CN109390265B - Automatic change wafer transfer device - Google Patents
Automatic change wafer transfer device Download PDFInfo
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- CN109390265B CN109390265B CN201811492067.6A CN201811492067A CN109390265B CN 109390265 B CN109390265 B CN 109390265B CN 201811492067 A CN201811492067 A CN 201811492067A CN 109390265 B CN109390265 B CN 109390265B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an automatic wafer transfer device in the field of semiconductor processing, which comprises a case, wherein a waiting platform and a positioning platform are arranged on the case in parallel, a wafer material box is correspondingly arranged between two transverse transmission boxes and between two longitudinal frame strips, a plurality of wafers are vertically arranged in the wafer material box, openings are formed in the upper side and the lower side of the wafer material box, a lifting and lifting mechanism is correspondingly arranged below the wafer material box, and a pair of transfer manipulators capable of transversely moving are arranged on the case corresponding to the wafer material box; the positioning platform comprises a group of bases which are correspondingly arranged from front to back, baffle plates are vertically arranged on the bases, the wafer material frames are supported on the bases, the front side and the rear side of the wafer material frames respectively lean against the baffle plates corresponding to the bases, and lifting mechanisms are correspondingly arranged below the wafer material frames. The invention can transfer the wafer in the wafer material box into the wafer material box, and avoid the damage caused by unbalanced stress of the wafer.
Description
Technical Field
The invention belongs to the field of semiconductor processing, and particularly relates to an automatic wafer transfer device.
Background
In the process of packaging and testing wafers, the wafers need to be transferred or selected frequently. The wafer is usually manually taken or sucked by a vacuum suction pen during the operation of transferring or selecting the material box. Manual handling presents the following risks: product defects are easily caused by the problems of product pollution, electrostatic injury and the like caused by direct contact of hands; wafer breakage is caused by improper handling. The vacuum suction pen suctions the wafer with the following risks: the suction pen and the suction cup are in direct contact with the surface of the wafer, so that scratch is easily caused; the wafers are densely stacked in the material box, so that the operation is inconvenient and the operation efficiency is low; the wafer is easy to drop due to gas interruption or weak adsorption.
In the prior art, there is a wafer transfer tool, and the patent application number is: CN 201410840504.4; filing date: 2014.12.30; publication No.: CN 104505361a; publication date: 2015.04.08; the structure comprises a first platform and a second platform which are kept flush and can be folded or separated along a sliding track; the first platform is provided with a limiting corner and a first clamping groove which are used for fixing the wafer transfer box on the first platform and enabling the opening direction of the wafer transfer box to face the second platform; the second platform is provided with a second clamping groove, a first column body and a second column body; the first column body and the second column body are provided with grooves for accommodating the bottom support of the wafer material box, and the second clamping groove is used for being meshed with the clamping part of the wafer material box so as to fix the wafer material box on the second platform and enable the opening direction of the wafer material box to face the first platform; the inner sides of the first and second columns are aligned with the hollow openings of the shoe portion of the wafer cassette. The apparatus can horizontally push a wafer from a first stage onto a second stage to transfer the wafer, but it is disadvantageous in that: the thickness of the wafer is thinner, the brittleness is larger, and the wafer is easy to break due to unbalanced stress when the wafer is pushed horizontally.
Disclosure of Invention
The invention aims to provide an automatic wafer transfer device which can lift up and transfer a wafer vertically placed in a wafer material box into the wafer material box, and the wafer is stable in movement and is prevented from being damaged due to unbalanced stress.
The purpose of the invention is realized in the following way: an automatic wafer transfer device comprises a case, wherein a material waiting platform and a positioning platform are arranged on the case in parallel, the material waiting platform comprises a group of transverse transmission boxes which are arranged correspondingly from front to back and a group of longitudinal frame bars which are arranged correspondingly from left to right, a wafer material box is correspondingly arranged between the two transverse transmission boxes and between the two longitudinal frame bars, a plurality of wafers which are parallel to each other are vertically arranged in the wafer material box, the surfaces of the wafers are parallel to the length direction of the transverse transmission boxes, openings are formed in the upper side and the lower side of the wafer material box, lifting mechanisms are correspondingly arranged below the wafer material box, and a pair of transfer manipulators which can transversely move are arranged on the case and correspond to the wafer material box; the positioning platform comprises a group of bases which are correspondingly arranged from front to back, baffle plates are vertically arranged on the bases, the wafer material frames are supported on the bases, the front side and the rear side of the wafer material frames respectively lean against the baffle plates corresponding to the bases, and lifting mechanisms are correspondingly arranged below the wafer material frames.
