CN109545728A - A kind of automation wafer transfer method - Google Patents
A kind of automation wafer transfer method Download PDFInfo
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- CN109545728A CN109545728A CN201811492066.1A CN201811492066A CN109545728A CN 109545728 A CN109545728 A CN 109545728A CN 201811492066 A CN201811492066 A CN 201811492066A CN 109545728 A CN109545728 A CN 109545728A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of automation wafer transfer methods in field of semiconductor processing, described method includes following steps: 25 wafer equidistant intervals are placed in wafer magazine, wafer magazine is placed on wait expect on platform again, wafer material frame is placed on locating platform；Lifting arm is jacked up upwards across wafer magazine, each wafer is lifted upwards, then lifting arm declines, two transfer robot arms move towards on the downside of wafer, two trailing arms hold wafer, latter two right transfer robot arm is mobile towards locating platform simultaneously, the wafer held is sent to above wafer material frame, lifting arm rises through wafer material frame, go up and down fupport arm each wafer, right latter two transfer robot arm reverse movement, trailing arm and wafer separate, lifting arm declines so that each wafer is fallen in wafer material frame, and wafer side is contacted with upper pressure pin.Wafer in wafer magazine can be transferred in wafer material frame by the present invention, avoid wafer force unbalance and breakage occurs.
Description
Technical field
The invention belongs to field of semiconductor processing, in particular to a kind of automation wafer transfer method.
Background technique
In wafer level packaging, test process, need often to shift or select wafer.The work that wafer is shifted or selected in magazine
The manual mode taken or vacuum WAND is drawn is generallyd use during industry.Taking manually, there are following risks: being easy because hand is straight
Contact and cause contamination of products, electrostatic injury the problems such as and lead to product defects；It artificially acts improper and wafer is caused to rupture.
Vacuum WAND draws wafer, and there are following risks: sucking pen, sucker directly contact crystal column surface and be easy to cause scratch；Wafer is in magazine
In intensively pile up, inconvenient, operating efficiency is low；It is easy wafer occurs because dying or adsorbing loosely to fall.
In the prior art, there is a kind of wafer transfer tool, number of patent application: CN 201410840504.4；The applying date:
2014.12.30；Publication number: CN 104505361A；Publication date: 2015.04.08；Its structure is concordant including holding and can edge
Sliding rail close up or separated the first platform and the second platform；On first platform there is limit turning and the first card slot to be used for
Wafer interconnecting device is fixed on the first platform and makes its opening direction towards the second platform；There is the second card on second platform
Slot, the first cylinder and the second cylinder；The collet of wafer magazine, the second card are accommodated on first cylinder and the second cylinder with groove
Wafer magazine is fixed on the second platform for engaging with the shackle portion of wafer magazine and makes its opening direction court by slot
To the first platform；The inside of first cylinder and the second cylinder is aligned with the hollow open of the collet part of wafer magazine.The device
Wafer can be shifted on the second platform from the first plateau levels, to shift wafer, but disadvantage is that: the thickness of wafer
Spend relatively thin, and brittleness is larger, and when Level Promoting wafer, wafer force unbalance is easily broken.
Summary of the invention
The object of the present invention is to provide a kind of automation wafer transfer method, the crystalline substance that will can be placed vertically in wafer magazine
Circle is lifted, and is transferred in wafer material frame, and wafer is mobile steady, avoids wafer force unbalance and breakage occurs.
