CN208384588U - Fingerprint mould group and electronic equipment - Google Patents
Fingerprint mould group and electronic equipment Download PDFInfo
- Publication number
- CN208384588U CN208384588U CN201820560105.6U CN201820560105U CN208384588U CN 208384588 U CN208384588 U CN 208384588U CN 201820560105 U CN201820560105 U CN 201820560105U CN 208384588 U CN208384588 U CN 208384588U
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- mould group
- fingerprint
- fingerprint sensor
- encapsulated layer
- curved surface
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- 239000011521 glass Substances 0.000 claims description 4
- 230000006978 adaptation Effects 0.000 abstract description 5
- 238000012545 processing Methods 0.000 description 14
- 230000006870 function Effects 0.000 description 10
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- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
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Abstract
The utility model discloses a kind of fingerprint mould group and electronic equipments, fingerprint mould group includes: fingerprint sensor, flexible circuit board and encapsulated layer, flexible circuit board is electrically connected with fingerprint sensor, encapsulated layer is located at the side of fingerprint sensor, and the side surface away from fingerprint sensor of encapsulated layer is formed at least partially as curved surface.Fingerprint mould group according to the present utility model can make fingerprint mould group adaptation have the electronic equipment of curved surface fingerprint mould group mounting portion by setting curved surface for the surface away from fingerprint sensor of encapsulated layer.So as to which so that the appearance of fingerprint mould group is preferably connected with the appearance of electronic equipment, the junction for avoiding the appearance of fingerprint mould group and the appearance of electronic equipment generates lofty sense, improves the aesthetic appearance of electronic equipment.
Description
Technical field
The utility model relates to technical field of communication equipment, specifically, more particularly to a kind of fingerprint mould group and electronics set
It is standby.
Background technique
With the personalization of the electronic equipments such as mobile phone, design, the electronic equipments such as mobile phone are embedded fingerprint mould group
Position becomes diversification, and the position for being such as embedded fingerprint mould group may be the curved surface with radian.In the related technology, fingerprint mould group
Appearance is configured to plane, is embedded position with the fingerprint mould group of curved surface and is not adapted, affects the appearance looks elegant of electronic equipment
Degree.
Utility model content
The utility model aims to solve at least one of the technical problems existing in the prior art.For this purpose, the utility model mentions
The advantages of a kind of fingerprint mould group out, the fingerprint mould group have suitability good, appearance looks elegant.
The utility model also proposes a kind of electronic equipment, and the electronic equipment includes fingerprint mould group described above.
According to the fingerprint mould group of the utility model embodiment, comprising: fingerprint sensor；Flexible circuit board, the flexible electrical
Road plate is electrically connected with the fingerprint sensor；Encapsulated layer, the encapsulated layer are located at the side of the fingerprint sensor, the encapsulation
The side surface away from the fingerprint sensor of layer is formed at least partially as curved surface.
According to the fingerprint mould group of the utility model embodiment, by the way that the surface away from fingerprint sensor of encapsulated layer is arranged
For curved surface, it can make fingerprint mould group adaptation that there is the electronic equipment of curved surface fingerprint mould group mounting portion.So as to so that fingerprint mould group
Appearance be preferably connected with the appearance of electronic equipment, avoid the appearance of fingerprint mould group and the appearance of electronic equipment
Junction generate lofty sense, improve the aesthetic appearance of electronic equipment.
Some embodiments according to the present utility model, a side surface for the encapsulated layer are formed at least partially as court
The curved surface protruded to the direction far from the fingerprint sensor.
Further, the side surface of the encapsulated layer is formed at least partially as being directed away from the fingerprint sensing
The cambered surface of the direction protrusion of device.
In some embodiments of the utility model, the side entire surface of the encapsulated layer is formed as curved surface；Or
A side surface for the encapsulated layer includes central portion and the edge part for being looped around the central portion periphery, the central portion shape
As plane, the edge part is formed as from the center of the central portion towards the direction of the edge part, is tilted towards the finger
The curved surface that the direction of line sensor extends.
Some embodiments according to the present utility model, the encapsulated layer include: the first encapsulation main body, and first encapsulation is originally
Body is located at the side of the fingerprint sensor；Case chip, it is described that the case chip is covered in deviating from for first encapsulation main body
On one side surface of fingerprint sensor, the side surface away from the fingerprint sensor of the case chip is at least a partially formed
For curved surface.
