CN109560101B - 发光二极管显示装置及其制造方法 - Google Patents
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Abstract
发光二极管显示装置包括第一基板、多个发光二极管、粘着层、彩色层及第二基板。第一基板具有多个开关元件。发光二极管包括第一半导体层、多个第二半导体层、多个发光层、第一电极及多个第二电极。第一电极配置于第一半导体层上。第二电极分别配置于对应的第二半导体层上。第二电极分别电性连接于对应的开关元件。粘着层与第一基板分别位于发光二极管的相对两侧。彩色层配置于第一基板上,并覆盖粘着层及发光二极管。彩色层包括多个彩色单元以及多个阻挡层。各阻挡层配置于各彩色单元之间。第二基板与第一基板相对设置。
Description
技术领域
本发明是有关于一种显示装置,且特别是有关于一种发光二极管显示装置。
背景技术
虽然市场上主流的显示器是以液晶显示器、有机发光二极管显示器为大宗,但随着科技的进步,许多光电元件的体积也逐渐往小型化发展。而作为液晶显示器的背光源的发光二极管在小型化之后,可被分区为较小的单元并可操作其明暗。因此,使得小型化的发光二极管可应用于高动态范围(High Dynamic Range,HDR)技术或是进一步作为显示器。然而,将小型化的发光二极管应用作为显示器仍面临有许多的问题,特别是在封装后的发光二极管元件的巨量转移过程中,常会有不易进行巨量转移,甚至有巨量转移良率不佳的问题。
发明内容
本发明提供一种发光二极管显示装置,可提供宽色域的色彩规格。
本发明另提供一种发光二极管显示装置的制造方法,可用于制造上述的发光二极管显示装置,并可改善巨量转移的良率。
本发明的一种发光二极管显示装置包括第一基板、多个发光二极管、粘着层、彩色层以及第二基板。第一基板具有多个开关元件。发光二极管包括第一半导体层、多个第二半导体层、多个发光层、第一电极以及多个第二电极。发光层分别配置于第一半导体层与对应的第二半导体层之间。第一电极配置于第一半导体层上。第二电极分别配置于对应的第二半导体层上。第二电极分别电性连接于对应的开关元件。粘着层配置于第一基板上。粘着层与第一基板分别位于发光二极管的相对两侧。彩色层配置于第一基板上,并覆盖粘着层及发光二极管。彩色层包括多个彩色单元以及多个阻挡层,且各阻挡层配置于各彩色单元之间。第二基板与第一基板相对设置,且第二基板覆盖彩色层、粘着层以及发光二极管。
本发明的一种发光二极管显示装置的制造方法,包括以下步骤:形成第一组件、形成第二组件以及使第一组件与第二组件相对设置。其中,形成第一组件包括以下步骤:提供第一基板,且第一基板具有多个开关元件;形成多个发光二极管于成长基板上;转移发光二极管至第一基板上;以及形成粘着层于第一基板上,其中粘着层与第一基板分别位于发光二极管的相对两侧。形成第二组件包括以下步骤:提供第二基板;以及形成彩色层于第二基板上,其中彩色层包括多个彩色单元以及多个阻挡层,且各阻挡层配置于各彩色单元之间。使第一组件与第二组件相对设置,其中彩色层覆盖粘着层及发光二极管,且第二基板覆盖彩色层、粘着层以及发光二极管。
在上述实施例之一的发光二极管显示装置可提供宽色域的色彩规格。
在上述实施例之一的发光二极管显示装置的制造方法可改善巨量转移的良率。
以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。
附图说明
图1A为本发明一实施例的一种发光二极管显示装置的俯视示意图。
图1B为图1A的发光二极管显示装置沿I-I’剖线的剖面示意图。
图1C为图1B的区域A的放大图。
图1D与图1E为本发明多个实施例的一种微型发光二极管发光二极管显示装置的剖面示意图。
图2A至图2F为本发明一实施例的一种发光二极管显示装置的制造方法的剖面示意图。
图3A至图3E为本发明另一实施例的一种发光二极管显示装置的制造方法的剖面示意图。
图4为本发明另一实施例的一种微型发光二极管显示装置的剖面示意图。
其中,附图标记:
10、10a、10b、10c、10d、10e:发光二极管显示装置
