CN207690105U - Fingerprint module and electronic equipment equipped with the fingerprint module - Google Patents

Abstract

The utility model is related to a kind of fingerprint module and the electronic equipment equipped with the fingerprint module, fingerprint module include：Circuit board；Chip-packaging structure；Cover board is covered in chip-packaging structure；Chip-packaging structure includes packaging body and chip, packaging body offers container, chip is embedded in container, and chip includes chip body, pin, pad and soldered ball, and pin is embedded at chip body, pad is set to chip body, soldered ball is set on pad, connecting hole is offered in chip body, chip further includes wiring layer, wiring layer electrical connection pins, and extend to chip body by connecting hole and be electrically connected with pad.Above-mentioned fingerprint module, pin in chip body pad and then is electrically connected to circuit board by being electrically connected to pad across the wiring layer of connecting hole by soldered ball, to make chip body and circuit board electrical connection, to reduce the thickness of fingerprint module.In addition, packaging body can play a protective role to chip, there is stronger penetration capacity.

Description

Fingerprint module and electronic equipment equipped with the fingerprint module

technical field

The utility model relates to the technical field of fingerprint identification, in particular to a fingerprint module and electronic equipment provided with the fingerprint module.

Background technique

As an input device of human-computer interaction interface, touch screen is installed in various terminal devices and widely used in various fields. It plays an increasingly important role in people's life and social development. In order to realize the touch function of the screen, the touch screen is composed of a multi-layer structure, and the structure is relatively complicated. Moreover, since more and more personal information is stored during the use of the terminal equipment, a device is required to encrypt the terminal equipment. Since human fingerprints are formed by the joint action of genetics and the environment, their complexity is not only used for identification, but also has uniqueness and invariance. Therefore, fingerprint recognition is used as an encryption method for some terminal devices, which has good security performance and is convenient. The identification process is simple and fast, and it is convenient for the operator to use.

As a fingerprint module that completes the fingerprint identification function, due to its relatively thick thickness at present, it hinders the further reduction of the thickness of the smart device equipped with the fingerprint module, which is not conducive to the development of smart devices in the direction of thinner and lighter.

Utility model content

Based on this, it is necessary to provide a fingerprint module with a thinner thickness and an intelligent device equipped with the fingerprint module in order to solve the problem of a relatively thick fingerprint module.

A fingerprint module, comprising:

circuit board;

a chip packaging structure arranged on one side of the circuit board; and

a cover plate covering the side of the chip packaging structure away from the circuit board;

Wherein, the chip packaging structure includes a package body and a chip, and the side of the package body close to the cover plate is provided with a receiving groove with a bottom wall, the chip is embedded in the receiving groove, and the chip includes a chip Main body, pins, pads and solder balls, the pins are embedded in the chip main body and electrically connected to the chip main body, the pads are arranged on the side of the chip main body facing the circuit board, the The solder balls are arranged on the pads and are electrically connected to the pads and the circuit board, the chip body is provided with connection holes, and the connection holes extend from the pins to the chip body. On the side of the pad, the chip further includes a wiring layer, the wiring layer is electrically connected to the pin, and extends through the connection hole to the side of the chip body where the pad is provided with the pad. Disk electrical connection.

In the above-mentioned fingerprint module, the chip body of the chip packaging structure is provided with connection holes, so the pins on the chip body are electrically connected to the pads through the wiring layer passing through the connection holes, and the pads are then electrically connected to the circuit board through solder balls, thereby The main body of the chip is electrically connected to the circuit board without an additional substrate for electrical connection with the pins, thereby reducing the thickness of the fingerprint module, simplifying the manufacturing process of the fingerprint module and avoiding cracking of the main body of the chip. In addition, the package can protect the chip, and since the chip is embedded in the receiving groove on the side of the package close to the cover plate, it has stronger penetrating ability and supports the setting of a thicker cover plate, which improves the The structural strength of the fingerprint module.

In one of the embodiments, the chip body includes a first surface and a second surface opposite to each other, the first surface is located on the side of the chip body facing the cover plate, and the second surface is located on the side of the chip The main body faces the side of the circuit board, the pins are embedded on the first surface, the solder pads protrude from the second surface, and the connecting hole penetrates the first surface and the second surface. Two surfaces. In this way, the connection holes can electrically connect the pins on the two opposite first and second surfaces of the chip body to the pads, and then electrically connect the solder balls electrically connected to the pads to the circuit board without additional The substrate attached to the second surface does not need to arrange conductive connecting wires that bypass the chip body from the pins and then connect to the substrate.