Further, the case chip is glass workpiece, ceramic member, plastic parts or metalwork.
In some embodiments of the utility model, the encapsulated layer includes the second encapsulation main body and spray coating, and described the
Two encapsulation main bodies are located at the side of the fingerprint sensor, and it is described that the spray coating is sprayed on deviating from for second encapsulation main body
On one side surface of fingerprint sensor, the side surface away from the fingerprint sensor of the spray coating is at least a partially formed
For curved surface.
Some embodiments according to the present utility model, formed on the encapsulated layer it is fluted, wherein the fingerprint sensor
If in the groove.
According to the electronic equipment of the utility model embodiment, comprising: shell is formed with through-hole section on the shell；It is above-mentioned
The fingerprint mould group, the fingerprint mould group are located at the through-hole section.
Some embodiments according to the present utility model, the side of the shell are formed as curved surface, and the through-hole section is formed in
The side of the shell, the side of the side surface and the shell away from the fingerprint sensor of the encapsulated layer
Face is adapted.
The additional aspect and advantage of the utility model will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model from the description of the embodiment in conjunction with the following figures will
Become obvious and be readily appreciated that, in which:
Fig. 1 is the structural schematic diagram according to the fingerprint mould group of the utility model embodiment；
Fig. 2 is the partial structure sectional view according to the fingerprint mould group of the utility model embodiment；
Fig. 3 is the partial structure sectional view according to the fingerprint mould group of another embodiment of the utility model；
Fig. 4 is the partial structure sectional view according to the fingerprint mould group of the utility model another embodiment；
Fig. 5 is the partial structure sectional view according to the fingerprint mould group of the utility model another embodiment；
Fig. 6 is the main view according to the electronic equipment of the utility model embodiment；
Fig. 7 is the side view according to the electronic equipment of the utility model embodiment.
Appended drawing reference:
Fingerprint mould group 100,
Fingerprint sensor 10,
Flexible circuit board 20,
Encapsulated layer 30, the first encapsulation main body 310, case chip 320, the second encapsulation main body 330, spray coating 340, groove 350,
Case ring 40,
Substrate 50,
Steel mends 60,
Electronic equipment 500, display screen 510, shell 520, through-hole section 521.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and should not be understood as to the utility model
Limitation.
In the description of the present invention, it should be understood that term " center ", " thickness ", "upper", "lower", " preceding ",
The orientation or positional relationship of the instructions such as " rear ", "left", "right", "top", "bottom", "inner", "outside", " circumferential direction " is based on shown in attached drawing
Orientation or positional relationship, be merely for convenience of describing the present invention and simplifying the description, rather than indication or suggestion is signified
Device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as practical new to this
The limitation of type.In addition, defining " first ", the feature of " second " can explicitly or implicitly include one or more be somebody's turn to do
Feature.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
Below with reference to Fig. 1-Fig. 7 description according to the fingerprint mould group 100 and electronic equipment 500 of the utility model embodiment.
As depicted in figs. 1 and 2, according to the fingerprint mould group 100 of the utility model embodiment, fingerprint mould group 100 includes: fingerprint
Sensor 10, flexible circuit board 20 and encapsulated layer 30.
Flexible circuit board 20 is electrically connected with fingerprint sensor 10, it should be noted that one end of flexible circuit board 20 can be with
It is connect with fingerprint sensor 10, the other end of flexible circuit board 20 can be connect with mainboard.The induction of fingerprint sensor 10 inspection as a result,
The information measured can be transferred to mainboard by flexible circuit board 20, and mainboard can also be by flexible circuit board 20 to fingerprint sensing
The transmission of device 10 correspondingly controls information.As a result, when user's touch screen fingerprint mould group 100, electronic equipment 500 can be carried out accordingly
Ground control, such as realize the fingerprint recognition or unlocked by fingerprint function of electronic equipment 500.
As shown in Fig. 2, encapsulated layer 30 can be located at the side of fingerprint sensor 10, pass through setting encapsulated layer 30, envelope as a result,
Dress layer 30 can carry out fingerprint sensor 10 blocking protection, prevent 10 damaged in collision of fingerprint sensor.Moreover, encapsulated layer 30 can
Dust and water droplet is isolated, the service life of fingerprint sensor 10 is improved.
