CN108098460A - A kind of chemical modification liquid and the fine grinding processing method of chemical machinery - Google Patents
A kind of chemical modification liquid and the fine grinding processing method of chemical machinery Download PDFInfo
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- CN108098460A CN108098460A CN201711339341.1A CN201711339341A CN108098460A CN 108098460 A CN108098460 A CN 108098460A CN 201711339341 A CN201711339341 A CN 201711339341A CN 108098460 A CN108098460 A CN 108098460A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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Abstract
The invention discloses a kind of chemical modification liquid and the fine grinding processing method of chemical machinery for the processing of the silicon substrates hard brittle material micro parts such as silicon, carborundum, quartz glass.The chemical modification liquid consists of the following compositions as mass fraction：10~20 parts of sodium carbonate；10~20 parts of hydrogen peroxide；2~4 parts of sodium tungstates；2~4 parts of triethanolamines；2~4 parts of diethanol amine；4~8 parts of polyethylene glycol；4~8 parts of hexamethylenetetramines；4~8 parts of benzotriazole；1~2 part of disodium ethylene diamine tetraacetate；2~4 parts of alkylphenol polyoxyethylene ether；2~4 parts of barium mahogany sulfonates；2~4 parts of petrolic magnesium sulfonates；2~4 parts of mahogany acid amine；2~4 parts of mahogany acid ammoniums；90~180 parts of deionized waters, the chemical modification liquid is in the fine grinding of silica-base material micro parts, softening workpiece material can be modified, it is processed so as to fulfill the high geometric accuracy of silica-base material labyrinth micro parts, great surface quality and high efficiency, and processing method is simple and convenient, it is of low cost, fully meet industrialization production requirements.
Description
Technical field
The present invention relates to accurate grinding processing technique fields, and in particular to a kind of chemical modification liquid and the fine mill of chemical machinery
Cut processing method.
Background technology
At present, as the silicon substrates such as silicon, carborundum, quartz glass hard brittle material is in ultraprecise labyrinth micro parts
Increasingly extensive application, the contradiction between machining accuracy, processing efficiency and actual demand are increasingly prominent.In order to realize hard brittle material
High dimensional accuracy and the great surface quality requirement of micro parts, recent domestic researcher proposes micro- using ultra-fine abrasive material
Grinding tool (micro- bistrique) carries out the fine grinding technique of ultraprecise of micro- nano-precision processing.Though it is had become using fine grinding
Work(realization hard brittle material micro parts photoelectric elements surface roughness, but the crackle of still unresolved micro-structure corner angle side sword,
The machining damages defect problem such as chipping, unfilled corner.
In order to realize the high machined surface quality of silicon substrate hard brittle material micro parts, flash sword precision and high efficiency processing,
Domestic and international researcher successively proposes the removal processing of ductility domain, optimizes fine grinding process, improves micro- main shaft and micro- frotton
The methods of energy, but still have the machining damages such as crackle, chipping, the unfilled corner of micro-structure corner angle side sword.
Domestic and international researcher has found to be extremely difficult to few/not damaged processing request by single mechanism.Because
In material removal process, at least need to separate surface input with chip to workpiece and be equivalent to materials chemistry bonding energy with depending on
The machining energy of the sum of the surface barrier energy of the factors such as temperature, chemical balance degree and reaction speed.If by physics chemical action, table
The effects that face active effect, abrasive particle rub/scratch is combined, and will significantly reduce the machining damage of part.Such as pass through abrasive particle-work
Machinery, chemical action between part-processing environment realize the chemically mechanical polishing (Chemical of the rotten removal of rapidoprint softening
Mechanical Planarization, CMP) method；And with workpiece material solid phase occurs for abrasive material under dry-type processing state
Reaction, then be ground by the chemical machinery of abrasive particle mechanical removal reaction product (Chemo-Mechanical Grinding,
CMG) method.Numerous studies show that the chemical machinings such as CMP, CMG technology passes through the multi-energies compound action such as power, heat, chemistry
The effect of mechanical force in material removal process is weakened, can realize effective control to surface/sub-surface machining damage.But
The chemical machinings technology such as CMP, CMG be currently only used for the hard brittle materials such as silicon chip, glass planarization processing in, yet there are no by
Chemical machining technology is applied to the fine grindings of three-dimensional microstructures such as microflute, micropore, the micro prism of hard brittle material micro parts
The correlative study report of processing.