When the wafer material box is in operation, the wafer material box is placed on the material waiting platform, the wafer material frame is placed on the positioning platform, the lifting and lifting mechanism lifts the wafers in the wafer material box upwards, the two transfer manipulators move to the lower sides of the wafers in opposite directions to hold the wafers, then the transfer manipulators move towards the positioning platform in the same direction to enable the held wafers to move to the upper side of the wafer material frame, the lifting and lifting mechanism below the wafer material frame lifts and holds the wafers, the pair of transfer manipulators reversely move to loosen the wafers, and the lifting and lifting mechanism descends to enable the wafers to fall into the positioning grooves of the wafer material frame. Compared with the prior art, the invention has the beneficial effects that: the wafer can be lifted up by vertically placing the wafer in the wafer material box, and is transferred into the wafer material box by the transfer manipulator, so that the wafer keeps stable movement in a vertical state, the stress of the wafer is balanced, and the wafer is prevented from being damaged.
As a further improvement of the invention, the bottom of the wafer material box is supported on a first backing plate, the first backing plate is positioned between two transverse transmission boxes and between two longitudinal frame strips, at least 3 adjusting shafts are rotatably arranged between the two transverse transmission boxes, the peripheries of the adjusting shafts are wrapped with jackets, the axes of the adjusting shafts are longitudinally arranged, at least 3 adjusting shafts are positioned below the wafer and distributed along the circumferential direction of the wafer, two ends of the adjusting shafts are respectively rotatably supported on the corresponding transverse transmission box walls, and a transmission mechanism is arranged in at least one transverse transmission box. The wafer edge is provided with the mark, and drive mechanism drives the adjustment axle and rotates, drives the wafer through the sheath and rotates for the wafer circumference rotates to the position that sets for.
As a further improvement of the invention, the transmission mechanism comprises at least three pairs of bearing seats which are correspondingly arranged front and back, each pair of bearing seats is rotatably provided with a rotating shaft, the rotating shafts are in transmission connection with corresponding adjusting shafts through couplers, the rotating shafts are sleeved with chain wheels, the chain wheels on each rotating shaft are in transmission connection through chains, any rotating shaft is sleeved with a driven belt pulley, the driven belt pulley is in transmission connection with a driving belt pulley at the output end of a motor through a belt, the bottom of a transverse transmission box and the upper side of the machine box are both provided with grooves capable of allowing the belt to pass through, and the motor is arranged in the machine box. The motor drives the driving belt pulley to rotate, the driving belt pulley drives the driven belt pulley to rotate through the belt, the rotating shaft realizes rotation, the chain wheel on the rotating shaft drives the chain wheels on other rotating shafts to rotate through the chain, and each rotating shaft realizes rotation and drives the adjusting shaft to rotate.
As a further improvement of the invention, the lifting mechanism comprises two lifting arms which are correspondingly distributed left and right, the axis of the lifting arm is longitudinally arranged, the upper side of the lifting arm is obliquely arranged, a plurality of positioning grooves are arranged on the upper side of the lifting arm at intervals along the axis direction, each positioning groove is arranged in one-to-one correspondence with each wafer, and grooves which can be penetrated by the lifting arm are formed on the first backing plate and the upper side of the case; the vertical connecting rods that are provided with at least two parallels of lift arm downside, each connecting rod stretches into quick-witted incasement portion and lower extreme fixedly connected with elevating seat, the symmetry is equipped with 4 piece at least gibs around the elevating seat, every gib is all with a vertical guide rail assorted setting, elevating seat left and right sides all is equipped with the lead screw, the vertical setting of lead screw axis, the upper and lower both ends of lead screw rotate respectively and support on a bearing frame, the one end and the motor drive of lead screw are connected, the cover is equipped with screw-nut on the lead screw, screw-nut passes through the connecting seat and is connected with elevating seat transmission. The motor drives the screw rod to rotate, and a screw rod nut on the screw rod moves up and down to drive the lifting seat to move up and down, and the lifting seat drives the lifting arm to move up and down.
As a further improvement of the invention, two transfer manipulators are correspondingly arranged left and right, the transfer manipulators are positioned above the wafer material box, the transfer manipulators are L-shaped, the transfer manipulators comprise a transverse section and a longitudinal section, the lower side of the longitudinal section of the transfer manipulator is fixedly connected with a supporting arm, one side of the two opposite supporting arms is obliquely arranged, a plurality of positioning grooves are formed in the inclined surface of the supporting arm at intervals along the length direction, and each positioning groove is arranged in one-to-one correspondence with each wafer; the vertical pole setting that is equipped with of horizontal section downside of transfer manipulator, pole setting stretch into quick-witted incasement and lower extreme setting are on removing the seat, remove the seat and pass through the slider and be connected with the transverse guide transmission, remove and be provided with the motor on the seat, the output of motor is vertical downwards and be equipped with the gear, the axial is provided with the rack on the transverse guide, the gear meshes with the rack mutually. The motor drives the gear to rotate, the gear rolls along the rack, the movable seat is driven to move along the transverse guide rail, the transfer manipulators realize transverse movement, when the two transfer manipulators move to corresponding positions in opposite directions, the edges of the wafers are inserted into the corresponding positioning grooves, and the supporting arms can support the wafers from the lower side.