The side surface away from fingerprint sensor 10 of encapsulated layer 30 is formed at least partially as curved surface.That is, envelope
The surface (upper surface of encapsulated layer 30 as shown in Figure 2) of dress side of the layer 30 far from fingerprint sensor 10 can be entirely formed to
Curved surface；Encapsulated layer 30 can also partially be formed as curved surface far from the surface of 10 side of fingerprint sensor, and another part is formed as flat
Face.It should be noted that the surface of the side away from fingerprint sensor 10 of encapsulated layer 30 can be directly or indirectly as referring to
The appearance of line mould group 100.By setting curved surface for the appearance of encapsulated layer 30, fingerprint mould group 100 can be made and there is song
The fingerprint mould group mounting portion in face is adapted, to make the connection of the appearance of fingerprint mould group 100 and the appearance of electronic equipment 500
Place is more ideally connected, and improves the aesthetic appearance of electronic equipment 500.
According to the fingerprint mould group 100 of the utility model embodiment, by by encapsulated layer 30 away from fingerprint sensor 10
Surface is set as curved surface, and the adaptation of fingerprint mould group 100 can be made to have the electronic equipment 500 of curved surface fingerprint mould group mounting portion.To
The appearance of fingerprint mould group 100 can be made preferably to be connected with the appearance of electronic equipment 500, avoid fingerprint mould group 100
The junction of appearance and the appearance of electronic equipment 500 generates lofty sense, improves the aesthetic appearance of electronic equipment 500.
Some embodiments according to the present utility model a, as shown in Fig. 2, side surface of encapsulated layer 30 is at least a partially formed
To be directed away from the curved surface that the direction of fingerprint sensor 10 is protruded.For example, the upper surface of encapsulated layer 30 can partially be formed as bent
Face is partially plane；The upper surface of encapsulated layer 30 is also possible to whole surface and is configured to curved surface.Thus, it is possible to improve fingerprint
The diversification that mould group 100 designs.The appearance for processing correspondingly encapsulated layer 30 can be designed according to actual needs, be referred to improving
The appearance of line mould group 100 and the concordance and consistency of 500 appearance of electronic equipment.Moreover, by the way that encapsulated layer 30 is arranged
For the curved surface outwardly protruded, fingerprint mould group 100 is touched and operated convenient for user.
Further, the direction for being formed at least partially as being directed away from fingerprint sensor 10 of a side surface of encapsulated layer 30
The cambered surface of protrusion.For example, the upper surface of encapsulated layer 30 can partially be formed as cambered surface, another part is formed as plane；Encapsulated layer
30 upper surface can also entirely be configured to cambered surface.It is convenient for the processing and manufacturing of encapsulated layer 30, as a result, so as to improve fingerprint
The production efficiency of mould group 100 reduces the production cost of fingerprint mould group 100.Moreover, by setting the appearance of encapsulated layer 30 to
Fingerprint mould group 100 is touched convenient for user and operated to the cambered surface outwardly protruded.
In some embodiments of the utility model, a side surface of encapsulated layer 30 can be integrally formed into curved surface.For example,
One side surface of encapsulated layer 30 can be formed as the curved surface of undulatory curved surface or other shapes, thus, it is possible to improve encapsulated layer
The diversity of 30 design, to improve the aesthetics and diversity of 100 appearance of fingerprint mould group.
In other embodiments of the utility model, as shown in Fig. 2, during the surface of the side of encapsulated layer 30 may include
Centre portion and the edge part for being looped around central portion periphery, central portion can be formed as plane, and edge part is formed from the portion of centre
The heart towards edge part direction, be tilted towards fingerprint sensor 10 direction extend curved surface.It is convenient for the processing of encapsulated layer 30 as a result,
Manufacture, and the aesthetic appearance of fingerprint mould group 100 can be improved.
