TWI754087B - Grinding device - Google Patents

Abstract

[Subject] To prevent the film cassette from floating to the surface, and to be able to identify the size of the film cassette. [Solution] The polishing apparatus includes a storage device for storing the wafer in the second cassette, and the storage device includes: a cassette unit for immersing the second cassette in a water tank; and a moving device for moving the wafer into the water along the rail. It is moved and stored in the second cassette, and the cassette unit is provided with: a weight for pressing the second cassette from above; and a lifting device for pressing the weight on the second cassette placed on the platform The 2nd film cassette is submerged downwards, therefore, by pressing the top of the 2nd film cassette immersed in the water tank with a heavy hammer, the 2nd film cassette can be prevented from floating to the surface. Moreover, according to this invention, the 2nd cassette of an inappropriate size of a cassette can be recognized easily by an identification part.

Description

Grinding device

Field of Invention

The present invention relates to a polishing apparatus for polishing a wafer with a polishing pad.

Background of the Invention

A polishing apparatus that polishes a workpiece such as a wafer by a chemical mechanical polishing method called CMP (Chemical Mechanical Polishing), for example, a polishing pad is brought into contact with the wafer, while the wafer is The polishing process of the wafer is performed while supplying a polishing liquid (for example, refer to the following Patent Document 1). In such a CMP polishing process, when the polishing liquid adheres to the wafer, it may not be removed even by cleaning. The reason for this is that if the polishing liquid dries while adhering to the wafer, traces of water droplets or traces of polishing liquid remain on the wafer.

As a countermeasure against the above-mentioned problem, after the polishing of the wafer, the wafer is stored in the cassette while maintaining a wet state, and thereafter, the wafer accommodated in the cassette is washed with a chemical solution. That is, it is sufficient to keep the wafer in the immersed state after the polishing process. In particular, when the wafer is composed of lithium tantalate, lithium niobate, etc., it becomes difficult to remove the polishing liquid from the wafer. Therefore, there is a polishing apparatus that dips the cassette after polishing. In addition, the water transfer in which the wafer is accommodated in the cassette is carried out in water (for example, refer to the following Patent Document 2).

prior art literature Patent Literature

Patent Document 1: Japanese Patent Laid-Open No. 2004-22804

Patent Document 2: Japanese Patent Laid-Open No. 11-277423

Summary of Invention

The film cassette as described above must be chemically resistant in the subsequent cleaning step, so it is formed of resin. Although there are resins immersed in water, they are usually made of polyethylene resins because they are difficult to mold or become heavy. Therefore, even if the film cassette is submerged in the water in the water tank, there is a problem that it still floats. In addition, a film cassette having an inappropriate size may be mistakenly supplied to the polishing apparatus, and there may be a problem that the film cassette immersed in the water tank cannot be recognized.

The present invention has been made in view of the above-mentioned matters, and an object thereof is to prevent the film cassette from rising to the surface, and to allow the cassette size of the film cassette to be recognized.

The present invention relates to a polishing apparatus comprising: a first cassette for accommodating wafers in a shelf shape; a holding table for holding the wafers; a carrying device for carrying the wafers from the first cassette into the holding table; and a polishing device for the holding station The held wafers are polished; the unloading equipment carries out the wafers from the holding table; the second cassette stores the wafers carried out by the unloading equipment in a shelf; and the storage equipment carries out the unloading equipment. The wafers are accommodated in the second cassette, and the unloading equipment includes a carry-out pad having a holding surface for holding the wafer, and water is radially discharged from the center of the holding surface, and the holding surface is connected to the wafer. A water layer is formed between the circles to hold the wafer, and the storage device includes: a water tank; a cassette unit capable of placing the second cassette and immersing the second cassette in the water tank; The second cassette in the water tank is extended; and a moving device makes the wafers immersed on the rail by the unloading equipment move in water along the extending direction of the rail, and are stored in the second cassette, the The cassette unit includes: a platform on which the second cassette can be placed; a weight for pressing the second cassette from above; and a lifting device for pressing the second cassette on the platform with the weight. The platform is raised and lowered in the state of the cassette, so that the second film cassette is immersed, and the grinding device is provided with an identification portion, and the identification portion is the height position of the weight when the weight is pressed against the second cassette. to identify the cassette size of the second cassette.

The weight is arranged at one end of the support arm, and the support arm is revolved by taking the other end as a fulcrum, so that the weight is close to and away from the top of the second film cassette placed on the platform. The above identification The part can identify the height of the weight by the angle of the support arm, and then identify the cassette size of the second cassette.

