WO2022134090A1

WO2022134090A1 - Capacitive fingerprint packaging structure, module, electronic device, and method

Info

Publication number: WO2022134090A1
Application number: PCT/CN2020/139667
Authority: WO
Inventors: 阙小奇; 刘相英
Original assignee: 深圳市汇顶科技股份有限公司
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2022-06-30

Abstract

The present application relates to the field of packaging, and in particular to a capacitive fingerprint packaging structure, a module, an electronic device, and a method for manufacturing a capacitive fingerprint module. The capacitive fingerprint packaging structure comprises at least three capacitive fingerprint sensors, wherein the at least three capacitive fingerprint sensors are arranged side by side and comprise a first capacitive fingerprint sensor, a second capacitive fingerprint sensor and a third capacitive fingerprint sensor. The first capacitive fingerprint sensor is located between the second capacitive fingerprint sensor and the third capacitive fingerprint sensor, the center of the upper surface of the first capacitive fingerprint sensor is higher than the center of the upper surface of the second capacitive fingerprint sensor, and the center of the upper surface of the first capacitive fingerprint sensor is higher than the center of the upper surface of the third capacitive fingerprint sensor. Setting the relationship between the heights of the centers of the upper surfaces of at least three capacitive fingerprint sensors alleviates the problem of the quality of fingerprint images being relatively poor.

Description

Capacitive fingerprint packaging structure, module, electronic device and method

technical field

The present application relates to the field of biometric identification, and in particular, to a capacitive fingerprint packaging structure, a module, an electronic device and a method.

Background technique

At present, with the development of biometric sensors, especially the rapid development of fingerprint recognition sensors, fingerprint recognition sensors are widely used in mobile terminal equipment, smart home, automotive electronics and other fields. As the years go by, the requirements of users for products are not only the pursuit of high quality and high performance, but have expanded to the diversification of appearance requirements, and the aesthetic vision of different user groups is also diversified. At present, the capacitive fingerprints in the mainstream market are all flat structures, which are not enough to adapt to the curved parts of mobile terminal devices. The surface of the side fingerprint (such as the capacitive fingerprint set near the power button) can be made into a curved surface, but the quality of the collected fingerprint image is poor, so that even for the target user, the fingerprint recognition success rate is low, and the user experience is poor.

SUMMARY OF THE INVENTION

Aiming at the problem of poor fingerprint image quality in the prior art, embodiments of the present application provide a capacitive fingerprint package structure, a module, an electronic device, and a method for manufacturing a capacitive fingerprint module.

A first aspect of the embodiments of the present application provides a capacitive fingerprint package structure, including at least three capacitive fingerprint sensors;

at least three capacitive fingerprint sensors arranged side by side;

The at least three capacitive fingerprint sensors include a first capacitive fingerprint sensor, a second capacitive fingerprint sensor and a third capacitive fingerprint sensor;

The first capacitive fingerprint sensor is located between the second capacitive fingerprint sensor and the third capacitive fingerprint sensor;

The center of the upper surface of the first capacitive fingerprint sensor is higher than the center of the upper surface of the second capacitive fingerprint sensor; the center of the upper surface of the first capacitive fingerprint sensor is higher than the center of the upper surface of the third capacitive fingerprint sensor.

According to the first aspect, in a possible implementation manner, the height of the center of the upper surface of the second capacitive fingerprint sensor is equal to the height of the center of the upper surface of the third capacitive fingerprint sensor.

According to the first aspect, in a possible implementation manner, an encapsulation material layer is further included, and the upper surface of the encapsulation material layer is an arc surface; the encapsulation material layer covers at least three capacitive fingerprint sensors.

According to the first aspect, in a possible implementation manner, the distance from the upper surfaces of the at least three fingerprint sensors to the upper surfaces of the packaging material layers corresponding to the at least three capacitive fingerprint sensors is 100um to 400um.

According to the first aspect, in a possible implementation manner, the lower surfaces of at least three capacitive fingerprint sensors are arranged on the same plane, the thickness of the first capacitive fingerprint sensor is greater than the thickness of the second capacitive fingerprint sensor, and the thickness of the first capacitive fingerprint sensor is larger than that of the second capacitive fingerprint sensor. The thickness is greater than that of the third capacitive fingerprint sensor.

According to the first aspect, in a possible implementation manner, the thickness of the second capacitive fingerprint sensor is equal to the thickness of the third capacitive fingerprint sensor.

According to the first aspect, in a possible implementation manner, the DAF adhesive layer of the wafer bonding film is further included; at least three capacitive fingerprint sensors are arranged side by side on the upper surface of the DAF adhesive layer;

It also includes a flexible circuit board FPC, and the DAF adhesive layer is arranged on the upper surface of the FPC;

Also includes a reinforcing plate, and the reinforcing plate is arranged on the lower surface of the FPC;

A gold wire is also included, and the gold wire is used to electrically connect the at least three capacitive fingerprint sensors and the FPC.

According to the first aspect, in a possible implementation manner, a substrate is further included, and at least three capacitive fingerprint sensors are arranged side by side above the substrate;

Also includes a wafer bonding film DAF adhesive layer, at least three capacitive fingerprint sensors are arranged side by side on the upper surface of the DAF adhesive layer; the DAF adhesive layer is arranged on the upper surface of the substrate;

Also includes an FPC, at least three capacitive fingerprint sensors are electrically connected to the FPC;

Also includes a solder layer, the solder layer is arranged between the substrate and the FPC for electrically connecting the substrate and the FPC;

It also includes gold wires, which are used to electrically connect at least three capacitive fingerprint sensors and the substrate; the substrate is a copper-clad laminate;

It also includes a reinforcing plate, and the reinforcing plate is arranged on the lower surface of the FPC.

According to the first aspect, in a possible implementation manner, the lower surfaces of the at least three capacitive fingerprint sensors are disposed on different planes.

According to the first aspect, in a possible implementation manner, a substrate is further included, the substrate is a ceramic substrate, and at least three capacitive fingerprint sensors are arranged side by side above the substrate;

The base plate includes a prism, the prism has at least four sides, and the sides of the prism at least include a first plane, a first inclined plane and a second inclined plane; the first plane is respectively connected with the first inclined plane and the second inclined plane;

The center of the first plane is higher than the center of the second inclined plane, and the center of the first plane is higher than the center of the third inclined plane;

The first capacitive fingerprint sensor, the second capacitive fingerprint sensor and the third capacitive fingerprint sensor are respectively disposed above the first plane, above the first inclined surface and above the second inclined surface.

According to the first aspect, in a possible implementation manner, the first inclined plane and the second inclined plane have the same inclination angle with respect to the horizontal plane, and the inclination angle is less than or equal to 15 degrees; the prism is a quadrangular prism or a hexagonal prism.

According to the first aspect, in a possible implementation manner, further comprising a first solder layer, a second solder layer and a third solder layer;

The first capacitive fingerprint sensor, the second capacitive fingerprint sensor and the third capacitive fingerprint sensor are respectively arranged on the upper surfaces of the first solder layer, the second solder layer and the third solder layer, and the first capacitive fingerprint sensor, the second capacitive fingerprint sensor and the The third capacitive fingerprint sensor is electrically connected to the substrate; the first solder layer, the second solder layer and the third solder layer are respectively arranged on the upper surface of the first plane, the upper surface of the first inclined plane and the upper surface of the second inclined plane;

The first solder layer, the second solder layer and the third solder layer are spaced apart from each other by the packaging material layer and the thicknesses of the first solder layer, the second solder layer and the third solder layer are equal; the packaging material layer is disposed above the substrate.

According to the first aspect, in a possible implementation manner, an FPC is further included, and at least three capacitive fingerprint sensors are electrically connected to the FPC;

TSV through holes are arranged in the at least three capacitive fingerprint sensors and in the substrate so that the at least three capacitive fingerprint sensors are electrically connected to the substrate. A fourth solder layer is arranged between the substrate and the FPC, and the fourth solder layer is used to electrically connect the substrate and the substrate. FPC;

It also includes a reinforcing plate, and the FPC is arranged on the upper surface of the reinforcing plate.

According to the first aspect, in a possible implementation manner, it further includes a flexible circuit board FPC, at least three capacitive fingerprint sensors are electrically connected to the FPC, a packaging material layer is provided on the upper surface of the substrate, and at least three capacitive fingerprint sensors are arranged side by side above the FPC;

The FPC includes a first FPC, a second FPC and a third FPC;

The first capacitive fingerprint sensor, the second capacitive fingerprint sensor, and the third capacitive fingerprint sensor are respectively connected to the first FPC, the second FPC, and the third FPC through electrical connectors; the first FPC, the second FPC, and the third FPC pass through the packaging material The layers are spaced apart from each other and one end of the first FPC, one end of the second FPC and one end of the third FPC are electrically connected; the electrical connections are gold wires;

The first FPC, the second FPC and the third FPC are respectively disposed above the first plane, above the first inclined plane and above the second inclined plane.

According to the first aspect, in a possible implementation manner, the DAF adhesive layer of the wafer bonding film is further included, and the DAF adhesive layer at least includes a first DAF adhesive layer, a second DAF adhesive layer and a third DAF adhesive layer;

The first capacitive fingerprint sensor is arranged on the upper surface of the first DAF adhesive layer, and the first DAF adhesive layer is arranged on the upper surface of the first FPC;

The second capacitive fingerprint sensor is arranged on the upper surface of the second DAF adhesive layer, and the second DAF adhesive layer is arranged on the upper surface of the second FPC;

The third capacitive fingerprint sensor is arranged on the upper surface of the third DAF adhesive layer, and the third DAF adhesive layer is arranged on the upper surface of the third FPC;

The first DAF adhesive layer, the second DAF adhesive layer and the third DAF adhesive layer are spaced apart from each other by the packaging material layer and the thicknesses of the first DAF adhesive layer, the second DAF adhesive layer and the third DAF adhesive layer are equal;

The lower surfaces of the first FPC, the second FPC and the third FPC are respectively provided with a first reinforcing plate, a second reinforcing plate and a third reinforcing plate, the first reinforcing plate, the second reinforcing plate and the third reinforcing plate The plates are spaced apart from each other by layers of encapsulation material and the thicknesses of the first reinforcing plate, the second reinforcing plate and the third reinforcing plate are equal;

The lower surfaces of the first reinforcing plate, the second reinforcing plate and the third reinforcing plate are respectively provided with a first thermosetting adhesive layer, a second thermosetting adhesive layer and a third thermosetting adhesive layer; the first thermosetting adhesive layer , the second thermosetting adhesive layer and the third thermosetting adhesive layer are separated from each other by the packaging material layer and the thicknesses of the first thermosetting adhesive layer, the second thermosetting adhesive layer and the third thermosetting adhesive layer are equal;

The first thermosetting adhesive layer, the second thermosetting adhesive layer and the third thermosetting adhesive layer are respectively disposed on the upper surface of the first plane, the upper surface of the first inclined plane and the upper surface of the second inclined plane of the substrate.