The object of the present invention is achieved like this: a kind of automation wafer transfer method, including cabinet, sets side by side on cabinet
It is equipped with platform and locating platform to be expected, the platform to be expected includes the lateral transmission case that one group of correspondence is arranged and one group or so
The longitudinal moulding being correspondingly arranged is correspondingly arranged on lifting lift mechanism wait expect, corresponds to wafer magazine on the cabinet and set on platform
It is equipped with a pair of transversely movable transfer robot arm；Two described transfer robot arms or so are correspondingly arranged, transfer robot arm position
Above wafer magazine, transfer robot arm is L-shaped, and transfer robot arm includes traversing section and longitudinal sections, transfer robot arm longitudinal sections
Downside is fixedly connected with trailing arm, and the opposite side of two trailing arms is obliquely installed, interval setting along its length on the inclined surface of trailing arm
There are several locating slots, each locating slot is arranged in a one-to-one correspondence with each wafer；The locating platform includes that one group of correspondence is arranged
Pedestal is vertically arranged with baffle on pedestal, is symmetrically set with two positioning protrusion on pedestal, and also correspondence is set on locating platform
It is equipped with lifting lift mechanism；The lifting lift mechanism includes the lifting arm of two or so corresponding distributions, and lifting arm axis is longitudinal
Setting, the setting of lifting arm incline upward are arranged at intervals with several locating slots on the upside of lifting arm in the axial direction, each locating slot and each
Wafer is arranged in a one-to-one correspondence, and the groove that lifting arm passes through can be held by offering on the upside of cabinet；
Described method includes following steps:
(1) 25 wafer equidistant intervals are placed in wafer magazine, wafer state in a vertical shape, the upper side and lower side of wafer magazine
It is equipped with opening；
(2) front and rear sides of wafer magazine are placed between two lateral transmission cases again, the left and right sides of wafer magazine is placed
Between two longitudinal mouldings, crystal column surface is parallel with lateral transmission case length direction, and bottom is supported on corresponding lifting arm
Locating slot in；
(3) by wafer material frame support on the base, the wafer material frame include two correspondences setting deckle board, deckle board it
Between be provided with a pair of symmetrical upper pressure pin and a pair of symmetrical lower supporting rod, upper pressure pin inner shafts are to being arranged at intervals with 27
A locating slot, lower supporting rod upside is axially spaced to be provided with 27 locating slots, places in the locating slot of wafer material frame front and rear sides
There is protection baffle, the locating slot between two protection baffles is arranged in a one-to-one correspondence with each wafer, and two deckle board bottoms are fixedly connected with
Two or so the locating rods being correspondingly arranged, the deckle board of the front and rear sides of wafer material frame are acted against respectively on the baffle of corresponding pedestal,
The locating rod againsts the positioning protrusion of the corresponding the same side of two pedestals；
(4) lifting arm is jacked up upwards across wafer magazine, and each wafer is lifted upwards, and then lifting arm declines, and two turn
Telephone-moving tool palmistry is to being moved on the downside of wafer, and crystal round fringes protrude into the correspondence locating slot of trailing arm, and two trailing arms hold wafer,
Latter two right transfer robot arm is mobile towards locating platform simultaneously, the wafer held is sent to above wafer material frame, wafer material
Lifting arm below frame rises through wafer material frame, and two lifting arms hold in the palm each wafer jointly, latter two right transfer robot arm is anti-
To movement, trailing arm and wafer separate, lifting arm decline so that each wafer is fallen in wafer material frame, and bottom is supported on lower supporting rod
On, wafer side is contacted with upper pressure pin.
Wafer magazine is placed on wait expect on platform by this method, and wafer material frame is placed on locating platform, and machine is lifted in lifting
Structure first lifts the wafer in wafer magazine upwards, and two transfer robot arms move towards on the downside of wafer, by each wafer
It holds, then transfer robot arm moves in the same direction towards locating platform, so that the wafer held is moved to above wafer material frame, it is brilliant
Lifting lift mechanism below circle material frame rises and holds in the palm each wafer, and wafer is unclamped, risen by a pair of of transfer robot arm reverse movement
Lift mechanism decline is dropped so that each wafer is just fallen in the locating slot of wafer material frame.Compared with prior art, of the invention to have
Beneficial effect is: can lift the wafer placed vertically in wafer magazine, and be transferred to wafer by transfer robot arm
In material frame, wafer keeps vertical state mobile steady, and wafer stress balance avoids wafer from occurring damaged.
As a further improvement of the present invention, at least 3 tune can be rotatably set between two lateral transmission cases
Bearing, adjustment axis periphery are enclosed with sheath, and adjustment axis axis is longitudinally disposed, and at least 3 adjustment axle positions are below wafer and along crystalline substance
Circle is circumferentially distributed, and the both ends for adjusting axis are rotatably supported in respectively on corresponding laterally transmission tank wall, at least one lateral transmission case
Equipped with transmission mechanism；After wafer magazine is put well in step (2), transmission mechanism drives adjustment axis rotation, drives wafer by sheath
Rotation, so that the mark of crystal round fringes circumferentially rotates the position set.Markedness is arranged in crystal round fringes, and transmission mechanism drives
Axis rotation is adjusted, wafer rotation is driven by sheath, so that wafer circumferentially rotates the position set.