The polishing apparatus of the present invention includes: a first cassette for storing wafers in a shelf; a holding table for holding wafers; The first cassette is loaded into the holding table; the polishing equipment is used to polish the wafers held by the holding table; the unloading equipment is used to carry out the wafers from the holding table; the second cassette is used to store the wafers carried out by the unloading equipment in a shelf shape; and storage equipment for storing the wafers carried out by the unloading equipment into the second cassette, and the storage equipment includes: a water tank; a cassette unit for immersing the second cassette in the water tank; The two cassettes are extended; and the moving device makes the wafers immersed on the rail by the unloading equipment move underwater along the extending direction of the rail, and are stored in the second cassette, and the cassette unit is provided with: a platform, which can be A second film cassette is placed; a weight is used to press the second film cassette from above; Since the cassette is submerged, the second cassette can be prevented from floating toward the water surface by pressing the top of the 2 cassette immersed in the water tank with a heavy hammer. Thereby, a resin-made second film cassette can be used at low cost. In addition, the polishing apparatus of the present invention is provided with an identification portion that identifies the cassette size of the second cassette by the height of the weight when the weight is pressed against the second cassette, so that the cassette can be easily identified. An improperly sized 2nd cassette is identified.

The weight is arranged at one end of the support arm, and the support arm is revolved by taking the other end as a fulcrum, so that the weight is close to and away from the top of the second film cassette placed on the platform, and the identification portion can be used. The height of the weight is identified by the angle of the support arm, and further, the size of the second cassette is identified. Therefore, the same as the above, the second cassette with an inappropriate size can be easily identified.

1: Grinding device

2: Holding table

2a, 410: Keep Face

3: cover

4: Platform

5: 1st film cassette

6: Handling equipment

7: Temporary placement table

8, 8': 2nd cassette

8a: Containment Shed

9: Water

10: Grinding equipment

11: Spindle

12: Spindle housing

13: Bracket

14, 22, 544, 651: Motor

15: Mounting seat

16: Polishing pad

17: Round plate

18: Grinding components

19: Grinding fluid supply source

20: Grinding feed equipment

21, 543, 650: ball screw

23, 545: rail

24: Lifting plate

30: Move in equipment

31: Move In Pad

32, 43: Convoluted Arm

33: Moving Mechanisms

40: Move out the equipment

41: Move Out Pad

42: Lifting mechanism

44: Winding mechanism

45: Water supply source

50: Storage equipment

51: Sink

52a: Bottom 1

52b: 2nd bottom

53: Orbit

54: Mobile Devices

60, 60A: cassette unit

61, 61A: Platform

62: Hammer

63, 63A, 540: Arm

64: Pivot Department

65: Lifting equipment

66, 68: Links

67: Position decision block

69: Guide

70, 90: Identification Department

71: Light Projection Department

72: Light Receiving Department

80: Judging equipment

100: Device base

101: Column

102: Tablet

103: Support plate

330: Shaft member

411: Central Department

412: Water spout

413: Ditch

413a: Bevel

414: Lateral displacement preventing wall

420: Cylinder

421: Piston Rod

440: Rotary axis

541: Press out part

542: Lifting mechanism

546: Mobile Ministry

630: Arm support

652: Lifting Department

W: Wafer

θ 1, θ 2: Angle

+X, -X, +Y, -Y, +Z, -Z: Direction

FIG. 1 is a perspective view showing the structure of a polishing apparatus.

FIG. 2 is a perspective view showing the structure of a carry-out pad.

3 is a cross-sectional view showing a state in which the polished wafer is carried out by the carry-out pad.

4 is a cross-sectional view showing a state in which the wafer and the second cassette are immersed in a water tank.

5 is a cross-sectional view showing a state in which the wafer is moved toward the second cassette by the moving device.

6 is a cross-sectional view showing a state in which the wafer is accommodated in the second cassette.

7 is a cross-sectional view showing a state in which the second cassette in which the wafers are accommodated is lowered.

8 is a cross-sectional view showing a state in which the recognition unit recognizes the height of the weight by the angle of the arm, and further recognizes the cassette size (large cassette size) of the second cassette.

9 is a cross-sectional view showing a state in which the recognition unit recognizes the height of the weight by the angle of the arm, and further recognizes the cassette size (small cassette size) of the second cassette.

10 is a cross-sectional view showing a state in which the recognition unit recognizes the height of the weight by the position of the arm, and further recognizes the cassette size (large cassette size) of the second cassette.

11 is a cross-sectional view showing a state in which the recognition unit recognizes the height of the weight by the position of the arm, and further recognizes the cassette size (small cassette size) of the second cassette.

