CN206850735U - Encapsulate SMD quartz crystal resonator - Google Patents
Encapsulate SMD quartz crystal resonator Download PDFInfo
- Publication number
- CN206850735U CN206850735U CN201720661228.4U CN201720661228U CN206850735U CN 206850735 U CN206850735 U CN 206850735U CN 201720661228 U CN201720661228 U CN 201720661228U CN 206850735 U CN206850735 U CN 206850735U
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- ceramic
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- quartz
- crystal resonator
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Abstract
The utility model provides encapsulation SMD quartz crystal resonator, it includes metal flat cover, quartz wafer, base of ceramic, wherein, the sealing surface of base of ceramic is covered with silver-bearing copper metal level, quartz wafer is solidified by elargol and base of ceramic, and metal flat cover is connected with being covered with the base of ceramic sealing surface of silver-bearing copper metal level.SMD is made using the technical program（Surface mount）The cost of quartz wafer resonator product is greatly reduced, and properties of product are suitable with traditional product, so as to improve SMD（Surface mount）Quartz wafer resonator and the oscillator localization rate of parts and components, improve the chip rate of China's quartz-crystal resonator and oscillator.Make SMD（Surface mount）Quartz-crystal resonator production cost declines about 20%, can domesticize comprehensively, improves product competitiveness, meets electronic component to miniaturization, chip type trend.
Description
Technical field
Electronic component technology field is the utility model is related to, refers in particular to novel encapsulated SMD quartz crystal resonator.
Background technology
SMD（Surface mount）Quartz-crystal resonator generally comprises quartz wafer, ceramic metallization pedestal and metal flat cover,
Quartz wafer is adhesively fixed by elargol and base of ceramic, and metal flat cover can cut down ring with ceramic metallization pedestal and pass through seam welder height
Temperature welding forms dustless sealing space required for quartz wafer work.SMD quartz crystal resonator and oscillator industry institute at present
The ceramic metallization pedestal needed only has Kyocera, the production of Sumitomo Deng Jijia great factories, and domestic enterprise only has three ring groups to give birth on a small quantity
Production, the seam welder of encapsulation only has imported product, expensive, and tool process parameter control is complicated.Existing SMD（Surface mount）
Quartz-crystal resonator such as Fig. 1 and Fig. 2, it can be seen that traditional SMD（Surface mount）Quartz resonator and oscillator 10,
Ring 16 can be cut down including metal flat cover 11, quartz wafer 12, ceramic metallization pedestal 13, ceramic metallization pedestal.Quartz wafer 12
Be bonded with ceramic metallization pedestal 13 by elargol 15, metal flat cover 11 can cut down ring 16 with ceramic metallization pedestal and pass through seam welder
High-temperature soldering forms the sealing space needed for quartz crystal work.
The content of the invention
The purpose of this utility model is overcome the deficiencies in the prior art, there is provided a kind of product qualification rate is high, pedestal production
The low novel encapsulated SMD quartz crystal resonator of cost.
To achieve the above object, technical scheme provided by the utility model is：SMD quartz crystal resonator is encapsulated, it
Include metal flat cover, quartz wafer, base of ceramic, wherein, the sealing surface of base of ceramic is covered with silver-bearing copper metal level, quartz wafer
Solidified by elargol and base of ceramic, metal flat cover is connected with being covered with the base of ceramic sealing surface of silver-bearing copper metal level.
Recessed deep gouge is provided with the middle part of described base of ceramic sealing surface, quartz wafer is across above deep gouge, its both ends
Fixed respectively by corresponding elargol.
Described base of ceramic edge is provided with square groove, and silver-bearing copper metal level bottom is entrenched in groove, silver-bearing copper gold
Category layer surface contacts with base of ceramic sealing surface.
Sealing space is formed by laser welded seal between described metal flat cover and base of ceramic sealing surface.
The new pattern laser welding encapsulation SMD of this programme（Surface mount）The pedestal of quartz resonator is made of ceramics, its
Cost is low, easy-formation, and base of ceramic sealing surface is covered with silver-bearing copper metal level 25.Quartz wafer 22 passes through elargol 24 and base of ceramic 23
Solidification, metal flat cover 21 and base of ceramic sealing surface, which are covered with silver-bearing copper metal level 25 and weld sealing by laser welding, forms quartz-crystal
Sealing space needed for body running.The product made using ceramic technology, makes SMD（Surface mount）Quartz-crystal resonator produces
Cost declines about 20%, can domesticize comprehensively, improves product competitiveness, meets electronic component and develops tide to miniaturization, chip type
Stream.
Brief description of the drawings
Fig. 1, Fig. 2 are existing quartz-crystal resonator structural representation.