As a further improvement of the invention, the wafer material frame comprises two frame plates which are correspondingly arranged from front to back, a pair of upper supporting rods which are bilaterally symmetrical and a pair of lower supporting rods which are bilaterally symmetrical are arranged between the frame plates, a plurality of positioning grooves are axially arranged at intervals on the inner sides of the upper supporting rods, a plurality of positioning grooves are axially arranged on the upper sides of the lower supporting rods at intervals, protection baffle plates are arranged in the positioning grooves on the front and back sides of the wafer material frame, the positioning grooves between the two protection baffle plates are arranged in one-to-one correspondence with each wafer, and two positioning rods which are bilaterally and correspondingly arranged are fixedly connected to the bottoms of the two frame plates. Each wafer is correspondingly placed in each positioning groove between two protection baffle plates, the bottom of the wafer is supported on the lower supporting rod, and the side surface of the wafer is contacted with the upper supporting rod.
As a further improvement of the invention, the base is arranged on the second base plate, the baffle plate of the base is contacted with the corresponding frame plate, two positioning bulges are symmetrically arranged on the base left and right, the positioning rods are abutted against the positioning bulges on the same side corresponding to the two base plates, a positioning plate is arranged on any base plate, and a telescopic positioning button is arranged on the positioning plate. The wafer material frame is contacted with the positioning bulges through the positioning rods, the two positioning rods are positioned between the four positioning bulges, and when the frame plate of the wafer material frame is contacted with the positioning plate, the positioning button is retracted.
As a further improvement of the invention, the bottom of the wafer material box is symmetrically provided with vertical bottom plates, and the wafer material box is supported on the first backing plate through the bottom plates. The wafer material box is supported on the first backing plate through the bottom plate, and the bottom of the wafer in the wafer material box is just supported on the lifting arm.
As a further improvement of the invention, the surface of the case is provided with a plurality of circular through holes. The through holes on the surface of the case can increase friction force, and the case cannot slide when articles are placed on the upper side of the case.
Drawings
Fig. 1 is a top view of the present invention.
Fig. 2 is a cross-sectional view AA of fig. 1.
Fig. 3 is a cross-sectional view in BB of fig. 2.
Fig. 4 is a top view of a wafer cassette containing wafers.
Fig. 5 is a front view of the wafer cassette.
Fig. 6 is a longitudinal cross-sectional view of the blanking platform.
Fig. 7 is a partial enlarged view of fig. 6.
Fig. 8 is a graph showing the relative positional relationship between the wafer and the adjustment shaft.
Fig. 9 is a positional relationship diagram of the sprockets.
Fig. 10 is a top view of the lift base.
Fig. 11 is a CC-sectional view of fig. 1.
Fig. 12 is a top view of the cross rail and the traveling block.
Fig. 13 is a perspective view of the cross rail and the traveling block.
Fig. 14 is a top view of the transfer robot holding a wafer.
Fig. 15 is a side view of the transfer robot.
Fig. 16 is a front view of the transfer robot holding a wafer.
Fig. 17 is a DD cross-sectional view of fig. 2.
Fig. 18 is a perspective view of a wafer frame.
The device comprises a machine case 1, a material waiting platform 2, a positioning platform 3, a transverse transmission case 4, a longitudinal frame strip 5, a wafer material box 6, a wafer 7, a transfer manipulator 8, a transverse section 8a, a longitudinal section 8b, a base 9, a baffle plate 10, a backing plate 11, a backing plate 12, a backing plate 13, an adjusting shaft 14, a bearing seat 15, a rotating shaft 16, a coupling 17, a connecting seat 18, a chain wheel 19, a driven belt pulley 20, a belt 21, a motor 22, a driving belt pulley 23, a lifting arm 23a positioning groove 24, a connecting rod 25, a lifting seat 26, a guide strip 27, a vertical guide rail 28, a lead screw nut 28a, a supporting arm 29, a positioning groove 29a, a vertical rod 31, a moving seat 32 wafer material frame 32a frame plate 32b, a supporting rod 32c supporting rod 32d positioning rod 33, a gear 33a rack 34 sliding blocks 34a transverse guide rail 35 positioning bulges, 36 positioning plates 36a positioning button and a bottom plate 37.
