CN109571269A - A kind of processing method removing sub-surface damage layer - Google Patents
A kind of processing method removing sub-surface damage layer Download PDFInfo
- Publication number
- CN109571269A CN109571269A CN201811546252.9A CN201811546252A CN109571269A CN 109571269 A CN109571269 A CN 109571269A CN 201811546252 A CN201811546252 A CN 201811546252A CN 109571269 A CN109571269 A CN 109571269A
- Authority
- CN
- China
- Prior art keywords
- polishing
- surface damage
- class
- damage layer
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention patent relates to a kind of processing methods for removing sub-surface damage layer, and nm-class polishing liquid is placed in polishing container, and polishing product is bonded on polishing disk, are suspended in nm-class polishing liquid；Motor stirring nm-class polishing liquid in container is constantly wriggled, impact optical articles, simultaneously, the optical articles for being suspended in nm-class polishing liquid constantly rotate, cutting polishing optical articles surface is flowed using polishing fluid, prolonged wriggling polishing action achievees the purpose that removal optics sub-surface damage, laser damage threshold greatly improve.
Description
Technical field
The invention patent belongs to the manufacture field of optical articles, especially a kind of processing side for removing sub-surface damage layer
Method.
Background technique
Optical glass is inorganic polymer condensed state matter, and sub-surface damage only has sub-surface to split in optics grinding process
Line and surface or two kinds of forms of sub-surface residual stress.Traditional optical manufacturing using grinding, polishing process route, to adding
The sub-surface damage generated during work is difficult to precise measurement and removal, and Meanpace mentions the sub-surface damage of grinding process introducing
Hurt 3 times that depth is about coating materials granularity, and to bulk cargo abrasive material lesion depths is 1-1.8 times of wear particle size, the sub- table of this part
Surface damage layer greatly reduces the damage threshold of optical articles, especially seems increasingly important in deep ultraviolet.
Summary of the invention
Since current polishing process uses chemical mechanical polishing method, there are gravity pressures to polish product, optical articles and throwing
Light liquid is under the cutting pressure of gravity, and there are sub-surface damages to destroy layer on surface, not can be removed, causes to damage extremely low！Therefore, originally
The purpose of patent of invention is to invent a kind of processing method for removing sub-surface damage layer.
In order to solve the above deficiency, nm-class polishing liquid is placed in polishing container by the invention patent, and polishing product is viscous
Knot is suspended in nm-class polishing liquid on polishing disk；Motor stirring nm-class polishing liquid in container is constantly wriggled, and light is impacted
Product is learned, meanwhile, the optical articles for being suspended in nm-class polishing liquid constantly rotate, and flow cutting polishing optics using polishing fluid and produce
Product surface, polishing action of wriggling for a long time achieve the purpose that remove optics sub-surface damage.
Detailed description of the invention
Fig. 1 is a kind of processing method schematic diagram of removal sub-surface damage layer of the invention patent.
Specific embodiment
In order to be preferably illustrated to the invention patent, elaborate below in conjunction with attached drawing.
As shown in Figure 1, a kind of processing method schematic diagram of removal sub-surface damage layer of the invention patent, 101 be polishing
Container, 102 be diluent liquid, and 103 be rotating electric machine, and 104 be silica nanometer grade polishing fluid, and 105 be optical articles, 106
To bond disk.
Optical articles 105 are bonded on polishing disk 106, are first processed using conventional method, are processed surface smoothness and face
Type, at this point, there are subdamage layers on optical articles 105 surface.104 silica nanometer grade polishing fluids dilute in 102 dilutions
Proportion, is placed in 101 polishing containers, and rotating electric machine 103 constantly rotates, wriggling nm-class polishing liquid, so that 104 silica
Nm-class polishing liquid, which is wriggled, polishes optical articles 105, while 105 are bonded on 106 polishing disks, are constantly rotated by motor, increase
The optical polishing efficiency of 105 optical articles is added, has achieved the purpose that remove sub-surface damage layer.
Above-mentioned specific embodiment is not construed as further limiting the invention patent, those skilled in the art according to
The unsubstantiality change that the invention patent content is made should all be fallen into the invention patent protection scope.
