TWI754087B - Grinding device - Google Patents
Grinding device Download PDFInfo
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- TWI754087B TWI754087B TW107126614A TW107126614A TWI754087B TW I754087 B TWI754087 B TW I754087B TW 107126614 A TW107126614 A TW 107126614A TW 107126614 A TW107126614 A TW 107126614A TW I754087 B TWI754087 B TW I754087B
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- Taiwan
- Prior art keywords
- cassette
- wafer
- weight
- wafers
- platform
- Prior art date
Links
- 238000000227 grinding Methods 0.000 title claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 72
- 238000005498 polishing Methods 0.000 claims abstract description 67
- 238000003860 storage Methods 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims description 122
- 230000007246 mechanism Effects 0.000 claims description 21
- 239000007788 liquid Substances 0.000 description 12
- 238000004804 winding Methods 0.000 description 11
- 238000005406 washing Methods 0.000 description 7
- 230000003028 elevating effect Effects 0.000 description 6
- 238000007517 polishing process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
[課題]要防止片匣浮上水面,並且可以對片匣的片匣尺寸進行辨識。 [解決手段]研磨裝置具備將晶圓收納至第2片匣的收納設備,收納設備具備:片匣單元,使第2片匣浸沒至水槽內;及移動設備,使晶圓沿著軌道進行水中移動,並且收納至第2片匣,又,片匣單元具備:重錘,從上壓住第2片匣;及升降設備,在以重錘壓住平台所載置的第2片匣的狀態下使第2片匣浸沒,因此,藉由以重錘將浸沒至水槽的第2片匣上方壓住,可以防止第2片匣浮上水面。又,依據本發明,藉由辨識部可以容易地對片匣尺寸不適當的第2片匣進行辨識。[Subject] To prevent the film cassette from floating to the surface, and to be able to identify the size of the film cassette. [Solution] The polishing apparatus includes a storage device for storing the wafer in the second cassette, and the storage device includes: a cassette unit for immersing the second cassette in a water tank; and a moving device for moving the wafer into the water along the rail. It is moved and stored in the second cassette, and the cassette unit is provided with: a weight for pressing the second cassette from above; and a lifting device for pressing the weight on the second cassette placed on the platform The 2nd film cassette is submerged downwards, therefore, by pressing the top of the 2nd film cassette immersed in the water tank with a heavy hammer, the 2nd film cassette can be prevented from floating to the surface. Moreover, according to this invention, the 2nd cassette of an inappropriate size of a cassette can be recognized easily by an identification part.
Description
發明領域 Field of Invention
本發明是有關於一種以研磨墊來對晶圓進行研磨加工的研磨裝置。 The present invention relates to a polishing apparatus for polishing a wafer with a polishing pad.
發明背景 Background of the Invention
藉由例如稱為CMP(Chemical Mechanical Polishing,化學機械研磨)之化學機械研磨法來對晶圓等之被加工物進行研磨的研磨裝置,是使研磨墊抵接於晶圓,並且一邊對晶圓供給研磨液(slurry)一邊進行晶圓的研磨加工(例如,參照下述的專利文獻1)。在這種CMP研磨加工中,當研磨液附著於晶圓時,有時即便進行洗浄也無法去除。就其原因而言,是因為研磨液若是在附著於晶圓的狀態下乾燥的話,就會在晶圓上殘留水滴的痕跡或者研磨液的痕跡。 A polishing apparatus that polishes a workpiece such as a wafer by a chemical mechanical polishing method called CMP (Chemical Mechanical Polishing), for example, a polishing pad is brought into contact with the wafer, while the wafer is The polishing process of the wafer is performed while supplying a polishing liquid (for example, refer to the following Patent Document 1). In such a CMP polishing process, when the polishing liquid adheres to the wafer, it may not be removed even by cleaning. The reason for this is that if the polishing liquid dries while adhering to the wafer, traces of water droplets or traces of polishing liquid remain on the wafer.
作為上述問題的對策,是在晶圓的研磨加工後,將晶圓維持濕潤狀態並且收納至片匣,之後,以藥液將收納至片匣的晶圓加以洗淨。也就是,只要在研磨加工後將晶圓維持浸沒狀態即可。尤其,在晶圓是由鉭酸鋰、鈮酸鋰等而構成的情況下,會變得難以將研磨液從晶圓去除,因此有一種研磨裝置是在研磨加工後,使片匣浸 沒並且在水中進行將晶圓收容至片匣內的水中搬送(例如,參照下述的專利文獻2)。 As a countermeasure against the above-mentioned problem, after the polishing of the wafer, the wafer is stored in the cassette while maintaining a wet state, and thereafter, the wafer accommodated in the cassette is washed with a chemical solution. That is, it is sufficient to keep the wafer in the immersed state after the polishing process. In particular, when the wafer is composed of lithium tantalate, lithium niobate, etc., it becomes difficult to remove the polishing liquid from the wafer. Therefore, there is a polishing apparatus that dips the cassette after polishing. In addition, the water transfer in which the wafer is accommodated in the cassette is carried out in water (for example, refer to the following Patent Document 2).
專利文獻1:日本專利特開2004-22804號公報 Patent Document 1: Japanese Patent Laid-Open No. 2004-22804
專利文獻2:日本專利特開平11-277423號公報 Patent Document 2: Japanese Patent Laid-Open No. 11-277423
發明概要 Summary of Invention
如上所述的片匣在接下來的洗浄步驟必須具耐藥性,因此是以樹脂而形成。雖然也有沈在水中的樹脂,但因為難以成型,或是會變重,所以通常是以聚乙烯製的樹脂來製造片匣。因此,會有即使將片匣沈在水槽內的水中,也還是會浮上的問題。又,有時會將片匣尺寸不適當的片匣搞錯而供給至研磨裝置,也會有無法對浸沒至水槽內的片匣進行辨識的問題。 The film cassette as described above must be chemically resistant in the subsequent cleaning step, so it is formed of resin. Although there are resins immersed in water, they are usually made of polyethylene resins because they are difficult to mold or become heavy. Therefore, even if the film cassette is submerged in the water in the water tank, there is a problem that it still floats. In addition, a film cassette having an inappropriate size may be mistakenly supplied to the polishing apparatus, and there may be a problem that the film cassette immersed in the water tank cannot be recognized.
