WO2020259025A1

WO2020259025A1 - Fingerprint module and mobile terminal

Info

Publication number: WO2020259025A1
Application number: PCT/CN2020/085293
Authority: WO
Inventors: 郑大峰
Original assignee: 维沃移动通信有限公司
Priority date: 2019-06-28
Filing date: 2020-04-17
Publication date: 2020-12-30
Also published as: CN110321831A

Abstract

A fingerprint module and a mobile terminal. The fingerprint module comprises: a circuit board (200); a conductive chip (410), the conductive chip (410) being provided on the circuit board (200); a fingerprint recognition chip (420), the fingerprint recognition chip (420) being provided on the surface of the side of the conductive chip (410) away from the circuit board (200), and the fingerprint recognition chip (420) being electrically connected to the circuit board (200) by means of the conductive chip (410); and a packaging layer (500), the packaging layer (500) wrapping the conductive chip (410) and the fingerprint recognition chip (420).

Description

Fingerprint module and mobile terminal

Cross references to related applications

This application claims the priority of Chinese Patent Application No. 201910579105.X filed in China on June 28, 2019, the entire content of which is incorporated herein by reference.

Technical field

The present disclosure relates to the technical field of fingerprint identification, and in particular to a fingerprint module and a mobile terminal.

Background technique

With the development of the mobile terminal industry, the constant pursuit of the ultimate in appearance and high screen-to-body ratio is a major development direction in related technologies, which can not only meet the appearance needs of consumers, but also meet the needs of consumers in audio-visual entertainment and other aspects. .

In order to increase the screen-to-body ratio of the mobile terminal, the fingerprint module can be arranged on the side of the mobile terminal. However, due to the limited thickness of the mobile terminal, the fingerprint recognition area of the fingerprint module is small, resulting in a lower fingerprint recognition rate of the fingerprint module of the fingerprint module. In addition, the encapsulation layer of the fingerprint module is thick, so that the fingerprint signal cannot effectively reach the fingerprint chip, which also leads to a low fingerprint recognition rate.

Summary of the invention

The embodiments of the present disclosure provide a fingerprint module and a mobile terminal to solve the problem of low fingerprint recognition rate.

In order to solve the above problems, the present disclosure adopts the following technical solutions:

A fingerprint module, including:

Circuit board

A conduction chip, the conduction chip is arranged on the circuit board;

A fingerprint identification chip, the fingerprint identification chip is arranged on a surface of the conduction chip facing away from the circuit board, and the fingerprint identification chip is electrically connected to the circuit board through the conduction chip;

An encapsulation layer that wraps the conduction chip and the fingerprint identification chip.

A mobile terminal includes a housing and the above-mentioned fingerprint module, and the fingerprint module is arranged on the housing.

The technical solution adopted by the present disclosure can achieve the following beneficial effects:

In the fingerprint module provided by the embodiment of the present disclosure, the fingerprint identification chip and the conduction chip are stacked, so most areas of the fingerprint identification chip can be set as the identification area, making the identification area larger, thereby improving the fingerprint identification rate. In addition, after the fingerprint identification chip and the conduction chip are stacked, the distance between the fingerprint identification chip and the surface of the packaging layer is smaller, that is, the thickness of the part of the packaging layer corresponding to the fingerprint identification chip is reduced, making the fingerprint signal more effective Reach the fingerprint recognition area, thereby improving the fingerprint recognition rate.

Description of the drawings

The drawings described here are used to provide a further understanding of the present disclosure and constitute a part of the present disclosure. The exemplary embodiments of the present disclosure and their descriptions are used to explain the present disclosure, and do not constitute an improper limitation of the present disclosure. In the attached picture:

FIG. 1 is a cross-sectional view of a partial structure of a mobile terminal disclosed in an embodiment of the disclosure.

Description of reference signs:

100-shell, 110-third curved surface, 200-circuit board, 210-circuit board body, 220-substrate, 410-conduction chip, 420-fingerprint recognition chip, 500-package layer, 510-second arc Shaped surface, 520-first plane, 600-reinforcing plate, 710-first wire, 720-second wire, 800-protective cover, 810-first curved surface, 820-body, 830-edge , 900-bonding layer.

