CN109511219B - Display panel, circuit board and preparation method thereof - Google Patents
Display panel, circuit board and preparation method thereof Download PDFInfo
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- CN109511219B CN109511219B CN201811401617.9A CN201811401617A CN109511219B CN 109511219 B CN109511219 B CN 109511219B CN 201811401617 A CN201811401617 A CN 201811401617A CN 109511219 B CN109511219 B CN 109511219B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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Abstract
The disclosure provides a display panel, a circuit board and a preparation method of the circuit board. The preparation method of the circuit board comprises the following steps: providing a substrate; forming at least one golden finger on the substrate, wherein each golden finger comprises a first finger section and a second finger section which are connected with each other, and the width of the second finger section is larger than that of the first finger section; and cutting off the substrate on which the golden finger is formed along a preset track, wherein the preset track penetrates through the second finger section. The anti-tilting circuit board can prevent the golden finger from tilting in the cutting process, and the qualification rate of the circuit board is improved.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a display panel, a circuit board and a preparation method of the circuit board.
Background
With the development of display technology, higher requirements are placed on the performance of circuit boards that process various analog signals or digital signals. In order to improve the performance of the circuit board, people pay more and more attention to the preparation method of the circuit board.
The existing preparation method of the circuit board adopts a composition process to form a required circuit and a required gold finger on a conductive material layer on a substrate, and forms the required circuit board through processing processes such as punching and the like. However, in the punching process, the gold finger is easy to tilt, which causes the circuit board to have short circuit and other faults, and reduces the qualified rate of the circuit board.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
The purpose of the present disclosure is to provide a display panel, a circuit board and a method for manufacturing the circuit board, which can prevent a gold finger from tilting and improve the qualification rate of the circuit board.
According to an aspect of the present disclosure, there is provided a method of manufacturing a circuit board, including: providing a substrate; forming at least one golden finger on the substrate, wherein each golden finger comprises a first finger section and a second finger section which are connected with each other, and the width of the second finger section is larger than that of the first finger section; and cutting off the substrate on which the golden finger is formed along a preset track, wherein the preset track penetrates through the second finger section.
In an exemplary embodiment of the present disclosure, cutting the substrate on which the gold finger is formed along a preset track, the preset track passing through the first finger segment includes: and cutting off the substrate on which the golden finger is formed along a preset track by a punching process, wherein the preset track passes through the second finger section.
In an exemplary embodiment of the present disclosure, forming at least one gold finger on the substrate includes: forming a conductive material layer on the substrate; and etching the conductive material layer to form at least one gold finger on the substrate, wherein each gold finger comprises a first finger section and a second finger section which are connected with each other, and the width of the second finger section is greater than that of the first finger section.
In an exemplary embodiment of the present disclosure, each of the golden fingers extends along a preset direction, the preset track is perpendicular to the preset direction, and a distance between one end of the second finger segment of each of the golden fingers, which is close to the first finger segment, and the preset track is 0.1-0.2 mm.
According to one aspect of the present disclosure, a circuit board is provided, which includes a substrate and at least one gold finger disposed on the substrate. Each golden finger comprises a first finger section and a second finger section retaining part which are connected with each other, the width of the second finger section retaining part is larger than that of the first finger section, and the end face of one end, away from the first finger section, of the second finger section retaining part is located on a preset track.
In an exemplary embodiment of the present disclosure, the width of the second finger section retainer gradually increases in a direction away from the first finger section.
In an exemplary embodiment of the present disclosure, the width of the first finger section is 0.005-0.015mm, and the width of the second finger section retention portion is 0.01-0.02 mm.
In an exemplary embodiment of the present disclosure, the substrate is a flexible substrate.
In an exemplary embodiment of the present disclosure, the number of the gold fingers is multiple, and the multiple gold fingers are distributed in parallel or radially around a preset center.
According to an aspect of the present disclosure, a display panel is provided, which includes the circuit board.
According to the display panel, the circuit board and the preparation method of the circuit board, the substrate is cut off along the preset track passing through the second finger section, so that the second finger section retaining part of the gold finger in the circuit board is formed. Because the width of second finger section is greater than the width of first finger section to increased the binding force of second finger section and base plate, strengthened the binding force of second finger section with the base plate, can prevent that the golden finger from taking place the perk at the in-process of cutting, avoid circuit fault such as short circuit to appear, improved the qualification rate of circuit board.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The above and other features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.
Fig. 1 is a flow chart of a method of manufacturing a circuit board of an embodiment of the present disclosure;
fig. 2 is a flowchart of step S12 in the method for manufacturing a circuit board according to the embodiment of the present disclosure;
fig. 3 is a schematic view of a substrate with a gold finger formed thereon before cutting in a method for manufacturing a circuit board according to an embodiment of the present disclosure;
fig. 4 is a schematic view of a substrate with a gold finger formed thereon after being cut off in a method for manufacturing a circuit board according to an embodiment of the present disclosure;
fig. 5 is a schematic view of a display panel according to an embodiment of the present disclosure.
