is performed so as to be the center of the observed image.
[0033]
If the number of alignment marks is three or more, it is possible to improve the accuracy of the correction parameters, but it takes time to acquire the correction parameters. Therefore, although two or more alignment marks are required, the number of alignment marks is determined by a trade-off between the accuracy of the correction parameter and the acquisition time thereof. In the above example, the alignment processing is performed by a combination of the camera and the image processing apparatus. However, the alignment processing may be performed by a known method using the diffracted light of the wafer.
[0034]
When the objective lens 105 includes a plurality of magnification lenses by the above-described alignment, it is possible to correct a shift of an observed image due to the influence of the eccentricity.
[0035]
In the above description, the configuration in which each alignment mark is imaged by the camera 103 and the correction parameter is obtained has been described. However, by setting the camera 103 to have a high resolution, each alignment mark can be imaged simultaneously, and correction can be performed from them. The parameters may be obtained collectively.
[0036]
Hereinafter, an operation sequence of the wafer positioning apparatus according to the first embodiment of the present invention will be described with reference to the flowchart of FIG. The wafer 107 to be observed is placed on the wafer holder 108 in steps 401 and 402 while being roughly positioned by a wafer transfer system (not shown) and a pre-alignment mechanism. However, since the wafer 107 is only roughly positioned, as shown in FIG. 2, the wafer 107 is placed on the wafer holder 108 with the actual wafer position 202 shifted from the calculated wafer coordinates 201.
Next, in step 403, the above-described alignment is performed, and the coordinate measurement of the wafer is performed with high accuracy.
[0037]
Next, in step 404, the timer A111 starts time measurement from the execution of the alignment. Next, when observation has been completed at all observation points in step 405, the wafer is unloaded by a wafer transfer system (not shown) in step 410, and the observation is terminated. If the observation point remains, the process proceeds to step 406.
[0038]
In step 406, an actual observation position 208 is calculated based on the deviation amount 209 of the alignment mark 203, the deviation amount 210 of the alignment mark 205, and the designed observation position (observation point) 204 stored in the control device 113. Next, in step 407, the control device 113 and the position control device 106 drive and position the XYθ stage 109 so that the actual observation position 208 calculated in step 406 moves below the objective lens 105.
[0039]
Next, in step 408, the control device 113 reads the time measured by the timer A111 to calculate the elapsed time from the end of the alignment, and the predetermined time registered in the control device 113 (time until realignment). Has elapsed, the process returns to step 403, and alignment is performed again. This is performed in order to prevent a decrease in accuracy of moving the observation point under the object when the shift amount 209 of the alignment mark 203 and the shift amount 210 of the alignment mark 205 obtained in the alignment in step 403 have changed. If the elapsed time from the end of the alignment is less than the predetermined time, step 409 is executed. Next, in step 409, it is confirmed whether or not there is an end instruction by the operator, and when the operator has instructed the end of observation with the confirmation switch of the display confirmation device 115, the process proceeds to step 405 to move to the next observation point. If there is no observation end instruction from the operator, the process proceeds to step 408 to check the elapsed time after the alignment is completed.
[0040]
In the first embodiment, the next alignment is performed according to the elapsed time from the end of the previous alignment. Therefore, even in the case where the shift amount of the wafer changes with time, it is possible. The observation position can be accurately reproduced. In addition, a timer B112 for measuring the time from power-on of the apparatus is added, and the time until realignment is set by the elapsed time from power-on (for example, when the temperature change after power-on is large, the frequency is high, By reducing the frequency when stable), the time until realignment can be optimized.
[0041]
This corresponds to changing the “predetermined time” itself, which is the reference for the determination in step 408 in the flowchart shown in FIG. 4, according to the time from the power-on measured by the timer B112. In addition, the timer B112 measures the elapsed time from when the power of the illumination light source is turned on instead of the elapsed time from when the power of the device is turned on. The time until realignment may be adjusted accordingly. This method is also effective for a while after the power of the illumination light source is turned on, since the temperature change is particularly large.
[0042]
In addition, when a predetermined time has elapsed since the power was turned on or the power of the illumination light source was turned on, the “predetermined time” is set to infinity, so that realignment can be prevented.