In one embodiment, the wiring layer extends from the pin through the connection hole to the second surface of the chip body, and the pad covers part of the wiring layer. In this way, the wiring layer passing through the connection hole can electrically connect the pins respectively located on the two opposite first surfaces and the second surface of the chip body with the pads, without additional configuration for electrically connecting with the pins through conductive connecting wires substrate, thereby reducing the thickness of the fingerprint module.

In one of the embodiments, the chip further includes a solder resist layer, and the solder resist layer covers the second surface of the chip body and a region of the wiring layer not covered by the pad. In this way, problems such as short circuits caused by solder overflow caused by solder balls and circuit boards can be prevented, and the wiring layer can be protected to prevent the wiring layer and the main body of the chip from being damp or damaged.

In one embodiment, the edge of the circuit board is surrounded by sealant, and the sealant is used to seal the gap between the circuit board and the chip packaging structure. In this way, the liquid in the external environment can be prevented from entering the fingerprint module from between the circuit board and the chip packaging structure, thereby further improving the sealing and waterproof performance of the fingerprint module.

In one of the embodiments, the fingerprint module further includes a reinforcing plate, and the reinforcing plate is arranged on a side of the circuit board away from the chip packaging structure. In this way, a certain support can be provided for the circuit board, and the structural strength of the fingerprint module can be increased.

In one of the embodiments, the fingerprint module further includes a housing, the housing includes a bottom wall and a side wall bent from the bottom wall, the bottom wall and the side wall together form a first receiving groove , the bottom wall is provided with a second accommodating groove communicating with the first accommodating groove, the size of the second accommodating groove is smaller than that of the first accommodating groove, and the cover plate and the chip package structure are accommodated in the first accommodating groove and the end surface of the chip package structure away from the cover plate is limited on the bottom wall, and the circuit board is located in the second receiving groove. In this way, the structure of the shell is adapted to the shape of the cover plate, the chip package structure and the circuit board, so as to avoid the cover plate, the chip package structure and the circuit board from being damaged. Moreover, since the thickness of the chip packaging structure is small, the chip packaging structure can be limited by the bottom wall inside the housing, so when the fingerprint module is installed on the electronic device, the display module and other structures can extend to the fingerprint module. below, thereby expanding the screen-to-body ratio of the electronic device equipped with the fingerprint module, and saving the installation space in the electronic device.

In one of the embodiments, the gap between the chip packaging structure and the bottom wall is filled with waterproof glue to close the gap between the chip packaging structure and the bottom wall, so that liquid in the external environment can be prevented. Entering into the fingerprint module from between the cover plate and the bottom wall will damage the chip packaging structure, so that the fingerprint module has better waterproof and sealing performance.

An electronic device includes the above-mentioned fingerprint module.

The above-mentioned electronic device, because the thickness of the fingerprint module provided by it is small, thus saves the internal space of the electronic device, enables the display module to extend below the installation groove, and increases the screen size while making the electronic device thinner and thinner. Proportion.

Description of drawings

Fig. 1 is the sectional view of the fingerprint module of an embodiment;

Fig. 2 is the sectional view of the chip package structure of fingerprint module shown in Fig. 1;

Fig. 3 is a cross-sectional view of the package body of the fingerprint module shown in Fig. 1;

Fig. 4 is a sectional view of the shell of the fingerprint module shown in Fig. 1;

FIG. 5 is a cross-sectional view of a fingerprint module in another embodiment.

Detailed ways

In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present utility model are provided in the accompanying drawings. However, the invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present utility model more thorough and comprehensive.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of this invention. The terminology used in the description of the utility model herein is only for the purpose of describing specific embodiments, and is not intended to limit the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in FIGS. 1-2 , a fingerprint module 100 of this preferred embodiment includes a circuit board 10 , a chip packaging structure 20 and a cover plate 30 . The chip packaging structure 20 is disposed on one side of the circuit board 10 , and the cover plate 30 covers the side of the chip packaging structure 20 away from the circuit board 10 .