本發明是有鑒於上述事項而作成的發明,其目的在於要防止片匣浮上水面,並且可以對片匣的片匣尺寸進行辨識。 The present invention has been made in view of the above-mentioned matters, and an object thereof is to prevent the film cassette from rising to the surface, and to allow the cassette size of the film cassette to be recognized.
本發明是一種研磨裝置,具備:第1片匣,棚架狀地收容晶圓;保持台,保持晶圓;搬入設備,將晶圓從該第1片匣搬入該保持台;研磨設備,對該保持台所 保持的晶圓進行研磨;搬出設備,將晶圓從該保持台搬出;第2片匣,將該搬出設備所搬出的晶圓棚架狀地收容;及收納設備,將該搬出設備所搬出的晶圓收納至該第2片匣,該搬出設備具備搬出墊,該搬出墊具有保持晶圓的保持面,並且將水從該保持面的中央呈放射狀地放水,而在該保持面與晶圓之間形成水層來保持晶圓,該收納設備具備:水槽;片匣單元,可載置該第2片匣,並且使該第2片匣浸沒至該水槽內;軌道,朝向浸沒至該水槽內的該第2片匣延伸;及移動設備,使由該搬出設備所加以浸沒至該軌道上的晶圓沿著該軌道的延伸方向進行水中移動,並且收納至該第2片匣,該片匣單元具備:平台,可載置該第2片匣;重錘,從上壓住該第2片匣;及升降設備,在以該重錘壓住該平台所載置的該第2片匣的狀態下使該平台升降,而使該第2片匣浸沒,又,該研磨裝置具備辨識部,該辨識部是以該重錘壓住該第2片匣時之該重錘的高度位置來對該第2片匣的片匣尺寸進行辨識。 The present invention relates to a polishing apparatus comprising: a first cassette for accommodating wafers in a shelf shape; a holding table for holding the wafers; a carrying device for carrying the wafers from the first cassette into the holding table; and a polishing device for the holding station The held wafers are polished; the unloading equipment carries out the wafers from the holding table; the second cassette stores the wafers carried out by the unloading equipment in a shelf; and the storage equipment carries out the unloading equipment. The wafers are accommodated in the second cassette, and the unloading equipment includes a carry-out pad having a holding surface for holding the wafer, and water is radially discharged from the center of the holding surface, and the holding surface is connected to the wafer. A water layer is formed between the circles to hold the wafer, and the storage device includes: a water tank; a cassette unit capable of placing the second cassette and immersing the second cassette in the water tank; The second cassette in the water tank is extended; and a moving device makes the wafers immersed on the rail by the unloading equipment move in water along the extending direction of the rail, and are stored in the second cassette, the The cassette unit includes: a platform on which the second cassette can be placed; a weight for pressing the second cassette from above; and a lifting device for pressing the second cassette on the platform with the weight. The platform is raised and lowered in the state of the cassette, so that the second film cassette is immersed, and the grinding device is provided with an identification portion, and the identification portion is the height position of the weight when the weight is pressed against the second cassette. to identify the cassette size of the second cassette.
上述重錘是配設在支臂的一端,該支臂是藉由以另一端為支點來進行旋繞,而使該重錘接近及遠離上述平台所載置的上述第2片匣上方,上述辨識部能夠以該支臂的角度來對該重錘的高度進行辨識,進而對該第2片匣的片匣尺寸進行辨識。 The weight is arranged at one end of the support arm, and the support arm is revolved by taking the other end as a fulcrum, so that the weight is close to and away from the top of the second film cassette placed on the platform. The above identification The part can identify the height of the weight by the angle of the support arm, and then identify the cassette size of the second cassette.
本發明之研磨裝置具備:第1片匣,棚架狀地收容晶圓;保持台,保持晶圓;搬入設備,將晶圓從第 1片匣搬入保持台;研磨設備,對保持台所保持的晶圓進行研磨;搬出設備,將晶圓從保持台搬出;第2片匣,將搬出設備所搬出的晶圓棚架狀地收容;及收納設備,將搬出設備所搬出的晶圓收納至第2片匣,又,收納設備具備:水槽;片匣單元,使第2片匣浸沒至水槽內;軌道,朝向浸沒至水槽內的第2片匣延伸;及移動設備,使由搬出設備所加以浸沒至軌道上的晶圓沿著軌道的延伸方向進行水中移動,並且收納至第2片匣,又,片匣單元具備:平台,可載置第2片匣;重錘,從上壓住第2片匣;及升降設備,在以重錘壓住平台所載置的第2片匣的狀態下使平台升降,而使第2片匣浸沒,因此,藉由以重錘將浸沒至水槽內的第2片匣上方壓住,可以防止第2片匣朝向水面浮上。藉此,可以利用樹脂製並且低價製造的第2片匣。又,本發明之研磨裝置具備辨識部,該辨識部是以重錘壓住第2片匣時之重錘的高度來對第2片匣的片匣尺寸進行辨識,因此可以容易地對片匣尺寸不適當的第2片匣進行辨識。 The polishing apparatus of the present invention includes: a first cassette for storing wafers in a shelf; a holding table for holding wafers; The first cassette is loaded into the holding table; the polishing equipment is used to polish the wafers held by the holding table; the unloading equipment is used to carry out the wafers from the holding table; the second cassette is used to store the wafers carried out by the unloading equipment in a shelf shape; and storage equipment for storing the wafers carried out by the unloading equipment into the second cassette, and the storage equipment includes: a water tank; a cassette unit for immersing the second cassette in the water tank; The two cassettes are extended; and the moving device makes the wafers immersed on the rail by the unloading equipment move underwater along the extending direction of the rail, and are stored in the second cassette, and the cassette unit is provided with: a platform, which can be A second film cassette is placed; a weight is used to press the second film cassette from above; Since the cassette is submerged, the second cassette can be prevented from floating toward the water surface by pressing the top of the 2 cassette immersed in the water tank with a heavy hammer. Thereby, a resin-made second film cassette can be used at low cost. In addition, the polishing apparatus of the present invention is provided with an identification portion that identifies the cassette size of the second cassette by the height of the weight when the weight is pressed against the second cassette, so that the cassette can be easily identified. An improperly sized 2nd cassette is identified.
