CN107529477A - Devitrified glass cmp method and devitrified glass - Google Patents

Devitrified glass cmp method and devitrified glass Download PDF

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Publication number
CN107529477A
CN107529477A CN201710667071.0A CN201710667071A CN107529477A CN 107529477 A CN107529477 A CN 107529477A CN 201710667071 A CN201710667071 A CN 201710667071A CN 107529477 A CN107529477 A CN 107529477A
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polishing
devitrified glass
glass
cleaning
finishing polish
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CN107529477B (en
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曹阳
金军
陈蕊
路新春
沈攀
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Tsinghua University
Huahaiqingke Co Ltd
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Tianjin Hwatsing Technology Co Ltd (hwatsing Co Ltd)
Tsinghua University
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Abstract

The invention discloses a kind of devitrified glass cmp method and devitrified glass, this method to include:(1) rough polishing is carried out to devitrified glass using SUBA Series polishing pads and cerium oxide polishing slurry, to obtain devitrified glass after rough polishing;(2) finishing polish is carried out to devitrified glass after rough polishing using IC series soft polishing pad and Ludox alkalescence polishing liquid, to obtain devitrified glass after finishing polish;(3) megasonic cleaning is carried out to devitrified glass after finishing polish using alkaline cleaning fluid, to obtain devitrified glass after megasonic cleaning;(4) devitrified glass after megasonic cleaning is cleaned by ultrasonic using deionized water, so as to devitrified glass after being cleaned by ultrasonic;(5) processing is dried to devitrified glass after ultrasonic cleaning, so as to devitrified glass after being polished.Polishing efficiency can be significantly improved using this method, and it is the other ultra-smooth glass surface of Subnano-class that can process roughness.

Description

Devitrified glass cmp method and devitrified glass
Technical field
The invention belongs to glass polishing field, specifically, the present invention relates to devitrified glass cmp method and Devitrified glass.
Background technology
Traditional glass polishing technique, i.e., with diamond loose abrasive, operation break-down carries out mechanical grinding to substrate on cast iron plate The face shape for reaching certain and thickness deviation are ground, is then polished using classic polishing processes or traditional two-stage polishing processes.It is classic Polishing processes are finally reached certain surface figure accuracy and surface are thick to be polished on polishing pitch disk with cerium oxide and iron oxide Rugosity, this method intricate operation and human factor account for leading, inefficient, and the roughness one of the polished surface of gained of polishing As all in nanometer scale;Traditional two-stage polishing method is:One-level polishing hard polishing pad, select conventional synthetic leather or poly- Urethane polishing pad;Two level polishing soft polishing pad, also using using very extensive non-woven fabrics or fine hair polishing pad.This method Because using conventional non-woven fabrics or fine hair polishing pad, polishing pad has chip and dropped in polishing process, and easily sample is drawn Hinder or cause other defect, and polishing time is longer, typically more than one hour, removal rate is slow, and processing efficiency is low.
Therefore, the technique of existing glass polishing is further improved.
The content of the invention
It is contemplated that at least solves one of technical problem in correlation technique to a certain extent.Therefore, the present invention One purpose is to propose a kind of devitrified glass cmp method and devitrified glass.It can be significantly improved using this method Polishing efficiency, and it is the other ultra-smooth glass surface of Subnano-class that can process roughness.
In one aspect of the invention, the present invention proposes a kind of devitrified glass cmp method, according to this hair Bright embodiment, this method include:
(1) rough polishing is carried out to devitrified glass using SUBA Series polishing pads and cerium oxide polishing slurry, to obtain rough polishing Devitrified glass after light;
(2) smart throwing is carried out to devitrified glass after the rough polishing using IC series soft polishing pad and Ludox alkalescence polishing liquid Light, to obtain devitrified glass after finishing polish;
(3) megasonic cleaning is carried out to devitrified glass after the finishing polish using alkaline cleaning fluid, to obtain megasonic cleaning Devitrified glass afterwards;
(4) devitrified glass after the megasonic cleaning is cleaned by ultrasonic using deionized water, to be cleaned by ultrasonic Devitrified glass afterwards;
(5) processing is dried to devitrified glass after the ultrasonic cleaning, so as to devitrified glass after being polished.