Detailed ways

In order to make the objectives, technical solutions, and advantages of the present disclosure clearer, the technical solutions of the present disclosure will be described clearly and completely in conjunction with specific embodiments of the present disclosure and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present disclosure.

The technical solutions disclosed in each embodiment of the present disclosure will be described in detail below with reference to the accompanying drawings.

As shown in FIG. 1, an embodiment of the present disclosure discloses a mobile terminal. The mobile terminal includes a housing 100 and a fingerprint module. The fingerprint module is disposed on the housing 100. Specifically, the display module of the mobile terminal can be opened, and the fingerprint module can be provided at the corresponding opening of the display module. However, in order to increase the screen-to-body ratio of the mobile terminal, the fingerprint module can be installed on the side of the mobile terminal, namely The housing 100 has a side surface, a mounting hole is opened on the side surface, and the fingerprint module is mounted in the mounting hole. At this time, the fingerprint module does not occupy the display area of the mobile terminal, thereby increasing the screen-to-body ratio of the mobile terminal.

In the embodiment of the present disclosure, the fingerprint module may specifically include a circuit board 200, a conduction chip 410, a fingerprint identification chip 420, and a packaging layer 500. The circuit board 200 can be a flexible circuit board, and the circuit board 200 can be connected to the main board of the mobile terminal, so that the main board can control the working state of the fingerprint module. Specifically, the circuit board 200 may include a circuit board body 210 and a substrate 220, the substrate 220 is disposed on the circuit board body 210, and the substrate 220 may provide a mounting basis for the conduction chip 410 and the fingerprint recognition chip 420. The conduction chip 410 is arranged on the circuit board 200. Specifically, the conduction chip 410 is arranged on the surface of the substrate 220 away from the circuit board body 210. The main function of the conduction chip 410 is to realize the fingerprint identification chip 420 and the circuit board. Therefore, the conduction chip 410 is provided with a circuit area, the circuit area is provided with a connection circuit, and the conduction chip 410 is electrically connected to the circuit board 200 through the connection circuit. The fingerprint identification chip 420 is disposed on a surface of the conduction chip 410 away from the circuit board 200, and the fingerprint identification chip 420 is electrically connected to the circuit board 200 through the conduction chip 410. The fingerprint identification chip 420 is provided with an identification area, which can collect fingerprint information of the user, so as to determine whether the user's access operation is legal.

In the above fingerprint module, the fingerprint recognition chip 420 and the conduction chip 410 are stacked, so most areas of the fingerprint recognition chip 420 can be set as the recognition area, making the recognition area larger, thereby improving the fingerprint recognition rate. Specifically, the fingerprint identification chip 420 does not need to be provided with a circuit for connecting the circuit board 200, and the conduction chip 410 does not need to be provided with an identification area for identifying fingerprints. Therefore, the identification area on the fingerprint identification chip 420 and the conduction The circuit area on the chip 410 can be maximized. In addition, after the fingerprint identification chip 420 and the conduction chip 410 are stacked, the distance between the fingerprint identification chip 420 and the surface of the packaging layer 500 is smaller, that is, the thickness of the portion of the packaging layer 500 corresponding to the fingerprint identification chip 420 is reduced. Make the fingerprint signal reach the fingerprint recognition area more effectively, thereby improving the fingerprint recognition rate.

In addition, since the recognition area of the fingerprint recognition chip 420 can be set larger, while satisfying fingerprint recognition, the size of the fingerprint module can be appropriately reduced, so that the fingerprint module can be designed in the direction of miniaturization, which is beneficial to reduce The thickness of the mobile terminal.

Optionally, the fingerprint module disclosed in the embodiment of the present disclosure may further include a reinforcing plate 600 disposed on the side of the circuit board body 210 away from the substrate 220. The reinforcing plate 600 can realize the circuit board body 210, The reinforcement of the substrate 220, the conductive chip 410, the fingerprint identification chip 420 and other components makes the structure of the entire fingerprint module higher.

