CN112771663A - Welding pad, electronic device, connection structure of electronic device and manufacturing method of welding resistance layer - Google Patents
Welding pad, electronic device, connection structure of electronic device and manufacturing method of welding resistance layer Download PDFInfo
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- CN112771663A CN112771663A CN201880098120.6A CN201880098120A CN112771663A CN 112771663 A CN112771663 A CN 112771663A CN 201880098120 A CN201880098120 A CN 201880098120A CN 112771663 A CN112771663 A CN 112771663A
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- 238000003466 welding Methods 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 181
- 238000000034 method Methods 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 238000011161 development Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 70
- 238000010586 diagram Methods 0.000 description 9
- 230000007704 transition Effects 0.000 description 7
- 208000037656 Respiratory Sounds Diseases 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004021 metal welding Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The embodiment of the application provides a pad, an electronic device and a manufacturing method of a connecting structure and a solder mask of the electronic device, relates to the technical field of electronic element connection, and the pad comprises a pad body and covers in the solder mask above the pad body, and is formed with a through hole for welding in the thickness direction of the solder mask, wherein the area of the through hole is smaller than that of the pad body, and the area of the through hole is along the direction of the pad body which is gradually increased.
Description
The application relates to the technical field of electronic element connection, in particular to a bonding pad, an electronic device, a connection structure of the electronic device and a manufacturing method for forming a solder mask on the bonding pad of the electronic device.
Electrical signals and mechanical interconnections between surface mount chips and circuit substrates are typically accomplished through solder joints. The structure of the welding spot is composed of a PCB, a metal welding disc exposed outside of the chip substrate and welding flux between the PCB and the metal welding disc. There are generally two design approaches for pads, namely Solder Mask Defined (SMD) pad design and Non-Solder Mask Defined (NSMD) pad design.
Fig. 1 and 2 show a structure of an SMD pad, where a layer of green oil 02 is disposed above a pad 01 to cover an edge of the pad 01, and this design can increase a copper-spreading area of the pad 01 below the green oil 02, and the edge of the pad 01 is protected by the green oil 02, and the pad 01 and a circuit substrate 04 are connected firmly, so that the pad has a strong ability to resist pad pitting, but the orifice of a through hole 021 of the pad corresponding to the green oil 02 at the edge of the SMD pad is designed at a right angle, so that a connection 031 between a solder point 03 and the green oil 02 is not smooth in transition, and the connection 031 between the solder point 03 and the green oil 02 is prone to stress concentration, resulting in failure of the solder point 03 due to thermal fatigue stress or mechanical impact stress at an early stage. Fig. 3 shows a structure of an NSMD pad, in the NSMD pad design, green oil 02 does not cover a pad 01, a pad 03 wraps the pad, the profile of the pad 03 is smooth, and stress concentration is not easy to occur, so that the internal fracture resistance of the pad 03 is strong, but the pad area of the NSMD pad is small and the periphery of the NSMD pad is not protected by the green oil 02, so that fracture is easy to occur between the pad 01 and a circuit substrate 04 below the pad, and the crater crack resistance of the pad is poor.
Disclosure of Invention
The bonding pad, the electronic device, the connection structure of the electronic device and the manufacturing method for forming the solder mask layer on the bonding pad of the electronic device solve the problem that an SMD bonding pad structure in the prior art is prone to fracture.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect, the application provides a pad, include the pad body and cover in the solder mask of pad body top follows the thickness direction of solder mask is formed with and is used for the welded through-hole, the area of through-hole is less than the area of pad body, just the area of through-hole is followed and is kept away from the direction crescent of pad body.
The pad that this application embodiment provided, because the through-hole area of solder mask is less than the area of pad body, consequently, a part of pad body is covered by the solder mask for the connection between pad body and the base plate is more firm, and the pad is difficult for droing from the base plate. And because the area of through-hole is along keeping away from the direction of pad body crescent, from this, when welding, the solder joint can smooth transition in the through-hole department of solder mask, is difficult for forming the closed angle, and the crackle is difficult for here to sprout to the solder joint thermal fatigue resistance and the ability of anti brittle fracture have been promoted.