Devitrified glass cmp method according to embodiments of the present invention is by using SUBA Series polishing pads and oxygen Change the combination of cerium polishing fluid and carry out rough polishing, smart throwing is then carried out using IC series soft polishing pad and the combination of Ludox alkalescence polishing liquid IC series soft polishing pad during light, wherein finishing polish can make it in compression because of its unique vertical orientated gap structure Momentary recovery, while the fluid ability of Ludox alkalescence polishing liquid can be increased, and then smooth glass surface can be obtained.By This, the efficiency of polishing can have both been improved using this method, while it is the other ultra-smooth glass table of Subnano-class that can also obtain roughness Face.
In addition, devitrified glass cmp method according to the above embodiment of the present invention can also have following add Technical characteristic:
In some embodiments of the invention, in step (1), the shore hardness of the SUBA Series polishing pads is 60- 80.Thus, the quality of devitrified glass after raising polishes is advantageous to.
In some embodiments of the invention, in step (1), the granularity of the cerium oxide polishing slurry is micro- for 0.4~1.0 Rice, concentration is 5~15wt%, it is preferred that granularity is 0.7 micron, concentration 10wt%.Thus, after can further improve polishing The quality of devitrified glass.
In some embodiments of the invention, in step (1), the flow of the cerium oxide polishing slurry is 50-500ml/ min.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (1), the pressure of the rough polishing is 0.5-10psi, and the time is 20-40min.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (1), the rotating speed of rubbing head and polishing disk point in the rough polishing It is not independently 10-100r/min.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (2), the granularity of the Ludox alkalescence polishing liquid is 35-45 Nanometer.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (2), the flow of the Ludox alkalescence polishing liquid is 50- 500ml/min.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (2), the pressure of the finishing polish is 0.5-10psi, and the time is 5-30min.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (2), the rotating speed of rubbing head and polishing disk point in the finishing polish It is not independently 10-100r/min.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (3), the alkaline cleaning fluid is that pH is 9.0-10.0 Tianjin crystalline substance FA/O cleaning fluids.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (3), the concentration of the alkaline cleaning fluid is 2-10wt%.By This, can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (3), the power of mega sonic wave is 100- in the megasonic cleaning 600W, time 500-1000s.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (4), the power of ultrasonic wave is 100- in the ultrasonic cleaning 600W, time 500-1000s.Thus, it can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (5), the drying process is high temperature nitrogen drying process.By This, can further improve the quality of devitrified glass after polishing.
In some embodiments of the invention, in step (5), the temperature of the drying process is 60-90 degrees Celsius, when Between be 500-1000s.Thus, it can further improve the quality of devitrified glass after polishing.
In another aspect of the invention, the present invention proposes a kind of devitrified glass, according to an embodiment of the invention, described Devitrified glass handles to obtain using above-mentioned devitrified glass cmp method.Thus, can obtain surface roughness is The other devitrified glass of Subnano-class, meet the requirement of devitrified glass Surface Machining.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment Substantially and it is readily appreciated that, wherein:
Fig. 1 is the schematic flow sheet of devitrified glass cmp method according to an embodiment of the invention.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In one aspect of the invention, the present invention proposes a kind of devitrified glass cmp method, according to this hair Bright embodiment, with reference to figure 1, this method includes:
S100:Rough polishing is carried out to devitrified glass using SUBA Series polishing pads and cerium oxide polishing slurry
In the step, rough polishing is carried out to devitrified glass using SUBA Series polishing pads and cerium oxide polishing slurry, so as to Devitrified glass after to rough polishing.Specifically, being stirred continuously using mechanical pump to cerium oxide polishing slurry, its precipitation is prevented, is taken Devitrified glass is polished with SUBA Series polishing pads, wherein, cerium oxide polishing slurry can be recycled.Inventor has found, micro- The surface of crystal glass devitrified glass after rough polishing is estimated after using SUBA Series polishing pads and cerium oxide polishing slurry rough polishing is Through smooth, damaging layer has removed, no significant defect.Cerium oxide abrasives hardness is low, can reach the effect of " soft to throw firmly ", be polished Material surface is not likely to produce cut, when carrying out rough polishing to devitrified glass using SUBA Series polishing pads and cerium oxide polishing slurry, Cerium oxide abrasives not only play the role of mechanical grinding to devitrified glass surface, and it is anti-complexing can also to occur with devitrified glass surface Should, so as to form passivating film on devitrified glass surface faster, make it be more easy to remove.