Form for carrying out the invention

The polishing apparatus 1 shown in FIG. 1 is an example of a polishing apparatus for polishing the wafer W by CMP. The grinding|polishing apparatus 1 has the apparatus base 100 extended in the Y-axis direction, and the stage 4 is arrange|positioned at the edge part of the +Y direction side of the apparatus base 100. As shown in FIG. On the stage 4, the first cassette 5 that accommodates the wafers W before polishing can be mounted in a shelf shape. A transfer device 6 for transferring the wafer W to a desired position is provided at a position facing the first cassette 5 , and a temporary placement stage 7 for temporarily placing the wafer W is provided in the movable range of the transfer device 6 . The first cassette 5 is formed of resin such as polyethylene, for example. The size of the first cassette 5 is not particularly limited, but has a cassette size corresponding to the size of the wafers W, and can accommodate, for example, wafers W of 4 inches, 6 inches, or 8 inches. The stage 4 is provided with a sensor that recognizes the size of the wafer W before processing based on the size or shape of the first cassette 5 placed thereon. In addition, the size identification of the wafer W before processing may be performed on the temporary stage 7 . That is, the size of the wafer W is recognized by detecting the wafer W placed on the temporary placement table 7 with a sensor or the like. In this case, the size of the wafer W may be set in the processing data already set in the polishing processing conditions. In this way, in the polishing apparatus 1, the size of the wafer W before processing is recognized.

The device base 100 is provided with a holding table 2 that holds the wafer W. The upper surface of the holding table 2 serves as a holding surface 2a for sucking and holding the wafer W, and a suction source (not shown) is connected to the holding surface 2a. The periphery of the holding table 2 is covered with a cover 3 , and a holding table moving device for moving the holding table 2 in the Y-axis direction is connected below the holding table 2 . A carry-in device 30 is provided near the temporary placement table 7 , and the carry-in device 30 sends the first cassette 5 from the first cassette 5 . The wafer W that was carried out and temporarily placed on the temporary placing table 7 is carried into the holding table 2 .

The loading equipment 30 includes: a loading pad 31 that holds the wafer W; a winding arm 32 that supports the loading pad 31 horizontally; The moving mechanism 33 includes at least a shaft member 330 connected to the revolving arm 32 and a motor (not shown) connected to the shaft member 330 . When the shaft member 330 is raised and lowered in the Z-axis direction, the carry-in pad 31 can be raised and lowered in the Z-axis direction together with the winding arm 32 . Moreover, when the shaft member 330 is rotated, the winding arm 32 is wound in the horizontal direction, and the carrying-in pad 31 can be wound in the horizontal direction.

A column portion 101 is erected at the rear portion of the device base 100 on the -Y direction side. In front of the column portion 101 , there are provided a polishing apparatus 10 for polishing the wafer W held by the holding table 2 , and a polishing feeding apparatus 20 for moving the polishing apparatus 10 on the wafer W held by the holding table 2 . Grinding feed is performed in the approaching and distant directions (Z-axis direction).

The grinding device 10 is provided with: a main shaft 11 having an axis in the Z-axis direction; a main shaft housing 12 , which surrounds and supports the main shaft 11 to be rotatable; a bracket 13 holds the main shaft housing 12 ; a motor 14 is connected to one end of the main shaft 11 ; And the polishing pad 16 is detachably installed on the lower end of the main shaft 11 through the mounting seat 15 . The polishing pad 16 is constituted by a disc 17 and a polishing member 18 fixed to the disc 17 . By rotating the main shaft 11 by the motor 14, the polishing pad 16 can be rotated at a predetermined rotational speed. The abrasive member 18 is formed of, for example, urethane or non-woven fabric. A polishing liquid supply source 19 is connected to the polishing apparatus 10 , and the polishing liquid supply source 19 supplies the polishing liquid between the polishing member 18 and the wafer W held by the holding table 2 .

The grinding and feeding device 20 includes: a ball screw 21 extending in the Z-axis direction; a motor 22 connected to one end of the ball screw 21; a pair of guide rails 23 extending parallel to the ball screw 21; in the grinding device 10. A pair of guide rails 23 are slidably joined to the other surface of the lift plate 24 , and a ball screw 21 is screwed into a nut formed in the center of the lift plate 24 . By driving the ball screw 21 by the motor 22 , the grinding apparatus 10 together with the lift plate 24 can be ground and fed in the Z-axis direction along the pair of guide rails 23 .

On the side (+X direction side in the illustrated example) of the holding table 2 , a carry-out device 40 is provided, and the carry-out device 40 carries out the polished wafer W from the holding table 2 . The unloading equipment 40 includes: a carrying-out pad 41 for holding the wafer W; a lift mechanism 42 for raising and lowering the carry-out pad 41 in the Z-axis direction; a winding arm 43 connected to the lifting mechanism 42 at one end; and a winding mechanism 44 connected to the winding arm 43 the other end of the . The elevating mechanism 42 includes at least a cylinder 420 and a piston rod 421, and can elevate the delivery pad 41 in the Z-axis direction. The reeling mechanism 44 includes at least: a rotation shaft 440 for revolving the reeling arm 43 in the horizontal direction; and a motor connected to the revolving shaft 440, and when the rotation shaft 440 is rotated by the motor, the reeling arm 43 revolves in the horizontal direction , and the carry-out pad 41 can be rotated in the horizontal direction.