In an optional embodiment, the edge of the fingerprint identification chip 420 may be flush with the edge of the conduction chip 410, that is, the fingerprint identification chip 420 and the conduction chip 410 have the same shape and substantially the same size. However, this structure is not convenient for the electrical connection between the fingerprint recognition chip 420, the conduction chip 410 and the circuit board 200. Therefore, in order to facilitate the electrical connection of the three, the fingerprint recognition chip 420 is perpendicular to the fingerprint recognition chip 420. The projection of is located within the projection of the via chip 410. In other words, the fingerprint identification chip 420 and the conduction chip 410 form a stepped structure, so that the conduction chip 410 exceeds the fingerprint identification chip 420 by a certain distance, thereby reserving enough space to realize the fingerprint identification chip 420, the conduction chip 410, and the circuit board. 200 electrical connections.

In order to simplify the structure of the fingerprint module, the fingerprint recognition chip 420 may be electrically connected to the conduction chip 410 through the first wire 710, and the conduction chip 410 may be electrically connected to the circuit board 200 through the second wire 720, specifically, the conduction chip 410 It can be electrically connected to the substrate 220 through the second wire 720, and the substrate 220 is electrically connected to the circuit board body 210. The structure of the first wire 710 and the second wire 720 is relatively simple, and the space occupied by the two is relatively small, which makes the structure of the fingerprint module simpler. At this time, the packaging layer 500 may wrap the first wire 710 and the second wire 720, thereby protecting the first wire 710 and the second wire 720. Optionally, the first wire 710 and the second wire 720 may be metal wires.

In a further embodiment, the fingerprint module may further include a protective cover 800 disposed on the packaging layer 500, and the side of the protective cover 800 facing away from the packaging layer 500 is the first surface. Optionally, the protective cover 800 can be made of glass, acrylic, polyethylene terephthalate (PET), paint, and other materials, and the protective cover 800 can be connected to the encapsulation layer through the adhesive layer 900 500 fixed connection. When the fingerprint module is disposed on the side surface of the casing 100, in order to better adapt to the curved surface characteristics of the side surface, the edge of the first surface of the protective cover 800 is provided with a first curved surface 810. That is to say, the first surface is a curved surface, and the edge of the first surface can transition well with the side surface of the housing 100, so that when the user puts his finger on the protective cover 800, the hand feel is better, thereby enhancing the user experience.

When the protective cover 800 is provided with the above-mentioned first curved surface 810, the fingerprint identification chip 420 and the conduction chip 410 can be further arranged in a stepped structure, which can be more beneficial to ensure the curvature of the first curved surface 810, thereby facilitating The structure design of the fingerprint module.

The first surface of the protective cover 800 may be an arc-shaped surface as a whole, but the middle area of the protective cover 800 corresponds to the fingerprint recognition chip 420. If the first surface of the protective cover 800 is an arc-shaped surface as a whole, it will cause different areas of the finger The distance between the fingerprint identification chip 420 and the fingerprint identification chip 420 is different, which will adversely affect fingerprint identification. To this end, the protective cover 800 may include a main body portion 820 and an edge portion 830, and both sides of the main body portion 820 are connected to the edge portion 830. Among them, the main body 820 has a flat structure, and the user can align the center of the finger with the center of the main body 820, so that the distance between most of the user's finger and the fingerprint recognition chip 420 is basically the same, so as to facilitate fingerprint recognition; edge 830 In an arc structure, the first arc surface 810 is disposed on the edge portion 830. Specifically, the edge portion 830 here may be configured as a straight structure, and the main body portion 820 transitions to the side surface of the housing 100 through the edge portions 830 on both sides thereof.

When the above-mentioned first curved surface 810 is provided, the side of the encapsulation layer 500 facing the protective cover 800 can be set to be flat. At this time, there is a gap between the encapsulation layer 500 and the protective cover 800, resulting in a gap between the encapsulation layer 500 and the protective cover 800. The reliability of the connection between them deteriorates. To solve this problem, optionally, the side of the encapsulation layer 500 facing the protective cover 800 is provided with a second arc-shaped surface 510 corresponding to the first arc-shaped surface 810. In other words, the shape and size of the second arc-shaped surface 510 can be adapted to the first arc-shaped surface 810, so that the connection area between the packaging layer 500 and the protective cover 800 is larger, and the connection between the two is more reliable. At the same time, after the packaging layer 500 is provided with the second curved surface 510, the thickness of the entire packaging layer 500 is smaller, and the fingerprint signal can more reliably penetrate the packaging layer 500 and reach the fingerprint recognition chip 420, thereby further improving the fingerprint recognition rate.

