CN109671679A - Fingerprint chip-packaging structure and fingerprint mould group equipped with fingerprint chip-packaging structure - Google Patents
Fingerprint chip-packaging structure and fingerprint mould group equipped with fingerprint chip-packaging structure Download PDFInfo
- Publication number
- CN109671679A CN109671679A CN201710954154.8A CN201710954154A CN109671679A CN 109671679 A CN109671679 A CN 109671679A CN 201710954154 A CN201710954154 A CN 201710954154A CN 109671679 A CN109671679 A CN 109671679A
- Authority
- CN
- China
- Prior art keywords
- fingerprint chip
- fingerprint
- packaging structure
- conduct piece
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
Abstract
The present invention relates to a kind of fingerprint chip-packaging structure and the fingerprint mould group equipped with the fingerprint chip-packaging structure, fingerprint chip-packaging structure include: fingerprint chip；Conduct piece is set to fingerprint chip, fingerprint chip is electrically connected to external structure；Packaging body, encapsulated moulding is in fingerprint chip and conduct piece, the bottom wall that packaging body has roof and is oppositely arranged with roof, packaging body includes the first accommodating hole and the second accommodating hole, first accommodating hole is between roof and bottom wall, second accommodating hole is connected to the first accommodating hole and bottom wall, fingerprint chip are located at the first accommodating hole, and conduct piece is located at the second accommodating hole.Above-mentioned fingerprint chip-packaging structure, fingerprint chip is electrically connected to external structure by conduct piece, there is no need to which the electric connection structures such as conductive connecting are arranged, therefore there is relatively thin thickness, is conducive to the lightening development of the electronic equipment equipped with the fingerprint chip-packaging structure.
Description
Technical field
The present invention relates to fingerprint identification technology field, in particular to a kind of fingerprint chip-packaging structure and be equipped with fingerprint chip
The fingerprint mould group of encapsulating structure.
Background technique
A kind of input unit of the touch screen as man-machine interactive interface, is installed on various terminal equipment, is widely applied
More and more important role is played in people's life and social development in every field.In order to realize the touch function of screen
Can, therefore touch screen is made of multilayered structure, structure is complex.Also, due in the use process of terminal device, storage
Personal information is more and more, it is therefore desirable to which device encrypts terminal device.Since the fingerprint of people is common by nature-nurture
It acts on and is formed, complexity is applied not only to identify, and also has uniqueness and invariance, therefore using fingerprint recognition as one
The cipher mode that a little terminal devices use has good security performance, and it is simple and fast to facilitate identification process, facilitates behaviour
The use of author.
And as the fingerprint recognition chip for completing fingerprint identification function, since fault of construction causes thickness thicker, to hinder
Hinder further decreasing for the thickness of the smart machine equipped with the fingerprint recognition chip, is unfavorable for smart machine to frivolous direction
Development.
Summary of the invention
Based on this, it is necessary to provide a kind of fingerprint chip-packaging structure of slimming and be equipped with the fingerprint chip-packaging structure
Fingerprint mould group.
A kind of fingerprint chip-packaging structure, comprising:
Fingerprint chip；
Conduct piece is set to the fingerprint chip, the fingerprint chip is electrically connected to external structure；And
Packaging body, encapsulated moulding in the fingerprint chip and the conduct piece, the packaging body have roof and with it is described
The bottom wall that roof is oppositely arranged, the packaging body include the first accommodating hole and the second accommodating hole, and first accommodating hole is located at institute
It states between roof and the bottom wall, second accommodating hole is connected to first accommodating hole and the bottom wall, the fingerprint chip
Positioned at first accommodating hole, the conduct piece is located at second accommodating hole.
Above-mentioned fingerprint chip-packaging structure, fingerprint chip are electrically connected to external structure by conduct piece, and there is no need to be arranged
The electric connection structures such as conductive connecting, therefore there is relatively thin thickness, be conducive to the electronics equipped with the fingerprint chip-packaging structure
The lightening development of equipment.
The conduct piece is flushed far from fingerprint chip-side surface with the bottom wall in one of the embodiments,.
In this way, conduct piece can directly contact external structure and tie with outside when the bottom wall of packaging body is attached directly in external structure
Structure electrical connection, improves the reliability of electrical connection.
The conduct piece is tin ball in one of the embodiments,.In this way, the size of conduct piece can be polishing to as needed
Default size is to meet the difference requirement to the size of fingerprint chip-packaging structure.When fingerprint chip-packaging structure is attached at substrate
Etc. in external structures when, directly contact and be electrically connected with external structure by conduct piece, without conductive connecting is arranged.