Detailed Description
As shown in fig. 1-18, an automatic wafer transfer device comprises a case 1, wherein a to-be-material platform 2 and a positioning platform 3 are arranged on the case 1 in parallel, the to-be-material platform 2 comprises a group of transverse transmission boxes 4 which are correspondingly arranged front and back and a group of longitudinal frame strips 5 which are correspondingly arranged left and right, a wafer material box 6 is correspondingly arranged between the two transverse transmission boxes 4 and between the two longitudinal frame strips 5, a plurality of wafers 7 which are mutually parallel are vertically arranged in the wafer material box 6, the surfaces of the wafers 7 are parallel to the length direction of the transverse transmission boxes 4, openings are respectively arranged on the upper side and the lower side of the wafer material box 6, lifting and lifting mechanisms are correspondingly arranged below the wafer material box 6, and a pair of transfer manipulators 8 which can both transversely move are correspondingly to the wafer material box 6 on the case 1; the positioning platform 3 comprises a group of bases 9 which are correspondingly arranged front and back, a baffle 10 is vertically arranged on the bases 9, a wafer material frame 32 is supported on the bases 9, the front side and the back side of the wafer material frame 32 respectively prop against the baffle 10 corresponding to the bases 9, and a lifting mechanism is correspondingly arranged below the wafer material frame 32. The bottom of the wafer magazine 6 is supported on a first backing plate 11, the first backing plate 11 is located between two transverse transmission boxes 4 and located between two longitudinal frame strips 5, at least 3 adjusting shafts 13 are rotatably arranged between the two transverse transmission boxes 4, the peripheries of the adjusting shafts 13 are wrapped with jackets, the axes of the adjusting shafts 13 are longitudinally arranged, at least 3 adjusting shafts 13 are located below the wafer 7 and distributed along the circumferential direction of the wafer 7, two ends of the adjusting shafts 13 are respectively rotatably supported on the walls of the corresponding transverse transmission boxes 4, and a transmission mechanism is arranged in at least one transverse transmission box 4. The transmission mechanism comprises at least three pairs of bearing seats 14 which are correspondingly arranged front and back, each pair of bearing seats 14 is rotatably provided with a rotating shaft 15, each rotating shaft 15 is in transmission connection with a corresponding adjusting shaft 13 through a coupler 16, each rotating shaft 15 is sleeved with a chain wheel 18, each chain wheel 18 on each rotating shaft 15 is in transmission connection through a chain, each rotating shaft 15 is sleeved with a driven belt pulley 19, each driven belt pulley 19 is in transmission connection with a driving belt pulley 22 at the output end of a motor 21 through a belt 20, the bottom of a transverse transmission case 4 and the upper side of the case 1 are both provided with grooves which can be penetrated by the belt 20, and the motor 21 is arranged in the case 1. The lifting mechanism comprises two lifting arms 23 which are correspondingly distributed left and right, the axis of each lifting arm 23 is longitudinally arranged, the upper side of each lifting arm 23 is obliquely arranged, a plurality of positioning grooves 23a are formed in the upper side of each lifting arm 23 at intervals along the axis direction, each positioning groove 23a is correspondingly arranged with each wafer 7 one by one, and grooves capable of allowing the lifting arms 23 to penetrate are formed in each backing plate 11 and the upper side of the case 1; the lifting arm 23 downside is provided with two piece at least parallel connecting rods 24 vertically, each connecting rod 24 stretches into the inside of quick-witted case 1 and lower extreme fixedly connected with lifting seat 25, the symmetry is equipped with 4 piece at least guide bars 26 around the lifting seat 25, every guide bar 26 all sets up with a vertical guide rail 27 phase-match, lifting seat 25 both sides all are equipped with lead screw 28, the vertical setting of lead screw 28 axis, the upper and lower both ends of lead screw 28 rotate respectively and support on a bearing frame 14, the one end and the motor 21 transmission of lead screw 28 are connected, the cover is equipped with screw nut on the lead screw 28, screw nut 28a passes through connecting seat 17 and lifting seat 25 transmission connection. The two transfer manipulators 8 are correspondingly arranged left and right, the transfer manipulators 8 are positioned above the wafer material box 6, the transfer manipulators 8 are L-shaped, each transfer manipulator 8 comprises a transverse section 8a and a longitudinal section 8b, the lower sides of the longitudinal sections 8b of the transfer manipulators 8 are fixedly connected with supporting arms 29, one sides of the two opposite supporting arms 29 are obliquely arranged, a plurality of positioning grooves 29a are formed in the inclined surfaces of the supporting arms 29 at intervals along the length direction, and each positioning groove 29a is arranged in one-to-one correspondence with each wafer 7; the vertical pole 30 is vertically arranged at the lower side of the transverse section 8a of the transfer manipulator 8, the pole 30 stretches into the chassis 1, the lower end of the pole 30 is arranged on the movable seat 31, the movable seat 31 is in transmission connection with the transverse guide rail 34a through the sliding