CN109545728B - Automatic wafer transfer method - Google Patents
Automatic wafer transfer method Download PDFInfo
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- CN109545728B CN109545728B CN201811492066.1A CN201811492066A CN109545728B CN 109545728 B CN109545728 B CN 109545728B CN 201811492066 A CN201811492066 A CN 201811492066A CN 109545728 B CN109545728 B CN 109545728B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Abstract
The invention discloses an automatic wafer transfer method in the field of semiconductor processing, which comprises the following steps: placing 25 wafers in a wafer material box at equal intervals, placing the wafer material box on a material waiting platform, and placing a wafer material frame on a positioning platform; the lifting arm jacks upwards to penetrate through the wafer material box to lift each wafer upwards, then the lifting arm descends, the two transfer mechanical arms move to the lower sides of the wafers in opposite directions, the two supporting arms support the wafers, then the two transfer mechanical arms move towards the positioning platform simultaneously to send the supported wafers to the upper side of the wafer material frame, the lifting arm ascends to penetrate through the wafer material frame and supports each wafer, then the two transfer mechanical arms move in opposite directions, the supporting arms are separated from the wafers, the lifting arm descends to enable each wafer to fall into the wafer material frame, and the side faces of the wafers are in contact with the upper supporting rod. The invention can transfer the wafer in the wafer material box into the wafer material frame, thereby avoiding the wafer from being damaged due to unbalanced stress.
Description
Technical Field
The invention belongs to the field of semiconductor processing, and particularly relates to an automatic wafer transfer method.
Background
During the wafer packaging and testing process, wafers need to be frequently transferred or selected. During the operation of transferring or selecting the material box, the wafer is usually manually taken or sucked by a vacuum suction pen. Manual fetching presents the following risks: the product defects are easily caused by the problems of product pollution, electrostatic damage and the like caused by direct contact of hands; the wafer is cracked due to improper manual operation. The vacuum suction pen sucks the wafer and has the following risks: the suction pen and the sucker are directly contacted with the surface of the wafer to easily scratch; the wafers are densely stacked in the material box, so that the operation is inconvenient and the operation efficiency is low; the wafer is liable to fall off due to air-break or poor adsorption.
Among the prior art, there is a wafer transfer tool, its patent application No.: CN 201410840504.4; application date: 2014.12.30, respectively; publication No.: CN 104505361A; the publication date is as follows: 2015.04.08, respectively; the structure of the device comprises a first platform and a second platform which are kept flush and can be folded or separated along a sliding track; the first platform is provided with a limiting corner and a first clamping groove which are used for fixing the wafer transfer box on the first platform and enabling the opening direction of the wafer transfer box to face the second platform; the second platform is provided with a second clamping groove, a first column body and a second column body; the first column body and the second column body are provided with grooves for accommodating the bottom supports of the wafer material boxes, and the second clamping grooves are used for being meshed with the clamping parts of the wafer material boxes so as to fix the wafer material boxes on the second platform and enable the opening directions of the wafer material boxes to face the first platform; the inner sides of the first cylinder and the second cylinder are aligned with the hollow opening of the bottom support part of the wafer material box. The device can horizontally push the wafer from the first platform to the second platform to transfer the wafer, but has the disadvantages that: the wafer has a small thickness and a large brittleness, and when the wafer is horizontally pushed, the wafer is easy to break due to unbalanced stress.
Disclosure of Invention
The invention aims to provide an automatic wafer transfer method, which can lift up a wafer vertically placed in a wafer material box and transfer the wafer into a wafer material frame, so that the wafer moves stably, and the wafer is prevented from being damaged due to unbalanced stress.
