CN109670371A - Fingerprint recognition mould group and electronic equipment equipped with the fingerprint recognition mould group - Google Patents
Fingerprint recognition mould group and electronic equipment equipped with the fingerprint recognition mould group Download PDFInfo
- Publication number
- CN109670371A CN109670371A CN201710952292.2A CN201710952292A CN109670371A CN 109670371 A CN109670371 A CN 109670371A CN 201710952292 A CN201710952292 A CN 201710952292A CN 109670371 A CN109670371 A CN 109670371A
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- Prior art keywords
- mould group
- fingerprint recognition
- fingerprint
- recognition chip
- thickness
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The present invention relates to a kind of fingerprint mould group and the electronic equipment equipped with the fingerprint mould group, fingerprint mould group includes circuit board and the fingerprint recognition chip packing-body being formed on circuit board, fingerprint recognition chip packing-body includes substrate, fingerprint recognition chip and encapsulation glue-line, encapsulation glue-line is located on substrate, and fingerprint recognition chip is contained in encapsulation glue-line；Wherein, fingerprint recognition chip is made of wafer twin polishing technique, fingerprint recognition chip with a thickness of 0.06mm~0.7mm, substrate with a thickness of 0.1mm~0.56mm.Above-mentioned fingerprint mould group, since the thickness of fingerprint recognition chip can be as thin as 0.1mm, and fingerprint recognition chip is made of wafer twin polishing technique, to make its thickness while meeting intensity requirement that can be as thin as 0.06mm, therefore thinner thickness while ensure that fingerprint recognition chip packing-body enough mechanical strength, reduce the integral thickness of fingerprint mould group, it to save the inner space for being equipped with the electronic equipment of the fingerprint mould group, may extend to the display module of electronic equipment below the fingerprint mould group.
Description
Technical field
The present invention relates to fingerprint identification technology fields, more particularly to a kind of fingerprint recognition mould group and are equipped with the fingerprint recognition
The electronic equipment of mould group.
Background technique
A kind of input unit of the touch screen as man-machine interactive interface, is installed on various terminal equipment, is widely applied
More and more important role is played in people's life and social development in every field.In order to realize the touch function of screen
Can, therefore touch screen is made of multilayered structure, structure is complex.Also, due in the use process of terminal device, storage
Personal information is more and more, it is therefore desirable to which device encrypts terminal device.Since the fingerprint of people is common by nature-nurture
It acts on and is formed, complexity is applied not only to identify, and also has uniqueness and invariance, therefore using fingerprint recognition as one
The cipher mode that a little terminal devices use has good security performance, and it is simple and fast to facilitate identification process, facilitates behaviour
The use of author.
Refer to hinder equipped with this as the fingerprint mould group for completing fingerprint identification function since current thickness is thicker
The thickness of the electronic equipment of line mould group further decreases, and is unfavorable for development of the electronic equipment to frivolous direction, is also unfavorable for electricity
The screen accounting of sub- equipment further increases.
Summary of the invention
Based on this, it is necessary to thicker for the thickness of fingerprint mould group and cause the screen accounting of electronic equipment is lesser to ask
Topic provides a kind of thinner thickness and makes the biggish fingerprint mould group of the screen accounting of electronic equipment and the electronics equipped with the fingerprint mould group
Equipment.
A kind of fingerprint mould group, it is described including circuit board and the fingerprint recognition chip packing-body being formed on the circuit board
Fingerprint recognition chip packing-body includes that substrate, fingerprint recognition chip and encapsulation glue-line, the encapsulation glue-line are located on the substrate,
The fingerprint recognition chip is contained in the encapsulation glue-line；Wherein, the fingerprint recognition chip uses wafer twin polishing work
Skill is made, the fingerprint recognition chip with a thickness of 0.06mm~0.7mm, the substrate with a thickness of 0.1mm~0.56mm.
