CN209044625U - Bio-sensing chip and electronic equipment - Google Patents
Bio-sensing chip and electronic equipment Download PDFInfo
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- CN209044625U CN209044625U CN201790000266.3U CN201790000266U CN209044625U CN 209044625 U CN209044625 U CN 209044625U CN 201790000266 U CN201790000266 U CN 201790000266U CN 209044625 U CN209044625 U CN 209044625U
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- bio
- electrostatic protection
- sensing chip
- protection element
- bare die
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
Abstract
It includes: substrate and the wafer bare die being set on the substrate, an at least electrostatic protection element that the utility model, which discloses a kind of bio-sensing chip and electronic equipment, the bio-sensing chip,；The electrostatic protection element is located at the outside of the wafer bare die, and the electrostatic protection element is greater than vertical height of the wafer bare die relative to the substrate relative to the vertical height of the substrate, and the electrostatic protection element is for releasing electrostatic.The electronic equipment includes above-mentioned bio-sensing chip.
Description
Technical field
The utility model relates to a kind of bio-sensing chip of antistatic and electronic equipments.
Background technique
As its name suggests, bio-sensing chip be used for user in contact with or close to when, to contact object biological information
It is sensed.Such as fingerprint sensor, the object in contact with or close to the sensor can be sensed, and obtain fingerprint image.
However, human body is conductor, when user contacts or contacts the sensor, static electricity on human body can be to the circuit in sensor
It impacts, causes bio-sensing chip sensing efficiency to reduce and even fail.
Utility model content
The utility model embodiment aims to solve at least one of the technical problems existing in the prior art.For this purpose, this reality
Need to provide a kind of bio-sensing chip and electronic equipment with novel embodiment.
A kind of bio-sensing chip of the utility model embodiment, comprising: substrate and be set on the substrate
Wafer bare die, electrostatic protection element, the electrostatic protection element are located at the outside of the wafer bare die, and the electrostatic protection
Element is greater than vertical height of the wafer bare die relative to the substrate, the electrostatic protection relative to the vertical height of the substrate
Element is for releasing electrostatic.
The utility model embodiment is located at the outer of wafer bare die by the way that electrostatic protection element to be set on substrate
Side, while the vertical height of electrostatic protection element is also greater than the vertical height of wafer bare die, therefore when object contacts biology biography
When sense chip, for electrostatic protection element with respect to wafer bare die closer to object, the electrostatic that object generates first passes through electrostatic protection element
It releases, wafer bare die is impacted by wafer bare die so as to avoid electrostatic.In addition, due to electrostatic protection element
Positioned at the outside of wafer bare die, so that the electrostatic protection element will not influence the biological sensing of wafer bare die, to improve life
Object senses effect.Furthermore since electrostatic protection element realizes electrostatic leakage by being highly arranged, the electrostatic protection element
It can be set as the conduct piece of smaller size smaller, to save the manufacturing cost of bio-sensing chip.
In some embodiments, the electrostatic protection element is conducting wire.Not by the electrostatic protection element of conductor structure
But structure is simple, and material utilization amount is few, to reduce material cost.In addition, the electrostatic protection element of the conductor structure is located at
The outside of wafer bare die, does not influence the regular link of wafer bare die not only, and is set to the conducting wire on the outside of wafer bare die, can be with
It realizes short distance design and improves the support strength of conducting wire.
In some embodiments, the electrostatic protection element is set on the substrate by way of routing.Pass through
The mode of routing realizes electrostatic protection element, and manufacture craft is simple and fast, and is easily achieved.
In some embodiments, perspective plane of the wafer bare die on substrate is quadrangle, the electrostatic protection member
Part includes two, which is set to the same side of the wafer bare die, or to be correspondingly arranged at the wafer naked
The opposite sides of piece.In this way, not only simplifying the setting structure of electrostatic protection element, and also improve electrostatic leakage effect.
In some embodiments, the electrostatic protection element includes multiple, and is distributed in the surrounding of the wafer bare die.
In this way, electrostatic can be more quickly routed to ground by electrostatic protection element, to mention even if object deviates contact bio-sensing chip
High electrostatic leakage effect.
In some embodiments, each electrostatic protection element is corresponded on the substrate to set there are two pad, this is quiet
Electric protective element one end is connected to a pad, and the electrostatic protection element other end is connected to another pad.