block 34, the motor 21 is arranged on the movable seat 31, the output end of the motor 21 is vertically downward and provided with the gear 33, the transverse guide rail 34a is axially provided with the rack 33a, and the gear 33 is meshed with the rack 33 a. The wafer material frame 32 includes two frame plates 32a that correspond to each other around, be provided with a pair of bilateral symmetry's upper die-pin 32b and a pair of bilateral symmetry's lower die-pin 32c between the frame plates 32a, upper die-pin 32b inboard axial interval is provided with a plurality of constant head tanks, lower die-pin 32c upside is provided with a plurality of constant head tanks along axial interval, protection separation blade has been placed in the constant head tank of both sides around the wafer material frame 32, constant head tank and each wafer 7 one-to-one setting between two protection separation blade, two corresponding setting's constant head tank 32d are connected with two in the bottom of two frame plates 32 a. The base 9 is arranged on the second base plate 12, the baffle 10 of the base 9 is in contact with the corresponding frame plate 32a, two positioning protrusions 35 are symmetrically arranged on the base 9 left and right, the positioning rod 32d is abutted against the positioning protrusions 35 on the same side corresponding to the two bases 9, a positioning plate 36 is arranged on any base 9, and a telescopic positioning button 36a is arranged on the positioning plate 36. The bottom of the wafer material box 6 is symmetrically provided with a vertical bottom plate 37 in a left-right manner, and the wafer material box 6 is supported on the first backing plate 11 through the bottom plate 37. The surface of the case 1 is provided with a plurality of round through holes.
The invention relates to a transfer method of an automatic wafer transfer device, which comprises a machine case 1, wherein a material waiting platform 2 and a positioning platform 3 are arranged on the machine case 1 in parallel, the material waiting platform 2 comprises a group of transverse transmission boxes 4 which are correspondingly arranged front and back and a group of longitudinal frame strips 5 which are correspondingly arranged left and right, a lifting and lifting mechanism is correspondingly arranged on the material waiting platform 2, and a pair of transfer manipulators 8 which can transversely move are arranged on the machine case 1 and correspond to a wafer material box 6; the two transfer manipulators 8 are correspondingly arranged left and right, the transfer manipulators 8 are positioned above the wafer material box 6, the transfer manipulators 8 are L-shaped, each transfer manipulator 8 comprises a transverse section 8a and a longitudinal section 8b, the lower sides of the longitudinal sections 8b of the transfer manipulators 8 are fixedly connected with supporting arms 29, one sides of the two opposite supporting arms 29 are obliquely arranged, a plurality of positioning grooves 29a are formed in the inclined surfaces of the supporting arms 29 at intervals along the length direction, and each positioning groove 29a is arranged in one-to-one correspondence with each wafer 7; the positioning platform 3 comprises a group of bases 9 which are correspondingly arranged front and back, a baffle 10 is vertically arranged on the bases 9, two positioning bulges 35 are symmetrically arranged on the bases 9 left and right, and lifting mechanisms are correspondingly arranged on the positioning platform 3; the lifting mechanism comprises two lifting arms 23 which are correspondingly distributed left and right, the axis of each lifting arm 23 is longitudinally arranged, the upper side of each lifting arm 23 is obliquely arranged, a plurality of positioning grooves 23a are formed in the upper side of each lifting arm 23 at intervals along the axis direction, each positioning groove 23a is correspondingly arranged with each wafer 7 one by one, and a groove capable of allowing the lifting arm 23 to penetrate through is formed in the upper side of the case 1;
the method comprises the following steps:
(1) A plurality of wafers 7 are placed in the wafer material box 6 at equal intervals, the wafers 7 are in a vertical state, and openings are formed in the upper side and the lower side of the wafer material box 6;
(2) Then, the front side and the rear side of the wafer material box 6 are placed between the two transverse transmission boxes 4, the left side and the right side of the wafer material box 6 are placed between the two longitudinal frame strips 5, the surface of the wafer 7 is parallel to the length direction of the transverse transmission boxes 4, and the bottom of the wafer 7 is supported in the positioning groove 23a corresponding to the lifting arm 23; at least 3 adjusting shafts 13 are rotatably arranged between the two transverse transmission boxes 4, the peripheries of the adjusting shafts 13 are wrapped with jackets, the axes of the adjusting shafts 13 are longitudinally arranged, at least 3 adjusting shafts 13 are positioned below the wafer 7 and distributed along the circumferential direction of the wafer 7, two ends of each adjusting shaft 13 are respectively rotatably supported on the walls of the corresponding transverse transmission boxes 4, and a transmission mechanism is arranged in at least one transverse transmission box 4; after the wafer material box 6 in the step (2) is placed, the transmission mechanism drives the adjusting shaft 13 to rotate, and the wafer 7 is driven to rotate through the sheath, so that marks on the edge of the wafer 7 circumferentially rotate to a set position.