Above-mentioned fingerprint mould group, since the thickness of substrate can be as thin as 0.1mm, and fingerprint recognition chip uses wafer twin polishing
Technique is made, to make its thickness while meeting intensity requirement that can be as thin as 0.06mm, therefore ensure that fingerprint recognition core
Thinner thickness while piece packaging body enough mechanical strength, reduces the integral thickness of fingerprint mould group, to save fingerprint mould
The placing space of group, thus may make fingerprint to ensconce in the hole TP completely, the display module of electronic equipment is made to may extend to the fingerprint
Below mould group, to improve screen accounting, be conducive to the electronic equipment equipped with the fingerprint mould group to high screen accounting, lightening
Direction is developed.On the other hand, the thickness of substrate can reach 0.56mm, and the thickness of fingerprint recognition chip can reach 0.7mm, have
Can mechanical strength with higher and be not easily susceptible to damage while can be to avoid the thickness due to substrate and fingerprint recognition chip
Cohesive force between fingerprint chip and substrate is caused to reduce and more conducting resinl is needed to be bonded together greatly very much.And work as substrate
Thickness be less than 0.1mm, when the thickness of fingerprint recognition chip is less than 0.06mm, be then difficult to ensure that fingerprint recognition chip packing-body has
There are enough mechanical strengths, so that fingerprint recognition chip packing-body be made to be easily damaged.When the thickness of substrate is greater than 0.56mm, fingerprint
When the thickness of identification chip is greater than 0.7mm, it will lead to the oversized of fingerprint recognition chip packing-body and significantly increase it and account for
The thickness of electronic equipment is greatly improved in space.On the other hand since the thickness of substrate and fingerprint recognition chip is too big
And cohesive force between fingerprint chip and substrate is caused to reduce and more conducting resinl is needed to be bonded together.
In one of the embodiments, the fingerprint recognition chip packing-body with a thickness of 0.3mm~1.31mm.In this way,
There is lesser thickness while intensity with higher, be conducive to the lightening of fingerprint mould group.
The fingerprint recognition chip packing-body is covered with explosion-proof far from the circuit board side in one of the embodiments,
Film.In this way, further increasing the intensity of fingerprint recognition chip packing-body.
The fingerprint mould group further includes cover board in one of the embodiments, and it is remote that the cover board is covered in the packaging body
From the substrate side.In this way, cover board can protect fingerprint recognition chip packing-body to avoid being damaged by external force.
Orthographic projection at least portion of the circuit board on the fingerprint recognition chip packing-body in one of the embodiments,
For quartile within the scope of the fingerprint recognition chip packing-body, the edge of the circuit board is surrounded with sealant, and the sealant is used
Gap between the edge and the fingerprint recognition chip packing-body for closing the circuit board.In this way, sealant is by circuit
While plate is fixed on fingerprint recognition chip packing-body, avoid environmental liquids from circuit board and fingerprint recognition chip packing-body it
Between gap enter the normally between circuit board and fingerprint recognition chip packing-body and influencing circuit, improve the fingerprint mould
The waterproof performance of group.
The fingerprint mould group further includes stiffening plate in one of the embodiments, and the stiffening plate is set to the circuit board
Far from fingerprint recognition chip packing-body side.In this way, the structural strength of circuit board can be enhanced as needed.
The circuit board is flexible circuit board in one of the embodiments,.In this way, circuit board have Distribution density it is high,
The feature light-weight, thickness is thin, bending is good etc..
The fingerprint mould group further includes frame in one of the embodiments, and one end of the frame offers the first appearance
Receive slot, first holding tank has bottom wall, offers the second holding tank on the bottom wall, the size of second holding tank is small
In the size of first holding tank, the fingerprint recognition chip packing-body is contained in first holding tank and is held in institute
It states on bottom wall.In this way, fingerprint mould group is simple for structure and compact, space hold is reduced, is conducive to equipped with the fingerprint mould group
The raising of the screen accounting of electronic equipment.
Marine glue is equipped between the fingerprint recognition chip packing-body and the bottom wall in one of the embodiments,.Such as
This is avoided environmental liquids from fingerprint recognition chip package to seal the gap between fingerprint recognition chip packing-body and bottom wall
Gap between body and bottom wall enters in frame, avoids the normal work for influencing fingerprint mould group, improves the waterproofness of fingerprint mould group
Energy.
A kind of electronic equipment, including above-mentioned fingerprint mould group, the electronic equipment offers mounting groove, and the frame is embedded
In in the mounting groove.
