CN211465883U - Polishing equipment - Google Patents
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- CN211465883U CN211465883U CN201922474677.XU CN201922474677U CN211465883U CN 211465883 U CN211465883 U CN 211465883U CN 201922474677 U CN201922474677 U CN 201922474677U CN 211465883 U CN211465883 U CN 211465883U
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Abstract
The utility model relates to a polishing technical field discloses a polishing equipment. The polishing equipment comprises an installation table, a conveying mechanism and a polishing mechanism. A plurality of independent polishing areas are arranged on the mounting table along the first horizontal direction. The transmission mechanism is movably arranged on the mounting table along a first horizontal direction to transmit the wafer. All be provided with polishing mechanism in every polishing district, polishing mechanism includes polishing dish and rubbing head, and polishing dish and rubbing head all rotationally set up on the mount table, and the rubbing head is portable and set up on the mount table along vertical direction liftable along the second horizontal direction to adsorb the wafer on the transport mechanism, and remove the wafer to the top of polishing dish, the polishing dish can cooperate with the rubbing head and polish the wafer. The utility model provides a polishing equipment can effectively improve polishing yield and polishing efficiency, and application scope is wide simultaneously, can satisfy multiple polishing precision's requirement.
Description
Technical Field
The utility model relates to a polishing technical field especially relates to a polishing equipment.
Background
In the wafer production process, it is usually necessary to polish the wafer by using a polishing apparatus. However, the existing polishing equipment has low polishing yield, low polishing efficiency and small application range, and cannot meet various polishing precision requirements. Therefore, a new polishing head driving device is needed to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a polishing equipment can effectively improve polishing yield and polishing efficiency, and application scope is wide simultaneously, can satisfy multiple polishing precision's requirement.
In order to achieve the purpose, the utility model adopts the following technical proposal:
a polishing apparatus comprising:
a mounting table on which a plurality of independent polishing zones are arranged in a first horizontal direction;
the conveying mechanism is movably arranged on the mounting table along the first horizontal direction so as to convey the wafer;
the polishing mechanism is arranged in each polishing area and comprises a polishing disk, a polishing head and a polishing head cleaner, the polishing disk and the polishing head are rotatably arranged on the mounting table, the polishing head can move in the second horizontal direction and can be arranged on the mounting table in a lifting mode in the vertical direction, the polishing head can adsorb the wafer on the conveying mechanism, the wafer can move to the position above the polishing disk, the polishing disk can be matched with the polishing head to polish the wafer, the polishing head cleaner is fixedly arranged on the mounting table, and the polishing head can pass through the position above the polishing head cleaner when moving in the second horizontal direction, so that the polishing head cleaner can clean the polishing head.
As a preferable scheme of the polishing apparatus, the polishing mechanism further includes a polishing disk washer, and the polishing disk washer is rotatably disposed on the mounting table and located at one side of the polishing disk to wash the polishing disk.
As a preferable mode of the polishing apparatus, polishing accuracies of a plurality of the polishing zones sequentially increase along the first horizontal direction.
As a preferable scheme of the polishing apparatus, the number of the polishing areas is three, and the three polishing areas are a rough polishing area, a middle polishing area and a fine polishing area in sequence.
As a preferable scheme of the polishing equipment, the polishing equipment further comprises a loading manipulator, wherein a loading area is further arranged on the mounting table, a loading wafer box containing the wafer to be polished can be placed in the loading area, and the loading manipulator can take out the wafer from the loading wafer box and place the wafer on the conveying mechanism.
As a preferable scheme of the polishing apparatus, the polishing apparatus further includes an unloading robot, the mounting table is further provided with an unloading area, an unloading wafer cassette can be placed in the unloading area, the polished wafer can be placed on the conveying mechanism, and the unloading robot can place the polished wafer on the conveying mechanism into the unloading wafer cassette.
As a preferable aspect of the polishing apparatus, the unloading zone is provided with a water tank in which the unloaded wafer cassette containing the wafers can be immersed.
