TW201544761A - An LED lighting element and lighting fixtures - Google Patents

Abstract

The present invention discloses an LED lighting element, including an bracket having a bi-luminous LED light and for fixing the luminous body. The bracket is made from material with better thermal characteristics. There has a U-shaped central vertical side gap. Said bidirectional LED light emission by a bracket with a U-shaped main body of a solder layer are fixed to each side of the gap, and corresponds to the light emitting chip is disposed on the U-shaped notch. By setting the creepage distance is greater than the standard, and the effect of such insulation can be specifically implemented. With this kind of technology programs to strengthen the stability of the structure between the LED light and bracket, improve the thermal efficiency of LED light, and lower the manufacturing costs. It can be widely used in the bulb lamps, candle lamps and other lighting fixtures.

Description

LED light-emitting element and lamp thereof

The present invention relates to an LED light-emitting element, and more particularly to an LED light-emitting element capable of achieving full-circumference illumination and a light-emitting device to which the light-emitting element is applied.

Conventional LED illuminating lamps can only achieve unidirectional illuminating. As shown in FIG. 1 , the LED illuminating chip 4 is disposed on the surface of the substrate 3 , and the illuminating surface can only illuminate one direction away from the side of the substrate, and the illuminating angle is less than 180°. And its light intensity is concentrated in the middle, and the periphery is gradually attenuated.

Then, the industry has developed a full-circumference LED bulb. As shown in FIG. 2-1, the light-emitting element is provided with an aluminum substrate 100. The edge of the aluminum substrate 100 is provided with a plurality of upwardly protruding folds along the same side. The LED 110 is provided with a bidirectional illumination on the top of the bent portion 110. The LED light source 200 generally uses the transparent substrate 210 as a carrier for the LED light emitting chip and is used for bonding the aluminum substrate. The bent portion 110 of 100. The material of the transparent substrate 210 is generally made of transparent glass or sapphire glass, and is a brittle material, and the transparent substrate 210 and the bent portion 110 of the aluminum substrate 100 are adhered and fixed by the pad 220 because of the pad. The limited area of 220 causes the light-emitting element to be easily adhered to the transparent substrate 210 on the bent portion 110 through the pad in the event of non-controllable factors such as collision, vibration, impact, etc. during transportation, resulting in the entire group. The light emitting device is scrapped; at the same time, the light emitting chip 230 is fixed on the transparent substrate 210. Since the transparent substrate 210 is made of transparent glass or sapphire glass, the material itself has no heat conducting effect, so the power of the LED light emitting chip 230 disposed thereon is small. (generally no more than 0.2W), can not carry the use of high-power LED light-emitting chips.

Finally, due to the lack of insulation withstand voltage between the aluminum substrate 100 and the transparent substrate 210, referring to FIG. 2-2, the conductive circuit 120 on the aluminum substrate 100 passes through the pad 220 to the LED light-emitting chip 230 on the transparent substrate 210. The power supply is performed. However, since the pad 220 not only needs to bond the transparent substrate 210 to the aluminum substrate bent portion 110 but also supplies power to the LED light-emitting chip 230, the area of the pad 220 cannot be too small, but the aluminum substrate 100 is The width of the bent portion 110 is limited, and finally the distance between the longitudinal direction and the lateral direction of the pad 220 and the aluminum substrate bent portion 110 is too short, as shown in the figure, and the lateral direction thereof is close to the boundary of the bent portion 110 without creepage distance. The longitudinal creepage distance H' is too short to be less than 2mm (for example, the UL rated design has an insulation withstand voltage of 1500 volts and the standard creepage distance is 2mm), so it is prone to high-voltage sparking (see Figure 2-3. Figure 2-4), the insulation withstand voltage test cannot be passed.

The main object of the present invention is to provide a full-circumference LED light-emitting element having a stable structure and excellent thermal conduction and insulation effect.

A secondary object of the present invention is to ensure that the LED lighting element meets the requirements of insulation withstand voltage.

A third object of the present invention is to achieve the practical application of the above LED light-emitting element in a luminaire.