(3) The wafer material frame 32 is supported on the base 9, the wafer material frame 32 comprises two frame plates 32a which are correspondingly arranged front and back, a pair of upper supporting rods 32b which are bilaterally symmetrical and a pair of lower supporting rods 32c which are bilaterally symmetrical are arranged between the frame plates 32a, a plurality of positioning grooves are axially arranged at intervals on the inner sides of the upper supporting rods 32b, a plurality of positioning grooves are axially arranged on the upper sides of the lower supporting rods 32c at intervals, protection baffle plates are arranged in the positioning grooves on the front side and the rear side of the wafer material frame 32, the positioning grooves between the two protection baffle plates are arranged in a one-to-one correspondence manner with each wafer 7, two positioning rods 32d which are correspondingly arranged left and right are fixedly connected to the bottoms of the two frame plates 32a, the frame plates 32a on the front side and the rear side of the wafer material frame 32 respectively prop against the baffle plates 10 of the corresponding base 9, and the positioning rods 32d lean against the positioning bulges 35 on the same side corresponding to the two bases 9;
(4) The lifting arm 23 lifts up and passes through the wafer material box 6 to lift each wafer 7 up, then the lifting arm 23 descends, the two transfer manipulators 8 move to the lower side of the wafer 7 in opposite directions, the edges of the wafer 7 extend into the corresponding positioning grooves 29a of the supporting arms 29, the two supporting arms 29 support the wafer 7, then the two transfer manipulators 8 simultaneously move towards the positioning platform 3 to convey the supported wafer 7 to the upper side of the wafer material box 32, the lifting arm 23 below the wafer material box 32 ascends through the wafer material box 32, the two lifting arms 23 jointly support each wafer 7, then the two transfer manipulators 8 reversely move, the supporting arms 29 are separated from the wafer 7, the lifting arm 23 descends to enable each wafer 7 to fall into the wafer material box 32, the bottom of the wafer 7 is supported on the lower supporting rod 32c, and the side of the wafer 7 is contacted with the upper supporting rod 32 b. The transfer of the wafer 7 is completed.
The transmission mechanism comprises at least three pairs of bearing seats 14 which are correspondingly arranged front and back, each pair of bearing seats 14 is rotatably provided with a rotating shaft 15, each rotating shaft 15 is in transmission connection with a corresponding adjusting shaft 13 through a coupler 16, each rotating shaft 15 is sleeved with a chain wheel 18, each chain wheel 18 on each rotating shaft 15 is in transmission connection through a chain, each rotating shaft 15 is sleeved with a driven belt pulley 19, each driven belt pulley 19 is in transmission connection with a driving belt pulley 22 at the output end of a motor 21 through a belt 20, the bottom of a transverse transmission case 4 and the upper side of the case 1 are both provided with grooves which can be penetrated by the belt 20, and the motor 21 is arranged in the case 1. The motor 21 drives the driving belt pulley 22 to rotate, the driving belt pulley 22 drives the driven belt pulley 19 to rotate through the belt 20, the rotating shafts 15 realize rotation, the chain wheels 18 on the rotating shafts 15 drive the chain wheels 18 on other rotating shafts 15 to rotate through chains, and each rotating shaft 15 realizes rotation to drive the adjusting shaft 13 to rotate.
The lifting arm 23 downside is provided with two piece at least parallel connecting rods 24 vertically, each connecting rod 24 stretches into the inside of quick-witted case 1 and lower extreme fixedly connected with lifting seat 25, the symmetry is equipped with 4 piece at least guide bars 26 around the lifting seat 25, every guide bar 26 all sets up with a vertical guide rail 27 phase-match, lifting seat 25 both sides all are equipped with lead screw 28, the vertical setting of lead screw 28 axis, the upper and lower both ends of lead screw 28 rotate respectively and support on a bearing frame 14, the one end and the motor 21 transmission of lead screw 28 are connected, the cover is equipped with screw nut on the lead screw 28, screw nut 28a passes through connecting seat 17 and lifting seat 25 transmission connection. The motor 21 drives the screw rod 28 to rotate, and a screw rod nut 28a on the screw rod 28 moves up and down to drive the lifting seat 25 to move up and down, and the lifting seat 25 drives the lifting arm 23 to move up and down.
The vertical pole 30 is vertically arranged at the lower side of the transverse section 8a of the transfer manipulator 8, the pole 30 stretches into the chassis 1, the lower end of the pole 30 is arranged on the movable seat 31, the movable seat 31 is in transmission connection with the transverse guide rail 34a through the sliding block 34, the motor 21 is arranged on the movable seat 31, the output end of the motor 21 is vertically downward and provided with the gear 33, the transverse guide rail 34a is axially provided with the rack 33a, and the gear 33 is meshed with the rack 33 a. The motor 21 drives the gear 33 to rotate, the gear 33 rolls along the rack 33a to drive the movable seat 31 to move along the transverse guide rail 34a, the transfer manipulators 8 realize transverse movement, when the two transfer manipulators 8 move to corresponding positions in opposite directions, the edge of the wafer 7 is inserted into the corresponding positioning groove 29a, and the supporting arm 29 can support the wafer 7 from below.
