CN115837358A

CN115837358A - Direct-push type wafer sorting machine and wafer sorting process thereof

Info

Publication number: CN115837358A
Application number: CN202211595798.XA
Authority: CN
Inventors: 卢国强; 郑灿升; 王勇; 王俊涛
Original assignee: Shenzhen Yougen Technology Co ltd
Current assignee: Shenzhen Yougen Technology Co ltd
Priority date: 2022-12-13
Filing date: 2022-12-13
Publication date: 2023-03-24

Abstract

The invention discloses a direct-push type wafer sorting machine and a wafer sorting process thereof, wherein the direct-push type wafer sorting machine comprises a machine table arranged horizontally and material boxes arranged on the machine table, wherein the material boxes comprise at least two material boxes, the tops of the at least two material boxes are open surfaces, and the direct-push type wafer sorting machine also comprises a carrying disc carrying mechanism and a wafer transferring mechanism; the wafer transfer mechanisms comprise at least two groups, and the at least two groups of wafer transfer mechanisms are arranged on the side part of the material box; the carrier tray carrying mechanism is arranged on the carrier box and the wafer transferring mechanism; the wafer transfer mechanism comprises a wafer bearing component, a wafer transfer component, a detection component and a transfer component, wherein the wafer bearing component and the wafer transfer component are arranged at intervals; the detection assembly and the transfer assembly are respectively arranged at the side parts of the wafer carrying assembly and the wafer transfer assembly; the detecting component is propped against the die-connecting part of the bearing turntable from the outer side. The invention adopts the close-gap vertical insertion carrying disc, realizes the integration of automatic detection and wafer transfer and carrying, realizes the rapid transfer of crystal grains by directly pushing the thimble, and effectively improves the wafer sorting efficiency.

Description

Direct-push type wafer sorting machine and wafer sorting process thereof

Technical Field

The invention relates to the field of semiconductor automation equipment, in particular to a direct-push type wafer sorting machine and a wafer sorting process thereof.

Background

Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed.

In the wafer manufacturing process, wafers of different sizes, types, good products or defective products are mixed together after being manufactured, and the wafers of the same type need to be sorted and stored, namely, the wafers are sorted, and the wafers are generally supported and fixed by a carrying disc. In the existing wafer sorting equipment, the adopted mode is that different types of wafers are respectively conveyed to different vacant carrying discs after the wafers are taken out from the carrying discs to be sorted through the mechanical arm, the sorting mode needs the mechanical arm to rotate back and forth to take and place the materials, the time gap between taking and placing the materials is long, the sorting efficiency is low, and the existing wafer sorting requirements cannot be met.

Disclosure of Invention

The invention aims to solve at least one of the technical problems in the prior art, and provides a direct-push type wafer sorting machine and a wafer sorting process thereof, wherein a near-gap vertical insertion carrying disc is adopted, automatic detection and wafer transferring and carrying are integrated, rapid grain transferring is realized by directly pushing an ejector pin, and the wafer sorting efficiency is effectively improved.

The technical scheme adopted by the invention is as follows: a direct push type wafer sorting machine comprises a machine platform arranged horizontally and material boxes arranged on the machine platform, wherein the material boxes comprise at least two material boxes, the tops of the at least two material boxes are open surfaces, the direct push type wafer sorting machine also comprises a carrying disc carrying mechanism and a wafer transferring mechanism, wherein,

at least two clamping grooves are respectively arranged on two symmetrically arranged inner side walls of the material box, are arranged along the vertical direction and extend upwards to the open surface at the top of the material box so as to conveniently take and place the wafer carrying disc up and down;

the wafer transfer mechanisms comprise at least two groups, and the at least two groups of wafer transfer mechanisms are arranged on the side parts of the material boxes;

the tray carrying mechanism is erected on the material loading box and the wafer transferring mechanism, takes out the wafer tray to be sorted from the material loading box and carries the wafer tray into the wafer transferring mechanism, and carries the wafer tray after the sorting in the wafer transferring mechanism back to the material loading box;

the wafer transfer mechanism comprises a wafer bearing component, a wafer transfer component, a detection component and a transfer component, wherein the wafer bearing component and the wafer transfer component are arranged at intervals, and an insertion space is formed between the wafer bearing component and the wafer transfer component so as to insert and place a bearing carrying disc and a transfer carrying disc respectively; the detection component and the transfer component are respectively arranged at the side parts of the wafer carrying component and the wafer transfer component; the detection component props against the grain receiving part of the bearing turntable from the outer side and detects the wafer on the transfer bearing disk; the transfer component sorts and transfers the crystal grains on the transfer carrying disc from the outer side to the carrying disc.

Preferably, the carrying tray carrying mechanism comprises a rack, a first linear module, a second linear module and a carrying tray carrying assembly, wherein the rack is erected on the machine platform; the first linear module is horizontally arranged on the rack; the second linear module is connected to the output end of the first linear module along the direction perpendicular to the first linear module; the carrying disc carrying assembly is connected to the output end of the second linear module and is driven by the first linear module and the second linear module to linearly move in the longitudinal direction and the transverse direction in the horizontal plane.

Preferably, the tray carrying assembly comprises two groups of chuck plate parts which are arranged in front and at back, and the carrying assembly moves up and down along the vertical direction so as to be close to the material box or the wafer transfer mechanism to take and place the wafer tray; the carrying assembly guides the limiting wafer carrying disc through the flexible annular groove.

Preferably, the wafer carrying disc is of a plate-shaped structure, the middle part of the wafer carrying disc is a circular carrying plane, and at least two wafers are distributed in the carrying plane; the outer side of the wafer carrier plate is a rigid supporting part so as to be convenient for clamping and carrying.

Preferably, the wafer bearing component and the wafer transferring component are vertically arranged, the wafer bearing component and the wafer transferring component are arranged in parallel at intervals, and circular through grooves are correspondingly formed in the wafer bearing component and the wafer transferring component; the wafer transfer assembly is internally provided with a transfer carrying disc in a vertical insertion manner, and the circular carrying planes of the carrying disc and the transfer carrying disc are arranged corresponding to the circular through grooves.