The purpose of the invention is realized as follows: an automatic wafer transfer method comprises a case, wherein a material waiting platform and a positioning platform are arranged on the case in parallel, the material waiting platform comprises a group of transverse transmission boxes which are correspondingly arranged in front and back and a group of longitudinal frame strips which are correspondingly arranged in left and right, a lifting and lifting mechanism is correspondingly arranged on the material waiting platform, and a pair of transfer manipulators which can move transversely are arranged on the case corresponding to a wafer material box; the two transfer manipulators are arranged in a left-right corresponding mode, the transfer manipulators are located above the wafer material box and are L-shaped, each transfer manipulator comprises a transverse section and a longitudinal section, a support arm is fixedly connected to the lower side of the longitudinal section of each transfer manipulator, one side, opposite to the two support arms, of each transfer manipulator is obliquely arranged, a plurality of positioning grooves are formed in the inclined surface of each support arm at intervals along the length direction, and each positioning groove is arranged in one-to-one correspondence with each wafer; the positioning platform comprises a group of bases which are correspondingly arranged front and back, a baffle is vertically arranged on each base, two positioning bulges are symmetrically arranged on each base left and right, and a lifting and lifting mechanism is correspondingly arranged on each positioning platform; the lifting and lifting mechanism comprises two lifting arms which are distributed correspondingly from left to right, the axis of each lifting arm is longitudinally arranged, the upper sides of the lifting arms are obliquely arranged, a plurality of positioning grooves are arranged at intervals along the axis direction on the upper sides of the lifting arms, each positioning groove is arranged in one-to-one correspondence with each wafer, and a groove for allowing the lifting arms to pass through is formed in the upper side of the case;
the method comprises the following steps:
(1) placing 25 wafers in a wafer material box at equal intervals, wherein the wafers are in a vertical state, and openings are formed in the upper side and the lower side of the wafer material box;
(2) placing the front side and the rear side of the wafer material box between two transverse transmission boxes, placing the left side and the right side of the wafer material box between two longitudinal frame strips, wherein the surface of the wafer is parallel to the length direction of the transverse transmission boxes, and the bottom of the wafer is supported in a positioning groove corresponding to a lifting arm;
(3) supporting a wafer material frame on a base, wherein the wafer material frame comprises two frame plates which are arranged in a front-back corresponding mode, a pair of left-right symmetric upper supporting rods and a pair of left-right symmetric lower supporting rods are arranged between the frame plates, 27 positioning grooves are axially arranged at intervals on the inner sides of the upper supporting rods, 27 positioning grooves are axially arranged at intervals on the upper sides of the lower supporting rods, protective blocking pieces are placed in the positioning grooves on the front side and the rear side of the wafer material frame, the positioning grooves between the two protective blocking pieces are arranged in a one-to-one correspondence mode with wafers, two positioning rods which are arranged in a left-right corresponding mode are fixedly connected to the bottoms of the two frame plates, the frame plates on the front side and the rear side of the wafer material frame respectively abut against baffle plates of the;
(4) the lifting arm jacks upwards to penetrate through the wafer material box to lift each wafer upwards, then the lifting arm descends, the two transfer manipulators move to the lower sides of the wafers in opposite directions, the edges of the wafers extend into corresponding positioning grooves of the supporting arms, the two supporting arms support the wafers, then the two transfer manipulators move towards the positioning platform simultaneously to send the supported wafers to the upper side of the wafer material frame, the lifting arm below the wafer material frame ascends to penetrate through the wafer material frame, the two lifting arms support the wafers together, then the two transfer manipulators move in opposite directions, the supporting arms are separated from the wafers, the lifting arm descends to enable the wafers to fall into the wafer material frame, the bottoms of the wafers are supported on the lower supporting rods, and the side faces of the wafers are in contact with the upper supporting rods.
The method comprises the steps of placing a wafer material box on a material waiting platform, placing a wafer material frame on a positioning platform, lifting and lifting a wafer in the wafer material box by a lifting and lifting mechanism, moving two transfer mechanical arms to the lower sides of the wafer in opposite directions to support each wafer, moving the transfer mechanical arms in the same direction towards the positioning platform to enable the supported wafer to move above the wafer material frame, lifting and lifting the lifting and lifting mechanism below the wafer material frame to lift and support each wafer, moving a pair of transfer mechanical arms in opposite directions to release the wafer, and lowering the lifting and lifting mechanism to enable each wafer to just fall into a positioning groove of the wafer material frame. Compared with the prior art, the invention has the beneficial effects that: the wafer vertically placed in the wafer material box can be lifted up and transferred to the wafer material frame through the transfer manipulator, the wafer keeps a vertical state and moves stably, the stress of the wafer is balanced, and the wafer is prevented from being damaged.
As a further improvement of the invention, at least 3 adjusting shafts are rotatably arranged between two transverse transmission boxes, the peripheries of the adjusting shafts are wrapped with sheaths, the axes of the adjusting shafts are longitudinally arranged, the at least 3 adjusting shafts are positioned below the wafer and are circumferentially distributed along the wafer, two ends of each adjusting shaft are respectively rotatably supported on the wall of the corresponding transverse transmission box, and a transmission mechanism is arranged in at least one transverse transmission box; after the wafer material box is placed in the step (2), the transmission mechanism drives the adjusting shaft to rotate, and the wafer is driven to rotate through the sheath, so that the marks on the edge of the wafer circumferentially rotate to the set position. The edge of the wafer is provided with a mark, the transmission mechanism drives the adjusting shaft to rotate, and the wafer is driven to rotate through the sheath, so that the wafer is circumferentially rotated to a set position.