In a possible implementation, the hole wall of the through hole is a slope. The bevel structure is easy to process.
In a possible implementation manner, the inclination angle of the hole wall of the through hole is 20-60 degrees. Therefore, the solder mask can avoid the solder joint, and the part of the solder mask covering the solder pad body is thicker so as to form better fixation on the solder pad.
In a possible implementation, the hole wall of the through hole is a concave arc surface. Therefore, the gap between the welding spot and the wall of the through hole of the solder mask layer can be larger, and the welding spot is further ensured not to be in contact with the solder mask layer.
In a possible implementation, the solder mask is made of liquid photo solder resist.
In a possible implementation, a chamfer is formed at the aperture of the through hole. Thereby, the aperture of the through hole may be made smoother, thereby further avoiding the formation of stress concentrations at the aperture of the through hole.
In a second aspect, the application further provides an electronic device, including being used for the connection face of being connected with other electronic devices, it is equipped with at least one pad body to connect the face, it has the solder mask to connect the covering, the solder mask corresponds the position of pad body is formed with and is used for the welded through-hole, the area of through-hole is less than the area of pad body, just the area of through-hole is followed and is kept away from the direction crescent of pad body.
The electronic device that this application embodiment provided, because the through-hole area of solder mask is less than the area of pad body, consequently, a part of pad body is covered by the solder mask for the connection between pad body and the base plate is more firm, and the pad body is difficult for droing from the base plate. And because the area of through-hole is along keeping away from the direction of pad body crescent, from this, when welding, the solder joint can smooth transition in the through-hole department of solder mask, is difficult for forming the closed angle, has avoided the junction between solder mask and the solder joint to produce stress concentration, and the crackle is difficult for here to be sprouted to solder joint thermal fatigue resistance and anti brittle fracture's ability has been promoted. Thereby making the connection of the electronic device with other electronic devices more stable.
In a possible implementation manner of the second aspect, the hole wall of the through hole is a slope.
In a possible implementation manner of the second aspect, the inclination angle of the hole wall of the through hole is 20 ° to 60 °.
In a possible implementation manner of the second aspect, the electronic device is a chip or a circuit substrate.
In a third aspect, the present application also provides a connection structure of an electronic device, including:
the chip, the connection face of chip is equipped with at least one first pad body, the connection face of chip covers there is first solder mask, first solder mask corresponds the position of first pad body is formed with and is used for the first through-hole of welded, the area of first through-hole is less than the area of first pad body, just the area of first through-hole is along keeping away from the direction crescent of first pad body.
The circuit board is provided with at least one second pad body on the connecting surface, a second solder mask is covered on the connecting surface of the circuit board, a second through hole for welding is formed in the position, corresponding to the second pad body, of the second solder mask, the area of the second through hole is smaller than that of the second pad body, and the area of the second through hole is gradually increased along the direction far away from the second pad body;
the first pad body of the chip is welded with the second pad body of the substrate through a welding spot, the first end of the welding spot is located in the first through hole, the second end of the welding spot is located in the second through hole, a gap is formed between the first end of the welding spot and the hole wall of the first through hole, and a gap is formed between the second end of the welding spot and the hole wall of the second through hole.
The electronic device's that this application embodiment provided connection structure, because the area of first through-hole is along keeping away from the direction crescent of first pad body, and the area of second through-hole is along keeping away from the direction crescent of second pad body, consequently, some of pad body is covered by the solder mask for the connection between pad body and the base plate is more firm, and the pad is difficult for droing from the base plate. And because the area of through-hole is along the direction crescent of keeping away from the pad body, from this, when welding, the solder joint can smooth transition in the through-hole department of solder mask, is difficult for forming the closed angle, has avoided the junction between solder mask and the solder joint to produce stress concentration, and the crackle is difficult for here to be sprouted to solder joint thermal fatigue resistance and anti brittle fracture's ability has been promoted. Thereby making the connection between the chip and the circuit substrate more stable.
