CN109304665A - A kind of polishing handling parts module comprising moving handling module - Google Patents
A kind of polishing handling parts module comprising moving handling module Download PDFInfo
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- CN109304665A CN109304665A CN201811158609.6A CN201811158609A CN109304665A CN 109304665 A CN109304665 A CN 109304665A CN 201811158609 A CN201811158609 A CN 201811158609A CN 109304665 A CN109304665 A CN 109304665A
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- module
- polishing
- loading position
- handling
- platform
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- 238000005498 polishing Methods 0.000 title claims abstract description 98
- 235000012431 wafers Nutrition 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 230000000630 rising effect Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000007521 mechanical polishing technique Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004886 head movement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
Abstract
The polishing handling parts module comprising moving handling module that the invention discloses a kind of, include a handling module and two polishing modules, handling module is placed in the middle, two polishing modules are located at its two sides, there are two loading positions on the direction perpendicular with handling module and two polishing module orientations for the handling module, described two polishing modules are respectively corresponded, handling module can move back and forth between two loading positions.Handling module includes linear moving module, platform module, platform fixed block, the linear moving module is fixed on fixed frame, platform fixed block is fixed on the sliding shoe of linear moving module, and linear moving module can be such that platform module moves back and forth between two loading positions i.e. the first loading position and the second loading position.The present invention passes through the movement of platform module, eliminates after rubbing head is gone back to above corresponding polishing pad and is gone back to again to clean, can save transmission time, significantly improve efficiency.
Description
Technical field
The invention belongs to be ground or burnishing device technical field, and in particular to a kind of semiconductor integrated circuit chip manufactured
The polishing handling parts module of based CMP apparatus used in journey.
Background technique
Integrated circuit plays more and more very important effect in all trades and professions, is the foundation stone of advanced information society.
With the rapid development of semicon industry, integrated circuit feature size constantly tends to miniaturize, therefore semiconductor film film surface
Height planarization has important influence to the high-performance, low cost, high finished product rate of device.
Chemical-mechanical planarization (Chemical Mechanical Planarization, CMP) equipment is integrated circuit system
Make one of the seven big key equipments in field.Its principle is the overall balance using polishing fluid chemical etching and polishing pad mechanical friction
Effect, finely removes crystal column surface material.In integrated circuit fabrication, CMP is primarily used for the preceding road work of chip manufacturing
The planarization of skill, device isolation, device configuration, secondly chip manufacturing postchannel process metal interconnection also need using.Meanwhile
CMP is also crucial process means in integrated circuit 3 D encapsulation TSV technique.Exactly because having relatively various and crucial answer
With CMP has become standard technology and Core equipment in IC manufacturing.
Currently, chemical Mechanical Polishing Technique, which has developed into, collects the technologies such as online measuring, online end point determination, cleaning in one
The chemical Mechanical Polishing Technique of body is the product that integrated circuit develops to miniaturization, multiple stratification, slimming, flatening process.Together
When be also wafer from 200mm to 300mm or even larger diameter transition, improve that productivity, to reduce manufacturing cost, the substrate overall situation flat
Technology necessary to changing.
One typical based CMP apparatus generally includes multiple polishing units and cleaning, wafer transport, does
Dry equal auxiliary devices.Polishing unit generally includes workbench, polishing disk, rubbing head, polishing arm, trimmer, polishing fluid arm etc., throws
CD, rubbing head, polishing arm, trimmer, polishing fluid arm are arranged on the table according to technique Working position.Actual wafer adds
It is found during work, the space layout of the modules such as polishing unit and cleaning, wafer transport is whole for based CMP apparatus
The polishing output of body has significant effect.Wafer is usually relied in polishing unit and outside and the transmission between polishing unit
The device of platform or similar effect is realized.About the space layout of platform and polishing unit, some uses platform
The form that unit is square layout is polished with three.Since a platform needs to provide handling clothes to three polishing units
Business, therefore the shortcomings that this technology layout is complex technical process.Separately have using four polishing units are arranged side by side, wafer passes
The defeated loading place by being located at flattening device end and two linear transport establishments' completions along polishing unit orientation setting,
The other side of linear transport establishment is cleaning area.Each above-mentioned linear transport establishment provides service for two polishing units, and
Two transmission stations are set for each polishing unit, the rubbing head for polishing unit can be brilliant from one of transmission station handling
Circle.Although but the shortcomings that this layout is that two transmission stations are arranged in each polishing unit, polishing unit in polishing process
Wafer is directly loaded and unloaded from one of them, therefore from the angle analysis of wafer transfer efficiency room for improvement also in need.