Above-mentioned electronic equipment saves the interior of the electronic equipment since the thickness of the fingerprint mould group of its setting is smaller
Portion space.Also, since fingerprint recognition chip packing-body supports on the bottom wall of frame, the bottom wall of frame be located at scuncheon and
Without outside projection, therefore the volume and cross-sectional area of the fingerprint mould group are reduced, makes electronic equipment internal that there is bigger peace
Space is filled, display module is may extend to below mounting groove, increases screen while keeping electronic equipment more lightening and account for
Than.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the fingerprint mould group of an embodiment；
Fig. 2 is the cross-sectional view of the fingerprint mould group of another embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in Figure 1, a kind of fingerprint mould group 100 of this better embodiment, including circuit board 10 and it is formed in circuit board
Fingerprint recognition chip packing-body 20 on 10.
Wherein, fingerprint recognition chip packing-body 20 is set on circuit board 10 and is electrically connected with circuit board 10, fingerprint recognition core
Piece packaging body 20 includes substrate 22, fingerprint recognition chip 24 and packaging body 26, and packaging body 26 is set to 22 side of substrate and and substrate
22 electrical connections, fingerprint recognition chip 24 are contained in packaging body 26, and fingerprint recognition chip is made of wafer twin polishing technique,
Fingerprint recognition chip 24 with a thickness of 0.06mm~0.7mm, substrate 22 with a thickness of 0.1mm~0.56mm.
Above-mentioned fingerprint mould group 100, since the thickness of substrate 22 can be as thin as 0.1mm, and fingerprint recognition chip 24 uses wafer
Twin polishing technique is made, to make its thickness while meeting intensity requirement that can be as thin as 0.06mm, therefore refers to ensure that
Thinner thickness while line identification chip 20 enough mechanical strengths of packaging body, reduces the integral thickness of fingerprint mould group 100, from
And the inner space for being equipped with the electronic equipment of the fingerprint mould group 100 is saved, may extend to the display module of electronic equipment
100 lower section of fingerprint mould group is conducive to the electronic equipment equipped with the fingerprint mould group 100 to Gao Ping to improve screen accounting
Curtain accounting, lightening direction are developed.On the other hand, the thickness of substrate 22 can reach 0.56mm, the thickness of fingerprint recognition chip 24
Can reach 0.7mm, have can mechanical strength with higher and be not easily susceptible to damage while can meet distinct electronic apparatuses
Size need.And when the thickness of substrate 22 is less than 0.1mm, and the thickness of fingerprint recognition chip 24 is less than 0.06mm, then it is difficult to
Guarantee that fingerprint recognition chip packing-body 20 has enough mechanical strengths, so that fingerprint recognition chip packing-body 20 be made to be easy damage
It is bad.When the thickness of substrate 22 is greater than 0.56mm, and the thickness of fingerprint recognition chip 24 is greater than 0.7mm, fingerprint recognition core will lead to
Piece packaging body 20 oversized and significantly increase its space occupied, the thickness of electronic equipment is greatly improved.
In the present embodiment, substrate can be by 60 μm of Doosan (bucket mountain Company Electronic material), Doosan40 μm, MGC (three
Water chestnut gas Chemical Co., Ltd.) materials such as 60 μm or PPT steel disc material are made, so as to reach certain Structural strength calls
In the case of so that thickness is reached 0.1mm.Wafer refers to circular silicon wafer used in silicon semiconductor production of integrated circuits, is passing through chemistry
And/or it is can be processed on the silicon wafer after mechanical means polishing and is fabricated to various circuit component structures and fingerprint recognition chip is made
24。
Please continue to refer to Fig. 1, substrate 22 with a thickness of 0.1mm~0.56mm, so as to guarantee certain structural strength
There is lesser thickness simultaneously, to reduce the thickness of fingerprint recognition chip packing-body 20, make fingerprint recognition chip packing-body 20
Integral thickness can be 0.3mm~1.31mm, to be conducive to fingerprint with lesser thickness while intensity with higher
Mould group 100 it is lightening.
Preferably, substrate 22 with a thickness of 0.15mm, thus the intensity with higher while with lesser thickness；
Fingerprint recognition chip 24 with a thickness of 0.15mm, packaging body 26 with a thickness of 0.2mm, table of the packaging body 26 far from 22 side of substrate
The distance between face and surface of the fingerprint recognition chip 24 far from 22 side of substrate are 0.05mm.In this way, fingerprint recognition chip seals
The integral thickness for filling body 20 is 0.3mm, to be conducive to fingerprint mould with lesser thickness while intensity with higher
Group 100 it is lightening, save the inner space for being equipped with the electronic equipment of the fingerprint mould group 100, make the display of electronic equipment
Mould group may extend to 100 lower section of fingerprint mould group and be conducive to the electricity equipped with the fingerprint mould group 100 to improve screen accounting
Sub- equipment develops to high screen accounting, lightening direction.