As a further improvement of the present invention, the transmission mechanism includes the bearing block of at least three pairs of correspondences setting,
Shaft is rotationally equipped between each pair of bearing block, shaft is sequentially connected with corresponding adjustment axis by shaft coupling, is covered in shaft
Equipped with sprocket wheel, the sprocket wheel in each shaft is connected through chain drive, and negative pulley wheel, negative pulley wheel warp are arranged in any shaft
The drive pulley of belt and motor output end is sequentially connected, and belt can be held by, which being equipped on the upside of lateral transmission case bottom and cabinet, wears
The groove crossed, the motor are arranged in cabinet.Motor drives driver pulley rotation, and drive pulley drives quilt by belt
Dynamic pulley rotation, shaft realize rotation, and the sprocket wheel in shaft passes through the sprocket wheel rotation in other shafts of chain-driving, each shaft
It all realizes rotation, drives adjustment axis rotation.
As a further improvement of the present invention, at least two parallel connecting rods are vertically arranged on the downside of the lifting arm,
Each connecting rod protrudes into cabinet inside and lower end is fixedly connected with lifting seat, at least 4 gib blocks is symmetrically arranged with around lifting seat, often
Root gib block matches with a upright guide rail setting, is equipped with lead screw at left and right sides of lifting seat, lead screw axis is vertically arranged, silk
The upper and lower ends of thick stick are rotatably supported in respectively on a bearing block, and one end of lead screw is connect with motor drive, and silk is arranged on lead screw
Stem nut, feed screw nut are sequentially connected by attachment base and lifting seat.Motor drives lead screw to rotate, on the feed screw nut on lead screw
Lower movement drives lifting seat to move up and down, and lifting seat drives lifting arm to move up and down.
As a further improvement of the present invention, it is equipped with upright bar vertically on the downside of the transfer robot arm traversing section, upright bar is protruded into
In cabinet and lower end is arranged on Mobile base, and Mobile base is sequentially connected by sliding block and cross slide way, is provided with electricity on Mobile base
Machine, the output end of motor straight down and are equipped with gear, are axially provided with rack gear on cross slide way, wheel and rack is meshed.
Motor driven gear rotation, gear are rolled along rack gear, and Mobile base is driven to move along cross slide way, and transfer robot arm is realized horizontal
To movement, when two transfer robot arms are moved towards to corresponding position, crystal round fringes are inserted into corresponding locating slot, and trailing arm can be from
Hold in the palm wafer in lower section.
Detailed description of the invention
Fig. 1 is top view of the invention.
Fig. 2 is the sectional view along AA of Fig. 1.
Fig. 3 is the BB of Fig. 2 to cross-sectional view.
Fig. 4 is the top view of the wafer magazine equipped with wafer.
Fig. 5 is the main view of wafer magazine.
Fig. 6 is the longitudinal cross-section cross-sectional view of platform to be expected.
Fig. 7 is the partial enlarged view of Fig. 6.
Fig. 8 is wafer and the relative position relation figure for adjusting axis.
Fig. 9 is the location diagram of each sprocket wheel.
Figure 10 is the top view of lifting seat.
Figure 11 is the CC of Fig. 1 to cross-sectional view.
Figure 12 is the top view of cross slide way and Mobile base.
Figure 13 is the perspective view of cross slide way and Mobile base.
Figure 14 is top view when transfer robot arm holds wafer.
Figure 15 is the side view of transfer robot arm.
Figure 16 is main view when transfer robot arm holds wafer.
Figure 17 is the DD of Fig. 2 to cross-sectional view.
Figure 18 is the three-dimensional structure diagram of wafer material frame.
Wherein, 1 cabinet, 2 platforms to be expected, 3 locating platforms, 4 lateral transmission cases, 5 longitudinal mouldings, 6 wafer magazines, 7 wafers,
8 transfer robot arms, 8a traversing section, 8b longitudinal sections, 9 pedestals, 10 baffles, 11 backing plates one, 12 backing plates two, 13 adjustment axis, 14 bearings
Seat, 15 shafts, 16 shaft couplings, 17 attachment bases, 18 sprocket wheels, 19 negative pulley wheels, 20 belts, 21 motors, 22 drive pulleys, 23
Lifting arm, 23a locating slot, 24 connecting rods, 25 lifting seats, 26 gib blocks, 27 upright guide rails, 28 lead screws, 28a feed screw nut, 29
Trailing arm, 29a locating slot, 30 upright bars, 31 Mobile bases, 32 wafer material frames, 32a deckle board, the upper pressure pin of 32b, 32c lower supporting rod, 32d positioning
Bar, 33 gears, 33a rack gear, 34 sliding blocks, 34a cross slide way, 35 positioning protrusion, 36 positioning plates, 36a navigation button, 37 bottom plates.