According to one embodiment of present invention, the shore hardness of SUBA Series polishing pads is not particularly restricted, this area Technical staff can be selected according to being actually needed, according to the present invention a specific embodiment, SUBA Series polishing pads Shore hardness can be 60-80.Thus, be advantageous to improve the efficiency of rough polishing, and then be advantageous to crystallite glass after raising polishing The quality of glass.Inventor has found that the more big then SUBA Series polishing pads of shore hardness numerical value of SUBA Series polishing pads are harder, shore The size of hardness directly affects the removal amount and surface quality of devitrified glass.When the shore hardness increase of SUBA Series polishing pads When, the material removal amount increase on devitrified glass surface, while the depth of its surface tear and surface roughness also increase, and when pressure When power is larger, more serious surface damage may be brought.It should be noted that the specific shore hardness of SUBA Series polishing pads should Consider the hardness for being polished material and the hardness of polishing pad.
According to still a further embodiment, the granularity of cerium oxide polishing slurry and concentration are not particularly restricted, ability The technical staff in domain can be selected according to being actually needed, according to the specific embodiment of the present invention, cerium oxide polishing slurry Granularity can be 0.4~1.0 micron, concentration can be 5~15wt%, it is preferred that granularity is 0.7 micron, and concentration is 10wt%.Thus, the efficiency of rough polishing is can further improve, while can further improve the quality of devitrified glass after polishing.Hair A person of good sense has found, during rough polishing, the granularity of cerium oxide polishing slurry be influence devitrified glass surface finish it is important because Element, the larger cerium oxide particle of particle diameter easily causes devitrified glass surface damage, and then influences surface quality, and simultaneous oxidation cerium is thrown The height of light liquid concentration can also directly affect the removal rate and surface quality on devitrified glass surface, dense when cerium oxide polishing slurry When reaching to a certain degree, the mobility of polishing fluid can be affected degree, and mass transfer is hindered, and then polishing speed also can be by To influence.
According to still another embodiment of the invention, the flow of cerium oxide polishing slurry is not particularly restricted, the skill of this area Art personnel can be selected according to being actually needed, according to the specific embodiment of the present invention, the flow of cerium oxide polishing slurry Can be 50-500mL/min.Thus, the efficiency of rough polishing is can further improve, while can further improve crystallite glass after polishing The quality of glass.Inventor has found, if the flow of cerium oxide polishing slurry is too low, effective abrasive components in polishing fluid reduce, right The removal rate and surface quality of devitrified glass have an impact, and with the increase of cerium oxide polishing slurry flow, it is on polishing pad Mobility strengthens, and effective abrasive material and chemical composition increase in the unit interval in polishing process, reaction product can be rapid Depart from devitrified glass surface, so that polishing speed increases.But if the flow of cerium oxide polishing slurry is too high, polishing fluid is also following to be obtained And react with devitrified glass and just flow away, the effect of the chemical machinery of polishing fluid and devitrified glass can not be effectively played, make Into the waste of cerium oxide polishing slurry.
According to still another embodiment of the invention, the condition of rough polishing is not particularly restricted, those skilled in the art It can be selected according to being actually needed, according to the specific embodiment of the present invention, the pressure of rough polishing can be 0.5- 10psi, time can be 20-40min.Thus, the efficiency of rough polishing is can further improve, while after can further improve polishing The quality of devitrified glass.Inventor has found that experiment proves that the pressure of rough polishing and the removal rate on devitrified glass surface are in substantially Linear relationship, pressure is bigger, and removal rate is faster.Specifically, with the increase of rough polishing light pressure, devitrified glass surface and polishing Frictional force increase between pad, mechanism enhancing between the two, while the complexing between devitrified glass surface and cerium oxide Reaction accelerates the progress of reaction, but pressure is excessive easily devitrified glass surface is caused to damage, and makes easily against reaction potential energy barrier Obtaining cerium oxide polishing slurry can not timely enter between devitrified glass and polishing pad.
According to still another embodiment of the invention, the rotating speed of rubbing head and polishing disk is not particularly restricted in rough polishing, Those skilled in the art can be selected according to being actually needed, according to the present invention a specific embodiment, in rough polishing The rotating speed of rubbing head and polishing disk can be independently for 10-100r/min.Thus, it can further improve the effect of rough polishing Rate, while can further improve the quality of devitrified glass after polishing.Inventor's discovery, turn of rubbing head and polishing disk in rough polishing Removal rate influence of the height of speed on devitrified glass surface is smaller, with the increase of rubbing head or polishing disk rotating speed, cerium oxide Molecular kinetic energy increase in polishing fluid, anakmetomeres number increase, and mass transfer is accelerated, and reaction rate is accelerated, while also accelerates Reaction product transports.