[0043]
In the first embodiment, the realignment is performed according to the elapsed time from the previous alignment. However, the realignment can be performed according to a change in the temperature of the apparatus.
[0044]
FIG. 5 shows a flowchart of the operation of the wafer positioning apparatus according to the second embodiment of the present invention. The flowchart in FIG. 5 can be realized by changing step 404 in the flowchart in FIG. 4 to the temperature measurement after the execution of the alignment in step 504, and changing step 408 to confirm the temperature change from the time of the alignment in step 508.
[0045]
This temperature measurement is performed by the thermometer 110 shown in FIG. The operation of the wafer positioning apparatus according to the second embodiment of the present invention will be described below with reference to the flowchart of FIG. The wafer 107 to be observed is placed on the wafer holder 108 in steps 501 and 502 while being roughly positioned by a wafer transfer system (not shown) and a pre-alignment mechanism. However, since the wafer 107 is only roughly positioned, the actual wafer position 202 (FIG. 2) is placed on the wafer holder 108 with a deviation from the calculated wafer coordinate 201. Next, in step 503, the above-described alignment is performed, and the coordinate measurement of the wafer is performed with high accuracy. Next, in step 504, the temperature at the time of performing the alignment is measured by the thermometer 110. The measured temperature is stored in the control device 113. Next, when observation has been completed at all observation points in step 505, the wafer is unloaded by a wafer transfer system (not shown) in step 510, and the observation ends. If there is still an observation point, the process proceeds to step 506. In step 506, the actual observation position 208 is calculated based on the deviation amount 209 of the alignment mark 203, the deviation amount 210 of the alignment mark 205, and the designed observation position 204 stored in the control device 113.
[0046]
Next, in step 507, the control device 113 and the position control device 106 drive and position the XYθ stage 109 so that the actual observation position 208 calculated in step 506 moves below the objective lens 105. Next, in step 508, the temperature is measured by the thermometer 110, and the temperature measured at this time and the temperature measured by the thermometer 110 in step 504 when the alignment was performed last time are compared by the controller 113. The comparison is made to determine the presence or absence of a temperature change.
[0047]
The temperature measured in step 508 is stored in control device 113. At this time, if there is a temperature change, or if the temperature change is equal to or more than the predetermined value, the process returns to step 503, and the alignment is executed again. This is performed in order to prevent a decrease in accuracy of moving the observation point under the object when the shift amount 209 of the alignment mark 203 and the shift amount 210 of the alignment mark 205 obtained in the alignment in step 503 have changed. If there is no temperature change in step 508, or if the temperature change is less than the predetermined value, step 509 is executed. Next, in step 509, it is checked whether or not there is an end instruction by the operator. If the operator has instructed the end of observation with the confirmation switch of the display confirmation device 115, the process moves to step 505 to move to the next observation point. If there is no observation end instruction from the operator, the process proceeds to step 508 for detecting a temperature change.
[0048]
In the above-described second embodiment, the next alignment is performed by a temperature change from the temperature measured at the time of the previous alignment. Therefore, when the temperature in the apparatus changes, the shift amount changes. Even in the case, the observation position can be accurately reproduced.
[0049]
FIG. 6 shows a flowchart of the operation of the wafer positioning device according to the third embodiment of the present invention. The operation of the apparatus in this embodiment is such that re-alignment is repeated at regular intervals after the power of the apparatus is turned on. The operation is the same as that of the flowchart shown in FIG. 4 except for the method of setting the timer and determining the elapsed time.
[0050]
The sequence of the flowchart shown in FIG. 6 is activated when the power of the device is turned on, and ends when the power of the device is turned off. When the power of the apparatus is turned on, measurement of the timer A111 is started in step 600, and a sequence for loading a wafer is started (step 601 and subsequent steps).
[0051]
The wafer 107 to be observed is placed on the wafer holder 108 in steps 601 and 602 while being roughly positioned by a wafer transfer system (not shown) and a pre-alignment mechanism. However, since the wafer 107 is only roughly positioned, as shown in FIG. 2, the wafer 107 is placed on the wafer holder 108 with the actual wafer position 202 shifted from the calculated wafer coordinates 201.
Next, in step 603, the above-described alignment is performed, and the coordinate measurement of the wafer is performed with high accuracy.