In conclusion for the demand processed using increasingly extensive silicon substrate hard brittle material micro parts, it is necessary to develop one
Kind high precision machining, machined surface quality and processing efficiency disclosure satisfy that the new side of low cost processing of industrialization production requirements
Method.
The content of the invention
It is an object of the invention to provide a kind of chemical modification liquid and the fine grinding processing method of chemical machinery, the modification liquids
Biochemical reaction can be issued in grinding heat and mechanical stress effect with silica-base materials such as silicon, carborundum, quartz glass, generate silicic acid
Salt deposit modifier reduces material surface layer hardness.By the way that power, heat, chemical multi-energy compound action is cooperateed with to weaken material and removed
Mechanical force in journey, so as to decrease or even eliminate corner angle side sword and processing table in the fine grinding process of silicon substrate hard brittle material
Micro- chipping in face, the machining damage of nick hole micro-crack, realize the high geometric accuracy of silicon substrate hard brittle material micro parts, high surface
Quality and high efficiency processing.
In order to solve the above-mentioned technical problem, the present invention adopts the following technical scheme that：
A kind of chemical modification liquid and the fine grinding processing method of chemical machinery, it is characterised in that the chemical modification liquid
Ingredient and its mass fraction are as follows：10~20 parts of sodium carbonate；10~20 parts of hydrogen peroxide；2~4 parts of sodium tungstates；2~4 part of three second
Hydramine；2~4 parts of diethanol amine；4~8 parts of polyethylene glycol；4~8 parts of hexamethylenetetramines；4~8 parts of benzotriazole；1~2 part
Disodium ethylene diamine tetraacetate；2~4 parts of alkylphenol polyoxyethylene ether；2~4 parts of barium mahogany sulfonates；2~4 parts of petrolic magnesium sulfonates；2
~4 parts of mahogany acid amine；2~4 parts of mahogany acid ammoniums；90~180 parts of deionized waters, the chemical modification liquid is for described
The fine grinding processing method of chemical machinery, the chemical modification liquid can under the conditions of grinding force, grinding heat coupling
It is chemically reacted with silica-base materials such as silicon, carborundum, quartz glass, generates hardness and the smaller silicate layer of brittleness.
The specific implementation step of the fine grinding processing method of the chemical machinery is as follows：
1) processed micro parts are fixed on the table, is being wanted using chemical modification liquid described in claim 1
Working position is locally supplying；
2) the fine part during grinding of micro- bistrique is used, chemical modification liquid is in mechanical stress, grinding heat coupling condition
Lower and material work surface reaction generation silicate layer, the silicate layer remove under abrasive particle mechanism, micro- bistrique grinding
Depth is less than thickness of silicate layer；
3) 1)~2) step synchronization implementation, is repeated, until machine-shaping, but leave 1~10 μm of allowance layer；
4) supply chemical modification liquid is stopped；
5) continue to remove remaining silicate layer using the grinding of micro- bistrique, until processing shaping completely.
6) sundries on processing part surface is cleaned, is machined.
A diameter of 0.1~the 10mm of micro- bistrique.
The object of chemical modification liquid grinding application fine with the chemical machinery is silicon, carborundum, quartzy glass
Glass etc. can generate the silicon substrate hard brittle material micro parts of silicate by the chemical modification liquid.
The chemical modification liquid cannot be only used in the fine grinding of chemical machinery of the present invention, it can also be used to its
In his chemical machining technology, such as (CMP) is chemically-mechanicapolish polished.