According to the first aspect, in a possible implementation manner, the substrate further includes a stepped structure, and the stepped structure is connected to the prism; the stepped structure includes a first stepped structure, a second stepped structure, and a third stepped structure;

The first stepped structure is arranged on the upper surface of one end of the first plane, and the height of the first stepped structure is equal to the height difference between the first plane and the lower surface of the first FPC;

The second stepped structure is arranged on the upper surface of one end of the first inclined surface, and the height of the second stepped structure is equal to the height difference between the first inclined surface and the lower surface of the second FPC;

The third stepped structure is disposed on the upper surface of one end of the second inclined surface, and the height of the third stepped structure is equal to the height difference between the second inclined surface and the lower surface of the third FPC.

According to the first aspect, in a possible implementation manner, the number of capacitive fingerprint sensors is three.

A second aspect of the embodiments of the present application provides a capacitive fingerprint module, comprising the capacitive fingerprint encapsulation structure according to any one of the first aspect, and further comprising an arc-shaped coating layer, and the arc-shaped coating layer is disposed on the packaging material The upper surface of the layer, the upper surface of the arc-shaped coating layer is an arc surface.

According to the second aspect, in a possible implementation manner, the distance from the upper surface of the at least three capacitive fingerprint sensors to the upper surface of the arc-shaped coating layer corresponding to the at least three capacitive fingerprint sensors is 170um to 500um, and the arc-shaped coating layer is 170um to 500um. The radius of the arc surface of the cladding is 0.8 to 8 mm.

A third aspect of the embodiments of the present application provides an electronic device, which is characterized by comprising: a circuit board and the capacitive fingerprint module according to any one of the second aspects, wherein the capacitive fingerprint module and the circuit board are connected by device connection.

A fourth aspect of the embodiments of the present application provides a method for manufacturing a capacitive fingerprint module, which is applied to manufacturing the capacitive fingerprint module according to any one of the second aspects, and is characterized in that, it includes:

The encapsulation material layer is processed by computer numerical control CNC surface processing and polishing to form an arc-shaped encapsulation sheet;

The upper surface of the encapsulation material layer of the arc-shaped encapsulation sheet is coated to form an arc-shaped coating layer.

A fifth aspect of the embodiments of the present application provides a method for manufacturing a capacitive fingerprint module, which is applied to manufacturing the capacitive fingerprint module according to any one of the second aspects, and is characterized in that, it includes:

An arc-surface encapsulation sheet whose upper surface of the encapsulation material layer is an arc surface is produced by a plastic encapsulation process; the upper surface of the encapsulation material layer of the arc-shaped encapsulation sheet is coated to form an arc-shaped coating layer.

Compared with the prior art, the beneficial effects of the embodiments of the present application are: the embodiments of the present application provide a capacitive fingerprint packaging structure, a module, an electronic device, and a method for making a capacitive fingerprint module, by setting at least three capacitive fingerprints. The relationship between the height of the center of the upper surface of the sensor improves the problem of poor fingerprint image quality.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

1 is a top view of a capacitive fingerprint module according to an embodiment of the present application;

2 is a cross-sectional view of the capacitive fingerprint module shown in FIG. 1 according to an embodiment of the present application;

3 is a cross-sectional view of another capacitive fingerprint module shown in FIG. 1 provided by an embodiment of the present application;

4 is a top view of a capacitive fingerprint module according to an embodiment of the present application;

5 is a cross-sectional view of the capacitive fingerprint module shown in FIG. 4 according to an embodiment of the present application;

6 is a cross-sectional view of another capacitive fingerprint module shown in FIG. 4 provided by an embodiment of the present application;

7 is a flowchart of a method for manufacturing a capacitive fingerprint module provided by an embodiment of the present application;

8 is a cross-sectional view of a capacitive fingerprint package structure provided by an embodiment of the present application;

9 is a cross-sectional view of another capacitive fingerprint packaging structure provided by an embodiment of the present application;

10 is a flowchart of a method for manufacturing a capacitive fingerprint module provided by an embodiment of the present application;

11 is a top view of a capacitive fingerprint module provided by an embodiment of the application;

12 is a cross-sectional view of the capacitive fingerprint module shown in FIG. 11 according to an embodiment of the present application;

13 is a cross-sectional view of yet another capacitive fingerprint module shown in FIG. 11 provided by an embodiment of the present application;

14 is a cross-sectional view of a capacitive fingerprint package structure provided by an embodiment of the application;

15 is a cross-sectional view of yet another capacitive fingerprint package structure provided by an embodiment of the present application;

16 is a top view of a capacitive fingerprint module provided by an embodiment of the application;

17 is a cross-sectional view of the capacitive fingerprint module shown in FIG. 16 according to an embodiment of the present application;

18 is a cross-sectional view of another capacitive fingerprint module shown in FIG. 16 provided by an embodiment of the present application;

19 is a cross-sectional view of a capacitive fingerprint package structure provided by an embodiment of the application;

20 is a cross-sectional view of yet another capacitive fingerprint package structure provided by an embodiment of the present application;

21 is a top view of a capacitive fingerprint module provided by an embodiment of the application;

22 is a cross-sectional view of the capacitive fingerprint module shown in FIG. 21 according to an embodiment of the present application;

23 is a cross-sectional view of yet another capacitive fingerprint module shown in FIG. 21 provided by an embodiment of the present application;

FIG. 24 is a schematic structural diagram of a substrate provided by an embodiment of the present application;

FIG. 25 is a cross-sectional view of yet another capacitive fingerprint module shown in FIG. 11 according to an embodiment of the present application.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present application clearer, some embodiments of the present application will be described in detail below by way of examples in conjunction with the accompanying drawings. However, one of ordinary skill in the art will appreciate that in each instance, numerous technical details are set forth in order to provide the reader with a better understanding of the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present application can be realized.

For a long time, the capacitive fingerprint module has always adopted the traditional structure, which is basically a square or circular plane contact structure. The user feels uncomfortable and unsightly in use, and in harsh environments such as windy sand and dust, the Dust will be easily adsorbed on the flat contact structure, resulting in misjudgment of fingerprint recognition when the capacitive fingerprint module is in use. The effective solution is to use a curved capacitive fingerprint structure scheme. This new structural design scheme improves the fingerprint recognition module. After it is installed on the whole machine, the whole machine is more beautiful in appearance, and the user It feels comfortable in the hand and has a three-dimensional sense visually. On the other hand, the arc three-dimensional design can avoid damage to the entire capacitive fingerprint recognition module when the mobile phone is dropped.

The capacitive fingerprint module provided by the embodiment of the present application is shown in FIG. 1 , which is a top view of the curved fingerprint module. The curved fingerprint module 100 includes a capacitive fingerprint sensor 101 and a substrate 102 . For convenience of description, the capacitance The fingerprint sensor is represented by Die, Die101 is electrically connected to the substrate 102, and the substrate 102 is located under the Die101, and the module 100 further includes an FPC (Flexible Printed Circuit, flexible circuit board) 103 and a reinforcing steel plate (or called a reinforcing plate, Steel reinforcement, reinforcement steel sheet) 108, reinforcement steel plate 108 is used to fix connectors and electronic devices such as resistors, capacitors, MCUs, etc. The connector is used for capacitive fingerprint sensors to be connected with other circuits in the electronic device to realize the fingerprint identification function, The capacitors, resistors, MCU and other electronic devices are used to cooperate with Die101 to realize the fingerprint collection function. According to the A-A dotted line of the curved fingerprint module shown in Figure 1, the sectional view of the curved fingerprint module shown in Figure 2 can be obtained. The sectional view of the curved fingerprint module shown in FIG. 3 can be obtained by cutting the dotted line B-B of the curved fingerprint module shown in FIG. 1 .

As shown in the sectional view of the curved fingerprint module shown in FIG. 2 , the substrate 102 is connected to the FPC 103 by soldering and then underfilling the colloid, that is, there may be a solder layer 107 between the FPC 103 and the substrate 102. The solder layer 107 includes Solder and colloid. The module 100 may further include a DAF (Die Attach Film) adhesive layer 104, and the Die 101 can be directly pasted on the substrate 102 through the DAF adhesive layer 104, and then the Die can be realized by means of WB (Wire Bonding, wire bonding). Electrical connection to the substrate 102 . The module 100 may further include an EMC (Epoxy Molding Compound, epoxy resin molding compound or epoxy molding compound) layer 105. The EMC layer 105 may be fabricated by a Molding (injection molding or plastic encapsulation) process, and then CNC is performed on the EMC layer. (Computer numerical control, computer numerical control) surface processing and polishing process to form the EMC arc surface 105a, and finally a coating process is performed on the EMC arc surface 105a to form an arc-shaped coating layer 106. The module 100 A reinforcing steel plate 108 is also included, and the reinforcing steel plate 108 is arranged on the lower surface of the FPC 103 . The upper and lower surfaces of the arc-shaped coating layer are both arc surfaces. It is worth noting that, for the center of the upper surface of Die, the distance from the center of the upper surface 101a of the Die to the surface 106a of the arc-shaped coating layer 106 D1 is easily too large, and the distance from the edge of the upper surface 101a of the Die to the surface 106a of the arc-shaped coating layer 106 is easily too small, and the distance from the edge of the upper surface 101a of the Die to the surface 106a of the arc-shaped coating layer 106 is too small It may reduce the reliability of the module, and if D1 is too large, the imaging quality of the fingerprint will be affected. If the distance from the upper surface 101a of the upper surface 101a to the surface 106a of the arc-shaped coating layer 106 is too large, the imaging quality of the fingerprint will be reduced.