[0052]
Next, when observation has been completed at all observation points in step 605, wafer unloading is performed by a wafer transfer system (not shown) in step 610, and if power has been turned off in step 611, the process ends. If the power has not been turned off, the process returns to step 601 to process the next wafer. If the observation point remains in step 605, the process proceeds to step 606.
[0053]
In step 606, the actual observation position 208 is calculated based on the deviation amount 209 of the alignment mark 203, the deviation amount 210 of the alignment mark 205, and the designed observation position 204 stored in the control device 113. Next, in step 607, the control unit 113 and the position control unit 106 drive and position the XYθ stage 109 so that the actual observation position 208 calculated in step 606 moves below the objective lens 105.
[0054]
Next, in the first step 608, the control device 113 reads the time measured by the timer A111 to obtain the elapsed time since the power was turned on, and obtains the predetermined time registered in the control device 113 (the time until realignment). If the time has elapsed, the process returns to step 603, and the alignment is executed again. This is performed in order to prevent a decrease in the accuracy of moving the observation point under the object when the shift amount 209 of the alignment mark 203 and the shift amount 210 of the alignment mark 205 obtained in the alignment in step 603 have changed.
[0055]
This determination is different from that shown in FIG. 4, and when a predetermined time has elapsed since the power was turned on, and when a predetermined time has elapsed after that, it is determined to be YES when the predetermined time has repeatedly passed. You. Therefore, in the sequence shown in FIG. 6, the realignment is repeated every predetermined time after the power is turned on. In order to perform this operation, the timer A111 may be reset and restarted each time it is determined that realignment is to be performed, or realignment is performed every time a multiple of a predetermined time elapses. You may do so. In the sequence of FIG. 6, realignment is performed at regular intervals. However, realignment may be performed at short intervals immediately after power-on, or at long intervals as time elapses after power-on. .
[0056]
If the elapsed time is less than the predetermined time, step 609 is executed. In step 609, it is confirmed whether or not there is an end instruction by the operator. If the operator has instructed the end of observation with the confirmation switch of the display confirmation device 115, the process moves to step 605 to move to the next observation point. If there is no observation end instruction from the operator, the process proceeds to step 608 in order to confirm the elapsed time from the completion of the alignment.
[0057]
In the above-described third embodiment, realignment is performed every predetermined time after the power is turned on. Therefore, even when the amount of deviation of the wafer changes over time, accurate alignment can be performed. Can reproduce the observation position.
[0058]
In FIG. 4, the sequence from loading one wafer to unloading is described. However, in FIG. 6, a plurality of wafers are loaded from power-on to power-off. Is described.
[0059]
If the sequence in FIG. 6 is started after the power of the illumination light source is turned on and is terminated when the power of the illumination light source is turned off, realignment is performed at predetermined time intervals after the illumination light source is turned on. Can be run.
[0060]
In the first, second, and third embodiments, the configuration in which the second and subsequent alignments (realignment) are performed based on the outputs of the timer A111, the timer B112, and the thermometer 110 has been described. In a simple sequence, when the necessity of realignment is detected, realignment is not immediately performed, a display to that effect is displayed on the display confirmation device 115, and realignment is performed after an operator's confirmation operation. It may be.
[0061]
For example, in the case of the operation flow of FIG. 4, the control unit 113 outputs a confirmation signal to the display confirmation unit 115 after it is determined in step 408 that the predetermined time has elapsed and before realignment is performed in step 403. Display confirmation device 115 displays a message for confirming whether or not realignment may be performed based on the confirmation signal. This message may be output as a voice without being displayed. The operator looks at the message displayed on the display confirmation device 115 and operates the alignment switch of the display confirmation device 115 to permit the realignment operation. The output of the operation of the alignment switch is input to the controller 113, and based on the output, realignment is performed in step 403.
[0062]
In the operation flow of FIG. 5, the same operation as described above may be performed when proceeding from step 508 to step 503, and in the operation flow of FIG. 6, when proceeding from step 608 to step 603.
With the above configuration, the second and subsequent alignments are prevented from being performed unexpectedly while the operator is observing the sample.