In order to achieve the above object, the technical solution of the present invention is: an LED light-emitting element having a bi-directional light-emitting LED illuminator and a support for fixing the illuminant, the bi-directional light-emitting LED illuminator comprising a transparent substrate and an LED An illuminating chip, the front and back surfaces of the transparent substrate are respectively a first main surface and a second main surface, and a first conductive circuit is disposed on the first main surface, and the LED illuminating chip is disposed on the first main surface, And the first conductive circuit is electrically connected to the LED light emitting chip; the bracket is composed of a vertical end having a heat conducting property and a lateral end having a heat conducting and insulating property; the vertical end is provided with a notch in the middle thereof, and the width of the notch And greater than or equal to the width of the LED illuminating chip on the LED illuminator; the lateral end section includes an electrode layer, an insulating layer and a heat conducting layer from top to bottom, and the electrode layer is provided with a second conductive circuit, the second conductive circuit and the second conductive circuit a conductive circuit is connected to each other in series or in parallel through a wire enclosing the insulating layer; the transparent substrate on the LED illuminator is fixed to the vertical end of the bracket through the soldering layer, and is made Corresponding to the wafer disposed on the cutout.

Further, a minimum creepage distance between the solder layer on the transparent substrate and the first conductive circuit on the first major surface is greater than a standard creepage distance corresponding to the corresponding safety voltage.

Further, the minimum creepage distance of the first conductive circuit and the second conductive circuit to the heat conducting layer at the vertical end and the lateral end of the bracket are respectively greater than the standard creepage distance corresponding to the corresponding safety voltage.

Further, the bracket is an integrally formed aluminum substrate or a joint of a heat pipe at a vertical end and an aluminum substrate at a lateral end.

Further, it further includes a wavelength conversion layer disposed on the light emitting diode wafer, the first major surface and the second major surface.

Further, the width of the bracket notch is greater than or equal to the width of the wavelength conversion layer on the LED illuminator.

Further, the transparent substrate is a transparent aluminum oxide or an aluminum nitride ceramic.

Further, the lateral end of the bracket may be provided with a plurality of unidirectional illuminants.

A lamp using the LED lighting component produced by the above technical solution, the lamp is composed of a lamp cap assembly, a heat sink, a lamp cover and a light emitting component, and the light emitting component is disposed on the heat sink.

Further, the luminaire comprises two sets of illuminating elements, the lateral ends of the brackets of the two sets of illuminating elements being side by side, and the vertical ends thereof are oppositely disposed, and the first main surfaces of the two sets of illuminating elements are disposed opposite to each other.

Further, the vertical ends of the brackets of the two sets of light-emitting elements are arranged side by side and in line.

Further, the height of the vertical end of the bracket of the light-emitting element is close to the lampshade, and the illumination angle of the LED light-emitting chip disposed on the notch of the bracket is larger, and the irradiation range of the whole set of lamps is larger.

After the above solution, the following beneficial technical effects can be achieved: 1. Since the transparent substrate is fixed to each other by the solder layer and the aluminum substrate on both sides of the U-shaped notch, the light of the two-way illumination on the LED illuminator can be transmitted through the U-shaped notch. Light radiation, realizes the illumination of the full illumination of the LED light-emitting component; 2. Increases the soldering layer area between the transparent substrate and the aluminum substrate or the heat pipe, ensuring that the LED light-emitting component can be stably placed on the aluminum substrate even in transportation During the process, inevitable extrusion and collision occur, and the impact does not cause breakage or damage between the LED illuminator and the aluminum substrate; 3. The solder layer on the transparent substrate and the first conductive circuit on the first main surface The minimum creepage distance between the two is greater than the standard creepage distance corresponding to the corresponding safety voltage, and the first conductive circuit and the second conductive circuit are ensured by the first conductive circuit and the second conductive circuit through the wires. The minimum creepage distance H of the heat conduction layer from the circuit to the bracket is greater than the standard creepage distance corresponding to the corresponding safety voltage. The insulating pressure resistance requirement of the light-emitting element; 4. The transparent substrate adopts transparent aluminum oxide or aluminum nitride ceramic, and has better heat conduction characteristics than the conventional transparent glass or sapphire glass, and ensures the LED disposed on the substrate. The heat of the light-emitting chip is diffused outward through the transparent substrate, and as described above, the U-shaped notch of the aluminum substrate increases the contact area between the transparent substrate and the aluminum substrate, further promoting the heat transmission of the LED light-emitting chip. The transparent substrate with thermal conductivity rapidly spreads out through the aluminum substrate or the heat pipe (such as a heat sink), which greatly reduces the heat on the LED light-emitting chip, improves the service life of the entire LED light-emitting element, and realizes the high-power LED light-emitting chip. Commercial applications. 5. The light-emitting element is actually applied to LED lamps, such as bulbs, candle lamps, etc., which satisfies high-power LED lamps requiring high lumens and wide illumination range in some specific fields, and the above-mentioned lamp components are easy to assemble and stable in structure. The heat dissipation effect is good and the service life is long.