In some embodiments, if the substrate is printed circuit board, the electrostatic protection element passes through printing electricity
Circuit connection on the plate of road is extremely；If the substrate is insulating substrate, electrostatic protection element is by being bound to the insulation base
Flexible circuit board on plate is connected to the ground.
In some embodiments, the electrostatic protection element is directly or indirectly connected to ground.
In some embodiments, the bio-sensing chip further includes packaging body, for encapsulating the wafer bare die, quiet
Electric protective element, and fill the gap between the wafer bare die and the electrostatic protection element.
In some embodiments, the packaging body far from the substrate a side surface be used for receive object contact or
Close to input, and the wafer bare die be used for in contact with or close to object carry out information sensing.
In some embodiments, the object information of the wafer bare die sensing includes fingerprint, palmmprint, ear line, heart rate, blood
One or more of oxygen, blood pressure, vein.
In some embodiments, the bio-sensing chip is optical profile type sensing chip, capacitive sensing chip, ultrasound
One or more of waves sensing chip.
In some embodiments, the wafer bare die is at least one.
In some embodiments, the electrostatic protection element is domed, and the top end surface of the arch is more than the crystalline substance
The upper surface of circle bare die.
In some embodiments, the electrostatic protection element is greater than crystalline substance relative to the highest vertical height of the substrate
Vertical height of the circle bare die relative to the substrate.
The utility model embodiment further provides a kind of electronic equipment, including shell and be set in housing openings or
Bio-sensing chip on the inside of shell, and the bio-sensing chip is bio-sensing core described in above-mentioned any one embodiment
Piece.Therefore with all beneficial effects of above-mentioned bio-sensing chip.
The additional aspect and advantage of the utility model embodiment will be set forth in part in the description, partially will be under
Become obvious in the description in face, or is recognized by the practice of the utility model embodiment.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model embodiment are from combination following accompanying drawings to embodiment
Description in will be apparent and be readily appreciated that, in which:
Fig. 1 is a kind of existing mounting structure schematic diagram of bio-sensing chip；
Fig. 2 is the package structure diagram of existing another bio-sensing chip；
Fig. 3 is the side structure schematic diagram of the bio-sensing chip of one embodiment of the utility model；
Fig. 4 is a kind of structural schematic diagram of the electrostatic protection element of the utility model bio-sensing chip；
Fig. 5 a is a kind of distributed architecture schematic diagram of two electrostatic protection elements in the utility model bio-sensing chip；
Fig. 5 b is another distributed architecture schematic diagram of two electrostatic protection elements in the utility model bio-sensing chip；
Fig. 5 c is another distributed architecture schematic diagram of two electrostatic protection elements in the utility model bio-sensing chip；
Fig. 6 is the structural schematic diagram of the bio-sensing chip of another embodiment of the utility model；
Fig. 7 is the structure of one embodiment of wafer bare die in the utility model bio-sensing chip；
Fig. 8 is the structural schematic diagram of the electronic equipment of one embodiment of the utility model.
Specific embodiment
The embodiments of the present invention is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein
Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and should not be understood as practical to this
Novel limitation.
In the description of the present invention, it should be understood that term " first ", " second " are used for description purposes only, and
It cannot be understood as indicating or implying relative importance or implicitly indicate the quantity of indicated technical characteristic.It defines as a result,
The feature of " first ", " second " can explicitly or implicitly include one or more feature.In the utility model
Description in, the meaning of " plurality " is two or more, and unless otherwise specifically defined, accordingly, this definition is suitable
For the terms such as " a variety of ", " a plurality of "." contact " or " touch " includes directly contact or mediate contact.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected or can be in communication with each other；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the connection inside two elements or the interaction relationship of two elements.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter to the component of specific examples and being set for describing.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, the example of various specific techniques and material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Further, described feature, structure can be incorporated in one or more embodiment party in any suitable manner
In formula.In the following description, many details are provided to provide and fully understand to the embodiments of the present invention.
However, one of ordinary skill in the art would recognize that, without one or more in the specific detail, or using other knots
Structure, constituent element etc. can also practice the technical solution of the utility model.In other cases, it is not shown in detail or describes known knot
Structure or operation are to avoid fuzzy the utility model.
The utility model proposes bio-sensing chip be used to sense fingerprint, palmmprint, ear line, the heart rate, blood oxygen, blood of object
It is one or more in pressure, vein.The bio-sensing chip includes optical profile type sensing chip, capacitive sensing chip, ultrasonic wave biography
One of sense chip is a variety of.