The side of the fingerprint chip far from the conduct piece is completely covered in the roof in one of the embodiments,.
In this way, fingerprint chip is packaged body cladding and is contained in the first accommodating hole of packaging body completely, avoid direct with external environment
It contacts and damages under external force.
The fingerprint chip is far from packaging body described in the surface distance of the conduct piece side in one of the embodiments,
Roof 0.05mm~the 0.1mm.In this way, packaging body can protect a side surface of the fingerprint chip far from conduct piece, and make fingerprint
Chip-packaging structure surface smoothness with higher and have preferably fitting effect.
The fingerprint chip is equipped with packaging body described in the surface distance of the conduct piece side in one of the embodiments,
Bottom wall 0.05mm~the 0.1mm.In this way, packaging body can protect fingerprint chip to be equipped with conduct piece side and conduct piece, and make to refer to
Line chip-packaging structure surface smoothness with higher and have preferably fitting effect.
The roof of the packaging body is apart from the bottom wall 0.3mm~0.4mm in one of the embodiments,.In this way,
The fingerprint chip-packaging structure while packaging body can coat fingerprint chip and mechanical strength with higher completely have compared with
Small size develops to be conducive to the electronic equipment equipped with the fingerprint chip-packaging structure to lightening direction.
The fingerprint chip-packaging structure further includes pad in one of the embodiments, and the pad is embedded at described
Fingerprint chip is electrically connected close to one side surface of bottom wall and with the fingerprint chip, and the conduct piece is set on the pad simultaneously
It is electrically connected with the pad.In this way, the pad on fingerprint chip is electrically connected to soldered ball by being electrically connected hole, and then make fingerprint chip
It is electrically connected with external structure, there is preferable electrical connection stability.
The pad is multiple, multiple pad interval settings with the conduct piece in one of the embodiments,
Each conduct piece is correspondingly arranged on one of them described pad.In this way, each pad of fingerprint chip passes through conduct piece
It is electrically connected with external structure, to realize the function of fingerprint recognition.
A kind of fingerprint mould group, including above-mentioned fingerprint chip-packaging structure, the fingerprint mould group further includes substrate, the finger
Line chip-packaging structure is electrically connected to the substrate by the conduct piece.
Above-mentioned fingerprint mould group, since its fingerprint chip-packaging structure being equipped with has lesser stick up while thinner thickness
Curvature and biggish mechanical strength, therefore there is lesser size and higher intensity, be conducive to the electricity equipped with the fingerprint mould group
The lightening development of sub- equipment.
Detailed description of the invention
Fig. 1 is the schematic diagram of the fingerprint chip-packaging structure of an embodiment；
Fig. 2 is the sectional view along A-A of fingerprint chip-packaging structure shown in FIG. 1；
Fig. 3 is the B-B direction cross-sectional view of fingerprint chip-packaging structure shown in FIG. 1；
The cross-sectional view of the packaging body of Fig. 4 fingerprint mould group shown in Fig. 3.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in FIG. 1 to 3, a kind of fingerprint chip-packaging structure 100 of this preferred embodiment, including fingerprint chip 20,
Conduct piece 40 and packaging body 60, the fingerprint chip-packaging structure 100 are mountable in various electronic equipments to carry out fingerprint recognition.
Wherein, conduct piece 40 is set to fingerprint chip 20, fingerprint chip 20 is electrically connected to external structure, outside knot
Structure can be wiring board or external electronic device.60 encapsulated moulding of packaging body has roof 62 in fingerprint chip 20 and conduct piece 40
And the bottom wall 64 being oppositely arranged with roof 62.Packaging body 60 includes the first accommodating hole 66 and the second accommodating hole 68, the first accommodating hole
66 between roof 62 and bottom wall 64, and the second accommodating hole 68 is connected to the first accommodating hole 66 and bottom wall 64, fingerprint chip 20 are located at
First accommodating hole 66, conduct piece 40 are located at the second accommodating hole 68.
Above-mentioned fingerprint chip-packaging structure 100, fingerprint chip 20 are electrically connected to external structure, therefore nothing by conduct piece 40
The electric connection structures such as conductive connecting need to be set, therefore there is relatively thin thickness, be conducive to be equipped with the fingerprint chip-packaging structure
The lightening development of 100 electronic equipment.