In order to further explain the technical solutions of the present invention, the present invention will be specifically described below by way of specific embodiments.

As shown in FIGS. 3-1 to 3-4, an LED light-emitting element includes an LED light-emitting body 1 having two-way light emission and a holder 2 for fixing the light-emitting body. The bidirectionally illuminated LED illuminator 1 comprises a transparent substrate 11, an LED illuminating wafer 12 and a wavelength conversion layer 13. The transparent substrate 11 is made of transparent aluminum oxide or aluminum nitride ceramic. The material itself has certain thermal conductivity but no conductive property, and the front and back surfaces are the first main surface 111 and the second main surface 112, respectively. A main surface is provided with a first conductive circuit 113 for supplying power to the LED light-emitting chip 12. The LED light-emitting chip 12 is disposed on the first main surface 111, and at least a portion of the light passes through the first main surface 111. The two major surfaces 112 are transmitted, such that the light of the first main light-emitting surface of the LED light-emitting wafer 12 radiating outward from the first major surface 111 is greater than the light intensity transmitted from the second major surface 112 to the second main light-emitting surface. The wavelength conversion layer 13 is disposed on the LED light emitting chip 12, the first main surface 111 and the second main surface 112, and the wavelength conversion layer 13 at least partially absorbs the light emitted by the LED wafer 12. And convert to different ranges of wavelengths, such as white light;

The bracket 2 shown in Figures 3-4 is composed of a vertical end 200 having a heat conducting property and a lateral end 201 having both heat conducting and insulating properties, the lateral end section including an electrode layer, an insulating layer and heat conduction from top to bottom. a layer (not shown), the bracket 2 may be made of an integrally formed aluminum substrate, or an aluminum substrate may be used by the lateral end 201, and the vertical end 200 is formed by a metal heat conductive material or a heat pipe together, in which the vertical The middle portion of the end 200 is provided with a notch, and the notch is a U-shaped notch 21 having a width greater than or equal to the width of the LED light-emitting chip 12 on the LED illuminator 1 and smaller than the width of the transparent substrate 11 to ensure that light can pass through the notch and light outward. Radiation; the electrode layer on the lateral end 201 of the L-shaped bracket 2 is provided with a second conductive circuit 114; the transparent substrate 11 on the LED illuminator 1 is fixed to the vertical end 200 of the L-shaped bracket 2 through the solder layer 22, That is, the bracket body on both sides of the U-shaped notch 21, and the light-emitting chip 12 is correspondingly disposed on the U-shaped notch 21;

At the same time, the minimum creepage distance H between the solder layer 22 and the first conductive circuit 113 on the first main surface 111 is greater than the corresponding creepage distance corresponding to the corresponding safety voltage, because the solder of the solder layer 22 is an electrically conductive substance, The transparent substrate 11 is an insulating material, and the creepage distance of the first conductive circuit 113 to the solder layer 22 is greater than the standard creepage distance corresponding to the corresponding safety voltage, thereby ensuring the insulation withstand voltage characteristics. For example, the UL rated design has an insulation withstand voltage of 1500 volts and a standard creepage distance of 2 mm, while the VDE certified design has an insulation withstand voltage of 3,750 volts and a standard creepage distance of 5 mm. Of course, the standard creepage distance H is not limited to 2 mm. Or 5mm, the design can be matched according to the actual applied safety standards, and will not be described in detail.