As a further improvement of the invention, the transmission mechanism comprises at least three pairs of bearing seats which are arranged in a front-back corresponding manner, a rotating shaft is rotatably arranged between each pair of bearing seats, the rotating shaft is in transmission connection with a corresponding adjusting shaft through a coupler, a chain wheel is sleeved on the rotating shaft, the chain wheel on each rotating shaft is in transmission connection through a chain, a driven belt pulley is sleeved on any rotating shaft, the driven belt pulley is in transmission connection with a driving belt pulley at the output end of a motor through a belt, grooves which can allow the belt to pass through are respectively arranged at the bottom of the transverse transmission box and the upper side of the case, and. The motor drives the driving belt pulley to rotate, the driving belt pulley drives the driven belt pulley to rotate through the belt, the rotating shafts rotate, the chain wheels on the rotating shafts drive the chain wheels on other rotating shafts to rotate through the chains, and each rotating shaft rotates to drive the adjusting shaft to rotate.
As a further improvement of the invention, at least two parallel connecting rods are vertically arranged on the lower side of the lifting arm, each connecting rod extends into the case, the lower end of the lifting arm is fixedly connected with a lifting seat, at least 4 guide bars are symmetrically arranged around the lifting seat, each guide bar is matched with a vertical guide rail, lead screws are arranged on the left side and the right side of the lifting seat, the axes of the lead screws are vertically arranged, the upper end and the lower end of each lead screw are respectively rotatably supported on a bearing seat, one end of each lead screw is in transmission connection with a motor, a lead screw nut is sleeved on each lead screw, and the lead screw nut is in transmission connection with the. The motor drives the lead screw to rotate, the lead screw nut on the lead screw moves up and down, the lifting seat is driven to move up and down, and the lifting seat drives the lifting arm to move up and down.
As a further improvement of the invention, the lower side of the transverse section of the transfer manipulator is vertically provided with an upright rod, the upright rod extends into the case, the lower end of the upright rod is arranged on a moving seat, the moving seat is in transmission connection with a transverse guide rail through a sliding block, the moving seat is provided with a motor, the output end of the motor is vertically downward and is provided with a gear, a rack is axially arranged on the transverse guide rail, and the gear is meshed with the rack. The motor drives the gear to rotate, the gear rolls along the rack, the movable seat is driven to move along the transverse guide rail, the transfer mechanical arms move transversely, when the two transfer mechanical arms move to corresponding positions oppositely, the edges of the wafers are inserted into the corresponding positioning grooves, and the wafer can be supported by the support arms from the lower side.
Drawings
FIG. 1 is a top view of the present invention.
Fig. 2 is a cross-sectional view along AA of fig. 1.
Fig. 3 is a cross-sectional view taken along line BB of fig. 2.
Fig. 4 is a top view of a wafer cassette holding wafers.
Fig. 5 is a front view of the wafer magazine.
Fig. 6 is a longitudinal sectional view of the platform to be charged.
Fig. 7 is a partially enlarged view of fig. 6.
FIG. 8 is a diagram showing the relative positions of the wafer and the adjustment axis.
Fig. 9 is a positional relationship diagram of the sprockets.
Fig. 10 is a top view of the elevator base.
Fig. 11 is a cross-sectional view taken along line CC of fig. 1.
FIG. 12 is a top view of the transverse rails and the mobile platform.
Fig. 13 is a perspective view of the transverse rail and the mobile platform.
Fig. 14 is a top view of the transfer robot holding a wafer.
Fig. 15 is a side view of the transfer robot.
Fig. 16 is a front view of the transfer robot holding a wafer.
Fig. 17 is a sectional view taken along line DD of fig. 2.
Fig. 18 is a perspective view of a wafer frame.
Wherein, 1 chassis, 2 waiting material platform, 3 positioning platform, 4 transverse transmission box, 5 longitudinal frame strip, 6 wafer magazine, 7 wafer, 8 transfer manipulator, 8a transverse section, 8b longitudinal section, 9 base, 10 baffle, 11 backing plate I, 12 backing plate II, 13 adjusting shaft, 14 bearing seat, 15 rotating shaft, 16 shaft coupling, 17 connecting seat, 18 sprocket wheel, 19 driven pulley, 20 belt, 21 motor, 22 driving pulley, 23 lifting arm, 23a positioning groove, 24 connecting rod, 25 lifting seat, 26 guide strip, 27 vertical guide rail, 28 lead screw, 28a lead screw nut, 29 supporting arm, 29a positioning groove, 30 upright rod, 31 moving seat, 32 wafer material frame, 32a frame plate, 32b upper supporting rod, 32c lower supporting rod, 32d positioning rod, 33 gear, 33a rack, 34 slide block, 34a transverse guide rail, 35 positioning bulge, 36 positioning plate, 36a positioning button, 37 floor.