The invention has the advantages that: the wafer 7 vertically placed in the wafer material box 6 can be lifted, and transferred into the wafer material frame 32 through the transfer manipulator 8, the wafer 7 keeps stable movement in a vertical state, the stress of the wafer 7 is balanced, and the wafer 7 is prevented from being damaged.
The invention is not limited to the above embodiments, and based on the technical solution disclosed in the invention, a person skilled in the art may make some substitutions and modifications to some technical features thereof without creative effort according to the technical content disclosed, and all the substitutions and modifications are within the protection scope of the invention.
Claims (9)
1. The automatic wafer transfer device comprises a case, wherein a material waiting platform and a positioning platform are arranged on the case in parallel, the automatic wafer transfer device is characterized in that the material waiting platform comprises a group of transverse transmission boxes which are correspondingly arranged front and back and a group of longitudinal frame strips which are correspondingly arranged left and right, a wafer material box is correspondingly arranged between the two transverse transmission boxes and between the two longitudinal frame strips, a plurality of wafers which are parallel to each other are vertically arranged in the wafer material box, the surfaces of the wafers are parallel to the length direction of the transverse transmission boxes, openings are respectively arranged on the upper side and the lower side of the wafer material box, lifting and lifting mechanisms are correspondingly arranged below the wafer material box, and a pair of transfer manipulators which can transversely move are arranged on the case and correspond to the wafer material box; the positioning platform comprises a group of bases which are correspondingly arranged front and back, a baffle is vertically arranged on the base, a wafer material frame is supported on the base, the front side and the rear side of the wafer material frame respectively lean against the baffle corresponding to the base, and a lifting mechanism is correspondingly arranged below the wafer material frame; the lifting mechanism comprises two lifting arms which are correspondingly distributed left and right, the axis of each lifting arm is longitudinally arranged, the upper side of each lifting arm is obliquely arranged, a plurality of positioning grooves are formed in the upper side of each lifting arm at intervals along the axis direction, and each positioning groove is arranged in one-to-one correspondence with each wafer; the two transfer manipulators are correspondingly arranged left and right, the transfer manipulators are positioned above the wafer material box, the transfer manipulators are L-shaped, the transfer manipulators comprise a transverse section and a longitudinal section, the lower side of the longitudinal section of the transfer manipulator is fixedly connected with a supporting arm, one opposite sides of the two supporting arms are obliquely arranged, a plurality of positioning grooves are formed in the inclined surfaces of the supporting arms at intervals along the length direction, and each positioning groove is arranged in one-to-one correspondence with each wafer; the transverse transmission box drives the wafer to rotate, so that marks on the edge of the wafer circumferentially rotate to a set position.
2. The automated wafer transfer apparatus of claim 1, wherein the bottom of the wafer cassette is supported on a first backing plate, the first backing plate is located between two lateral transmission boxes and between two longitudinal frame bars, at least 3 adjustment shafts are rotatably disposed between the two lateral transmission boxes, the peripheries of the adjustment shafts are wrapped with jackets, the axes of the adjustment shafts are longitudinally disposed, at least 3 adjustment shafts are located below the wafer and distributed along the circumferential direction of the wafer, two ends of the adjustment shafts are respectively rotatably supported on corresponding lateral transmission box walls, and a transmission mechanism is disposed in at least one lateral transmission box.
3. The automated wafer transfer apparatus of claim 2, wherein the transmission mechanism comprises at least three pairs of bearing seats arranged correspondingly in front and back, each pair of bearing seats is rotatably provided with a rotating shaft, the rotating shaft is in transmission connection with a corresponding adjusting shaft through a coupling, a sprocket is sleeved on the rotating shaft, the sprockets on each rotating shaft are in transmission connection through a chain, a driven belt pulley is sleeved on any rotating shaft, the driven belt pulley is in transmission connection with a driving belt pulley at the output end of a motor through a belt, grooves capable of allowing the belt to pass are formed in the bottom of a transverse transmission case and the upper side of the case, and the motor is arranged in the case.