Some embodiments according to the present utility model, as shown in figure 3, encapsulated layer 30 may include: the first encapsulation main body 310
With case chip 320, the first encapsulation main body 310 is located at the side of fingerprint sensor 10.For example, the first encapsulation main body 310 can be
Epoxy resin or other materials, fingerprint sensor 10 is sealed and be protected.Case chip 320 is covered in the first encapsulation main body
310 on a side surface of fingerprint sensor 10.As shown in figure 3, case chip 320 can be located at the first encapsulation main body 310
Upper surface, case chip 320 can be sealed protection to the first encapsulation main body 310 and fingerprint sensor 10 as a result, thus
Improve the structural strength of fingerprint mould group 100.At least partly shape of the side surface away from fingerprint sensor 10 of case chip 320
As curved surface.As shown in figure 3, the upper surface of case chip 320 can partially be formed as curved surface, another part is formed as plane；Envelope
The upper surface of load 320 can also be entirely configured to curved surface.It, can be according to electronics in the process of fingerprint mould group 100
The rigging position of 500 fingerprint mould group 100 of equipment carries out correspondingly design to the appearance of case chip 320 and processes.
Further, case chip 320 can be glass workpiece, ceramic member, plastic parts or metalwork.That is, case chip
320 can be glass workpiece, thus, it is possible to reduce the production cost of fingerprint mould group 100；Case chip 320 or ceramic member, by
This, ceramic member can block the first encapsulation main body 310 of protection and fingerprint sensor 10；Case chip 320 can also be metalwork, by
This, can be improved the structural strength and aesthetic appearance of fingerprint mould group 100.
In some embodiments of the utility model, as shown in Figure 4 and Figure 5, encapsulated layer 30 may include the second encapsulation sheet
Body 330 and spray coating 340, the second encapsulation main body 330 are located at the side of fingerprint sensor 10, as shown in Figure 4 and Figure 5, the second envelope
The upside that ontology 330 can be set to fingerprint sensor 10 is filled, fingerprint sensor 10 is sealed and be protected.
Spray coating 340 be sprayed on the second encapsulation main body 330 on a side surface of fingerprint sensor 10, such as Fig. 4 and
Shown in Fig. 5, spray coating 340 can be located on the uper side surface of the second encapsulation main body 330, by the way that spray coating 340, Ke Yiti is arranged
The aesthetic appearance of high second encapsulation main body 330.
As shown in Figure 4 and Figure 5, the side surface away from fingerprint sensor 10 of spray coating 340 is formed at least partially as
Curved surface.That is, spray coating 340 can partially be formed as curved surface, another part shape far from a side surface of fingerprint mould group 100
As plane；The surface of the separate fingerprint mould group 100 of spray coating 340 can also be integrally formed into curved surface.
It should be noted that as shown in figure 4, the part of the second encapsulation main body 330 is formed as curved surface, in the second encapsulation main body
330 upper surface can spray a layer thickness and uniformly spray layer 340, so that the upper surface portion of spray coating 340 be made to be formed as
Curved surface；As shown in figure 5, the upper surface of the second encapsulation main body 330 can be set to plane, in the upper table of the second encapsulation main body 330
Face can make the upper surface of spray coating 340 by the spray coating 340 of coating thickness unevenness with the spray coating 340 of coating thickness unevenness
Be formed as curved surface.
Some embodiments according to the present utility model could be formed with groove 350 as Figure 2-Figure 5 on encapsulated layer 30,
Wherein fingerprint sensor 10 is located in groove 350.As a result, convenient for the assembly between fingerprint sensor 10 and encapsulated layer 30.Groove
350 shape can be formed as shape compatible with fingerprint sensor 10, be filled with improving fingerprint sensor 10 and encapsulated layer 30
The convenience matched.In some embodiments of the utility model, encapsulated layer 30 can be plastic packaging above fingerprint sensor 10
Epoxy resin reduces the production cost of fingerprint mould group 100 thus, it is possible to improve the production efficiency of fingerprint mould group 100.
According to the electronic equipment 500 of the utility model embodiment, as shown in Figure 6 and Figure 7, electronic equipment 500 includes: shell
520 and fingerprint mould group 100 described above.
Wherein, through-hole section 521 is formed on shell 520, fingerprint mould group 100 is located at through-hole section 521.For example, can be
Through-hole section 521 is arranged in the surface of shell 520, and fingerprint mould group 100 can be embedded in through-hole section 521, and in through-hole section 521
Peripheral wall bonding, by fingerprint mould group 100 securely, be firmly secured on shell 520.