Detailed Description
As shown in fig. 1-18, an automatic wafer transferring device comprises a case 1, wherein a platform 2 to be loaded and a positioning platform 3 are arranged on the case 1 in parallel, and is characterized in that the platform 2 to be loaded comprises a group of transverse transmission boxes 4 arranged in a front-back corresponding manner and a group of longitudinal frame strips 5 arranged in a left-right corresponding manner, a wafer magazine 6 is correspondingly placed between the two transverse transmission boxes 4 and between the two longitudinal frame strips 5, a plurality of wafers 7 parallel to each other are vertically placed in the wafer magazine 6, the surfaces of the wafers 7 are parallel to the length direction of the transverse transmission boxes 4, openings are formed in the upper side and the lower side of the wafer magazine 6, a lifting mechanism is correspondingly arranged below the wafer magazine 6, and a pair of transferring manipulators 8 capable of moving transversely is arranged on the case 1 corresponding to the wafer magazine 6; the positioning platform 3 comprises a group of bases 9 which are correspondingly arranged front and back, baffles 10 are vertically arranged on the bases 9, the wafer material frame 32 is supported on the bases 9, the front side and the back side of the wafer material frame 32 are respectively abutted against the baffles 10 corresponding to the bases 9, and lifting mechanisms are correspondingly arranged below the wafer material frame 32. The bottom of wafer magazine 6 supports on backing plate 11, backing plate 11 is located between two horizontal transmission case 4 and is located between two longitudinal frame strip 5, rotationally be provided with 3 at least adjusting shafts 13 between two horizontal transmission case 4, adjusting shaft 13 periphery parcel has the sheath, adjusting shaft 13 axis vertically sets up, 3 at least adjusting shafts 13 are located 7 below wafers and distribute along 7 circumference of wafers, the both ends of adjusting shaft 13 rotate respectively and support on corresponding horizontal transmission case 4 wall, be equipped with drive mechanism in at least one horizontal transmission case 4. The transmission mechanism comprises at least three pairs of bearing seats 14 which are correspondingly arranged front and back, a rotating shaft 15 is rotatably arranged between each pair of bearing seats 14, the rotating shaft 15 is in transmission connection with a corresponding adjusting shaft 13 through a coupler 16, a chain wheel 18 is sleeved on the rotating shaft 15, the chain wheel 18 on each rotating shaft 15 is in transmission connection through a chain, a driven belt pulley 19 is sleeved on any rotating shaft 15, the driven belt pulley 19 is in transmission connection with a driving belt pulley 22 at the output end of a motor 21 through a belt 20, grooves which can allow the belt 20 to pass through are formed in the bottom of the transverse transmission case 4 and the upper side of the case 1, and the motor 21 is arranged. The lifting and lifting mechanism comprises two lifting arms 23 which are distributed correspondingly from left to right, the axes of the lifting arms 23 are longitudinally arranged, the upper sides of the lifting arms 23 are obliquely arranged, a plurality of positioning grooves 23a are formed in the upper sides of the lifting arms 23 at intervals along the axis direction, each positioning groove 23a is arranged in one-to-one correspondence with each wafer 7, and grooves through which the lifting arms 23 can pass are formed in the first base plate 11 and the upper side of the case 1; the vertical connecting rod 24 that is provided with two piece at least parallels of lifing arm 23 downside, each connecting rod 24 stretches into quick-witted case 1 inside and lower extreme fixedly connected with lift seat 25, the symmetry is equipped with 4 piece at least gib block 26 around the lift seat 25, every gib block 26 all sets up with a vertical guide rail 27 phase-match, the lift seat 25 left and right sides all is equipped with lead screw 28, the vertical setting of lead screw 28 axis, the upper and lower both ends of lead screw 28 rotate respectively to be supported on a bearing frame 14, the one end and the motor 21 transmission of lead screw 28 are connected, the cover is equipped with screw-nut on the lead screw 28, screw-nut 28a is connected with lift seat 25. The two transfer manipulators 8 are arranged in a left-right corresponding mode, the transfer manipulators 8 are positioned above the wafer material box 6, the transfer manipulators 8 are L-shaped, each transfer manipulator 8 comprises a transverse section 8a and a longitudinal section 8b, a support arm 29 is fixedly connected to the lower side of the longitudinal section 8b of each transfer manipulator 8, one side, opposite to each support arm 29, of each support arm is obliquely arranged, a plurality of positioning grooves 29a are formed in the inclined surface of each support arm 29 at intervals along the length direction, and each positioning groove 29a is arranged in one-to-one correspondence with each wafer 7; the lower side of the transverse section 