In a fourth aspect, the present application further provides a method for forming a solder mask layer on a pad of an electronic device, where the electronic device includes a connection surface, and the connection surface is provided with at least one pad body, and the method includes the following steps:
forming a solder mask layer on a connecting surface of the electronic device, wherein the solder mask layer is formed by a photoinduced solder mask material;
the method comprises the steps of completely removing the solder mask covered by the middle area of the pad body through exposure and development processes, and partially removing the solder mask covered by the edge area of the pad body, so that the area of a through hole surrounded by the solder mask covered by the edge area of the pad body is gradually increased along the direction far away from the pad body.
According to the manufacturing method for forming the solder mask layer on the welding pad of the electronic device, the shape of the solder mask layer is controlled through the exposure and development processes, so that the area of the through hole formed by the surrounding of the solder mask layer is gradually increased along the direction far away from the welding pad body, and the method is simple in process and convenient to achieve.
In a possible implementation manner of the fourth aspect, in order to remove the local part of the solder mask layer covered by the edge region of the pad body, so that the area of the through hole surrounded by the solder mask layer covered by the edge region of the pad body is gradually increased along a direction away from the pad body, the following steps may be implemented: in the exposure process, the light intensity of the solder mask layer covering the edge area of the pad body is gradually weakened along the direction parallel to the connecting surface and far away from the center of the pad body.
In a possible implementation manner of the fourth aspect, in order to remove a part of the solder mask layer covered by the edge region of the pad body, so that an area of the through hole surrounded by the solder mask layer covered by the edge region of the pad body is gradually increased along a direction away from the pad body, the method may further include: in the exposure process, the irradiation direction of the light beam irradiating the solder mask covering the edge area of the pad body is inclined towards the direction close to the center of the pad body.
In a possible implementation manner of the fourth aspect, in order to incline the irradiation direction of the light irradiating the solder resist layer covering the edge area of the pad body to a direction close to the center of the pad body, the following steps may be implemented: and arranging a convex lens between a light source of the exposure process and the pad, so that the irradiation direction of light rays irradiating the solder mask covering the edge area of the pad body is inclined towards the direction close to the center of the pad body.
In a possible implementation manner of the fourth aspect, in order to remove a part of the solder mask layer covered by the edge region of the pad body, so that an area of the through hole surrounded by the solder mask layer covered by the edge region of the pad body is gradually increased along a direction away from the pad body, the method may further include: before the exposure process, cover the light shield layer on the solder mask layer, the light shield layer corresponds the middle part region of pad body is formed with the through-hole, the light shield layer cover in the partial transmittance of the marginal area of pad body reduces along being on a parallel with the connection face and keeping away from the direction at pad body center gradually.
FIG. 1 is a schematic diagram of an SMD pad structure;
FIG. 2 is a schematic diagram of an SMD pad and solder joint structure;
FIG. 3 is a schematic diagram of an NSMD pad and pad configuration;
FIG. 4 is a schematic structural diagram of a bonding pad according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural diagram of a bonding pad and a bonding pad according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of another structure of a bonding pad according to an embodiment of the present application;
FIG. 7 is an overall view of another structure of a bonding pad and a bonding pad according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a chamfer provided at an aperture of a through hole of a solder resist layer of a pad according to an embodiment of the present application;
FIG. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 10 is a schematic structural view of a connection structure of an electronic device according to an embodiment of the present application;
fig. 11 is a schematic structural view showing another connection mode of a connection structure of an electronic device according to an embodiment of the present application;
FIG. 12 is a comparison graph of the results of a drop simulation experiment;
FIG. 13 is a comparison graph of the results of the temperature-impact simulation experiment;
fig. 14 is a schematic view illustrating a light shielding layer is covered on a solder mask layer in a method for manufacturing a solder mask layer according to an embodiment of the present application;
fig. 15 is a schematic diagram of a solder mask layer in the middle of a pad etched by an exposure and development process in a method for manufacturing a solder mask layer according to an embodiment of the present application;
fig. 16 is a schematic view of a convex lens adopted to focus a light source in the method for manufacturing a solder mask according to the embodiment of the present application.
As shown in fig. 4, the embodiment of the present application provides a pad, including pad body 1 and cover in solder mask 2 above pad body 1, follow solder mask 2's thickness direction is formed with through-hole 21 that is used for the welding, the area of through-hole 21 is less than the area of pad body 1, just the area of through-hole 21 is along keeping away from the direction of pad body 1 increases gradually.