In this embodiment, the encapsulation material layer may include one or more materials for encapsulation, for example, a thermosetting resin such as epoxy resin, or the encapsulation material layer may also refer to a gas layer, such as an air gap. In this embodiment, the packaging material layer is illustrated by taking the EMC layer as an example. In this embodiment, the center of the plane figure can be understood as the intersection of the diagonals. For example, if the upper surface of the Die is a rectangle, the center of the upper surface of the Die is the intersection of the diagonals of the rectangle. If the upper surface of the Die is If it is a circle, the center of the upper surface of Die is the center of the circle.

As shown in the cross-sectional view of the curved fingerprint module shown in FIG. 3 , the Die 101 can be directly pasted on the substrate 102 through the DAF adhesive layer 104 , and then the electrical connection between the Die and the substrate 102 can be realized through the gold wire 109 by WB. The reinforcing steel sheet 108 is arranged below the FPC 103 for fixing the capacitive fingerprint sensor. In addition, in this embodiment, a part of the reinforcing steel plate is arranged below the FPC103 for fixing the capacitive fingerprint sensor, and another part of the reinforcing steel plate can also be arranged on the upper part of the FPC103 for fixing the connector 1010 and the resistor, capacitor, MCU, etc. The electronic device 1011 is used for connecting the capacitive fingerprint sensor with other components in the electronic device to realize the fingerprint identification function.

Based on the contents disclosed in the foregoing embodiments, the capacitive fingerprint module provided by the embodiments of the present application may include at least 3 Dies, and specifically, may include an odd number of Dies, such as 5 Dies or 7 Dies, and the odd number of Dies may be symmetrically arranged side by side Distributed above the substrate to adapt to the thin thickness of electronic devices. The embodiment of the present application takes three Dies as an example for illustrative description, and the situation that there are other numbers of Dies in a module can be derived according to the embodiment of the present application. It should be noted that compared with the case where more Dies are set in the module, when 3 Dies are set in the module, the quality of the fingerprint image can be improved, the cost is lower, and the area is smaller, which is more in line with the The fingerprint recognition is applied to the scene of the whole machine.

Based on the content disclosed in the above embodiments, the top view of the curved fingerprint module provided by the embodiment of the present application is shown in FIG. 4 , and the curved fingerprint module 400 includes three Dies, which are the second capacitive fingerprint sensor 401a, the first The capacitive fingerprint sensor 401b and the third capacitive fingerprint sensor 401c, the module 400 further includes an FPC 403 and a substrate 402, and the substrate 402 is electrically connected to the three Dies and is located below the three Dies. The module 400 also includes a reinforcing steel plate 408. The reinforcing steel plate 408 is used for fixing connectors and electronic devices such as resistors, capacitors, and MCUs. The connectors are used to connect the capacitive fingerprint sensor to other circuits in the electronic equipment. Such electronic devices are used to cooperate with the

capacitive fingerprint sensors

401a, 401b and 401c to realize the fingerprint collection function. According to the A-A dotted line of the curved fingerprint module shown in FIG. 4, the sectional view of the curved fingerprint module shown in FIG. 5 can be obtained, The sectional view of the curved fingerprint module shown in FIG. 6 can be obtained by cutting according to the B-B dotted line of the curved fingerprint module shown in FIG. 4 .

Please refer to the cross-sectional view of the curved fingerprint module shown in FIG. 5 , the substrate 402 is connected to the FPC 403 through solder and a colloid is filled at the bottom of the substrate, that is, a solder layer 407 may also be provided between the FPC and the substrate 402. The solder layer includes solder and Colloid, the solder layer is used for the electrical connection between the FPC and the substrate, and the colloid is used to strengthen the physical connection between the FPC and the substrate. In this embodiment, the substrate is a copper-clad laminate, which facilitates the electrical connection between Die and the substrate through WB. The module 400 may further include a DAF adhesive layer 404, and the Dies 401a, 401b and 401c can be directly pasted on the substrate 402 through the DAF adhesive layer 404, and the Die is electrically connected to the substrate 402 by means of WB. In this embodiment, a DAF adhesive layer is arranged on the lower part of each Die to correspond to the Die, and the DAF adhesive layers of the three Dies can also be connected as a whole. The module 400 may further include an EMC layer 405. The EMC layer 405 may be fabricated by a Molding process, and then a CNC surface machining and polishing process is performed on the EMC layer to form an EMC arc surface 405a on the upper surface of the EMC layer. The surface 405a is coated to form an arc-shaped coating layer 406. Specifically, the arc-shaped coating layer 406 may include ink. The module 400 further includes a reinforcing steel sheet 408 , and the reinforcing steel sheet 408 is arranged below the FPC 403 . In this embodiment, the packaging material layer is described by taking the EMC layer as an example, the upper surface 405a of the packaging material layer is an arc surface, and the packaging material layer 405 covers the

Die

401a, 401b and 401c.

Please refer to the cross-sectional view of the curved fingerprint module as shown in FIG. 6 , the Die 401b can be directly pasted on the substrate 402 through the DAF adhesive layer 404 , and then the electrical connection between the Die and the substrate 402 can be realized through the gold wire 409 by WB. The capacitive fingerprint sensor is connected to the substrate 402 through an electrical connector, the electrical connector is a gold wire, and the packaging material layer 405 also covers the gold wire 409 . The reinforcing steel sheet 408 is arranged on the lower surface of the FPC403 for fixing the capacitive fingerprint sensor. In addition, in this embodiment, a part of the reinforcing steel plate can be placed on the lower surface of the FPC403 to fix the capacitive fingerprint sensor, and another part of the reinforcing steel plate can also be placed on the upper surface of the FPC403 to fix the connector 4010 and the resistor and capacitor , MCU and other electronic devices 4011, the connector is used to connect the capacitive fingerprint sensor with other circuits in the electronic device to realize fingerprint recognition, the capacitor, resistor, MCU and other electronic devices 4011 are used to cooperate with capacitive fingerprint sensors Die401a, 401b and 401c to realize fingerprint Collection function.

It can be understood that, in order to make the fingerprint identification module more three-dimensional in appearance of the whole machine and bring a new experience to the user group, the height D2 of the arc-shaped part of the arc-shaped coating layer is required to be larger. The distances D11, D12, and D13 from the surface of the die to the surface of the coating layer should not be too small or too large. If D11 and D13 are too small, the distance between the edge of the die and the top surface of the arc-shaped coating layer 406 may be too close. The reliability is reduced. Too large D11, D12, and D13 may affect the imaging quality of the fingerprint due to the long detection distance. Therefore, the distance from the surface of the Die to the surface of the coating layer should be set within a reasonable range, which can improve the accuracy of fingerprint recognition. degree and guarantee reliability to improve user experience. If Die401a, Die401b, and Die401c are set on the same level and the heights of Die401a, Die401b, and Die401 are the same, the distance from the center of the upper surface of Die401b to the upper surface of the arc-shaped coating layer may be relatively large, so the quality of fingerprint imaging cannot be guaranteed, and The larger the height D2 of the arc-shaped coating layer, the smaller the contact area between the fingerprint and the arc structure, which reduces the quality of the collected fingerprint image. In this case, the three Dies have the same height and are placed in the same The horizontal plane may be set up in a way that does not meet user needs.

In the embodiment of the present application, the three Dies shown in FIG. 5 are arranged side by side in the fingerprint module. The center of the upper surface of Die401b is higher than the center of the upper surfaces of Die401a and Die401c. This module structure can compensate for Due to the height difference between the arc-shaped coating layer and the upper surface of the Die caused by the height D2 of the arc-shaped part of the arc-shaped fingerprint module, in order to realize that the height of the arc-shaped part of the arc-shaped coating layer is larger, Fingerprint recognition is also possible.

It can be understood that if the fingerprint identification module is installed on the side key of the mobile phone, the curved surface of the fingerprint identification module has a certain height difference. Generally speaking, the distance from the upper surface 406a of the arc-shaped coating layer to the edge of the middle frame (not shown in the figure) of the mobile phone is greater than 0.8 mm. In order to meet user requirements, the height D2 of the arc-shaped part of the arc-shaped coating layer can be set To be greater than or equal to 0.5 mm, in this embodiment, the height of the arc-shaped portion of the arc-shaped coating layer can be understood as the vertical distance from the arc top of the arc-shaped coating layer to the arc edge of the arc-shaped coating layer. In this embodiment, the arc-shaped coating layer may coat the entire surface of the EMC layer, or only the upper surface of the EMC layer, which is not limited in this embodiment. In the figure, the arc-shaped coating layer is used to coat the entire EMC layer. The surface of the layer will be described as an example. The R angle of the upper surface 406a of the arc-shaped coating layer can be 0.8-8 mm, that is, the radius of the arc surface of the arc-shaped coating layer can be set to 0.8-8 mm to meet the needs of users; The vertical distances D11, D12 and D13 of the upper surface 406a of the coating can be set to 170um-500um, and the vertical distance D3 of the Die surface to the EMC arc surface 405a of the EMC layer 405 can be set to 100um-400um. While improving the quality of the fingerprint recognition image while ensuring the reliability, it is understandable that the smaller the distance between the upper surface of the Die and the upper surface of the arc-shaped coating layer, the higher the quality of the obtained fingerprint recognition image, but the higher the quality of the fingerprint recognition image obtained. The smaller the distance from the surface to the upper surface of the arc-shaped coating layer, the lower its reliability, for example, it is not easy to pass the drop test in the reliability test, the upper surface of at least three fingerprint sensors to at least three fingerprint sensors corresponding The distance of the upper surface of the arc-shaped coating layer is set to 170um-500um, that is, the distance from each point of the upper surface of the at least three fingerprint sensors to the upper surface of the arc-shaped coating layer facing it is set to be 170um-500um, The image quality and reliability of fingerprint recognition can be well balanced. Specifically, the distance from the upper surface of the at least three fingerprint sensors to the upper surface of the packaging material layer facing the at least three fingerprint sensors can be set to 100um to 400um; for arc The thickness of the curved coating layer is designed. If the curved coating layer is a matte surface, its thickness can be set to 30um; if the curved coating layer is a high-gloss surface, its thickness is 40um. The thickness can also be set to 70um.