It is appreciated that fingerprint recognition chip packing-body 20 thickness it is without being limited thereto, can select as needed improve substrate 22,
The thickness of packaging body 26 and fingerprint recognition chip 24 is to meet different needs, to further increase the structure of fingerprint mould group 100
Intensity.
Further, fingerprint recognition chip packing-body 20 is covered with rupture pressure disc far from 10 side of circuit board, thus further
Improve the intensity of fingerprint recognition chip packing-body 20.
Fingerprint mould group 100 further includes cover board 40, and cover board 40 is covered in packaging body 26 far from 22 side of substrate to protect fingerprint
Identification chip packaging body 20 avoids being damaged by external force.In the present embodiment, cover board 40 with a thickness of 0.08mm~0.25mm, it is excellent
Selection of land, cover board 40 with a thickness of 0.14mm, thus while structural strength with higher have lesser thickness.More specifically
Ground, cover board 40 include the cover plate main body and ink layer being stacked, and cover plate main body is made of ceramic, wherein the thickness of cover plate main body
For 0.12mm, ink layer with a thickness of 0.02mm.
Further, it is additionally provided with glue film between cover board 40 and fingerprint recognition chip packing-body 20, which is used for cover board
40 are pasted on fingerprint recognition chip packing-body 20.In the present embodiment, glue film with a thickness of 0.02mm.
Circuit board 10 is electrically connected with substrate 22, to be electrically connected to fingerprint recognition chip 24 by substrate 22.The circuit board
10 be flexible circuit board, therefore has the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good etc..Further, base
Plate 22 is equipped with pad far from 26 side of packaging body, to be electrically connected by pad with circuit board 10, there is no need to lead to be arranged
Electric connection line and reserved routing space.In the present embodiment, the thickness of circuit board 10 is preferably 0.08mm.
Further, fingerprint mould group 100 further includes stiffening plate 50, and stiffening plate 50 is set to circuit board by solidifying thermally conductive gluing
10 far from 20 side of fingerprint recognition chip packing-body, to enhance the structural strength of circuit board 10.In this embodiment, stiffening plate 50
Thickness is equal to or more than 0.1mm, and the thickness for solidifying heat-conducting glue is preferably 0.03mm.It is appreciated that stiffening plate 50 and solidification are thermally conductive
The thickness of glue is without being limited thereto, can increase as needed to improve the structural strength of fingerprint mould group 100.Preferably, stiffening plate 50
With a thickness of 0.15mm, solidify heat-conducting glue with a thickness of 0.03mm.
As shown in Fig. 2, in other embodiments, stiffening plate 50 can also be not provided with.Circuit board 10 is sealed in fingerprint recognition chip
Orthographic projection on dress body 20 is at least partially disposed in 20 range of fingerprint recognition chip packing-body, and 10 edge of circuit board is surrounded with sealing
Glue 30 is with the gap between 10 edge of closed circuit plate and fingerprint recognition chip packing-body 20, to be fixed on by circuit board 10
While on fingerprint recognition chip packing-body 20, avoid environmental liquids between circuit board 10 and fingerprint recognition chip packing-body 20
Gap enter the normally between circuit board 10 and fingerprint recognition chip packing-body 20 and influencing circuit, improve the fingerprint
The waterproof performance of mould group 100.
Please continue to refer to Fig. 1, fingerprint mould group 100 further includes frame 60, and one end of frame 60 offers the first holding tank 62,
First holding tank 62 has bottom wall, and the second holding tank 64 is offered on bottom wall, and the size of the second holding tank 64 is accommodated less than first
The size of slot 62, fingerprint recognition chip packing-body 20 are contained in the first holding tank 62 and are held on bottom wall.In this way, due to referring to
Line identification chip packaging body 20, which is integrally located at, to be contained in the first holding tank 62 and is held on bottom wall, and circuit board 10 is contained in
In two holding tanks 64, therefore the fingerprint mould group 100 is simple for structure and compact, reduces space hold, is conducive to refer to equipped with this
The raising of the screen accounting of the electronic equipment of line mould group 100.