Preferably, the wafer bearing assembly comprises a bearing component, a bearing rotating component, a bearing disc and a first convex ring, wherein the bearing component is vertically arranged on the machine platform; the bearing plate is vertically arranged on one side of the bearing part and is rotatably connected with the side wall of the bearing part along the vertical plane direction; the bearing rotating component is arranged on the bearing component, and the output end of the bearing rotating component is connected with the bearing disc so as to drive the bearing disc to rotate; a circular through groove is formed in the bearing plate; the first convex ring is arranged on the bearing disc along the edge of the circular through groove and protrudes outwards; the bearing carrying disc is vertically inserted on the bearing disc and fixed by the bearing disc, and the first convex ring jacks up the bearing plane of the bearing carrying disc outwards to tension the bearing plane.

Preferably, the detection assembly comprises a detection driving part, a detection part and a bearing head, wherein the detection driving part is arranged at the side part of the wafer bearing assembly and outputs power along the longitudinal direction and the transverse direction in the horizontal plane; the detection part is arranged on the output end of the detection driving part and is driven by the detection driving part; the bearing head is arranged on the output end of the detection driving part and is positioned between the detection part and the wafer bearing component, and the end face of the bearing head is tightly attached to the wafer bearing component so as to be conveniently abutted to a bearing carrying disc on the wafer bearing component when wafers are transferred.

Preferably, the wafer transfer assembly comprises a transfer bearing part and a transfer bearing seat, wherein the transfer bearing part is vertically arranged on the machine table and outputs upward power; the transfer bearing seat is vertically connected to the output end of the transfer bearing part, and a circular through groove is formed in the transfer bearing seat.

Preferably, the transfer assembly comprises a transfer driving part and a transfer part, wherein the transfer part is arranged at the side part of the wafer transfer assembly and outputs power along the longitudinal direction and the transverse direction in the horizontal plane; the transfer component is arranged on the output end of the transfer driving component and moves back and forth in a linear way towards the direction of the wafer bearing component so as to push and transfer the wafer on the transfer tray on the wafer transfer component to the bearing tray on the wafer bearing component.

A wafer sorting process of a direct-push type wafer sorter comprises the following process steps:

s1, full-load plate feeding: the tray carrying mechanism takes out the transfer trays to be sorted from the material box and vertically inserts the transfer trays into the wafer bearing assembly;

s2, loading an empty tray: the carrier disc carrying mechanism takes out the empty carrier rotary disc from the material box and vertically inserts the empty carrier rotary disc into the wafer transfer assembly;

s3, detecting and fixing the carrier disc in a plug-in manner: after the transfer turntable and the bearing turntable are inserted in the steps S1 and S2, the wafer bearing assembly and the wafer transfer assembly carry out disc detection, and if no disc is detected, the step S1 and/or the step S2 are/is repeated; the wafer bearing component and the wafer transferring component are used for adsorbing and fixing the inserted transferring carrying disc and the inserted carrying disc;

s4, adjusting the position and the angle of the carrying disc: the position and the angle of the transfer carrying disc or the carrying disc fixed in the step S3 are adjusted in a vertical plane through the wafer carrying assembly and the wafer transferring assembly respectively;

s5, wafer detection: the detection assembly arranged outside the wafer bearing assembly shoots the wafer on the transfer bearing disc through the wafer bearing assembly and the bearing rotary disc and uploads the shot pattern to the industrial control center;

s6, wafer transfer: step 5, after analyzing the wafer distribution situation on the transfer carrying disc, the industrial control center sends a control instruction to the detection assembly and the transfer assembly, wherein the transfer assembly pushes the transfer carrying disc from the outer side of the wafer transfer assembly, pushes and transfers one wafer on the transfer carrying disc to the carrying disc, and the wafer is carried from the other side by the detection assembly;

s7, carrying disc replacement: s6, after the same wafer on the transfer tray is transferred, the carrying tray carrying mechanism extracts the carrying tray and transfers the carrying tray into the material box, and the empty carrying tray is taken out from the material box again and inserted into the wafer carrying assembly;

s8, wafer sorting: and (7) after the loading carrying disc is inserted in the step (S7), repeating the steps (S3) to (S6), transferring another wafer on the transferring carrying disc to the loading carrying disc by the transferring assembly, and repeating the steps until all similar wafers on the transferring carrying disc are transferred to different loading carrying discs.

The invention has the beneficial effects that:

aiming at the defects and shortcomings in the prior art, the invention independently develops and designs the direct-push type wafer sorting machine and the wafer sorting process thereof, wherein the loading disc is vertically inserted in a near-gap mode, the automatic detection and the wafer transferring and loading are integrated, the rapid grain transferring is realized by the direct pushing of the ejector pins, and the wafer sorting efficiency is effectively improved.

The invention is applied to the field of automatic wafer sorting, and has the function of respectively transferring different wafers to different carrying disks after automatically detecting various wafers which are mixed and placed on the transferring carrying disks. Based on the process requirements, a plurality of material boxes are arranged on a machine platform at intervals in parallel and used for storing and transferring the carrier disc and the bearing carrier disc, a carrier disc carrying mechanism is arranged above the material boxes, and the carrier disc carrying mechanism moves back and forth in a linear mode above the material boxes and the wafer transferring mechanism so as to transfer the carrier disc back and forth between the material boxes and the wafer transferring mechanism; the wafer transfer mechanism is arranged on the side part of the material box, and in order to improve the wafer sorting efficiency of the whole machine, the wafer transfer mechanism comprises a plurality of groups, one group of wafer transfer mechanism can carry out the picking and placing work of the carrier disc during the wafer transfer process, so that the carrier disc can be carried and the wafer can be transferred at the same time, and the stand-by time of the station of the whole machine is effectively reduced. Different from the prior art, the wafer transfer mechanism comprises wafer bearing components and wafer transfer components which are arranged at intervals, the wafer bearing components and the wafer transfer components are arranged on a machine table at intervals, an insertion space with an open structure at the top is formed between the wafer bearing components and the wafer transfer components, a transfer carrying disc of a wafer to be transferred is vertically inserted into the wafer transfer components, an empty carrying disc of the wafer to be carried is vertically inserted into the wafer bearing components, the two inserted carrying discs are arranged in parallel at intervals, the distance between the two carrying discs can be controlled to be 2.5mm, the middle parts of the transfer carrying disc and the carrying disc are circular carrying planes, the circular carrying planes can be used as carriers through flexible blue film materials, and the outer side parts of the carrying planes can be made of rigid metal materials so as to be convenient for clamping and carrying; after the loading disc is inserted, a detection assembly arranged on the outer side of the crystal grain loading assembly adjusts the position from the outer side and shoots, detects and transfers the wafer on the loading disc, and horizontally approaches the wafer loading assembly from the outer side; the transfer assembly arranged outside the wafer transfer assembly is close to the wafer bearing assembly from the outer side and linearly pushes the blue film of the transfer carrier disc from the outer side to deform the blue film, the blue film on the transfer assembly is attached and transferred to the blue film on the bearing carrier disc, and the detection assembly pushes the receiving part of the blue film of the bearing carrier disc from the other side of the bearing carrier disc to provide a horizontal bearing surface so as to prevent the blue film from being excessively pushed and pierced. Compared with the traditional separation mode of taking and placing the wafers by rotating and transferring the mechanical wall, the single wafer transfer consumes 50-60 milliseconds, and the direct push type separation process can reduce the time consumption of the single wafer to below 40 milliseconds, thereby greatly improving the separation efficiency of the wafer.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic perspective view of the second embodiment of the present invention.