Specific embodiment
As shown in Fig. 1-18, it is a kind of automation wafer transfer device, including cabinet 1, is set side by side on cabinet 1 and needs to be expected
Platform 2 and locating platform 3, which is characterized in that platform 2 to be expected includes the lateral transmission case 4 that one group of correspondence is arranged and one group
Longitudinal moulding 5 for being correspondingly arranged of left and right between two lateral transmission cases 4 and is located at correspondence between two longitudinal mouldings 5 and is placed with
Wafer magazine 6 is placed with several wafers 7 parallel to each other, 4 length of 7 surface of wafer and lateral transmission case in wafer magazine 6 vertically
Direction is parallel, and the upper side and lower side of wafer magazine 6 is equipped with opening, and the lower section of wafer magazine 6 is correspondingly arranged on lifting and lifts machine
Structure corresponds to wafer magazine 6 on cabinet 1 and is provided with a pair of transversely movable transfer robot arm 8；Locating platform 3 includes one group
The pedestal 9 of correspondence setting, is vertically arranged with baffle 10 on pedestal 9, wafer material frame 32 is supported on pedestal 9, wafer material frame
32 front and rear sides are acted against respectively on the baffle 10 of corresponding pedestal 9, and the lower section of wafer material frame 32 is also correspondingly arranged on lifting support
Lift mechanism.The bottom of wafer magazine 6 is supported on backing plate 1, and backing plate 1 is located between two lateral transmission cases 4 and is located at
Between two longitudinal mouldings 5, it can be rotatably set at least 3 adjustment axis 13 between two lateral transmission cases 4, adjusted outside axis 13
It is enclosed with sheath week, adjustment 13 axis of axis is longitudinally disposed, and at least 3 adjustment axis 13 are located at 7 lower section of wafer and along circumferential point of wafer 7
Cloth, the both ends of adjustment axis 13 are rotatably supported in respectively on 4 wall of corresponding lateral transmission case, are equipped at least one lateral transmission case 4
Transmission mechanism.The transmission mechanism includes the bearing block 14 of at least three pairs of correspondences setting, between each pair of bearing block 14
It is rotatably provided with shaft 15, shaft 15 is sequentially connected by shaft coupling 16 with corresponding adjustment axis 13, is arranged with sprocket wheel in shaft 15
18, the sprocket wheel 18 in each shaft 15 is connected through chain drive, is arranged with negative pulley wheel 19, negative pulley wheel in any shaft 15
19 drive pulleys 22 through belt 20 and 21 output end of motor are sequentially connected, and are all provided on the upside of lateral 4 bottom of transmission case and cabinet 1
The groove that belt 20 passes through can be held by having, and motor 21 is arranged in cabinet 1.The lifting lift mechanism includes two or so corresponding point
The lifting arm 23 of cloth, 23 axis of lifting arm is longitudinally disposed, the setting of 23 incline upward of lifting arm, and 23 upside of lifting arm is in the axial direction
Several locating slot 23a are arranged at intervals with, each locating slot 23a is arranged in a one-to-one correspondence with each wafer 7,1 upside of backing plate 1 and cabinet
The groove that lifting arm 23 passes through can be held by offering；At least two parallel connecting rods 24 are vertically arranged on the downside of lifting arm 23,
Each connecting rod 24 protrudes into 1 inside of cabinet and lower end is fixedly connected with lifting seat 25, and at least 4 are symmetrically arranged with around lifting seat 25 and is led
To item 26, every gib block 26 matches with a upright guide rail 27 setting, and lead screw 28, silk are equipped at left and right sides of lifting seat 25
The setting of 28 axis vertical of thick stick, the upper and lower ends of lead screw 28 are rotatably supported in respectively on a bearing block 14, one end of lead screw 28 and electricity
Machine 21 is sequentially connected, and feed screw nut is arranged on lead screw 28, and feed screw nut 28a is connected by attachment base 17 and the transmission of lifting seat 25
It connects.Two transfer robot arms 8 or so are correspondingly arranged, and transfer robot arm 8 is located at 6 top of wafer magazine, and transfer robot arm 8 is L-shaped,