Further, marine glue 70 is equipped between fingerprint recognition chip packing-body 20 and bottom wall, to seal fingerprint recognition
Gap between chip packing-body 20 and bottom wall avoids environmental liquids from the seam between fingerprint recognition chip packing-body 20 and bottom wall
Gap enters in frame 60, avoids the normal work for influencing fingerprint mould group 100, improves the waterproof performance of fingerprint mould group 100.Specifically exist
In the present embodiment, marine glue 70 is completely covered by the bottom wall of frame 60, to have good waterproof sealing effect.
It is thin can to form thickness by using the lesser fingerprint recognition chip 24 of thickness and substrate 22 for above-mentioned fingerprint mould group 100
To the fingerprint recognition chip packing-body 20 of 0.3mm, and then forms the thickness when being not provided with stiffening plate 50 and be as thin as 0.75mm or be equipped with
Thickness is as thin as the fingerprint mould group 100 of 0.57mm when stiffening plate 50, makes fingerprint mould group 100 in the case where guaranteeing certain structural strength
Develop towards lightening direction.Also, since fingerprint recognition chip packing-body 20 supports on the bottom wall of frame 60, frame 60
Bottom wall is located at 60 inside of frame without outside projection, therefore reduces the volume and cross-sectional area of the fingerprint mould group 100.
As shown in Figure 1, a kind of electronic equipment (not shown) of this preferred embodiment, including above-mentioned fingerprint mould group 100, electricity
Sub- equipment includes main casing, and mounting groove is offered on main casing, and fingerprint mould group 100 is embedded in mounting groove to be installed on electronics
On the main casing of equipment.
Specifically, fingerprint mould group 100 is contained in completely in the mounting groove, so that display module be made to may extend under mounting groove
Side, to increase the screen accounting of the electronic equipment while being conducive to reduce the volume of the electronic equipment.Also, due to
Fingerprint mould group 100 is fully located in mounting groove and does not stretch out mounting groove, therefore the display module in electronic equipment is extensible
Below to mounting groove, to expand the screen accounting of the electronic equipment.
Above-mentioned electronic equipment saves the electronic equipment since the thickness of the fingerprint mould group 100 of its setting is smaller
Inner space.Also, since fingerprint recognition chip packing-body 20 supports on the bottom wall of frame 60, the bottom wall of frame 60 is located at side
60 inside of frame reduces the volume and cross-sectional area of the fingerprint mould group 100 without outside projection, makes electronic equipment internal
With bigger installation space, it may extend to display module below mounting groove, while keeping electronic equipment more lightening
Increase screen accounting.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of fingerprint mould group, which is characterized in that sealed including circuit board and the fingerprint recognition chip being formed on the circuit board
Body is filled, the fingerprint recognition chip packing-body includes that substrate, fingerprint recognition chip and encapsulation glue-line, the encapsulation glue-line are located at institute
It states on substrate, the fingerprint recognition chip is contained in the encapsulation glue-line；Wherein, the fingerprint recognition chip is double using wafer
Face polishing process is made, the fingerprint recognition chip with a thickness of 0.06mm~0.7mm, the substrate with a thickness of 0.1mm~
0.56mm。
2. fingerprint mould group according to claim 1, which is characterized in that the fingerprint recognition chip packing-body with a thickness of
0.3mm~1.31mm.
3. fingerprint mould group according to claim 1, which is characterized in that the fingerprint recognition chip packing-body is far from the electricity
Road plate side is covered with rupture pressure disc.
4. fingerprint mould group according to claim 1, which is characterized in that the fingerprint mould group further includes cover board, the cover board
The packaging body is covered in far from the substrate side.
5. fingerprint mould group according to claim 1, which is characterized in that the circuit board is in the fingerprint recognition chip package
Orthographic projection on body is at least partially disposed within the scope of the fingerprint recognition chip packing-body, and the edge of the circuit board is surrounded with close
Sealing, the sealant are used to close the gap between the edge of the circuit board and the fingerprint recognition chip packing-body.
6. fingerprint mould group according to claim 1, which is characterized in that the fingerprint mould group further includes stiffening plate, the benefit
Strong plate is set to the circuit board far from fingerprint recognition chip packing-body side.
7. fingerprint mould group according to claim 1, which is characterized in that the circuit board is flexible circuit board.