Fig. 3 is a third schematic perspective view of the present invention.

Fig. 4 is a fourth schematic perspective view of the present invention.

FIG. 5 is a schematic perspective view of a tray carrying mechanism and a magazine according to the present invention.

FIG. 6 is a second perspective view of the tray carrying mechanism and the magazine of the present invention.

FIG. 7 is a perspective view of the tray handling assembly of the present invention.

FIG. 8 is a second perspective view of the tray handling assembly of the present invention.

FIG. 9 is a third perspective view of the tray carrying assembly of the present invention.

Fig. 10 is a perspective view of the chuck assembly of the present invention.

Fig. 11 is a second perspective view of the chuck assembly of the present invention.

Fig. 12 is a schematic perspective view of the wafer transfer mechanism according to one embodiment of the present invention.

FIG. 13 is a second schematic perspective view of the wafer transfer mechanism of the present invention.

FIG. 14 is a third schematic perspective view of the wafer transfer mechanism of the present invention.

FIG. 15 is a fourth schematic perspective view of the wafer transfer mechanism of the present invention.

FIG. 16 is a schematic perspective view of a wafer carrier assembly according to one embodiment of the present invention.

FIG. 17 is a second schematic perspective view of a wafer carrier assembly according to the present invention.

Fig. 18 is a third schematic perspective view of a wafer carrier assembly according to the present invention.

Fig. 19 is a schematic perspective view of a wafer transfer assembly according to one embodiment of the present invention.

Fig. 20 is a second schematic perspective view of the wafer transfer device of the present invention.

FIG. 21 is a third schematic perspective view of a wafer transfer assembly according to the present invention.

FIG. 22 is a schematic perspective view of a detecting assembly according to the present invention.

FIG. 23 is a second perspective view of the detecting assembly of the present invention.

Fig. 24 is a third perspective view of the detecting assembly of the present invention.

Fig. 25 is a perspective view of the transfer unit of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all directional indicators in the embodiments of the present invention, such as up, down, left, right, front, and back, 8230, are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture, and if the specific posture is changed, the directional indicator is changed accordingly.

In the present invention, unless expressly stated or limited otherwise, the terms "connected," "secured," and the like are to be construed broadly, and for example, "connected" may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

As shown in fig. 1 to 4, the present invention provides a self-adaptive clamping type material taking and placing device, which adopts the following technical scheme:

a direct push type wafer sorting machine comprises a machine table 1 arranged horizontally and material boxes 2 arranged on the machine table 1, wherein the material boxes 2 comprise at least two material boxes 2, the tops of the at least two material boxes 2 are open surfaces, the direct push type wafer sorting machine also comprises a carrying disc conveying mechanism 3 and a wafer transferring mechanism 4, wherein,

at least two clamping grooves are respectively arranged on two symmetrically arranged inner side walls of the material box 2, are arranged along the vertical direction and extend upwards to the open surface at the top of the material box 2 so as to conveniently take and place the wafer carrying disc up and down;

the wafer transfer mechanisms 4 comprise at least two groups, and the at least two groups of wafer transfer mechanisms 4 are arranged on the side part of the material box 2;

the tray carrying mechanism 3 is erected on the material loading box 2 and the wafer transferring mechanism 4, the tray carrying mechanism 3 takes out the wafer tray to be sorted from the material loading box 2 and carries the wafer tray to the wafer transferring mechanism 4, and the wafer tray after being sorted in the wafer transferring mechanism 4 is carried back to the material loading box 2;

the wafer transfer mechanism 4 comprises a wafer bearing component 41, a wafer transfer component 42, a detection component 43 and a transfer component 44, wherein the wafer bearing component 41 and the wafer transfer component 42 are arranged at intervals, and an insertion space is formed between the wafer bearing component 41 and the wafer transfer component 42 so as to insert and place a bearing carrying disc and a transfer carrying disc; the detection assembly 43 and the transfer assembly 44 are respectively arranged at the side parts of the wafer carrying assembly 41 and the wafer transfer assembly 42; the detection component 43 props against the die receiving part of the bearing turntable from the outer side and detects the wafer on the transfer bearing disk; the transfer component sorts and transfers the crystal grains on the transfer carrying disc from the outer side to the carrying disc.