Fig. 3, Fig. 4, Fig. 5 are encapsulation SMD quartz crystal resonator structural representation of the present utility model.
Embodiment
With reference to all accompanying drawings, the utility model is described in further detail, and preferred embodiment of the present utility model is：Ginseng
Accompanying drawing 3 is seen to accompanying drawing 5, and the encapsulation SMD quartz crystal resonator described in the present embodiment includes metal flat cover 21, quartz wafer
22nd, base of ceramic 23, wherein, the sealing surface of base of ceramic 23 is covered with silver-bearing copper metal level 25, quartz wafer 22 by elargol 24 with
Base of ceramic 23 solidifies, and metal flat cover 21 is connected with being covered with the sealing surface of base of ceramic 23 of silver-bearing copper metal level 25, described metal
Sealing space is formed by laser welded seal between flat cover 21 and the sealing surface of base of ceramic 23.The described sealing-in of base of ceramic 23
Middle face is provided with recessed deep gouge 26, and quartz wafer 22 is across the top of deep gouge 26, and its both ends passes through corresponding elargol 24 respectively
It is fixed.The edge of base of ceramic 23 is provided with square groove, and the bottom of silver-bearing copper metal level 25 is entrenched in groove, silver-bearing copper metal level 25
Surface contacts with the sealing surface of base of ceramic 23.The pedestal of this programme is made of ceramics, and its cost is low, easy-formation, uses simultaneously
After metal flat cover, new ceramics pedestal sealing surface is covered with silver-bearing copper metal level 25, by laser welding metal flat cover and novel ceramic
Porcelain pedestal sealing surface, which is covered with silver-bearing copper metal level 25 and welded, to be sealed.SMD is made using the technical program（Surface mount）Quartz-crystal
The cost of piece resonator product is greatly reduced, and properties of product are suitable with traditional product, so as to improve SMD（Surface mount）Quartz
Chip resonator and the oscillator localization rate of parts and components, improve the chip rate of China's quartz-crystal resonator and oscillator.Make SMD（Table
Face mounts）Quartz-crystal resonator production cost declines about 20%, can domesticize comprehensively, improves product competitiveness, meets electronics member
Device to miniaturization, chip type trend.
Embodiment described above is only the preferred embodiment of the utility model, not limits reality of the present utility model with this
Apply scope, therefore the change that all shape, principles according to the utility model are made, it all should cover in the scope of protection of the utility model
It is interior.
Claims (4)
1. encapsulate SMD quartz crystal resonator, it is characterised in that：It includes metal flat cover（21）, quartz wafer（22）, ceramics
Pedestal（23）, wherein, base of ceramic（23）Sealing surface be covered with silver-bearing copper metal level（25）, quartz wafer（22）Pass through elargol（24）
With base of ceramic（23）Solidification, metal flat cover（21）With being covered with silver-bearing copper metal level（25）Base of ceramic（23）Sealing surface connects.
2. encapsulation SMD quartz crystal resonator according to claim 1, it is characterised in that：Base of ceramic（23）Sealing surface
Middle part is provided with recessed deep gouge（26）, quartz wafer（22）It is across deep gouge（26）Top, its both ends pass through corresponding silver respectively
Glue（24）It is fixed.
3. encapsulation SMD quartz crystal resonator according to claim 1, it is characterised in that：Base of ceramic（23）Edge
Provided with square groove, silver-bearing copper metal level（25）Bottom is entrenched in groove, silver-bearing copper metal level（25）Surface and base of ceramic
（23）Sealing surface contacts.
4. encapsulation SMD quartz crystal resonator according to claim 1, it is characterised in that：Metal flat cover（21）With ceramics
Pedestal（23）Sealing space is formed by laser welded seal between sealing surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720661228.4U CN206850735U (en) | 2017-06-08 | 2017-06-08 | Encapsulate SMD quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720661228.4U CN206850735U (en) | 2017-06-08 | 2017-06-08 | Encapsulate SMD quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206850735U true CN206850735U (en) | 2018-01-05 |
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ID=60799273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720661228.4U Expired - Fee Related CN206850735U (en) | 2017-06-08 | 2017-06-08 | Encapsulate SMD quartz crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206850735U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111362715A (en) * | 2020-03-16 | 2020-07-03 | 研创科技（惠州）有限公司 | Packaging method based on nano metal |
-
2017
- 2017-06-08 CN CN201720661228.4U patent/CN206850735U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111362715A (en) * | 2020-03-16 | 2020-07-03 | 研创科技（惠州）有限公司 | Packaging method based on nano metal |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180105 Termination date: 20190608 |