Transfer robot arm 8 includes traversing section 8a and longitudinal sections 8b, is fixedly connected with trailing arm 29 on the downside of 8 longitudinal sections 8b of transfer robot arm, and two
The opposite side of trailing arm 29 is obliquely installed, and is arranged at intervals with several locating slot 29a on the inclined surface of trailing arm 29 along its length, respectively
Locating slot 29a is arranged in a one-to-one correspondence with each wafer 7；It is equipped with upright bar 30 vertically on the downside of 8 traversing section 8a of transfer robot arm, upright bar 30 is stretched
Enter in cabinet 1 and lower end is arranged on Mobile base 31, Mobile base 31 is sequentially connected by sliding block 34 and cross slide way 34a, mobile
Motor 21 is provided on seat 31, and the output end of motor 21 straight down and is equipped with gear 33, and the upper axial direction of cross slide way 34a is provided with
Rack gear 33a, gear 33 are meshed with rack gear 33a.Wafer material frame 32 includes the deckle board 32a, deckle board 32a of two correspondences setting
Between be provided with a pair of symmetrical upper pressure pin 32b and a pair of symmetrical lower supporting rod 32c, it is axial on the inside of upper pressure pin 32b
Several locating slots are arranged at intervals with, the upside lower supporting rod 32c is axially spaced to be provided with several locating slots, 32 front and back two of wafer material frame
Protection baffle is placed in the locating slot of side, the locating slot between two protection baffles is arranged in a one-to-one correspondence with each wafer 7, two frames
The bottom plate 32a is fixedly connected with two or so the locating rod 32d being correspondingly arranged.Pedestal 9 is arranged on backing plate 2 12, pedestal 9
Baffle 10 is in contact with corresponding deckle board 32a, and two positioning protrusion 35 are symmetrically set on pedestal 9, and locating rod 32d againsts
The positioning protrusion 35 of two corresponding the same sides of pedestal 9 is provided with positioning plate 36 on any pedestal 9, and positioning plate 36 is equipped with can
Flexible navigation button 36a.The bottom of wafer magazine 6 is symmetrically set with vertical bottom plate 37, and wafer magazine 6 passes through bottom plate 37
It is supported on backing plate 1.1 surface of cabinet is provided with several circular through holes.
A kind of automation wafer transfer method of the invention, including cabinet 1 are set side by side on cabinet 1 and need to be expected 2 He of platform
Locating platform 3, platform 2 to be expected include the lateral transmission case 4 and one group or so the longitudinal direction being correspondingly arranged that one group of correspondence is arranged
Moulding 5 is correspondingly arranged on lifting lift mechanism on platform 2 to be expected, corresponded on cabinet 1 wafer magazine 6 be provided with it is a pair of can be horizontal
To mobile transfer robot arm 8；Two transfer robot arms 8 or so are correspondingly arranged, and transfer robot arm 8 is located at 6 top of wafer magazine,
Transfer robot arm 8 is L-shaped, and transfer robot arm 8 includes traversing section 8a and longitudinal sections 8b, and 8 downside longitudinal sections 8b of transfer robot arm is solid
Surely it is connected with trailing arm 29, the opposite side of two trailing arms 29 is obliquely installed, interval setting along its length on the inclined surface of trailing arm 29
There are several locating slot 29a, each locating slot 29a to be arranged in a one-to-one correspondence with each wafer 7；Locating platform 3 includes that one group of correspondence is set
The pedestal 9 set is vertically arranged with baffle 10 on pedestal 9, and two positioning protrusion 35 are symmetrically set on pedestal 9, and positioning is flat
Also lifting lift mechanism is correspondingly arranged on platform 3；The lifting lift mechanism includes the lifting arm 23 of two or so corresponding distributions,
23 axis of lifting arm is longitudinally disposed, the setting of 23 incline upward of lifting arm, if 23 upside of lifting arm is arranged at intervals in the axial direction
Dry locating slot 23a, each locating slot 23a are arranged in a one-to-one correspondence with each wafer 7, and lifting arm 23 can be held by, which offering on the upside of cabinet 1, passes through
Groove；
Described method includes following steps:
