CN109590562B - Semiconductor shell welding method and semiconductor shell positioning and mounting method - Google Patents
Semiconductor shell welding method and semiconductor shell positioning and mounting method Download PDFInfo
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- CN109590562B CN109590562B CN201811533003.6A CN201811533003A CN109590562B CN 109590562 B CN109590562 B CN 109590562B CN 201811533003 A CN201811533003 A CN 201811533003A CN 109590562 B CN109590562 B CN 109590562B
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- sealing ring
- ceramic body
- ring
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- solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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Abstract
The invention discloses a semiconductor shell welding method and a semiconductor shell positioning and mounting method, wherein the semiconductor shell welding method comprises the following steps: the method comprises the following steps: assembling a sealing ring above the ceramic body to ensure that the sealing ring is attached to the metalized area surface of the ceramic body; step two: preparing a side-mounted solder ring; step three: sleeving the side-mounted solder ring outside the sealing ring, wherein the side-mounted solder ring is close to the sealing ring, and meanwhile, the side-mounted solder ring is placed above the ceramic body; step four: under the protective atmosphere environment, welding by using a diffusion furnace, melting a side-mounted welding material ring, filling the side-mounted welding material ring into a slit between the ceramic body and the sealing ring, and welding; the sealing ring is directly jointed with the metallized area of the ceramic body, so that the slit between the sealing ring and the metallized area of the ceramic body is smaller, the amount of liquid solder formed after the laterally arranged solder ring is melted to fill the slit is smaller, the displacement of the sealing ring lifted upwards is very small, and the parallelism precision grade of the sealing ring is higher.
Description
Technical Field
The invention belongs to the technical field of semiconductor shells, and particularly relates to a semiconductor shell welding method and a semiconductor shell positioning and racking method.
Background
Brazing is widely applied to industries such as aerospace, electronic power and the like as a precise connecting technology in the current high technology; during welding, the welding material is generally placed in a sandwiched mode, namely the welding material is placed between two base materials which are stacked up and down, the welding material with the melting temperature lower than that of the base materials is adopted, the operation temperature lower than the solidus line of the base materials and higher than the liquidus line of the welding material is adopted, and the two base materials are connected together through the molten welding material, so that the welding structure has the following defects that (1) the requirement on the welding material amount is relatively large, and the cost is high; (2) in the process of melting the solder, the parent metal on the upper surface can sink down, and the sinking heights in different directions are different in the process of sinking, so that the parallelism index of the product cannot meet the requirement; (3) in the process of melting the solder, the upper base material can sink down, and the welding seam desoldering can be formed at individual parts due to different deposition speeds in different directions.
At present, when a semiconductor housing is soldered, a soldering method of placing a solder in a sandwich manner is adopted, and as shown in fig. 1, a sealing ring 1, a sandwich type solder ring 2, and a ceramic body 3 are sequentially stacked from top to bottom. The semiconductor shell has the characteristics of small size, high arraying degree and high positioning requirement accuracy, and the sealing ring 1 is not allowed to have a skew offset phenomenon, so that a ceramic body 3 and the sealing ring 1 need to be aligned by means of a T-shaped positioning column 4 in the welding process as shown in figure 2; the lower end of the T-shaped positioning column 4 penetrates through the sealing ring 1 to extend into an inner cavity of the ceramic body 3 for positioning, and the upper end of the T-shaped positioning column 4 is provided with a step cover 41 for pressing the upper surface of the sealing ring 1 so as to enable the sealing ring 1 to sink when the solder is melted; however, the "T" shaped positioning post 4 has the following problems: on one hand, because the sealing ring 1 is small in size and limited in machining capacity, after the T-shaped positioning column 4 is assembled, the sealing ring 1 is pressed by the step cover 41, the sealing ring 1 cannot be seen, and the adjustment cannot be carried out under a microscope; on the other hand, because the sealing ring 1 is shielded by the step cover 41, the sealing ring 1, the sandwiched solder ring 2 and the ceramic body 3 must be assembled first, and finally the T-shaped positioning column 4 is assembled; because the size of each part is less, the sealing ring 1 and the inner cavity of the ceramic body 3 are easy to misplace, the T-shaped positioning column 4 cannot be installed after the dislocation, the position of the sealing ring 1 needs to be adjusted repeatedly, the frame installing efficiency is very low, and the frame installing time is generally 2 min.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method for soldering a semiconductor package, which improves soldering quality by setting relative positions of a side solder ring, a ceramic body and a sealing ring, and simply, the side solder ring is melted to form a liquid solder, and the sealing ring is directly bonded to the ceramic body, so that a slit between the sealing ring and the ceramic body is small, and thus, the amount of the liquid solder required for filling the slit is small, the usage amount of the liquid solder is effectively reduced, that is, the volume of the side solder ring is reduced, and resources are saved.