The pad that this application embodiment provided, because the area of the through-hole 21 of solder mask 2 is less than the area of pad body 1, consequently, a part of pad body 1 is covered by solder mask 2 for the connection between pad body 1 and the base plate is more firm, and the pad is difficult for droing from the base plate. And because the area of through-hole 21 is along keeping away from the direction crescent of pad body 1, from this, when welding, as shown in fig. 5, solder joint 3 can smooth transition in solder mask 2's through-hole 21 department, and difficult formation closed angle has avoided the junction between solder mask 2 and the solder joint 3 to produce stress concentration, and the crackle is difficult here to be sprouted to solder joint 3 thermal fatigue resistance and anti brittle fracture's ability have been promoted.
In order to avoid the formation of a sharp corner after the solder joint 3 is connected with the solder mask layer 2, the solder joint 3 can be avoided from the hole wall 211 of the through hole 21 of the solder mask layer 2 as much as possible during welding, and specifically, the coverage area of the solder joint 3 can be controlled in the following manner: this can be achieved, for example, by adjusting the amount of solder paste used, the weight of the device, the area of the pads, etc. The more the solder paste is used, the larger the coverage area of the welding spot 3 is, and the less the solder paste is used, the smaller the coverage area of the welding spot 3 is; the larger the weight of the device (such as a chip, a PCB and the like), the larger the deformation amount of the extruded welding spot 3 is, the larger the coverage area is, and the smaller the weight of the device is, the smaller the deformation amount of the extruded welding spot 3 is, and the smaller the coverage area is; the larger the pad area is, the larger the area of the pad 3 can be made, and the smaller the pad area is, the smaller the area of the pad 3 can be made. Therefore, the size of the welding spot 3 can be controlled according to the area of the welding pad, so that the welding spot 3 is avoided from the solder mask layer 2.
Specifically, the solder resist layer 2 may be a liquid photo solder resist (commonly called green oil), which is a kind of protective layer coated on a circuit board and a substrate that do not need to be soldered, or used as a solder resist. The purpose is to protect the formed circuit pattern for a long period of time.
In order to realize that the area of the through hole 21 gradually increases along the direction away from the pad body 1, there may be various implementations, for example, the hole wall 211 of the through hole 21 may be an inclined surface, as shown in fig. 4, the hole wall 211 of the through hole 21 gradually inclines towards the direction away from the axis of the through hole 21 along the direction away from the pad body 1, and the inclined surface structure is easy to process. Specifically, the through-hole 21 may be a conical hole or a pyramidal hole. In another possible implementation manner, as shown in fig. 6 and 7, the hole wall 211 of the through hole 21 may also be a concave arc structure. The concave arc structure can make the gap between the welding spot 3 and the hole wall 211 of the through hole 21 of the solder mask layer 2 larger, and further ensure that the welding spot 3 is not in contact with the solder mask layer 2.
In order to make the aperture of the through hole 21 smoother, as shown in fig. 8, a chamfer 212 may be formed at the upper end aperture of the through hole 21, and the chamfer 212 may be a bevel or a fillet as shown in fig. 8, thereby making the aperture of the through hole 21 smoother and further avoiding the formation of stress concentration at the aperture of the through hole 21.
As shown in fig. 4, the inclination angle α of the hole wall 211 of the through-hole 21 may be 20 ° to 60 °. If the value of inclination angle alpha is too big, then solder mask 2 is too close to solder joint 3, is difficult to control the size of solder joint 3 when the welding, if the value of inclination angle alpha is undersize, then solder mask 2 covers the partial thickness of pad body 1 and is thinner, and the fixed effect to pad body 1 is relatively poor. Therefore, the inclination angle α of the hole wall 211 of the through hole 21 is set to 20 ° to 60 °, so that the solder resist layer 2 can avoid the open solder joints 3, and the thickness of the portion of the solder resist layer 2 covering the pad body 1 can be made thick, thereby forming a good fixation to the pad body 1.