As a preferable mode of the polishing apparatus, the loading area is disposed opposite to the polishing area having the lowest polishing precision in the second horizontal direction; and/or
The unloading area is arranged opposite to the polishing area with the highest polishing precision along the second horizontal direction.
As a preferable scheme of the polishing apparatus, the polishing mechanism further includes a mounting rack, the mounting rack is disposed on the mounting table movably in the second horizontal direction and liftable in the vertical direction, each polishing mechanism includes at least two polishing heads, and the at least two polishing heads are rotatably mounted on the mounting rack, so that at least two wafers can be polished on the same polishing disk.
As a preferable mode of the polishing apparatus, each of the polishing mechanisms includes two of the polishing heads, the two polishing heads being arranged in the first horizontal direction; and/or
Each polishing mechanism comprises four polishing heads, and the four polishing heads are arranged in a square array.
The utility model has the advantages that:
the utility model provides a polishing equipment, through setting up a plurality of independent polishing district on the mount table to correspond in every polishing district and set up polishing mechanism, not only can polish the wafer in a plurality of polishing districts simultaneously, improve polishing efficiency, moreover because independent each other between a plurality of polishing districts, mutual isolation, so can carry out independent air current control and clean control, prevent effectively that polishing solution and polishing powder etc. in a polishing district from splashing to other polishing districts, thereby be favorable to improving the polishing yield; in addition, a plurality of independent polishing zones are arranged along the first horizontal direction, namely the polishing zones are arranged in series, the arrangement number of the polishing zones can be selected according to requirements such as polishing precision, the requirements of various polishing precisions are met, and the application range of polishing equipment is expanded; meanwhile, the polishing head cleaner is arranged on a moving path of the polishing head along the second horizontal direction, when the polishing head moves along the second horizontal direction to adsorb the wafer on the conveying mechanism, the polishing head firstly moves above the polishing head cleaner to clean the polishing head, and then the polishing head moves above the conveying mechanism to adsorb the wafer, so that the polishing head is prevented from polluting the wafer, and the cleanliness of the wafer is ensured.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
Fig. 1 is a plan view of a first polishing apparatus provided in an embodiment of the present invention;
fig. 2 is a side view of a first polishing apparatus provided by an embodiment of the present invention;
fig. 3 is a plan view of a second polishing apparatus provided in an embodiment of the present invention;
fig. 4 is a side view of a second polishing apparatus according to an embodiment of the present invention.
In the figure:
100-a wafer; 200-loading a wafer cassette; 300-unloading the wafer cassette;
1-mounting a table; 11-a polishing zone; 12-a loading zone; 13-an unloading zone; 14-a water tank;
2-a transfer mechanism;
3-a polishing mechanism; 31-a polishing disk; 32-a polishing head; 33-polishing head cleaner; 34-a polishing disk cleaner; 35-a mounting frame;
4-loading a manipulator;
5-unloading the mechanical arm.
Detailed Description
In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only or to distinguish between different structures or components and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 and 2, the present embodiment provides a polishing apparatus including a mounting table 1, a conveyance mechanism 2, and a polishing mechanism 3. Wherein, a plurality of independent polishing areas 11 are arranged on the mounting table 1 along the first horizontal direction. The transfer mechanism 2 is movably disposed on the mount table 1 in a first horizontal direction to transfer the wafer 100. All be provided with polishing mechanism 3 in each polishing zone 11, polishing mechanism 3 includes polishing dish 31, polishing head 32 and polishing head purger 33, and polishing dish 31 and polishing head 32 all rotationally set up on mount table 1, and polishing head 32 is portable and set up on mount table 1 along vertical direction liftable along the second horizontal direction, and wafer 100 on the transport mechanism 2 can be adsorbed to polishing head 32 to remove wafer 100 to the top of polishing dish 31, and polishing dish 31 can cooperate with polishing head 32 and polish wafer 100. The polishing head cleaner 33 is fixedly disposed on the mount table 1, and the polishing head 32 can pass over the polishing head cleaner 33 while moving in the second horizontal direction, so that the polishing head cleaner 33 can clean the polishing head 32.