101b:第一组件
102b:第二组件
110:第一基板
112a、112b:开关元件
114:绝缘层
115:开关元件区
120:发光二极管
121:第一半导体层
122a、122b:第二半导体层
123a、123b:发光层
124:第一电极
125a、125b:第二电极
126:绝缘层
130:粘着层
140:彩色层
142a、142b、142c:彩色单元
1421a、1422b、1421c:彩色滤光层
1422a、1422b:荧光材料层
144:阻挡层
150:第二基板
160:胶层
170:荧光材料层
A:区域
E1:显示区
P1、P2:像素单元
SB:基底
T1:非显示区
具体实施方式
下面结合附图对本发明的结构原理和工作原理作具体的描述:
图1A为本发明一实施例的一种发光二极管显示装置的俯视示意图。图1B为图1A的发光二极管显示装置沿I-I’剖线的剖面示意图。图1C为图1B的区域A的放大图。为了方便说明,图1A中的发光二极管显示装置10省略示出了粘着层130及第二基板150。
请同时参照图1A至图1C,本实施例的发光二极管显示装置10包括第一基板110、多个发光二极管120(图1A示意地示出为多个)、粘着层130、彩色层140及第二基板150。第一基板110具有多个开关元件112a、112b(图1C示意地示出为2个)。每个发光二极管120包括第一半导体层121、多个第二半导体层122a、122b(图1C示意地示出为2个)、多个发光层123a、123b(图1C示意地示出为2个)、第一电极124、多个第二电极125a、125b(图1C示意地示出为2个)及绝缘层126。发光层123a(或发光层123b)配置于第一半导体层121与对应的第二半导体层122a(或第二半导体层122b)之间。第一电极124配置于第一半导体层121上并适于接收一电压。第二电极125a、125b分别配置于对应的第二半导体层122a、122b上。第二电极125a、125b分别电性连接于对应的第二半导体层122a、122b与对应的开关元件112a、112b。粘着层130配置于第一基板110上,且粘着层130与第一基板110分别位于发光二极管120的相对两侧。彩色层140配置于第一基板110上,并覆盖粘着层130及发光二极管120。彩色层140包括多个彩色单元142a、142b(图1C示意地示出为2个)以及多个阻挡层144(图1C示意地示出为3个),且各阻挡层144配置于各彩色单元142a、142b之间。第二基板150与第一基板110相对设置,且第二基板150覆盖彩色层140、粘着层130以及发光二极管120。
具体来说,请继续参照图1A,发光二极管显示装置10包括多个像素单元P1、P2,且像素单元P1、P2分别包括显示区E1、E2与非显示区T1、T2。此处,每个像素单元P1、P2的大小例如是介于40微米至400微米之间,较佳地,例如是317.5微米。在本实施例中,非显示区T1可为透明区,使得发光二极管显示装置10的透光度例如是大于60%。
请再参照图1B与图1C,彩色层140配置于第二基板150与发光二极管120之间,彩色层140中的每一个彩色单元142a、142b与每一个阻挡层144交替排列。需要注意的是,在区域A中,彩色单元142a对应于发光二极管120的发光层123a设置,且彩色单元142b对应于发光二极管120的发光层123b设置,以使得发光层123a发出的光可经由彩色单元142a来显示,且发光层123b发出的光可经由彩色单元142b来显示。更具体来说,彩色单元142a包括彩色滤光层1421a及荧光材料层1422a,且第二基板150与荧光材料层1422a分别位于彩色滤光层1421a的相对两侧。彩色单元142b包括彩色滤光层1421b及荧光材料层1422b,且第二基板150与荧光材料层1422b分别位于彩色滤光层1421b的相对两侧。其中,彩色滤光层1421a、1421b可分别呈现不同的颜色,以使得发光二极管120可发出红光、绿光或蓝光。