On the other hand, as shown in fig. 9, this application still provides an electronic device, this electronic device is including being used for being connected with other electronic devices connecting face 4, connecting face 4 is equipped with at least one pad body 1, connecting face 4 covers there is solder mask 2, solder mask 2 corresponds the position of pad body 1 is formed with the through-hole 21 that is used for the welding, the area of through-hole 21 is less than the area of pad body 1, just the area of through-hole 21 is along keeping away from the direction of pad body 1 increases gradually.
The electronic device provided by the embodiment of the application has the advantages that the area of the through hole 21 of the solder mask layer 2 is smaller than that of the pad body 1, so that one part of the pad body 1 is covered by the solder mask layer 2, the connection between the pad body 1 and the substrate is stable, and the pad body 1 is not easy to fall off from the substrate. And because the area of through-hole 21 is along keeping away from the direction crescent of pad body 1, from this, when welding, solder joint 3 can smooth transition in solder mask 2's through-hole 21 department, is difficult for forming the closed angle, has avoided the junction between solder mask 2 and solder joint 3 to produce stress concentration, and the crackle is difficult for here to be sprouted to solder joint 3 thermal fatigue resistance and anti brittle fracture's ability have been promoted. Thereby making the connection of the electronic device with other electronic devices more stable.
The electronic device may be a chip, a Printed Circuit Board (PCB), or other electronic devices that can be soldered by a pad, which is not limited herein.
On the other hand, as shown in fig. 10, the present application also provides a connection structure of an electronic device, including:
The circuit board 200 is provided with at least one second pad body 1b on a connection surface of the circuit board 200, a second solder mask layer 2b covers the connection surface of the circuit board 200, a second through hole 21b for welding is formed in a position, corresponding to the second pad body 1b, of the second solder mask layer 2b, the area of the second through hole 21b is smaller than that of the second pad body 1b, and the area of the second through hole 21b is gradually increased along a direction far away from the second pad body 1 b;
the first pad body 1a of the chip 100 is welded with the second pad body 1b of the substrate through a welding spot 3, a first end 31 of the welding spot is located in the first through hole 21a, a second end 32 of the welding spot is located in the second through hole 21b, a gap is formed between the first end 31 of the welding spot and the hole wall of the first through hole 21a, and a gap is formed between the second end 32 of the welding spot and the hole wall of the second through hole 21 b.
The connection structure of electronic device that this application embodiment provided, because the area of first through-hole 21a is along keeping away from first pad body 1 a's direction crescent, and the area of second through-hole 21b is along keeping away from second pad body 1 b's direction crescent, consequently, the partly quilt of pad body covers by the solder mask for the connection between pad body and the base plate is more firm, and the pad is difficult for coming off from the base plate. And because the area of through-hole is along the direction crescent of keeping away from the pad body, from this, when welding, the solder joint can smooth transition in the through-hole department of solder mask, is difficult for forming the closed angle, has avoided the junction between solder mask and the solder joint to produce stress concentration, and the crackle is difficult for here to be sprouted to solder joint thermal fatigue resistance and anti brittle fracture's ability has been promoted. Thereby making the connection of the chip 100 and the circuit substrate 200 more stable.
Note that, one of the pad structure on the chip 100 side and the pad structure on the circuit board 200 side may be an NSMD pad structure, and as shown in fig. 11, the pad structure on the chip 100 side is an SMD pad structure of the present application, and the pad structure on the circuit board 200 side is an NSMD pad structure, and in this case, the second solder resist layer 2b does not contact the second pad body 1 b.
