CN207690105U - Fingerprint module and electronic equipment equipped with the fingerprint module - Google Patents
Fingerprint module and electronic equipment equipped with the fingerprint module Download PDFInfo
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- CN207690105U CN207690105U CN201721323709.0U CN201721323709U CN207690105U CN 207690105 U CN207690105 U CN 207690105U CN 201721323709 U CN201721323709 U CN 201721323709U CN 207690105 U CN207690105 U CN 207690105U
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- chip
- fingerprint module
- pad
- circuit board
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Abstract
The utility model is related to a kind of fingerprint module and the electronic equipment equipped with the fingerprint module, fingerprint module include：Circuit board；Chip-packaging structure；Cover board is covered in chip-packaging structure；Chip-packaging structure includes packaging body and chip, packaging body offers container, chip is embedded in container, and chip includes chip body, pin, pad and soldered ball, and pin is embedded at chip body, pad is set to chip body, soldered ball is set on pad, connecting hole is offered in chip body, chip further includes wiring layer, wiring layer electrical connection pins, and extend to chip body by connecting hole and be electrically connected with pad.Above-mentioned fingerprint module, pin in chip body pad and then is electrically connected to circuit board by being electrically connected to pad across the wiring layer of connecting hole by soldered ball, to make chip body and circuit board electrical connection, to reduce the thickness of fingerprint module.In addition, packaging body can play a protective role to chip, there is stronger penetration capacity.
Description
Technical field
The utility model is related to fingerprint identification technology field, more particularly to a kind of fingerprint module and equipped with the fingerprint module
Electronic equipment.
Background technology
Touch screen is installed on various terminal equipment, extensive use as a kind of input unit of man-machine interactive interface
In every field more and more important role is played in people's life and social development.In order to realize the touch work(of screen
Can, therefore touch screen is made of multilayered structure, structure is complex.Also, during the use of terminal device, storage
Personal information is more and more, it is therefore desirable to which terminal device is encrypted in device.Since the fingerprint of people is common by nature-nurture
It acts on and is formed, complexity is applied not only to differentiate, also has uniqueness and invariance, therefore using fingerprint recognition as one
The cipher mode that a little terminal devices use has good security performance, and it is simple and fast to facilitate identification process, facilitates behaviour
The use of author.
Refer to equipped with this to hinder since current thickness is thicker as the fingerprint module for completing fingerprint identification function
The thickness of the smart machine of line module further decreases, and is unfavorable for development of the smart machine to frivolous direction.
Utility model content
Based on this, it is necessary to for the thicker problem of the thickness of fingerprint module, provide a kind of fingerprint module of thinner thickness
And the smart machine equipped with the fingerprint module.
A kind of fingerprint module, including：
Circuit board；
Chip-packaging structure is set to the circuit board side；And
Cover board is covered in the chip-packaging structure far from the circuit board side；
Wherein, the chip-packaging structure includes packaging body and chip, and the packaging body is opened up close to the cover board side
There are the container with bottom wall, the chip to be embedded in the container, the chip includes chip body, pin, pad
And soldered ball, the pin are embedded at the chip body and are electrically connected to the chip body, the pad is set to the chip
Towards the circuit board side, the soldered ball is set on the pad and is electrically connected the pad and the circuit board, institute main body
It states and offers connecting hole in chip body, the connecting hole extends to the chip body from the pin and is equipped with the pad one
Side, the chip further include wiring layer, and the wiring layer is electrically connected the pin, and extends to the core by the connecting hole
Piece main body is electrically connected equipped with the pad side with the pad.
The chip body of above-mentioned fingerprint module, chip-packaging structure offers connecting hole, therefore the pin in chip body
By being electrically connected to pad across the wiring layer of connecting hole, pad is electrically connected to circuit board by soldered ball in turn, to make chip
Main body and circuit board electrical connection, without the substrate for being electrically connected with the pin and is additionally is arranged, to reduce fingerprint module
Thickness simplifies the manufacturing process of fingerprint module and chip body is avoided to crack.Make in addition, packaging body can play chip protection
With, and since chip is embedded at packaging body in the container of cover board side, there is stronger penetration capacity and support
Thicker cover board is set, the structural strength of the fingerprint module is improved.