此外,第一基板110还包括基底SB与绝缘层114。其中开关元件112a、112b配置于基底SB上,且开关元件112a、112b位于绝缘层114与基底SB之间。
值得说明的是,在本实施例中,由于发光二极管显示装置10的发光二极管120具有2个发光层123a、123b,且发光层123a、123b分别有其对应的第二半导体层122a、122b以及第二电极125a、125b。接着,第二电极125a、125b也分别电性连接至其对应的开关元件112a、112b。也就是说,发光二极管120的2个发光层123a、123b可分别由不同的开关元件112a、112b控制其发光,并使得各个发光层123a、123b发出的光可对应于其上方的彩色单元142a、142b来显示出红光、绿光或蓝光。换言之,本实施例中的每个发光二极管120具有2个发光位置,且每个发光位置可各自由不同的开关元件112a、112b控制。此外,虽然在本实施例中,发光二极管120具体化为垂直式发光二极管,但不以此为限,在其他实施例中,发光二极管也可以是水平式发光二极管或其他形式的发光二极管。
需要说明的是,虽然本实施例的发光二极管显示装置10的发光二极管120是以2个发光层123a、123b、2个第二半导体层122a、122b以及2个第二电极125a、125b来表示,但不以此为限。也就是说,在其他实施例中,发光二极管显示装置的发光二极管也可以有2个以上的发光层以及与发光层数量相当的第二半导体层以及第二电极。
此外,在一些实施例中,发光二极管显示装置10更包括胶层160,以包覆发光二极管120,并使彩色层140与第一基板110分别位于胶层160的相对两侧。此处,胶层160可例如是框胶、光学胶或其他适合的光学胶材,但不以此为限。
请再参照图1B,在一些实施例中,发光二极管显示装置10的彩色层140的高度H1例如是50微米,胶层160的高度H2例如是100微米,第二基板150的高度H3例如是125微米,第一基板110的高度H4例如是125微米,发光二极管120的宽度W1例如是150微米,彩色单元142a、142b的宽度W2例如是20微米,但不以此为限。
在此必须说明的是,下述实施例沿用前述实施例的元件标号与部分内容,其中采用相同的标号来表示相同或近似的元件,并且省略了相同技术内容的说明。关于省略部分的说明可参考前述实施例,下述实施例不再重复赘述。
需要说明的是,虽然在微型发光二极管显示装置10中,彩色单元142a、142b可包括彩色滤光层1421a、1421b及荧光材料层1422a、1422b,但不以此为限。在一些实施例中,微型发光二极管显示装置10a的彩色层140c的彩色单元142c也可以是量子点材料层,如图1D所示。在一些实施例中,微型发光二极管显示装置10b的彩色层140d的彩色单元142d也可以包括彩色滤光层1421d,且其荧光材料层170不设置在彩色层140d内,如图1E所示。
图1E为本发明另一实施例的一种微型发光二极管显示装置的剖面示意图。请同时参考图1B与图1E,本实施例的微型发光二极管显示装置10b与图1B中的微型发光二极管显示装置10相似,惟二者主要差异之处在于:本实施例的微型发光二极管显示装置10b的彩色层140d的彩色单元142d包括彩色滤光层1421d,且发光二极管显示装置10b更包括荧光材料层170。其中,荧光材料层170与彩色层140d为不同的迭层,荧光材料层170配置于彩色层140d与发光二极管120之间,且第二基板150与荧光材料层170分别位于彩色层140d的相对两侧。
基于上述,在本实施例的发光二极管显示装置10中,由于发光二极管120包括第一半导体层121、多个第二半导体层122a、122b、多个发光层123a、123b、第一电极124以及多个第二电极125a、125b。其中,发光层123a、123b分别对应于第二半导体层122a、122b与第二电极125a、125b设置,且第二电极125a、125b分别电性连接于对应的开关元件112a、112b。藉此设计,使得本实施例的发光二极管120具有至少2个发光位置,进而使得发光二极管显示装置10可提供宽色域的色彩规格。
图2A至图2F为本发明一实施例的一种发光二极管显示装置的制造方法的剖面示意图。