When the protective cover 800 includes the main body portion 820, the encapsulation layer 500 is further provided with a first plane 520 on the side facing the protective cover 800. The first plane 520 and the main body portion 820 are arranged directly opposite to each other. Connect the second arc-shaped surface 510. After this arrangement, the connection area between the packaging layer 500 and the protective cover 800 can also be made larger, thereby improving the reliability of the connection between the two.

When the fingerprint module includes the protective cover 800, the side of the housing 100 is provided with a third arc-shaped surface 110, and the edge of the first arc-shaped surface 810 of the protective cover 800 is aligned with the edge of the third arc-shaped surface 110, This makes the protective cover 800 and the side of the housing 100 better transition, thereby improving the appearance and texture of the mobile terminal, and at the same time improving the user experience when holding the mobile terminal.

The mobile terminal disclosed in the embodiments of the present disclosure may be a smart phone, a tablet computer, an e-book reader or a wearable device. Of course, the mobile terminal may also be other devices, which is not limited in the embodiments of the present disclosure.

The above embodiments of the present disclosure focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the conciseness of the text, here is No longer.

The foregoing descriptions are merely embodiments of the present disclosure, and are not used to limit the present disclosure. For those skilled in the art, the present disclosure can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure should be included in the scope of the claims of the present disclosure.

Claims

A fingerprint module, including:

Circuit board (200);

A conduction chip (410), the conduction chip (410) is arranged on the circuit board (200);

Fingerprint identification chip (420), the fingerprint identification chip (420) is arranged on the surface of the conduction chip (410) facing away from the circuit board (200), and the fingerprint identification chip (420) passes through the The conduction chip (410) is electrically connected to the circuit board (200);

An encapsulation layer (500), the encapsulation layer (500) encapsulates the conduction chip (410) and the fingerprint identification chip (420).
The fingerprint module according to claim 1, wherein, in a direction perpendicular to the fingerprint identification chip (420), the projection of the fingerprint identification chip (420) is located within the projection of the conduction chip (410) .
The fingerprint module according to claim 1, wherein the fingerprint identification chip (420) is electrically connected to the conduction chip (410) through a first wire (710), and the conduction chip (410) passes through the The two wires (720) are electrically connected with the circuit board (200).
The fingerprint module according to claim 1, further comprising a protective cover plate (800), the protective cover plate (800) is disposed on the encapsulation layer (500), and the protective cover plate (800) faces away from the One surface of the encapsulation layer (500) is a first surface, and the edge of the first surface is provided with a first arc surface (810).
The fingerprint module according to claim 4, wherein the protective cover (800) comprises a main body (820) and an edge portion (830), and both sides of the main body (820) are connected to the edge portion (830), the main body part (820) is a flat plate structure, the edge part (830) is an arc structure, and the first arc surface (810) is disposed on the edge part (830).
The fingerprint module according to claim 5, wherein the side of the packaging layer (500) facing the protective cover (800) is provided with a second curved surface (810) corresponding to the first curved surface (810) 510).
The fingerprint module according to claim 6, wherein a side of the packaging layer (500) facing the protective cover (800) is further provided with a first plane (520), and the first plane (520) is connected to The main body (820) is arranged directly opposite, and both sides of the first plane (520) are connected to the second arc-shaped surface (510).
A mobile terminal, comprising a housing (100) and the fingerprint module according to any one of claims 1-7, the fingerprint module being arranged on the housing (100).
The mobile terminal according to claim 8, wherein the housing (100) has a side surface, and the side surface defines a mounting hole, and the fingerprint module is installed in the mounting hole.
The mobile terminal according to claim 9, wherein the fingerprint module further comprises a protective cover (800), the protective cover (800) is disposed on the packaging layer (500), the protective cover (800) The side facing away from the encapsulation layer (500) is the first surface, the edge of the first surface is provided with a first arc-shaped surface (810), and the side surface is provided with a third arc-shaped surface (110), The edge of the first arc-shaped surface (810) is aligned with the edge of the third arc-shaped surface (110).