S200:Finishing polish is carried out to devitrified glass after rough polishing using IC series soft polishing pad and Ludox alkalescence polishing liquid
In the step, using IC series soft polishing pad (being specially DOW Chemical PolitexTMReg polishing pads) and Ludox Alkalescence polishing liquid carries out finishing polish to devitrified glass after rough polishing, to obtain devitrified glass after finishing polish.Specifically, Ludox Alkalescence polishing liquid is very low to the clearance of devitrified glass, and the chemical substance in polishing fluid chemically reacts with devitrified glass, raw Into the macromolecular amine salt of solubility, reactant, collocation are can remove using the mass transfer effect of less mechanical force and abrasive material Using PolitexTMReg polishing pads, the surface quality of devitrified glass can be improved, polishing fluid can enter when polishing pad is under pressure Enter in cavity, and when pressure discharges, polishing pad can return to original shape, and old polishing fluid and reactant are discharged, and mend Fill new polishing fluid.
According to one embodiment of present invention, the granularity of Ludox alkalescence polishing liquid is not particularly restricted, this area Technical staff can be selected according to being actually needed, according to the specific embodiment of the present invention, Ludox alkalescence polishing liquid Granularity can be 35-45 nanometers.Thus, be advantageous to improve the efficiency of finishing polish, while can further improve crystallite after polishing The quality of glass.Inventor has found, during finishing polish, the granularity of Ludox alkalescence polishing liquid is to influence crystallite after rough polishing An important factor for glass surface polishing effect, devitrified glass surface is damaged after the larger silica sol granule of particle diameter easily causes rough polishing Wound, and then influence its surface quality.
According to still a further embodiment, the flow of Ludox alkalescence polishing liquid is not particularly restricted, this area Technical staff can be selected according to being actually needed, according to the present invention a specific embodiment, Ludox alkaline polishing The flow of liquid can be 50-500mL/min.Thus, the efficiency of finishing polish is can further improve, while can further improve polishing The quality of devitrified glass afterwards.Inventor has found, if the flow of Ludox alkalescence polishing liquid is too low, effective abrasive material in polishing fluid Constituent reduction, have an impact to the removal rate and surface quality of devitrified glass after rough polishing, with Ludox alkaline polishing liquid stream The increase of amount, its enhancing of mobility on polishing pad, effective abrasive material and chemical composition in the unit interval in polishing process Increase, reaction product can rapidly depart from devitrified glass surface, so that polishing speed increases.If but Ludox alkaline polishing The flow of liquid is too high, and polishing fluid also has not enough time to react with devitrified glass after rough polishing and just flowed away, polishing fluid and rough polishing Afterwards devitrified glass chemical machinery effect can not be effectively played, cause the waste of Ludox alkalescence polishing liquid.
According to still another embodiment of the invention, the condition of finishing polish is not particularly restricted, those skilled in the art It can be selected according to being actually needed, according to the specific embodiment of the present invention, the pressure of finishing polish can be 0.5- 10psi, time can be 5-30min.Thus, the efficiency of finishing polish is can further improve, while after can further improve polishing The quality of devitrified glass.Inventor has found that the removal on devitrified glass surface is fast after the pressure of experiment proof finishing polish and rough polishing Rate is substantially linear, and pressure is bigger, and removal rate is faster.Specifically, with the increase of finishing polish pressure, it is micro- after rough polishing Frictional force increase between crystal glass surface and polishing pad, mechanism enhancing between the two, while crystallite glass after rough polishing Complex reaction between glass surface and Ludox alkalescence polishing liquid accelerates the progress of reaction, but press easily against reaction potential energy barrier Power is excessive easily to be caused to damage to devitrified glass surface after rough polishing so that Ludox alkalescence polishing liquid can not timely enter rough polishing After light between devitrified glass and polishing pad.