The invention designs a direct-push type wafer sorting machine and a wafer sorting process thereof, wherein the direct-push type wafer sorting machine adopts a near-gap vertical plug-in mounting carrying disc, realizes integration of automatic detection and wafer transferring and carrying, realizes rapid transfer of crystal grains by directly pushing through a thimble, and effectively improves the wafer sorting efficiency. The invention is applied to the field of automatic wafer sorting, and has the function of respectively transferring different wafers to different carrying disks after automatically detecting various wafers which are mixed and placed on the transferring carrying disks. Based on the process requirements, a plurality of material boxes are arranged on a machine platform at intervals in parallel and used for storing and transferring the carrier disc and the bearing carrier disc, a carrier disc carrying mechanism is arranged above the material boxes, and the carrier disc carrying mechanism moves back and forth in a linear mode above the material boxes and the wafer transferring mechanism so as to transfer the carrier disc back and forth between the material boxes and the wafer transferring mechanism; the wafer transfer mechanism is arranged on the side part of the material box, and in order to improve the wafer sorting efficiency of the whole machine, the wafer transfer mechanism comprises a plurality of groups, one group of wafer transfer mechanism can carry out the picking and placing work of the carrier disc during the wafer transfer process, so that the carrier disc can be carried and the wafer can be transferred at the same time, and the stand-by time of the station of the whole machine is effectively reduced. Different from the prior art, the wafer transfer mechanism comprises wafer bearing components and wafer transfer components which are arranged at intervals, the wafer bearing components and the wafer transfer components are arranged on a machine table at intervals, an insertion space with an open structure at the top is formed between the wafer bearing components and the wafer transfer components, a transfer carrying disc of a wafer to be transferred is vertically inserted into the wafer transfer components, an empty carrying disc of the wafer to be carried is vertically inserted into the wafer bearing components, the two inserted carrying discs are arranged in parallel at intervals, the distance between the two carrying discs can be controlled to be 2.5mm, the middle parts of the transfer carrying disc and the carrying disc are circular carrying planes, the circular carrying planes can be used as carriers through flexible blue film materials, and the outer side parts of the carrying planes can be made of rigid metal materials so as to be convenient for clamping and carrying; after the loading disc is inserted, a detection assembly arranged on the outer side of the crystal grain loading assembly adjusts the position from the outer side and shoots, detects and transfers the wafer on the loading disc, and horizontally approaches the wafer loading assembly from the outer side; the transfer assembly arranged outside the wafer transfer assembly is close to the wafer bearing assembly from the outer side and linearly pushes the blue film of the transfer carrier disc from the outer side to deform the blue film, the blue film on the transfer assembly is attached and transferred to the blue film on the bearing carrier disc, and the detection assembly pushes the receiving part of the blue film of the bearing carrier disc from the other side of the bearing carrier disc to provide a horizontal bearing surface so as to prevent the blue film from being excessively pushed and pierced. Compared with the traditional separation mode of taking and placing the wafers by rotating and transferring the mechanical wall, the single wafer transfer takes 50-60 milliseconds, and the direct pushing type separation process can reduce the time consumption of the single wafer to below 40 milliseconds, thereby greatly improving the separation efficiency of the wafer.

As an embodiment of the present invention, the wafer carrier 0 of the present invention is a plate-shaped structure, and includes a turntable carrier and a carrier, wherein the middle of the turntable carrier is a circular carrier plane, the carrier plane can be made of a blue film made of a flexible material, and at least two wafers are disposed in the carrier plane; the outer side of the wafer carrier plate 0 is a rigid supporting part for clamping and carrying.

As shown in fig. 5 to 6, the tray carrying mechanism 3 of the present invention includes a frame 31, a first linear module 32, a second linear module 33, and a tray carrying assembly 34, wherein the frame 31 is erected on the machine 1; the first linear module 32 is horizontally arranged on the rack 31; the second linear module 33 is connected to the output end of the first linear module 32 along the direction perpendicular to the first linear module 32; the tray carrying assembly 34 is connected to the output end of the second linear module 33, and the tray carrying assembly 34 is driven by the first linear module 32 and the second linear module 33 to move linearly in the longitudinal direction and the transverse direction in the horizontal plane.

As shown in fig. 7 to 11, the carrier tray handling assembly 34 of the present invention includes two sets of chuck members disposed in front and rear, and the handling assembly 34 is vertically moved up and down to access the wafer carrier 0 near the magazine 2 or the wafer transfer mechanism 4; the carrying assembly 34 is guided to limit the wafer carrying tray 0 through the flexible ring groove. The tray carrying assembly 34 comprises a carrying bracket 341, a chuck member and a limiting member 349, wherein the carrying bracket 341 is a rectangular frame structure; the two chuck members are respectively arranged on the front side and the rear side of the carrying bracket 341 and move up and down along the vertical direction so as to clamp and take the carrying disc; the limiting parts comprise two groups, and the two groups of limiting parts are respectively arranged on two sides below the carrying bracket 341 and movably arranged along the inclined direction so as to guide the limiting carrying discs from two sides. The bottom of the carrying rack 341 is vertically provided with a rail 343.

As shown in fig. 7, as an embodiment of the present invention, the chuck member of the present invention includes a first motor 342, a first transfer belt 344, a first link block 345, a first chuck cylinder 346, a jaw support 347, and a first jaw 348, wherein the first motor 342 is horizontally disposed at the top and bottom of the carrying support 341; the first transmission belt 344 is vertically arranged, the upper end of the first transmission belt 344 is sleeved on the output shaft of the first motor 342, and the lower end of the first transmission belt 344 is sleeved on the roller at the lower part of the carrying bracket 341; the first chuck cylinder 346 is slidably connected to the guide rail 343 in a vertical direction and is connected to the first transmission belt 344 through a first connection block 345, and when the output shaft of the first motor 342 rotates, the first chuck cylinder 346 is driven to move up and down through the first transmission belt 344; the two jaw supports 347 comprise an inverted U-shaped structure, and the jaw supports 347 are respectively connected to the output ends of the first chuck cylinder 346; the first jaws 348 comprise two sets, and the first jaws 348 are connected to the bottom of the jaw support 347 in pairs.

As shown in fig. 8, as another embodiment of the present invention, the chuck member of the present invention comprises a second motor 3410, a second belt 3411, a second connecting block 3412, a chuck slide 3413, a second chuck cylinder 3414, a second clamping jaw 3415, a third chuck cylinder 3416 and a third clamping jaw 3417, wherein the second motor 3410 is horizontally disposed at the top and bottom of the carrying bracket 341; the second transmission belt 3411 is vertically arranged, an upper end of the second transmission belt 3411 is sleeved on an output shaft of the second motor 3410, and a lower end of the second transmission belt 3411 is sleeved on a roller at the lower part of the carrying bracket 341; the chuck slide 3413 is slidably coupled to the guide rail 343 in a vertical direction and is connected to a second belt 3411 through a second connecting block 3412, and the chuck slide 3413 is driven to move up and down by the second belt 3411 when an output shaft of a second motor 3410 rotates. A second chuck cylinder 3414 and a third chuck cylinder 3416 are respectively disposed at both sides of a lower portion of the chuck slide 3413, and an output end thereof is disposed downward; the second clamping jaw 3415 and the third clamping jaw 3416 are connected to output shafts of the second chuck cylinder 3414 and the third chuck cylinder 3416, respectively.