The chip body includes the first surface and second surface being oppositely arranged in one of the embodiments, described
First surface is located at the chip body towards the cover board side, and the second surface is located at the chip body towards described
Circuit board side, the pin are embedded at the first surface, and the pad is protrudingly placed on the second surface, the connecting hole
Through the first surface and the second surface.In this way, connecting hole can will be located at two opposite of chip body
One surface is electrically connected with the pin of second surface with pad, and then soldered ball and circuit board electrical connection by being electrically connected to pad,
Without the substrate for fitting in second surface is additionally arranged, there are no need to be arranged from pin around being connected to substrate after chip body
Conductive connecting.
The wiring layer extends to the chip master from the pin by the connecting hole in one of the embodiments,
The second surface of body, the pad are covered on the wiring layer of part.In this way, the wiring layer across connecting hole can will divide
Not Wei Yu two opposite first surfaces of chip body be electrically connected with pad with the pin of second surface, without use is additionally arranged
In the substrate being electrically connected by conductive connecting with pin, to reduce the thickness of the fingerprint module.
The chip further includes solder mask in one of the embodiments, and the solder mask covers the chip body
The region of second surface and the wiring layer not covered with the pad.In this way, soldered ball can be prevented in the welding with circuit board
Scolding tin excessive the problems such as causing short circuit in journey, and wiring layer can be protected to prevent wiring layer and chip body from making moist
Or it is damaged.
The board edge is surrounded with fluid sealant in one of the embodiments, and the fluid sealant is described for sealing
Gap between circuit board and the chip-packaging structure.In this way, liquid in external environment can be prevented from circuit board and chip
Enter in fingerprint module between encapsulating structure, to further increase the sealing water resistance of the fingerprint module.
The fingerprint module further includes stiffening plate in one of the embodiments, and the stiffening plate is set to the circuit board
Far from the chip-packaging structure side.In this way, certain support can be provided for circuit plate, the structure for increasing fingerprint module is strong
Degree.
The fingerprint module further includes shell in one of the embodiments, and the shell includes bottom wall and from the bottom
The first holding tank is collectively formed with the side wall in the side wall that wall is bent to form, the bottom wall, and connection institute is offered on the bottom wall
The second holding tank of the first holding tank is stated, the size of second holding tank is less than first holding tank, the cover board and core
Chip package is contained in first holding tank, and end face limit of the chip-packaging structure far from the cover board side
In on the bottom wall, the circuit board is located in second holding tank.In this way, the structure of shell and cover board, chip package knot
The shape of structure and circuit board is adapted, and is damaged to avoid cover board, chip-packaging structure and circuit board.Also, due to chip
The thickness of encapsulating structure is smaller, therefore chip-packaging structure can be limited by the bottom wall on the inside of shell, therefore works as the fingerprint module
When being installed on electronic equipment, the structures such as display module may extend to below the fingerprint module, and the fingerprint is equipped with to expand
The screen accounting of the electronic equipment of module, saves the installation space in electronic equipment.
Marine glue is filled between the chip-packaging structure and the bottom wall in one of the embodiments, with closing
Gap between the chip-packaging structure and the bottom wall, in this way, liquid in external environment can be prevented from cover board and bottom wall
Between into fingerprint module internal damage chip-packaging structure, make the fingerprint module that there is preferable sealing performance.
A kind of electronic equipment, including above-mentioned fingerprint module.
Above-mentioned electronic equipment saves the interior of the electronic equipment since the thickness of the fingerprint module of its setting is smaller
Portion space, makes display module may extend to below mounting groove, and increasing screen while keeping electronic equipment more lightening accounts for
Than.
Description of the drawings
Fig. 1 is the sectional view of the fingerprint module of an embodiment；
Fig. 2 is the sectional view of the chip-packaging structure of fingerprint module shown in FIG. 1；
Fig. 3 is the sectional view of the packaging body of fingerprint module shown in FIG. 1；
Fig. 4 is the sectional view of the shell of fingerprint module shown in FIG. 1；
Fig. 5 is the sectional view of the fingerprint module of another embodiment.