上述重錘是配設在支臂的一端,支臂是藉由以另端為支點來進行旋繞,而使重錘接近及遠離上述平台所載置的上述第2片匣上方,上述辨識部能夠以支臂的角度來對重錘的高度進行辨識,進而對第2片匣的片匣尺寸進行辨識,因此與上述相同,可以容易地對片匣尺寸不適當的第2片匣進行辨識。 The weight is arranged at one end of the support arm, and the support arm is revolved by taking the other end as a fulcrum, so that the weight is close to and away from the top of the second film cassette placed on the platform, and the identification portion can be used. The height of the weight is identified by the angle of the support arm, and further, the size of the second cassette is identified. Therefore, the same as the above, the second cassette with an inappropriate size can be easily identified.
1:研磨裝置 1: Grinding device
2:保持台 2: Holding table
2a、410:保持面 2a, 410: Keep Face
3:外罩 3: cover
4:平台 4: Platform
5:第1片匣 5: 1st film cassette
6:搬送設備 6: Handling equipment
7:暫時放置台 7: Temporary placement table
8、8’:第2片匣 8, 8': 2nd cassette
8a:收容棚 8a: Containment Shed
9:水 9: Water
10:研磨設備 10: Grinding equipment
11:主軸 11: Spindle
12:主軸殼體 12: Spindle housing
13:托座 13: Bracket
14、22、544、651:馬達 14, 22, 544, 651: Motor
15:安裝座 15: Mounting seat
16:研磨墊 16: Polishing pad
17:圓板 17: Round plate
18:研磨構件 18: Grinding components
19:研磨液供給源 19: Grinding fluid supply source
20:研磨進給設備 20: Grinding feed equipment
21、543、650:滾珠螺桿 21, 543, 650: ball screw
23、545:導軌 23, 545: rail
24:升降板 24: Lifting plate
30:搬入設備 30: Move in equipment
31:搬入墊 31: Move In Pad
32、43:旋繞臂 32, 43: Convoluted Arm
33:移動機構 33: Moving Mechanisms
40:搬出設備 40: Move out the equipment
41:搬出墊 41: Move Out Pad
42:升降機構 42: Lifting mechanism
44:旋繞機構 44: Winding mechanism
45:水供給源 45: Water supply source
50:收納設備 50: Storage equipment
51:水槽 51: Sink
52a:第1底部
52a:
52b:第2底部 52b: 2nd bottom
53:軌道 53: Orbit
54:移動設備 54: Mobile Devices
60、60A:片匣單元 60, 60A: cassette unit
61、61A:平台 61, 61A: Platform
62:重錘 62: Hammer
63、63A、540:支臂 63, 63A, 540: Arm
64:支點部 64: Pivot Department
65:升降設備 65: Lifting equipment
66、68:連結部 66, 68: Links
67:位置決定塊 67: Position decision block
69:導部 69: Guide
70、90:辨識部 70, 90: Identification Department
71:光投射部 71: Light Projection Department
72:光接受部 72: Light Receiving Department
80:判斷設備 80: Judging equipment
100:裝置基座 100: Device base
101:柱部 101: Column
102:平板 102: Tablet
103:支撐板 103: Support plate
330:軸構件 330: Shaft member
411:中央部 411: Central Department
412:水噴出口 412: Water spout
413:溝 413: Ditch
413a:斜面 413a: Bevel
414:橫向位移防止壁 414: Lateral displacement preventing wall
420:汽缸 420: Cylinder
421:活塞桿 421: Piston Rod
440:旋轉軸 440: Rotary axis
541:壓出部 541: Press out part
542:升降機構 542: Lifting mechanism
546:移動部 546: Mobile Ministry
630:支臂支撐部 630: Arm support
652:升降部 652: Lifting Department
W:晶圓 W: Wafer
θ 1、θ 2:角度
+X、-X、+Y、-Y、+Z、-Z:方向 +X, -X, +Y, -Y, +Z, -Z: Direction
圖1是顯示研磨裝置之構成的立體圖。 FIG. 1 is a perspective view showing the structure of a polishing apparatus.
圖2是顯示搬出墊之構成的立體圖。 FIG. 2 is a perspective view showing the structure of a carry-out pad.
圖3是顯示以搬出墊將研磨後的晶圓搬出之狀態的截面圖。 3 is a cross-sectional view showing a state in which the polished wafer is carried out by the carry-out pad.
圖4是顯示使晶圓與第2片匣浸沒至水槽之狀態的截面圖。 4 is a cross-sectional view showing a state in which the wafer and the second cassette are immersed in a water tank.
圖5是顯示藉由移動設備來使晶圓朝向第2片匣移動之狀態的截面圖。 5 is a cross-sectional view showing a state in which the wafer is moved toward the second cassette by the moving device.
圖6是顯示將晶圓收納至第2片匣之狀態的截面圖。 6 is a cross-sectional view showing a state in which the wafer is accommodated in the second cassette.
圖7是顯示使收納有晶圓的第2片匣下降之狀態的截面圖。 7 is a cross-sectional view showing a state in which the second cassette in which the wafers are accommodated is lowered.
圖8是顯示辨識部以支臂的角度來對重錘的高度進行辨識,進而對第2片匣的片匣尺寸(大片匣尺寸)進行辨識之狀態的截面圖。 8 is a cross-sectional view showing a state in which the recognition unit recognizes the height of the weight by the angle of the arm, and further recognizes the cassette size (large cassette size) of the second cassette.
圖9是顯示辨識部以支臂的角度來對重錘的高度進行辨識,進而對第2片匣的片匣尺寸(小片匣尺寸)進行辨識之狀態的截面圖。 9 is a cross-sectional view showing a state in which the recognition unit recognizes the height of the weight by the angle of the arm, and further recognizes the cassette size (small cassette size) of the second cassette.
圖10是顯示辨識部以支臂的位置來對重錘的高度進行辨識,進而對第2片匣的片匣尺寸(大片匣尺寸)進行辨識之狀態的截面圖。 10 is a cross-sectional view showing a state in which the recognition unit recognizes the height of the weight by the position of the arm, and further recognizes the cassette size (large cassette size) of the second cassette.