As shown in fig. 7 to 11, the limiting component 349 includes a limiting support plate 3491, a limiting wheel 3492, a limiting slide rail 3493 and a spring column 3494, wherein the limiting support plate 3491 is vertically disposed; the limiting wheels 3492 comprise at least two limiting wheels 3492, the at least two limiting wheels 3492 are rotatably connected to the limiting support plate 3491 and are arranged at intervals along the vertical direction, and the middle part of each limiting wheel 3492 is provided with an inward concave ring groove so that the edge of the carrying disc can be embedded into the ring groove; the limiting slide rail 3493 is arranged on the carrying bracket 341 from the middle part outwards and obliquely upwards and is connected with the limiting support plate 3491 in a sliding way through a slide seat; the spring column 3494 is disposed on the side wall of the position-limiting support 3491 along the position-limiting slide rail 3493, and the end of the spring column 3494 is connected to the carrying bracket 341.

The tray carrying mechanism 3 is used for realizing automatic taking and placing of the wafer tray 0, the first linear module 32 and the second linear module 33 drive the carrying component 34 to move between the material box 2 and the wafer transfer mechanism 4, and the carrying component 34 takes and places the wafer tray 0 from the material box 2 or the wafer transfer mechanism 4. According to the invention, the carrying assembly 34 clamps and fixes the wafer carrying discs 0 from the upper part, the chuck plate parts are respectively arranged at the front side and the rear side of the carrying assembly 34, in the actual working process, the structural design of the double chuck plate parts is that one group of chuck plate parts are working parts, the other group of chuck plate parts are buffer memory parts, two groups of chuck plate parts can respectively clamp and clamp two wafer carrying discs in the actual working process, the two wafer carrying discs can be respectively inserted into the wafer carrying assembly 41 and the wafer transferring assembly 42 or the two wafer transferring mechanisms 4, and by the design of the double chuck plate parts, the carrying times of the carrying discs can be effectively reduced in the carrying disc transferring process, the carrying time consumption of the carrying discs is effectively reduced, and the sorting efficiency of the whole machine is improved. In addition, since the wafer carrier 0 is vertically inserted into the magazine 2 or the wafer transfer mechanism 4, a chucking situation is likely to occur during the insertion of the wafer carrier 0, and in order to avoid the chucking situation, the carrying assembly 34 of the present invention guides and limits the wafer carrier 0 through the limiting component 349. Specifically, the limiting component 349 of the invention adopts a plurality of limiting wheels 3942 rotatably arranged on the limiting support plate 3491 as guiding components, and the middle part of the limiting wheel 3492 is provided with an inwards concave ring groove, so that the side edge of the wafer carrying disc 0 can be embedded conveniently, thereby playing a role of guiding and limiting, and simultaneously effectively avoiding friction force in the limiting process through a free rolling type structure of the limiting wheel 3492; meanwhile, the whole limiting support plate 3491 is used as a sliding path through a limiting slide rail 3493 which extends obliquely upwards from the middle part, and the limiting support plate 3491 prevents the limiting wheel 3492 from blocking the wafer carrying tray 0 while limiting the wafer carrying tray 0 through the flexible connection of the spring column 3494.

As shown in fig. 12 to 14, the wafer carrying assembly 41 and the wafer transferring assembly 42 of the present invention are vertically disposed, the wafer carrying assembly 41 and the wafer transferring assembly 42 are disposed in parallel at intervals, and circular through slots are correspondingly formed on the two assemblies; a carrying tray is vertically inserted into the wafer carrying assembly 41, a transferring tray is vertically inserted into the wafer transferring assembly 42, and the carrying tray and the circular carrying plane of the transferring tray are arranged corresponding to the circular through groove.

As shown in fig. 16 to 18, the wafer carrier assembly 41 of the present invention includes a carrier member, a carrier rotating member, a carrier plate 416, and a first raised ring 4111, wherein the carrier member is vertically disposed on the machine table 1; the bearing plate 416 is vertically arranged on one side of the bearing part and is rotatably connected with the side wall of the bearing part along the vertical plane direction; the bearing rotating component is arranged on the bearing component, and the output end of the bearing rotating component is connected with the bearing disc 416 so as to drive the bearing disc 416 to rotate; a circular through groove is formed in the bearing plate 416; the first raised ring 4111 is arranged on the bearing disc 416 along the edge of the circular through groove and is raised outwards; the load-bearing carrying tray is vertically inserted into the load-bearing carrying tray 416 and fixed by the load-bearing carrying tray 416, and the first protruding ring 4111 pushes up the load-bearing plane of the load-bearing carrying tray outwards, so that the load-bearing plane is tensioned.

The bearing part comprises a bearing support 411, a bearing lifting motor 412 and a bearing seat 413, wherein the bearing support 411 is vertically arranged on the machine table 1; the bearing lifting motor 412 is vertically arranged on the bearing bracket 411, and the output end of the bearing lifting motor is arranged upwards; the bearing seat 413 is slidably connected to the side wall of the bearing bracket 411 in the vertical direction and is connected to an output shaft of the bearing lifting motor 412 through a screw rod and a screw rod seat, and the bearing lifting motor 412 drives the bearing seat 413 to move up and down; the circular through groove penetrates through the side wall of the bearing seat 413.

The side of the carrier plate 416 close to the carrier seat 413 is provided with a circular gear 417.

The bearing rotating component comprises a bearing rotating motor 414, a bearing rotating gear 415 and a bearing rotating belt 418, wherein the bearing rotating motor 414 is arranged on one side wall of the bearing seat 413, and the output shaft passes through the bearing seat 413 and extends to the other side of the bearing seat 413; the bearing rotary gear 415 is sleeved on an output shaft of the bearing rotary motor 414; the bearing rotary belt 418 is sleeved on the circular gear 417 and the bearing rotary gear 415, and is meshed with the circular gear 417 and the bearing rotary gear 415, and when the bearing rotary gear 415 rotates, the circular gear 417 is driven by the bearing rotary belt 418 to drive the bearing disc 416 to rotate.

At least two first magnetic attraction blocks 419 are arranged on the carrier disc 416, and the at least two first magnetic attraction blocks 419 are arranged on the outer edge of the first convex ring 4111 so as to attract and fix the carrier disc; an inwards concave mounting groove is formed in the side wall of the bearing disc 416, and a first sensor 4110 is fixedly embedded in the mounting groove so as to sense and detect the bearing disc; the lower part of the bearing tray 416 is provided with a support 4112 which extends outwards and horizontally, and the bearing tray which is vertically inserted bears and supports through the support 4112.