It can be seen from Figures 4 and 5 that the fingerprint module contains 3 Dies, the thickness and width of 401a and 401c are the same, the thickness of 401b is larger, and the center of the upper surface of 401b is the same as the center of the arc coating layer. Correspondingly, the three Dies are arranged side by side on the substrate, and are pasted on the substrate 402 through the DAF adhesive layer. The substrate 402 can be pasted on the FPC 403 through the Surface Mounted Technology (SMT) process, and the first capacitive fingerprint sensor 401b is located at Between the second capacitive sensor 401a and the third capacitive fingerprint sensor 401c, the center of the upper surface of the first capacitive fingerprint sensor 401b is higher than the center of the upper surface of the second capacitive fingerprint sensor 401a, and the center of the upper surface of the first capacitive fingerprint sensor 401b The center is also higher than the center of the upper surface of the third capacitive fingerprint sensor 401c, which can compensate for the drop between the curved coating layer and the surface of Die caused by D2. The substrate is attached to the FPC through the SMT process. The FPC and The reinforcing plates 408 are pressed together by hot pressing glue, and the solder needs to be filled with colloid, and then encapsulated by the EMC process. The top surface of the EMC layer after the packaging process is completed is flat. According to the requirements of different clients, the top surface of the EMC layer can be processed into arc surfaces with different curvatures through CNC surface processing and polishing treatment, and finally the arc coating can be obtained by coating. The upper surface of the cladding layer is a capacitive fingerprint module with an arc surface. The capacitive fingerprint module is attached to the side buttons of the mobile phone, and can be directly connected to the motherboard of the whole machine through the FPC and the connector. This design can meet the large curvature of the curved surface. This fingerprint module solution compatible with at least three capacitive fingerprint sensors has a higher tolerance for the angle of the user's pressing, and can achieve multi-angle unlocking, at least three After the capacitive fingerprint sensor collects the fingerprint image, the fingerprint can be recognized by splicing.

Based on the contents disclosed in the above embodiments, in this embodiment, the upper surface of the substrate 402 is flat, Die401a, Die401b, and Die401 are arranged above the substrate 402, and the center of the upper surface of the second capacitive fingerprint sensor 401a is relative to the height of the substrate 402 It is equal to the height of the center of the upper surface of the third capacitive fingerprint sensor 401 c relative to the substrate 402 . In this embodiment, the second capacitive fingerprint sensor and the third capacitive fingerprint sensor are arranged symmetrically. It can be understood that if five capacitive fingerprint sensors are provided, that is, the fourth capacitive fingerprint sensor and the fifth capacitive fingerprint sensor , the fourth capacitive fingerprint sensor and the fifth capacitive fingerprint sensor can also be arranged symmetrically. The three capacitive fingerprint sensors are arranged on the same plane, the thickness of 401b is greater than that of 401a, and the thickness of 401b is greater than that of 401c. By setting different thicknesses of Die to compensate for the height difference caused by the curved surface of the curved fingerprint, the height difference can be improved. The quality of the collected fingerprint images is guaranteed to be reliable. In this embodiment, since the substrate 402 is horizontal, it can be understood that the thicknesses of 401a and 401c are the same, so that the second capacitive fingerprint sensor and the third capacitive fingerprint sensor can be the same capacitive fingerprint sensor, and no additional cost is required. The process of making the second capacitive fingerprint sensor and the third capacitive fingerprint sensor with different thicknesses can save costs.

Based on the content disclosed in the foregoing embodiments, please refer to FIG. 7 , the present embodiment provides a method for making a fingerprint module for making the capacitive fingerprint module disclosed in the foregoing embodiments, and the method includes the following steps:

S701: perform CNC surface processing and polishing on the packaging material layer to form an arc-shaped packaging sheet;

S702: Coating the upper surface of the encapsulation material layer of the arc-shaped encapsulation sheet to form an arc-shaped coating layer.

Specifically, please refer to the encapsulation sheet shown in FIG. 8 , encapsulate three dies 801a, 801b and 801c to form an encapsulation sheet 800. The encapsulation sheet 800 includes a DAF adhesive layer 804 disposed on the lower surface of the Die. The substrate 802 is connected, the lower surface of the substrate 802 is provided with a solder layer 807, the substrate 802 is electrically connected to the FPC 803 through the solder layer 807, and a reinforcing plate 808 is provided on the lower surface of the FPC 803. The packaging sheet shown in FIG. 8 is after the packaging process is completed. Flat packaging sheet, the upper surface of the flat packaging sheet is flat. After the encapsulation material layer 805 of the flat encapsulation sheet is CNC surface processed and polished in step S701 , the arc-shaped encapsulation sheet 900 shown in FIG. 9 can be formed. Compared with the encapsulation sheet 800, the arc-shaped encapsulation sheet 900 has the upper surface of the encapsulation material layer EMC805 changed from the flat surface to the upper surface of the 905, that is, from the flat surface to the curved surface. 902, solder layer 907, FPC903 and reinforcing plate 908 are the same as or similar to the corresponding Die801a, 801b, 801c, DAF adhesive layer 804, substrate 802, solder layer 807, FPC803 and reinforcing plate 808 in FIG. Repeat. In this embodiment, the CNC curved surface can be processed into cambered surfaces with different angles, for example, regular cambered surfaces or irregular cambered surfaces. Specifically, the curvature of the cambered surfaces is not limited.

The fingerprint module shown in FIG. 5 can be formed by coating the arc-shaped encapsulation sheet shown in FIG. 9 , and the arc-shaped coating layer 406 can be formed on the upper surface of the EMC by coating the surface of the arc-shaped encapsulation sheet. .

Based on the content disclosed in the foregoing embodiments, the present embodiment provides a method for making a fingerprint module. Please refer to FIG. 10 . This embodiment provides a method for making a fingerprint module, which includes the following steps:

S1001: A curved surface encapsulation sheet whose upper surface of the encapsulation material layer is an arc surface is produced by a plastic encapsulation process;

S1002: Coating the upper surface of the encapsulation material layer of the arc-shaped encapsulation sheet to form an arc-shaped coating layer.

Specifically, in the packaging process, an arc-surface Molding mold can be made to make an arc-shaped EMC layer, without the need for CNC surface processing and polishing, that is, step S1001 can be used instead of step S701, and the arc-surface Molding mold can be used to make the arc surface. shape EMC to form the encapsulation sheet shown in FIG. 9 , and then step S1002 is performed. Before the coating process, that is, the surface of the EMC is already arc-shaped before the arc-shaped coating layer is made, and it does not need to be processed by CNC surface processing and polishing. , after the arc-shaped EMC layer is made by making an arc-shaped Molding mold, the upper surface of the arc-shaped EMC layer is directly coated. Surfaced and polished.

This embodiment provides a curved capacitive fingerprint solution. By adopting the design of three Die packages, it is ensured that the distance between the surface of the curved coating layer and the three Die surfaces is kept within the fingerprint surface when the finger contact surface is curved. Identify the required distance to improve the accuracy of fingerprint identification. Using the curved fingerprint module of this embodiment, the curvature of the curved coating layer can be larger, the user experience is closer to ergonomics, the appearance of the whole machine is more three-dimensional, and the reliability is high, and the fingerprint will not be affected. recognition accuracy.

Based on the contents disclosed in the above embodiments, the present embodiment provides a capacitive fingerprint module. By using three Dies in the fingerprint module for packaging, a substrate is also proposed. The substrate is, for example, a ceramic substrate. Die is mounted above the ceramic substrate. With this package structure, the height difference between the arc surface of the arc coating layer and the surface of the Die caused by the height difference of the arc part of the arc coating layer can be compensated , this setting method can meet the requirements of a wide range of arc surface curvature, the distances from the surfaces of multiple Dies to the surface of the arc-shaped coating layer are similar and within a reasonable range, and the reliability of the normal identification of fingerprints can be realized at the same time. high.

The curved fingerprint module provided by the embodiment of the present application is shown in FIG. 11 . The curved fingerprint module 1100 includes three Dies, which are a second capacitive fingerprint sensor 1101a, a first capacitive fingerprint sensor 1101b, and a third capacitive fingerprint sensor, respectively. 1101c, the module 1100 further includes an FPC 1103 and a substrate 1102. The substrate is, for example, a ceramic substrate. The substrate 1102 is electrically connected to the three Dies and is located below the three Dies. The module 1100 also includes a reinforcing steel plate 1108. The reinforcing steel plate 1108 is used for fixing connectors and electronic devices such as resistors, capacitors, and MCUs. The connectors are used to connect the capacitive fingerprint sensor to the mobile phone. The capacitors, resistors, MCUs and other electronic devices are used for In order to cooperate with the

capacitive fingerprint sensors

1101a, 1101b and 1101c to realize the fingerprint acquisition function, the sectional view of the curved capacitive fingerprint module shown in FIG. 12 can be obtained by cutting the dotted line A-A of the curved capacitive fingerprint module shown in FIG. The sectional view of the curved capacitive fingerprint module shown in FIG. 13 can be obtained by cutting the B-B dotted line of the curved fingerprint module shown in FIG. 11 .