According to the electronic equipment 500 of the utility model embodiment, by by encapsulated layer 30 away from fingerprint sensor 10
Surface is set as curved surface, and the adaptation of fingerprint mould group 100 can be made to have the electronic equipment 500 of curved surface fingerprint mould group mounting portion.To
The appearance of fingerprint mould group 100 can be made preferably to be connected with the appearance of electronic equipment 500, avoid fingerprint mould group 100
The junction of appearance and the appearance of electronic equipment 500 generates lofty sense, improves the aesthetic appearance of electronic equipment 500.
Some embodiments according to the present utility model, as shown in fig. 7, the side of shell 520 can be formed as curved surface, by
This, can be improved the exterior aesthetics of electronic equipment 500.Through-hole section 521 is formed in the side of shell 520, the back of encapsulated layer 30
A side surface from fingerprint sensor 10 is adapted with the side of shell 520.In conjunction with shown in Fig. 2-Fig. 5, the upper table of encapsulated layer 30
Face can form curved surface compatible with the side of shell 520." being adapted " described here is it is to be understood that work as fingerprint mould group
100 when being embedded on the side wall of shell 520, and the appearance of fingerprint mould group 100 is connect with the side rounding off of shell 520.Example
Such as, encapsulated layer 30 can be consistent with the curvature of 520 side of shell, so as to so that fingerprint mould group 100 appearance and shell 520
Appearance between rounding off connection, and then improve the aesthetic appearance of electronic equipment 500.
In other embodiments of the utility model, fingerprint mould group 100 can also be embedded at the bottom wall or electricity of shell 520
On the front side wall of sub- equipment 500.Fingerprint mould group 100 can be shaped to compatible according to the appearance for being embedded position
Shape.
It is set with four specific embodiment detailed descriptions according to the electronics of the utility model embodiment referring to Fig. 1-Fig. 7
Standby 500.It is worth understanding, described below is only exemplary description, rather than to the concrete restriction of the utility model.
It should be noted that including, but are not limited to be configured to via wired as " electronic equipment 500 " as used herein
Connection (such as connects via Public Switched Telephone Network (PSTN), digital subscriber line (DSL), digital cable, direct cable
Connect and/or another data connection/network) and/or via (for example, for cellular network, WLAN (WLAN), such as
The digital TV network of DVB-H network, satellite network, AM-FM broadcasting transmitter and/or another communication terminal) wirelessly connect
Mouth reception/transmission signal of communication device.The example of electronic equipment 500 includes, but are not limited to satellite or cellular phone；It can group
Close PCS Personal Communications System (PCS) terminal of cellular radio telephone and data processing, fax and communication ability；It can wrap
Include radio telephone, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or global positioning system
The PDA of system (GPS) receiver；And conventional laptop and/or palmtop receiver or its including radiotelephone transceiver
Its electronic equipment 500.
Electronic equipment 500 can be the various equipment that can be obtained data from outside and be handled the data, alternatively,
Electronic equipment 500 can be it is various be built-in with battery, and can be from the external equipment that obtains electric current and charge to the battery, example
Such as, mobile phone (embodiment as shown in figures 6 and 7), tablet computer, calculating equipment or device for display of message etc..Mobile phone is only one
The citing of kind 500 equipment of electronic equipment, the application are simultaneously not particularly limited, and this application can be applied to the electricity such as mobile phone, tablet computer
Sub- equipment 500, the application does not limit this.
In the embodiment of the present application, mobile phone may include radio circuit, memory, input unit, Wireless Fidelity (WiFi,
Wireless fidelity) portions such as module, display screen 510, sensor, voicefrequency circuit, processor, fingerprint recognition component, battery
Part.
Wherein, radio circuit can be used for receive and send messages or communication process in, signal sends and receivees, particularly, will
After the downlink information of base station receives, processor processing is given；In addition, the data of mobile phone uplink are sent to base station.In general, radio frequency electrical
Road includes but is not limited to antenna 20, at least one amplifier, transceiver, coupler, low-noise amplifier, duplexer etc..This
Outside, radio circuit can also be communicated with network and other equipment by wireless communication.