Referring to Fig.1, Fig. 1 is a kind of existing mounting structure schematic diagram of bio-sensing chip.The bio-sensing chip 10
When carrying out the installation of mould group, a becket 11 is set, which is connected to ground by the way that route 12 is connected；And the becket
11 are equipped with a centre bore, and bio-sensing chip 10 is located in the centre bore of the becket 11.When user is in contact with or close to the biology
When sensing chip 10, static electricity on human body will be routed to ground by becket 11 to release, so that static electricity on human body be avoided to flow to life
Object sensing chip 10 and damage bio-sensing chip 10.
Referring to Fig. 2, Fig. 2 is the package structure diagram of existing another bio-sensing chip.The bio-sensing chip
10 ' include encapsulating housing 13 and sensing bare die 14 and circuit brake 15 in encapsulating housing 13, which protects
Such as TVS of device 15 (Transient Voltage Suppressor) diode is protected, when finger is passed in contact with or close to the biology
When sense chip 10, static electricity on human body to protect subsequent circuit element, that is, senses clamping down on by the circuit brake 15
Bare die 14, not by the damage of electrostatic.
Although can solve electrostatic problem by setting becket 11 and circuit brake 15, becket 11 is set
The manufacturing cost of bio-sensing chip 10,10 ' will all be increased with circuit brake 15, so the utility model proposes one kind
Bio-sensing chip with novel electrostatic safeguard structure can reduce the manufacturing cost of bio-sensing chip 10.
It is the side structure schematic diagram of the bio-sensing chip of one embodiment of the utility model referring to Fig. 3, Fig. 3.This reality
It include a substrate 20 and the wafer bare die 21 being set on the substrate 20, electrostatic protection with novel proposition bio-sensing chip 2
Element 22, and electrostatic protection element 22 is greater than the hanging down relative to substrate 20 of wafer bare die 21 relative to the vertical height h1 of substrate 20
Straight height h2.
The utility model embodiment has the following advantages compared with the prior art:
One, by the way that electrostatic protection element to be set on substrate, and the vertical height of electrostatic protection element is also greater than wafer
The vertical height of bare die, therefore when object contacts the bio-sensing chip, electrostatic protection element with respect to wafer bare die closer to
Object, the electrostatic that object generates first pass through electrostatic protection element and release, right by wafer bare die so as to avoid electrostatic
Wafer bare die impacts.
Two, since electrostatic protection element is located at the outside of wafer bare die, so that the electrostatic protection element will not influence wafer
The biological sensing of bare die, to improve biological sensing effect.
Three, since electrostatic protection element realizes electrostatic leakage by being highly arranged, which can be set
It is set to the conduct piece of smaller size smaller, to save the manufacturing cost of bio-sensing chip.
In some embodiments, which may include transparent substrate and two kinds of nontransparent substrate, wherein transparent substrate
Such as, but not limited to glass substrate, plastic base, crystal, sapphire insulation substrate, nontransparent substrate are such as, but not limited to silicon
Substrate, printed circuit board, metal substrate etc..In addition, the substrate 20 can be rigid, or flexible material, such as
Fexible film.
In some embodiments, after wafer bare die 21 is set on substrate 20, wafer bare die 21 passes through conducting wire 202
It is connect with substrate 20.
Further, pad 201 is set on the substrate 20, and electrostatic protection element 22 is fixed on substrate 20 by pad 201
On.If the substrate 20 is printed circuit board, pad 201 is connected to the ground by the circuit in printed circuit board；If the substrate
20 be the hardened structure of other inverter circuits, such as insulating substrate, then the flexible circuit board and pad by being bound on the insulating substrate
201 connections, pad 201 is connected to the ground by flexible circuit board.It should be noted that ground here includes bio-sensing core
Applied by the ground or bio-sensing chip 2 of piece 2 systematically or equipment.In this way, passing through electrostatic protection element 22 and weldering
Static electricity on human body is routed to ground to release by the connection line between disk 201 and ground.
Further, which includes the lug boss that is set on substrate 20, and direct or indirect connection
Yu Di for example, the electrostatic protection element 22 is directly connected to ground by connection line, or passes through between other circuits and ground in succession
It connects, the electrostatic received on electrostatic protection element 22 is conducted to ground, realizes electrostatic leakage.The electrostatic protection element 22 is opposite
It is greater than vertical height of the wafer bare die 21 relative to substrate 20 in the vertical height of substrate 20.