The wafer carrier assembly 41 of the present invention is used for supporting and fixing the carrier plate, and based on the requirement of the insertion process of the wafer carrier plate 0, in order to adjust the position of the carrier plate, the wafer carrier assembly 41 of the present invention drives the carrier seat 413 to move up and down through the carrier lifting motor 412. The invention takes a bearing seat 413 as a bearing main body, a bearing disc 416 as a supporting main body of the bearing disc, a circular through groove is arranged on the bearing seat 413 which is vertically arranged, the side part of the bearing seat 413 is rotatably connected with the bearing disc 416 along the axial direction of the circular through groove, the bearing disc 416 is correspondingly provided with the circular through groove, a circular gear 417 is arranged on the outer side of the bearing disc 416, and the bearing rotary motor 414 arranged on the side wall of the bearing seat 413 drives a bearing rotary belt 418 to drive the bearing disc 416 to rotate, thereby realizing the rotation motion of the bearing disc in a vertical plane. In addition, in order to support the vertically inserted carrying tray, an outwardly protruding support 4112 is disposed on a sidewall of the lower portion of the present invention for supporting the vertically inserted carrying tray. Meanwhile, an embedded groove body is arranged on the side wall of the bearing seat 413, a first magnetic block 419 is fixed in the groove body, and the bearing disc is fixedly adsorbed through the first magnetic blocks 419 distributed on the periphery of the circular through groove. In addition, in order to detect whether the carrier tray is inserted, and avoid no-load, the carrier tray 416 of the present invention further has a first sensor 4110.

As shown in fig. 17 and fig. 22 to 24, the inspection assembly 43 of the present invention includes an inspection driving part, an inspection part and a carrier head 439, wherein the inspection driving part is disposed at a side portion of the wafer carrier assembly 41 and outputs power in a longitudinal direction and a lateral direction in a horizontal plane; the detection part is arranged on the output end of the detection driving part and is driven by the detection driving part; the carrier head 439 is disposed on the output end of the detection driving component and located between the detection component and the wafer carrier 41, and an end surface of the carrier head 439 is attached to the wafer carrier 41 so as to abut against a carrier tray on the wafer carrier 41 during wafer transfer.

The detection driving component comprises a detection linear module 431, a detection base 432, a detection cylinder 433 and a detection sliding base 434, wherein the detection linear module 431 is horizontally arranged at the side part of the wafer bearing component 41; the detection base 432 is arranged on the detection straight line module 431 and is connected with the output end of the detection straight line module 431; the detection cylinder 433 is arranged on the detection base 432 along a direction perpendicular to the detection straight line module 431; the detection sliding base 434 is slidably disposed on the detection base 432 and connected to an output end of the detection cylinder 433, and the detection cylinder 433 drives the detection sliding base 434 to move linearly.

The detection components comprise a detection camera 435, a light source 436 and a light source box 437, wherein the detection camera 435 is horizontally arranged on the detection slide 434, and the lens direction of the detection camera is arranged towards the wafer bearing assembly 41; the light source box 437 is arranged on the detection sliding base 434 and is positioned outside the lens of the detection camera 435; the light sources 436 include at least two, and the at least two light sources 436 are disposed at the side of the light source box 437, and the light emitting direction thereof is disposed toward the wafer carrier assembly 41.

One end of the detection sliding base 434 close to the wafer carrying assembly 41 is provided with a vertical support plate 438, and the vertical support plate 438 is provided with a through hole; the carrying head 439 is horizontally disposed on the sidewall of the vertical support plate 438 and disposed corresponding to the through hole, and the carrying head 439 is made of a transparent material, so that the inspection camera 435 can shoot the wafer on the transfer tray on the wafer transfer assembly 42 through the through hole and the carrying head 439.

The detection assembly 43 of the invention is used for shooting, detecting and transferring the wafers on the carrying disc, the detection assembly 43 drives the detection component to move longitudinally and transversely in the horizontal plane through the detection driving component so as to adjust the installation position; meanwhile, in the invention, the end part of the detection sliding seat 434 is provided with a vertical support plate 438 which vertically extends upwards, in order to avoid blocking the detection component, the vertical support plate 438 is provided with a through hole which is communicated from left to right, the side wall of the through hole close to one side of the bearing carrier disc is provided with a transparent bearing head 439, one side of the bearing head 439 close to the bearing carrier disc is a pushing plane, when the wafer is sorted, the detection sliding seat 434 drives the bearing head 439 to synchronously transfer the component 44 to move, and the blue membrane of the bearing carrier disc is pushed from the outer side of the bearing carrier disc, so that the blue membrane is prevented from being excessively pushed and pierced in the wafer transferring process. Through the structural design, the shooting inspection during wafer transfer is ensured, and meanwhile, the bearing support during the transfer process is provided; meanwhile, the plane support of the bearing head avoids the deformation of the blue film due to pushing in the process of receiving and taking the wafer by the bearing carrier disc, thereby influencing the positions of the wafer at other parts of the blue film and preventing the other wafers from being separated from the blue film of the bearing carrier disc.

As shown in fig. 19 to 21, the wafer transferring assembly 42 of the present invention includes a transferring bearing member and a transferring bearing seat 423, wherein the transferring bearing member is vertically disposed on the machine platform 1 and outputs upward power; the transfer bearing seat 423 is vertically connected to the output end of the transfer bearing part, and a circular through groove is formed in the transfer bearing seat.

The transfer bearing part comprises a transfer support 421 and a transfer motor 422, wherein the transfer support 421 is vertically arranged on the machine table 1; the transfer motor 422 is arranged on the transfer support 421, and the output end of the transfer motor is arranged upwards; the transfer bearing seat 423 is slidably connected to the transfer support 421 in a vertical direction, is connected to an output end of the transfer motor 422, and is driven by the transfer motor 422 to move up and down.

A carrier ring 424 is disposed on a sidewall of the transfer susceptor 423 near the wafer carrier assembly 41, the carrier ring 424 is disposed outside the circular through-groove of the transfer susceptor 423, and at least two second magnetic blocks 426 are embedded in the carrier ring 424 for adsorbing and fixing the transfer susceptor; the lower part of the carrier ring 424 is provided with a bearing step 427 protruding outwards to support the transfer carrier; a second inductor 428 is embedded in the carrier ring 424 to sense whether a transfer tray is inserted; the carrier ring 424 is provided with a second protrusion ring 425, the second protrusion ring 425 is disposed along the edge of the circular through groove of the transfer carrier seat 423 and protrudes outward, and the transfer carrier plate adsorbed on the carrier ring 424 is pushed and tensioned by the second protrusion ring 425.