Summary of the invention
Present invention aims at for wafer transfer low efficiency, conveyer present in existing based CMP apparatus
Structure proposes a kind of a kind of polishing dress comprising moving handling module of based CMP apparatus the problem of structure is complicated
Component models are unloaded, modularization is carried out by the way that part and polishing part will be loaded and unloaded, can simplify device structure, improve the manufacture of equipment
Efficiency reduces the space occupied of equipment.
To achieve the above object, the technical solution adopted by the present invention is a kind of polishing handling comprising moving handling module
Component models include a handling module and two polishing modules, and handling module is placed in the middle, and two polishing modules are located at its two sides,
There are two loading positions on the direction perpendicular with handling module and two polishing module orientations for the handling module, divide
Described two polishing modules are not corresponded to, and handling module can move back and forth between two loading positions.
Above-mentioned polishing module includes fixed platform, polishing pad, and rubbing head polishes shaft, and polishing pad is located in fixed platform,
Polishing shaft can drive rubbing head to rotate to loading position.
Above-mentioned handling module includes fixed frame, sink, linear moving module, platform module, platform fixed block, isolation
Cover, the sink and linear moving module are fixed on fixed frame, and platform fixed block is fixed on the sliding of linear moving module
On block, platform module is fixed on platform fixed block, and platform fixed block lower part is fixed with isolation cover and makes platform
Lower part is isolated with liquid, and linear moving module can make platform module in two loading positions i.e. the first loading position and second
Move back and forth between loading position.
First jet module and second nozzle module, first jet are respectively arranged on two loading positions of handling module
Module and second nozzle module are all fixed on fixed station.
First jet module and second nozzle module are separately positioned on the edge of the first loading position and the second loading position.
Platform module can raising and lowering in vertical direction, complete wafer transfer with rubbing head.
The present invention it is further proposed that it is a kind of using above-mentioned polishing handling parts module carry out wafer transfer method, specifically
It comprises the steps of:
S1: platform module stops at the first loading position, waits the corresponding carrying in the position that first stage throwing is completed
First rubbing head of the wafer of light；
After S2: the first rubbing head is transferred to the first loading position, the rising of platform module picks up wafer, and moves directly to
Second loading position；
S3: the first rubbing head is cleaned on the first loading position top, is moved to the platform mould of the second loading position
The wafer of block is drawn by the second rubbing head, starts the polishing of second stage, after the second rubbing head is transferred on the second polishing pad, machine
Tool hand loads upper new polished wafer；
S4: platform when corresponding first rubbing head cleaning is completed when the first loading position, on the second loading position
Module is moved to below the first rubbing head of the first loading position, and subsequent platform module rises, and the first loading position is corresponding
First rubbing head completion treat wafer polishing adsorb and be transferred to polishing area polish；
The platform module of S5: the first loading position is moved to the second loading position, at the same time the second loading position pair
The the second rubbing head movement answered is transferred to the second loading position top, and platform module rises, and second stage throwing is completed in absorption
The wafer of light, after absorption, platform module is moved to the first loading position by the second loading position；
Corresponding second rubbing head in S6: the second loading position is cleaned on the second loading position top, at the same time, machine
Tool hand takes the wafer that second stage polishing is completed in the platform module on the first loading position away, then waits the
The wafer for completing first stage polishing on one rubbing head；
After S7: the first rubbing head is transferred to the first loading position, the rising of platform module, which picks up, completes first stage polishing
Wafer, and move directly to the second loading position；
S8: repeating above step, until whole polishing wafers finish.
Compared with existing based CMP apparatus technology, the present invention has following advantageous effects:
1, the present invention carries out modularization by that will load and unload part and polishing part, is spliced into a polishing and loads and unloads whole mould
Block, this topological simplicity device structure, improves the manufacture efficiency of equipment, and reduce the space occupied of equipment.
2, by the movement of platform module, just saves after rubbing head is gone back to above corresponding polishing pad and gone back to again to clean,
Transmission time is saved, efficiency is improved.
3, it is individually placed by the displacement movement and cleaning part of platform module, then cooperative mechanical hand transmission wafer,
So that process realizes parallel running between multiple polishing modules, the manufacture efficiency of equipment is increased substantially.
4, polishing handling integral module can according to need carry out spread, can be by three and more module
Spliced, further increase the flexibility of wafer manufacture, improve manufacture efficiency, reduce the space of equipment, increases yield.