Memory can be used for storing software program and module, and processor is stored in the software program of memory by operation
And module, thereby executing the various function application and data processing of mobile phone.Memory can mainly include storing program area and
Storage data area, wherein storing program area can application program needed for storage program area, at least one function (such as sound is broadcast
Playing function, image player function etc.) etc.；Storage data area, which can be stored, uses created data (such as audio number according to mobile phone
According to, phone directory etc.) etc..In addition, memory may include high-speed random access memory, it can also include non-volatile memories
Device, for example, at least a disk memory, flush memory device or other volatile solid-state parts.
Input unit can be used for receiving the number or character information of input, and generate the user setting and function with mobile phone
It can control related key signals.Specifically, input unit may include touch panel and other input equipments.Touch panel,
Referred to as touch screen, collecting the touch operation of user on it or nearby, (for example user is any suitable using finger, stylus etc.
The operation of object or attachment on touch panel or near touch panel), and driven accordingly according to preset formula
Attachment device.
Optionally, touch panel may include both touch detecting apparatus and touch controller.Wherein, touch detection fills
The touch orientation of detection user is set, and detects touch operation bring signal, transmits a signal to touch controller；Touch control
Device receives touch information from touch detecting apparatus, and is converted into contact coordinate, then gives processor, and can reception processing
Order that device is sent simultaneously is executed.Furthermore, it is possible to using multiple types such as resistance-type, condenser type, infrared ray and surface acoustic waves
Type realizes touch panel.In addition to touch panel, input unit can also include other input equipments.Specifically, other inputs are set
It is standby to can include but is not limited to physical keyboard, function key (such as volume control button, switch key etc.), trace ball, mouse, behaviour
Make one of bar etc. or a variety of.
Display screen 510 may include display panel, optionally, can use liquid crystal display (LCD, Liquid
Crystal Display), the forms such as Organic Light Emitting Diode (OLED, Organic Light-Emitting Diode) match
Set display panel.Further, touch panel can cover display panel, when touch panel detects touch on it or nearby
After operation, processor is sent to determine the type of touch event, is followed by subsequent processing device according to the type of touch event in display surface
Corresponding visual output is provided on plate.
Voicefrequency circuit, loudspeaker and microphone can provide the audio interface between user and mobile phone.Voicefrequency circuit can will connect
Electric signal after the audio data conversion received, is transferred to loudspeaker, is converted to voice signal output by loudspeaker；Another party
The voice signal of collection is converted to electric signal by face, microphone, is converted to audio data after being received by voicefrequency circuit, then by audio
After the processing of data output processing device, such as another mobile phone is sent to through radio circuit, or audio data is exported to storage
Device is to be further processed.
WiFi belongs to short range wireless transmission technology, mobile phone can help user to send and receive e-mail by WiFi module,
Webpage and access streaming video etc. are browsed, it provides wireless broadband internet access for user.But it is understood that
WiFi module is simultaneously not belonging to must be configured into for mobile phone, can according to need in the range for the essence for not changing application and saves completely
Slightly.
Processor is the control centre of mobile phone, and processor is mounted on circuit board assemblies, is connected using various interfaces and route
The various pieces for connecing whole mobile phone, by running or executing the software program and/or module that are stored in memory, and calling
The data being stored in memory execute the various functions and processing data of mobile phone, to carry out integral monitoring to mobile phone.It is optional
, processor may include one or more processing units；Preferably, processor can integrate application processor and modulation /demodulation processing
Device, wherein the main processing operation system of application processor, user interface and application program etc., modem processor is mainly located
Reason wireless communication.
Power supply can be logically contiguous with processor by power-supply management system, manages to be realized by power-supply management system
The functions such as charging, electric discharge and power managed.Although being not shown, mobile phone can also include bluetooth module, sensor (such as appearance
State sensor, can also configure the other sensors such as barometer, hygrometer, thermometer and infrared sensor at optical sensor) etc.,
Details are not described herein.
As shown in Figure 6 and Figure 7, electronic equipment 500 includes: shell 520, display screen 510 and fingerprint mould group 100 etc..
As shown in fig. 7, the side wall of shell 520 is formed as curved surface, fingerprint mould group 100 is embedded at the side wall of shell 520.Fingerprint
The appearance of mould group 100 is configured to curved surface compatible with the side of shell 520.