According to still another embodiment of the invention, the rotating speed of rubbing head and polishing disk is not particularly restricted in finishing polish, Those skilled in the art can be selected according to being actually needed, according to the present invention a specific embodiment, in finishing polish The rotating speed of rubbing head and polishing disk can be independently for 10-100r/min.Thus, it can further improve the polishing of finishing polish Efficiency, while can further improve the quality of devitrified glass after polishing.Inventor has found, rubbing head and polishing disk in finishing polish Removal rate influence of the height of rotating speed on devitrified glass surface after rough polishing is smaller, with the increasing of rubbing head or polishing disk rotating speed Adding, the molecular kinetic energy increase in Ludox alkalescence polishing liquid, anakmetomeres number increases, and mass transfer is accelerated, and reaction rate is accelerated, Also accelerate transporting for reaction product simultaneously.
S300:Megasonic cleaning is carried out to devitrified glass after finishing polish using alkaline cleaning fluid
In the step, megasonic cleaning is carried out to devitrified glass after finishing polish using alkaline cleaning fluid, it is clear to obtain million sound Wash rear devitrified glass.Specifically, at normal temperatures, by devitrified glass after finishing polish as in alkaline cleaning fluid, in the work of mega sonic wave Devitrified glass after finishing polish is cleaned with lower.Thus, the residue in devitrified glass after finishing polish can be removed.
According to one embodiment of present invention, the particular type of alkaline cleaning fluid is not particularly restricted, the skill of this area Art personnel can be selected according to being actually needed, and according to the specific embodiment of the present invention, alkaline cleaning fluid can be day The FA/O cleaning fluids that Jin Jing ridges electronic material Science and Technology Ltd. provides, pH 9.0-10.0.Thus, it can further improve polishing The quality of devitrified glass afterwards.
According to still a further embodiment, the concentration of alkaline cleaning fluid is not particularly restricted, the technology of this area Personnel can be selected according to being actually needed, and according to the specific embodiment of the present invention, the concentration of alkaline cleaning fluid can be with For 2-10wt%.Thus, the efficiency of megasonic cleaning is can further improve, while can further improve the product of devitrified glass after polishing Matter.Inventor has found, if the concentration of alkaline cleaning fluid is too low, the effect of cleaning is not had, and if the concentration of alkaline cleaning fluid It is too high, then slight erosion easily is produced to devitrified glass surface after finishing polish, influence its surface quality, and alkaline cleaning fluid is dense Degree height is not easy to rinse.
According to still another embodiment of the invention, the condition of megasonic cleaning is not particularly restricted, those skilled in the art Member can be selected according to being actually needed, according to the specific embodiment of the present invention, the power of mega sonic wave in megasonic cleaning Can be 100-600W, the time can be 500-1000s.Thus, the efficiency of megasonic cleaning is can further improve, while one can be entered Step improves the quality of devitrified glass after polishing.Inventor has found that the mechanism of mega sonic wave cleaning is by high energy frequency vibration effect and combined The advantages of chemical reaction of chemical and workpiece realizes the cleaning to workpiece, and it not only saves ultrasonic wave cleaning, and Its deficiency is overcome, bubble as ultrasonic wave cleaning will not be produced, while can be with the fluid bump workpiece of high speed Surface, make the fine particles of the pollutant of surface attachment be forced to remove and enter in cleaning fluid.
S400:Devitrified glass after megasonic cleaning is cleaned by ultrasonic using deionized water
In the step, devitrified glass after megasonic cleaning is cleaned by ultrasonic using deionized water, it is ultrasonic clear to obtain Wash rear devitrified glass.Thus, the residue in devitrified glass after megasonic cleaning can further be removed.
According to one embodiment of present invention, the condition of ultrasonic cleaning is not particularly restricted, those skilled in the art It can be selected according to being actually needed, according to the specific embodiment of the present invention, the power of ultrasonic wave can in ultrasonic cleaning Think 100-600W, the time can be 500-1000s.Thus, the efficiency of ultrasonic cleaning is remarkably improved, while can further be carried The quality of devitrified glass after height polishing.Inventor has found that the power of ultrasonic wave is very big on the influence of ultrasonic wave cleaning efficiency, and cleans Effect is not necessarily completely directly proportional to ultrasonic power and scavenging period, can be quickly when the power of ultrasonic wave reaches certain value The dirt of workpiece is removed;And if power is excessive, cavitation intensity will greatly increase, can be to workpiece while cleaning performance improves Surface produces pitting, while can also reduce the life-span of supersonic cleaning machine.