Since the curved surface of the side key fingerprint has a height difference, and the side key has a certain movement stroke, generally speaking, the distance from the curved coating layer to the edge of the middle frame of the mobile phone (not shown in the figure) is greater than 0.8mm. Please refer to FIG. 12 , the vertical height D2 from the surface 1106a of the arc-shaped coating layer 1106 to its edge is greater than or equal to 0.5mm, and the R angle of the arc-shaped coating layer is designed to be 0.8～8mm, that is, the radius of the arc surface can be set to 0.8～8mm 8mm; in addition, the distances D111, D112, D113 from the upper surfaces of the three Dies to the upper surface 1106a of the arc-shaped coating layer 1106 can be set to 170um-500um, and each point of the upper surfaces of the three Dies is directly opposite to the distance D111, D112, D113. The distances D111, D112, D113 of the upper surface 1106a of the arc-shaped coating layer 1106 can be set to 170um-500um, and the distances D114, D115, D116 of the upper surface of Die to the upper surface 1105a of the EMC layer 1105 can be set to 100-400um, The distances D114, D115, and D116 from the upper surfaces of the three Dies to the upper surface 1105a of the EMC layer 1105 facing them can be set to 100-400um, which is set to improve the quality of the acquired fingerprint recognition images and ensure reliability. For the thickness of the arc-shaped coating layer 1106, if the arc-shaped coating layer is a matte material layer, the thickness of the arc-shaped coating layer can be set to 30um; if the arc-shaped coating layer is a high-gloss material layer, the arc-shaped coating layer The thickness of the shape coating layer can be set to 40um. In this embodiment, the upper surface of the EMC layer 1105 is an arc surface, and the EMC layer covers three capacitive fingerprint sensors.

It can be seen from Figures 11 and 12 that the fingerprint module contains 3 Dies. The thickness and width of Die1101a, Die 1101b and Die 1101c can be consistent. The lower surfaces of Die1101a, Die 1101b and Die 1101c are set on different planes. , Die 1101b and Die 1101c can be respectively attached to the three sides of the substrate 1102 as shown in FIG. 12 through the SMT process. Specifically, the substrate 1102 can be a ceramic substrate. As shown in FIG. 12 , the ceramic substrate can include prisms , the prism includes at least four sides, wherein, the four sides at least include a first inclined plane, a second inclined plane and a first plane. Specifically, the ceramic substrate may include a quadrangular prism or a hexagonal prism. For example, the ceramic substrate is a hexagonal prism. As an example, the upper and lower bottom surfaces are hexagonal, the hexagonal prism has six sides, and the side surfaces at least include a first inclined surface 1102a, a first flat surface 1102b and a second inclined surface 1102c. The first plane 1102b is connected with the first inclined plane 1102a and the second inclined plane 1102c. The inclination angles of the first inclined plane 1102a and the second inclined plane 1102c can be the same. Above the first plane 1102b and the second inclined plane 1102c, the ceramic substrate adopts the bottom wiring scheme to avoid the increase in the size of the substrate due to the surrounding wiring. The upper and lower surfaces of the ceramic substrate can also be formed by electroplating. Through the through silicon via (TSV) process for electrical connection, for example, specifically, TSV through

holes

1112a, 1112b and 1112c can be provided inside Die1101, Die 1101b and Die1101c, respectively, for electrical connection with the ceramic substrate 1102 For connection, inside the ceramic substrate 1102, TSV through

holes

1113a, 1113b, 1113c are correspondingly arranged to connect with the TSV through

holes

1112a, 1112b and 1112c in the Die respectively; A slope with a certain slope, the angle of the slope is determined according to the radius of the upper surface of the curved coating layer of the fingerprint module and the thickness of the Die. In this embodiment, the angle of the slope can be understood as the acute angle formed between the slope and the horizontal plane. For example, the angle of the inclined plane can be 60 degrees, 45 degrees, 30 degrees or 15 degrees, etc. When the inclination angle of the inclined plane is less than or equal to 15 degrees, each point on the upper surface of the Die is coated with an arc that is opposite to it. The vertical distance between the coating layers is similar, and it is convenient to set the distance between the upper surface of the Die and the upper surface of the arc-shaped coating layer within a preset distance, so as to ensure reliability and high quality of fingerprint recognition images at the same time. Compared with the solution in which the ceramic substrate is a quadrangular prism, when the ceramic substrate is configured as a hexagonal prism, the problem that the inclination angle of the inclined plane is too small to realize the process, or the reliability is low, is avoided.

In this embodiment, Die1102a and Die1102c are respectively attached to the two

inclined surfaces

1102a and 1102c, and the surfaces of Die1102a and Die1102c are inclined at a predetermined angle relative to the FPC1103 to face the arc-shaped coating layer, that is, the upper surface of the Die and the upper surface of the Die. The tangent line of the arc-shaped coating layer facing the center of the surface is parallel, which can compensate the drop between the surface of the arc-shaped coating layer and the surface of the Die caused by the height difference of the arc-shaped coating layer. The substrate is attached on the FPC1103 through the SMT process, and the FPC1103 and the reinforcing plate 1108 can be pressed together with hot glue. In this embodiment, colloid needs to be filled at the soldering tin, and then the encapsulation protection layer is fabricated through the EMC process. The TSV process is used for electrical connection between Die1101a, Die1101b and Die1101c and their corresponding three

surfaces

1102a, 1102b and 1102c of the ceramic substrate 1102 respectively, and a second solder layer 1107a and a first solder layer are provided 1107b and the third solder layer 1107c to realize the electrical connection between the Die and the ceramic substrate, the 1107a, 1107b and 1107c also include filled colloid for strengthening the connection between the Die and the ceramic substrate. When the ceramic substrate 1102 is attached to the FPC1103 through the SMT process, a fourth solder layer 1107z may be provided between the ceramic substrate 1102 and the FPC1103 for electrical connection between the ceramic substrate 1102 and the FPC1103. The 1107z also includes a filled colloid, Used to strengthen the connection between the ceramic substrate 1102 and the FPC 1103. The three capacitive fingerprint sensors are connected to the substrate 1102 through electrical connectors. In this embodiment, the electrical connectors include

solder layers

1107a, 1107b and 1107c, which are respectively disposed on the

second solder layers

1107a, 1107a, The thicknesses of the first solder layer 1107b and the third solder layer 1107c are equal. In this embodiment, the second solder layer 1107a, the first solder layer 1107b and the third solder layer 1107c are separated from each other by the EMC layer.

As shown in the cross-sectional view of the curved fingerprint module shown in FIG. 13 , the Die1101b can be directly pasted on the ceramic substrate 1102 through the solder layer 1107b , and then passed through the TSV through holes 1112b provided in the Die1101b and the TSV through holes 1113b provided in the ceramic substrate 1102 Realize the electrical connection between Die1101b and FPC1103. The reinforcing steel sheet 1108 is arranged on the lower surface of the FPC1103 for fixing the capacitive fingerprint sensor. In addition, in this embodiment, a part of the reinforcing steel plate can be placed on the lower surface of the FPC1103 to fix the capacitive fingerprint sensor, and another part of the reinforcing steel plate can also be placed on the upper surface of the FPC1103 to fix the connector 1110 and the resistor and capacitor , MCU and other electronic devices 1111, the connector is used to connect the capacitive fingerprint sensor to the circuit such as the motherboard in the mobile phone to realize fingerprint recognition, the capacitor, resistor, MCU and other electronic devices are used to cooperate with the capacitive fingerprint sensor Die1101a, 1101b and 1101c to realize fingerprint collection Function.

In this embodiment, the EMC layer 1105 is disposed above the substrate 1102, three capacitive fingerprint sensors are disposed side by side above the substrate 1102, and the center of the upper surface of Die1101b is higher than the centers of the upper surfaces of Die1101a and Die1101c.

Based on the content disclosed in the above embodiments, in this embodiment, the thicknesses of Die1101b, Die1101a, and Die1101c are all the same. Therefore, the three capacitive fingerprint identification sensors can be the same, so as to avoid the need to make three capacitive fingerprint identification sensors with different heights, which can save energy cost. In this embodiment, since the cambered surfaces of the side keys are generally symmetrical, the horizontal heights of the centers of the upper surfaces of Die1101a and Die1101c can be the same, so as to adapt to the cambered surfaces of the arc-shaped coating layer.

Based on the contents disclosed in the foregoing embodiments, the method for manufacturing a fingerprint module shown in FIG. 7 provided in this embodiment can also be used to manufacture the capacitive fingerprint modules shown in FIGS. 11 , 12 and 13 . Specifically, please refer to the package sheet shown in FIG. 14 , the three Dies 1401a, 1401b and 1401c are EMC-packaged to form a package sheet 1400. The package sheet 1400 includes a second solder layer 1407a, a first solder layer on the lower surface of the three Dies Layer 1407b and the third solder layer 1407c, Die is connected to the ceramic substrate 1402 through the solder layer, the lower surface of the substrate 1402 is provided with a fourth solder layer 1407z, and the ceramic substrate 1402 is electrically connected to the FPC 1403 through the fourth solder layer 1407z. In this embodiment, the ceramic substrate 1402 also includes a first plane 1402b, a first inclined plane 1402a, and a second inclined plane 1402c, and the

Die

1401a, 1401b, and 1401c are respectively disposed above the first inclined plane 1402a, the first plane 1402b, and the second inclined plane 1402c.

A reinforcing plate 1408 is disposed on the lower surface of the FPC 1403 , and the surface of the packaging sheet 1400 after the packaging process is completed is flat. After the encapsulation sheet 1400 is processed by the CNC surface machining and polishing in step S701, the arc-shaped encapsulation sheet 1500 shown in FIG. 15 can be formed. Compared with the encapsulation sheet 1400, the arc-shaped encapsulation sheet 1500 has the upper surface of the EMC1405 changed from a flat surface to a 1505a, that is, from a flat surface to an arc-shaped surface. 1507c, 1507z, TSV through

holes

1512a, 1512b, 1512c and reinforcing plate 1508 are the corresponding Die1401a, 1401b, 1401c in FIG. 1412b, 1412c and the reinforcing plate 1408 are the same or similar, and will not be repeated here. In this embodiment, the ceramic substrate 1502 also includes a first flat surface 1502b, a first inclined surface 1502a, and a second inclined surface 1502c. Die 1501a, 1501b, and 1501c are respectively disposed above the first inclined surface 1502a, the first flat surface 1502b, and the second inclined surface 1502c.

The fingerprint module shown in FIG. 12 can be formed by coating the arc-shaped encapsulation sheet shown in FIG. 15 , and the arc-shaped coating layer 1106 can be formed on the EMC surface by coating the surface of the arc-shaped encapsulation sheet.