Compared with the prior art, chemical modification liquid of the present invention has the advantage that：
(1) under grinding heat and mechanical stress effect, chemical modification liquid occurs chemistry to workpiece surface processing layer material and changes
Property reaction, generate than silicon, carborundum and the lower silicate layer of quartz glass hardness.Mechanical removal is weakened under chemical cooperated effect
Stress can reduce the machining damage for even eliminating surface/sub-surface, such as the nick hole on surface, micro-crack, improve fine grinding
Machined surface quality.Pass through the removal of lower tensile strength modified layer, can effectively protect hard brittle material micro parts corner angle side sword
Form accuracy, achieve the purpose that reduce the machining damages defects such as crackle, chipping, the unfilled corner for even eliminating corner angle sides sword.
(2) compared to single fine grinding, by chemical modification increase material it is crisp-the removal transformation of ductility domain is critical cuts
Deep condition, so as to improve material remove rate.Chemical modification liquid contributes to the modifying function of workpiece material to weaken micro- bistrique
The mechanical force of ultra-fine abrasive particle in fine grinding process can effectively alleviate the breakage of abrasive particle, be broken and come off, extend micro- mill
The service life of head.
(3) chemical modification liquid of the present invention only works as reaction at room temperature to keeing relative stability property of workpiece material
Just reach chemical modification purpose when temperature and stress condition reache a certain level, i.e., only in working position feed flow, in grinding heat, micro-
Workpiece material is chemically modified generation silicate layer under bistrique machinery stress, and is then mechanically gone by micro- bistrique
It removes.Part remains to keep the original excellent physical mechanical property of workpiece material after processing.
(4) chemical modification condition is simple, only passes through the mechanical stress and grinding heat offerization of the micro- bistrique generation of fine grinding
The chemical reaction energy needed for modification liquid is learned, without other forms energy input as modified condition.
(5) chemical modification liquid service life of the present invention is long, and the pH stable of chemical modification liquid is 8~10 before reaction
In the range of, modified recovered liquid pH value tends to 7.The corrosive substance of damage health is not contained in chemical modification liquid, recycles nothing
Evilization processing is simple, non-hazardous to human body and environment.
In conclusion a kind of chemical modification liquid proposed by the invention and the fine grinding processing method of chemical machinery, it can
Realize the high geometric accuracy of the silicon substrates hard brittle material ultraprecise labyrinth micro parts such as silicon, carborundum, quartz glass, high surface
Quality and high efficiency processing, and processing method is simple and convenient, it is at low cost, fully meet industrialization production requirements.
Description of the drawings
Fig. 1 is that chemical machinery of the present invention-mechanochemistry cooperates with fine grinding processing method flow chart of steps.
Specific embodiment
The specific embodiment of the present invention is described in aggregate embodiment below, to be better understood from the present invention.
Chemical modification liquid in the present embodiment and the fine grinding processing method of chemical machinery, as mass fraction by below into
It is grouped into：10~20 parts of sodium carbonate；10~20 parts of hydrogen peroxide；2~4 parts of sodium tungstates；2~4 parts of triethanolamines；2~4 parts of diethyls
Hydramine；4~8 parts of polyethylene glycol；4~8 parts of hexamethylenetetramines；4~8 parts of benzotriazole；1~2 part of ethylenediamine tetra-acetic acid two
Sodium；2~4 parts of alkylphenol polyoxyethylene ether；2~4 parts of barium mahogany sulfonates；2~4 parts of petrolic magnesium sulfonates；2~4 parts of mahogany acid amine；
2~4 parts of mahogany acid ammoniums；90~180 parts of deionized waters.The above-mentioned fine grinding processing method of chemical machinery is as follows：
By processed micro parts fix on the table, the chemical modification liquid by independent liquid-supplying system to silicon,
The silicon substrates micro parts working position part feed flow such as carborundum and quartz glass.It should be noted that the spy according to processing part
Selection of dimension chemical modification liquid feed flow jet size is levied, while controls chemical modification liquid feed flow flow and flow rate, in order to avoid cross polyvoltine
Modification liquid is learned to flow into and influence non-processing position.