Wherein, the chip packaging structure 20 includes a package body 21 and a chip 22 , the package body 21 is provided with a receiving groove 211 with a bottom wall near the cover plate 30 , and the chip 22 is embedded in the receiving groove 211 . The chip 22 includes a chip body 222, pins 223, pads 224 and solder balls 225, wherein the pins 223 are embedded in the chip body 222 and are electrically connected to the chip body 222, and the pads 224 are located on the chip body 222 facing the circuit board 10- On the side, the solder ball 225 is disposed on the pad 224 and electrically connects the pad 224 and the circuit board 10 . The chip body 222 is provided with a connection hole 2221, the connection hole 2221 extends from the pin 223 to the side of the chip body 22 where the pad 225 is provided, the chip 22 also includes a wiring layer 226, the wiring layer 226 is electrically connected to the pin 223, and is connected The hole 2221 extends to the side of the chip body 222 where the bonding pad 225 is provided and is electrically connected to the bonding pad 225 .

In the above-mentioned fingerprint module 100, the chip body 22 of the chip packaging structure 20 is provided with a connection hole 2221, so the pin 223 on the chip body 22 is electrically connected to the pad 224 through the wiring layer 226 passing through the connection hole 2221, and the pad 224 further The solder balls 225 are electrically connected to the circuit board 10, so that the chip body 22 is electrically connected to the circuit board 10 without additionally providing a substrate for electrical connection with the pins 223, thereby reducing the thickness of the fingerprint module 100 and simplifying the process. The manufacturing process of the fingerprint module 100 is improved to prevent the chip main body 22 from cracking. In addition, the package body 21 can protect the chip 22, and since the chip 22 is embedded in the receiving groove 211 on the side of the package body 22 close to the cover plate 30, it has a stronger penetrating ability and supports the setting of a thicker The cover plate 30 improves the structural strength of the fingerprint module 100 .

Wherein, the package body 21 covers the chip 22 by molding, and the material of the package body 21 formed by injection molding process can be nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer) or PP (Polypropylene, polypropylene), etc. . It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate possible implementation methods of the present invention, and are not limitations of the present invention. The circuit board 10 is a flexible circuit board, which has the characteristics of high wiring density, light weight, thin thickness and good bendability. The chip body 222 is a pure silicon wafer, which has little warping deformation and high strength, so that the thickness of the fingerprint module 100 is more uniform, and has high structural strength when the thickness is small.

Please continue to refer to FIG. 1 to FIG. 4 , the chip body 222 includes a first surface 2222 and a second surface 2223 opposite to each other. On one side of the circuit board 10 , the pins 223 are embedded on the first surface 2222 , the pads 224 protrude from the second surface 2223 , and the connection holes 2221 penetrate the first surface 2222 and the second surface 2223 . In this way, the connection holes 2221 can electrically connect the pins 223 on the two opposite first surfaces 2222 and the second surfaces 2223 of the chip body 222 to the pads 224, and then connect the solder balls 225 electrically connected to the pads 224 to the pads 224. The circuit board 10 is electrically connected without an additional substrate attached to the second surface 2222 , and there is no need to provide conductive connecting wires that bypass the chip body 222 from the pins 223 and connect to the substrate.

In this embodiment, the first surface 2222 of the chip body 222 is flush with the surface of the package body 21 near the cover plate 30 . In this way, the cover plate 30 is pressed against the surfaces of the package body 21 and the chip body 222 , and the chip body 222 and the package body 21 jointly support the cover plate 30 to increase the structural strength of the fingerprint module 100 . Moreover, since the first surface 2222 of the package body 21 directly contacts the surface of the cover plate 30, it has a stronger penetrating ability, so that a thicker cover plate 30 can be provided to protect the chip main body 222 without affecting the fingerprint. The recognition speed and accuracy of the recognition structure 20.

Furthermore, the wiring layer 226 extends from the pin 223 to the second surface 2223 of the chip body 222 through the connection hole 2221 , and the solder ball 225 covers and welds a part of the wiring layer 226 to be electrically connected to the wiring layer 226 . In this way, the wiring layer 226 passing through the connection hole 2221 can electrically connect the pins 223 on the two opposite first surfaces 2222 and the second surfaces 2223 of the chip body 222 to the pads 224, without additional settings for connecting with the leads. The feet 223 are electrically connected to the substrate through conductive connecting wires, thereby reducing the thickness of the fingerprint module 100 . In this embodiment, the wiring layer 226 is composed of copper connection wires.

In this embodiment, the number of pins 223 embedded on the first surface 222 of the chip body 222 is multiple, and the multiple pins 223 are arranged at intervals along a straight line on one edge of the chip body 22 . The connection hole 226 is opened in the area of the chip body 222 where the lead 223 is disposed so as to be located below the lead 223 .