According to the polishing device provided by the embodiment, the plurality of independent polishing areas 11 are arranged on the mounting table 1, and the polishing mechanism 3 is correspondingly arranged in each polishing area 11, so that the wafer 100 can be polished in the plurality of polishing areas 11 simultaneously, the polishing efficiency is improved, and the plurality of polishing areas 11 are independent and isolated from each other, so that independent air flow control and cleaning control can be performed, polishing liquid, polishing powder and the like in one polishing area 11 are effectively prevented from splashing to other polishing areas 11, and the polishing yield is improved; in addition, a plurality of independent polishing zones 11 are arranged in a first horizontal direction, namely the polishing zones 11 are arranged in series, so that the arrangement number of the polishing zones 11 can be selected according to requirements such as polishing precision, the requirements of various polishing precisions are met, and the application range of polishing equipment is expanded; meanwhile, the polishing head cleaner 33 is disposed on the moving path of the polishing head 32 along the second horizontal direction, when the polishing head 32 moves in the second horizontal direction to adsorb the wafer 100 on the transfer mechanism 2, the polishing head 32 moves above the polishing head cleaner 33 first, so that the polishing head cleaner 33 cleans the polishing head 32, and then the polishing head 32 moves above the transfer mechanism 2 and adsorbs the wafer 100, so as to prevent the wafer 100 from being contaminated by the polishing head 32, and ensure the cleanliness of the wafer 100.
Preferably, the polishing mechanism 3 provided in this embodiment further includes a polishing disk washer 34, and the polishing disk washer 34 is rotatably disposed on the mounting table 1 and located at one side of the polishing disk 31 to wash the polishing disk 31. Before polishing the wafer 100, the polishing disk cleaner 34 first cleans the polishing disk 31 to prevent the wafer 100 from being contaminated by the polishing disk 31 and ensure the cleanliness of the wafer 100.
Preferably, in the present embodiment, the polishing accuracy of the plurality of polishing zones 11 is sequentially increased in the first horizontal direction. According to the arrangement, the wafer 100 can be polished sequentially from coarse to fine step by step, so that the polishing processes are reasonably arranged, and the polishing quality is ensured. Of course, in other embodiments, the plurality of polishing zones 11 may be all of the same polishing precision according to the actual polishing requirement, and are not limited herein.
Alternatively, in the present embodiment, the number of the polishing zones 11 is three, and the three polishing zones 11 are a rough polishing zone, a middle polishing zone and a fine polishing zone in sequence. That is, the same wafer 100 may be subjected to rough polishing, intermediate polishing, and finish polishing in sequence. Of course, in other embodiments, the number of polishing zones 11 can be increased or decreased according to the actual polishing requirement, and is not limited herein.
Optionally, the polishing apparatus provided by the present embodiment further includes a loading robot 4, the mounting table 1 is further provided with a loading area 12, the loading cassette 200 containing the wafer 100 to be polished can be placed in the loading area 12, and the loading robot 4 can take out the wafer 100 from the loading cassette 200 and place the wafer on the transfer mechanism 2. That is, the loading robot 4 can place the wafer 100 loaded in the wafer cassette 200 onto the transfer mechanism 2 so that the polishing head 32 can adsorb the wafer 100 on the transfer mechanism 2. Alternatively, at least two loaded cassettes 200 can be placed in the loading zone 12 at the same time. Specifically, in the present embodiment, the loading robot 4 is disposed between the loading area 12 and the transfer mechanism 2.
Alternatively, in the present embodiment, the conveyance mechanism 2 is provided on the mount table 1 so as to be liftable in the vertical direction. Before the polishing head 32 adsorbs the wafer 100 on the transfer mechanism 2, the transfer mechanism 2 is lifted upwards to bring the wafer 100 thereon close to the polishing head 32, so that the polishing head 32 adsorbs the wafer 100. Of course, in other embodiments, the transfer mechanism 2 may not be vertically arranged, and the wafer 100 on the transfer mechanism 2 is only sucked by the polishing head 32.