Based on the contents disclosed in the above-mentioned embodiments, FIG. 10 provides a method for making a fingerprint module, which can be used to make the capacitive fingerprint module shown in FIGS. 11 , 12 and 13 . Molding the mold to make the arc-shaped EMC layer without the need for CNC surface processing and polishing, that is, step S701 can be omitted, and the arc-shaped EMC layer can be made through the arc-shaped molding mold to form the encapsulation sheet shown in FIG. 15 , and then execute Step S1002, before the coating process, that is, before the arc-shaped coating layer is made, the upper surface of the EMC is already arc-shaped, and does not need to be processed by CNC surface processing and polishing. The coating process is directly performed on the arc-shaped EMC surface, that is, in this embodiment, the machining of the CNC surface and the polishing process are reduced by making an arc-shaped Molding mold to make an arc-shaped EMC.

This embodiment provides a curved capacitive fingerprint solution. By adopting the design of three Die packages, the three capacitive fingerprint sensors are connected to the substrate through electrical connectors. In this embodiment, the electrical connectors are TSV through holes, and the electrical

connectors Solder layers

1407a, 1407b, 1407c may also be included. The packaging material layer is arranged above the substrate, the three capacitive fingerprint sensors are arranged side by side above the substrate, the center of the upper surface of the first capacitive fingerprint sensor 1401b is higher than the center of the surface of the second capacitive fingerprint sensor 1401a, the first capacitive fingerprint sensor The center of the upper surface of 1401b is higher than the center of the surface of the third capacitive fingerprint sensor 1401c. With the curved fingerprint module of this embodiment, the curvature of the curved coating layer can be larger, and at the same time, the accuracy of fingerprint recognition will not be affected.

Based on the contents disclosed in the above embodiments, the present embodiment provides a capacitive fingerprint module. By using 3 Dies for packaging in the fingerprint module, and at the same time, a ceramic substrate is proposed, and the three Dies are packaged on the ceramic substrate. On one plane and two slopes on the side, this package structure can compensate for the difference between the curved surface of the curved coating and the surface of the Die caused by the height difference of the curved part of the curved coating , This setting method can meet the requirements of normal fingerprint recognition and multi-angle unlocking in the case of a wide range of camber curvature. For example, in this embodiment of the present application, fingerprint recognition can be realized by processing the fingerprint images collected on the three Dies, and splicing the fingerprint images collected on the three Dies.

Based on the contents disclosed in the above embodiments, the present embodiment provides a schematic diagram of a capacitive fingerprint module as shown in Figures 16, 17, and 18. Figure 17 can be obtained by cutting the dotted line A-A of the curved fingerprint module shown in Figure 16. The sectional view of the cambered fingerprint module shown in FIG. 16 can be obtained by cutting the dashed line B-B of the cambered fingerprint module shown in FIG. 16 to obtain the sectional view of the cambered fingerprint module shown in FIG. 18 .

The difference from the capacitive fingerprint module shown in FIGS. 11 and 12 is that the substrate 1614 shown in FIG. 16 is not electrically connected to the capacitive fingerprint sensor, and the substrate 1614 shown in FIG. 16 is disposed under the reinforcing plate instead of the reinforcing plate. above. In this embodiment, for convenience of description, the substrate 1614 may also be referred to as a substrate 1614 . The substrate 1614 may be a ceramic substrate, similar in shape to the copper clad laminate in the previous embodiment, the substrate 1614 may include prisms, for example, the substrate may include hexagonal prisms or quadrangular prisms, this embodiment uses the substrate of hexagonal prisms As an example, the upper and lower bottom surfaces may be hexagonal, and the side surfaces may include a first flat surface 1614b, a first inclined surface 1614a and a second inclined surface 1614c. The first flat surface 1614b is connected to the first inclined surface 1614a and the second inclined surface 1614c.

Slopes

1614a and 1614c with a certain slope are formed on both sides of the slant. The angles of the

slopes

1614a and 1614c are determined according to the radius of the arc coating and the thickness of the Die. The slopes of the

slopes

1614a and 1614c can be the same. The embodiment is not limited, it can be 60 degrees, 45 degrees, 30 degrees, 15 degrees or 10 degrees, etc. When the inclination angle of the inclined plane is set to be less than or equal to 15 degrees, it is convenient to control the distance between Die and the arc coating layer. , in order to ensure the quality and reliability of fingerprint recognition images at the same time.

The curved fingerprint module 1600 includes three Dies, which are a second capacitive fingerprint sensor 1601a, a first capacitive fingerprint sensor 1601b and a third capacitive fingerprint sensor 1601c, and the module 1600 further includes a first FPC1603b, a second FPC1603a and a third FPC1603c , the three FPCs are respectively electrically connected to the three Dies and located below the three Dies. The module 1100 also includes a substrate 1614 for adjusting the distance between the Die and the arcuate coating so that the surface of the Die faces the vertical distance of the upper surface of the arcuate coating 1606 where the Die surface faces Within a preset distance, the module 1100 also includes a reinforcing steel plate 1608, which is used to fix the connector 1610 and electronic devices 1611 such as resistors, capacitors, and MCUs, and the connectors are used for capacitive fingerprint sensors and the motherboard in the mobile phone, etc. The circuit is connected to realize fingerprint identification, and the electronic devices such as capacitors, resistors, and MCUs are used to cooperate with the capacitive fingerprint sensors 1601a, 1601b and 1601c to realize the function of fingerprint collection. Please refer to FIG. 18 , Die1601b is connected to FPC1603b through gold wire 1609. In this embodiment, the connection between Die and FPC is realized by using WB as an example. Compared with TSV, the cost is lower. If TSV is used, Then the DAF glue layer between Die and FPC can be replaced with a solder layer.

As shown in FIG. 16, the second capacitive fingerprint sensor 1601a, the first capacitive fingerprint sensor 1601b and the third capacitive fingerprint sensor 1601c in the fingerprint module pass through the second DAF adhesive layer 1604a, the first DAF adhesive layer 1604b, the third DAF adhesive layer, respectively. The adhesive layer 1604c is attached to the top of the second FPC1603a, the first FPC1603b, and the third FPC1603c, and the FPCs corresponding to each Die are arranged separately. Specifically, the first FPC1603b, the second FPC1603a, and the third FPC1603c are separated by the EMC layer to The second DAF adhesive layer 1604a, the first DAF adhesive layer 1604b, and the third DAF adhesive layer 1604c are arranged separately for the convenience of being subsequently attached to the substrate 1614. Specifically, the three DAF adhesive layers are separated by the EMC layer. As shown in FIG. 16, the traces of the first FPC 1603b, the second FPC 1603a and the third FPC 1603c are connected together on one side, and the FPCs are connected to other circuits in the mobile phone through the connector 1610 to realize interconnection. Specifically, the reinforcing plate 1608 may include a first reinforcing plate 1608b, a second reinforcing plate 1608a, and a third reinforcing plate 1608c, and the reinforcing

plates

1608b, 1608a, and 1608c are respectively disposed below the FPC 1603b, the second FPC 1603a, and the

third FPC

1603c, and , 1608b, 1608a, 1608c are separated by an EMC layer. Thermocompression or thermosetting glue can be used for lamination between the FPC and the reinforcing plate and between the reinforcing plate and the substrate, and the first thermosetting

adhesive layers

1615b, 1608b, 1608c and the substrate 1614 are respectively included. The second thermosetting adhesive layer 1615a, the third thermosetting adhesive layer 1615c, the first thermosetting adhesive layer 1615b, the second thermosetting adhesive layer 1615a, and the third thermosetting adhesive layer 1615c are respectively disposed on the first plane 1614b of the substrate The upper surface, the upper surface of the first inclined surface 1614a, and the upper surface of the second inclined surface.

In this embodiment, Die1601a and 1601c are arranged above the two inclined surfaces of the substrate, and the surfaces of Die1601a and 1601c are kept inclined at a certain angle so that the surfaces of Die1601a and 1601c can face the arc surface of the arc-shaped coating layer, which can compensate for the arc-shaped coating layer. The problem of unequal drop between the surface of the arc-shaped coating layer and the surface of the Die caused by the height difference of the arc-shaped part of the shaped coating layer. After the Die is mounted on the substrate, it can be packaged by the EMC process to form a flat package as shown in Figure 19 with a flat surface of the EMC. According to the requirements of different terminals, it can be processed into different curvatures by CNC surface processing and polishing process as shown in Figure 20. The arc-shaped encapsulation sheet shown is finally coated with surface treatment to obtain the capacitive fingerprint module shown in Figure 17 with an arc-shaped coating layer. The capacitive fingerprint modules shown in Figures 16, 17, and 18 can also be used. The method shown in FIG. 7 is used, or the method shown in FIG. 10 is used. In this embodiment, the distances D164 , D165 , and D166 between the top surface of the EMC shown in FIG. 20 and the top surface of the chip are set to be 100um-400um.

The embodiment of the present application proposes an arc capacitive fingerprint solution. By adopting a special-shaped ceramic substrate for the design of three Die packages, it is ensured that the arc-shaped coating layer has a large curvature. The distance from the surface of the layer to the surface of each Die is within a preset distance, so as to realize the normal identification of fingerprints and meet the application occasions in the case of large curvature of the arc surface.

The curved fingerprint module provided by the embodiment of the present application is shown in FIG. 21 . The curved fingerprint module 2100 includes three Dies, which are a second capacitive fingerprint sensor 2101 a , a first capacitive fingerprint sensor 2101 b and a third capacitive fingerprint respectively. In the fingerprint sensor 2101c, the module 2100 also includes the FPC 2103. The difference from the solution in FIG. 4 is that the curved fingerprint module shown in FIG. 21 does not include a substrate. The module 2100 also includes a reinforcing steel plate 2108. The reinforcing steel plate 2108 is used to fix the connector and electronic devices such as resistors, capacitors, and MCUs. The connectors are used to connect the capacitive fingerprint sensor to the mobile phone. In order to cooperate with the

capacitive fingerprint sensors

2101a, 2101b and 2101c to realize the fingerprint acquisition function, the sectional view of the curved fingerprint module shown in FIG. 22 can be obtained by cutting the dotted line A-A of the curved fingerprint module shown in FIG. The sectional view of the curved fingerprint module shown in FIG. 23 can be obtained by cutting the B-B dotted line of the curved fingerprint module shown in FIG. 23 .