Wherein, as depicted in figs. 1 and 2, fingerprint mould group 100 includes that the steel being cascading mends 60, flexibility from bottom to top
Circuit board 20, substrate 50 and fingerprint sensor 10.Substrate 50 can support fixed fingerprint sensor 10, and steel mends 60 can be with supporting flexible
Property circuit board 20, convenient for being fixedly connected for flexible circuit board 20.The top plastic packaging of fingerprint sensor 10 has encapsulated layer 30, and fingerprint passes
The periphery wall of sensor 10 and substrate 50 is equipped with the case ring 40 extended along 10 circumferential direction of fingerprint sensor.As shown in Fig. 2, encapsulation
The edge of the periphery of layer 30 is configured to curved surface, to be adapted with the curved surface side of shell 520.
As a result, by setting curved surface for the surface away from fingerprint sensor 10 of encapsulated layer 30, fingerprint mould group can be made
100 adaptations have the electronic equipment 500 of curved surface fingerprint mould group mounting portion.So as to so that fingerprint mould group 100 appearance and electricity
The appearance of sub- equipment 500 is preferably connected, and avoids the appearance of fingerprint mould group 100 and the appearance of electronic equipment 500
Junction generates lofty sense, improves the aesthetic appearance of electronic equipment 500.
Embodiment two:
As shown in figure 3, what is different from the first embodiment is that in this embodiment, encapsulated layer 30 includes: the first encapsulation main body
310 and case chip 320,310 plastic packaging of the first encapsulation main body is attached in 10 upper surface of fingerprint sensor and outer peripheral surface, case chip 320
In the upper surface of the first encapsulation main body 310.The peripheral part of the upper surface of first encapsulation main body 310 is configured to curved surface, correspondingly,
Correspondingly position is configured to curved surface to case chip 320 with the curved surface periphery of the first encapsulation main body 310.Pass through setting envelope as a result,
Load 320 can use case chip 320 and block the first encapsulation main body 310 of protection and fingerprint sensor 10, improves fingerprint mould group
100 service life.
Embodiment three:
As shown in figure 4, what is different from the first embodiment is that in this embodiment, encapsulated layer 30 includes: the second encapsulation main body
330 and spray coating 340.Wherein, upper surface and outer peripheral surface of 330 plastic packaging of the second encapsulation main body in fingerprint sensor 10, the second envelope
The outer peripheral edge for filling the upper surface of ontology 330 is configured to curved surface.It is uniform that thickness is coated in the upper surface of the second encapsulation main body 330
Spray coating 340.Thus, it is possible to improve the exterior aesthetics of fingerprint mould group 100, and then improve the appearance of electronic equipment 500
Aesthetics.
Example IV:
As shown in figure 5, in this embodiment, the upper surface of the second encapsulation main body 330 is by structure unlike example IV
It makes as plane, the upper surface of the second encapsulation main body 330 and the portion perimeter face connecting with upper surface are coated with the spray of uneven thickness
Coating 340, so that the upper surface of spray coating 340 is configured to outer peripheral edge appearance in curved surface.Thus, it is possible to improve fingerprint mould
The suitability of group 100 and 500 curved surface sidewall of electronic equipment, to improve the aesthetic appearance of electronic equipment 500.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the utility model.In the present specification, to above-mentioned art
The schematic representation of language may not refer to the same embodiment or example.Moreover, description specific features, structure, material or
Person's feature can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that the embodiments of the present invention, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principles of the present invention and objective
And modification, the scope of the utility model are defined by the claims and their equivalents.
Claims (10)
1. a kind of fingerprint mould group characterized by comprising
Fingerprint sensor；
Flexible circuit board, the flexible circuit board are electrically connected with the fingerprint sensor；
Encapsulated layer, the encapsulated layer are located at the side of the fingerprint sensor, and the encapsulated layer deviates from the fingerprint sensor
A side surface be formed at least partially as curved surface.
2. fingerprint mould group according to claim 1, which is characterized in that at least portion of a side surface for the encapsulated layer
Divide and is formed towards the curved surface that the direction far from the fingerprint sensor is protruded.