In order to achieve the above object, the present invention provides a method for soldering a semiconductor package, comprising the steps of:
the method comprises the following steps: preparing a sealing ring and a ceramic body with a metalized area on the surface, and assembling the sealing ring above the ceramic body to ensure that the sealing ring is attached to the metalized area of the ceramic body; step two: preparing a side welding material ring, wherein the material of the side welding material ring is determined according to the material of the ceramic body and the material of the sealing ring; step three: sleeving the side-mounted solder ring outside the sealing ring, wherein the side-mounted solder ring is close to the sealing ring, and meanwhile, the side-mounted solder ring is placed above the ceramic body; step four: and (3) welding by using a diffusion furnace under a protective atmosphere environment, so that the laterally arranged welding material ring is melted and filled in a slit between the ceramic body and the sealing ring, and the welding between the ceramic body and the sealing ring is realized.
Further, the gap range between the side welding material ring and the sealing ring is 0.1 mm.
Furthermore, the ceramic body is made of alumina ceramic, the metalized area of the ceramic body is a nickel-plated metalized area, the sealing ring is made of kovar alloy, and the side-mounted solder ring is made of silver-copper solder.
Further, the protective atmosphere is nitrogen-hydrogen gas.
Based on the above technical solution, another object of the present invention is to provide a method for positioning and mounting a semiconductor package, comprising the following steps:
the method comprises the following steps: when the sealing ring is assembled above the ceramic body, the ceramic body and the sealing ring are aligned through a positioning die, the positioning die adopts a straight cylindrical body, and the straight cylindrical body is respectively matched with the sealing ring and the inner cavity of the ceramic body in shape;
step two: the lower end of the straight cylindrical body is assembled in an inner cavity formed in the ceramic body, and the upper end of the straight cylindrical body extends upwards;
step three: the sealing ring is sleeved from the upper end of the straight cylindrical body, is sleeved outside the straight cylindrical body and moves downwards to the upper surface of the ceramic body, so that the sealing ring is attached to the surface of the ceramic body.
Further, the method also comprises the fourth step of: the position of the sealing ring is adjusted under a microscope according to the relative position between the ceramic body and the sealing ring.
The invention has the beneficial effects that:
1. the semiconductor shell welding method provides a brand new technical concept, can improve the welding quality and reduce the cost; here, the sealing ring is directly attached to the metallized area of the ceramic body, so that a slit between the sealing ring and the ceramic body is smaller; the side-mounted solder ring is sleeved outside the sealing ring, meanwhile, the side-mounted solder ring is placed above the ceramic body, liquid solder is formed after the side-mounted solder ring is melted and is close to one side of the slit, and the liquid solder flows in the slit in a capillary mode until the slit is filled with the liquid solder; because the slit between the sealing ring and the ceramic body is smaller, the demand for filling the slit with liquid solder is smaller, the volume of the laterally arranged solder ring is reduced, and resources are saved; in addition, the sealing ring is lifted after the slit is filled with the liquid solder, and the amount of the liquid solder for filling the slit is small, so that the lifting displacement of the sealing ring is very small, and the parallelism precision grade of the sealing ring is high; in addition, less liquid solder for filling the slit is used, and the other liquid solder forms a wrap angle on the side edge of the sealing ring, so that the welding quality of the semiconductor shell is effectively improved.
2. The positioning and mounting method for the semiconductor shell can assemble the positioning die firstly and then assemble the sealing ring; because the positioning die adopts the straight cylindrical body which is matched with the sealing ring and the inner cavity of the ceramic body respectively in shape, the sealing ring and the inner cavity of the ceramic body are automatically aligned through the positioning die, and the positioning and mounting efficiency of the semiconductor shell is effectively improved; on this basis, because the straight column shape body can not shelter from the ring of sealing, the staff can be according to the ceramic body with seal the relative position between the ring, under the microscope, finely tune the position of sealing the ring, further improve the counterpoint precision of ceramic body and ring of sealing.