Specific implementation mode
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms
It realizes, however it is not limited to embodiment described herein.Make to the utility model on the contrary, purpose of providing these embodiments is
The understanding of disclosure is more thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the utility model
The normally understood meaning of technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more relevant Listed Items.
As shown in Fig. 1~Fig. 2, a kind of fingerprint module 100 of this preferred embodiment, including circuit board 10, chip package knot
Structure 20 and cover board 30.Chip-packaging structure 20 is set to 10 side of circuit board, and cover board 30 is covered in chip-packaging structure 20 far from electricity
10 side of road plate.
Wherein, chip-packaging structure 20 includes packaging body 21 and chip 22, and packaging body 21 is opened up close to changing 30 side of cover board
There are the container 211 with bottom wall, chip 22 to be embedded in container 211.Chip 22 include chip body 222, pin 223,
Pad 224 and soldered ball 225, wherein pin 223 are embedded at chip body 222 and are electrically connected to chip body 222, and pad 224 is set
In chip body 222 towards 10 side of circuit board, soldered ball 225 is set on pad 224 and is electrically connected pad 224 and circuit board 10.
Connecting hole 2221 is offered in chip body 222, connecting hole 2221 extends to chip body 22 from pin 223 and is equipped with pad 225
Side, chip 22 further include wiring layer 226,226 electrical connection pins 223 of wiring layer, and extend to chip by connecting hole 2221
Main body 222 is electrically connected equipped with 225 side of pad with pad 225.
The chip body 22 of above-mentioned fingerprint module 100, chip-packaging structure 20 offers connecting hole 2221, therefore chip master
For pin 223 on body 22 by being electrically connected to pad 224 across the wiring layer 226 of connecting hole 2221, pad 224 passes through weldering in turn
Ball 225 is electrically connected to circuit board 10, to make chip body 22 be electrically connected with circuit board 10, without be additionally arranged for draw
The substrate that foot 223 is electrically connected simplifies the manufacturing process of fingerprint module 100 and keeps away to reduce the thickness of fingerprint module 100
Exempt from the cracking of chip body 22.In addition, packaging body 21 can play a protective role to chip 22, and since chip 22 is embedded at packaging body
22 in the container 211 of 30 side of cover board, therefore the cover board 30 for supporting setting thicker with stronger penetration capacity, carries
The high structural strength of the fingerprint module 100.
Wherein, packaging body 21 forms packaging body 21 by molded mode coating chip 22 using Shooting Technique
Material can be nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer) or PP (Polypropylene,
Polypropylene) etc..It will be apparent to a skilled person that the aforementioned manufacture that can be selected and the material that can be selected
Material, is illustrative only the mode that can implement of the utility model, is not the limitation of the utility model.Circuit board 10 is
Flexible PCB has the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good etc..Chip body 222 is that pure silicon is brilliant
Piece, buckling deformation is small and has higher intensity, to keep the thickness of the fingerprint module 100 more uniform, and it is smaller in thickness
In the case of have higher structural strength.
Please continue to refer to Fig. 1~Fig. 4, chip body 222 includes the first surface 2222 and second surface being oppositely arranged
2223, first surface 2222 is located at chip body 222 close to 30 side of cover board, and second surface 2223 is located at chip body 222 and leans on
Nearly 10 side of circuit board, pin 223 are embedded at first surface 2222, and pad 224 is protrudingly placed on second surface 2223, connecting hole
2221 through first surface 2222 and second surface 2223.In this way, connecting hole 2221 can will be located at the two of chip body 222
A opposite first surface 2222 is electrically connected with the pin 223 of second surface 2223 with pad 224, and then by being electrically connected to weldering
The soldered ball 225 of disk 224 is electrically connected with circuit board 10, and without the substrate for fitting in second surface 2222 is additionally arranged, there are no need
The conductive connecting that substrate is connected to after bypassing chip body 222 from pin 223 is set.