As shown in FIG. 2 , the unloading pad 41 has a holding surface 410 formed in a disk shape and holds the wafer W, and a plurality of (in In the example of the figure, there are three) water jetting ports 412 . The water supply source 45 shown in FIG. 1 is connected to each water jetting port 412 . A groove 413 is formed in the holding surface 410, and the groove 413 It is inclined so that the water jetted from the water jetting port 412 flows radially. The groove 413 has an inclined surface 413a that is inclined to descend from the outer peripheral side of the carry-out pad 41 toward the center side (the center portion 411 side). An annular lateral displacement preventing wall 414 is disposed on the outer peripheral portion of the holding surface 410 . In the unloading pad 41 configured in this way, water is discharged radially from the water jetting ports 412 along the grooves 413, thereby forming a water layer between the holding surface 410 and the wafer W, and it is possible to use the Bernoult. According to Leigh's law, the wafer W is attracted and held in a non-contact state.

The apparatus base 100 shown in FIG. 1 includes: a second cassette 8 that accommodates the wafers W unloaded by the unloading equipment 40 in a shelf-like manner; and a storage equipment 50 that accommodates the wafers W unloaded by the unloading equipment 40 2nd film cassette 8. As shown in FIG. 3 , the second cassette 8 has a plurality of storage chambers 8a, and these storage chambers 8a are formed by providing predetermined intervals in the vertical direction. The second cassette 8 is formed so that the wafers W can be accommodated in the accommodating bay 8a in a horizontal state. Like the first cassette 5, the second cassette 8 is formed of resin such as polyethylene, for example. Also, the size of the second cassette 8 is not particularly limited, but has a cassette size corresponding to the size of the wafers W, and can accommodate, for example, wafers W of 4 inches, 6 inches, or 8 inches.

The storage device 50 includes: a water tank 51 ; a cassette unit 60 capable of placing the second cassette 8 in the water tank 51 and immersing the second cassette 8 in the water tank 51 ; extension; and the moving device 54 , so that the wafer W immersed on the rail 53 by the unloading device 40 is moved underwater in the extending direction of the rail 53 and stored in the second cassette 8 . The water tank 51 has: the first bottom part 52a on which the rails 53 are laid; and the second The bottom portion 52b is deeper than the first bottom portion 52a. When the polished wafer W is accommodated in the second cassette 8 , it is performed in a state in which the washing water 9 is stored in the water tank 51 . The washing water 9 is not particularly limited, and for example, a chemical solution or pure water can be used. The first bottom portion 52 a only needs to have a depth that allows the wafer W to be immersed on the rail 53 . Moreover, the 2nd bottom part 52b should just have about the depth which can immerse the 2nd film cassette 8.

On the end of the device base 100 on the +X direction side, a flat plate 102 extending in the Y-axis direction is abutted against, and the mobile device 54 is disposed on the flat plate 102 . The mobile device 54 includes a support arm 540; a pressing part 541 connected from one end of the support arm 540 through a lifting mechanism 542; a ball screw 543 extending along the flat plate 102; a motor 544 connected to one end of the ball screw 543; a pair of guide rails 545 , which extends parallel to the ball screw 543 ; and a moving part 546 , which is connected to the other end of the support arm 540 and moves along the guide rail 545 in the Y-axis direction. The elevating mechanism 542 is constituted by a cylinder and a piston rod, and can elevate the extrusion part 541 in the Z-axis direction. A pair of guide rails 545 are slidably engaged with the side portions of the moving portion 546 , and a ball screw 543 is screwed into a nut formed in the center of the moving portion 546 . By driving the ball screw 543 by the motor 544 , the extrusion part 541 together with the moving part 546 can be moved in the Y-axis direction along the pair of guide rails 545 .

A support plate 103 for supporting the cassette unit 60 is arranged on the side of the water tank 51 . The cassette unit 60 includes: a platform 61 on which the second cassette 8 can be placed; a weight 62 for pressing the second cassette 8 from above; The platform 61 is moved up and down in the state of the second film cassette 8, and the second film cassette 8 is submerged. The connection shown in FIG. 3 is connected to the platform 61 The knot portion 66, the connection portion 66 extends from one end of the platform 61 in the Z-axis direction. Moreover, on the platform 61, corresponding to the external shape of the second cassette 8, a plurality of (for example, two) position determination blocks 67 are arranged at the corner positions of the second cassette 8. As shown in FIG. The position determination block 67 is, for example, a block having a substantially L-shaped cross section. By making the corners of the second cassette 8 abut on the inner surface of the position determination block 67 , the second cassette 8 can be positioned at an appropriate position on the platform 61 .

