CN109605211A - A kind of polishing wafer exchange system and method - Google Patents
A kind of polishing wafer exchange system and method Download PDFInfo
- Publication number
- CN109605211A CN109605211A CN201910063145.9A CN201910063145A CN109605211A CN 109605211 A CN109605211 A CN 109605211A CN 201910063145 A CN201910063145 A CN 201910063145A CN 109605211 A CN109605211 A CN 109605211A
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- wafer
- polishing
- cleaned
- frame
- manipulator
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- 238000005498 polishing Methods 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 61
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 238000004140 cleaning Methods 0.000 claims description 7
- 230000033001 locomotion Effects 0.000 claims description 6
- 238000011065 in-situ storage Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 4
- 238000002425 crystallisation Methods 0.000 abstract description 3
- 230000008025 crystallization Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 190
- 238000012546 transfer Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a kind of polishing wafer exchange system and methods, which includes: wafer load mechanism, in polishing area to the transmission of wafer；Manipulator, be arranged in can and wafer load mechanism position, manipulator directly grabs wafer polishing from the wafer load mechanism in polishing area and sends wafer polishing to subsequent cell, which is a wafer cassette to be cleaned.Its advantage is that: reduce this transmission process of wafer exchange mechanism and mechanical structure, reduce the transmission time of wafer and extraneous exchange, it increases the stability of wafer exchange entirety while improving space utilization rate, reduce processing, control and maintenance cost, avoid the problem of wafer leads to surface crystallization because of falling into a long wait, meanwhile traditional fixed wafer frame to be cleaned is changed to mobile wafer cassette to be cleaned, so that the efficiency of transmission of wafer is improved.
Description
Technical field
The present invention relates to semiconductor integrated circuit chip manufacturing technology fields, and in particular to a kind of polishing wafer exchange system
And method.
Background technique
Chemically-mechanicapolish polish (CMP) be one of key technology of field of semiconductor manufacture, be it is currently the only can be entire
The technology of global planarization on Silicon Wafer, it is considered to be wafer surface roughness and surface flattening requirement can be taken into account, obtained
Obtain the best approach on not damaged surface.
The wafer transfer in a kind of existing CMP tool polishing area and other regions be by a wafer load mechanism,
What one wafer exchange mechanism and a manipulator were realized.Wafer exchange mechanism with manipulator mainly by cooperating completion wafer to send
The wafer transfer for out and being taken into, and being responsible between the charging crane of polishing area wafer, wafer exchange mechanism are set in periphery
It is standby to play function served as bridge between the core CMP.
In CMP tool, wafer exchange mechanism makees other transmission work as the buffer unit in polishing area, in manipulator
When, wafer can wait in wafer exchange mechanism.However, the presence of wafer exchange mechanism during transmitting wafer relative to
One of transmission process is increased, after transmitting process increase, transmission time extension, the stability drop of wafer and extraneous exchange will be present
The disadvantages of low, processing and control and maintenance cost increase, occupied space increases.And due to the wafer bracket of wafer exchange device
Directly and wafer contacts, existing wafer bracket generate a possibility that polluting during directly contacting with wafer, to wafer
Increase.
Summary of the invention
The purpose of the present invention is to provide a kind of polishing wafer exchange system and method, used in the polishing area of the system
Mechanism of the wafer load mechanism as wafer transfer, at the same be arranged a manipulator can and wafer load mechanism position,
Directly grab wafer polishing from the wafer load mechanism in polishing area by manipulator reduces in this way to subsequent cell
This transmission process of wafer exchange mechanism and mechanical structure reduce the transmission time of wafer and extraneous exchange, increase crystalline substance
The whole stability of circle exchange improves space utilization rate simultaneously, reduces processing, control and maintenance cost, avoids wafer
The problem of leading to surface crystallization because of falling into a long wait.
A kind of polishing wafer exchange system, characterized in that include:
Polishing area workbench；
Wafer load mechanism, be arranged on polishing area workbench, in polishing area to the transmission of wafer；
Manipulator, be arranged in can and wafer load mechanism position；
Polishing area housing covers polishing area workbench, and its position for corresponding to manipulator is equipped with a window.
Above-mentioned polishing wafer exchange system, wherein also include:
Cleaning unit, be arranged in manipulator can and position, it includes polished wafer frame and wafer cassette to be cleaned, to
Wafer frame to be cleaned is equipped in cleaning wafer box.
Above-mentioned polishing wafer exchange system, in which:
The polished wafer frame is to move polished wafer frame, can be moved along a first straight line path；
The wafer frame to be cleaned is to move wafer frame to be cleaned, can be moved along a second straight line path.