Further, the lug boss is in wedge angle or arc or arch, to utilize lightning rod principle by object electrostatic through protrusion
Portion flow direction ground, to prevent electrostatic from impacting to wafer bare die 21.Preferably, the lug boss of the electrostatic protection element 22
Top end surface is more than the upper surface of wafer bare die 21.The upper surface of the wafer bare die 21 is the surface of adjacent user, is used for
Receive the touch or close input of user.
It in some embodiments, is the electrostatic protection element of the utility model bio-sensing chip referring to Fig. 4, Fig. 4
A kind of structural schematic diagram.The electrostatic protection element 22 is, for example, conducting wire.The lug boss of electrostatic protection element 22 for example passes through routing
It is formed.It in some embodiments, is metal wire for the conducting wire of electrostatic protection element 22, the material of the metal wire is, for example,
Gold, copper, aluminium etc. can also be other suitable conductive materials certainly.It is not only tied by the electrostatic protection element 22 of conductor structure
Structure is simple, and material utilization amount is few, to reduce material cost.In addition, the electrostatic protection element 22 is by way of routing
It can be achieved, manufacture craft is simple and fast, and is easily achieved.
Specifically, with continued reference to Fig. 4, it should be noted that show two electrostatic protection elements 22 in Fig. 4, certainly
One electrostatic protection element 22 can be only set, or more than two electrostatic protection elements 22 are set.As shown in figure 4, the substrate
20 are equipped with the first pad 201a and the second pad 201b, third pad 201c, the 4th pad 201d.It will by way of routing
One end of first conductor wire is connected to the first pad 201a, and the other end of the first conductor wire is connected to the second pad 201b, thus
Form electrostatic protection element 22a.First conductor wire is in an arc, and the vertical height of first conductor wire relative to substrate 20
Maximum value h1 be greater than vertical height h2 of the wafer bare die 21 relative to substrate 20.By the second conductor wire by way of routing
One end is connected to third pad 201c, and the other end of the second conductor wire is connected to the 4th pad 201d, to form electrostatic protection
Element 22b.Second conductor wire is also in a radian, and second conductor wire is big relative to the maximum value of the vertical height of substrate 20
In vertical height of the wafer bare die 21 relative to substrate 20.In the present embodiment, electrostatic protection element 22a is relative to substrate 20
Vertical height and the electrostatic protection element 22b deviation range equal or in permission relative to the vertical height of substrate 20 in.
It is of course also possible to be set as the different electrostatic protection element 22 of height.
In some embodiments, the material of pad is for example including one of aluminium, copper, Au Ag Pt Pd, nickel etc. or two
Kind or more.Certainly, bonding pad material can also be other suitable materials.
Further, in some embodiments, electrostatic protection element 22 is all set in the outside of wafer bare die.If electrostatic
Protective element 22 is two, which can be set the same side or not ipsilateral, example in wafer bare die 21
Opposite sides or adjacent two sides such as wafer bare die.It is the bio-sensing core of the utility model referring to Fig. 5 a and Fig. 5 b, Fig. 5 a
A kind of distributed architecture schematic diagram of two electrostatic protection elements in piece；Fig. 5 b is two in the bio-sensing chip of the utility model
Another distributed architecture schematic diagram of electrostatic protection element；Fig. 5 c is that two electrostatic are anti-in the bio-sensing chip of the utility model
Another distributed architecture schematic diagram of protection element.As shown in Figure 5 a, which is four sides
Shape, certainly, the perspective plane of wafer bare die 21 on the base plate 20 can also be other shapes, such as triangle, polygon, circle,
Ellipse etc..The wafer bare die 21 includes the first side 21a and second side 21b being oppositely arranged, and the third being oppositely arranged
Side 21c and the 4th side 21d, electrostatic protection element 22a and electrostatic protection element 22b are all set in the first side of wafer bare die 21
21a.It is understood that electrostatic protection element 22a and electrostatic protection element 22b also can be set in wafer bare die 21
Two side 21b, third side 21c and the 4th side 21d.
As shown in Figure 5 b, electrostatic protection element 22a is set to the first side 21a of wafer bare die 21, electrostatic protection element 22b
It is set to second side 21b of wafer bare die 21.It is understood that electrostatic protection element 22a and electrostatic protection element 22b
The third side 21c and the 4th side 21d of wafer bare die 21 can be correspondingly arranged in.