S500:Processing is dried to devitrified glass after ultrasonic cleaning
In the step, processing is dried to devitrified glass after ultrasonic cleaning, so as to devitrified glass after being polished.By This, can obtain roughness is the other ultra-smooth glass surface of Subnano-class.
According to one embodiment of present invention, the concrete mode of drying process is not particularly restricted, the technology of this area Personnel can be selected according to being actually needed, and according to the specific embodiment of the present invention, drying process is done for high temperature nitrogen Dry processing.Thus, it can further improve the quality of devitrified glass after polishing.Inventor is had found, workpiece is purged using high temperature nitrogen Surface, the hydrone of workpiece surface can be made to depart from surface rapidly.
According to still a further embodiment, the condition of drying process is not particularly restricted, those skilled in the art Member can be selected according to being actually needed, and according to the specific embodiment of the present invention, the temperature of drying process can be 60- 90 degrees Celsius, the time can be 500-1000s.Thus, the efficiency of drying process is remarkably improved, so as to further improve polishing The quality of devitrified glass afterwards.Inventor has found that, if the temperature of drying process is too low, the hydrone of workpiece surface can not depart from time It workpiece surface, can adsorb in workpiece surface, be not easy to remove;And if the temperature of drying process is too high, the time is too short, then can be in workpiece Corner on produce decorative pattern.
Devitrified glass cmp method according to embodiments of the present invention is by using SUBA Series polishing pads and oxygen Change the combination of cerium polishing fluid and carry out rough polishing, smart throwing is then carried out using IC series soft polishing pad and the combination of Ludox alkalescence polishing liquid IC series soft polishing pad during light, wherein finishing polish can make it in compression because of its unique vertical orientated gap structure Momentary recovery, while the fluid ability of Ludox alkalescence polishing liquid can be increased, and then smooth glass surface can be obtained.By This, the efficiency of polishing can have both been improved using this method, while it is the other ultra-smooth glass table of Subnano-class that can also obtain roughness Face.
In another aspect of the invention, the present invention proposes a kind of devitrified glass, according to an embodiment of the invention, crystallite Glass handles to obtain using above-mentioned devitrified glass cmp method.Thus, surface roughness is can obtain to receive for Asia The other devitrified glass of meter level, meet the requirement of devitrified glass Surface Machining.It should be noted that above-mentioned be directed to devitrified glass chemistry machine Feature and advantage described by tool polishing method are equally applicable to the devitrified glass, and here is omitted.
Below with reference to specific embodiment, present invention is described, it is necessary to which explanation, these embodiments are only to describe Property, without limiting the invention in any way.
Embodiment
6 devitrified glass samples are polished, are clamped in using fixture on rubbing head, the radius of devitrified glass sample is 15mm, it is independently respectively 0.747 using the roughness on ZYGO optical surface profilers measurement devitrified glass surface before polishing μm, scanning range is 50*70 μm.
Rough polishing uses cerium oxide polishing slurry of the particle diameter for 0.7um, concentration 10wt%, it is carried out not using mechanical pump Disconnected stirring, prevents from precipitating, and the SUBA600 polishing pads that collocation shore hardness is 78 carry out rough polishing, and the pressure for controlling rough polishing is 2psi, the rotating speed of rubbing head is 87rpm, and the rotating speed of polishing disk is 93rpm, and the flow for controlling cerium oxide polishing slurry is 100ml/ Min, and cerium oxide polishing slurry recycles, and polishes 30min, then tests removal amount using weight method, calculates removal rate point Not Wei 66.92 μm/h, 66.08 μm/h, 64.92 μm/h, 68.25 μm/h, 65.73 μm/h, 65.83 μm/h, visual observations rough polishing The surface of devitrified glass is smooth after light, and damaging layer has removed, no significant defect.
Finishing polish uses the FA/O Ludox essence that particle diameter provides for 40nm Tianjin Jingling Electronic Material Technology Co., Ltd Throw liquid, pH 9.0-10.0), collocation DOW Chemical PolitexTMReg polishing pads carry out finishing polish, and the pressure for controlling finishing polish is 1psi, the rotating speed of rubbing head is 87rpm, and the rotating speed of polishing disk is 93rpm, and the flow for controlling FA/O Ludox fine polishing liquids is 150ml/min, and Ludox alkalescence polishing liquid does not recycle, and polishes 10min, then tests removal amount, meter using weight method Calculation removal rate is 6.07 μm/h, 5.99 μm/h, 5.97 μm/h, 5.78 μm/h, 5.87 μm/h, 5.82 μm/h.