圖11是顯示辨識部以支臂的位置來對重錘的高度進行辨識,進而對第2片匣的片匣尺寸(小片匣尺寸)進行辨識之狀態的截面圖。 11 is a cross-sectional view showing a state in which the recognition unit recognizes the height of the weight by the position of the arm, and further recognizes the cassette size (small cassette size) of the second cassette.
用以實施發明之形態 Form for carrying out the invention
圖1所示之研磨裝置1是藉由CMP來研磨晶圓W的研磨裝置之一例。研磨裝置1具有在Y軸方向上延伸的裝置基座100,並且在裝置基座100的+Y方向側的端部配設有平台4。在平台4上可載置將研磨前之晶圓W棚架狀地收容的第1片匣5。在面對第1片匣5的位置上具備將晶圓W搬送至期望位置的搬送設備6,且在搬送設備6的可動範圍上具備用於暫時放置晶圓W的暫時放置台7。第1片匣5是藉由例如聚乙烯等之樹脂而形成。第1片匣5的尺寸並無特別地限定,是具有與晶圓W之尺寸相對應的片匣尺寸,可以收容例如4吋、6吋或8吋的晶圓W。在平台4具備有感測器,該感測器是藉由所載置之第1片匣5的尺寸或者形狀,來對加工前之晶圓W的尺寸進行辨識。又,加工前之晶圓W的尺寸辨識也可以在暫時放置台7來進行。即,以感測器等來對暫時放置台7所載置的晶圓W進行檢測,藉此來對晶圓W的尺寸進行辨識。在此情況下,也可以在已設定於研磨加工條件的加工資料中設定晶圓W的尺寸。像這樣,在研磨裝置1中,是對加工前之晶圓W的尺寸進行辨識。
The polishing
在裝置基座100上具備有保持晶圓W的保持台2。保持台2的上表面是成為吸引保持晶圓W的保持面2a,且在保持面2a連接有未圖示的吸引源。保持台2的周圍是藉由外罩3所包覆,在保持台2的下方連接有使保持台2在Y軸方向上移動的保持台移動設備。在暫時放置台7的附近具備搬入設備30,該搬入設備30會將從第1片匣5
搬出而暫時放置在暫時放置台7的晶圓W搬入保持台2。
The
搬入設備30具備:搬入墊31,保持晶圓W;旋繞臂32,水平地支撐搬入墊31;及移動機構33,使旋繞臂32升降並且在水平方向上旋繞。移動機構33至少具備:軸構件330,連接於旋繞臂32;及未圖示的馬達,連接於軸構件330。當軸構件330在Z軸方向上升降時,可以使搬入墊31連同旋繞臂32一起在Z軸方向上升降。又,當軸構件330旋轉時,旋繞臂32會在水平方向上旋繞,而可使搬入墊31在水平方向上旋繞。
The
在裝置基座100的-Y方向側的後部,豎立設置有柱部101。在柱部101的前方中,具備:研磨設備10,對保持台2所保持的晶圓W進行研磨;及研磨進給設備20,將研磨設備10在相對於保持台2所保持的晶圓W接近及遠離的方向(Z軸方向)上進行研磨進給。
A
研磨設備10具備:主軸11,具有Z軸方向的軸心;主軸殼體12,將主軸11圍繞且支撐成可旋轉;托座13,保持主軸殼體12;馬達14,連接於主軸11的一端;及研磨墊16,透過安裝座15而可裝卸地裝設在主軸11的下端。研磨墊16是藉由圓板17及固定於圓板17的研磨構件18而構成。藉由馬達14來使主軸11旋轉,藉此便可使研磨墊16以規定的旋轉速度進行旋轉。研磨構件18是藉由例如胺基甲酸乙酯或者不織布而形成。在研磨設備10連接有研磨液供給源19,該研磨液供給源19會將研磨液供給至研磨構件18與保持台2所保持的晶圓W之間。
The grinding
研磨進給設備20具備:滾珠螺桿21,在Z軸方向上延伸;馬達22,連接於滾珠螺桿21的一端;一對導軌23,與滾珠螺桿21平行地延伸;及升降板24,其中一面連結於研磨設備10。在升降板24的另一面滑動接合有一對導軌23,且在形成於升降板24的中央之螺帽中,螺合有滾珠螺桿21。藉由馬達22驅動滾珠螺桿21,可以將研磨設備10連同升降板24一起沿著一對導軌23在Z軸方向上進行研磨進給。
The grinding and feeding
在保持台2的側邊側(在圖示之例中為+X方向側)具備搬出設備40,該搬出設備40會將研磨後的晶圓W從保持台2搬出。搬出設備40具備:搬出墊41,保持晶圓W;升降機構42,使搬出墊41在Z軸方向上升降;旋繞臂43,一端連接於升降機構42;及旋繞機構44,連接於旋繞臂43的另一端。升降機構42至少具備汽缸420及活塞桿421,並且可以使搬出墊41在Z軸方向上升降。旋繞機構44至少具備:旋轉軸440,使旋繞臂43在水平方向上旋繞;及馬達,連接於旋轉軸440,當藉由馬達來使旋轉軸440旋轉時,旋繞臂43會在水平方向上旋繞,而可使搬出墊41在水平方向上旋繞。
On the side (+X direction side in the illustrated example) of the holding table 2 , a carry-out
如圖2所示,搬出墊41具有形成為圓板狀且會保持晶圓W的保持面410,並且在保持面410的中央部411形成有用於將水呈放射狀地放水的複數個(在圖之例中為三個)水噴出口412。在各水噴出口412連接有圖1所示之水供給源45。在保持面410形成有溝413,該溝413
是傾斜成從水噴出口412所噴出的水會呈放射狀地流動。溝413具有斜面413a,該斜面413a是從搬出墊41的外周側朝向中心側(中央部411側)降低地傾斜。在保持面410的外周部配設有環狀的橫向位移防止壁414。像這樣所構成的搬出墊41中,是將水從各水噴出口412沿著溝413呈放射狀地放水,藉此在保持面410與晶圓W之間形成水層,而可以利用白努利定律在非接觸的狀態下吸引保持晶圓W。
As shown in FIG. 2 , the
圖1所示之裝置基座100具備:第2片匣8,將搬出設備40所搬出的晶圓W棚架狀地收容;及收納設備50,將搬出設備40所搬出的晶圓W收納至第2片匣8。第2片匣8如圖3所示,具有複數個收容棚8a,該等收容棚8a是在上下方向設置規定的間隔而形成。在第2片匣8中,是形成為可以在水平的狀態下將晶圓W收容在收容棚8a中。第2片匣8與第1片匣5相同,是藉由例如聚乙烯等之樹脂而形成。又,有關第2片匣8的尺寸也並無特別地限定,是具有與晶圓W之尺寸相對應的片匣尺寸,可以收容例如4吋、6吋或8吋的晶圓W。
The
收納設備50具備:水槽51;片匣單元60,可載置第2片匣8,並且使第2片匣8浸沒至水槽51內;軌道53,朝向浸沒至水槽51內的第2片匣8延伸;及移動設備54,使由搬出設備40所加以浸沒至軌道53上的晶圓W在軌道53的延伸方向上進行水中移動,並且收納至第2片匣8。水槽51具有:第1底部52a,敷設有軌道53;及第2