In the present embodiment, the cross section of packaging body 60 is in kidney-shaped, and coats fingerprint by molding integrally formed mode
Chip 20, the material for forming packaging body 60 can be nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer polymerization
Object) or PP (Polypropylene, polypropylene) etc..In this way, being received completely due to identical material breathing ratio having the same
It is equal everywhere to hold the tension that the fingerprint chip 20 in packaging body 60 is subject to, to effectively optimize fingerprint chip-packaging structure
100 warpage issues improve the yields of the fingerprint chip-packaging structure 100.
Fingerprint chip 20 is pure silicon wafer, and buckling deformation is small and intensity with higher, to make the fingerprint chip package
The thickness of structure 100 is more uniform, and the structural strength with higher in the lesser situation of thickness.Those skilled in the art answer
When understanding, the aforementioned manufacture that can choose and the material that can choose, be illustrative only it is of the invention can
It is not limitation of the invention in a manner of implementation.
Please refer to figs. 2 and 3, and conduct piece 40 is flushed far from 20 1 side surface of fingerprint chip with bottom wall 64.In this way, when encapsulation
When the bottom wall 64 of body 60 is attached directly in external structure, conduct piece 40 directly can contact external structure and be electrically connected with external structure
It connects, improves the reliability of electrical connection.
Specifically, conduct piece 40 is tin ball, and tin ball is polished to far from 20 side of fingerprint chip and flushes with bottom wall 64.Such as
This, the size of conduct piece 40 can be polishing to default size as needed to meet to the size of fingerprint chip-packaging structure 100
Difference requires.When fingerprint chip-packaging structure 100 is attached in external structure, directly connect with external structure by conduct piece 40
It touches and is electrically connected, without conductive connecting is arranged.
Fingerprint chip 20 is substantially in rectangular parallelepiped structure, and fingerprint chip 20 is completely covered far from conductive in the roof 62 of packaging body 60
The side of part 40.In this way, fingerprint chip 20 is packaged the cladding of body 60 and is contained in the first accommodating hole 66 of packaging body 60 completely,
It avoids directly contacting and damaging under external force with external environment.
Specifically, fingerprint chip 20 far from 40 side surface distance packaging body 60 of conduct piece roof 62 be 0.05mm~
0.1mm to make the side surface far from conduct piece 40 that can protect fingerprint chip 20 of packaging body 60, and makes fingerprint chip package knot
The surface smoothness with higher of structure 100 and have preferably fitting effect.Fingerprint chip 20 is equipped with 40 1 side surface of conduct piece
The bottom wall 64 of distance packaged body 60 is 0.05mm~0.1mm, to make packaging body 60 that fingerprint chip 20 can be protected to be equipped with conduct piece
40 sides and conduct piece 40, and make the surface smoothness with higher of fingerprint chip-packaging structure 100 and there is preferably fitting
Effect.The roof 64 of packaging body 60 is 0.3mm~0.4mm apart from bottom wall 64, in this way, the fingerprint chip-packaging structure 100 is sealing
Dress body 60 can coat fingerprint chip 20 completely and mechanical strength with higher while has lesser size, to be conducive to
Electronic equipment equipped with the fingerprint chip-packaging structure 100 develops to lightening direction.
Specifically in the present embodiment, roof 62 of the fingerprint chip 20 far from 40 side surface distance packaging body 60 of conduct piece is
0.05mm, the bottom wall 64 that fingerprint chip 20 is equipped with 40 side surface distance packaging body 60 of conduct piece is 0.05mm, packaging body 60
Roof 64 apart from bottom wall 64 be 0.3mm, thus make fingerprint chip-packaging structure 100 have enough mechanical strengths, avoiding sticking up
With relatively thin thickness while bent.
In one embodiment, fingerprint chip-packaging structure 100 further includes pad, and pad is embedded at fingerprint chip 20 close to envelope
It fills 64 1 side surface of bottom wall of body 60 and is electrically connected with fingerprint chip 20, conduct piece 40 is set on pad and is electrically connected with pad.
In this way, the pad on fingerprint chip 20 is directly electrically connected to conduct piece 40, and then it is electrically connected fingerprint chip 20 with external structure,
To reliability of electrical connection with higher.
Further, be spaced apart on packaging body 60 and be equipped with multiple second accommodating holes 68, conduct piece 40 with pad be it is multiple,
Multiple pad intervals are set on fingerprint chip 20, and each conduct piece 40 is correspondingly arranged on one of pad and correspondence is contained in it
In in second accommodating hole 68, be electrically connected so that each pad of fingerprint chip 20 be made to pass through conduct piece 40 with external structure
It connects, realizes the function of fingerprint recognition.