8a of the transfer manipulator 8 is vertically provided with an upright rod 30, the upright rod 30 extends into the case 1, the lower end of the upright rod 30 is arranged on a movable seat 31, the movable seat 31 is in transmission connection with a transverse guide rail 34a through a sliding block 34, a motor 21 is arranged on the movable seat 31, the output end of the motor 21 is vertically downward and is provided with a gear 33, a rack 33a is axially arranged on the transverse guide rail 34a, and the gear 33 is meshed with the rack 33 a. Wafer material frame 32 includes the frame plate 32a that two front and back correspondence set up, be provided with a pair of bilateral symmetry's last die-pin 32b and a pair of bilateral symmetry's lower die-pin 32c between the frame plate 32a, the inboard axial interval of last die-pin 32b is provided with a plurality of constant head tanks, lower die-pin 32c upside is provided with a plurality of constant head tanks along axial interval, the protection separation blade has been placed in the constant head tank of wafer material frame 32 front and back both sides, constant head tank and each wafer 7 one-to-one setting between two protection separation blades, two frame plate 32a bottom fixedly connected with correspond the locating lever 32d that sets up about two. The base 9 is arranged on the second backing plate 12, the baffle plate 10 of the base 9 is contacted with the corresponding frame plate 32a, two positioning protrusions 35 are symmetrically arranged on the base 9 left and right, the positioning rod 32d is attached to the positioning protrusions 35 on the same side corresponding to the two bases 9, a positioning plate 36 is arranged on any one base 9, and a telescopic positioning button 36a is arranged on the positioning plate 36. The bottom of the wafer material box 6 is symmetrically provided with a vertical bottom plate 37 from left to right, and the wafer material box 6 is supported on the first base plate 11 through the bottom plate 37. The surface of the case 1 is provided with a plurality of circular through holes.
The invention discloses an automatic wafer transfer method, which comprises a case 1, wherein a material waiting platform 2 and a positioning platform 3 are arranged on the case 1 in parallel, the material waiting platform 2 comprises a group of transverse transmission boxes 4 which are correspondingly arranged front and back and a group of longitudinal frame strips 5 which are correspondingly arranged left and right, a lifting mechanism is correspondingly arranged on the material waiting platform 2, and a pair of transfer manipulators 8 which can move transversely are arranged on the case 1 corresponding to a wafer material box 6; the two transfer manipulators 8 are arranged in a left-right corresponding mode, the transfer manipulators 8 are positioned above the wafer material box 6, the transfer manipulators 8 are L-shaped, each transfer manipulator 8 comprises a transverse section 8a and a longitudinal section 8b, a support arm 29 is fixedly connected to the lower side of the longitudinal section 8b of each transfer manipulator 8, one side, opposite to each support arm 29, of each support arm is obliquely arranged, a plurality of positioning grooves 29a are formed in the inclined surface of each support arm 29 at intervals along the length direction, and each positioning groove 29a is arranged in one-to-one correspondence with each wafer 7; the positioning platform 3 comprises a group of bases 9 which are correspondingly arranged front and back, a baffle 10 is vertically arranged on each base 9, two positioning bulges 35 are symmetrically arranged on each base 9 left and right, and a lifting and lifting mechanism is correspondingly arranged on each positioning platform 3; the lifting and lifting mechanism comprises two lifting arms 23 which are correspondingly distributed left and right, the axes of the lifting arms 23 are longitudinally arranged, the upper sides of the lifting arms 23 are obliquely arranged, a plurality of positioning grooves 23a are arranged at intervals on the upper sides of the lifting arms 23 along the axis direction, each positioning groove 23a is arranged in one-to-one correspondence with each wafer 7, and a groove through which the lifting arms 23 can pass is formed in the upper side of the case 1;
the method comprises the following steps:
(1) placing 25 wafers 7 in a wafer material box 6 at equal intervals, wherein the wafers 7 are in a vertical state, and openings are formed in the upper side and the lower side of the wafer material box 6;