At normal temperatures, it is 300 in power in the alkaline cleaning fluid for being 2wt% as concentration by devitrified glass after finishing polish Watt mega sonic wave in the presence of devitrified glass after finishing polish is cleaned, clean 900s, obtain devitrified glass after megasonic cleaning. Then devitrified glass after megasonic cleaning is cleaned by ultrasonic using deionized water, the power of ultrasonic wave is 300 watts, is cleaned by ultrasonic Time be 900s, devitrified glass after being cleaned by ultrasonic.Finally to ultrasound under the atmosphere for the nitrogen that temperature is 70 degrees Celsius Processing is dried in devitrified glass after cleaning, dries 1000s, devitrified glass after being polished.
Using the roughness on devitrified glass surface after the measurement polishing of ZYGO optical surface profilers, scanning range is 50*70 μ M, each 3 points of sample test, is averaged.Roughness test result is respectively 0.469nm, 0.471nm, 0.482nm, 0.479nm, 0.481nm, 0.476nm.Respectively less than 0.5nm, meet the requirement of devitrified glass Surface Machining.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description Point is contained at least one embodiment or example of the present invention.In this manual, to the schematic representation of above-mentioned term not Identical embodiment or example must be directed to.Moreover, specific features, structure, material or the feature of description can be with office Combined in an appropriate manner in one or more embodiments or example.In addition, in the case of not conflicting, the skill of this area Art personnel can be tied the different embodiments or example and the feature of different embodiments or example described in this specification Close and combine.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changed, replacing and modification.

Claims (10)

  1. A kind of 1. devitrified glass cmp method, it is characterised in that including:
    (1) rough polishing is carried out to devitrified glass using SUBA Series polishing pads and cerium oxide polishing slurry, after obtaining rough polishing Devitrified glass;
    (2) finishing polish is carried out to devitrified glass after the rough polishing using IC series soft polishing pad and Ludox alkalescence polishing liquid, To obtain devitrified glass after finishing polish;
    (3) megasonic cleaning is carried out to devitrified glass after the finishing polish using alkaline cleaning fluid, it is micro- after megasonic cleaning to obtain Crystal glass;
    (4) devitrified glass after the megasonic cleaning is cleaned by ultrasonic using deionized water, so as to micro- after being cleaned by ultrasonic Crystal glass;
    (5) processing is dried to devitrified glass after the ultrasonic cleaning, so as to devitrified glass after being polished.
  2. 2. according to the method for claim 1, it is characterised in that in step (1), the shore of the SUBA Series polishing pads Hardness is 60-80;
    Optional, the granularity of the cerium oxide polishing slurry is 0.4~1.0 micron, and concentration is 5~15wt%, it is preferred that granularity is 0.7 micron, concentration 10wt%;
    Optional, the flow of the cerium oxide polishing slurry is 50-500ml/min.
  3. 3. according to the method for claim 2, it is characterised in that in step (1), the pressure of the rough polishing is 0.5- 10psi, time 20-40min;
    It is optional, in the rough polishing rotating speed of rubbing head and polishing disk independently for 10-100r/min.
  4. 4. according to the method for claim 1, it is characterised in that in step (2), the grain of the Ludox alkalescence polishing liquid Spend for 35-45 nanometers;
    Optional, the flow of the Ludox alkalescence polishing liquid is 50-500ml/min.
  5. 5. according to the method for claim 4, it is characterised in that in step (2), the pressure of the finishing polish is 0.5- 10psi, time 5-30min;
    It is optional, in the finishing polish rotating speed of rubbing head and polishing disk independently for 10-100r/min.
  6. 6. according to the method for claim 1, it is characterised in that in step (3), the alkaline cleaning fluid is that pH is 9.0- 10.0 FA/O cleaning fluids;
    Optional, the concentration of the alkaline cleaning fluid is 2-10wt%.
  7. 7. according to the method for claim 6, it is characterised in that in step (3), the work(of mega sonic wave in the megasonic cleaning Rate is 100-600W, time 500-1000s.
  8. 8. according to the method for claim 1, it is characterised in that in step (4), the work(of ultrasonic wave in the ultrasonic cleaning Rate is 100-600W, time 500-1000s.
  9. 9. according to the method for claim 1, it is characterised in that in step (5), the drying process is done for high temperature nitrogen Dry processing;
    Optional, the temperature of the drying process is 60-90 degrees Celsius, time 500-1000s.