Above-mentioned polishing wafer exchange system, in which:
The polished wafer frame is fixed polished wafer frame；
The wafer frame to be cleaned is fixed wafer frame to be cleaned.
Above-mentioned polishing wafer exchange system, wherein also include:
The mobile door of wafer to be cleaned, is arranged in wafer cassette to be cleaned.
Above-mentioned polishing wafer exchange system, wherein also include:
Polished wafer frame driving mechanism is guide rod cylinder or motor lead screw or rack-and-pinion, connects polished wafer frame；
Wafer frame driving mechanism to be cleaned is guide rod cylinder or motor lead screw or rack-and-pinion, connects wafer frame to be cleaned.
A kind of polishing wafer exchange method, is completed, characterized in that include by above-mentioned polishing wafer exchange system:
Wafer to be processed the polished operation such as is placed into the wafer load mechanism in polishing area by S1, manipulator；
S2, it is finished to polishing wafer, manipulator grabs wafer polishing from the wafer load mechanism in polishing area；
S3, manipulator send wafer polishing to subsequent cell.
Above-mentioned polishing wafer exchanges method, wherein also includes before the step S1:
S0, manipulator grab the wafer on polished wafer frame.
Above-mentioned polishing wafer exchanges method, wherein subsequent cell is wafer cassette to be cleaned, and the step S3 is specifically wrapped
Contain:
The mobile door of wafer to be cleaned in wafer cassette to be cleaned is opened, the wafer frame straight line to be cleaned in wafer cassette to be cleaned
Designated position is moved to receive wafer polishing；
Wafer polishing is placed on wafer frame to be cleaned by manipulator, and wafer frame to be cleaned moves along a straight line back in situ, machine
Tool hand enters next working cycles.
Compared with the prior art, the present invention has the following advantages:
1, reduce this transmission process of wafer exchange mechanism and mechanical structure, by manipulator directly from polishing area
Wafer polishing is grabbed in interior wafer load mechanism, reduces the transmission time of wafer and extraneous exchange, increases wafer friendship
Change whole stability while improving space utilization rate, reduce processing, control and maintenance cost, avoid wafer because
The problem of falling into a long wait and leading to surface crystallization；
2, traditional fixed polished wafer storage rack is changed to mobile polished wafer frame, it will be traditional fixed
Wafer frame to be cleaned is changed to mobile wafer frame to be cleaned, and mobile form be it is linear so that the transmission of wafer is imitated
Rate is improved；
It 3, is to be carried out in fixed position when wafer load mechanism exchanges wafer with manipulator, compared to traditional polishing area
It is more reliable to pass sheet mode, it is possible to reduce unstable factor during grabbing wafer.
Detailed description of the invention
Fig. 1 is the perspective view of polishing wafer exchange system of the invention；
Fig. 2 is the second embodiment of polishing wafer exchange system of the invention with reference to figure.
Specific embodiment
The present invention is further elaborated by the way that a preferable specific embodiment is described in detail below in conjunction with attached drawing.
As shown in Figure 1, the system specifically includes the invention proposes a kind of polishing wafer exchange system: removing existing skill
Wafer exchange mechanism in art, using wafer load mechanism 2 as in polishing area to the transmission mechanism of wafer, i.e. wafer load
Mechanism 2 as wafer transfer mode unique in polishing area and wafer transfer class of establishment, also comprising setting can and it is brilliant
The manipulator 1 of the position of circle loader mechanism 2, the system are by reducing this traditional transmission process of wafer exchange mechanism, i.e., logical
It crosses and is grabbed directly from wafer load mechanism 2 or place wafer 6, to reach the transmission time for reducing wafer and extraneous exchange
Purpose, it is noted that wafer load mechanism 2 and the quantity of manipulator 1 are unlimited, this programme for ease of understanding, this reality
It applies in example and is only illustrated by taking the manipulator 1 that a wafer load mechanism 2 and one are correspondingly arranged as an example.
In general, wafer load mechanism 2 is arranged on polishing area workbench 5, wafer load mechanism 2 is arranged in the polishing area
On domain workbench 5；In the present embodiment, a polishing area housing 3 is also set up for covering polishing area workbench 5, is corresponded to
The position of manipulator 1 is equipped with a window, enters crawl from window convenient for manipulator 1 or places wafer 6；It is arranged outside polishing area
Cleaning unit for being cleaned to the wafer 6 polished, and be located at manipulator 1 can and position, it includes for into one
Step accelerates the moveable polished wafer frame 11 and wafer cassette to be cleaned 9 of polishing wafer exchange circulation time, wherein to be cleaned
Include moveable wafer frame 13 to be cleaned in wafer cassette 9.