(2) then the front side and the rear side of the wafer material box 6 are placed between the two transverse transmission boxes 4, the left side and the right side of the wafer material box 6 are placed between the two longitudinal frame strips 5, the surface of the wafer 7 is parallel to the length direction of the transverse transmission boxes 4, and the bottom of the wafer 7 is supported in a positioning groove 23a corresponding to the lifting arm 23; at least 3 adjusting shafts 13 are rotatably arranged between the two transverse transmission boxes 4, the peripheries of the adjusting shafts 13 are wrapped with sheaths, the axes of the adjusting shafts 13 are longitudinally arranged, the at least 3 adjusting shafts 13 are positioned below the wafer 7 and are circumferentially distributed along the wafer 7, two ends of each adjusting shaft 13 are respectively rotatably supported on the wall of the corresponding transverse transmission box 4, and a transmission mechanism is arranged in at least one transverse transmission box 4; after the wafer material box 6 is placed in the step (2), the transmission mechanism drives the adjusting shaft 13 to rotate, and the wafer 7 is driven to rotate through the sheath, so that the marks on the edge of the wafer 7 circumferentially rotate to a set position;
(3) supporting a wafer material frame 32 on a base 9, wherein the wafer material frame 32 comprises two frame plates 32a which are arranged in a front-back corresponding manner, a pair of upper supporting rods 32b which are symmetrical left and right and a pair of lower supporting rods 32c which are symmetrical left and right are arranged between the frame plates 32a, 27 positioning grooves are axially arranged at intervals on the inner sides of the upper supporting rods 32b, 27 positioning grooves are axially arranged at intervals on the upper sides of the lower supporting rods 32c, protective blocking pieces are arranged in the positioning grooves on the front and back sides of the wafer material frame 32, the positioning grooves between the two protective blocking pieces are arranged in a one-to-one correspondence with wafers 7, two positioning rods 32d which are arranged in a left-right corresponding manner are fixedly connected to the bottoms of the two frame plates 32a, the frame plates 32a on the front and back sides of the wafer material frame 32 respectively abut against baffle plates 10 of the corresponding base 9;
(4) the lifting arm 23 is lifted upwards to penetrate through the wafer material box 6 to lift each wafer 7 upwards, then the lifting arm 23 descends, the two transfer manipulators 8 move towards each other to the lower side of the wafer 7, the edge of the wafer 7 extends into the corresponding positioning grooves 29a of the lifting arms 29, the two lifting arms 29 support the wafer 7, then the two transfer manipulators 8 simultaneously move towards the positioning platform 3 to send the supported wafer 7 to the upper side of the wafer material frame 32, the lifting arm 23 below the wafer material frame 32 ascends to penetrate through the wafer material frame 32, the two lifting arms 23 support each wafer 7 together, then the two transfer manipulators 8 move in opposite directions, the lifting arms 29 are separated from the wafer 7, the lifting arm 23 descends to enable each wafer 7 to fall in the wafer material frame 32, the bottom of the wafer 7 is supported on the lower supporting rod 32c, and the side face of the wafer 7 is in contact with the upper supporting rod 32 b. The transfer of the wafer 7 is completed.
The transmission mechanism comprises at least three pairs of bearing seats 14 which are correspondingly arranged front and back, a rotating shaft 15 is rotatably arranged between each pair of bearing seats 14, the rotating shaft 15 is in transmission connection with a corresponding adjusting shaft 13 through a coupler 16, a chain wheel 18 is sleeved on the rotating shaft 15, the chain wheel 18 on each rotating shaft 15 is in transmission connection through a chain, a driven belt pulley 19 is sleeved on any rotating shaft 15, the driven belt pulley 19 is in transmission connection with a driving belt pulley 22 at the output end of a motor 21 through a belt 20, grooves which can allow the belt 20 to pass through are formed in the bottom of the transverse transmission case 4 and the upper side of the case 1, and the motor 21 is arranged. The motor 21 drives the driving belt pulley 22 to rotate, the driving belt pulley 22 drives the driven belt pulley 19 to rotate through the belt 20, the rotating shaft 15 rotates, the chain wheel 18 on the rotating shaft 15 drives the chain wheels 18 on other rotating shafts 15 to rotate through a chain, and each rotating shaft 15 rotates to drive the adjusting shaft 13 to rotate.
The vertical connecting rod 24 that is provided with two piece at least parallels of lifing arm 23 downside, each connecting rod 24 stretches into quick-witted case 1 inside and lower extreme fixedly connected with lift seat 25, the symmetry is equipped with 4 piece at least gib block 26 around the lift seat 25, every gib block 26 all sets up with a vertical guide rail 27 phase-match, the lift seat 25 left and right sides all is equipped with lead screw 28, the vertical setting of lead screw 28 axis, the upper and lower both ends of lead screw 28 rotate respectively to be supported on a bearing frame 14, the one end and the motor 21 transmission of lead screw 28 are connected, the cover is equipped with screw-nut on the lead screw 28, screw-nut 28a is connected with lift seat 25. The motor 21 drives the screw 28 to rotate, the screw nut 28a on the screw 28 moves up and down, the lifting seat 25 is driven to move up and down, and the lifting seat 25 drives the lifting arm 23 to move up and down.