Chemical modification liquid will be in front of workpieces processing position, and with micro- bistrique simultaneously for the micro- grinding tool of nozzle for liquid face diamond
Feed motion, as shown in Fig. 1 (a).In process, the material and chemical modification liquid at position to be processed are in grinding heat, micro- mill
Occur chemical modification reaction under the conditions of the energy input of head mechanical stress, generate the silicate layer of 1~1000 μ m-thick, and silicic acid
The hardness of salt is much smaller than the original hardness of workpiece material.
The hardness of chemically modified layer declines, increase material it is crisp-removal of ductility domain changes critical cutting-in condition, contribute to reality
Existing workpiece material removes pattern in fine grinding process from brittle fracture removal Mode change for ductility domain.Zero can not only be improved
The machined surface quality of part, and the percussion suffered by abrasive particle is also reduced, be conducive to the extension of micro- bistrique service life.
The silicate layer of removal modified layer generation is ground using micro- bistrique, grinding depth is less than thickness of silicate layer.According to
Micro parts labyrinth size to be processed, the continuous chemical modification that carries out are removed with fine grinding, and actually the two is synchronous
It carries out, as shown in Fig. 1 (b).Until machine-shaping, but while leaving 1~10 μm of allowance layer, stops supply chemical modification liquid.
Although stopping supply chemical modification liquid, processed body structure surface still leaves residual silicate layer.At this point, still
Continue to finish using micro- bistrique.Finally, using cleaning workpieces such as acetone soln, deionized waters, the organic of surface is removed
Object, dust and residual oxide etc..So far, all machine, required part is obtained, as shown in Fig. 1 (c).
Used chemical modification liquid is in alkalescent, if to increase modified layer depth or thickness, i.e. thickness of silicate layer,
* OH in modification liquid can be improved by Fenton methods, oxidation flocculation method, Ozone, sonication and photocatalytic method etc. to contain
Amount, but specifically to be determined according to workpiece and operating mode.
With silica-base material under the conditions of grinding heat, mechanical stress solid-liquid phase reaction occurs for chemical modification liquid in the technical program
The specific principle of reflection it is following (reaction is such as the principle in CMP):
(Si、SiC)+*OH+O2→SiO2+H2O+CO2
SiO2+OH-→SiO2-3+H2O
For the control of chemical modification liquid pH value in 8-10 scopes in alkalescent, reaction condition controls the peroxidating in chemical modification liquid
Hydrogen enhances oxidation modification ability to * OH Directional Decompositions.The silicic acid carbonate hardness of generation is far below part material original hardness number, therefore
Can the more efficient removal under micro- bistrique mechanical stress, and do not sacrifice machining accuracy.After chemical modification, recovered liquid pH value tends to 7 and is in
Neutrality will not generate further corrosion contamination to workpiece material and machine tool, ensure that the environmentally protective of the process
Type.
The present invention can be with processed complex structure micro parts and chemical machining, mechanization mainly in conjunction with fine grinding
Part high manufacturing accuracy, the advantage of high machined surface quality can be realized by learning processing.Fine grinding process has ensured hard brittle material
The geometric accuracy of micro parts processing；Grinding heat, the mechanical stress of micro- bistrique provide reaction institute for the chemical modification of workpiece material
Need energy environment；Chemical modification reaction product reduces the difficulty of mechanical removal, improves processing quality.It can be seen that this
Invention is fully able to realize the high geometric accuracy of silica-base material labyrinth micro parts, great surface quality and high efficiency processing,
And processing method is simple and convenient, and it is of low cost, fully meet industrialization production requirements.
It should be noted that used by above-mentioned fine grinding processing method micro- bistrique part a diameter of 0.1~
10mm.It is described above to be not in relation to chemical modification layer depth, chemical modification liquid supplying device, fine micro- bistrique size of grinding etc.
Limitation of the invention, on the premise of the creation design of the present invention is not departed from, any obvious processing capacity, feed flow side
The replacements such as formula, grinding tool size are within protection scope of the present invention.