Please refer to the cross-sectional view of the curved fingerprint module shown in FIG. 22. The

capacitive fingerprint sensors

2101a, 2101b and 2101c can be pasted on the FPC2103 through the DAF adhesive layer 2104, and then the electrical connection between the Die and the FPC2103 can be realized by WB. The module 2100 may further include an EMC layer 2105. The EMC layer 2105 may be fabricated by a Molding process, and then the EMC layer is subjected to CNC surface machining and polishing process to form the EMC arc surface 2105a, and finally the EMC arc surface 2105a is coated to form Arc coating layer 2106. The module 2100 further includes a reinforcing steel sheet 2108, and the reinforcing steel sheet 2108 is disposed on the lower surface of the FPC 2103 for fixing the capacitive fingerprint sensor. In addition, in this embodiment, a part of the reinforced steel plate can be placed on the lower surface of the FPC2103 for fixing the capacitive fingerprint sensor, another part of the reinforced steel plate can also be placed on the upper surface of the FPC2103, and the reinforced steel plate 2108 is used to fix the connector 2110 And electronic devices 2111 such as resistors, capacitors, MCUs, etc., the connector is used to connect the capacitive fingerprint sensor with other components in the electronic device to realize fingerprint recognition and unlocking, the capacitors, resistors, MCUs and other electronic devices are used to cooperate with the capacitive fingerprint sensor Die2101a, 2101b and 2101c realize the function of fingerprint collection.

In the embodiment of the present application, three Dies are used for packaging in the fingerprint module, and the center of the upper surface of Die2101b is higher than the center of the upper surface of Die2101a and the center of the upper surface of Die2101c. With this packaging structure, it is possible to compensate for the The height difference between the arc-shaped coating layer and the Die surface caused by the height difference of the arc-shaped coating layer of the surface fingerprint module can satisfy the situation that the radius of the arc-shaped coating layer is small and realize the fingerprint While ensuring the reliability of the normal identification.

The height D2 of the arc-shaped portion of the arc-shaped coating layer is greater than or equal to 0.5 mm. In this embodiment, the height of the arc-shaped coating layer can be understood as the vertical distance from the arc top of the arc-shaped coating layer to the arc edge. The R angle of the upper surface 2106a of the arc-shaped coating layer may be 0.8-8 mm, that is, the radius of the arc-shaped coating layer 2106a may be 0.8-8 mm; in addition, the surface of the Die to the upper surface of the arc-shaped coating layer The vertical distances D21, D22 and D23 of 2106a can be set to 170um-500um, and the vertical distance D24 from the Die surface to the EMC arc surface 2105a of the EMC layer 2105 can be set to 100um-400um.

It can be seen from Figures 21 and 22 that the thickness and width of the three Dies included in the fingerprint module, 2101a and 2101c are the same, the thickness of 2101b is larger, and the center of 2101b corresponds to the center of the arc coating layer. The three Dies are arranged side by side, and are respectively attached to the FPC2103 through the DAF adhesive layer 2104. The FPC2103 and the reinforcing plate 2108 can be pressed together by hot pressing. After the packaging process is completed, the surface of the package sheet is flat. According to the requirements of different clients, it can be processed into different arc surfaces through CNC surface treatment and polishing treatment. Finally, the coating surface treatment is performed to obtain the fingerprint capacitor module with an arc surface. In this embodiment, please refer to FIG. 23 , the electrical connector is a gold wire 2109 , and the three Dies included in the fingerprint module are connected to the FPC 2103 through the gold wire 2109 .

Based on the contents disclosed in the above embodiments, please refer to FIG. 24 . This embodiment provides a substrate for use in the capacitive fingerprint modules shown in FIGS. 16 , 17 and 18 . Specifically, the substrate includes a first plane 2401b, The first inclined surface 2401a and the second inclined surface 2401c, with reference to FIG. 17, it can be understood that the Die1601b is disposed above the first plane 2401b, the Die1601a is disposed above the first inclined surface 2401a, and the Die1601c is disposed above the second inclined surface 2401c. Specifically, the The substrate further includes a stepped structure, the upper surface of one end of the first plane 2401b is provided with a first stepped structure 2402b, the first stepped structure 2402b is connected with the first plane 2401b, and the upper surface of one end of the first inclined surface 2401a is provided with a second stepped structure 2402a, the second stepped structure 2402a is connected with the first inclined surface 2401a, the upper surface of one end of the second inclined surface 2401c is provided with a third stepped structure 2402c, and the third stepped structure 2402c is connected with the second inclined surface 2401c. Please refer to FIG. 18 , one end of the FPC is provided with a connecting connector 1610 for connecting with circuits such as the mainboard of the mobile phone. Therefore, the stepped structure provided in this embodiment can play a role in fixing the FPC. Specifically, in order to play a better role To fix the role of the FPC, the height of the stepped structure is equal to the height difference between the surface on which the stepped structure is placed and the corresponding FPC above the surface, that is, the height of the first stepped structure 2402b is equal to the height of the first plane 2401b and the lower surface of the first FPC1603b. The height difference, the height D25 of the second stepped structure 2402a is equal to the height difference between the first inclined plane 2401a and the lower surface of the second FPC1603a, and the height of the third stepped structure 2402c is equal to the height difference between the second inclined plane 2401c and the bottom surface of the third FPC1603c; In this embodiment, the other end of the prism may also include a step structure symmetrical with the first step structure 2402b, the second step structure 2402a, and the third step structure 2402c, and the step structure at the other end is disposed on the lower surface of the EMC layer, for Support EMC layer. In addition, the height of the stepped structure can also be understood as the height of the reinforcing plate and the thermosetting adhesive layer, that is, the height of the first stepped structure 2402b is equal to the height of the first reinforcing plate 1608b and the first thermosetting adhesive layer 1615b, the second The height D25 of the stepped structure 2402a is equal to the height of the second reinforcing plate 1608a and the second thermosetting adhesive layer 1615a, and the height of the third stepped structure 2402c is equal to the height of the third reinforcing plate 1608c and the third thermosetting adhesive layer 1615c; , the height of the first stepped structure and the height of the second stepped structure are equal to the height of the third stepped structure, which is convenient for implementation in terms of technology.

In this embodiment, the other end of the hexagonal pyramid may also include a stepped structure symmetrical with the first stepped structure 2402b, the second stepped structure 2402a, and the third stepped structure 2402c, and the stepped structure at the other end is disposed on the lower surface of the EMC layer. In order to support the EMC layer, in this embodiment, a quadrangular pyramid can be used instead of a hexagonal platform, but the solution of forming a substrate with a hexagonal platform and a stepped structure has lower process difficulty and lower cost.

Based on the content disclosed in the above-mentioned embodiment, please refer to FIG. 25 . Different from the structure of the fingerprint module shown in FIG. 12 , the substrate provided in this embodiment is described by taking a quadrangular prism as an example, and other structures are the same as those in FIG. 11 . Or approximate, which will not be repeated here. In FIG. 25, when the substrate is a quadrangular prism, the sides of the quadrangular prism are a first plane 1102b, a first inclined plane 1102a, a second inclined plane 1102c, and a second plane 1102d, and the fourth solder layer 1107z is disposed on the lower surface of the second plane 1102d, the first inclined plane, the second inclined plane and the second plane respectively form acute angles, and the acute angles are equal, and the second plane can be understood as being parallel to the horizontal plane.

In addition, referring to the cross-sectional view of the capacitive fingerprint module shown in FIG. 17 , the substrate 1614 may also include a quadrangular prism, and the quadrangular prism is shown in FIG. 25 . In addition, referring to the substrate of FIG. The upper surfaces of one side of the flat surface, the first inclined surface and the second inclined surface may also be provided with a stepped structure as shown in FIG. 24 .

The present embodiment provides a capacitive fingerprint package structure. Compared with the capacitive fingerprint module structure in the foregoing embodiments, only the arc-shaped coating layer is omitted. For the specific implementation, refer to the foregoing embodiments, which will not be repeated here.

This embodiment also provides an electronic device, the electronic device is provided with a circuit board, a specific circuit board includes a memory and a processor, the capacitive fingerprint module is connected to the circuit board, and specifically, the connector of the capacitive fingerprint module is connected to the circuit board , in order to realize fingerprint recognition and unlocking, the electronic device can be a mobile phone, a tablet, a computer and other electronic devices. For the specific implementation of the above, refer to the above-mentioned embodiments, and details are not repeated here.

It should be understood that, in this embodiment of the present application, "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean that B is only determined according to A, and B may also be determined according to A and/or other information.

In addition, the term "and/or" in this article is only an association relationship to describe the associated objects, indicating that there can be three kinds of relationships, for example, A and/or B, it can mean that A exists alone, A and B exist at the same time, There are three cases of B alone. In addition, the character "/" in this document generally indicates that the related objects are an "or" relationship.

Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the above-described systems, devices and units may refer to the corresponding processes in the foregoing method embodiments, which will not be repeated here.