It is simple for structure compact by the way that electrostatic protection element to be set to the same side of wafer bare die 21, and will not influence
Wire line between wafer bare die 21 and substrate 20.
As shown in Figure 5 c, the first side 21a and third side 21c that electrostatic protection element 22a is set to wafer bare die 21 are formed
Corner, electrostatic protection element 22b be set to wafer bare die 21 second side 21b and the 4th side 21d formed corner.Tool
Body, the one end electrostatic protection element 22a is set to the first side 21a of wafer bare die 21, and the electrostatic protection element 22a other end is set
It is placed in the third side 21c of wafer bare die 21；The one end electrostatic protection element 22b is set to second side 21b of wafer bare die 21, electrostatic
The protective element 22b other end is set to the 4th side 21d of wafer bare die 21.It is understood that electrostatic protection element 22a and
Other two opposite corner in wafer bare die 21 also can be set in electrostatic protection element 22b.
By the electrostatic protection element 22a and electrostatic protection element 22b being oppositely arranged, so that even if deviateing bio-sensing core
The touch location of piece 2 can also achieve the purpose that electrostatic leakage.
Certainly, ground is changed, above-mentioned electrostatic protection element 22 can be set to 4, that is, be correspondingly arranged at wafer bare die 21
The first side, second side, third side and the 4th side, or be correspondingly arranged at four corners of wafer bare die 21.
In some embodiments, electrostatic protection element 22 may be arranged as other quantity, and according to rule or not advise
Distribution rule then is distributed in the surrounding of wafer bare die 21, to realize better electrostatic leakage effect.For example, being uniformly distributed in crystalline substance
The outside of circle bare die 21.In other words, it can be configured as long as the position of electrostatic protection element can be arranged on substrate 20, with
Improve electrostatic leakage effect.
In some embodiments, when electrostatic protection element 22 includes at least two, for fixing electrostatic protection element
The linear distance of 22 two pads on the base plate 20 can be equal, naturally it is also possible to unequal.As shown in figure 3, the first pad
Linear distance L1 between 201a and the second pad 201b, with the linear distance between third pad 201c and the 4th pad 201d
L2 is equal.If electrostatic protection element 22 is conducting wire, since conducting wire is thinner, and limited strength, therefore by the way that shorter straight line is arranged
Distance, can reinforce the intensity of the electrostatic protection element 22, while also save the length of conducting wire.Furthermore it is also possible to same
Greater number of electrostatic protection element is set on substrate.
It further, is the structural representation of the bio-sensing chip of another embodiment of the utility model referring to Fig. 6, Fig. 6
Figure.Above-mentioned bio-sensing chip 2 further includes packaging body 23, and the packaging body 23 is for encapsulating wafer bare die 21, electrostatic protection element
Gap between 22, and filling wafer bare die 21 and electrostatic protection element 22.The material of the packaging body 23 is, for example, asphalt mixtures modified by epoxy resin
Lipid materials or other suitable insulating materials.
The manufacturing process of the bio-sensing chip is for example are as follows: S1, is separately made wafer bare die according to scheduled circuit structure；
S2, a substrate 20 is provided, is reserved with the position of wafer bare die 21 on the substrate 20, and at least two are arranged on the outside of the reserved location
A pad；S3, wafer bare die 21 is corresponded to the designated position for being mounted on substrate 20, and makes wafer naked by conducting wire 202
Piece 21 is electrically connected with substrate 20；S4,22 both ends of electrostatic protection element are connected on two pads by way of routing,
And electrostatic protection element 22 is greater than height of the wafer bare die 21 relative to substrate 20 relative to the height of substrate 20；S5, it will carry
The substrate 20 of wafer bare die 21 and electrostatic protection element 22 is placed in the injection mold equipped with epoxy resin material；S6, lead to
Cross molding in mold cavity wafer bare die 21 and electrostatic protection element 22 carry out plastic packaging molding.The plastic packaging molding mode example
Such as use T mold or C mold.
So, change ground, the manufacturing process of the utility model bio-sensing chip 2 be not limited to above-mentioned the step of listing with
And the sequence between step, it can also be other suitable steps.
In some embodiments, the encapsulation of above-mentioned bio-sensing chip 2 is for example, by using packaged types such as LGA, BGA.So,
Ground is changed, other similar packaged types can also be used.