Drawings
In order to make the object, technical scheme and beneficial effect of the invention more clear, the invention provides the following drawings for explanation:
FIG. 1 is a schematic view of a prior art arrangement of a clamped solder ring;
FIG. 2 is a schematic view of a prior art mounting of a semiconductor package;
FIG. 3 is a schematic view of the side solder ring placement of the present invention;
FIG. 4 is a schematic view of a semiconductor package mounting of the present invention;
reference numerals: 1-sealing ring; 2-a clamped solder ring; 3-a ceramic body; 4- "T" shaped locating column; 5-side-mount solder ring; 6-a right cylindrical body; 41-step cover.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 3, in the first embodiment: the invention discloses a semiconductor shell welding method, which comprises the following steps:
the method comprises the following steps: a sealing ring 1 and a ceramic body 3 with a metalized area on the surface are prepared, and the sealing ring 1 is assembled above the ceramic body 3 to ensure that the sealing ring 1 is attached to the metalized area of the ceramic body 3. The sealing ring 1 is a rectangular ring, the length and the width of the outer ring of the sealing ring are both 4.7mm, and the length and the width of the inner ring of the sealing ring are both 3.7 mm.
Step two: preparing a side welding material ring 5, wherein the material of the side welding material ring 5 is determined according to the material of the ceramic body 3 and the material of the sealing ring 1; specifically, the ceramic body 3 is made of alumina ceramic, the metalized area of the ceramic body 3 is a nickel-plated metalized area, and as is well known, the metalized area on the surface of the ceramic body 3 is used for welding with the sealing ring 1, and the structure of the ceramic body 3 is not described again; the sealing ring 1 is made of kovar alloy, and the side solder ring 5 is made of silver-copper solder.
Step three: sleeving the side-mounted welding material ring 5 outside the sealing ring 1, and meanwhile, placing the side-mounted welding material ring 5 above the ceramic body 3; in order to ensure that the liquid solder formed after the side solder ring 5 is melted can be filled in the slit between the ceramic body 3 and the sealing ring 1 in time, the side solder ring 5 should be close to the sealing ring 1, wherein the gap between the side solder ring 5 and the sealing ring 1 is 0.1mm, and the volume of the side solder ring 5 is 0.52mm3。
Step four: under the environment of protective atmosphere, a diffusion furnace is used for welding, so that the side-mounted welding material ring 5 is melted and filled in a slit between the ceramic body 3 and the sealing ring 1, and the welding between the ceramic body 3 and the sealing ring 1 is realized; specifically, the protective atmosphere is a nitrogen-hydrogen gas; when the diffusion furnace is used for welding, the temperature in the diffusion furnace is kept for 4min when the temperature in the diffusion furnace is increased to 810 ℃.
As shown in fig. 1, the second embodiment: taking the prior art as a comparison group, sequentially stacking the clamped solder ring 2, the sealing ring 1, the clamped solder ring 2 and the ceramic body 3 from top to bottom, and keeping the temperature for 4min when the temperature in a diffusion furnace rises to 810 ℃, wherein the other conditions are the same as the first embodiment.
The weld quality of examples one to two is shown in table 1:
the semiconductor package is small in size and has high precision requirements, and here, the welding quality is mainly considered from the aspects of appearance, the settling amount of the sealing ring 1 and the parallelism of the sealing ring 1.
TABLE 1
From table 1, comparing the data of example one with example two, it can be seen that the weld quality of the present invention is significantly improved over the prior art.
As shown in fig. 4, in a third embodiment, based on the first embodiment, the present invention further provides a method for positioning and mounting a semiconductor package, including the following steps:
the method comprises the following steps: when the sealing ring 1 is assembled above the ceramic body 3, the ceramic body 3 and the sealing ring 1 are aligned through a positioning die, the positioning die adopts a straight cylindrical body 6, and the straight cylindrical body 6 is respectively matched with the sealing ring 1 and the inner cavity of the ceramic body 3 in shape. Here, since the sealing ring 1 is a rectangular ring, the straight cylindrical body 6 is in a straight prism shape; the material of the positioning mould is 304 stainless steel.
Step two: the lower end of the straight cylindrical body 6 is fitted in the inner cavity provided in the ceramic body 3, and the upper end of the straight cylindrical body 6 is extended upward.
Step three: the sealing ring 1 is sleeved from the upper end of the straight cylindrical body 6, the sealing ring 1 is sleeved outside the straight cylindrical body 6 and moves downwards to the upper surface of the ceramic body 3, and the sealing ring 1 is attached to the surface of the ceramic body 3.