Further, the chip 22 also includes a solder resist layer 227, and the solder resist layer 227 covers the second surface 2223 of the chip body 222 and the wiring layer 226, so as to prevent the solder balls 225 from overflowing during the soldering process with the circuit board 10 and cause short circuits, etc. problems, and the wiring layer 226 can be protected to prevent the wiring layer 226 and the chip main body 222 from getting wet or being damaged.

Further, the first surface 2222 of the chip body 222 is further provided with a covering layer to protect the chip body 22 . Specifically, in this embodiment, the covering layer is formed of polyimide.

In one embodiment, as shown in FIG. 5 , the fingerprint module 100 further includes a reinforcing plate 40, and the reinforcing plate 40 is arranged on the side of the circuit board 10 away from the chip packaging structure 20, so as to provide a certain support for the circuit board 10 and increase the The structural strength of the fingerprint module 100. Specifically, the reinforcing plate 40 is glued on the side of the circuit board 10 away from the chip packaging structure 20 by curing the thermally conductive adhesive.

Further, as shown in FIG. 1, the fingerprint module 100 also includes a sealant 50, and the sealant 50 surrounds the outer edge of the interconnected circuit board 10 and the chip packaging structure 20 to seal the outer edge of the circuit board 10 and the chip packaging structure. The gap between the outer edges of 20 prevents the liquid in the external environment from entering the fingerprint module 100 from between the circuit board 10 and the chip packaging structure 20, thereby further improving the sealing and waterproof performance of the fingerprint module 100.

Please continue to refer to FIG. 1, FIG. 2 and FIG. 4, the fingerprint module 100 also includes a housing 60, the housing 60 includes a bottom wall 62 and a side wall 64 bent from the bottom wall 62, the bottom wall 62 and the side wall 64 together form a second A receiving groove 66, the bottom wall 62 is provided with a second receiving groove 68 communicating with the first receiving groove 66, the size of the second receiving groove 68 is smaller than that of the first receiving groove 66, and the cover plate 30 and the chip packaging structure 20 are accommodated in the first receiving groove 66. In the receiving groove 66 , and the end surface of the chip package structure 20 away from the cover plate 30 is bounded on the bottom wall 62 , and the circuit board 10 is located in the second receiving groove 68 . In this way, the structure of the housing 60 is adapted to the shapes of the cover plate 30 , the chip packaging structure 20 and the circuit board 10 , so as to prevent the cover plate 30 , the chip package structure 20 and the circuit board 10 from being damaged. And, because the thickness of the chip package structure 20 is small, the chip package structure 20 can be limited by the bottom wall 62 inside the casing 60, so when the fingerprint module 100 is installed on the electronic device, structures such as the display module can be extended. to the bottom of the fingerprint module 100, thereby expanding the screen ratio of the electronic device equipped with the fingerprint module 100, and saving the installation space in the electronic device.

Further, the gap between the chip package structure 20 and the bottom wall 62 is filled with waterproof glue 70 to close the gap between the chip package structure 20 and the bottom wall 62 , so as to prevent the liquid in the external environment from passing between the cover plate 30 and the bottom wall 62 If time enters into the fingerprint module 100 and damages the chip packaging structure 20, the fingerprint module 100 has better waterproof and sealing performance.

In one embodiment, as shown in FIG. 3 , a glue containing groove 212 is defined on a side of the package body 21 close to the bottom wall 62 , and the waterproof glue 70 is filled in the glue containing groove 212 . In this way, the waterproof glue 70 is filled in the package body 21 of the chip package structure 20, so that the thickness of the fingerprint module 100 will not be increased, and it has a good sealing and waterproof effect.

In the above-mentioned fingerprint module 100, the chip body 222 of the chip packaging structure 20 is provided with a connection hole 2221 penetrating through the first surface 2222 and the second surface 2223, so the pins 223 embedded in the first surface 222 are connected to the second surface 224. The pads 224 can be electrically connected through the wiring layer 226 passing directly through the connection hole 2221 , so there is no need to provide an additional substrate to electrically connect the pins 223 , thereby reducing the thickness of the fingerprint module 100 . Moreover, the chip main body 222 is a pure silicon wafer, with little warping deformation and high strength, so that the thickness of the fingerprint module 100 is more uniform, and has high structural strength when the thickness is small.