In the present embodiment, as seen from the figure, polishing area workbench 5 is supported to by polishing area chassis 4 facilitates operation
Height, manipulator 1 is mounted upside down on the top plate lower part of cleaning machine frame 10 in cleaning unit, cleaning machine frame in the present embodiment
10 middle part is equipped with the polished wafer frame 11 and wafer cassette to be cleaned 9, polished 11 bottom of the wafer frame setting
Needing wafer polishing frame driving mechanism 7, polished wafer frame 11 driven to be A (designated position) along first straight line path --- B is past
Return movement.13 bottom of wafer frame to be cleaned is provided with wafer frame driving mechanism 8 to be cleaned, drives wafer frame to be cleaned 13 along second
Straight line path is A (designated position) --- B back and forth movement.
Linear transmission is more reliable compared to traditional rotational positioning mode, and efficiency of transmission is also higher, it can also be ensured that
Stability of the wafer in transmission process, it is therefore advantageous to, above-mentioned A (designated position) --- the motion path of B back and forth movement
To be linear, and realize the realization of the wafer frame driving mechanism 8 to be cleaned and polished wafer frame driving mechanism 7 of linear motion
Mode has very much, for example, guide rod cylinder or click screw rod or rack-and-pinion etc..
Correspondingly, the present invention also provides a kind of polishing wafers realized based on above system to exchange method, it includes
Following steps: S0, manipulator grab the wafer on polished wafer frame；Wafer to be processed is placed into polishing by S1, manipulator
The polished operation such as in the wafer load mechanism in region；S2, it is finished to polishing wafer, manipulator is from the wafer in polishing area
Wafer polishing is grabbed on loader mechanism；S3, manipulator send wafer polishing to subsequent cell, this in the present embodiment is subsequent
Unit is wafer frame to be cleaned.
Embodiment:
The polished driving of wafer frame driving mechanism 7 is moved in a straight line with the polished wafer frame 11 of polished wafer 6,
It moves from B displacement to position A；Manipulator 1 grabs the wafer 6 on wafer polishing frame 11, and polished wafer frame 11 moves back at B.Machine
Polished wafer 6 is placed in wafer load mechanism 2 by the window that tool hand 1 passes through polishing area housing 3, and polished wafer 6 exists
Polishing process is waited in wafer load mechanism 2.After wafer 6 is polished completion of processing, the wafer 6 polished will be placed
In wafer load mechanism 2, manipulator 1 grabs the wafer 6 polished from wafer load mechanism 2.It has been thrown in the crawl of manipulator 1
While the wafer 6 of light finishes, the mobile door 14 of the wafer to be cleaned of wafer cassette 9 to be cleaned is beaten by the mobile driving of door drive mechanism 12
It opens, wafer frame 13 to be cleaned is driven to designated position A from wafer frame driving mechanism 8 to be cleaned and moved, after arrival designated position A etc.
Wafer 6 wait polish is put into.The wafer 6 polished is placed in the wafer frame 13 to be cleaned of position A by manipulator 1
Wafer frame 13 to be cleaned afterwards equipped with the wafer 6 polished moves back to B under the driving of wafer frame driving mechanism 8 to be cleaned,
The mobile door 14 of wafer to be cleaned is closed by the driving of mobile door drive mechanism 12 outside wafer cassette 9 to be cleaned is arranged in.It is polished
The driving of wafer frame driving mechanism 7 is moved in a straight line with the polished wafer frame 11 of polished wafer 6, and manipulator 1 is from wait throw
It takes in light wafer frame 11 next wafer to be processed, into next working cycles.
As another embodiment of the present invention, above-mentioned moveable polished wafer frame 11 and wafer frame 13 to be cleaned can
Be it is fixed, help to improve the stability of wafer exchange entirety, at the same facilitate reduce processing, control and safeguard at
This.
As shown in Fig. 2, in figure 15 be fixed polished wafer frame, 16 be fixed wafer frame to be cleaned.The embodiment
In, manipulator 1 directly grabs polished wafer 6 from fixed polished wafer frame 15.When wafer 6 is polished completion of processing
Afterwards, manipulator 1 grabs the wafer 6 polished, the mobile door of the wafer to be cleaned of wafer cassette 9 to be cleaned from wafer load mechanism 2
14 are opened by the mobile driving of door drive mechanism 12, and the wafer 6 polished is placed in fixed wafer frame 16 to be cleaned by manipulator 1
On, the mobile door 14 of wafer to be cleaned is closed by the mobile driving of door drive mechanism 12.Manipulator 1 is from fixed polished wafer frame 15
In take next wafer to be processed, into next working cycles.