At the same time, since the first conductive circuit 113 and the second conductive circuit 114 are connected in series or in parallel through the wires 115 enclosing the insulating layer through the outer casing, it is ensured that the wire 115 does not damage the insulation withstand voltage characteristics of the entire group of light-emitting elements during the energization process;

The minimum creepage distance H of the first conductive circuit 113 and the second conductive circuit 114 to the vertical end 200 of the bracket or the lateral end 201 of the aluminum is greater than the standard creepage distance corresponding to the corresponding safety voltage, because the bracket The heat conducting layers of the vertical end 200 and the lateral end 201 are all electrical conductors, and the first conductive circuit 113 and the second conductive circuit 114 have sufficient safety creepage distance between the conductive bodies to meet the insulation withstand voltage of the light emitting element. Requirements, while achieving electrothermal separation of the product;

At the same time, a plurality of unidirectional illuminators 23 may be added to the lateral end of the bracket 2 for increasing the light intensity of the lateral end (level end) of the illuminating element.

As shown in FIG. 4, the figure shows an embodiment of the light-emitting element applied to a bulb lamp, which comprises a lamp head assembly 31, a heat sink 32, a lamp cover 33 and two sets of light-emitting elements manufactured by the above technical solution. 34. The lateral ends 3412 of the L-shaped brackets 341 of the two sets of light-emitting elements 34 are side by side, and the vertical ends 3411 thereof are oppositely disposed on the heat sink 32, and the first main surfaces 343 of the two sets of light-emitting elements are disposed opposite to each other. The lateral end 3412 of the bracket 341 is provided with a plurality of unidirectionally illuminated LED illuminators 35, which are arranged in a seating manner by two sets of illuminating elements. Since the first main surfaces 343 are disposed opposite each other, the vertical ends 3411 of the LED illuminating elements 34 are close to each other. The lamp cover 33, and the second main light emitting surface 342 is oriented toward the lamp cover 33, that is, the linear distance perpendicular to the second main surface 342 to the lamp cover 33 is smaller than the linear distance perpendicular to the first main surface 343 to the lamp cover 33, thus increasing the bubble The brightness and viewing angle of the side of the lamp, and the unidirectionally illuminated LED illuminators 35 at the lateral end of the L-shaped bracket increase the light intensity of the lateral end (level end) of the luminaire, realizing the full illumination of the bulb Lighting mode; at the same time due to the L-shaped bracket An integrally formed aluminum substrate having a good heat dissipation effect, or a structure in which a vertical end 3411 is a heat transfer tube and a lateral end 3412 is integrally joined by an aluminum substrate (the integrally formed L-shaped aluminum substrate is shown as an embodiment), The heat of the LED light-emitting chip or the LED light-emitting body can be diffused outward through the L-shaped aluminum substrate 341 along the heat sink 32, which increases the heat dissipation efficiency of the LED light-emitting chip and improves the service life of the light-emitting element.

As shown in FIG. 5, the figure shows an embodiment of the light-emitting element applied to a candle lamp. The basic structure is basically the same as that of the bulb lamp shown in FIG. 4, but only the L-shaped brackets 341 of the two sets of LED light-emitting elements 34. The lateral end of the L-shaped bracket 341 is not provided with a unidirectionally illuminated LED illuminator, and the L-shaped bracket 341 is formed by the vertical end of the heat pipe 3411 and the lateral end of the aluminum substrate 3412, and the vertical alignment of the L-shaped brackets 341 of the two sets of light-emitting elements. The end is arranged in a straight line, and it should be noted that the higher the height of the vertical end 3411 of the L-shaped bracket 341, the larger the illumination angle of the LED light-emitting chip disposed on the U-shaped notch of the L-shaped bracket, and the irradiation range of the whole group of lamps It is bigger.

The above-described embodiments and illustrations are not intended to limit the scope of the invention, and any suitable variations and modifications of the invention will be apparent to those skilled in the art.

1‧‧‧LED illuminator
11‧‧‧Transparent substrate
12‧‧‧LED light-emitting chip
13‧‧‧wavelength conversion layer
100‧‧‧Aluminum substrate
110‧‧‧Bends
111‧‧‧ first major surface
112‧‧‧Second major surface
113‧‧‧First conductive circuit
114‧‧‧Second conductive circuit
115‧‧‧ wire
120‧‧‧Conductive circuit
2‧‧‧L-shaped bracket
21‧‧‧U-shaped gap
22‧‧‧welding layer
200‧‧‧ vertical end
201‧‧‧ lateral end
210‧‧‧Transparent substrate
220‧‧‧ pads
3‧‧‧Substrate
31‧‧‧Light head assembly
32‧‧‧ Heat sink
33‧‧‧shade
34‧‧‧LED light-emitting components
341‧‧‧L bracket
3411‧‧‧ vertical end
3412‧‧‧ lateral end
342‧‧‧Second major surface
343‧‧‧ first major surface
35‧‧‧LED illuminator
4‧‧‧LED light-emitting chip
H‧‧‧ creepage distance
H'‧‧‧ creepage distance