底部52b,比第1底部52a還深。在將研磨後的晶圓W收納至第2片匣8時,是在水槽51內存放有洗淨水9的狀態下而實施。洗淨水9並無特別地限定,可以使用例如藥液或者純水。第1底部52a只要具有會使晶圓W浸沒在軌道53上的深度左右即可。又,第2底部52b只要具有會使第2片匣8浸沒的深度左右即可。
The
在裝置基座100的+X方向側的端部,抵靠配設有在Y軸方向上延伸的平板102,且在平板102配設有移動設備54。移動設備54具備支臂540;壓出部541,從支臂540的一端透過升降機構542而連接;滾珠螺桿543,沿著平板102延伸;馬達544,連接於滾珠螺桿543的一端;一對導軌545,與滾珠螺桿543平行地延伸;及移動部546,連接於支臂540的另一端,並且沿著導軌545在Y軸方向上移動。升降機構542是藉由汽缸及活塞桿而構成,並且可以使壓出部541在Z軸方向上升降。在移動部546的側部滑動接合有一對導軌545,且在形成於移動部546的中央之螺帽中,螺合有滾珠螺桿543。藉由馬達544驅動滾珠螺桿543,可以使壓出部541連同移動部546一起沿著一對導軌545在Y軸方向上移動。
On the end of the
在水槽51的側邊,配設有支撐片匣單元60的支撐板103。片匣單元60具備:平台61,可載置第2片匣8;重錘62,從上壓住第2片匣8;及升降設備65,在以重錘62壓住平台61所載置的第2片匣8的狀態下使平台61升降,而使第2片匣8浸沒。在平台61連結有圖3所示之連
結部66,該連結部66是從平台61的一端向Z軸方向延伸。又,在平台61上,對應於第2片匣8的外形,而在第2片匣8的角部位置配設有複數個(例如二個)位置決定塊67。位置決定塊67例如為截面大致L字形的塊體。藉由使第2片匣8的角部抵接於位置決定塊67的內側面,就可以在平台61中,將第2片匣8在適當的位置上決定位置。
A
如圖3所示,重錘62是配設在支臂63的一端,且在支臂63的另一端配設有具有水平方向之軸心的支點部64。支點部64是固定在平台61的連結部66的上端。支臂63是藉由以支點部64為軸來進行旋繞,而可以使重錘62對平台61所載置的第2片匣8的上表面進行接近及遠離。重錘62的重量並無特別地限定。
As shown in FIG. 3 , the
升降設備65具備:滾珠螺桿650,在Z軸方向上延伸;馬達651,連接於滾珠螺桿650的一端;及升降部652,使平台61升降。在升降部652連接有連結部66,且在形成於升降部652的中央之螺帽中,螺合有滾珠螺桿650。藉由馬達651驅動滾珠螺桿650,可以使第2片匣8連同升降部652一起升降,而使第2片匣8浸沒至水槽51內。然後,藉由以重錘62將浸沒至水槽51內的第2片匣8的上表面壓住,可以防止第2片匣8朝向洗淨水9的水面浮上。
The elevating
圖1所示之研磨裝置1具備有辨識部70,該辨識部70是以重錘62壓住第2片匣8時之支臂63的角度來對第2片匣8的片匣尺寸進行辨識。在辨識部70連接有判
斷設備80,該判斷設備80會判斷辨識部70所辨識之第2片匣8的片匣尺寸是否適當。辨識部70如圖3的局部放大圖所示,例如為反射型的光感測器,並且成為分割成光投射部71及光接受部72的構成,該光投射部71會朝向支臂63投射測定光,該光接受部72會接受在支臂63的側面所反射的反射光。在辨識部70中,是從光投射部71對支臂63投射測定光,並且用光接受部72接受在側面所反射的反射光,並以未圖示的光電轉換部將其反射光的光接受量轉換成電壓值,來檢測重錘62的高度位置,進而可以對第2片匣8的片匣尺寸進行辨識。辨識部70雖是以反射型感測器而構成,但也可以構成為例如在支點部64設置角度檢測感測器來檢測支臂63的角度,以對重錘62的高度位置進行辨識,進而對第2片匣8的片匣尺寸進行辨識。
The polishing
接著,針對研磨裝置1的動作例來進行說明。晶圓W是具有圓形板狀之基板的被加工物的一例,例如是藉由鉭酸鋰(LT)或者鈮酸鋰(LN)而構成。首先,搬送設備6會將研磨前的晶圓W從第1片匣5搬出,而暫時放置在暫時放置台7。搬入設備30會以搬入墊31將暫時放置在暫時放置台7的晶圓W搬出,並且將晶圓W搬入保持台2的保持面2a。晶圓W載置於保持台2的保持面2a後,會藉由吸引源的吸引力以保持面2a吸引保持晶圓W,並以未圖示的保持台移動設備使保持台2在例如-Y方向上移動,從而使晶圓W移動至研磨設備10的下方。然後,藉由研磨進給設備20使研磨設備10連同升降板24一起下
降。
Next, an operation example of the
保持晶圓W的保持台2是以規定的旋轉速度進行旋轉。研磨設備10會藉由主軸11使研磨墊16以規定的旋轉速度進行旋轉,研磨進給設備20是一邊將研磨墊16在例如-Z方向上進行研磨進給,一邊使研磨構件18接觸於旋轉的晶圓W,使研磨構件18與晶圓W相對地滑動。此時,從研磨液供給源19將研磨液供給至研磨構件18與晶圓W之間。藉由研磨設備10只在規定的時間對晶圓W進行研磨後,會藉由研磨進給設備20使研磨設備10上升,結束研磨加工。
The holding table 2 holding the wafer W rotates at a predetermined rotational speed. The polishing
研磨加工結束後,會藉由搬出設備40將研磨後的晶圓W從保持台2搬出。藉由保持台移動設備使保持台2在例如+Y方向上移動。接著,如圖3所示,搬出設備40會藉由旋繞機構44將搬出墊41連同旋繞臂43一起定位在保持台2的上方側,並且藉由升降機構42使搬出墊41在例如-Z方向下降,藉此來使搬出墊41的保持面410接觸於晶圓W。運作水供給源45,將水從圖2所示之水噴出口412呈放射狀地放水,而在保持面410與晶圓W之間形成水層,藉此就會在保持面410中,在非接觸的狀態下吸引保持晶圓W。
After the polishing process is completed, the polished wafer W is unloaded from the holding table 2 by the
如圖4所示,搬出設備40是藉由升降機構42使搬出墊41在例如+Z方向上升,並且藉由旋繞機構44使搬出墊41在水平方向上旋繞,而將搬出墊41定位在水槽51的上方側。在以搬出墊41將晶圓W搬出之時,晶圓W
的外周緣會接觸於圖2所示之橫向位移防止壁414,藉此限制晶圓W的活動。在水槽51中,預先存放有洗浄水9。
As shown in FIG. 4 , the
搬出設備40會將晶圓W載置在軌道53上,並使其浸沒至水槽51所存放的洗浄水9。當晶圓W浸沒至水槽51內時,可去除附著於晶圓W的研磨液等。又,片匣單元60會在重錘62從平台61所載置的第2片匣8上方壓住的狀態下,藉由升降設備65使第2片匣8在例如-Z方向下降,且如圖5所示,使第2片匣8浸沒至水槽51內所存放的洗淨水9,並且將規定的收容棚8a的位置定位在軌道53的延長線上。此時,第2片匣8會朝向水槽51的第2底部52b沈沒,但即使因浮力而使第2片匣8要浮上,也會藉由重錘62而防止第2片匣8的浮上。