In order to further illustrate the influence of the pad structure on the welding stability of the electronic device, drop and warm-punching simulation experiments can be respectively performed on the following four welding schemes, wherein the first scheme comprises the following steps: the bonding pads on the chip adopt the traditional SMD bonding pad structure shown in FIG. 1, and the bonding pads on the circuit substrate adopt the NSMD bonding pad structure shown in FIG. 3; scheme II: the bonding pads on the chip adopt the traditional SMD bonding pad structure shown in FIG. 1, and the bonding pads on the circuit substrate also adopt the traditional SMD bonding pad structure shown in FIG. 1; scheme three (shown in fig. 11): the bonding pads on the chip adopt the SMD bonding pad structure shown in FIG. 4 of the application, and the bonding pads on the circuit substrate adopt the NSMD bonding pad structure shown in FIG. 3; scheme four (as shown in fig. 10): the bonding pads on the chip adopt the SMD bonding pad structure shown in the figure 4 of the application, and the bonding pads on the circuit substrate also adopt the SMD bonding pad structure shown in the figure 4 of the application. Fig. 12 is a comparison graph of the results of the drop simulation experiments of the above four schemes, as can be seen from fig. 12, compared with the conventional solder joint structure, the drop stress level of the solder joint can be reduced by more than 15.4% due to the adoption of the structure of the SMD pad of the present application in the third and fourth schemes, as can be seen from fig. 13, compared with the conventional solder joint structure, the drop stress level of the solder joint can be reduced by more than 31.6% due to the adoption of the structure of the SMD pad of the present application in the third and fourth schemes, and the drop stress and thermal fatigue reliability of the solder joint can be significantly improved.
On the other hand, the present application also provides a manufacturing method for forming a solder mask layer on a pad of an electronic device, as shown in fig. 9, the electronic device includes a connection surface 4, the connection surface 4 is provided with at least one pad body 1, and the method includes the following steps:
forming a solder mask layer 2 on a connecting surface 4 of the electronic device, wherein the solder mask layer 2 is made of a photoinduced solder mask material;
the method comprises the steps of completely removing the solder mask layer 2 covered on the middle area of the pad body 1 through exposure and development processes, and partially removing the solder mask layer 2 covered on the edge area of the pad body 1, so that the area of a through hole 21 surrounded by the solder mask layer 2 covered on the edge area of the pad body 1 is gradually increased along the direction far away from the pad body 1.
In the exposure and development process, before exposure, as shown in fig. 14, a light shielding layer 6 is firstly covered on the solder mask layer 2, a light transmission hole 61 is formed in the light shielding layer 6 corresponding to the middle region of the pad body 1, and in the exposure and development process, as shown in fig. 15, light is irradiated into the solder mask layer 2 through the light transmission hole 61, so that part of the solder mask layer 2 is removed, and the metal layer below the solder mask layer 2 is exposed.
According to the manufacturing method for forming the solder mask layer 2 on the welding pad of the electronic device, the shape of the solder mask layer 2 is controlled through the exposure and development processes, so that the area of the through hole 21 surrounded by the solder mask layer 2 is gradually increased along the direction far away from the welding pad body 1, and the method is simple in process and convenient to implement.
In order to remove the local part of the solder mask layer 2 covered by the edge area of the pad body 1, in a possible implementation manner, the light intensity of the light irradiating the solder mask layer 2 covered by the edge area of the pad body 1 can be gradually weakened along a direction parallel to the connection surface and far away from the center of the pad body 1 in the exposure process. Thus, the stronger the light, the less the solder resist layer 2 remains after the light is irradiated, and the weaker the light, the more the solder resist layer 2 remains after the light is irradiated, so that the area of the through hole 21 can be gradually increased in the direction away from the pad body 1. Specifically, the brightness of the light source corresponding to the solder resist layer 2 covering the edge area of the pad body 1 may be adjusted to be gradually reduced in a direction away from the pad body 1.
In another possible implementation manner, in the exposure process, the irradiation direction of the light irradiating the solder resist layer 2 covering the edge area of the pad body 1 may be inclined toward the center of the pad body 1. Thus, by inclining the irradiation light, the inner wall of the through hole 21 of the solder resist layer 2 is inclined to realize that the area of the through hole 21 is gradually increased in a direction away from the pad body 1.
Specifically, in order to incline the irradiation direction of the light beam irradiating the solder resist layer 2 covering the edge area of the pad body 1 toward the center of the pad body 1, the light source corresponding to the solder resist layer 2 covering the edge area of the pad body 1 may be inclined. As shown in fig. 16, a convex lens 5 may be disposed between the light source and the pad body 1, so that the convex lens 5 converges the light of the light source toward the center of the pad body 1, and the irradiation direction of the light is inclined toward the center of the pad body 1.