Above-mentioned fingerprint chip-packaging structure 100 integrally has since fingerprint chip 20 is contained in completely in packaging body 60
Higher mechanical strength.Since packaging body 60 is made of one piece using identical material, thermal expansion and contraction ratio having the same,
So as to optimize the warpage issues of fingerprint chip-packaging structure 100.Moreover, fingerprint chip 20 is connected to outside by conduct piece 40
Structure has good reliability of electrical connection.
As shown in Figures 1 and 2, a kind of fingerprint mould group, including above-mentioned fingerprint chip-packaging structure 100, the fingerprint mould group
It further include substrate, fingerprint chip-packaging structure 100 is set to substrate side, and is electrically connected to substrate by conduct piece 40, thus will
The identification signal that fingerprint chip 20 generates is sent to substrate.
Above-mentioned fingerprint mould group, the fingerprint chip-packaging structure 100 being equipped with due to it have smaller while thinner thickness
Angularity and biggish mechanical strength, therefore there is lesser size and higher intensity, be conducive to be equipped with the fingerprint mould group
Electronic equipment lightening development.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of fingerprint chip-packaging structure characterized by comprising
Fingerprint chip；
Conduct piece is set to the fingerprint chip, the fingerprint chip is electrically connected to external structure；And
Packaging body, encapsulated moulding in the fingerprint chip and the conduct piece, the packaging body have roof and with the roof
The bottom wall being oppositely arranged, the packaging body include the first accommodating hole and the second accommodating hole, and first accommodating hole is located at the top
Between wall and the bottom wall, second accommodating hole is connected to first accommodating hole and the bottom wall, the fingerprint chip are located at
First accommodating hole, the conduct piece are located at second accommodating hole.
2. fingerprint chip-packaging structure according to claim 1, which is characterized in that the conduct piece is far from the fingerprint core
One side surface of piece is flushed with the bottom wall.
3. fingerprint chip-packaging structure according to claim 2, which is characterized in that the conduct piece is tin ball.
4. fingerprint chip-packaging structure according to claim 1, which is characterized in that the fingerprint is completely covered in the roof
Side of the chip far from the conduct piece.
5. fingerprint chip-packaging structure according to claim 1, which is characterized in that the fingerprint chip is far from the conduction
Roof 0.05mm~the 0.1mm of packaging body described in the surface distance of part side.
6. fingerprint chip-packaging structure according to claim 1, which is characterized in that the fingerprint chip is equipped with the conduction
Bottom wall 0.05mm~the 0.1mm of packaging body described in the surface distance of part side.
7. fingerprint chip-packaging structure according to claim 1, which is characterized in that the roof distance of the packaging body
Bottom wall 0.3mm~the 0.4mm.
8. fingerprint chip-packaging structure according to claim 1, which is characterized in that the fingerprint chip-packaging structure also wraps
Pad is included, the pad is embedded at the fingerprint chip close to one side surface of bottom wall and is electrically connected with the fingerprint chip,
The conduct piece is set on the pad and is electrically connected with the pad.
9. fingerprint chip-packaging structure according to claim 8, which is characterized in that the pad is with the conduct piece
Multiple, multiple pad interval settings, each conduct piece is correspondingly arranged on one of them described pad.
10. a kind of fingerprint mould group, which is characterized in that described including fingerprint mould group as claimed in any one of claims 1 to 9 wherein
Fingerprint mould group further includes wiring board, and the fingerprint chip-packaging structure is electrically connected to the wiring board by the conduct piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710954154.8A CN109671679A (en) | 2017-10-13 | 2017-10-13 | Fingerprint chip-packaging structure and fingerprint mould group equipped with fingerprint chip-packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710954154.8A CN109671679A (en) | 2017-10-13 | 2017-10-13 | Fingerprint chip-packaging structure and fingerprint mould group equipped with fingerprint chip-packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109671679A true CN109671679A (en) | 2019-04-23 |
Family
ID=66138943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710954154.8A Withdrawn CN109671679A (en) | 2017-10-13 | 2017-10-13 | Fingerprint chip-packaging structure and fingerprint mould group equipped with fingerprint chip-packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109671679A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650401A (en) * | 2019-09-30 | 2020-01-03 | 华为技术有限公司 | Wireless earphone |
-
2017
- 2017-10-13 CN CN201710954154.8A patent/CN109671679A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650401A (en) * | 2019-09-30 | 2020-01-03 | 华为技术有限公司 | Wireless earphone |
| CN110650401B (en) * | 2019-09-30 | 2024-01-30 | 华为技术有限公司 | Wireless earphone |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 Nanchang Avenue, Nanchang high tech Zone, Nanchang, Jiangxi 1189 Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190423 |