Above-mentioned chemical modification liquid cannot be only used in the fine grinding of chemical machinery of the present invention, it can also be used to its
In his chemical machining technology, such as (CMP) is chemically-mechanicapolish polished.
Claims (5)
1. a kind of chemical modification liquid and the fine grinding processing method of chemical machinery, it is characterised in that the chemical modification liquid into
Divide and its mass fraction is as follows：10~20 parts of sodium carbonate；10~20 parts of hydrogen peroxide；2~4 parts of sodium tungstates；2~4 part of three ethyl alcohol
Amine；2~4 parts of diethanol amine；4~8 parts of polyethylene glycol；4~8 parts of hexamethylenetetramines；4~8 parts of benzotriazole；1~2 part of second
Edetate disodium；2~4 parts of alkylphenol polyoxyethylene ether；2~4 parts of barium mahogany sulfonates；2~4 parts of petrolic magnesium sulfonates；2~4
Part mahogany acid amine；2~4 parts of mahogany acid ammoniums；90~180 parts of deionized waters, the chemical modification liquid are used for the change
Learn the fine grinding processing method of machinery, the chemical modification liquid can be under the conditions of mechanical stress, grinding heat coupling
The silica-base materials such as silicon, carborundum, quartz glass chemically react, and generate hardness and the smaller silicate layer of brittleness.
2. chemical modification liquid according to claim 1 and the fine grinding processing method of chemical machinery, which is characterized in that described
The fine grinding processing method of chemical machinery specific implementation step it is as follows：
1) processed micro parts are fixed on the table, using chemical modification liquid described in claim 1 to be processed
Position is locally supplying；
2) use the fine part during grinding of micro- bistrique, chemical modification liquid under the conditions of mechanical stress, grinding heat coupling with
Material work surface reaction generation silicate layer, the silicate layer remove under abrasive particle mechanism, micro- bistrique grinding depth
Less than thickness of silicate layer；
3) 1)~2) step synchronization implementation, is repeated, until machine-shaping, but leave 1~10 μm of allowance layer；
4) supply chemical modification liquid is stopped；
5) continue to remove remaining silicate layer using the grinding of micro- bistrique, until processing shaping completely.
6) sundries on processing part surface is cleaned, is machined.
3. chemical modification liquid according to claim 2 and the fine grinding processing method of chemical machinery, which is characterized in that described
Micro- a diameter of 0.1~10mm of bistrique.
4. chemical modification grinding fluid according to claim 3 and the fine grinding processing method of chemical machinery, which is characterized in that
The object of chemical modification liquid grinding application fine with the chemical machinery can for silicon, carborundum, quartz glass etc.
The silicon substrate hard brittle material micro parts of silicate are generated by the chemical modification liquid.