The lower side of the transverse section 8a of the transfer manipulator 8 is vertically provided with an upright rod 30, the upright rod 30 extends into the case 1, the lower end of the upright rod 30 is arranged on a movable seat 31, the movable seat 31 is in transmission connection with a transverse guide rail 34a through a sliding block 34, a motor 21 is arranged on the movable seat 31, the output end of the motor 21 is vertically downward and is provided with a gear 33, a rack 33a is axially arranged on the transverse guide rail 34a, and the gear 33 is meshed with the rack 33 a. The motor 21 drives the gear 33 to rotate, the gear 33 rolls along the rack 33a, the moving seat 31 is driven to move along the transverse guide rail 34a, the transfer manipulators 8 realize transverse movement, when the two transfer manipulators 8 move to corresponding positions oppositely, the edges of the wafers 7 are inserted into the corresponding positioning grooves 29a, and the supporting arms 29 can support the wafers 7 from the lower part.
The invention has the advantages that: the wafer 7 vertically placed in the wafer material box 6 can be lifted up and transferred into the wafer material frame 32 through the transfer manipulator 8, the wafer 7 keeps a vertical state and moves stably, the stress of the wafer 7 is balanced, and the wafer 7 is prevented from being damaged.
The present invention is not limited to the above-mentioned embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts according to the disclosed technical contents, and these substitutions and modifications are all within the protection scope of the present invention.
Claims (5)
1. An automatic wafer transfer method comprises a case, wherein a material waiting platform and a positioning platform are arranged on the case in parallel, the material waiting platform comprises a group of transverse transmission boxes which are correspondingly arranged in front and back and a group of longitudinal frame strips which are correspondingly arranged in left and right, a lifting and lifting mechanism is correspondingly arranged on the material waiting platform, and a pair of transfer manipulators which can move transversely are arranged on the case corresponding to a wafer material box; the two transfer manipulators are arranged in a left-right corresponding mode, the transfer manipulators are located above the wafer material box and are L-shaped, each transfer manipulator comprises a transverse section and a longitudinal section, a support arm is fixedly connected to the lower side of the longitudinal section of each transfer manipulator, one side, opposite to the two support arms, of each transfer manipulator is obliquely arranged, a plurality of positioning grooves are formed in the inclined surface of each support arm at intervals along the length direction, and each positioning groove is arranged in one-to-one correspondence with each wafer; the positioning platform comprises a group of bases which are correspondingly arranged front and back, a baffle is vertically arranged on each base, two positioning bulges are symmetrically arranged on each base left and right, and a lifting and lifting mechanism is correspondingly arranged on each positioning platform; the lifting and lifting mechanism comprises two lifting arms which are distributed correspondingly from left to right, the axis of each lifting arm is longitudinally arranged, the upper sides of the lifting arms are obliquely arranged, a plurality of positioning grooves are arranged at intervals along the axis direction on the upper sides of the lifting arms, each positioning groove is arranged in one-to-one correspondence with each wafer, and a groove for allowing the lifting arms to pass through is formed in the upper side of the case;
characterized in that the method comprises the following steps:
(1) placing 25 wafers in a wafer material box at equal intervals, wherein the wafers are in a vertical state, and openings are formed in the upper side and the lower side of the wafer material box;
(2) placing the front side and the rear side of the wafer material box between two transverse transmission boxes, placing the left side and the right side of the wafer material box between two longitudinal frame strips, wherein the surface of the wafer is parallel to the length direction of the transverse transmission boxes, and the bottom of the wafer is supported in a positioning groove corresponding to a lifting arm;
(3) supporting a wafer material frame on a base, wherein the wafer material frame comprises two frame plates which are arranged in a front-back corresponding mode, a pair of left-right symmetric upper supporting rods and a pair of left-right symmetric lower supporting rods are arranged between the frame plates, 27 positioning grooves are axially arranged at intervals on the inner sides of the upper supporting rods, 27 positioning grooves are axially arranged at intervals on the upper sides of the lower supporting rods, protective blocking pieces are placed in the positioning grooves on the front side and the rear side of the wafer material frame, the positioning grooves between the two protective blocking pieces are arranged in a one-to-one correspondence mode with wafers, two positioning rods which are arranged in a left-right corresponding mode are fixedly connected to the bottoms of the two frame plates, the frame plates on the front side and the rear side of the wafer material frame respectively abut against baffle plates of the;
(4) the lifting arm jacks upwards to penetrate through the wafer material box to lift each wafer upwards, then the lifting arm descends, the two transfer manipulators move to the lower sides of the wafers in opposite directions, the edges of the wafers extend into corresponding positioning grooves of the supporting arms, the two supporting arms support the wafers, then the two transfer manipulators move towards the positioning platform simultaneously to send the supported wafers to the upper side of the wafer material frame, the lifting arm below the wafer material frame ascends to penetrate through the wafer material frame, the two lifting arms support the wafers together, then the two transfer manipulators move in opposite directions, the supporting arms are separated from the wafers, the lifting arm descends to enable the wafers to fall into the wafer material frame, the bottoms of the wafers are supported on the lower supporting rods, and the side faces of the wafers are in contact with the upper supporting rods.