Detailed description of the invention
Fig. 1 is the three-dimensional effect diagram of present invention polishing handling integral module；
Fig. 2 is the structural schematic diagram of the handling module in module shown in Fig. 1；
The meaning of appended drawing reference used in figure:
1: the first loading position, 2: the first rubbing head shafts, 3: the first rubbing heads, 4: the first polishing pads, 5: the first is fixed
Platform, 6: the second loading positions, 7: the second rubbing head shafts, 8: the second rubbing heads, 9: the second polishing pads, 10: the second is fixed flat
Platform, 11: sink, 12: first jet module, 13: linear moving module, 14: second nozzle module, 15: platform module, 16:
Platform fixed block, 17: isolation cover, 18: fixed frame.
Specific embodiment
The invention will now be described in further detail with reference to the accompanying drawings.
The invention discloses a kind of polishing handling parts modules of based CMP apparatus.This polishing handling parts
Module is made of 1 handling module and 2 polishing modules, and layout is as shown in Figure 1, comprising the first loading position, the first rubbing head
Shaft 2, the first rubbing head 3, the first polishing pad 4, the first fixed platform 5, the second loading position 6, the second rubbing head shaft 7, the
Two rubbing heads 8, the second polishing pad 9, the second fixed platform 10.
Polishing pad, polishes shaft and other component composition is fixed on the stationary platform, and rubbing head is fixed in polishing shaft.
Polishing shaft drives rubbing head to rotate to loading position, after execution, is polished above rotation to polishing pad.First handling
Position corresponds to the first rubbing head 3, corresponding second rubbing head 8 in the second loading position 6.
The structure of handling module is as shown in Fig. 2, comprising the first loading position 1, the second loading position 6, sink 11, and first
Nozzle module 12, linear moving module 13, second nozzle module 14, platform module 15, platform fixed block 16, isolation cover
17, fixed frame 18.Sink 11 and linear moving module 13 are fixed on fixed frame 18.Platform fixed block 16 is fixed on straight line fortune
On dynamic model block 13, platform module 15 is fixed on platform fixed block 16, and 16 lower part of platform fixed block be fixed with every
Platform lower part is isolated with liquid from cover 17.Linear moving module 13 can make platform module 15 in the first loading position 1
Move back and forth with the second loading position 6, is corresponding with first jet module in the first loading position 1 and 6 edge of the second loading position
12 and second nozzle module 14.Two nozzle modules are all fixed on fixed frame 18
Transmission wafer process of the invention is as follows:
Firstly, platform module 15 stops at the first loading position 1, wait the corresponding carrying in the first loading position 1 complete
The first loading position 1 is transferred at the first rubbing head 3 of first stage wafer polishing；
The rising of platform module 15 picks up wafer, and platform module 15 moves directly to the second loading position after picking up wafer
6, then corresponding first rubbing head 3 in the first loading position is cleaned on the first loading position top.Pass through platform module
15 movement, such first rubbing head 3 are saved there is no need to go back to clean again after going back to above the first polishing pad 4
Transmission time improves efficiency.
At the same time, the second rubbing head 8 is transferred to the second loading position 6, then by the handling on the second loading position 6
Polished wafer in platform module 15 is taken away, and manipulator is again by polished wafer load on the second loading position 6
Platform module 15 on.
Platform mould when the corresponding rubbing head cleaned completion in the first loading position, on the second loading position 6
Block 15 is moved under the first rubbing head 3 of the first loading position.Subsequent platform module 15 rises, and the first loading position is corresponding
First rubbing head 3 is completed to adsorb and be transferred to polishing area polishing, starts the polishing of lower wafer.
Then the platform module 15 of the first loading position is moved to the second loading position 6, at the same time the second handling position
It sets the 6 corresponding movements of second rubbing head 8 and is transferred to 6 top of the second loading position, platform module 15 rises, and draws polished
The wafer finished, after absorption, platform module 15 is moved to the first loading position, the second handling by the second loading position 6
Corresponding second rubbing head 8 in position 6 is cleaned on 6 top of the second loading position.Such benefit be the second rubbing head 8 just not
It is gone back to again after needing to go back to 9 top of the second polishing pad to clean, therefore saves transmission time, improve efficiency.
At the same time, manipulator takes the polished wafer in the platform module 15 on the first loading position
It walks, and loads upper polished wafer, then platform module 15, which stops on the first loading position, waits the first loading position
Corresponding first rubbing head 3 unloads polished wafer, starts again at circulation.