Optionally, the polishing apparatus provided by the present embodiment further includes an unloading robot 5, the mounting table 1 is further provided with an unloading area 13, the unloading wafer cassette 300 can be placed in the unloading area 13, the polished wafer 100 can be placed on the conveying mechanism 2, and the unloading robot 5 can place the polished wafer 100 on the conveying mechanism 2 into the unloading wafer cassette 300. Namely, the unloading of the polished wafer 100 is realized by the cooperation of the unloading robot 5 and the transfer mechanism 2. Alternatively, at least two unloaded wafer cassettes 300 can be placed in the unload region 13 at the same time. Specifically, in the present embodiment, the unloading robot 5 is disposed between the unloading zone 13 and the transfer mechanism 2.
Preferably, in the present embodiment, the unloading zone 13 is provided with a water tank 14, and the unloading wafer cassette 300 containing the wafer 100 can be immersed in the water tank 14 to ensure the cleanliness of the wafer 100 and realize "dry in and wet out".
Preferably, in the present embodiment, the loading zone 12 is disposed opposite to the polishing zone 11 having the lowest polishing precision in the second horizontal direction. Specifically, in the present embodiment, the loading zone 12 is disposed opposite to the rough polishing zone. During polishing, the wafer 100 is usually rough polished, so that the loading area 12 is opposite to the rough polishing area, the loading path can be optimized, and the loading efficiency can be improved.
Preferably, in the present embodiment, the unloading zone 13 is disposed opposite to the polishing zone 11 where the polishing accuracy is highest in the second horizontal direction. Specifically, in the present embodiment, the unloading zone 13 is disposed opposite to the fine polishing zone. During polishing, the wafer 100 is usually finally subjected to fine polishing, and the unloading area 13 is opposite to the fine polishing area, so that the unloading path can be optimized, and the unloading efficiency can be improved.
Preferably, the polishing mechanism 3 provided in this embodiment further includes a mounting frame 35, the mounting frame 35 is disposed on the mounting table 1 movably in the second horizontal direction and elevatably and vertically, each polishing mechanism 3 includes at least two polishing heads 32, and each of the at least two polishing heads 32 is rotatably mounted on the mounting frame 35, so that at least two wafers 100 can be polished on the same polishing disk 31. By the cooperation of the plurality of polishing heads 32 in each polishing mechanism 3, it is advantageous to further improve the polishing efficiency. Further, the transfer mechanism 2 can transfer at least two wafers 100 at the same time. Further, the polishing head cleaner 33 can clean at least two polishing heads 32 at the same time.
Alternatively, as shown in fig. 1 to 2, two polishing heads 32 are included in each polishing mechanism 3, and the two polishing heads 32 are arranged in the first horizontal direction. The two polishing heads 32 can respectively suck one wafer 100, so that the two wafers 100 are simultaneously polished on one polishing disk 31. Further, the transfer mechanism 2 can transfer two wafers 100 at the same time. Further, the polishing head washer 33 can simultaneously wash the two polishing heads 32.
Alternatively, as shown in fig. 3 to 4, four polishing heads 32 are included in each polishing mechanism 3, and the four polishing heads 32 are arranged in a square array. The four polishing heads 32 can respectively suck one wafer 100, so that the four wafers 100 are simultaneously polished on one polishing disk 31. Further, the transfer mechanism 2 can transfer four wafers 100 at the same time. Further, the polishing head washer 33 can simultaneously wash the four polishing heads 32.