The
接著,移動設備54會將壓出部541定位在晶圓W的外周緣的附近。移動設備54如圖6所示,一邊以壓出部541壓住晶圓W的外周緣,一邊使晶圓W沿著軌道53在例如+Y方向上進行水中移動,藉此使晶圓W進入第2片匣8內,並且收納至收容棚8a。所收納的晶圓W在移交至接下來的步驟之前都會維持浸沒至水槽51內的狀態,因此可以防止晶圓W乾燥。因此,也不會有已附著於晶圓W的研磨液乾掉而變得難以去除的問題。像這樣,當一片晶圓W的收納動作結束後,如圖7所示,藉由升降設備65使第2片匣8進一步在-Z方向下降,而將接下來的收容棚8a的位置定位在軌道53的延長線上,重複進行上述之研磨後的晶圓W的搬出動作與晶圓W的收納動作,而將晶圓W
棚架狀地收納至第2片匣8的各收容棚8a。
Next, the moving
接著,針對判斷平台61所載置的第2片匣8的片匣尺寸是否適當的情況來進行說明。在本實施形態中,是構成為:與片匣尺寸對應的電壓值是設定在辨識部70。又,構成為:平台61所應載置的第2片匣8的片匣尺寸是作為例如8吋用的尺寸而設定在判斷設備80。
Next, the case of judging whether or not the cassette size of the
如圖8所示,棚架狀地收容複數個晶圓W的第2片匣8浸沒至水槽51內之後,辨識部70會以支臂63的角度來對重錘62的高度位置進行辨識,進而對第2片匣8的片匣尺寸進行辨識。具體而言,藉由光投射部71朝向支臂63投射檢測光,並且用光接受部72接受在支臂63的側面所反射的反射光後,會以光電轉換部將光接受量轉換成電壓值,並依據該電壓值來對第2片匣8的片匣尺寸進行辨識。在此,光接受部72所接受的光接受量會根據支臂63的角度而變化。也就是,若支臂63的角度大,則藉由支臂63遮蔽反射光的範圍會變小,光接受量會變少。另一方面,若支臂63的角度小,則藉由支臂63遮蔽反射光的範圍會變大,光接受量會變多。
As shown in FIG. 8 , after the
例如,如圖8的局部擴大圖所示,在支臂63的角度θ 1大的情況下,光接受部72所接受的光接受量會變少,因此接觸於第2片匣8的上表面之重錘62的高度變高,而可以確認第2片匣8的上表面高度位置是高的。也就是,辨識部70會以光電轉換部將光接受部72所接受的光接受量轉換成電壓值,並從所轉換的電壓值來辨識是大
片匣尺寸(例如8吋用)的第2片匣8。然後,在圖1所示之判斷設備80中,會依據辨識部70所辨識的資訊,判斷在平台61上載置有片匣尺寸適當的第2片匣8。
For example, as shown in the partially enlarged view of FIG. 8 , when the
另一方面,如圖9所示,浸沒至水槽51內的是第2片匣8’,且如局部擴大圖所示,在支臂63的角度θ 2小的情況下,光接受部72所接受的光接受量會變多,因此接觸於第2片匣8’的上表面之重錘62的高度變低,而可以確認第2片匣8’的上表面高度位置是低的。也就是,辨識部70會以光電轉換部將光接受部72所接受的光接受量轉換成電壓值,並從所轉換的電壓值來辨識是小片匣尺寸(例如6吋用)的第2片匣8’。在圖1所示之判斷設備80中,會依據辨識部70所辨識的資訊,判斷在平台61上載置有片匣尺寸不適當的第2片匣8’。在此情況下,只要藉由升降設備65使平台61上升,將第2片匣8’從平台61取出,並將適當的第2片匣8載置於平台61即可。
On the other hand, as shown in FIG. 9 , the
像這樣,本發明之研磨裝置1具備將晶圓W收納至第2片匣8的收納設備50,收納設備50具備:水槽51;片匣單元60,使第2片匣8浸沒至水槽51內;軌道53,朝向浸沒至水槽51內的第2片匣8延伸;及移動設備54,使由搬出設備40所加以浸沒至軌道53上的晶圓W沿著軌道53的延伸方向進行水中移動,並且收納至第2片匣8,又,片匣單元60具備:平台61,可載置第2片匣8;重錘62,從上壓住第2片匣8;及升降設備65,在以重錘62壓住平台61所載置的第2片匣8的狀態下使平台61升降,
而使第2片匣8浸沒,因此,藉由以重錘62將浸沒至水槽51內的第2片匣8上方壓住,可以防止第2片匣8朝向洗浄水9的水面浮上。藉此,變得可以利用樹脂製並且低價製造的第2片匣8。又,依據本發明,辨識部70能以支臂63的角度來對重錘62的高度進行辨識,進而對第2片匣8的片匣尺寸進行辨識,因此可以容易地將片匣尺寸對加工前所辨識之晶圓W的尺寸而言並不適當的第2片匣8進行辨識。
As described above, the polishing
作為對片匣尺寸進行辨識的設備,並不限定上述之辨識部70之構成的設備,例如,如圖10所示,也可以是辨識部90,該辨識部90是以重錘62壓住第2片匣8時之重錘62的高度位置來對第2片匣8的片匣尺寸進行辨識。辨識部90例如為光學式的位置感測器,具備有光投射部及光接受部。又,圖10之例中的片匣單元60A具備可載置第2片匣8的平台61A,且其他構成都與上述片匣單元60相同,因此附上共通的符號。
As a device for recognizing the size of the cassette, it is not limited to the device of the above-mentioned configuration of the
平台61A的一端連結有在Z軸方向上延伸的連結部68,且在連結部68配設有導部69。重錘62是配設於在水平方向上延伸的支臂63A的一端,且在支臂63A的另一端配設有支臂支撐部630。此支臂支撐部630可以使支臂63A在水平的狀態下沿著導部69在上下方向移動。在導部69中,於軸方向上配置有複數個辨識部90。藉由辨識部90被支臂支撐部630遮蔽,可以特定出支臂63A的軸方向的位置,並且依據該位置來檢測重錘62的高度,進
而對第2片匣8的片匣尺寸進行辨識。在辨識部90連接有判斷設備(不圖示),該判斷設備是判斷辨識部90所辨識之第2片匣8的片匣尺寸是否適當。
A connecting
例如,如圖10的局部擴大圖所示,支臂支撐部630在導部69中是在高的位置停止時,接觸於第2片匣8的上表面之重錘62的高度位置變高,而可以確認第2片匣8的上表面高度位置是高的。也就是,辨識部90會從該重錘62的高度位置來辨識是大片匣尺寸(例如8吋用)的第2片匣8。在平台61A所應載置的第2片匣8的片匣尺寸為例如8吋用的情況下,在判斷設備中,會依據辨識部90所辨識的資訊,判斷在平台61A上載置有片匣尺寸適當的第2片匣8。