As shown in FIG. 3 , the weight 62 is disposed at one end of the support arm 63 , and a fulcrum portion 64 having a horizontal axis is disposed at the other end of the support arm 63 . The fulcrum portion 64 is fixed to the upper end of the connection portion 66 of the platform 61 . The support arm 63 is revolved around the fulcrum portion 64 so that the weight 62 can approach and separate from the upper surface of the second cassette 8 placed on the stage 61 . The weight of the weight 62 is not particularly limited.

The elevating device 65 includes: a ball screw 650 extending in the Z-axis direction; a motor 651 connected to one end of the ball screw 650; The connecting portion 66 is connected to the elevating portion 652 , and a ball screw 650 is screwed to a nut formed in the center of the elevating portion 652 . By driving the ball screw 650 by the motor 651 , the second film cassette 8 can be raised and lowered together with the lifter 652 , and the second film cassette 8 can be immersed in the water tank 51 . Then, by pressing the upper surface of the second cassette 8 submerged in the water tank 51 with the weight 62 , the second cassette 8 can be prevented from floating toward the surface of the washing water 9 .

The polishing apparatus 1 shown in FIG. 1 is provided with an identification portion 70 , and the identification portion 70 identifies the cassette size of the second cassette 8 by the angle of the support arm 63 when the weight 62 presses the second cassette 8 . . A judgment is connected to the identification unit 70 When the cutting device 80 is disconnected, the judging device 80 will judge whether the size of the second cassette 8 identified by the identifying unit 70 is appropriate. As shown in the partially enlarged view of FIG. 3 , the recognition unit 70 is, for example, a reflective photo sensor, and is divided into a light projection unit 71 and a light reception unit 72 , and the light projection unit 71 projects toward the arm 63 . For measuring light, the light receiving portion 72 receives the reflected light reflected on the side surface of the arm 63 . In the identification unit 70 , the measurement light is projected from the light projection unit 71 to the arm 63 , the light receiving unit 72 receives the reflected light reflected on the side surface, and the reflected light is reflected by the photoelectric conversion unit (not shown). The received amount is converted into a voltage value, the height position of the weight 62 is detected, and the cassette size of the second cassette 8 can be recognized. Although the identification part 70 is constituted by a reflection type sensor, it can also be constituted such that, for example, an angle detection sensor is provided on the fulcrum part 64 to detect the angle of the support arm 63, so as to identify the height position of the weight 62, and further The cassette size of the second cassette 8 is identified.

Next, an operation example of the polishing apparatus 1 will be described. The wafer W is an example of a workpiece having a circular plate-shaped substrate, and is formed of, for example, lithium tantalate (LT) or lithium niobate (LN). First, the transfer facility 6 unloads the wafer W before polishing from the first cassette 5 and temporarily places it on the temporary placement table 7 . The carrying-in equipment 30 carries out the wafer W temporarily placed on the temporary placing table 7 using the carrying-in pad 31 , and carries the wafer W into the holding surface 2 a of the holding table 2 . After the wafer W is placed on the holding surface 2a of the holding table 2, the wafer W is sucked and held by the holding surface 2a by the attractive force of the suction source, and the holding table 2 is moved, for example, by a holding table moving device (not shown). By moving in the Y direction, the wafer W is moved below the polishing apparatus 10 . Then, the grinding device 10 is moved down together with the lifting plate 24 by the grinding feeding device 20 . drop.

The holding table 2 holding the wafer W rotates at a predetermined rotational speed. The polishing apparatus 10 rotates the polishing pad 16 at a predetermined rotational speed via the main shaft 11, and the polishing feeding apparatus 20 makes the polishing member 18 come into contact with the rotation while polishing and feeding the polishing pad 16 in the −Z direction, for example. the wafer W, the polishing member 18 is slid relative to the wafer W. At this time, the polishing liquid is supplied between the polishing member 18 and the wafer W from the polishing liquid supply source 19 . After the wafer W is polished by the polishing apparatus 10 for a predetermined time, the polishing apparatus 10 is raised by the polishing feeder 20 to complete the polishing process.