在本实施例中,发光二极管显示装置10c的制造方法包括形成第一组件101c、形成第二组件102c以及使第一组件101c与第二组件102c相对设置。
详细来说,首先,请先参照图2A至图2C,形成第一组件101c,其包括以下步骤:如图2A所示,提供第一基板110,且第一基板110具有多个开关元件组115、绝缘层114以及基底SB。其中,每个开关元件组115包括多个开关元件112c,而开关元件112c配置于基底SB上,且开关元件112c位于绝缘层114与基底SB之间。接着,形成多个发光二极管120于成长基板上(未示出)。再者,如图2B所示,转移发光二极管120至第一基板110上,且将发光二极管120配置于由绝缘层114所暴露出的多个开关元件112c上。然后,如图2C所示,形成粘着层130于第一基板110上,使粘着层130包覆发光二极管120,且使粘着层130与第一基板110分别位于发光二极管120的相对两侧。
接着,请参照图2D至图2E,形成第二组件102c,其包括以下步骤:如图2D所示,提供第二基板150,并形成彩色层140d于第二基板150上。彩色层140d包括多个彩色单元142d以及多个阻挡层144,其中,彩色单元142d包括彩色滤光层1421d,且各阻挡层144配置于各彩色单元142d之间。如图2E所示,形成荧光材料层170于彩色层140d上,使荧光材料层170与第二基板150分别位于彩色层140d的相对两侧。
最后,请参照图2F,将第一组件101c与第二组件102c相对设置,以形成发光二极管显示装置10c。其中,彩色层140d覆盖荧光材料层170、粘着层130及发光二极管120,且第二基板150覆盖彩色层140d、荧光材料层170、粘着层130以及发光二极管120。
值得说明的是,由于在本实施例中采用上述的发光二极管120,而发光二极管120包括2个发光层123a、123b、与发光层123a、123b数量相当的第二半导体层122a、122b以及第二电极125a、125b,使得发光二极管120相较于一般的微型发光二极管具有较宽的宽度W1,例如是150微米。此外,更由于发光二极管120不先经过封装过程也不含有荧光层,且另外设计荧光材料层170的位置在第二基板150上,进而使得本实施例的发光二极管显示装置10c的制造方法能改善巨量转移的良率。
图3A至图3E为本发明另一实施例的一种发光二极管显示装置的制造方法的剖面示意图。请同时参照图2A至图2F与图3A至图3E,本实施例的微型发光二极管显示装置10d的制造方法与图2A至图2F中的微型发光二极管显示装置10c的制造方法相似,惟二者主要差异之处在于:本实施例的微型发光二极管显示装置10d的制造方法将荧光材料层170形成于第一基板110,且微型发光二极管显示装置10d更包括胶层160。
详细来说,请参照图3A至图3C,形成第一组件101d。其中,图3A至图3B与图2A至图2B的步骤相同,于此不再赘述。请参照图3C,在形成粘着层130于第一基板110上之前,更包括:形成胶层160以包覆发光二极管120,以及形成荧光材料层170于胶层160上,并使荧光材料层170与发光二极管120分别位于胶层160的相对两侧。接着,请参照图3D,形成第二组件102d,其步骤与图2D相同,于此不再赘述。最后,请参照图3E,将第一组件101d与第二组件102d相对设置,以形成发光二极管显示装置10d。
图4为本发明另一实施例的一种微型发光二极管显示装置的剖面示意图。请同时参考图3E与图4,本实施例的微型发光二极管显示装置10e与图3E中的微型发光二极管显示装置10d相似,惟二者主要差异之处在于:本实施例的微型发光二极管显示装置10e更包括触控电路层180。其中,触控电路层180配置于第二基版150远离彩色层140d的一侧,但不以此为限。在其他实施例中,触控电路层180也可以配置于第一基板110与第二基版150之间,或配置于第一基板110远离发光二极管120的一侧。