(1) 25 wafer, 7 equidistant interval is placed in wafer magazine 6, the state in a vertical shape of wafer 7, the upside of wafer magazine 6 and
Downside is equipped with opening；
(2) front and rear sides of wafer magazine 6 are placed between two lateral transmission cases 4 again, the left and right sides of wafer magazine 6 is put
It is placed between two longitudinal mouldings 5,7 surface of wafer is parallel with lateral 4 length direction of transmission case, and 7 bottom of wafer is supported on correspondence
In the locating slot 23a of lifting arm 23；It can be rotatably set at least 3 adjustment axis 13 between two lateral transmission cases 4, adjusted axis
13 peripheries are enclosed with sheath, and adjustment 13 axis of axis is longitudinally disposed, and at least 3 adjustment axis 13 are located at 7 lower section of wafer and along wafer 7 weeks
To distribution, the both ends for adjusting axis 13 are rotatably supported in respectively on 4 wall of corresponding lateral transmission case, at least one lateral transmission case 4
Equipped with transmission mechanism；After wafer magazine 6 is put well in step (2), transmission mechanism drives adjustment axis 13 to rotate, and is driven by sheath brilliant
7 rotation of circle, so that the mark at 7 edge of wafer circumferentially rotates the position set；
(3) wafer material frame 32 is supported on pedestal 9, wafer material frame 32 includes the deckle board 32a of two correspondences setting, frame
A pair of symmetrical upper pressure pin 32b and a pair of symmetrical lower supporting rod 32c, the upper inside pressure pin 32b are provided between plate 32a
Axially spaced-apart is provided with 27 locating slots, axially spaced on the upside of lower supporting rod 32c to be provided with 27 locating slots, before wafer material frame 32
Protection baffle is placed in the locating slot of two sides afterwards, the locating slot between two protection baffles is arranged in a one-to-one correspondence with each wafer 7,
Two bottoms deckle board 32a are fixedly connected with two or so the locating rod 32d being correspondingly arranged, the deckle board of the front and rear sides of wafer material frame 32
32a is acted against respectively on the baffle 10 of corresponding pedestal 9, and locating rod 32d againsts the convex of the corresponding the same side of two pedestals 9
Play 35；
(4) lifting arm 23 is jacked up across wafer magazine 6 upwards, and each wafer 7 is lifted upwards, and then lifting arm 23 declines,
Two transfer robot arms 8 move towards 7 downside of wafer, and 7 edge of wafer protrudes into the correspondence locating slot 29a of trailing arm 29, and two
Trailing arm 29 holds wafer 7, latter two right transfer robot arm 8 is mobile towards locating platform 3 simultaneously, and the wafer 7 held is sent
To 32 top of wafer material frame, the lifting arm 23 of 32 lower section of wafer material frame rises through wafer material frame 32, and two lifting arms 23 are common
Each wafer 7 is held in the palm, right latter two transfer robot arm 8 reverse movement, trailing arm 29 is separated with wafer 7, and lifting arm 23 declines so that each
Wafer 7 is fallen in wafer material frame 32, and 7 bottom of wafer is supported on lower supporting rod 32c, and 7 side of wafer is contacted with upper pressure pin 32b.It is complete
At the transfer of wafer 7.
The transmission mechanism includes the bearing block 14 of at least three pairs of correspondences setting, can be turned between each pair of bearing block 14
It is equipped with shaft 15 dynamicly, shaft 15 is sequentially connected by shaft coupling 16 with corresponding adjustment axis 13, it is arranged with sprocket wheel 18 in shaft 15,
Sprocket wheel 18 in each shaft 15 is connected through chain drive, and negative pulley wheel 19, negative pulley wheel 19 are arranged in any shaft 15
Drive pulley 22 through belt 20 and 21 output end of motor is sequentially connected, and is equipped on the upside of lateral 4 bottom of transmission case and cabinet 1
The groove that belt 20 passes through can be held, motor 21 is arranged in cabinet 1.Motor 21 drives drive pulley 22 to rotate, drive pulley
Wheel 22 drives negative pulley wheel 19 to rotate by belt 20, and shaft 15 realizes rotation, and the sprocket wheel 18 in shaft 15 passes through chain band
The sprocket wheel 18 moved in other shafts 15 rotates, and each shaft 15 all realizes rotation, and adjustment axis 13 is driven to rotate.