In another possible implementation manner, in order to remove a part of the solder mask layer 2 covered by the edge region of the pad body 1, the light transmittance of the part of the light shielding layer covered by the edge region of the pad body 1 may be gradually reduced along a direction parallel to the connection surface and away from the center of the pad body 1. Therefore, the light rays of the part covered on the edge area of the pad body 1 through the light shielding layer are correspondingly gradually weakened along the direction parallel to the connecting surface and far away from the center of the pad body 1, so that the area of the through hole 21 is gradually increased along the direction far away from the pad body 1.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (14)
- The utility model provides a pad, its characterized in that, include the pad body and cover in the solder mask of pad body top follows the thickness direction of solder mask is formed with and is used for the welded through-hole, the area of through-hole is less than the area of pad body, just the area of through-hole is along keeping away from the direction crescent of pad body.
- The bonding pad of claim 1, wherein the via wall is beveled.
- The bonding pad according to claim 2, wherein the wall of the through hole has an inclination angle of 20 ° to 60 °.
- The bonding pad of claim 1, wherein the wall of the through hole is a concave arc.
- The utility model provides an electronic device, its characterized in that, is including being used for the connection face of being connected with other electronic devices, it is equipped with at least one pad body to connect the face, it has the solder mask to connect the covering, the solder mask corresponds the position of pad body is formed with and is used for the welded through-hole, the area of through-hole is less than the area of pad body, just the area of through-hole is along keeping away from the direction crescent of pad body.
- The electronic device of claim 5, wherein the wall of the via is beveled.
- The electronic device according to claim 6, wherein an inclination angle of a wall of the through hole is 20 ° to 60 °.
- The electronic device according to any one of claims 5 to 7, wherein the electronic device is a chip or a circuit substrate.
- A connecting structure of an electronic device, comprising:the chip comprises a chip, wherein the connecting surface of the chip is provided with at least one first pad body, the connecting surface of the chip is covered with a first solder mask, a first through hole for welding is formed in the position, corresponding to the first pad body, of the first solder mask, the area of the first through hole is smaller than that of the first pad body, and the area of the first through hole is gradually increased along the direction far away from the first pad body;the circuit board is provided with at least one second pad body on the connecting surface, a second solder mask is covered on the connecting surface of the circuit board, a second through hole for welding is formed in the position, corresponding to the second pad body, of the second solder mask, the area of the second through hole is smaller than that of the second pad body, and the area of the second through hole is gradually increased along the direction far away from the second pad body;the first pad body of the chip is welded with the second pad body of the substrate through a welding spot, the first end of the welding spot is located in the first through hole, the second end of the welding spot is located in the second through hole, a gap is formed between the first end of the welding spot and the hole wall of the first through hole, and a gap is formed between the second end of the welding spot and the hole wall of the second through hole.
- A manufacturing method for forming a solder mask layer on a pad of an electronic device, wherein the electronic device comprises a connecting surface, and the connecting surface is provided with at least one pad body, and the manufacturing method is characterized by comprising the following steps:forming a solder mask layer on a connecting surface of the electronic device, wherein the solder mask layer is formed by a photoinduced solder mask material;the method comprises the steps of completely removing the solder mask covered by the middle area of the pad body through exposure and development processes, and partially removing the solder mask covered by the edge area of the pad body, so that the area of a through hole surrounded by the solder mask covered by the edge area of the pad body is gradually increased along the direction far away from the pad body.
- A method for forming a solder mask on a pad of an electronic device as claimed in claim 10, wherein the partial removal of the solder mask covered by the edge region of the pad body to make the area of the through hole surrounded by the solder mask covered by the edge region of the pad body gradually increase along the direction far away from the pad body comprises:in the exposure process, the light intensity of the solder mask layer covering the edge area of the pad body is gradually weakened along the direction parallel to the connecting surface and far away from the center of the pad body.
- A method for forming a solder mask on a pad of an electronic device as claimed in claim 10, wherein the partial removal of the solder mask covered by the edge region of the pad body to make the area of the through hole surrounded by the solder mask covered by the edge region of the pad body gradually increase along the direction far away from the pad body comprises:in the exposure process, the irradiation direction of the light beam irradiating the solder mask covering the edge area of the pad body is inclined towards the direction close to the center of the pad body.