The advantages of wafer load modular construction of the invention: carrying out modularization by that will load and unload part and polishing part, can
To be spliced into layout shown in Fig. 1.This topological simplicity device structure, improves the manufacture efficiency of equipment, and the land occupation for reducing equipment is empty
Between.And it can according to need carry out spread, can be as 3 and the module of layout shown in more Fig. 1 is spliced,
The flexibility of wafer manufacture is further increased, manufacture efficiency is improved, reduces the space of equipment, increases yield.And pass through platform
The displacement movement of module 15 and cleaning part are individually placed, then cooperative mechanical hand transmits wafer so that multiple polishing modules it
Between process realize parallel running, increase substantially the manufacture efficiency of equipment.
The description of the above specific embodiment is not intended to limit the invention, all within the spirits and principles of the present invention institute
Any modification, equivalent substitution, improvement and etc. of work, should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of polishing handling parts module comprising moving handling module, which is characterized in that comprising handling module and
Two polishing modules composition, handling module is placed in the middle, and two polishing modules are located at its two sides, the handling module with handling module
There are two loading positions on perpendicular direction with two polishing module orientations, respectively correspond described two polishing modules,
Handling module can move back and forth between described two loading positions.
2. polishing handling parts module according to claim 1, it is characterised in that the polishing module includes fixed platform,
Polishing pad, rubbing head polish shaft, and polishing pad is located in fixed platform, and polishing shaft can drive rubbing head to rotate to handling position
It sets.
3. polishing handling parts module according to claim 2, it is characterised in that the handling module includes fixed frame
(18), sink (11), linear moving module (13), platform module (15), platform fixed block (16), isolation cover (17), institute
It states sink (11) and linear moving module (13) is fixed on fixed frame (18), platform fixed block (16) is fixed on linear motion
On the sliding shoe of module (13), platform module (15) is fixed on platform fixed block (16), and platform fixed block
(16) lower part, which is fixed with isolation cover (17), is isolated platform module lower part with liquid, and linear moving module (13) can make to load and unload
Platform module (15) moves back and forth between i.e. the first loading position in two loading positions (1) and the second loading position (6).
4. polishing handling parts module according to claim 3, it is characterised in that the first handling position of the handling module
It sets and is respectively arranged with first jet module (12) and second nozzle module (14), first jet on (1) and the second loading position (6)
Module (12) and second nozzle module (14) are all fixed on fixed frame (18).
5. polishing handling parts module according to claim 4, it is characterised in that the first jet module (12) and
Two nozzle modules (14) are separately positioned on the edge of the first loading position (1) and the second loading position (6).
6. polishing handling parts module according to claim 3, it is characterised in that the platform module can be in Vertical Square
Upward raising and lowering completes wafer transfer with rubbing head.
7. a kind of method that polishing handling parts module according to claim 6 carries out wafer transfer, it is characterised in that packet
Containing following steps:
S1: platform module (15) stops at the first loading position (1), waits the corresponding carrying in the position that the first stage is completed
The first rubbing head (3) of the wafer of polishing；
After S2: the first rubbing head (3) is transferred to the first loading position (1), the rising of platform module picks up wafer, and directly moves
To the second loading position (6)；
S3: the first rubbing head (3) is cleaned on the first loading position (1) top, is moved to the handling of the second loading position (6)
The wafer of platform module is drawn by the second rubbing head (8), starts the polishing of second stage, the second rubbing head (8) is transferred to the second throwing
After on light pad (9), manipulator loads upper new polished wafer；
S4: the dress when the first loading position (1) corresponding first rubbing head (3) cleaning is completed, on the second loading position (6)
It unloads platform module to be moved to below the first rubbing head (3) of the first loading position (1), subsequent platform module rises, the first handling
Corresponding first rubbing head (3) in position (1) is completed to treat wafer polishing adsorb and be transferred to polishing area and be polished；
The platform module of S5: the first loading position (1) is moved to the second loading position (6), at the same time the second loading position