At least two parallel connecting rods 24 are vertically arranged on the downside of lifting arm 23, each connecting rod 24 protrudes into inside cabinet 1
And lower end is fixedly connected with lifting seat 25, is symmetrically arranged at least 4 gib blocks 26 around lifting seat 25, every gib block 26 with
One upright guide rail 27 matches setting, and lead screw 28, the setting of 28 axis vertical of lead screw, lead screw 28 are equipped at left and right sides of lifting seat 25
Upper and lower ends be rotatably supported on a bearing block 14 respectively, one end of lead screw 28 and motor 21 are sequentially connected, and cover on lead screw 28
Equipped with feed screw nut, feed screw nut 28a is sequentially connected by attachment base 17 and lifting seat 25.Motor 21 drives lead screw 28 to rotate,
Feed screw nut 28a on lead screw 28 is moved up and down, and lifting seat 25 is driven to move up and down, and lifting seat 25 drives and moves down on lifting arm 23
It is dynamic.
Upright bar 30 is equipped on the downside of 8 traversing section 8a of transfer robot arm vertically, upright bar 30 is protruded into cabinet 1 and lower end setting is moving
On dynamic seat 31, Mobile base 31 is sequentially connected by sliding block 34 and cross slide way 34a, is provided with motor 21, motor on Mobile base 31
21 output end straight down and is equipped with gear 33, and cross slide way 34a is upper axial to be provided with rack gear 33a, gear 33 and rack gear 33a
It is meshed.Motor 21 is rotated with moving gear 33, and gear 33 is rolled along rack gear 33a, drives Mobile base 31 along cross slide way 34a
Mobile, transfer robot arm 8 realizes transverse shifting, and when two transfer robot arms 8 are moved towards to corresponding position, 7 edge of wafer is inserted
Enter in corresponding locating slot 29a, trailing arm 29 can hold in the palm wafer 7 from below.
The present invention has the advantages that the wafer 7 placed vertically in wafer magazine 6 can be lifted, and pass through transfer
Manipulator 8 is transferred in wafer material frame 32, and wafer 7 keeps vertical state mobile steady, and 7 stress balance of wafer avoids wafer 7 from sending out
It is raw damaged.
The present invention is not limited to the above embodiments, on the basis of technical solution disclosed by the invention, the skill of this field
For art personnel according to disclosed technology contents, one can be made to some of which technical characteristic by not needing creative labor
A little replacements and deformation, these replacements and deformation are within the scope of the invention.
Claims (5)
1. a kind of automation wafer transfer method, including cabinet, it is set side by side on cabinet and needs to be expected platform and locating platform, it is described
Platform to be expected includes the lateral transmission case and one group or so the longitudinal moulding being correspondingly arranged of one group of correspondence setting, platform to be expected
On be correspondingly arranged on lifting lift mechanism, wafer magazine is corresponded on the cabinet and is provided with a pair of transversely movable transfer
Tool hand；Two described transfer robot arms or so are correspondingly arranged, and transfer robot arm is located above wafer magazine, and transfer robot arm is in L
Shape, transfer robot arm include traversing section and longitudinal sections, are fixedly connected with trailing arm on the downside of transfer robot arm longitudinal sections, two trailing arms are opposite
Side be obliquely installed, be arranged at intervals with several locating slots on the inclined surface of trailing arm along its length, each locating slot and each wafer
It is arranged in a one-to-one correspondence；The locating platform includes the pedestal of one group of correspondence setting, is vertically arranged with baffle, pedestal on pedestal
On be symmetrically set with two positioning protrusion, be also correspondingly arranged on lifting lift mechanism on locating platform；The lifting is lifted
Mechanism includes the lifting arm of two or so corresponding distributions, and lifting arm axis is longitudinally disposed, the setting of lifting arm incline upward, lifting arm
Upside is arranged at intervals with several locating slots in the axial direction, and each locating slot is arranged in a one-to-one correspondence with each wafer, opens up on the upside of cabinet
The groove that lifting arm passes through can be held by having；
It is characterized in that, described method includes following steps:
(1) 25 wafer equidistant intervals are placed in wafer magazine, wafer state in a vertical shape, the upper side and lower side of wafer magazine
It is equipped with opening；
(2) front and rear sides of wafer magazine are placed between two lateral transmission cases again, the left and right sides of wafer magazine is placed
Between two longitudinal mouldings, crystal column surface is parallel with lateral transmission case length direction, and bottom is supported on corresponding lifting arm
Locating slot in；
(3) by wafer material frame support on the base, the wafer material frame include two correspondences setting deckle board, deckle board it
Between be provided with a pair of symmetrical upper pressure pin and a pair of symmetrical lower supporting rod, upper pressure pin inner shafts are to being arranged at intervals with 27
A locating slot, lower supporting rod upside is axially spaced to be provided with 27 locating slots, places in the locating slot of wafer material frame front and rear sides
There is protection baffle, the locating slot between two protection baffles is arranged in a one-to-one correspondence with each wafer, and two deckle board bottoms are fixedly connected with
Two or so the locating rods being correspondingly arranged, the deckle board of the front and rear sides of wafer material frame are acted against respectively on the baffle of corresponding pedestal,
The locating rod againsts the positioning protrusion of the corresponding the same side of two pedestals；
(4) lifting arm is jacked up upwards across wafer magazine, and each wafer is lifted upwards, and then lifting arm declines, and two turn
Telephone-moving tool palmistry is to being moved on the downside of wafer, and crystal round fringes protrude into the correspondence locating slot of trailing arm, and two trailing arms hold wafer,
Latter two right transfer robot arm is mobile towards locating platform simultaneously, the wafer held is sent to above wafer material frame, wafer material
Lifting arm below frame rises through wafer material frame, and two lifting arms hold in the palm each wafer jointly, latter two right transfer robot arm is anti-
To movement, trailing arm and wafer separate, lifting arm decline so that each wafer is fallen in wafer material frame, and bottom is supported on lower supporting rod
On, wafer side is contacted with upper pressure pin.