The wafer transfer assembly 42 of the invention is used for carrying a transfer carrying disc of a wafer to be transferred, the invention takes a transfer carrying seat 423 as a carrying part, and the transfer carrying seat 423 is driven by a transfer motor 422 below to move up and down so as to adjust the installation position; similarly, a circular through groove is correspondingly formed in the transfer bearing seat 423, a carrier plate bearing ring 424 is arranged on the outer edge of the circular through groove, the carrier plate bearing ring 424 protrudes outwards and is used for bearing the transfer bearing disc, and a bearing step 427 is arranged at the lower part of the carrier plate bearing ring 424 and is used for supporting the vertically inserted transfer bearing disc; meanwhile, a plurality of second magnetic blocks 426 are disposed on the carrier ring 424, the transfer tray is fixed and attracted by the second magnetic blocks 426, and a second sensor 428 embedded in the carrier seat 423 detects whether the transfer tray is inserted.

As shown in fig. 21 and 25, the transfer unit 44 of the present invention includes a transfer driving unit and a transfer unit, wherein the transfer unit is disposed at a side portion of the wafer transfer unit 42 and outputs power in a horizontal plane in longitudinal and transverse directions; the transfer component is disposed at the output end of the transfer driving component and moves back and forth in a linear manner toward the wafer carrying assembly 41, so as to push and transfer the wafer on the transfer tray on the wafer transfer assembly 42 onto the carrying tray on the wafer carrying assembly 41.

The transfer driving part comprises a transfer linear module 441, a transfer support, a transfer cylinder and a transfer slide 442, wherein the transfer linear module 441 is horizontally arranged at the side of the wafer transfer assembly 42; the transfer support is horizontally connected to the output end of the transfer straight line module 441; the transfer cylinder is arranged on the transfer support along the direction perpendicular to the transfer straight line module 441; the transfer slide 442 is slidably disposed on the transfer support in the direction of the transfer cylinder and is connected to the output end of the transfer cylinder.

The transferring means includes a transferring motor 443, a transferring shaft 444, a transferring seat 445, and a transferring cap 446, wherein the transferring motor 443 is disposed on the transferring slide 442; the transfer shaft 444 is horizontally connected to the output end of the transfer motor 443 and is driven by the transfer motor 443 to move back and forth in a straight line; the transfer base 445 is disposed outside the transfer motor 443, and the transfer shaft 444 penetrates through the transfer base 445 and extends toward the wafer carrier assembly 41; the transfer cap 446 is connected to the end of the transfer seat 445, a thimble is horizontally arranged in the transfer cap 446, and the thimble is connected with the transfer shaft 444; the end face of the transfer cap 446 is provided with a needle hole, and at least two suction holes are distributed around the needle hole; the ejector pins are driven by the transfer shafts 444 to penetrate through the pin holes to push and transfer the wafers, and the suction holes adsorb and fix the transfer carrier discs from the periphery.

The transfer component 44 is used for executing wafer transfer action, the transfer component 44 is arranged at the outer side of the wafer transfer component 42 and moves linearly along the longitudinal direction and the transverse direction in the horizontal plane integrally, so that the wafers at different positions on the blue film in the transfer carrier disc are pushed to the blue film of the carrier disc by matching with the lifting motion of the transfer component 44; specifically, in the transfer assembly 44 of the present invention, the transfer cap 446 is used as a transfer plane, a pinhole is formed in the middle of an end surface of the transfer cap 446 close to the transfer carrier tray, the transfer shaft 444 of the transfer motor 443 drives the thimble to penetrate through the pinhole to push the wafer on the transfer carrier tray onto the carrier tray, and meanwhile, a vacuum negative pressure is formed around the transferred wafer through the air holes arranged around the pinhole to adsorb the blue film of the transfer carrier tray, so as to avoid the situation that the blue film deforms during the pushing process to affect the position of the peripheral wafer, so that other wafers are separated from the blue film.

Further, as an embodiment of the present invention, the carrying ring 424 and the carrying ring 416 of the present invention are respectively protruded by 0.5mm, and the carrying ring 416 and the carrying ring 424 are respectively and correspondingly provided with the first protruding ring 4111 and the second protruding ring 425, the first protruding ring 4111 and the second protruding ring 425 are respectively arranged on the outer edge of the circular through groove and are protruded by 0.5mm; so that the clearance between the inserted transfer carrying disc and the bearing carrying disc is maintained at 0.5mm, thereby ensuring the rapid transfer of the wafer. In addition, the first convex ring 4111 and the second convex ring 425 enable the blue films on the inserted carrying tray and the inserted transfer tray to respectively protrude outwards, so that the blue film planes of the first convex ring 4111 and the second convex ring 425 can maintain a tensioning state, and the situation that the wafer sorting is influenced by the position deviation between the wafer detection position and the actual wafer position caused by the surface wrinkle of the blue film can be effectively avoided.

s1, full-load plate feeding: the tray carrying mechanism takes out the transfer trays to be sorted from the material boxes and vertically inserts the transfer trays into the wafer bearing assembly;

s3, carrying disc insertion detection and fixation: after the transfer turntable and the bearing turntable are inserted in the steps S1 and S2, the wafer bearing assembly and the wafer transfer assembly carry out disc detection, and if no disc is detected, the step S1 and/or the step S2 are/is repeated; the wafer bearing component and the wafer transferring component are used for adsorbing and fixing the inserted transferring carrying disc and the inserted carrying disc;

The embodiments of the present invention are merely illustrative of specific embodiments thereof, and are not intended to limit the scope thereof. Since the present invention can be modified by a person skilled in the art, the present invention is not limited to the embodiments described above.