In the present embodiment, surface of the first surface 2222 Yu packaging body 21 of chip body 222 close to 30 side of cover board
It flushes.In this way, cover board 30 is held in the surface of packaging body 21 and chip body 222, chip body 222 is propped up jointly with packaging body 21
Cover board 30 is supportted to increase the structural strength of the fingerprint module 100.Also, since the first surface of packaging body 21 2222 is in direct contact
The surface of cover board 30, therefore there is stronger penetration capacity, so as to which thicker cover board 30 is arranged to protect chip body 222
While recognition speed and accuracy rate without influencing the fingerprint recognition structure 20.
Further, wiring layer 226 extends to the second surface of chip body 222 from pin 223 by connecting hole 2221
2223, soldered ball 225 is covered and is welded on part wiring layer 226 to be electrically connected with wiring layer 226.In this way, passing through connecting hole
2221 wiring layer 226 can will be located at the opposite first surface 2222 of chip body 222 two and second surface 2223
Pin 223 is electrically connected with pad 224, without the substrate for being electrically connected by conductive connecting with pin 223 is additionally arranged,
To reduce the thickness of the fingerprint module 100.In the present embodiment, wiring layer 226 is made of copper connecting line.
In the present embodiment, the quantity for the pin 223 being embedded on the first surface 222 in chip body 222 be it is multiple, it is more
A pin 223 is arranged in 22 one side edge of chip body along linear interval.Connecting hole 226, which is opened in chip body 222 and is equipped with, to be drawn
The region of foot 223 is to be located at 223 lower section of pin.
Further, chip 22 further includes solder mask 227, and solder mask 227 covers the second surface 2223 of chip body 222
And wiring layer 226, to prevent soldered ball 225 with scolding tin in the welding process of circuit board 10 is excessive that short circuit etc. is caused to ask
Topic, and wiring layer 226 can be protected to prevent wiring layer 226 and chip body 222 from making moist or being damaged.
Further, the first surface 2222 of chip body 222 is additionally provided with coating to play protection to chip body 22
Effect.Specifically, in the present embodiment, coating is formed by polyimides.
In one embodiment, as shown in figure 5, fingerprint module 100 further includes stiffening plate 40, stiffening plate 40 is set to circuit board 10
Far from 20 side of chip-packaging structure, to provide certain support for circuit plate 10, the structure for increasing fingerprint module 100 is strong
Degree.Specifically, stiffening plate 40 is set to circuit board 10 far from 20 side of chip-packaging structure by curing heat conduction gluing.
Further, as shown in Figure 1, fingerprint module 100 further includes fluid sealant 50, fluid sealant 50 is around the electricity being connected with each other
The outer rim of road plate 10 and chip-packaging structure 20, between the outer rim of potted circuit plate 10 and the outer rim of chip-packaging structure 20
Gap, to prevent the liquid in external environment from entering in fingerprint module 100 between circuit board 10 and chip-packaging structure 20,
To further increase the sealing water resistance of the fingerprint module 100.
Please continue to refer to Fig. 1, Fig. 2 and Fig. 4, fingerprint module 100 further includes shell 60, and shell 60 includes the bottom wall 62 and bottom of from
The first holding tank 66 is collectively formed in the side wall 64 that wall 62 is bent to form, bottom wall 62 and side wall 64, and connection the is offered on bottom wall 62
The size of second holding tank 68 of one holding tank 66, the second holding tank 68 is less than the first holding tank 66, cover board 30 and chip package
Structure 20 is contained in the first holding tank 66, and end face of the chip-packaging structure 20 far from 30 side of cover board is limited in bottom wall 62
On, circuit board 10 is located in the second holding tank 68.In this way, the structure of shell 60 and cover board 30, chip-packaging structure 20 and circuit
The shape of plate 10 is adapted, and is damaged to avoid cover board 30, chip-packaging structure 20 and circuit board 10.Also, due to chip
The thickness of encapsulating structure 20 is smaller, therefore can limit chip-packaging structure 20 by the bottom wall 62 of 60 inside of shell, therefore working as should
When fingerprint module 100 is installed on electronic equipment, the structures such as display module may extend to 100 lower section of fingerprint module, to expand
The screen accounting of the big electronic equipment for being equipped with the fingerprint module 100, saves the installation space in electronic equipment.