5. chemical modification liquid according to claim 4, which is characterized in that the chemical modification liquid cannot be only used for the present invention
In the fine grinding of the chemical machinery, it can also be used in other chemical machining technologies, such as chemically-mechanicapolish polish
(CMP)。
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109454542A (en) * | 2018-11-23 | 2019-03-12 | 湖南航天环宇通信科技股份有限公司 | A kind of method of surface finish and its process equipment of infrared polycrystalline thin-walled parts |
| CN110842761A (en) * | 2019-11-19 | 2020-02-28 | 湖南大学 | Photocatalysis high-energy field assisted chemical mechanical composite fine grinding method |
| WO2020120522A1 (en) * | 2018-12-12 | 2020-06-18 | Basf Se | Chemical mechanical polishing of substrates containing copper and ruthenium |
| WO2020120520A1 (en) * | 2018-12-12 | 2020-06-18 | Basf Se | Chemical mechanical polishing of substrates containing copper and ruthenium |
| CN111558851A (en) * | 2020-04-16 | 2020-08-21 | 南方科技大学 | Grinding method and grinding device |
| CN113635144A (en) * | 2021-08-17 | 2021-11-12 | 上海交通大学 | Dry type modified grinding method and system for hard and brittle material |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005112917A (en) * | 2003-10-03 | 2005-04-28 | Mitsubishi Electric Corp | Slurry for cutting silicon ingot and method for cutting silicon ingot therewith |
| CN1958233A (en) * | 2006-11-08 | 2007-05-09 | 大连理工大学 | Scatheless grinding method for rigid, fragile crystal wafer |
| CN101797709A (en) * | 2010-04-12 | 2010-08-11 | 天津大学 | Composite grinding method for large-caliber quartz glass substrate |
| CN102559354A (en) * | 2010-12-30 | 2012-07-11 | 安集微电子（上海）有限公司 | Water-based glass grinding fluid |
| CN102977987A (en) * | 2012-12-04 | 2013-03-20 | 天津大学 | Special grinding fluid for ductile regime lapping of optical glass and preparation method of special grinding fluid |
| CN106675749A (en) * | 2016-11-02 | 2017-05-17 | 清华大学天津高端装备研究院 | Fully-synthetic water-based glass grinding fluid and preparation method thereof |
-
2017
- 2017-12-14 CN CN201711339341.1A patent/CN108098460A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005112917A (en) * | 2003-10-03 | 2005-04-28 | Mitsubishi Electric Corp | Slurry for cutting silicon ingot and method for cutting silicon ingot therewith |
| CN1958233A (en) * | 2006-11-08 | 2007-05-09 | 大连理工大学 | Scatheless grinding method for rigid, fragile crystal wafer |
| CN101797709A (en) * | 2010-04-12 | 2010-08-11 | 天津大学 | Composite grinding method for large-caliber quartz glass substrate |
| CN102559354A (en) * | 2010-12-30 | 2012-07-11 | 安集微电子（上海）有限公司 | Water-based glass grinding fluid |
| CN102977987A (en) * | 2012-12-04 | 2013-03-20 | 天津大学 | Special grinding fluid for ductile regime lapping of optical glass and preparation method of special grinding fluid |
| CN106675749A (en) * | 2016-11-02 | 2017-05-17 | 清华大学天津高端装备研究院 | Fully-synthetic water-based glass grinding fluid and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 彭丽英，周俊华等: "《机械制造技术》", 31 August 2016 * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109454542A (en) * | 2018-11-23 | 2019-03-12 | 湖南航天环宇通信科技股份有限公司 | A kind of method of surface finish and its process equipment of infrared polycrystalline thin-walled parts |
| WO2020120522A1 (en) * | 2018-12-12 | 2020-06-18 | Basf Se | Chemical mechanical polishing of substrates containing copper and ruthenium |
| WO2020120520A1 (en) * | 2018-12-12 | 2020-06-18 | Basf Se | Chemical mechanical polishing of substrates containing copper and ruthenium |
| CN113195656A (en) * | 2018-12-12 | 2021-07-30 | 巴斯夫欧洲公司 | Chemical mechanical polishing of copper and ruthenium containing substrates |
| CN113195657A (en) * | 2018-12-12 | 2021-07-30 | 巴斯夫欧洲公司 | Chemical mechanical polishing of copper and ruthenium containing substrates |
| US11725117B2 (en) | 2018-12-12 | 2023-08-15 | Basf Se | Chemical mechanical polishing of substrates containing copper and ruthenium |
| CN110842761A (en) * | 2019-11-19 | 2020-02-28 | 湖南大学 | Photocatalysis high-energy field assisted chemical mechanical composite fine grinding method |
| CN111558851A (en) * | 2020-04-16 | 2020-08-21 | 南方科技大学 | Grinding method and grinding device |
| CN111558851B (en) * | 2020-04-16 | 2022-04-15 | 南方科技大学 | Grinding method and grinding device |
| CN113635144A (en) * | 2021-08-17 | 2021-11-12 | 上海交通大学 | Dry type modified grinding method and system for hard and brittle material |
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Application publication date: 20180601 |