CN109686730B - LAMP LED capable of being used in AC-DC hybrid mode - Google Patents
LAMP LED capable of being used in AC-DC hybrid mode Download PDFInfo
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- CN109686730B CN109686730B CN201910064742.3A CN201910064742A CN109686730B CN 109686730 B CN109686730 B CN 109686730B CN 201910064742 A CN201910064742 A CN 201910064742A CN 109686730 B CN109686730 B CN 109686730B
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- straight line
- chip
- rod
- negative electrode
- conducting
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 10
- 239000000084 colloidal system Substances 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000010931 gold Substances 0.000 abstract description 4
- 229910052737 gold Inorganic materials 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract description 3
- 238000003780 insertion Methods 0.000 abstract description 3
- 230000037431 insertion Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention provides an LAMP LED capable of being used by mixing alternating current and direct current, which comprises a conducting wafer composed of a forward conducting chip and a reverse conducting chip, three pins and a chip resistor separated from the conducting wafer, wherein the chip resistor is wrapped in insulating heat-dissipating glue. The invention can realize the mixed use of alternating current and direct current through the use of three pins and the chip resistor; the chip resistor is separated from the wafer, so that the influence of self-heating on the damage and light attenuation of gold wires in the LED can be effectively avoided; in addition, the forward conducting chip absorbs the current of the forward voltage part of the alternating current and the reverse conducting chip, so that blind insertion application without separating positive and negative electrodes can be realized; and through the bending treatment to the pin, not only can prevent to appear even tin's problem when welding, can also guarantee the safety when LED uses the alternating current.
Description
Technical Field
The invention relates to the field of LEDs, in particular to an LAMP LED capable of being used in an alternating-current and direct-current mode.
Background
The existing LEDs are characterized by being semiconductor, and can normally emit light only by direct current and forward current, when alternating current is needed, the alternating current is generally converted into direct current by a ballast and then provided for the LEDs, and part of application occasions need to be connected with alternating current after being externally connected with a resistor.
The LED structure of the external resistor is large in size, occupies a large assembly space, is easy to damage, has a short service life, and is easy to drop due to welding, so that maintenance cost is increased to a certain extent.
In order to solve the problem of external resistor, the chinese patent application No. 201710073505.4 proposes to encapsulate both the resistor and the diode in a glue, i.e. use a built-in resistor to connect with ac. However, the built-in resistor has the following problems:
(1) The heat quantity of the built-in resistor is too large, the LED colloid cannot normally dissipate heat, the junction temperature in the LED exceeds 200 ℃ under the continuous electrifying and lighting state, the rapid light attenuation service life of the LED is obviously reduced, and meanwhile, the colloid internal stress attached to the tail end of the gold wire generated by the too high temperature exceeds the maximum tolerance 15g of the tail end of the LED gold wire, so that the gold wire of the LED is broken and fails;
(2) The mode of built-in resistance can climb when pasting the resistance used solder paste and attach on the LED support, produces the tin pollution to the support, causes the gold thread to be unable to stably attach on the support when welding the gold thread, has gold thread fracture phenomenon or hidden danger.
Meanwhile, due to the semiconductor characteristics of the LED, namely forward conduction, reverse cutoff and reverse breakdown, when an internal resistor mode is used for switching on alternating current, the reverse voltage of the alternating current of 110V-350V cannot be prevented from frequently impacting a PN junction of the LED, and the reverse bearing voltage of the LED is far greater than the 15V requirement of the theoretical maximum bearable capacity of the LED, so that the LED fails in reverse breakdown.
In addition, according to the requirements of safety regulations such as GB4943-2001/GB8898-2001 and the like, the safety electric distance of the conductor is more than 3mm; at present, the distance between pins of LED leads which are designed to be connected with alternating current in the market is less than or equal to 2.54mm, and potential safety hazards exist.
Disclosure of Invention
In order to solve the problems, the invention provides an LAMP LED capable of being used by alternating current and direct current.