Claims (4)
1. the present invention relates to a kind of processing methods for removing sub-surface damage layer, it is characterised in that: place nm-class polishing liquid
In polishing container, polishing product is bonded on polishing disk, is suspended in nm-class polishing liquid；Motor in container stirs nanometer
Grade polishing fluid is constantly wriggled, and optical articles are impacted, meanwhile, the optical articles for being suspended in nm-class polishing liquid constantly rotate, and utilize
Polishing fluid flowing cutting polishing optical articles surface, polishing action of wriggling for a long time reach removal optics sub-surface damage layer
Purpose.
2. a kind of processing method for removing sub-surface damage layer as described in claim 1, it is characterised in that: nm-class polishing liquid
It can be silica, cerium oxide, diamond dust and iron oxide polishing fluid.
3. a kind of processing method for removing sub-surface damage layer as described in claim 1, it is characterised in that: the material of processing is
Optical glass and crystalline material.
4. a kind of processing method for removing sub-surface damage layer as described in claim 1, it is characterised in that: processing polished liquid can
Think anhydrous organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811546252.9A CN109571269A (en) | 2018-12-18 | 2018-12-18 | A kind of processing method removing sub-surface damage layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811546252.9A CN109571269A (en) | 2018-12-18 | 2018-12-18 | A kind of processing method removing sub-surface damage layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109571269A true CN109571269A (en) | 2019-04-05 |
Family
ID=65930720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811546252.9A Pending CN109571269A (en) | 2018-12-18 | 2018-12-18 | A kind of processing method removing sub-surface damage layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109571269A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645030A (en) * | 1979-07-05 | 1981-04-24 | Wacker Chemitronic | Destroying surface that induces layer defects of semiconductor disk |
| CN1822919A (en) * | 2003-07-18 | 2006-08-23 | 墨西哥国立自治大学 | Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces |
| KR20100045289A (en) * | 2008-10-23 | 2010-05-03 | 주식회사 동진쎄미켐 | Electro chemical mechanical polishing pad and polishing method using the same |
| CN101844320A (en) * | 2010-06-07 | 2010-09-29 | 湖南大学 | Precise high-efficiency polishing method and device for curved surface parts |
| CN103372806A (en) * | 2012-04-13 | 2013-10-30 | 纳米及先进材料研发院有限公司 | Automatic polishing device for surface finishing of complex-curved-profile parts |
| CN106826408A (en) * | 2017-02-09 | 2017-06-13 | 同济大学 | A kind of lbo crystal polishing method based on crystal oxidant |
| EP3142142A4 (en) * | 2014-03-12 | 2017-11-08 | Osaka University | Method and device for processing wide-bandgap semiconductor substrate |
-
2018
- 2018-12-18 CN CN201811546252.9A patent/CN109571269A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645030A (en) * | 1979-07-05 | 1981-04-24 | Wacker Chemitronic | Destroying surface that induces layer defects of semiconductor disk |
| CN1822919A (en) * | 2003-07-18 | 2006-08-23 | 墨西哥国立自治大学 | Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces |
| KR20100045289A (en) * | 2008-10-23 | 2010-05-03 | 주식회사 동진쎄미켐 | Electro chemical mechanical polishing pad and polishing method using the same |
| CN101844320A (en) * | 2010-06-07 | 2010-09-29 | 湖南大学 | Precise high-efficiency polishing method and device for curved surface parts |
| CN103372806A (en) * | 2012-04-13 | 2013-10-30 | 纳米及先进材料研发院有限公司 | Automatic polishing device for surface finishing of complex-curved-profile parts |
| EP3142142A4 (en) * | 2014-03-12 | 2017-11-08 | Osaka University | Method and device for processing wide-bandgap semiconductor substrate |
| CN106826408A (en) * | 2017-02-09 | 2017-06-13 | 同济大学 | A kind of lbo crystal polishing method based on crystal oxidant |
Non-Patent Citations (1)
| Title |
|---|
| 宋月贤等: ""圆光栅玻璃的游离磨料研磨抛光加工工艺"", 《金刚石与磨料磨具工程》 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190405 |
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| WD01 | Invention patent application deemed withdrawn after publication |