8. fingerprint mould group described in any one according to claim 1~7, which is characterized in that the fingerprint mould group further includes side
Frame, one end of the frame offer the first holding tank, and first holding tank has bottom wall, offers second on the bottom wall
Holding tank, the size of second holding tank are less than the size of first holding tank, and the fingerprint recognition chip packing-body is received
It is dissolved in first holding tank and is held on the bottom wall.
9. fingerprint mould group according to claim 8, which is characterized in that the fingerprint recognition chip packing-body and the bottom wall
Between be equipped with marine glue.
10. a kind of electronic equipment, which is characterized in that including the fingerprint mould group as described in claim 1~9, the electronic equipment
Including main casing, mounting groove is offered on the main casing, the fingerprint mould group is embedded in the mounting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710952292.2A CN109670371A (en) | 2017-10-13 | 2017-10-13 | Fingerprint recognition mould group and electronic equipment equipped with the fingerprint recognition mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710952292.2A CN109670371A (en) | 2017-10-13 | 2017-10-13 | Fingerprint recognition mould group and electronic equipment equipped with the fingerprint recognition mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109670371A true CN109670371A (en) | 2019-04-23 |
Family
ID=66138825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710952292.2A Withdrawn CN109670371A (en) | 2017-10-13 | 2017-10-13 | Fingerprint recognition mould group and electronic equipment equipped with the fingerprint recognition mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109670371A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110378255A (en) * | 2019-07-04 | 2019-10-25 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN110417963A (en) * | 2019-07-18 | 2019-11-05 | 维沃移动通信有限公司 | Terminal device |
| CN111126215A (en) * | 2019-12-13 | 2020-05-08 | 维沃移动通信有限公司 | Functional module and electronic equipment |
| CN111144339A (en) * | 2019-12-30 | 2020-05-12 | 业成科技（成都）有限公司 | Fingerprint identification module and electronic device |
| CN111273734A (en) * | 2020-01-22 | 2020-06-12 | Oppo广东移动通信有限公司 | Fingerprint module and electronic equipment who has it |
| WO2020259025A1 (en) * | 2019-06-28 | 2020-12-30 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
| CN113746959A (en) * | 2020-05-29 | 2021-12-03 | 青岛海信移动通信技术股份有限公司 | Electronic equipment |
| CN116503400A (en) * | 2023-06-26 | 2023-07-28 | 深圳明锐理想科技有限公司 | Chip glue overflow thickness calculating method and electronic equipment |
-
2017
- 2017-10-13 CN CN201710952292.2A patent/CN109670371A/en not_active Withdrawn
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020259025A1 (en) * | 2019-06-28 | 2020-12-30 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
| CN110378255A (en) * | 2019-07-04 | 2019-10-25 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN110417963A (en) * | 2019-07-18 | 2019-11-05 | 维沃移动通信有限公司 | Terminal device |
| WO2021008389A1 (en) * | 2019-07-18 | 2021-01-21 | 维沃移动通信有限公司 | Terminal device |
| CN111126215A (en) * | 2019-12-13 | 2020-05-08 | 维沃移动通信有限公司 | Functional module and electronic equipment |
| CN111144339A (en) * | 2019-12-30 | 2020-05-12 | 业成科技（成都）有限公司 | Fingerprint identification module and electronic device |
| CN111144339B (en) * | 2019-12-30 | 2023-03-24 | 业泓科技(成都)有限公司 | Fingerprint identification module and electronic device |
| CN111273734A (en) * | 2020-01-22 | 2020-06-12 | Oppo广东移动通信有限公司 | Fingerprint module and electronic equipment who has it |
| CN111273734B (en) * | 2020-01-22 | 2021-06-04 | Oppo广东移动通信有限公司 | Fingerprint module and electronic equipment who has it |
| CN113746959A (en) * | 2020-05-29 | 2021-12-03 | 青岛海信移动通信技术股份有限公司 | Electronic equipment |
| CN116503400A (en) * | 2023-06-26 | 2023-07-28 | 深圳明锐理想科技有限公司 | Chip glue overflow thickness calculating method and electronic equipment |
| CN116503400B (en) * | 2023-06-26 | 2023-09-15 | 深圳明锐理想科技有限公司 | Chip glue overflow thickness calculating method and electronic equipment |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 Nanchang Avenue, Nanchang high tech Zone, Nanchang, Jiangxi 1189 Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. |
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Application publication date: 20190423 |
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| WW01 | Invention patent application withdrawn after publication |