  10. 10. a kind of devitrified glass, it is characterised in that the devitrified glass is using micro- any one of claim 1-9 Crystal glass cmp method handles what is obtained.
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CN109396967A (en) * 2018-12-12 2019-03-01 中国电子科技集团公司第四十六研究所 A kind of cmp method for cadmium selenide crystal
CN109719081A (en) * 2018-12-29 2019-05-07 华中光电技术研究所(中国船舶重工集团有限公司第七一七研究所) A kind of cleaning method of devitrified glass
CN111229705A (en) * 2020-01-20 2020-06-05 东莞市晶博光电有限公司 Method for cleaning screen glass
CN111811904A (en) * 2020-07-17 2020-10-23 安徽工业大学 Preparation method of GCr15 high-temperature laser confocal in-situ dynamic observation sample
CN112355861A (en) * 2020-10-08 2021-02-12 中山市光大光学仪器有限公司 Special material polishing process
CN112792711A (en) * 2020-12-31 2021-05-14 武汉风帆电化科技股份有限公司 Crystal silicon wafer alkali polishing device and polishing process
CN113103077A (en) * 2021-04-13 2021-07-13 深圳微米智能装备科技有限公司 Microcrystalline glass processing equipment and processing method
CN113618497A (en) * 2021-07-09 2021-11-09 维达力实业(赤壁)有限公司 Polishing liquid for polishing microcrystalline ceramic and microcrystalline ceramic polishing method
CN114850127A (en) * 2022-05-30 2022-08-05 福建晶安光电有限公司 Cleaning process of filter substrate
CN115256122A (en) * 2022-09-20 2022-11-01 齐鲁中科光物理与工程技术研究院 Polishing method for quickly removing surface defects of optical element
CN115256061A (en) * 2022-08-19 2022-11-01 潘芳琳 Microcrystalline cover plate production process

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CN109396967B (en) * 2018-12-12 2020-10-02 中国电子科技集团公司第四十六研究所 Chemical mechanical polishing method for cadmium selenide crystal
CN109396967A (en) * 2018-12-12 2019-03-01 中国电子科技集团公司第四十六研究所 A kind of cmp method for cadmium selenide crystal
CN109719081A (en) * 2018-12-29 2019-05-07 华中光电技术研究所(中国船舶重工集团有限公司第七一七研究所) A kind of cleaning method of devitrified glass
CN109719081B (en) * 2018-12-29 2021-07-06 华中光电技术研究所(中国船舶重工集团有限公司第七一七研究所) Method for cleaning microcrystalline glass
CN111229705B (en) * 2020-01-20 2021-03-30 东莞市晶博光电股份有限公司 Method for cleaning screen glass
CN111229705A (en) * 2020-01-20 2020-06-05 东莞市晶博光电有限公司 Method for cleaning screen glass
CN111811904A (en) * 2020-07-17 2020-10-23 安徽工业大学 Preparation method of GCr15 high-temperature laser confocal in-situ dynamic observation sample
CN112355861A (en) * 2020-10-08 2021-02-12 中山市光大光学仪器有限公司 Special material polishing process
CN112792711A (en) * 2020-12-31 2021-05-14 武汉风帆电化科技股份有限公司 Crystal silicon wafer alkali polishing device and polishing process
CN112792711B (en) * 2020-12-31 2022-05-17 武汉风帆电化科技股份有限公司 Crystal silicon wafer alkali polishing device and polishing process
CN113103077A (en) * 2021-04-13 2021-07-13 深圳微米智能装备科技有限公司 Microcrystalline glass processing equipment and processing method
CN113618497A (en) * 2021-07-09 2021-11-09 维达力实业(赤壁)有限公司 Polishing liquid for polishing microcrystalline ceramic and microcrystalline ceramic polishing method
CN114850127A (en) * 2022-05-30 2022-08-05 福建晶安光电有限公司 Cleaning process of filter substrate
CN114850127B (en) * 2022-05-30 2024-03-15 福建晶安光电有限公司 Filter substrate cleaning process
CN115256061A (en) * 2022-08-19 2022-11-01 潘芳琳 Microcrystalline cover plate production process
CN115256122A (en) * 2022-09-20 2022-11-01 齐鲁中科光物理与工程技术研究院 Polishing method for quickly removing surface defects of optical element

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