(6) corresponding second rubbing head (8) movement is transferred to the second loading position (6) top, and platform module rises, and absorption is completed
Second stage polishes the wafer finished, and after absorption, platform module is moved to the first handling position by the second loading position (6)
Set (1)；
Corresponding second rubbing head (8) in S6: the second loading position (6) is cleaned on the second loading position (6) top, same with this
When, manipulator takes the wafer that second stage polishing is completed in the platform module on the first loading position (1) away, so
The wafer for completing first stage polishing on the first rubbing head (3) is waited afterwards；
After S7: the first rubbing head (3) is transferred to the first loading position (1), the rising of platform module, which picks up, completes first stage throwing
The wafer of light, and move directly to the second loading position (6)；
S8: repeating above step, until whole polishing wafers finish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107142110A TWI731281B (en) | 2018-09-20 | 2018-11-26 | Grinding loading and unloading component module containing movable loading and unloading module and wafer transmission method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2018111174236 | 2018-09-20 | ||
| CN201811117423 | 2018-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109304665A true CN109304665A (en) | 2019-02-05 |
Family
ID=65225289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811158609.6A Pending CN109304665A (en) | 2018-09-20 | 2018-09-30 | A kind of polishing handling parts module comprising moving handling module |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN109304665A (en) |
| TW (1) | TWI731281B (en) |
| WO (1) | WO2020056818A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110103119A (en) * | 2018-09-20 | 2019-08-09 | 杭州众硅电子科技有限公司 | A kind of polishing handling parts module |
| CN111761419A (en) * | 2020-06-11 | 2020-10-13 | 上海新欣晶圆半导体科技有限公司 | Adhesive tape grinding process for repairing edge damage of wafer |
| CN112296830A (en) * | 2019-07-30 | 2021-02-02 | 均豪精密工业股份有限公司 | Grinding device |
| CN114619308A (en) * | 2022-03-29 | 2022-06-14 | 杭州众硅电子科技有限公司 | Wafer polishing system, loading method and using method thereof |
| WO2023125916A1 (en) * | 2021-12-31 | 2023-07-06 | 杭州众硅电子科技有限公司 | Wafer polishing system and wafer transfer method |
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| JP2000061830A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Polishing device |
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| CN202062281U (en) * | 2011-04-19 | 2011-12-07 | 桂林桂北机器有限责任公司 | Precision numerical-control multi-station gem grinder |
| CN105598827A (en) * | 2016-01-05 | 2016-05-25 | 天津华海清科机电科技有限公司 | Chemical-mechanical polishing machine |
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| CN208744518U (en) * | 2018-09-20 | 2019-04-16 | 杭州众硅电子科技有限公司 | A kind of polishing handling parts module comprising moving handling module |
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| TWI562269B (en) * | 2014-01-22 | 2016-12-11 | Taiwan Semiconductor Mfg Co Ltd | Wafer transfer device and wafer transfer method with calitration function |
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2018
- 2018-09-30 CN CN201811158609.6A patent/CN109304665A/en active Pending
- 2018-10-12 WO PCT/CN2018/110042 patent/WO2020056818A1/en active Application Filing
- 2018-11-26 TW TW107142110A patent/TWI731281B/en active
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| JP2000061830A (en) * | 1998-08-19 | 2000-02-29 | Speedfam-Ipec Co Ltd | Polishing device |
| CN101157199A (en) * | 2006-10-06 | 2008-04-09 | 株式会社荏原制作所 | Substrate polishing apparatus and method |
| CN202062281U (en) * | 2011-04-19 | 2011-12-07 | 桂林桂北机器有限责任公司 | Precision numerical-control multi-station gem grinder |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110103119A (en) * | 2018-09-20 | 2019-08-09 | 杭州众硅电子科技有限公司 | A kind of polishing handling parts module |
| WO2020057330A1 (en) * | 2018-09-20 | 2020-03-26 | 杭州众硅电子科技有限公司 | Polishing and loading/unloading component module |
| CN112296830A (en) * | 2019-07-30 | 2021-02-02 | 均豪精密工业股份有限公司 | Grinding device |
| CN111761419A (en) * | 2020-06-11 | 2020-10-13 | 上海新欣晶圆半导体科技有限公司 | Adhesive tape grinding process for repairing edge damage of wafer |
| CN111761419B (en) * | 2020-06-11 | 2021-10-15 | 上海中欣晶圆半导体科技有限公司 | Adhesive tape grinding process for repairing edge damage of wafer |
| WO2023125916A1 (en) * | 2021-12-31 | 2023-07-06 | 杭州众硅电子科技有限公司 | Wafer polishing system and wafer transfer method |
| CN114619308A (en) * | 2022-03-29 | 2022-06-14 | 杭州众硅电子科技有限公司 | Wafer polishing system, loading method and using method thereof |
| CN114619308B (en) * | 2022-03-29 | 2023-05-16 | 杭州众硅电子科技有限公司 | Wafer polishing system, loading method and using method thereof |
| WO2023185202A1 (en) * | 2022-03-29 | 2023-10-05 | 杭州众硅电子科技有限公司 | Wafer polishing system, and loading method and use method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202012102A (en) | 2020-04-01 |
| TWI731281B (en) | 2021-06-21 |
| WO2020056818A1 (en) | 2020-03-26 |
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