After the polishing process is completed, the polished wafer W is unloaded from the holding table 2 by the unloading device 40 . The holding table 2 is moved, for example, in the +Y direction by the holding table moving device. Next, as shown in FIG. 3 , the unloading device 40 positions the unloading pad 41 together with the winding arm 43 on the upper side of the holding table 2 by the winding mechanism 44 , and the lifting mechanism 42 makes the unloading pad 41 move in the −Z direction, for example. By descending, the holding surface 410 of the carry-out pad 41 is brought into contact with the wafer W. The water supply source 45 is operated to discharge the water radially from the water ejection port 412 shown in FIG. Wafer W is sucked and held in a non-contact state.

As shown in FIG. 4 , the unloading device 40 uses the elevating mechanism 42 to elevate the unloading pad 41 in the +Z direction, for example, and the winding mechanism 44 rotates the unloading pad 41 in the horizontal direction to position the unloading pad 41 on the water tank. 51 on the upper side. When the wafer W is unloaded by the unload pad 41, the wafer W is The outer periphery of the wafer W is in contact with the lateral displacement preventing wall 414 shown in FIG. 2 , thereby restricting the movement of the wafer W. In the water tank 51, the washing water 9 is stored in advance.

The unloading equipment 40 places the wafer W on the rails 53 and immerses the wafer W in the washing water 9 stored in the water tank 51 . When the wafer W is immersed in the water tank 51, the polishing liquid and the like adhering to the wafer W can be removed. In addition, in the state where the weight 62 is pressed from above the second film cassette 8 placed on the platform 61, the cassette unit 60 uses the lifting device 65 to lower the second cassette 8 in the -Z direction, for example, and as As shown in FIG. 5 , the second cassette 8 is immersed in the washing water 9 stored in the water tank 51 , and the position of the predetermined storage bay 8 a is positioned on the extension line of the rail 53 . At this time, the second film cassette 8 sinks toward the second bottom portion 52b of the water tank 51, but even if the second film cassette 8 tries to float up due to buoyancy, the weight 62 prevents the second film cassette 8 from floating up.

Next, the moving device 54 positions the extrusion portion 541 in the vicinity of the outer periphery of the wafer W. As shown in FIG. As shown in FIG. 6 , the moving device 54 moves the wafer W in the +Y direction along the rails 53 while pressing the outer peripheral edge of the wafer W with the pressing part 541 , thereby allowing the wafer W to enter. Inside the second cassette 8, it is accommodated in the accommodating shelf 8a. The accommodated wafers W are kept immersed in the water tank 51 until they are handed over to the next step, so that the wafers W can be prevented from drying. Therefore, there is no problem that the polishing liquid that has adhered to the wafer W dries and becomes difficult to remove. In this way, after the accommodating operation of one wafer W is completed, as shown in FIG. 7 , the second cassette 8 is further lowered in the −Z direction by the lifting and lowering device 65, and the position of the next accommodating bay 8a is positioned at On the extension line of the rail 53, the carrying out operation of the polished wafer W and the storage operation of the wafer W are repeated, and the wafer W is loaded Each storage bay 8a of the 2nd cassette 8 is accommodated in a shelf shape.

Next, the case of judging whether or not the cassette size of the second cassette 8 placed on the platform 61 is appropriate will be described. In this embodiment, it is comprised so that the voltage value corresponding to the cassette size is set in the identification part 70. Moreover, it is comprised so that the cassette size of the 2nd cassette 8 which should be mounted on the stage 61 is set in the judgment apparatus 80 as a dimension for 8 inches, for example.

As shown in FIG. 8 , after the second cassette 8 accommodating a plurality of wafers W in a shelf-like manner is immersed in the water tank 51 , the identification unit 70 identifies the height position of the weight 62 with the angle of the support arm 63 . Further, the cassette size of the second cassette 8 is identified. Specifically, the light projection part 71 projects the detection light toward the arm 63, and the light receiving part 72 receives the reflected light reflected on the side surface of the arm 63, and then the photoelectric conversion part converts the light received amount into a voltage value, and identify the cassette size of the second cassette 8 according to the voltage value. Here, the amount of light received by the light receiving portion 72 varies depending on the angle of the arm 63 . That is, when the angle of the support arm 63 is large, the range in which the reflected light is shielded by the support arm 63 is reduced, and the amount of light received is reduced. On the other hand, when the angle of the arm 63 is small, the range in which the reflected light is shielded by the arm 63 increases, and the light reception amount increases.

For example, as shown in the partially enlarged view of FIG. 8 , when the angle θ 1 of the arm 63 is large, the amount of light received by the light receiving portion 72 decreases, so that it contacts the upper surface of the second cassette 8 Since the height of the weight 62 becomes high, it can be confirmed that the height position of the upper surface of the second cassette 8 is high. That is, the identifying unit 70 converts the light receiving amount received by the light receiving unit 72 into a voltage value by using the photoelectric converting unit, and identifies whether it is a large value from the converted voltage value. The second cassette 8 for cassette size (eg for 8 inches). Then, in the judging device 80 shown in FIG. 1 , according to the information recognized by the recognition unit 70 , it is determined that a second cassette 8 with an appropriate size of the cassette is placed on the platform 61 .