3. fingerprint mould group according to claim 2, which is characterized in that at least portion of a side surface for the encapsulated layer
Divide and is formed towards the cambered surface that the direction far from the fingerprint sensor is protruded.
4. fingerprint mould group according to claim 1, which is characterized in that the side entire surface of the encapsulated layer is formed
For curved surface；Or
A side surface for the encapsulated layer includes central portion and the edge part for being looped around the central portion periphery, the center
Portion is formed as plane, and the edge part is formed as from the center of the central portion towards the direction of the edge part, is tilted towards institute
State the curved surface that the direction of fingerprint sensor extends.
5. fingerprint mould group described in any one of -4 according to claim 1, which is characterized in that the encapsulated layer includes:
First encapsulation main body, first encapsulation main body are located at the side of the fingerprint sensor；
Case chip, the case chip be covered in first encapsulation main body on a side surface of the fingerprint sensor,
The side surface away from the fingerprint sensor of the case chip is formed at least partially as curved surface.
6. fingerprint mould group according to claim 5, which is characterized in that the case chip is glass workpiece, ceramic member, plastic parts
Or metalwork.
7. fingerprint mould group described in any one of -4 according to claim 1, which is characterized in that the encapsulated layer includes the second encapsulation
Ontology and spray coating, second encapsulation main body are located at the side of the fingerprint sensor, and the spray coating is sprayed on described
Two encapsulation main bodies on a side surface of the fingerprint sensor, the spray coating away from the one of the fingerprint sensor
Side surface is formed at least partially as curved surface.
8. fingerprint mould group according to claim 1, which is characterized in that formed on the encapsulated layer it is fluted, wherein described
Fingerprint sensor is set in the groove.
9. a kind of electronic equipment characterized by comprising
Shell is formed with through-hole section on the shell；
Fingerprint mould group according to claim 1 to 8, the fingerprint mould group are located at the through-hole section.
10. electronic equipment according to claim 9, which is characterized in that the side of the shell is formed as curved surface,
The through-hole section is formed in the side of the shell, the side table away from the fingerprint sensor of the encapsulated layer
Face is adapted with the side of the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820560105.6U CN208384588U (en) | 2018-04-18 | 2018-04-18 | Fingerprint mould group and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820560105.6U CN208384588U (en) | 2018-04-18 | 2018-04-18 | Fingerprint mould group and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208384588U true CN208384588U (en) | 2019-01-15 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820560105.6U Expired - Fee Related CN208384588U (en) | 2018-04-18 | 2018-04-18 | Fingerprint mould group and electronic equipment |
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| Country | Link |
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| CN (1) | CN208384588U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110321831A (en) * | 2019-06-28 | 2019-10-11 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
| WO2022047761A1 (en) * | 2020-09-06 | 2022-03-10 | 深圳市汇顶科技股份有限公司 | Chip processing method and system, chip, and device |
| WO2022141367A1 (en) * | 2020-12-31 | 2022-07-07 | 深圳市汇顶科技股份有限公司 | Cambered capacitive fingerprint packaging structure, module, electronic device and packaging method |
| WO2022151364A1 (en) * | 2021-01-15 | 2022-07-21 | 深圳市汇顶科技股份有限公司 | Apparatus for recognizing biometric information, and electronic device |
-
2018
- 2018-04-18 CN CN201820560105.6U patent/CN208384588U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110321831A (en) * | 2019-06-28 | 2019-10-11 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
| WO2020259025A1 (en) * | 2019-06-28 | 2020-12-30 | 维沃移动通信有限公司 | Fingerprint module and mobile terminal |
| WO2022047761A1 (en) * | 2020-09-06 | 2022-03-10 | 深圳市汇顶科技股份有限公司 | Chip processing method and system, chip, and device |
| WO2022141367A1 (en) * | 2020-12-31 | 2022-07-07 | 深圳市汇顶科技股份有限公司 | Cambered capacitive fingerprint packaging structure, module, electronic device and packaging method |
| WO2022151364A1 (en) * | 2021-01-15 | 2022-07-21 | 深圳市汇顶科技股份有限公司 | Apparatus for recognizing biometric information, and electronic device |
| US11756328B2 (en) | 2021-01-15 | 2023-09-12 | Shenzhen GOODIX Technology Co., Ltd. | Biological information identification apparatus and electronic device |
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