The main content of the invention comprises:
the LAMP LED capable of being used in an alternating-current-direct-current hybrid mode comprises an encapsulation main body, an anode pin, a direct-current cathode pin and an alternating-current cathode pin, wherein the encapsulation main body comprises an anode rod, a cathode rod, a supporting rod and an encapsulation colloid, the cathode rod is arranged between the anode rod and the supporting rod, a transmitting cup is arranged on the cathode rod, a conducting wafer is arranged in the transmitting cup, and the conducting wafer is electrically connected with the anode rod through a gold wire; the packaging colloid covers the upper part of the conducting wafer and coats the anode rod, the cathode rod and the supporting rod; the bottom of the anode rod is connected with the anode pin, the bottom of the cathode rod is connected with the direct current negative electrode pin, and the bottom of the support rod is connected with the alternating current negative electrode pin; a chip resistor is arranged between the upper ends of the direct current negative electrode pin and the alternating current negative electrode pin; and the surface mount resistor is coated with insulating heat-dissipating glue.
Preferably, the conducting wafer comprises a forward conducting chip and a reverse conducting chip which are connected in parallel; the forward conduction chip and the reverse conduction chip are fixed at the bottom of the transmitting cup through a die bonding adhesive, the forward conduction chip is electrically connected with the anode rod through a first gold wire, and the reverse conduction chip is electrically connected with the anode rod through a second gold wire.
Preferably, the positive electrode pin comprises a first straight line segment A, a first connecting segment and a first straight line segment B; the direct current negative electrode pin is in a straight line; the alternating current negative electrode pin comprises a second straight line section A, a second connecting section and a second straight line section B; the first straight line segment A, the first straight line segment B, the second straight line segment A and the second straight line segment B extend along the vertical direction; the first connecting section and the second connecting section extend along the horizontal direction, and the distance between the first connecting section and the second connecting section and the direct current negative electrode pin is larger than 3mm.
Preferably, the first connecting section is a straight line section or a quarter arc section or an S-shaped.
Preferably, the second connecting section is a straight line section or a quarter arc section or an S-shaped.
Preferably, the first straight line section a, the first connecting section, the second straight line section a and the second connecting section are coated with insulating heat-dissipating glue.
The invention has the beneficial effects that: the invention provides an LAMP LED capable of being used by mixing alternating current and direct current, which can realize the mixed use of alternating current and direct current through the use of three pins and a patch resistor; the chip resistor is separated from the wafer and is coated on the insulating heat-dissipating glue, so that the influence of self-heating on the damage and light attenuation of gold wires in the LED can be effectively avoided; in addition, the forward conducting chip absorbs the current of the forward voltage part of the alternating current and the reverse conducting chip, so that blind insertion application without separating positive and negative electrodes can be realized; and through the bending treatment to the pin, not only can prevent to appear even tin's problem when welding, can also guarantee the safety when LED uses the alternating current.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
fig. 2 is a top view of the present invention.
Detailed Description
The technical scheme protected by the invention is specifically described below with reference to the accompanying drawings.
Please refer to fig. 1 and fig. 2. The invention provides an LAMP LED capable of being used by mixing alternating current and direct current, which comprises a packaging main body, wherein the packaging main body comprises an anode rod 21, a cathode rod 22 and a supporting rod 23, a transmitting cup 6 is arranged on the cathode rod 22, a conducting wafer 4 is arranged at the bottom of the transmitting cup 6, the conducting wafer 4 is fixed at the bottom of the transmitting cup 6 through a die bonding adhesive 5, and the conducting wafer 4 is electrically connected with the anode rod 21 through a gold wire 3; meanwhile, the package body is externally coated with the package colloid 1, specifically, the package colloid 1 wraps the anode rod 21, the cathode rod 22, the support rod 23 and the conducting wafer 4, so that air is prevented from entering.
Three pins 2 extend below the package body, specifically, the anode rod 21 extends through the package colloid 1 to form an anode pin 2-1, the cathode rod 22 extends through the package colloid 1 to form a direct current cathode pin 2-2, the supporting rod 23 extends through the package colloid 1 to form an alternating current cathode pin 2-3, and a chip resistor 8 is arranged between the direct current cathode pin 2-2 and the upper end of the alternating current cathode pin 2-3, namely, the three pins 2 and the chip resistor 8 are arranged outside the package colloid 1 and separated from the conducting wafer 4, so that influence on gold wires 3 and the conducting wafer 4 caused by overheating of the chip resistor 8 is avoided.
When the LED is applied to a direct current electric field, the positive electrode pin 2-1 and the direct current negative electrode pin 2-2 are connected with the positive electrode and the negative electrode of a power supply, the chip resistor 8 is not connected with a circuit, normal light emitting of the LED can be achieved, when the LED is applied to an alternating current electric field, the positive electrode pin 2-1 and the alternating current negative electrode pin 2-3 are connected with the positive electrode and the negative electrode of the power supply, at the moment, the chip resistor 8 and the conducting wafer 4 are connected in series in the circuit, the chip resistor 8 has a current limiting effect, so that the LED can be applied to the alternating current occasion, and meanwhile, the direct current negative electrode pin 2-2 is not connected with the power supply and only plays a fixing role.