It should be noted that the packaging body 23 in above-mentioned bio-sensing chip 2 has certain height, by wafer bare die
21 and electrostatic protection element 22 carry out plastic packaging.It certainly, is that the encapsulating face of packaging body 23 can also be with electrostatic protection member modifiablely
The top of part 22 is substantially flush.That is the packaging height of packaging body 23 is equal or slightly larger than the height of electrostatic protection element 22.
Further, above-mentioned packaging body 23 far from a side surface S of substrate 20 be used to receive object in contact with or close to defeated
Enter, defining side surface S is sensing face.When object is in contact with or close to the sensing face, electrostatic protection element 22 is naked with respect to wafer
Piece 21 is more nearly object, therefore the electrostatic that object generates will be routed to ground by electrostatic protection element 22, so as to avoid quiet
Electricity enters wafer bare die 21 and damages to wafer bare die.
In some embodiments, the wafer bare die 21 in above-mentioned packaging body 23 can be one, or two or
It is multiple, to realize corresponding function.Accordingly, electrostatic protection element 22 can be set for each wafer bare die 21, it can also
Same electrostatic protection element 22 is shared with multiple wafer bare dies 21.
It further, is the knot of one embodiment of wafer bare die in the utility model bio-sensing chip referring to Fig. 7, Fig. 7
Structure.The wafer bare die 21 includes substrate 210 and the sensing unit 211 and detection circuit 212 that are formed on substrate 210, sensing
Unit 211 works under the driving of detection circuit 212, to carry out information sensing to contact object.With biological information
For, the sensing unit 211 for example including one of optical sensing unit, capacitive sensing cells, supersonic sensing unit or
It is a variety of.The sensing unit 211 is array structure, including multiple senser elements, and multiple senser element presses certain regularly arranged, example
Such as matrix arrangement.Further, which further includes the corresponding route being electrically connected with multiple senser elements, the line
Road is corresponding to be electrically connected with detection circuit 212.
Further, above-mentioned substrate 210 is semiconductor substrate, such as silicon substrate or other suitable substrates.By at this
Sensing unit 211 and detection circuit 212 are formed in semiconductor substrate, to form wafer bare die 21.The wafer bare die is independently made
After work, then it is mounted on substrate 20.
Further, Fig. 8 please be join, Fig. 8 is the structural schematic diagram of the electronic equipment of one embodiment of the utility model.This reality
With a kind of electronic equipment 3 of novel embodiment, the bio-sensing chip 2 including any embodiment as above, not only realization pair
Object information in contact with or close to the bio-sensing chip 2 is sensed, and is also achieved and carried out to the electrostatic that object generates
The purpose released.
Specifically, for example consumer electrical product of electronic equipment 3 or household formula electronic product or vehicular electronic product.Its
In, the types of applications such as consumer electrical product for example mobile phone, tablet computer, laptop, tabletop display, computer all-in-one machine
The electronic product of biological identification technology.Household formula electronic product for example intelligent door lock, TV, refrigerator, wearable device etc. is all kinds of
Using the electronic product of biological identification technology.Vehicular electronic product for example automatic navigator, vehicle-carrying DVD etc..
In the example of fig. 8, electronic equipment 3 is mobile phone, and the front of mobile phone is provided with touch screen and display device 31, biology
Sensing chip 2 is arranged in below the front shroud of electronic equipment 3.So, ground is changed, in other embodiments, the biology passes
Sense chip 2 may also be arranged in touch screen and display device 31.In addition, the bio-sensing chip 2 can also be correspondingly arranged at electricity
The suitable positions such as front, the back side and the side of sub- equipment 3, and, it can both expose the outer surface of electronic equipment 3, such as electronics
In the aperture of device housings, it may also be arranged on 3 inside of electronic equipment and adjacent housings, such as positioned at the inside of shell.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the utility model.In this explanation
In book, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-mentioned embodiment party
Formula is exemplary, and should not be understood as limiting the present invention, and those skilled in the art are in the utility model
Above embodiment can be changed, be modified in range, replacement and variant.
Claims (16)
1. a kind of bio-sensing chip, comprising: substrate and the wafer bare die being set on the substrate, an at least electrostatic protection
Element；The electrostatic protection element is located at the outside of the wafer bare die, and the electrostatic protection element is relative to the base
The vertical height of plate be greater than vertical height of the wafer bare die relative to the substrate, the electrostatic protection element be used for by electrostatic into
Row is released.