The working process of the polishing apparatus provided by this embodiment is as follows:
(1) placing a loaded wafer cassette 200 containing wafers 100 to be polished in the loading zone 12;
(2) the loading manipulator 4 scans the loaded wafer box 200, and after confirming the position information of the wafer 100 in the loaded wafer box 200, takes out the wafer 100 from the loaded wafer box 200 in an edge clamping manner; at the same time, the transfer mechanism 2 is moved to a position close to the loading robot 4, and the loading robot 4 places the wafer 100 on the transfer mechanism 2; meanwhile, the polishing head 32 in the rough polishing area moves above the polishing head cleaner 33, and the polishing head cleaner 33 cleans the polishing head 32;
(3) the cleaned polishing head 32 moves to the upper part of the transfer mechanism 2, the transfer mechanism 2 drives the wafer 100 to ascend, and the polishing head 32 descends and adsorbs the wafer 100 on the transfer mechanism 2; meanwhile, the polishing disk cleaner 34 cleans the polishing disk 31 in the rough polishing area;
(4) the transfer mechanism 2 is lowered and reset, and simultaneously the polishing head 32 is lifted and drives the wafer 100 to move to the upper part of the polishing disk 31;
(5) the polishing head 32 drives the wafer 100 to descend so as to make the wafer 100 fit with the polishing disk 31, and meanwhile, the polishing liquid in the rough polishing area starts to be supplied;
(6) the polishing head 32 and the polishing disk 31 rotate in the same direction at different speeds, so that the polishing disk 31 and the wafer 100 perform relative friction motion to roughly polish the wafer 100;
(7) after the rough polishing is finished, the polishing head 32 is lifted and drives the wafer 100 to move to the upper part of the transfer mechanism 2, and the wafer 100 is placed on the transfer mechanism 2;
(8) the conveying mechanism 2 conveys the wafer 100 after the rough polishing to a position opposite to a middle polishing area, and after cleaning, a polishing head 32 of the middle polishing area performs middle polishing on the wafer 100 according to the modes of the step (3) to the step (6);
(9) after the conveying mechanism 2 finishes feeding the centering polishing area, repeating the steps (2) to (6) to roughly polish another wafer 100;
(10) when the middle polishing is finished, the conveying mechanism 2 moves to a position opposite to the middle polishing area, and after the middle polishing is finished, the polishing head 32 of the middle polishing area ascends and drives the wafer 100 to move to the upper part of the conveying mechanism 2, and the wafer 100 after the middle polishing is placed on the conveying mechanism 2;
(11) the conveying mechanism 2 conveys the wafer 100 after the middle polishing to a position opposite to a fine polishing area, after cleaning, a polishing head 32 of the fine polishing area performs fine polishing on the wafer 100 according to the modes from the step (3) to the step (6), and meanwhile, other wafers 100 perform rough polishing, fine polishing and middle polishing in sequence according to the same mode;
(12) when the fine polishing is about to be finished, the conveying mechanism 2 moves to a position opposite to the fine polishing area, after the fine polishing is finished, the polishing head 32 of the fine polishing area ascends and drives the wafer 100 to move to the upper part of the conveying mechanism 2, and the wafer 100 after the fine polishing is placed on the conveying mechanism 2;
(13) the unloading wafer box 300 immersed in the water tank 14 is lifted, the unloading manipulator 5 grips the finely polished wafer 100 from the transfer mechanism 2 in an edge gripping manner and places the wafer 100 in the lowermost layer of the unloading wafer box 300, and after completion, the unloading wafer box 300 is restored and immersed in the water tank 14;
(14) when the loaded cassette 200 is empty and the unloaded cassette 300 is full of wafers 100, the completion of the process is indicated, and the loaded cassette 200 and the unloaded cassette 300 are replaced.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (10)
1. A polishing apparatus, characterized by comprising:
a mounting table (1) on which a plurality of independent polishing zones (11) are arranged in a first horizontal direction;
a transfer mechanism (2) movably provided on the mount table (1) in the first horizontal direction to transfer the wafer (100);
polishing mechanism (3), every all be provided with in polishing district (11) polishing mechanism (3), polishing mechanism (3) are including polishing dish (31), polishing head (32) and polishing head purger (33), polishing dish (31) with polishing head (32) all rotationally set up on mount table (1), polishing head (32) are portable and set up along vertical direction liftable ground on mount table (1) along the second horizontal direction, polishing head (32) can adsorb wafer (100) on transport mechanism (2), and will wafer (100) move to the top of polishing dish (31), polishing dish (31) can with polishing head (32) cooperate and right wafer (100) polish, polishing head purger (33) are fixed to be set up on mount table (1), the polishing head (32) can pass over the polishing head cleaner (33) while moving in the second horizontal direction, so that the polishing head cleaner (33) can clean the polishing head (32).