In the several embodiments provided in this application, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented. On the other hand, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited to this. should be covered within the scope of protection of this application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

A capacitive fingerprint package structure, characterized in that it includes at least three capacitive fingerprint sensors;

the at least three capacitive fingerprint sensors are arranged side by side;

The at least three capacitive fingerprint sensors include a first capacitive fingerprint sensor, a second capacitive fingerprint sensor and a third capacitive fingerprint sensor;

the first capacitive fingerprint sensor is located between the second capacitive fingerprint sensor and the third capacitive fingerprint sensor;

The center of the upper surface of the first capacitive fingerprint sensor is higher than the center of the upper surface of the second capacitive fingerprint sensor; the center of the upper surface of the first capacitive fingerprint sensor is higher than the upper surface of the third capacitive fingerprint sensor. the center of the surface.
The capacitive fingerprint package structure according to claim 1, wherein the height of the center of the upper surface of the second capacitive fingerprint sensor is equal to the height of the center of the upper surface of the third capacitive fingerprint sensor.
The capacitive fingerprint encapsulation structure according to claim 1 or 2, further comprising an encapsulation material layer, the upper surface of the encapsulation material layer is an arc surface; the encapsulation material layer covers the at least three capacitive fingerprints sensor.
The capacitive fingerprint packaging structure according to claim 3, wherein the distance from the upper surface of the at least three fingerprint sensors to the upper surface of the packaging material layer corresponding to the at least three capacitive fingerprint sensors is from 100 μm to 100 μm. 400um.
The capacitive fingerprint package structure according to any one of claims 1 to 4, wherein the lower surfaces of the at least three capacitive fingerprint sensors are arranged on the same plane, and the thickness of the first capacitive fingerprint sensor is greater than that of the first capacitive fingerprint sensor. The thickness of the second capacitive fingerprint sensor, the thickness of the first capacitive fingerprint sensor is greater than the thickness of the third capacitive fingerprint sensor.
The capacitive fingerprint package structure according to claim 5, wherein the thickness of the second capacitive fingerprint sensor is equal to the thickness of the third capacitive fingerprint sensor.
The capacitive fingerprint packaging structure according to claim 5 or 6, further comprising a wafer-bonding film DAF adhesive layer; the at least three capacitive fingerprint sensors are arranged side by side on the upper surface of the DAF adhesive layer;

Also includes a flexible circuit board FPC, and the DAF adhesive layer is arranged on the upper surface of the FPC;

Also includes a reinforcing plate, the reinforcing plate is arranged on the lower surface of the FPC;

A gold wire is also included, and the gold wire is used to electrically connect the at least three capacitive fingerprint sensors and the FPC.
The capacitive fingerprint package structure according to claim 5 or 6, further comprising a substrate, and the at least three capacitive fingerprint sensors are arranged side by side above the substrate;

Also includes a wafer bonding film DAF adhesive layer, the at least three capacitive fingerprint sensors are arranged side by side on the upper surface of the DAF adhesive layer; the DAF adhesive layer is arranged on the upper surface of the substrate;

Also includes an FPC, the at least three capacitive fingerprint sensors are electrically connected to the FPC;

Also includes a solder layer, the solder layer is disposed between the substrate and the FPC, and is used to electrically connect the substrate and the FPC;

It also includes gold wires, the gold wires are used to electrically connect the at least three capacitive fingerprint sensors and the substrate; the substrate is a copper-clad laminate;

It also includes a reinforcing plate, and the reinforcing plate is arranged on the lower surface of the FPC.
The capacitive fingerprint package structure according to any one of claims 1 to 4, wherein the lower surfaces of the at least three capacitive fingerprint sensors are disposed on different planes.
The capacitive fingerprint package structure according to claim 9, further comprising a substrate, the substrate is a ceramic substrate, and the at least three capacitive fingerprint sensors are arranged side by side on the substrate;

The base plate includes a prism, the prism has at least four sides, and the sides of the prism at least include a first plane, a first inclined plane and a second inclined plane; the first plane is respectively connected with the first inclined plane and the second inclined plane. Two inclined plane connection;

The center of the first plane is higher than the center of the second inclined plane, and the center of the first plane is higher than the center of the third inclined plane;

The first capacitive fingerprint sensor, the second capacitive fingerprint sensor and the third capacitive fingerprint sensor are respectively disposed above the first plane, above the first inclined surface and above the second inclined surface.
The capacitive fingerprint package structure according to claim 10, wherein the first inclined plane and the second inclined plane have the same inclination angle with respect to the horizontal plane, and the inclination angle is less than or equal to 15 degrees; Prisms or hexagonal prisms.
The capacitive fingerprint package structure according to claim 10 or 11, further comprising a first solder layer, a second solder layer and a third solder layer;

The first capacitive fingerprint sensor, the second capacitive fingerprint sensor and the third capacitive fingerprint sensor are respectively disposed on the upper surfaces of the first solder layer, the second solder layer and the third solder layer, the first capacitive fingerprint sensor, the second capacitive fingerprint sensor and the third capacitive fingerprint sensor are electrically connected to the substrate; the first solder layer, the second solder layer and the third solder layer are respectively arranged on the upper surface of the first plane, the upper surface of the first inclined surface and the upper surface of the second inclined surface;

The first solder layer, the second solder layer and the third solder layer are spaced apart from each other by the encapsulation material layer and the first solder layer, the second solder layer and the third solder layer The thicknesses are equal; the packaging material layer is arranged above the substrate.
The capacitive fingerprint package structure according to claim 12, further comprising an FPC, and the at least three capacitive fingerprint sensors are electrically connected to the FPC;

TSV through holes are provided in the at least three capacitive fingerprint sensors and in the substrate so that the at least three capacitive fingerprint sensors are electrically connected to the substrate, and a fourth solder is provided between the substrate and the FPC layer, the fourth solder layer is used to electrically connect the substrate and the FPC;

It also includes a reinforcing plate, and the FPC is arranged on the upper surface of the reinforcing plate.
The capacitive fingerprint packaging structure according to claim 10 or 11, further comprising a flexible circuit board FPC, the at least three capacitive fingerprint sensors are electrically connected to the FPC, and the packaging material layer is provided on the substrate The upper surface of the at least three capacitive fingerprint sensors are arranged side by side above the FPC;

The FPC includes a first FPC, a second FPC and a third FPC;

The first capacitive fingerprint sensor, the second capacitive fingerprint sensor and the third capacitive fingerprint sensor are respectively connected to the first FPC, the second FPC and the third FPC through electrical connectors; the The first FPC, the second FPC and the third FPC are spaced apart from each other by the packaging material layer and one end of the first FPC, one end of the second FPC and one end of the third FPC are electrically connected ; The electrical connector is a gold wire;

The first FPC, the second FPC, and the third FPC are respectively disposed above the first plane, above the first inclined surface, and above the second inclined surface.
The capacitive fingerprint packaging structure according to claim 14, further comprising a wafer bonding film DAF adhesive layer, the DAF adhesive layer at least comprising a first DAF adhesive layer, a second DAF adhesive layer and a third DAF adhesive layer ;

The first capacitive fingerprint sensor is arranged on the upper surface of the first DAF adhesive layer, and the first DAF adhesive layer is arranged on the upper surface of the first FPC;

The second capacitive fingerprint sensor is arranged on the upper surface of the second DAF adhesive layer, and the second DAF adhesive layer is arranged on the upper surface of the second FPC;

The third capacitive fingerprint sensor is arranged on the upper surface of the third DAF adhesive layer, and the third DAF adhesive layer is arranged on the upper surface of the third FPC;

The first DAF adhesive layer, the second DAF adhesive layer and the third DAF adhesive layer are spaced apart from each other by the packaging material layer and the first DAF adhesive layer, the second DAF adhesive layer and the The thickness of the third DAF adhesive layer is equal;

The lower surfaces of the first FPC, the second FPC and the third FPC are respectively provided with a first reinforcing plate, a second reinforcing plate and a third reinforcing plate, the first reinforcing plate, the The second reinforcing plate and the third reinforcing plate are spaced apart from each other by the encapsulating material layer and the thicknesses of the first reinforcing plate, the second reinforcing plate and the third reinforcing plate are equal;

The lower surfaces of the first reinforcing plate, the second reinforcing plate and the third reinforcing plate are respectively provided with a first thermosetting adhesive layer, a second thermosetting adhesive layer and a third thermosetting adhesive layer; The first thermosetting adhesive layer, the second thermosetting adhesive layer, and the third thermosetting adhesive layer are spaced apart from each other by the packaging material layer, and the first thermosetting adhesive layer, the second thermosetting adhesive layer The thickness of the solid adhesive layer and the third thermosetting adhesive layer are equal;

The first thermosetting adhesive layer, the second thermosetting adhesive layer, and the third thermosetting adhesive layer are respectively disposed on the upper surface of the first plane and the upper surface of the first inclined plane of the substrate and the upper surface of the second slope.
The capacitive fingerprint package structure according to claim 14 or 15, wherein the substrate further comprises a stepped structure, the stepped structure is connected to the prism; the stepped structure comprises a first stepped structure and a second stepped structure and the third step structure;

The first stepped structure is disposed on the upper surface of one end of the first plane, and the height of the first stepped structure is equal to the height difference between the first plane and the lower surface of the first FPC;

The second stepped structure is arranged on the upper surface of one end of the first inclined surface, and the height of the second stepped structure is equal to the height difference between the first inclined surface and the lower surface of the second FPC;

The third stepped structure is disposed on the upper surface of one end of the second inclined surface, and the height of the third stepped structure is equal to the height difference between the second inclined surface and the lower surface of the third FPC.
The capacitive fingerprint package structure according to any one of claims 1 to 16, wherein the number of the capacitive fingerprint sensors is three.
A capacitive fingerprint module, characterized in that it comprises the capacitive fingerprint encapsulation structure according to any one of claims 1 to 17, and further comprises an arc-shaped coating layer, wherein the arc-shaped coating layer is disposed on the package The upper surface of the material layer, the upper surface of the arc-shaped coating layer is an arc surface.
The capacitive fingerprint module according to claim 18, wherein the distance from the upper surface of the at least three capacitive fingerprint sensors to the upper surface of the arc-shaped coating layer corresponding to the at least three capacitive fingerprint sensors is 170um To 500um, the radius of the arc surface of the arc-shaped coating layer is 0.8 to 8mm.
An electronic device, comprising: a circuit board and a capacitive fingerprint module according to claim 18 or 19, wherein the capacitive fingerprint module is connected to the circuit board through a connector.
A method for making a capacitive fingerprint module, which is applied to making the capacitive fingerprint module as claimed in claim 18 or 19, characterized in that, comprising:

The encapsulation material layer is processed by computer numerical control CNC surface processing and polishing to form an arc-shaped encapsulation sheet;

The upper surface of the encapsulation material layer of the arc-shaped encapsulation sheet is coated to form an arc-shaped coating layer.
A method for making a capacitive fingerprint module, which is applied to making the capacitive fingerprint module as claimed in claim 18 or 19, characterized in that, comprising:

A cambered encapsulation sheet whose upper surface of the encapsulation material layer is an cambered surface is produced by a plastic encapsulation process;

The upper surface of the encapsulation material layer of the arc-shaped encapsulation sheet is coated to form an arc-shaped coating layer.