In addition, since the chip body 222 is embedded in the package body 21 and the first surface 2222 of the chip body 22 is exposed from the surface of the package body 21, it has high structural strength and good penetrating ability, and can be set thicker. The cover plate 30 prevents the chip main body 22 from being damaged while making the fingerprint module 100 still have a small thickness.

As shown in FIG. 1 , an electronic device in this preferred embodiment may be a mobile phone, a computer, and other types. The electronic device includes a fingerprint module 100 on it.

The electronic device includes a main casing, and the main casing is provided with an installation groove, and the fingerprint module 100 is completely embedded in the installation groove. In this way, the operator can input the fingerprint into the electronic device by touching the fingerprint module 100 on the electronic device with his finger. Moreover, the display module can extend below the installation slot without being blocked by the fingerprint module 100 , thereby increasing the screen ratio of the electronic device while reducing the volume of the electronic device.

The above-mentioned electronic device, because the thickness of the fingerprint module 100 it is provided with is small, thus saves the internal space of the electronic device, so that the display module can be extended to the bottom of the installation groove, which increases the thickness of the electronic device while making the electronic device thinner and thinner. screen-to-body ratio.

The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the utility model, and the description thereof is relatively specific and detailed, but it should not be understood as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the scope of protection of the utility model patent should be based on the appended claims.

Claims (10)

1. a kind of fingerprint module, which is characterized in that including：

Circuit board；

Chip-packaging structure is set to the circuit board side；And

Cover board is covered in the chip-packaging structure far from the circuit board side；

Wherein, the chip-packaging structure includes packaging body and chip, and the packaging body offers tool close to the cover board side There are the container of bottom wall, the chip to be embedded in the container, the chip includes chip body, pin, pad and weldering Ball, the chip body are flushed with the packaging body close to the surface of the cover board side close to one side surface of the cover board, institute It states pin to be embedded at the chip body and be electrically connected to the chip body, the pad is set to the chip body towards institute Circuit board side is stated, the soldered ball is set on the pad and is electrically connected the pad and the circuit board, the chip body On offer connecting hole, the connecting hole extends to the chip body from the pin and is equipped with the pad side, the core Piece further includes wiring layer, and the wiring layer is electrically connected the pin, and extends to the chip body by the connecting hole and set There is the pad side to be electrically connected with the pad.

2. fingerprint module according to claim 1, which is characterized in that the chip body includes the first table being oppositely arranged Face and second surface, the first surface are located at the chip body towards the cover board side, and the second surface is located at institute Chip body is stated towards the circuit board side, the pin is embedded at the first surface, and the pad is protrudingly placed on described On two surfaces, the connecting hole is through the first surface and the second surface.

3. fingerprint module according to claim 2, which is characterized in that the wiring layer passes through the connection from the pin Hole extends to the second surface of the chip body, and the pad is covered on the wiring layer of part.

4. fingerprint module according to claim 3, which is characterized in that the chip further includes solder mask, the solder mask Cover the region of second surface and the wiring layer not covered with the pad of the chip body.

5. fingerprint module according to claim 1, which is characterized in that the fingerprint module further includes fluid sealant, described close Sealing is around the outer rim for the circuit board and the chip-packaging structure being connected with each other, and the fluid sealant is for sealing the electricity Gap between the outer rim of road plate and the outer rim of the chip-packaging structure.

6. fingerprint module according to claim 1, which is characterized in that the fingerprint module further includes stiffening plate, the benefit Strong plate is set to the circuit board far from the chip-packaging structure side.

7. fingerprint module according to claim 1, which is characterized in that the fingerprint module further includes shell, the shell Including bottom wall and from the side wall that the bottom wall is bent to form, the first holding tank is collectively formed with the side wall in the bottom wall, described The second holding tank for being connected to first holding tank is offered on bottom wall, the size of second holding tank is less than described first and holds Receive slot, the cover board is contained in chip-packaging structure in first holding tank, and the chip-packaging structure is far from described The end face of cover board side is limited on the bottom wall, and the circuit board is located in second holding tank.

8. fingerprint module according to claim 7, which is characterized in that filled out between the chip-packaging structure and the bottom wall Filled with marine glue, to close the gap between the chip-packaging structure and the bottom wall.

9. fingerprint module according to claim 8, which is characterized in that the packaging body is opened close to the side of the circuit board Equipped with glue groove, the marine glue is located in the glue groove.

10. a kind of electronic equipment, which is characterized in that including fingerprint module as claimed in any one of claims 1 to 9 wherein.