CN109644246B - 摄像元件以及摄像系统 - Google Patents
摄像元件以及摄像系统 Download PDFInfo
- Publication number
- CN109644246B CN109644246B CN201780051764.5A CN201780051764A CN109644246B CN 109644246 B CN109644246 B CN 109644246B CN 201780051764 A CN201780051764 A CN 201780051764A CN 109644246 B CN109644246 B CN 109644246B
- Authority
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- China
- Prior art keywords
- light
- photoelectric conversion
- substrate
- image pickup
- driving
- Prior art date
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 102
- 239000000758 substrate Substances 0.000 claims description 94
- 238000001514 detection method Methods 0.000 claims description 11
- 238000009429 electrical wiring Methods 0.000 claims 1
- 238000003384 imaging method Methods 0.000 abstract description 46
- 238000009825 accumulation Methods 0.000 description 33
- 238000012937 correction Methods 0.000 description 16
- 238000005286 illumination Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/74—Circuitry for scanning or addressing the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/483—Details of pulse systems
- G01S7/486—Receivers
- G01S7/4861—Circuits for detection, sampling, integration or read-out
- G01S7/4863—Detector arrays, e.g. charge-transfer gates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-162799 | 2016-08-23 | ||
JP2016162799 | 2016-08-23 | ||
PCT/JP2017/028031 WO2018037862A1 (ja) | 2016-08-23 | 2017-08-02 | 撮像素子および撮像システム |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109644246A CN109644246A (zh) | 2019-04-16 |
CN109644246B true CN109644246B (zh) | 2022-01-14 |
Family
ID=61245781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201780051764.5A Active CN109644246B (zh) | 2016-08-23 | 2017-08-02 | 摄像元件以及摄像系统 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11057578B2 (de) |
EP (1) | EP3490248B1 (de) |
JP (1) | JP6750680B2 (de) |
CN (1) | CN109644246B (de) |
TW (1) | TWI727081B (de) |
WO (1) | WO2018037862A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022219928A1 (ja) * | 2021-04-16 | 2022-10-20 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、電子機器、および信号処理方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103491286A (zh) * | 2012-06-12 | 2014-01-01 | 佳能株式会社 | 成像装置及其图像显示方法 |
JP2014067577A (ja) * | 2012-09-26 | 2014-04-17 | Seiko Epson Corp | 撮像装置 |
JP2014531820A (ja) * | 2011-09-21 | 2014-11-27 | アプティナ イメージング コーポレイションAptina Imaging Corporation | スタックトチップイメージングシステム |
CN104580926A (zh) * | 2008-06-18 | 2015-04-29 | 索尼公司 | 固体摄像器件和照相机装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2816228B2 (ja) * | 1990-04-18 | 1998-10-27 | オリンパス光学工業株式会社 | 遠隔撮像装置 |
US20030010892A1 (en) * | 2001-06-27 | 2003-01-16 | Clark Lloyd Douglas | Imaging system using identical or nearly-identical scanning and viewing illuminations |
JP3778844B2 (ja) * | 2001-11-15 | 2006-05-24 | 浜松ホトニクス株式会社 | イメージセンサおよびそのイメージセンサを用いた撮像システム |
JP4574118B2 (ja) * | 2003-02-12 | 2010-11-04 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
JP4254602B2 (ja) * | 2004-04-19 | 2009-04-15 | 株式会社島津製作所 | 二次元放射線検出器 |
JP4337779B2 (ja) | 2004-07-01 | 2009-09-30 | ソニー株式会社 | 物理情報取得方法および物理情報取得装置並びに物理量分布検知の半導体装置 |
AT500855B1 (de) * | 2004-09-08 | 2006-04-15 | Bioident Biometric Technologie | Vorrichtung zum auswerten biochemischer proben |
JP4428351B2 (ja) * | 2006-03-07 | 2010-03-10 | セイコーエプソン株式会社 | 発光装置、電子機器、及び駆動方法 |
JP2008271413A (ja) * | 2007-04-24 | 2008-11-06 | Olympus Corp | 画像表示装置、撮像装置、処理プログラム、画像表示装置の制御方法 |
US9832409B2 (en) | 2014-02-07 | 2017-11-28 | National University Corporation Shizuoka University | Image sensor |
-
2017
- 2017-08-02 EP EP17843348.8A patent/EP3490248B1/de active Active
- 2017-08-02 WO PCT/JP2017/028031 patent/WO2018037862A1/ja unknown
- 2017-08-02 CN CN201780051764.5A patent/CN109644246B/zh active Active
- 2017-08-02 JP JP2018535563A patent/JP6750680B2/ja active Active
- 2017-08-07 TW TW106126507A patent/TWI727081B/zh active
-
2019
- 2019-02-22 US US16/283,058 patent/US11057578B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104580926A (zh) * | 2008-06-18 | 2015-04-29 | 索尼公司 | 固体摄像器件和照相机装置 |
JP2014531820A (ja) * | 2011-09-21 | 2014-11-27 | アプティナ イメージング コーポレイションAptina Imaging Corporation | スタックトチップイメージングシステム |
CN103491286A (zh) * | 2012-06-12 | 2014-01-01 | 佳能株式会社 | 成像装置及其图像显示方法 |
JP2014067577A (ja) * | 2012-09-26 | 2014-04-17 | Seiko Epson Corp | 撮像装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2018037862A1 (ja) | 2018-03-01 |
TWI727081B (zh) | 2021-05-11 |
JPWO2018037862A1 (ja) | 2019-06-20 |
CN109644246A (zh) | 2019-04-16 |
JP6750680B2 (ja) | 2020-09-02 |
EP3490248A1 (de) | 2019-05-29 |
US20190191111A1 (en) | 2019-06-20 |
US11057578B2 (en) | 2021-07-06 |
TW201813062A (zh) | 2018-04-01 |
EP3490248A4 (de) | 2019-06-26 |
EP3490248B1 (de) | 2021-07-14 |
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