On the other hand, as shown in FIG. 9 , the second cassette 8 ′ is immersed in the water tank 51 , and as shown in the partially enlarged view, when the angle θ 2 of the arm 63 is small, the light receiving portion 72 Since the amount of received light increases, the height of the weight 62 in contact with the upper surface of the second cassette 8' decreases, and it can be confirmed that the upper surface of the second cassette 8' has a low height position. That is, the identification part 70 converts the light reception amount received by the light receiving part 72 into a voltage value by the photoelectric conversion part, and recognizes the second film of the small cassette size (for example, for 6 inches) from the converted voltage value. Box 8'. In the determination apparatus 80 shown in FIG. 1, based on the information recognized by the recognition unit 70, it is determined that a second cassette 8' of an inappropriate size is placed on the platform 61. In this case, the platform 61 may be raised by the lifting device 65, the second cassette 8' may be taken out from the platform 61, and an appropriate second cassette 8 may be placed on the platform 61.

As described above, the polishing apparatus 1 of the present invention includes the storage facility 50 for storing the wafers W in the second cassette 8 . The storage facility 50 includes the water tank 51 and the cassette unit 60 for immersing the second cassette 8 in the water tank 51 . The track 53 extends toward the second cassette 8 immersed in the water tank 51; and the moving device 54 makes the wafer W immersed on the track 53 by the unloading device 40 to move in water along the extending direction of the track 53, It is accommodated in the second cassette 8, and the cassette unit 60 includes: a platform 61 on which the second cassette 8 can be placed; a weight 62 for pressing the second cassette 8 from above; The platform 61 is moved up and down in a state where the weight 62 presses the second cassette 8 placed on the platform 61, Since the second film cassette 8 is immersed, by pressing the weight 62 to the upper side of the second film cassette 8 immersed in the water tank 51 , the second film cassette 8 can be prevented from rising to the surface of the washing water 9 . Thereby, it becomes possible to utilize the 2nd film cassette 8 which is made of resin and manufactured at low cost. In addition, according to the present invention, the identification portion 70 can identify the height of the weight 62 by the angle of the support arm 63, and further identify the cassette size of the second cassette 8, so that the cassette size can be easily processed. The second cassette 8 which is not suitable for the size of the previously identified wafer W is identified.

As a device for recognizing the size of the cassette, it is not limited to the device of the above-mentioned configuration of the recognition part 70 . For example, as shown in FIG. 10 , the recognition part 90 may also be used. The height position of the weight 62 at the time of the 2-film cassette 8 is used to identify the cassette size of the second cassette 8 . The recognition unit 90 is, for example, an optical position sensor, and includes a light projection unit and a light reception unit. Moreover, since the cassette unit 60A in the example of FIG. 10 is provided with the platform 61A which can mount the 2nd cassette 8, and other structures are the same as that of the said cassette unit 60, the common code|symbol is attached.

A connecting portion 68 extending in the Z-axis direction is connected to one end of the platform 61A, and a guide portion 69 is arranged on the connecting portion 68 . The weight 62 is arranged at one end of the arm 63A extending in the horizontal direction, and the arm support portion 630 is arranged at the other end of the arm 63A. The arm support portion 630 can move the arm 63A in the vertical direction along the guide portion 69 in a horizontal state. In the guide portion 69, a plurality of identification portions 90 are arranged in the axial direction. By the identification part 90 being shielded by the arm support part 630, the position of the axial direction of the support arm 63A can be specified, and the height of the weight 62 can be detected according to the position, and the Then, the cassette size of the second cassette 8 is identified. A judging device (not shown) is connected to the recognition unit 90 , and the judging device is used for judging whether the size of the second cassette 8 recognized by the recognition unit 90 is appropriate.

For example, as shown in the partially enlarged view of FIG. 10 , when the arm support portion 630 stops at a high position in the guide portion 69, the height position of the weight 62 in contact with the upper surface of the second cassette 8 becomes high, On the other hand, it can be confirmed that the height position of the upper surface of the second cassette 8 is high. That is, the identification part 90 identifies the second cassette 8 with a large cassette size (for example, for 8 inches) from the height position of the weight 62 . In the case where the size of the second cassette 8 to be placed on the platform 61A is, for example, 8 inches, the judging device will determine that a cassette is placed on the platform 61A based on the information identified by the identifying unit 90 . Appropriately sized 2nd film cassette 8.