For example, as shown in the partially enlarged view of FIG. 10 , when the
另一方面,如圖11的局部擴大圖所示,支臂支撐部630在導部69中是在低的位置停止時,接觸於第2片匣8’的上表面之重錘62的高度位置變低,而可以確認第2片匣8’的上表面高度位置是低的。也就是,辨識部90會從該重錘62的高度位置來辨識是小片匣尺寸(例如6吋用)的第2片匣8’。在判斷設備中,會依據辨識部90所辨識的資訊,判斷在平台61A上載置有片匣尺寸不適當的第2片匣8’。在此情況下,只要藉由升降設備65使平台61A上升,將第2片匣8’從平台61取出,並將適當的第2片匣8載置於平台61A即可。像這樣,依據辨識部90,能夠以重錘62壓住第2片匣8時之重錘62的高度位置來對第2片匣8的片匣尺寸進行辨識,並且可以容易地對片匣尺寸不適當
的第2片匣8進行辨識。
On the other hand, as shown in the partially enlarged view of FIG. 11 , when the
1‧‧‧研磨裝置 1‧‧‧grinding device
2‧‧‧保持台 2‧‧‧Keeping Table
2a‧‧‧保持面 2a‧‧‧Maintaining surface
3‧‧‧外罩 3‧‧‧Cover
4‧‧‧平台 4‧‧‧Platform
5‧‧‧第1片匣 5‧‧‧1st cassette
6‧‧‧搬送設備 6‧‧‧Conveying equipment
7‧‧‧暫時放置台 7‧‧‧Temporary storage table
8‧‧‧第2片匣 8‧‧‧Second film cassette
10‧‧‧研磨設備 10‧‧‧grinding equipment
11‧‧‧主軸 11‧‧‧Spindle
12‧‧‧主軸殼體 12‧‧‧Spindle housing
13‧‧‧托座 13‧‧‧Receptacle
14、22、544、651‧‧‧馬達 14, 22, 544, 651‧‧‧motor
15‧‧‧安裝座 15‧‧‧Mount
16‧‧‧研磨墊 16‧‧‧Polishing pads
17‧‧‧圓板 17‧‧‧Circular plate
18‧‧‧研磨構件 18‧‧‧Abrasive components
19‧‧‧研磨液供給源 19‧‧‧Slurry supply source
20‧‧‧研磨進給設備 20‧‧‧grinding feeding equipment
21、543‧‧‧滾珠螺桿 21. 543‧‧‧ball screw
23、545‧‧‧導軌 23. 545‧‧‧rail
24‧‧‧升降板 24‧‧‧Lifting plate
30‧‧‧搬入設備 30‧‧‧Incoming equipment
31‧‧‧搬入墊 31‧‧‧Move-in pad
32、43‧‧‧旋繞臂 32, 43‧‧‧Swivel arm
33‧‧‧移動機構 33‧‧‧Mobile Mechanism
40‧‧‧搬出設備 40‧‧‧Remove equipment
41‧‧‧搬出墊 41‧‧‧Carry out mat
42‧‧‧升降機構 42‧‧‧Lifting mechanism
44‧‧‧旋繞機構 44‧‧‧winding mechanism
45‧‧‧水供給源 45‧‧‧Water supply source
50‧‧‧收納設備 50‧‧‧Storage equipment
51‧‧‧水槽 51‧‧‧Sink
53‧‧‧軌道 53‧‧‧Track
54‧‧‧移動設備 54‧‧‧Mobile Devices
60‧‧‧片匣單元 60‧‧‧cassette unit
61‧‧‧平台 61‧‧‧Platform
62‧‧‧重錘 62‧‧‧ Hammer
63、540‧‧‧支臂 63. 540‧‧‧arm
64‧‧‧支點部 64‧‧‧Fulcrum Department
65‧‧‧升降設備 65‧‧‧Lifting equipment
67‧‧‧位置決定塊 67‧‧‧Location decision block
70‧‧‧辨識部 70‧‧‧Identification Department
80‧‧‧判斷設備 80‧‧‧Judgment Equipment
100‧‧‧裝置基座 100‧‧‧Unit base
101‧‧‧柱部 101‧‧‧Column
102‧‧‧平板 102‧‧‧Tablet
103‧‧‧支撐板 103‧‧‧Support plate
330‧‧‧軸構件 330‧‧‧Shaft member
420‧‧‧汽缸 420‧‧‧Cylinder
421‧‧‧活塞桿 421‧‧‧Piston rod
440‧‧‧旋轉軸 440‧‧‧Rotary axis
541‧‧‧壓出部 541‧‧‧Extrusion
542‧‧‧升降機構 542‧‧‧Lifting mechanism
546‧‧‧移動部 546‧‧‧Mobile Department
W‧‧‧晶圓 W‧‧‧Wafer
+X、-X、+Y、-Y、+Z、-Z‧‧‧方向 +X, -X, +Y, -Y, +Z, -Z‧‧‧ directions
Claims (2)
Applications Claiming Priority (2)
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JP2017170162A JP6920141B2 (en) | 2017-09-05 | 2017-09-05 | Polishing equipment |
JP2017-170162 | 2017-09-05 |
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TW201913796A TW201913796A (en) | 2019-04-01 |
TWI754087B true TWI754087B (en) | 2022-02-01 |
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TW107126614A TWI754087B (en) | 2017-09-05 | 2018-08-01 | Grinding device |
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JP (1) | JP6920141B2 (en) |
KR (1) | KR102528131B1 (en) |
CN (1) | CN109420972B (en) |
TW (1) | TWI754087B (en) |
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CN110625519B (en) * | 2019-08-26 | 2021-08-03 | 苏州冠博控制科技有限公司 | High-precision wafer grinding machine |