In one embodiment, in order to prevent the chip resistor 8 from being damaged, improve the service life of the chip resistor 8, and prevent the chip resistor 8 from falling off, the chip resistor 8 is coated in the insulating heat-dissipating glue 9, and the insulating heat-dissipating glue 9 not only can protect the chip resistor 8, but also can timely dissipate heat generated by the chip resistor 8 in use, so that the service life of the chip resistor 8 is ensured, and the influences on the direct current negative electrode pin 2-2 and the alternating current negative electrode pin 2-3 are ensured.
In order to further improve the safety, the conducting wafer 4 includes a forward conducting chip 4-1 and a reverse conducting chip 4-2, the forward conducting chip 4-1 and the reverse conducting chip 4-2 are both fixed at the bottom of the transmitting cup 6 through a die bond 5, and are electrically connected with the anode rod 21 through gold wires 3, that is, the forward conducting chip 4-1 is electrically connected with the anode rod 21 through a first gold wire, and the reverse conducting chip 4-2 is electrically connected with the anode rod 21 through a second gold wire, that is, the forward conducting chip 4-1 and the reverse conducting chip 4-2 are connected in parallel.
When the LED is used in a direct-current electric field, the forward conduction chip 4-1 and the reverse conduction chip 4-2 are connected in parallel between the positive electrode pin 2-1 and the direct-current negative electrode pin 2-2, and at the moment, the positive electrode pin 2-1 and the direct-current negative electrode pin 2-2 do not need to strictly correspond to the positive electrode and the negative electrode of a power supply, so that the LED is more convenient to realize blind insertion.
Similarly, when the chip 4-1 absorbs the current conduction luminescence of the forward voltage portion of the ac and the chip 4-2 absorbs the current conduction luminescence of the reverse voltage portion of the ac, thereby avoiding the risk of reverse breakdown of the conductive wafer when the conductive wafer is used and the direction of the conductive voltage generated by the ac is opposite to that of the conductive wafer.
In order to reduce potential safety hazards in the use process of the LED, three pins 2 are bent, the distance between the pins is increased, the distance between the pins is larger than 3mm, and the safe electrical distance is further achieved, so that the safety requirement is met.
Specifically, the direct current negative electrode pin 2-2 is kept in a vertical straight line segment, and the distance between the positive electrode pin 2-1 and the alternating current negative electrode pin 2-3 and the direct current negative electrode pin 2-2 is larger than that of the traditional design of the distance between LED pins, namely, the positive electrode pin 2-1 and the alternating current negative electrode pin 2-3 extend out of a segment along the direction away from the direct current negative electrode pin 2-2.
In one embodiment, the positive electrode pin 2-1 includes a first straight line segment a, a first connection segment, and a first straight line segment B; the direct current negative electrode pin 2-2 is in a straight line shape; the alternating current negative electrode pin 2-3 comprises a second straight line segment A, a second connecting segment and a second straight line segment B; the first straight line segment A, the first straight line segment B, the second straight line segment A and the second straight line segment B extend along the vertical direction; the first connecting section and the second connecting section extend along the horizontal direction, and the distance between the first connecting section and the second connecting section and the direct current negative electrode pin is larger than 3mm.
Preferably, the first connecting section is a straight line section or a quarter arc section or an S-shaped.
Preferably, the second connecting section is a straight line section or a quarter arc section or an S-shaped.