In the third embodiment, the positioning mold is assembled first, and then the sealing ring 1 is assembled, the racking time is only 30s, which is far lower than that of the T-shaped positioning column 4. In addition, the positioning die is simple in structure and small in size, and only needs to be machined by a laser scribing machine, and the machining cost is 2 yuan each; because the T-shaped positioning column 4 is provided with the step cover 41, the T-shaped positioning column 4 is relatively complex in shape and has the processing cost of 10 yuan each; therefore, the straight cylindrical body 6 is adopted, the racking efficiency is greatly improved, and the cost is reduced.
In addition, in order to further improve the alignment accuracy between the ceramic body 3 and the sealing ring 1, the third embodiment further includes a fourth step of: the position of the sealing ring 1 is adjusted under a microscope based on the relative position between the ceramic body 3 and the sealing ring 1.
Finally, it is noted that the above-mentioned preferred embodiments illustrate rather than limit the invention, and that, although the invention has been described in detail with reference to the above-mentioned preferred embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the invention as defined by the appended claims.
Claims (1)
1. A semiconductor shell welding method is characterized in that: the method comprises the following steps:
the method comprises the following steps: preparing a sealing ring and a ceramic body with a metalized area on the surface, and assembling the sealing ring above the ceramic body to ensure that the sealing ring is attached to the metalized area of the ceramic body;
step two: preparing a side welding material ring, wherein the material of the side welding material ring is determined according to the material of the ceramic body and the material of the sealing ring;
step three: sleeving the side-mounted solder ring outside the sealing ring, wherein the side-mounted solder ring is close to the sealing ring, and meanwhile, the side-mounted solder ring is placed above the ceramic body;
step four: under the environment of protective atmosphere, a diffusion furnace is used for welding, so that the laterally arranged welding material ring is melted and filled in a slit between the ceramic body and the sealing ring, and the welding between the ceramic body and the sealing ring is realized;
the gap between the side welding material ring and the sealing ring is 0.1 mm;
the ceramic body is made of alumina ceramic, the metalized area of the ceramic body is a nickel-plated metalized area, the sealing ring is made of kovar alloy, and the side-mounted solder ring is made of silver-copper solder;
the protective atmosphere is nitrogen-hydrogen gas;
the positioning and mounting method of the semiconductor shell comprises the following steps: when the sealing ring is assembled above the ceramic body, the ceramic body and the sealing ring are aligned through a positioning die, the positioning die adopts a straight cylindrical body, and the straight cylindrical body is respectively matched with the sealing ring and the inner cavity of the ceramic body in shape; the lower end of the straight cylindrical body is assembled in an inner cavity formed in the ceramic body, and the upper end of the straight cylindrical body extends upwards; sleeving a sealing ring from the upper end of the straight cylindrical body, sleeving the sealing ring outside the straight cylindrical body and moving down to the upper surface of the ceramic body to enable the sealing ring to be attached to the surface of the ceramic body; the position of the sealing ring is adjusted under a microscope according to the relative position between the ceramic body and the sealing ring.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811533003.6A CN109590562B (en) | 2018-12-14 | 2018-12-14 | Semiconductor shell welding method and semiconductor shell positioning and mounting method |
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| CN201811533003.6A CN109590562B (en) | 2018-12-14 | 2018-12-14 | Semiconductor shell welding method and semiconductor shell positioning and mounting method |
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| Publication Number | Publication Date |
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| CN109590562A CN109590562A (en) | 2019-04-09 |
| CN109590562B true CN109590562B (en) | 2021-07-06 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5837562A (en) * | 1995-07-07 | 1998-11-17 | The Charles Stark Draper Laboratory, Inc. | Process for bonding a shell to a substrate for packaging a semiconductor |
| CN1727107A (en) * | 2004-07-30 | 2006-02-01 | 中国科学院电子学研究所 | The solder that is used for impregnated cathode |
| CN102780157A (en) * | 2012-07-06 | 2012-11-14 | 江苏飞格光电有限公司 | Chip patching system of semiconductor laser and patching method |
| CN103956344B (en) * | 2014-04-01 | 2017-03-08 | 中国电子科技集团公司第五十五研究所 | A kind of ceramic pipe cap of suitable Parallel Seam Sealing Technology and its manufacture method |
| CN204088294U (en) * | 2014-09-02 | 2015-01-07 | 河北中瓷电子科技有限公司 | Semiconductor laser transmitter band is heat sink ceramic package |
| CN205303435U (en) * | 2015-11-30 | 2016-06-08 | 无锡中微高科电子有限公司 | Semiconductor chip's high accuracy installation location system utensil |
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