Further, marine glue 70 is filled between chip-packaging structure 20 and bottom wall 62, to close chip-packaging structure
Gap between 20 and bottom wall 62, to prevent the liquid in external environment from entering fingerprint module between cover board 30 and bottom wall 62
Chip-packaging structure 20 is damaged inside 100, makes the fingerprint module 100 that there is preferable sealing performance.
In one embodiment, as shown in figure 3, packaging body 21 offers glue groove 212, marine glue 70 close to 62 side of bottom wall
It is filled in glue groove 212.In this way, marine glue 70 is filled in the packaging body 21 of chip-packaging structure 20, to increase
The thickness of fingerprint module 100, and there is good sealed waterproof effect.
Above-mentioned fingerprint module 100, offer in the chip body 222 of chip-packaging structure 20 through first surface 2222 with
The connecting hole 2221 of second surface 2223, therefore it is embedded at the pin 223 of first surface 222 and the weldering positioned at second surface 224
Disk 224 can be electrically connected by the wiring layer 226 directly through connecting hole 2221, and there is no need to substrate is additionally arranged to be electrically connected to draw
Foot 223, to reduce the thickness of the fingerprint module 100.Also, chip body 222 is pure silicon wafer, and buckling deformation is small and has
There is higher intensity, to keep the thickness of the fingerprint module 100 more uniform, and in the case where thickness is smaller with higher
Structural strength.
Further, since chip body 222 is embedded at packaging body 21 and the first surface 2222 of chip body 22 exposes encapsulation
The surface of body 21, therefore thicker cover board can be set with preferable penetration capacity while with higher structural strength
30 make the fingerprint module 100 still have smaller thickness while coming to harm to avoid chip body 22.
As shown in Figure 1, a kind of electronic equipment of this better embodiment, can be that mobile phone, computer etc. are all kinds of.The electronics is set
Standby includes upper fingerprint module 100.
Electronic equipment includes main casing, and mounting groove is offered on the main casing, and fingerprint module 100 is embedded at mounting groove completely
It is interior.In this way, the fingerprint module 100 on the finger contacting electronic equipments of operator, you can input fingerprint in the electronic equipment.And
And display module not may extend to by the blocking of fingerprint module 100 below mounting groove, to set being conducive to reduce the electronics
The screen accounting of the electronic equipment is increased while standby volume.
Above-mentioned electronic equipment saves the electronic equipment since the thickness of the fingerprint module 100 of its setting is smaller
Inner space makes display module may extend to below mounting groove, screen is increased while keeping electronic equipment more lightening
Accounting.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of fingerprint module, which is characterized in that including：
Circuit board；
Chip-packaging structure is set to the circuit board side；And
Cover board is covered in the chip-packaging structure far from the circuit board side；
Wherein, the chip-packaging structure includes packaging body and chip, and the packaging body offers tool close to the cover board side
There are the container of bottom wall, the chip to be embedded in the container, the chip includes chip body, pin, pad and weldering
Ball, the chip body are flushed with the packaging body close to the surface of the cover board side close to one side surface of the cover board, institute
It states pin to be embedded at the chip body and be electrically connected to the chip body, the pad is set to the chip body towards institute
Circuit board side is stated, the soldered ball is set on the pad and is electrically connected the pad and the circuit board, the chip body
On offer connecting hole, the connecting hole extends to the chip body from the pin and is equipped with the pad side, the core
Piece further includes wiring layer, and the wiring layer is electrically connected the pin, and extends to the chip body by the connecting hole and set
There is the pad side to be electrically connected with the pad.
2. fingerprint module according to claim 1, which is characterized in that the chip body includes the first table being oppositely arranged
Face and second surface, the first surface are located at the chip body towards the cover board side, and the second surface is located at institute
Chip body is stated towards the circuit board side, the pin is embedded at the first surface, and the pad is protrudingly placed on described
On two surfaces, the connecting hole is through the first surface and the second surface.