1 is a schematic diagram of a unidirectional light-emitting LED lamp in the background art; [FIG. 2-1] is a schematic diagram of a full-circumference LED light-emitting component in the background art; [FIG. 2-2] is a schematic diagram of a power supply circuit connection in the background art; 2-3], [Fig. 2-4] are schematic diagrams of flashovers existing in the electrical insulation withstand voltage test of the background art; [Fig. 3-1] to [Fig. 3-3] are parts of the LED light-emitting component of the present invention [Fig. 3-4] is a schematic view of the LED light emitting device of the present invention with an LED illuminator at the lateral end of the bracket; [Fig. 4] is a schematic view of the LED light emitting device of the present invention applied to a bulb lamp; 5] is a schematic view of the LED light-emitting element of the present invention applied to a candle light.

31‧‧‧Light head assembly

32‧‧‧ Heat sink

33‧‧‧shade

34‧‧‧LED light-emitting components

341‧‧‧L bracket

3411‧‧‧ vertical end

3412‧‧‧ lateral end

342‧‧‧ first major surface

343‧‧‧Second major surface

35‧‧‧LED light-emitting chip

Claims (9)

An LED light-emitting element, comprising: an LED light-emitting body having two-way light emission and a support for fixing the light-emitting body, wherein the two-way light-emitting LED light-emitting body comprises a transparent substrate and an LED light-emitting chip, and the transparent substrate is positive The reverse surface is respectively a first main surface and a second main surface, and the first main surface is provided with a first conductive circuit, the LED light emitting chip is disposed on the first main surface, and the first conductive circuit and the LED light emitting chip Electrically connected; the bracket is composed of a vertical end having a heat conducting property and a lateral end having a heat conducting and insulating property; the middle of the vertical end is provided with a notch, and the width of the notch is greater than or equal to the LED light emitting chip on the LED illuminator The width of the transverse end section includes an electrode layer, an insulating layer and a heat conducting layer from top to bottom, and the electrode layer is provided with a second conductive circuit, and the second conductive circuit and the first conductive circuit are wrapped with an insulating layer through an outer casing The wires are serially or in parallel with each other; the transparent substrate on the LED illuminator is fixed to the vertical end of the bracket by a soldering layer, and the illuminating wafer is correspondingly disposed on the notch. An LED lighting element according to claim 1, wherein the minimum creepage distance between the solder layer on the transparent substrate and the first conductive circuit on the first main surface is greater than that based on the corresponding safety The standard creepage distance corresponding to the voltage. An LED light-emitting component according to claim 1, wherein the first conductive circuit and the second conductive circuit respectively have a minimum creepage distance to the heat conducting layer at the vertical end and the lateral end of the bracket respectively. The corresponding creepage distance corresponding to the corresponding safety voltage. An LED light-emitting device according to claim 1, wherein the bracket is an integrally formed aluminum substrate or is formed by splicing a heat pipe at a vertical end and an aluminum substrate at a lateral end. An LED light-emitting device according to claim 1, wherein the transparent substrate is a transparent aluminum oxide or an aluminum nitride ceramic. An LED light-emitting element according to claim 1, wherein the lateral end of the bracket may be provided with a plurality of unidirectional LED light-emitting chips. An LED lamp characterized in that it consists of a lamp cap element, a heat sink, a lamp cover and any of the light-emitting elements described in the first to sixth aspects of the patent application, the light-emitting element being disposed on the heat sink. An LED lamp as claimed in claim 7 is characterized in that the lamp comprises more than two sets of LED light-emitting elements, and the first main surface of the vertical end of the light-emitting element holder is oppositely disposed. The LED lamp of claim 7, wherein the lamp comprises two or more sets of LED light-emitting elements, and the vertical ends of the light-emitting element brackets are arranged in a straight line.