On the other hand, as shown in the partially enlarged view of FIG. 11 , when the arm support portion 630 is stopped at a low position in the guide portion 69 , it contacts the height position of the weight 62 on the upper surface of the second cassette 8 ′. becomes lower, and it can be confirmed that the height position of the upper surface of the second cassette 8' is low. That is, the identification part 90 identifies the second cassette 8' of the small cassette size (for example, for 6 inches) from the height position of the weight 62 . In the judging device, based on the information recognized by the recognition unit 90, it is determined that the second cassette 8' having an inappropriate size of the cassette is placed on the platform 61A. In this case, the platform 61A may be raised by the lifting device 65, the second cassette 8' may be taken out from the platform 61, and an appropriate second cassette 8 may be placed on the platform 61A. In this way, according to the identification section 90, the cassette size of the second cassette 8 can be identified by the height position of the weight 62 when the weight 62 presses the second cassette 8, and the cassette size can be easily identified. inappropriate The second film cassette 8 is identified.

1‧‧‧grinding device

2‧‧‧Keeping Table

2a‧‧‧Maintaining surface

3‧‧‧Cover

4‧‧‧Platform

5‧‧‧1st cassette

6‧‧‧Conveying equipment

7‧‧‧Temporary storage table

8‧‧‧Second film cassette

10‧‧‧grinding equipment

11‧‧‧Spindle

12‧‧‧Spindle housing

13‧‧‧Receptacle

14, 22, 544, 651‧‧‧motor

15‧‧‧Mount

16‧‧‧Polishing pads

17‧‧‧Circular plate

18‧‧‧Abrasive components

19‧‧‧Slurry supply source

20‧‧‧grinding feeding equipment

21. 543‧‧‧ball screw

23. 545‧‧‧rail

24‧‧‧Lifting plate

30‧‧‧Incoming equipment

31‧‧‧Move-in pad

32, 43‧‧‧Swivel arm

33‧‧‧Mobile Mechanism

40‧‧‧Remove equipment

41‧‧‧Carry out mat

42‧‧‧Lifting mechanism

44‧‧‧winding mechanism

45‧‧‧Water supply source

50‧‧‧Storage equipment

51‧‧‧Sink

53‧‧‧Track

54‧‧‧Mobile Devices

60‧‧‧cassette unit

61‧‧‧Platform

62‧‧‧ Hammer

63. 540‧‧‧arm

64‧‧‧Fulcrum Department

65‧‧‧Lifting equipment

67‧‧‧Location decision block

70‧‧‧Identification Department

80‧‧‧Judgment Equipment

100‧‧‧Unit base

101‧‧‧Column

102‧‧‧Tablet

103‧‧‧Support plate

330‧‧‧Shaft member

420‧‧‧Cylinder

421‧‧‧Piston rod

440‧‧‧Rotary axis

541‧‧‧Extrusion

542‧‧‧Lifting mechanism

546‧‧‧Mobile Department

W‧‧‧Wafer

+X, -X, +Y, -Y, +Z, -Z‧‧‧ directions

Claims (2)

A polishing apparatus comprising: a first cassette for accommodating wafers in a shelf shape; a holding table for holding the wafers; a carrying device for carrying the wafers from the first cassette into the holding table; a polishing device for holding the holding table The held wafers are polished; the unloading equipment, the wafers are unloaded from the holding table; the second cassette, the wafers unloaded by the unloading equipment are stored in a shelf; and the storage equipment, the wafers unloaded from the unloading equipment The wafer is accommodated in the second cassette, and the unloading device includes a carry-out pad having a holding surface for holding the wafer, and water is radially discharged from the center of the holding surface, and the holding surface is connected to the wafer. A water layer is formed between the circles to hold the wafers; The storage mechanism is provided with: a water tank; a cassette unit capable of placing the second cassette and immersing the second cassette in the water tank; the second cassette in the water tank is extended; and a moving device that makes the wafers immersed on the track by the unloading device move in water along the extending direction of the track, and are stored in the second cassette; the wafer The cassette unit is provided with: a platform on which the second film cassette can be placed; a weight for pressing the second film cassette from above; and a lifting device for pressing the weight on the second film cassette on the platform The platform is moved up and down in a state of being so that the second cassette is immersed. Furthermore, the grinding device is provided with an identification portion, and the identification portion is based on the height position of the weight when the weight is pressed against the second cassette. The cassette size of the second cassette is identified. The grinding device of claim 1, wherein the weight is disposed at one end of the support arm, and the support arm is revolved with the other end as a fulcrum, so that the weight is close to and away from the platform mounted on the platform Above the second film cassette, the identifying portion identifies the height of the weight by the angle of the support arm, and further identifies the cassette size of the second film cassette.

Images