综上所述,在本实施例的发光二极管显示装置及其制造方法中,由于发光二极管包括多个第二半导体层、多个发光层以及多个第二电极。其中,发光层分别对应于第二半导体层与第二电极设置,且第二电极分别电性连接于对应的开关元件。藉此设计,使得每个发光二极管可发出至少2种的颜色的光且具有较宽的尺寸,进而使得本实施例的发光二极管显示装置具有可提供宽色域的色彩规格并能改善巨量转移的良率。
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。
Claims (9)
1.一种发光二极管显示装置,其特征在于,包括:
一第一基板,具有多个开关元件;
多个发光二极管,配置于该第一基板上,各该发光二极管包括:
一第一半导体层;
多个第二半导体层;
多个发光层,分别配置于该第一半导体层与对应的该第二半导体层之间;
一第一电极,配置于该第一半导体层上;以及
多个第二电极,分别配置于对应的该第二半导体层上,且该些第二电极分别电性连接于对应的该开关元件;
一粘着层,配置于该第一基板上,且该粘着层与该第一基板分别位于该些发光二极管的相对两侧;
一彩色层,配置于该第一基板上,并覆盖该粘着层及该些发光二极管,其中该彩色层包括多个彩色单元以及多个阻挡层,各该阻挡层配置于各该彩色单元之间;以及
一第二基板,与该第一基板相对设置,且该第二基板覆盖该彩色层、该粘着层以及该些发光二极管。
2.如权利要求1所述的发光二极管显示装置,其特征在于,其中该些彩色单元包括一彩色滤光层,且该发光二极管显示装置更包括:
一荧光材料层,配置于该彩色层与该些发光二极管之间,使该第二基板与该荧光材料层分别位于该彩色层的相对两侧。
3.如权利要求1所述的发光二极管显示装置,其特征在于,更包括:
一胶层,包覆该些发光二极管,其中该彩色层与该第一基板分别位于该胶层的相对两侧。
4.如权利要求1所述的发光二极管显示装置,其特征在于,其中该些彩色单元包括一彩色滤光层及一荧光材料层,且该第二基板与各该荧光材料层分别位于各该彩色滤光层的相对两侧。
5.如权利要求1所述的发光二极管显示装置,其特征在于,其中该些彩色单元包括量子点材料层。
6.一种发光二极管显示装置的制造方法,其特征在于,包括:
形成一第一组件,包括:
提供一第一基板,该第一基板具有多个开关元件;
形成多个发光二极管于一成长基板上;
转移该些发光二极管至该第一基板上;以及
形成一粘着层于该第一基板上,其中该粘着层与该第一基板分别位于该些发光二极管的相对两侧;
形成一第二组件,包括:
提供一第二基板;以及
形成一彩色层于该第二基板上,其中该彩色层包括多个彩色单元以及多个阻挡层,且各该阻挡层配置于各该彩色单元之间;以及
使该第一组件与该第二组件相对设置,其中该彩色层覆盖该粘着层及该些发光二极管,且该第二基板覆盖该彩色层、该粘着层以及该些发光二极管;
其中各该发光二极管至少包括:
一第一半导体层;
多个第二半导体层;
多个发光层,分别配置于该第一半导体层与对应的该第二半导体层之间;
一第一电极,配置于该第一半导体层上;以及
多个第二电极,分别配置于对应的该第二半导体层上,且该些第二电极分别电性连接于对应的该开关元件。
7.如权利要求6所述的发光二极管显示装置的制造方法,其特征在于,其中当该些彩色单元包括一彩色滤光层及一荧光材料层时,在形成该彩色层于该第二基板上之前,更包括:
形成该彩色滤光层及该荧光材料层于该些彩色单元内,并使该第二基板与各该荧光材料层分别位于各该彩色滤光层的相对两侧。
8.如权利要求6所述的发光二极管显示装置的制造方法,其特征在于,其中当该些彩色单元包括一彩色滤光层时,在形成该彩色层于该第一基板上之后,更包括:
形成一荧光材料层于该彩色层上,使该荧光材料层与该第二基板分别位于该彩色层的相对两侧。
9.如权利要求6所述的发光二极管显示装置的制造方法,其特征在于,其中该些彩色单元包括量子点材料层。
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US20200083206A1 (en) | 2020-03-12 |
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