2. a kind of automation wafer transfer method according to claim 1, which is characterized in that two lateral transmission cases
Between can be rotatably set at least 3 adjustment axis, adjustment axis periphery is enclosed with sheath, and adjustment axis axis is longitudinally disposed, at least 3
Root adjustment axle position is below wafer and circumferentially distributed along wafer, and the both ends for adjusting axis are rotatably supported in corresponding lateral transmission case respectively
On wall, transmission mechanism is equipped at least one lateral transmission case；After wafer magazine is put well in step (2), transmission mechanism, which drives, to be adjusted
Bearing rotation drives wafer rotation by sheath, so that the mark of crystal round fringes circumferentially rotates the position set.
3. a kind of automation wafer transfer method according to claim 2, which is characterized in that the transmission mechanism includes extremely
The bearing block of few three pairs of correspondences setting, is rotationally equipped with shaft between each pair of bearing block, shaft by shaft coupling with
Corresponding adjustment axis is sequentially connected, and is arranged with sprocket wheel in shaft, the sprocket wheel in each shaft is connected through chain drive, is covered in any shaft
Equipped with negative pulley wheel, negative pulley wheel is sequentially connected through the drive pulley of belt and motor output end, lateral transmission case bottom
The groove that belt passes through can be held by being equipped on the upside of portion and cabinet, and the motor is arranged in cabinet.
4. a kind of automation wafer transfer method according to claim 1-3, which is characterized in that the lifting arm
Downside is vertically arranged at least two parallel connecting rods, and each connecting rod protrudes into cabinet inside and lower end is fixedly connected with lifting
Seat, is symmetrically arranged at least 4 gib blocks around lifting seat, and every gib block matches with a upright guide rail setting, lifting seat
The left and right sides is equipped with lead screw, and lead screw axis is vertically arranged, and the upper and lower ends of lead screw are rotatably supported in respectively on a bearing block, silk
One end of thick stick is connect with motor drive, and feed screw nut is arranged on lead screw, and feed screw nut is connected by attachment base and lifting seat transmission
It connects.
5. a kind of automation wafer transfer method according to claim 1-3, which is characterized in that the transfer
Upright bar is equipped on the downside of tool hand traversing section vertically, upright bar is protruded into cabinet and lower end is arranged on Mobile base, and Mobile base passes through sliding block
It is sequentially connected with cross slide way, motor is provided on Mobile base, the output end of motor is straight down and equipped with gear, cross slide way
Upper axial direction is provided with rack gear, and wheel and rack is meshed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811492066.1A CN109545728B (en) | 2018-12-07 | 2018-12-07 | Automatic wafer transfer method |
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|---|---|---|---|
| CN201811492066.1A CN109545728B (en) | 2018-12-07 | 2018-12-07 | Automatic wafer transfer method |
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| CN109545728B CN109545728B (en) | 2021-03-05 |
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| CN110993547A (en) * | 2019-11-12 | 2020-04-10 | 至微半导体(上海)有限公司 | Wafer basket changing device |
| CN115155915A (en) * | 2022-08-01 | 2022-10-11 | 广东德磁科技有限公司 | Anti-magnetic ring plate sticking device of butt joint magnetic ring spraying equipment |
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|---|---|
| CN109545728B (en) | 2021-03-05 |
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