[0063]
In the embodiments of the invention described above, the present invention is applied to a wafer appearance inspection apparatus. However, in the present invention, a local area is processed by moving a sample such as an exposure apparatus. The present invention can also be applied to a device that performs the above.
[0064]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a positioning device capable of realizing accurate positioning of an object at low cost and in a small space.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram of a visual inspection device as an example of an embodiment of the present invention.
FIG. 2 is an explanatory diagram of alignment.
FIG. 3 is a flowchart showing an alignment sequence.
FIG. 4 is a flowchart showing an operation sequence of the wafer positioning device according to the first embodiment of the present invention.
FIG. 5 is a flowchart showing an operation sequence of a wafer positioning device according to a second embodiment of the present invention.
FIG. 6 is a flowchart showing an operation sequence of a wafer positioning device according to a second embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 101 ... eyepiece, 102 ... alignment processing apparatus (image processing apparatus), 103 ... alignment sensor (camera), 104 ... half mirror, 105 ... objective lens, 106 ... position control apparatus, 107 ... wafer, 108 ... wafer holder, 109 XYθ stage, 110 thermometer, 111 timer A, 112 timer B, 113 confirmation switch, 114 control device, 115 display confirmation device, 200 sensor, 201 calculated wafer position, 202 Actual wafer position, 203: coordinates of designed alignment mark, 204: coordinates of observed design, 205: coordinates of designed alignment mark, 206: coordinates of actual alignment mark, 207: coordinates of actual alignment mark , 208: actual observation coordinates, 209: deviation amount of alignment mark 210 ... shift amount of alignment marks, the deviation amount of 211 ... observation coordinate

Claims (7)

Mounting means for mounting the sample,
Alignment means for recognizing a sample coordinate system of the sample mounted on the mounting means,
Moving means for relatively moving a predetermined position based on the sample coordinate system to a predetermined position in the apparatus,
Calculating means for calculating a moving amount by the moving means based on the sample coordinate system recognized by the alignment means;
Elapsed time measuring means for measuring an elapsed time after the alignment means performs an operation of recognizing the sample coordinate system,
Control means for causing the alignment means to recognize the sample coordinate system again based on the output of the elapsed time measuring means. 2. The positioning device according to claim 1, wherein the control unit causes the alignment unit to perform the operation again when the elapsed time reaches a predetermined time. 3. 3. The positioning device according to claim 2, wherein the elapsed time measurement unit further measures an elapsed time since a power supply of the device is turned on, and the control unit performs the operation after the power supply of the device is turned on. 4. Wherein the predetermined time is changed based on a measurement result of the elapsed time of the positioning device. 3. The positioning device according to claim 2, wherein the elapsed time measurement unit further measures an elapsed time since the power of the illumination light source is turned on, and the control unit is configured to turn on the power of the illumination light source. A positioning device, wherein the predetermined time is changed based on a measurement result of an elapsed time from the time. Mounting means for mounting the sample,
Alignment means for recognizing a sample coordinate system of the sample mounted on the mounting means,
Moving means for relatively moving a predetermined position based on the sample coordinate system to a predetermined position in the apparatus,
Calculating means for calculating a moving amount by the moving means based on the sample coordinate system recognized by the alignment means;
Temperature measuring means for measuring the temperature of a predetermined portion of the device,
When the difference between the temperature measured by the temperature measurement unit and the temperature measured during the operation of recognizing the sample coordinate system by the alignment unit is equal to or more than a predetermined value, control for performing the operation by the alignment unit again. And a positioning device. Mounting means for mounting the sample,
Alignment means for recognizing a sample coordinate system of the sample mounted on the mounting means,
Moving means for relatively moving a predetermined position based on the sample coordinate system to a predetermined position in the apparatus,
Calculating means for calculating a moving amount by the moving means based on the sample coordinate system recognized by the alignment means;
A time measuring means for measuring time,
Control means for causing the alignment means to recognize the sample coordinate system again at predetermined time intervals based on the measurement result of the time measurement means. The positioning device according to any one of claims 1 to 6, further comprising a confirmation unit, wherein the control unit performs an operation of recognizing the sample coordinate system by the alignment unit again. A positioning device that outputs to the confirmation means that the operation is to be performed, and causes the operation to be performed when there is an input from the confirmation means.

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