2. The polishing apparatus according to claim 1, wherein the polishing mechanism (3) further comprises a polishing disk washer (34), and the polishing disk washer (34) is rotatably provided on the mounting table (1) on a side of the polishing disk (31) to wash the polishing disk (31).
3. The polishing apparatus according to claim 1, wherein polishing accuracies of a plurality of the polishing zones (11) are sequentially increased in the first horizontal direction.
4. A polishing apparatus according to claim 3, characterized in that the number of said polishing zones (11) is three, and three of said polishing zones (11) are a rough polishing zone, a middle polishing zone and a fine polishing zone in this order.
5. A polishing apparatus according to claim 3, characterized by further comprising a loading robot (4), wherein a loading area (12) is further provided on the mounting table (1), a loading cassette (200) containing the wafer (100) to be polished can be placed in the loading area (12), and the loading robot (4) can take out the wafer (100) from the loading cassette (200) and place the wafer on the transfer mechanism (2).
6. The polishing apparatus according to claim 5, further comprising an unloading robot (5), wherein an unloading zone (13) is further provided on the mounting table (1), an unloading wafer cassette (300) can be placed in the unloading zone (13), the polished wafer (100) can be placed on the transfer mechanism (2), and the unloading robot (5) can place the polished wafer (100) on the transfer mechanism (2) into the unloading wafer cassette (300).
7. Polishing apparatus according to claim 6, characterized in that the unloading zone (13) is provided with a water tank (14), the unloaded wafer cassette (300) containing the wafers (100) being submersible in the water tank (14).
8. The polishing apparatus according to claim 6, wherein the loading zone (12) is disposed opposite to the polishing zone (11) having the lowest polishing precision in the second horizontal direction; and/or
The unloading area (13) is arranged opposite to the polishing area (11) with the highest polishing precision along the second horizontal direction.
9. The polishing apparatus according to claim 1, wherein the polishing mechanism (3) further comprises a mounting frame (35), the mounting frame (35) is movably arranged on the mounting table (1) along the second horizontal direction and is vertically liftable, and each polishing mechanism (3) comprises at least two polishing heads (32), and each of the at least two polishing heads (32) is rotatably arranged on the mounting frame (35) so that at least two wafers (100) can be polished on the same polishing disk (31).
10. The polishing apparatus according to claim 9, wherein each of said polishing mechanisms (3) includes two of said polishing heads (32), the two of said polishing heads (32) being arranged in said first horizontal direction; and/or
Each polishing mechanism (3) comprises four polishing heads (32), and the four polishing heads (32) are arranged in a square array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922474677.XU CN211465883U (en) | 2019-12-31 | 2019-12-31 | Polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922474677.XU CN211465883U (en) | 2019-12-31 | 2019-12-31 | Polishing equipment |
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| Publication Number | Publication Date |
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| CN211465883U true CN211465883U (en) | 2020-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922474677.XU Active CN211465883U (en) | 2019-12-31 | 2019-12-31 | Polishing equipment |
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| CN (1) | CN211465883U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022121428A1 (en) * | 2020-12-08 | 2022-06-16 | 杭州众硅电子科技有限公司 | Polishing device |
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2019
- 2019-12-31 CN CN201922474677.XU patent/CN211465883U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022121428A1 (en) * | 2020-12-08 | 2022-06-16 | 杭州众硅电子科技有限公司 | Polishing device |
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