It is discussed in detail although the contents of the present invention have passed through above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read above content, for of the invention
A variety of modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (9)
1. a kind of polishing wafer exchange system, characterized by comprising:
Polishing area workbench；
Wafer load mechanism, be arranged on polishing area workbench, in polishing area to the transmission of wafer；
Manipulator, be arranged in can and wafer load mechanism position；
Polishing area housing covers polishing area workbench, and its position for corresponding to manipulator is equipped with a window.
2. polishing wafer exchange system as described in claim 1, which is characterized in that also include:
Cleaning unit, be arranged in manipulator can and position, it is to be cleaned it includes polished wafer frame and wafer cassette to be cleaned
Wafer frame to be cleaned is equipped in wafer cassette.
3. polishing wafer exchange system as claimed in claim 2, it is characterised in that:
The polished wafer frame is to move polished wafer frame, can be moved along a first straight line path；
The wafer frame to be cleaned is to move wafer frame to be cleaned, can be moved along a second straight line path.
4. polishing wafer exchange system as claimed in claim 2, it is characterised in that:
The polished wafer frame is fixed polished wafer frame；
The wafer frame to be cleaned is fixed wafer frame to be cleaned.
5. polishing wafer exchange system as claimed in claim 2, which is characterized in that also include:
The mobile door of wafer to be cleaned, is arranged in wafer cassette to be cleaned.
6. polishing wafer exchange system as claimed in claim 3, which is characterized in that also include:
Polished wafer frame driving mechanism is guide rod cylinder or motor lead screw or rack-and-pinion, connects polished wafer frame；
Wafer frame driving mechanism to be cleaned is guide rod cylinder or motor lead screw or rack-and-pinion, connects wafer frame to be cleaned.
7. a kind of polishing wafer exchanges method, pass through the polishing wafer exchange system as described in any one of claim 1~6
Completing, characterized by comprising:
Wafer to be processed the polished operation such as is placed into the wafer load mechanism in polishing area by S1, manipulator；
S2, it is finished to polishing wafer, manipulator grabs wafer polishing from the wafer load mechanism in polishing area；
S3, manipulator send wafer polishing to subsequent cell.
8. polishing wafer as claimed in claim 7 exchanges method, which is characterized in that also include before the step S1:
S0, manipulator grab the wafer on polished wafer frame.
9. polishing wafer as claimed in claim 7 exchanges method, which is characterized in that subsequent cell is wafer cassette to be cleaned, institute
The step S3 stated specifically includes:
The mobile door of wafer to be cleaned in wafer cassette to be cleaned is opened, the wafer frame to be cleaned linear motion in wafer cassette to be cleaned
Designated position is reached to receive wafer polishing；
Wafer polishing is placed on wafer frame to be cleaned by manipulator, and wafer frame to be cleaned moves along a straight line back in situ, manipulator
Into next working cycles.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910063145.9A CN109605211A (en) | 2019-01-23 | 2019-01-23 | A kind of polishing wafer exchange system and method |
| CN201910441333.0A CN110026886A (en) | 2019-01-23 | 2019-05-24 | Polishing wafer exchange system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910063145.9A CN109605211A (en) | 2019-01-23 | 2019-01-23 | A kind of polishing wafer exchange system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109605211A true CN109605211A (en) | 2019-04-12 |
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ID=66020392
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910063145.9A Pending CN109605211A (en) | 2019-01-23 | 2019-01-23 | A kind of polishing wafer exchange system and method |
| CN201910441333.0A Pending CN110026886A (en) | 2019-01-23 | 2019-05-24 | Polishing wafer exchange system and method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910441333.0A Pending CN110026886A (en) | 2019-01-23 | 2019-05-24 | Polishing wafer exchange system and method |
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| CN (2) | CN109605211A (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103252705A (en) * | 2013-05-15 | 2013-08-21 | 清华大学 | Chemical mechanical polishing device |
| CN104617016B (en) * | 2014-12-31 | 2017-10-17 | 上海新阳半导体材料股份有限公司 | Wafer processing device |
| US20160358796A1 (en) * | 2015-06-03 | 2016-12-08 | Dongfang Jingyuan Electron Limited | Cable drive robot mechanism for exchanging samples |
| CN208368479U (en) * | 2018-07-13 | 2019-01-11 | 清华大学 | Wafer processing |
| CN109148341A (en) * | 2018-10-16 | 2019-01-04 | 杭州众硅电子科技有限公司 | A kind of CMP wafer cleaning equipment |
| CN109227359A (en) * | 2018-10-19 | 2019-01-18 | 清华大学 | The post-processing unit of chemical-mechanical polishing system and method, wafer |
-
2019
- 2019-01-23 CN CN201910063145.9A patent/CN109605211A/en active Pending
- 2019-05-24 CN CN201910441333.0A patent/CN110026886A/en active Pending
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| CN110026886A (en) | 2019-07-19 |
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