4. An automated wafer transfer apparatus according to claim 2 or claim 3, wherein grooves are formed in the upper sides of the first base plate and the chassis for allowing the lifting arms to pass through; the vertical connecting rods that are provided with at least two parallels of lift arm downside, each connecting rod stretches into quick-witted incasement portion and lower extreme fixedly connected with elevating seat, the symmetry is equipped with 4 piece at least gibs around the elevating seat, every gib is all with a vertical guide rail assorted setting, elevating seat left and right sides all is equipped with the lead screw, the vertical setting of lead screw axis, the upper and lower both ends of lead screw rotate respectively and support on a bearing frame, the one end and the motor drive of lead screw are connected, the cover is equipped with screw-nut on the lead screw, screw-nut passes through the connecting seat and is connected with elevating seat transmission.
5. An automated wafer transfer apparatus according to any one of claims 1 to 3, wherein the lower side of the transverse section of the transfer robot is vertically provided with a vertical rod, the vertical rod extends into the chassis and the lower end is disposed on a movable seat, the movable seat is in driving connection with a transverse guide rail through a sliding block, a motor is disposed on the movable seat, the output end of the motor is vertically downward and is provided with a gear, the transverse guide rail is axially provided with a rack, and the gear is meshed with the rack.
6. An automated wafer transfer apparatus according to any one of claims 1 to 3, wherein the wafer material frame comprises two frame plates arranged in a front-back correspondence manner, a pair of upper support rods and a pair of lower support rods are arranged between the frame plates, a plurality of positioning grooves are axially arranged at intervals on the inner sides of the upper support rods, a plurality of positioning grooves are axially arranged on the upper sides of the lower support rods at intervals, protective baffle plates are arranged in the positioning grooves on the front side and the rear side of the wafer material frame, the positioning grooves between the two protective baffle plates are arranged in a one-to-one correspondence manner with each wafer, and two positioning rods arranged in a left-right correspondence manner are fixedly connected to the bottoms of the two frame plates.
7. The automated wafer transfer apparatus of claim 6, wherein the base is disposed on a second pad, the baffle of the base contacts the corresponding frame plate, two positioning protrusions are symmetrically disposed on the base, the positioning rod abuts against the positioning protrusions on the same side corresponding to the two bases, a positioning plate is disposed on any base, and a retractable positioning button is disposed on the positioning plate.
8. An automated wafer transfer apparatus according to claim 2 or claim 3, wherein the bottom of the wafer cassette is provided with a vertical base plate symmetrically left and right, the wafer cassette being supported on a first backing plate by the base plate.
9. An automated wafer transfer apparatus according to any one of claims 1-3, wherein the surface of the housing is provided with a plurality of circular through holes.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811492067.6A CN109390265B (en) | 2018-12-07 | 2018-12-07 | Automatic change wafer transfer device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811492067.6A CN109390265B (en) | 2018-12-07 | 2018-12-07 | Automatic change wafer transfer device |
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| CN109390265A CN109390265A (en) | 2019-02-26 |
| CN109390265B true CN109390265B (en) | 2023-09-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110773932B (en) * | 2019-11-13 | 2021-04-27 | 温州大学 | Positioning device for welding semiconductor device |
| CN115593910B (en) * | 2022-10-19 | 2024-08-06 | 苏州广年科技有限公司 | Scratch-proof wafer transferring method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307374A (en) * | 1994-05-10 | 1995-11-21 | Dainippon Screen Mfg Co Ltd | Substrate holding chuck, substrate holding unit and substrate treating device |
| JP2004055697A (en) * | 2002-07-17 | 2004-02-19 | Ace:Kk | Apparatus and method for transferring and conveying substrate |
| KR20060058823A (en) * | 2004-11-26 | 2006-06-01 | 삼성전자주식회사 | Robot for transferring wafer with tilt function |
| CN106601659A (en) * | 2016-12-30 | 2017-04-26 | 上海新阳半导体材料股份有限公司 | Novel wafer transfer device |
| CN106783710A (en) * | 2016-12-31 | 2017-05-31 | 上海新阳半导体材料股份有限公司 | Wafer transfer device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8033288B2 (en) * | 2007-03-09 | 2011-10-11 | Dainippon Screen Mfg. Co., Ltd. | Substrate treatment apparatus |
-
2018
- 2018-12-07 CN CN201811492067.6A patent/CN109390265B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307374A (en) * | 1994-05-10 | 1995-11-21 | Dainippon Screen Mfg Co Ltd | Substrate holding chuck, substrate holding unit and substrate treating device |
| JP2004055697A (en) * | 2002-07-17 | 2004-02-19 | Ace:Kk | Apparatus and method for transferring and conveying substrate |
| KR20060058823A (en) * | 2004-11-26 | 2006-06-01 | 삼성전자주식회사 | Robot for transferring wafer with tilt function |
| CN106601659A (en) * | 2016-12-30 | 2017-04-26 | 上海新阳半导体材料股份有限公司 | Novel wafer transfer device |
| CN106783710A (en) * | 2016-12-31 | 2017-05-31 | 上海新阳半导体材料股份有限公司 | Wafer transfer device |
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