Claims

1. The utility model provides a straight pushing-type wafer sorter, includes board (1) and magazine (2) of setting on board (1) that the level set up, magazine (2) include at least two, and the top of at least two magazine (2) is open face, its characterized in that: also comprises a carrying disc carrying mechanism (3) and a wafer transferring mechanism (4), wherein,

at least two clamping grooves are respectively arranged on two symmetrically arranged inner side walls of the material box (2), are arranged along the vertical direction and extend upwards to the open surface of the top of the material box (2) so as to conveniently take and place the wafer carrying disc up and down;

the wafer transfer mechanisms (4) comprise at least two groups, and the at least two groups of wafer transfer mechanisms (4) are arranged on the side parts of the material boxes (2);

the tray carrying mechanism (3) is erected on the material loading box (2) and the wafer transfer mechanism (4), the tray carrying mechanism (3) takes out the wafer tray to be sorted from the material loading box (2) and carries the wafer tray to the wafer transfer mechanism (4), and the wafer tray after being sorted in the wafer transfer mechanism (4) is carried back to the material loading box (2);

the wafer transfer mechanism (4) comprises a wafer bearing component (41), a wafer transfer component (42), a detection component (43) and a transfer component (44), wherein the wafer bearing component (41) and the wafer transfer component (42) are arranged at intervals, and an insertion space is formed between the wafer bearing component and the wafer transfer component so as to insert and place a bearing carrying disc and a transfer carrying disc respectively; the detection assembly (43) and the transfer assembly (44) are respectively arranged at the side parts of the wafer carrying assembly (41) and the wafer transfer assembly (42); the detection component (43) props against the crystal grain receiving part of the bearing turntable from the outer side and detects the wafer on the transfer bearing disk; the transfer component sorts and transfers the crystal grains on the transfer carrying disc from the outer side to the carrying disc.

2. A direct push type wafer handler as claimed in claim 1, wherein: the tray carrying mechanism (3) comprises a rack (31), a first linear module (32), a second linear module (33) and a tray carrying assembly (34), wherein the rack (31) is erected on the machine table (1); the first linear module (32) is horizontally arranged on the rack (31); the second linear module (33) is connected to the output end of the first linear module (32) along the direction vertical to the first linear module (32); the tray carrying assembly (34) is connected to the output end of the second linear module (33), and the tray carrying assembly (34) is driven by the first linear module (32) and the second linear module (33) to move linearly in the longitudinal direction and the transverse direction in the horizontal plane.

3. A direct push type wafer handler as claimed in claim 2, wherein: the tray carrying assembly (34) comprises two groups of chuck components which are arranged front and back, and the carrying assembly (34) moves up and down along the vertical direction so as to be close to the material box (2) or the wafer transfer mechanism (4) and take and place the wafer tray (0); the carrying assembly (34) guides the limiting wafer carrying disc (0) through the flexible ring groove.

4. A direct push type wafer handler as claimed in claim 1, wherein: the wafer carrying disc (0) is of a plate-shaped structure, the middle part of the wafer carrying disc is a circular carrying plane, and at least two wafers are distributed in the carrying plane; the outer side of the wafer carrier plate (0) is a rigid supporting part so as to be convenient for clamping and carrying.

5. A direct push type wafer handler as claimed in claim 1, wherein: the wafer bearing component (41) and the wafer transferring component (42) are vertically arranged, the wafer bearing component (41) and the wafer transferring component (42) are arranged in parallel at intervals, and circular through grooves are correspondingly formed in the wafer bearing component and the wafer transferring component; the wafer bearing assembly (41) is internally and vertically inserted with a bearing disc, the wafer transferring assembly (42) is internally and vertically inserted with a transferring bearing disc, and the bearing disc and the circular bearing plane of the transferring bearing disc are arranged corresponding to the circular through groove.

6. A direct push type wafer handler as claimed in claim 1, wherein: the wafer bearing assembly (41) comprises a bearing component, a bearing rotating component, a bearing disc (416) and a first convex ring (4111), wherein the bearing component is vertically arranged on the machine table (1); the bearing plate (416) is vertically arranged on one side of the bearing part and is rotatably connected with the side wall of the bearing part along the vertical plane direction; the bearing rotating component is arranged on the bearing component, and the output end of the bearing rotating component is connected with the bearing disc (416) so as to drive the bearing disc (416) to rotate; a circular through groove is formed in the bearing plate (416); the first convex ring (4111) is arranged on the bearing disc (416) along the edge of the circular through groove and protrudes outwards; the bearing carrying disc is vertically inserted on the bearing disc (416) and fixed by the bearing disc (416), and the first convex ring (4111) jacks up a bearing plane of the bearing carrying disc outwards to tension the bearing plane.

7. A direct push type wafer handler as claimed in claim 1, wherein: the detection assembly (43) comprises a detection driving component, a detection component and a bearing head (439), wherein the detection driving component is arranged at the side part of the wafer bearing assembly (41) and outputs power along the longitudinal direction and the transverse direction in the horizontal plane; the detection part is arranged on the output end of the detection driving part and is driven by the detection driving part; the bearing head (439) is arranged at the output end of the detection driving part and is positioned between the detection part and the wafer bearing component (41), and the end face of the bearing head (439) is tightly attached to the wafer bearing component (41) so as to be propped against a bearing carrying disc on the wafer bearing component (41) when wafers are transferred.

8. A direct push type wafer handler as claimed in claim 1, wherein: the wafer transfer assembly (42) comprises a transfer bearing part and a transfer bearing seat (423), wherein the transfer bearing part is vertically arranged on the machine table (1) and outputs upward power; the transfer bearing seat (423) is vertically connected to the output end of the transfer bearing part, and a circular through groove is formed in the transfer bearing seat.

9. A direct push type wafer handler as claimed in claim 1, wherein: the transfer assembly (44) comprises a transfer driving component and a transfer component, wherein the transfer component is arranged on the side of the wafer transfer assembly (42) and outputs power along the longitudinal direction and the transverse direction in the horizontal plane; the transfer component is arranged on the output end of the transfer driving component and moves back and forth in a linear way towards the direction of the wafer bearing component (41), so that the wafer on the transfer tray on the wafer transfer component (42) is pushed and transferred onto the bearing tray on the wafer bearing component (41).

10. A wafer sorting process of the direct push type wafer sorter according to any one of claims 1 to 9, comprising the process steps of:

s2, loading an empty tray: the carrying disc conveying mechanism takes out the empty carrying rotary disc from the material box and vertically inserts the empty carrying rotary disc into the wafer transfer assembly;

s3, detecting and fixing the carrier disc in a plug-in manner: after the transfer turntable and the bearing turntable are inserted in the steps S1 and S2, the wafer bearing assembly and the wafer transfer assembly carry out disc detection, and if no disc is detected, the step S1 and/or the step S2 are/is repeated; the wafer bearing component and the wafer transfer component adsorb and fix the inserted transfer carrying disc and the bearing carrying disc;

s4, adjusting the position and the angle of the carrying disc: the position and the angle of the transfer carrying disc or the carrying disc fixed in the step S3 are respectively adjusted in a vertical plane through the wafer carrying assembly and the wafer transferring assembly;