2. bio-sensing chip as described in claim 1, it is characterised in that: the electrostatic protection element is conducting wire.
3. bio-sensing chip as claimed in claim 2, it is characterised in that: the electrostatic protection element is by way of routing
It is set on the substrate.
4. bio-sensing chip as described in claim 1, it is characterised in that: perspective plane of the wafer bare die on substrate is
Quadrangle, the electrostatic protection element include two, which is set to the same side of the wafer bare die, or
Wafer bare die is not ipsilateral described in person.
5. bio-sensing chip as described in claim 1, it is characterised in that: the electrostatic protection element includes multiple, and point
It is distributed in the surrounding of the wafer bare die.
6. bio-sensing chip as described in claim 4 or 5, it is characterised in that: correspond to each electrostatic on the substrate
Protective element is set there are two pad, which is connected to a pad, and the electrostatic protection element other end is connected to
Another pad.
7. bio-sensing chip as described in claim 1, it is characterised in that: described if the substrate is printed circuit board
Electrostatic protection element passes through the circuit connection on printed circuit board to ground；If the substrate is insulating substrate, electrostatic protection member
Part is connected to the ground by the flexible circuit board being bound on the insulating substrate.
8. bio-sensing chip as claimed in claim 7, it is characterised in that: the electrostatic protection element direct or indirect connection
Yu Di.
9. bio-sensing chip as described in claim 1, it is characterised in that: the bio-sensing chip further includes packaging body,
For encapsulating between the wafer bare die, electrostatic protection element, and the filling wafer bare die and the electrostatic protection element
Gap.
10. bio-sensing chip as claimed in claim 9, it is characterised in that: side of the packaging body far from the substrate
Surface be used to receive object in contact with or close to input, and the wafer bare die be used for in contact with or close to object carry out information
Sensing.
11. bio-sensing chip as claimed in claim 10, it is characterised in that: the object information packet of the wafer bare die sensing
Include one or more of fingerprint, palmmprint, ear line, heart rate, blood oxygen, blood pressure, vein.
12. bio-sensing chip as described in claim 1, it is characterised in that: the bio-sensing chip is optical profile type sensing
One or more of chip, capacitive sensing chip, ultrasonic type sensing chip.
13. bio-sensing chip as described in claim 1, it is characterised in that: the wafer bare die is at least one.
14. bio-sensing chip as described in claim 1, it is characterised in that: the electrostatic protection element is domed, the arch
The top end surface of shape is more than the upper surface of the wafer bare die.
15. bio-sensing chip as described in claim 1, it is characterised in that: the electrostatic protection element is relative to the base
The highest vertical height of plate is greater than vertical height of the wafer bare die relative to the substrate.
16. a kind of electronic equipment, it is characterised in that: passed including shell and the biology being set in or beyond housing openings on the inside of shell
Sense chip, and the bio-sensing chip is bio-sensing chip described in any one of claim 1-15.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/110612 WO2019090748A1 (en) | 2017-11-11 | 2017-11-11 | Biosensor chip and electronic device |
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| CN209044625U true CN209044625U (en) | 2019-06-28 |
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| CN201790000266.3U Active CN209044625U (en) | 2017-11-11 | 2017-11-11 | Bio-sensing chip and electronic equipment |
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| WO (1) | WO2019090748A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110534504A (en) * | 2019-09-16 | 2019-12-03 | 柳州梓博科技有限公司 | A kind of chip and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2006101274A1 (en) * | 2005-03-25 | 2006-09-28 | Fujifilm Corporation | Method of manufacturing solid state imaging device |
| CN101593761B (en) * | 2008-05-29 | 2012-02-08 | 神盾股份有限公司 | Sensing device with sealing compound protective layer and manufacture method thereof |
| TWI534962B (en) * | 2013-12-09 | 2016-05-21 | 茂丞科技股份有限公司 | Proximity sensor with hidden couple electrode and method of manufacturing such sensor |
| US20160371528A1 (en) * | 2015-06-17 | 2016-12-22 | Motorola Mobility Llc | Concealed fingerprint sensor with wake-up and electrostatic discharg |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110534504A (en) * | 2019-09-16 | 2019-12-03 | 柳州梓博科技有限公司 | A kind of chip and electronic equipment |
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| WO2019090748A1 (en) | 2019-05-16 |
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