3. fingerprint module according to claim 2, which is characterized in that the wiring layer passes through the connection from the pin
Hole extends to the second surface of the chip body, and the pad is covered on the wiring layer of part.
4. fingerprint module according to claim 3, which is characterized in that the chip further includes solder mask, the solder mask
Cover the region of second surface and the wiring layer not covered with the pad of the chip body.
5. fingerprint module according to claim 1, which is characterized in that the fingerprint module further includes fluid sealant, described close
Sealing is around the outer rim for the circuit board and the chip-packaging structure being connected with each other, and the fluid sealant is for sealing the electricity
Gap between the outer rim of road plate and the outer rim of the chip-packaging structure.
6. fingerprint module according to claim 1, which is characterized in that the fingerprint module further includes stiffening plate, the benefit
Strong plate is set to the circuit board far from the chip-packaging structure side.
7. fingerprint module according to claim 1, which is characterized in that the fingerprint module further includes shell, the shell
Including bottom wall and from the side wall that the bottom wall is bent to form, the first holding tank is collectively formed with the side wall in the bottom wall, described
The second holding tank for being connected to first holding tank is offered on bottom wall, the size of second holding tank is less than described first and holds
Receive slot, the cover board is contained in chip-packaging structure in first holding tank, and the chip-packaging structure is far from described
The end face of cover board side is limited on the bottom wall, and the circuit board is located in second holding tank.
8. fingerprint module according to claim 7, which is characterized in that filled out between the chip-packaging structure and the bottom wall
Filled with marine glue, to close the gap between the chip-packaging structure and the bottom wall.
9. fingerprint module according to claim 8, which is characterized in that the packaging body is opened close to the side of the circuit board
Equipped with glue groove, the marine glue is located in the glue groove.
10. a kind of electronic equipment, which is characterized in that including fingerprint module as claimed in any one of claims 1 to 9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721323709.0U CN207690105U (en) | 2017-10-13 | 2017-10-13 | Fingerprint module and electronic equipment equipped with the fingerprint module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721323709.0U CN207690105U (en) | 2017-10-13 | 2017-10-13 | Fingerprint module and electronic equipment equipped with the fingerprint module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207690105U true CN207690105U (en) | 2018-08-03 |
Family
ID=62986935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721323709.0U Active CN207690105U (en) | 2017-10-13 | 2017-10-13 | Fingerprint module and electronic equipment equipped with the fingerprint module |
Country Status (1)
| Country | Link |
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| CN (1) | CN207690105U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110188677A (en) * | 2019-05-29 | 2019-08-30 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
| CN112771663A (en) * | 2018-09-29 | 2021-05-07 | 华为技术有限公司 | Welding pad, electronic device, connection structure of electronic device and manufacturing method of welding resistance layer |
| RU2810232C2 (en) * | 2019-05-20 | 2023-12-25 | Хонор Дивайс Ко., Лтд. | Fingerprint recognition module and electronic device |
-
2017
- 2017-10-13 CN CN201721323709.0U patent/CN207690105U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112771663A (en) * | 2018-09-29 | 2021-05-07 | 华为技术有限公司 | Welding pad, electronic device, connection structure of electronic device and manufacturing method of welding resistance layer |
| RU2810232C2 (en) * | 2019-05-20 | 2023-12-25 | Хонор Дивайс Ко., Лтд. | Fingerprint recognition module and electronic device |
| CN110188677A (en) * | 2019-05-29 | 2019-08-30 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
| CN110188677B (en) * | 2019-05-29 | 2021-05-28 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Patentee after: Guangzhou delta Imaging Technology Co.,Ltd. Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Patentee before: Guangzhou delta Imaging Technology Co.,Ltd. Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Patentee after: Guangzhou delta Imaging Technology Co.,Ltd. Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Patentee before: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) Co.,Ltd. Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20210707 Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Patentee before: Guangzhou delta Imaging Technology Co.,Ltd. Patentee before: Jiangxi OMS Microelectronics Co.,Ltd. |
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