- A method for forming a solder resist layer on a pad of an electronic device as described in claim 12, wherein said inclining an irradiation direction of a light ray irradiating the solder resist layer covering an edge area of the pad body to a direction close to a center of the pad body comprises:and arranging a convex lens between a light source of the exposure process and the pad, so that the irradiation direction of light rays irradiating the solder mask covering the edge area of the pad body is inclined towards the direction close to the center of the pad body.
- A method for forming a solder mask on a pad of an electronic device as claimed in claim 10, wherein the partial removal of the solder mask covered by the edge region of the pad body to make the area of the through hole surrounded by the solder mask covered by the edge region of the pad body gradually increase along the direction far away from the pad body comprises:before the exposure process, cover the light shield layer on the solder mask layer, the light shield layer corresponds the middle part region of pad body is formed with the through-hole, the light shield layer cover in the partial transmittance of the marginal area of pad body reduces along being on a parallel with the connection face and keeping away from the direction at pad body center gradually.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/108903 WO2020062195A1 (en) | 2018-09-29 | 2018-09-29 | Solder pad, electronic device, and connection structure thereof, and method for fabricating solder resist layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112771663A true CN112771663A (en) | 2021-05-07 |
Family
ID=69952711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880098120.6A Pending CN112771663A (en) | 2018-09-29 | 2018-09-29 | Welding pad, electronic device, connection structure of electronic device and manufacturing method of welding resistance layer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112771663A (en) |
| WO (1) | WO2020062195A1 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002171052A (en) * | 2000-12-04 | 2002-06-14 | Kyocera Corp | Wiring board and electronic device using the same |
| US20070114674A1 (en) * | 2005-11-22 | 2007-05-24 | Brown Matthew R | Hybrid solder pad |
| US20130118792A1 (en) * | 2011-11-10 | 2013-05-16 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
| CN103178043A (en) * | 2011-12-20 | 2013-06-26 | 日本特殊陶业株式会社 | Wiring board and method of manufacturing the same |
| JP2016127066A (en) * | 2014-12-26 | 2016-07-11 | イビデン株式会社 | Printed wiring board with bump and manufacturing method of the same |
| US20170303396A1 (en) * | 2016-04-14 | 2017-10-19 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| CN207690105U (en) * | 2017-10-13 | 2018-08-03 | 欧菲影像技术（广州）有限公司 | Fingerprint module and electronic equipment equipped with the fingerprint module |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9030019B2 (en) * | 2010-12-14 | 2015-05-12 | Infineon Technologies Ag | Semiconductor device and method of manufacture thereof |
| JP2012156257A (en) * | 2011-01-25 | 2012-08-16 | Fujitsu Ltd | Circuit board, and electronic device |
| US20160029486A1 (en) * | 2014-07-24 | 2016-01-28 | Samsung Electro-Mechanics Co., Ltd. | Solder joint structure and electronic component module including the same |
-
2018
- 2018-09-29 CN CN201880098120.6A patent/CN112771663A/en active Pending
- 2018-09-29 WO PCT/CN2018/108903 patent/WO2020062195A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002171052A (en) * | 2000-12-04 | 2002-06-14 | Kyocera Corp | Wiring board and electronic device using the same |
| US20070114674A1 (en) * | 2005-11-22 | 2007-05-24 | Brown Matthew R | Hybrid solder pad |
| US20130118792A1 (en) * | 2011-11-10 | 2013-05-16 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method for manufacturing the same |
| CN103178043A (en) * | 2011-12-20 | 2013-06-26 | 日本特殊陶业株式会社 | Wiring board and method of manufacturing the same |
| JP2016127066A (en) * | 2014-12-26 | 2016-07-11 | イビデン株式会社 | Printed wiring board with bump and manufacturing method of the same |
| US20170303396A1 (en) * | 2016-04-14 | 2017-10-19 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| CN207690105U (en) * | 2017-10-13 | 2018-08-03 | 欧菲影像技术（广州）有限公司 | Fingerprint module and electronic equipment equipped with the fingerprint module |
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| Publication number | Publication date |
|---|---|
| WO2020062195A1 (en) | 2020-04-02 |
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