CN113130360B (en) * | 2021-04-15 | 2024-05-07 | 杭州众硅电子科技有限公司 | Chemical mechanical polishing equipment, wafer caching device and wafer caching method thereof |
CN117718842B (en) * | 2024-01-10 | 2024-07-09 | 苏州市职业大学 | Method and device for preparing aspheric optical element |
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JPH06326067A (en) * | 1993-03-18 | 1994-11-25 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
JPH07226432A (en) * | 1994-02-09 | 1995-08-22 | Rap Master S F T Kk | Submerged accommodation of semiconductor wafer |
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JP2017092397A (en) * | 2015-11-16 | 2017-05-25 | 株式会社東京精密 | Wafer transfer apparatus |
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JPH05243199A (en) * | 1992-02-28 | 1993-09-21 | Shibayama Kikai Kk | Semiconductor wafer housing mechanism and method |
JPH07240456A (en) * | 1994-02-28 | 1995-09-12 | Kyushu Komatsu Denshi Kk | Wafer carrier securing apparatus |
JPH11163081A (en) * | 1997-11-28 | 1999-06-18 | Dainippon Screen Mfg Co Ltd | Cassette mounting stage |
JP4037511B2 (en) * | 1998-03-26 | 2008-01-23 | 不二越機械工業株式会社 | Wafer polishing apparatus and system |
JP2003203887A (en) * | 2002-01-10 | 2003-07-18 | Disco Abrasive Syst Ltd | Cutter |
JP2004022804A (en) | 2002-06-17 | 2004-01-22 | Disco Abrasive Syst Ltd | Polishing device |
JP6622610B2 (en) * | 2016-02-09 | 2019-12-18 | 株式会社ディスコ | Grinding equipment |
CN206179833U (en) * | 2016-10-28 | 2017-05-17 | 北京南轩兴达电子科技有限公司 | Automatic silicon wafer cleaning machine |
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- 2017-09-05 JP JP2017170162A patent/JP6920141B2/en active Active
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2018
- 2018-08-01 TW TW107126614A patent/TWI754087B/en active
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JPH06326067A (en) * | 1993-03-18 | 1994-11-25 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
JPH07226432A (en) * | 1994-02-09 | 1995-08-22 | Rap Master S F T Kk | Submerged accommodation of semiconductor wafer |
EP1263022B1 (en) * | 2001-05-31 | 2007-04-25 | S.E.S. Company Limited | Substrate cleaning system |
JP2006066447A (en) * | 2004-08-24 | 2006-03-09 | Komatsu Electronic Metals Co Ltd | Work chuck cleaning apparatus, work chuck cleaning method, and polishing equipment equipped with the work chuck cleaning apparatus |
JP2017092397A (en) * | 2015-11-16 | 2017-05-25 | 株式会社東京精密 | Wafer transfer apparatus |
Also Published As
Publication number | Publication date |
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KR20190026591A (en) | 2019-03-13 |
KR102528131B1 (en) | 2023-05-02 |
JP2019042888A (en) | 2019-03-22 |
CN109420972B (en) | 2022-01-18 |
CN109420972A (en) | 2019-03-05 |
JP6920141B2 (en) | 2021-08-18 |
TW201913796A (en) | 2019-04-01 |
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