In order to avoid the problems of breakage and the like caused by overheating of bending parts of the pins, the first straight line section A, the first connecting section, the second straight line section A and the second connecting section are coated with insulating heat-dissipating glue 9.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (5)
1. The LAMP LED capable of being used in an alternating-current-direct-current hybrid mode is characterized by comprising an encapsulation main body, an anode pin, a direct-current cathode pin and an alternating-current cathode pin, wherein the encapsulation main body comprises an anode rod, a cathode rod, a supporting rod and an encapsulation colloid, the cathode rod is arranged between the anode rod and the supporting rod, a transmitting cup is arranged on the cathode rod, a conducting wafer is arranged in the transmitting cup, and the conducting wafer is electrically connected with the anode rod through a gold wire; the packaging colloid covers the upper part of the conducting wafer and coats the anode rod, the cathode rod and the supporting rod; the bottom of the anode rod is connected with the anode pin, the bottom of the cathode rod is connected with the direct current negative electrode pin, and the bottom of the support rod is connected with the alternating current negative electrode pin; a chip resistor is arranged between the upper ends of the direct current negative electrode pin and the alternating current negative electrode pin; the surface mount resistor is coated with insulating heat-dissipating glue;
the conducting wafer comprises a forward conducting chip and a reverse conducting chip which are connected in parallel; the forward conduction chip and the reverse conduction chip are fixed at the bottom of the transmitting cup through a die bonding adhesive, the forward conduction chip is electrically connected with the anode rod through a first gold wire, and the reverse conduction chip is electrically connected with the anode rod through a second gold wire;
the positive electrode pin comprises a first straight line segment A, a first connecting segment and a first straight line segment B; the direct current negative electrode pin is in a straight line; the alternating current negative electrode pin comprises a second straight line section A, a second connecting section and a second straight line section B.
2. The LAMP LED capable of being used in a mixed mode of alternating current and direct current according to claim 1, wherein the first straight line segment a, the first straight line segment B, the second straight line segment a and the second straight line segment B extend along a vertical direction; the first connecting section and the second connecting section extend along the horizontal direction, and the distance between the first connecting section and the second connecting section and the direct current negative electrode pin is larger than 3mm.
3. The LAMP LED of claim 2, wherein the first connection section is a straight line section or a quarter arc section or an S-shape.
4. The LAMP LED of claim 3, wherein said second connecting section is a straight line segment or a quarter arc segment or an S-shape.
5. The LAMP LED capable of being used by both alternating current and direct current as claimed in any one of claims 2 to 4, wherein the first straight line section a, the first connecting section, the second straight line section a and the second connecting section are coated with insulating heat-dissipating glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910064742.3A CN109686730B (en) | 2019-01-23 | 2019-01-23 | LAMP LED capable of being used in AC-DC hybrid mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910064742.3A CN109686730B (en) | 2019-01-23 | 2019-01-23 | LAMP LED capable of being used in AC-DC hybrid mode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109686730A CN109686730A (en) | 2019-04-26 |
| CN109686730B true CN109686730B (en) | 2024-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910064742.3A Active CN109686730B (en) | 2019-01-23 | 2019-01-23 | LAMP LED capable of being used in AC-DC hybrid mode |
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| Country | Link |
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| CN (1) | CN109686730B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006582A (en) * | 2002-04-12 | 2004-01-08 | Shiro Sakai | Light emitting device |
| KR20090049466A (en) * | 2007-11-13 | 2009-05-18 | 주식회사 옵토필 | Lamp-type light emitting diode package |
| JP2012049184A (en) * | 2010-08-24 | 2012-03-08 | Tai-Her Yang | Led circuit |
| CN204031545U (en) * | 2014-08-04 | 2014-12-17 | 无锡市市北高级中学 | LED light-emitting diode connection in series-parallel automatic switching circuit |
| CN209312766U (en) * | 2019-01-23 | 2019-08-27 | 苏州弘磊光电有限公司 | It is a kind of being capable of the mixed LAMP LED of alternating current-direct current |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200739952A (en) * | 2005-12-22 | 2007-10-16 | Rohm Co Ltd | Light emitting device and illumination instrument |
-
2019
- 2019-01-23 CN CN201910064742.3A patent/CN109686730B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004006582A (en) * | 2002-04-12 | 2004-01-08 | Shiro Sakai | Light emitting device |
| KR20090049466A (en) * | 2007-11-13 | 2009-05-18 | 주식회사 옵토필 | Lamp-type light emitting diode package |
| JP2012049184A (en) * | 2010-08-24 | 2012-03-08 | Tai-Her Yang | Led circuit |
| CN204031545U (en) * | 2014-08-04 | 2014-12-17 | 无锡市市北高级中学 | LED light-emitting diode connection in series-parallel automatic switching circuit |
| CN209312766U (en) * | 2019-01-23 | 2019-08-27 | 苏州弘磊光电有限公司 | It is a kind of being capable of the mixed LAMP LED of alternating current-direct current |
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| Publication number | Publication date |
|---|---|
| CN109686730A (en) | 2019-04-26 |
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