2. The method as claimed in claim 1, wherein at least 3 adjusting shafts are rotatably disposed between two transverse transmission boxes, the adjusting shafts are wrapped by sheaths, the axes of the adjusting shafts are longitudinally disposed, the at least 3 adjusting shafts are disposed under the wafer and circumferentially distributed along the wafer, two ends of each adjusting shaft are rotatably supported on the walls of the corresponding transverse transmission box, and a transmission mechanism is disposed in at least one transverse transmission box; after the wafer material box is placed in the step (2), the transmission mechanism drives the adjusting shaft to rotate, and the wafer is driven to rotate through the sheath, so that the marks on the edge of the wafer circumferentially rotate to the set position.
3. The automatic wafer transferring method according to claim 2, wherein the transmission mechanism comprises at least three pairs of bearing seats correspondingly arranged in front and back, each pair of bearing seats is rotatably provided with a rotating shaft, the rotating shaft is in transmission connection with a corresponding adjusting shaft through a coupler, the rotating shaft is sleeved with a chain wheel, the chain wheels on each rotating shaft are in transmission connection through a chain, any rotating shaft is sleeved with a driven belt wheel, the driven belt wheel is in transmission connection with a driving belt wheel at the output end of a motor through a belt, the bottom of the transverse transmission box and the upper side of the machine box are provided with grooves for allowing the belt to pass through, and the motor is arranged in the machine box.
4. The automatic wafer transferring method according to any one of claims 1-3, wherein at least two parallel connecting rods are vertically arranged on the lower side of the lifting arm, each connecting rod extends into the interior of the case, the lower end of the lifting arm is fixedly connected with a lifting seat, at least 4 guide bars are symmetrically arranged around the lifting seat, each guide bar is matched with one vertical guide rail, the left side and the right side of the lifting seat are respectively provided with a lead screw, the axis of each lead screw is vertically arranged, the upper end and the lower end of each lead screw are respectively rotatably supported on a bearing seat, one end of each lead screw is in transmission connection with a motor, a lead screw nut is sleeved on each lead screw, and the lead screw nut is in transmission connection with the lifting.
5. An automated wafer transfer method according to any one of claims 1-3, wherein an upright rod is vertically arranged at the lower side of the transverse section of the transfer robot, the upright rod extends into the case, and the lower end of the upright rod is arranged on a movable seat, the movable seat is in transmission connection with the transverse guide rail through a slide block, a motor is arranged on the movable seat, the output end of the motor is vertically downward and is provided with a gear, and a rack is axially arranged on the transverse guide rail, and the gear is meshed with the rack.
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| CN201811492066.1A CN109545728B (en) | 2018-12-07 | 2018-12-07 | Automatic wafer transfer method |
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| CN201811492066.1A CN109545728B (en) | 2018-12-07 | 2018-12-07 | Automatic wafer transfer method |
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| CN110993547B (en) * | 2019-11-12 | 2023-08-29 | 至微半导体(上海)有限公司 | Wafer basket changing device |
| CN115155915A (en) * | 2022-08-01 | 2022-10-11 | 广东德磁科技有限公司 | Anti-magnetic ring plate sticking device of butt joint magnetic ring spraying equipment |
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| US20040005211A1 (en) * | 1996-02-28 | 2004-01-08 | Lowrance Robert B. | Multiple independent robot assembly and apparatus and control system for processing and transferring semiconductor wafers |
| US20140064886A1 (en) * | 2012-08-30 | 2014-03-06 | Orbotech LT Solar, LLC. | System, architecture and method for simultaneous transfer and process of substrates |
| CN104409383B (en) * | 2014-10-20 | 2017-08-01 | 上海技美电子科技有限公司 | Wafer transfer device |
| CN105870045B (en) * | 2016-05-04 | 2018-05-18 | 中国电子科技集团公司第四十五研究所 | Wafter delivery appts and application method |
| CN106601659B (en) * | 2016-12-30 | 2024-02-02 | 上海新阳半导体材料股份有限公司 | Novel wafer transfer device |
| CN106783710B (en) * | 2016-12-31 | 2024-01-12 | 上海新阳半导体材料股份有限公司 | Wafer transfer device |
| CN106910702B (en) * | 2017-03-02 | 2019-05-03 | 泉州市憬承光电科技有限公司 | A kind of automatic wafer transporter and transport method |
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