In the figure: 1. a substrate; 2. a golden finger; 201. a first finger section; 202. a second finger section; 203. a second finger section retention section; 3. presetting a track; 4. a power management chip; 5. a memory chip; 6. a signal processing circuit; 7. a display driver integrated circuit; 8. a component; 9. a display panel.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, etc. In other instances, well-known technical solutions have not been shown or described in detail to avoid obscuring aspects of the present disclosure.
Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted. The terms "a" and "the" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.
The embodiment of the disclosure provides a preparation method of a circuit board. As shown in fig. 1, the method of manufacturing a circuit board may include steps S11-S13, in which:
and step S11, providing a substrate.
Step S12, forming at least one golden finger on the substrate, where each golden finger includes a first finger section and a second finger section connected to each other, and a width of the second finger section is greater than a width of the first finger section.
And step S13, cutting off the substrate with the golden finger along a preset track, wherein the preset track passes through the second finger section.
According to the method for manufacturing the circuit board, the substrate is cut along the preset track passing through the second finger section. Because the width of second finger section is greater than the width of first finger section to increased the bonding area of second finger section and base plate, strengthened the bonding force of second finger section and base plate, can prevent that the golden finger from taking place the perk at the in-process that cuts, avoid the short circuit trouble to appear, improved the qualification rate of circuit board, had good economic benefits.
The following is a detailed description of the steps of the method for manufacturing a circuit board according to the embodiment of the present disclosure:
in step S11, a substrate is provided.
The substrate may have a regular shape such as a circle, a rectangle, or the like, but is not limited thereto, and may have an irregular shape. The substrate may be a flexible substrate such that the formed circuit board is a flexible circuit board. The flexible substrate may be made of polyimide, so that the flexible substrate has good insulating property. Of course, the material of the flexible substrate may also be other materials such as polyester, and will not be described in detail herein. In other embodiments of the present disclosure, the substrate may also be a ceramic substrate or the like, so that the formed circuit board has certain rigidity. The ceramic substrate may be an alumina ceramic substrate, an aluminum nitride ceramic substrate, or the like. In addition, the size of the substrate is not particularly limited in the embodiments of the present disclosure.
In step S12, at least one gold finger is formed on the substrate, each gold finger includes a first finger section and a second finger section connected to each other, and the width of the second finger section is greater than that of the first finger section.
As shown in fig. 3, the gold finger 2 may be divided into a first finger segment 201 and a second finger segment 202. The first finger section 201 and the second finger section 202 are connected to each other. Wherein, the first finger section 201 and the second finger section 202 can be integrally formed. The material of the first finger section 201 may be the same as the material of the second finger section 202, and of course, may not be the same. In addition, the first finger segment 201 and the second finger segment 202 of each gold finger 2 may be distributed along the extending direction of each gold finger 2.
As shown in fig. 3, the size of the first finger section 201 or the second finger section 202 in the direction perpendicular to the extending direction of the gold finger 2 and parallel to the substrate 1 is taken as the width thereof in the embodiment of the present disclosure. The width of the second finger section 202 is greater than that of the first finger section 201, so that the bonding area between the second finger section 202 and the substrate 1 is greater than that between the first finger section 201 and the substrate 1, and the contact viscosity between the second finger section 202 and the substrate 1 is greater than that between the first finger section 201 and the substrate 1. The width of the first finger section 201 may be 0.005-0.015mm, such as 0.005mm, 0.008mm, 0.012mm, 0.014mm, 0.015mm, etc. The two sides of the first finger section 201 may be parallel to each other such that the width of the first finger section 201 is the same from one end of the first finger section 201 to the other. In other embodiments of the present disclosure, the two sides of the first finger section 201 are not parallel, and the distance between the two sides gradually increases from the end of the first finger section 201 away from the second finger section 202 to the other end. Further, the length of the first finger section 201 may be 0.5-1mm, such as 0.5mm, 0.6mm, 0.8mm, 0.9mm, 1mm, and the like.
As shown in FIG. 3, the width of the second finger section 202 may be 0.01-0.02mm, such as 0.01mm, 0.012mm, 0.015mm, 0.016mm, 0.02mm, etc. In one embodiment, the width of the second finger section 202 is the same from one end of the second finger section 202 to the other. Specifically, the two sides of the second finger section 202 are parallel to each other. In another embodiment, the width of the second finger section 202 increases in a direction away from the first finger section 201. The projection of the second finger segment 202 on the substrate 1 may be a trapezoid, and the long side of the trapezoid is an end of the second finger segment 202 away from the first finger segment 201. Of course, the projection of the second finger section 202 on the substrate 1 may also be funnel-shaped, and the wide mouth of the funnel is the end of the second finger section 202 away from the first finger section 201. In other embodiments of the present disclosure, the width of the second finger section 202 may also increase first and then decrease or decrease first and then increase in a direction away from the first finger section 201. It should be noted that, when the width of the second finger section 202 is 0.01mm, the width of the first finger section 201 may not be 0.012mm, 0.014mm or 0.015mm, which is described above, but needs to be less than 0.01 mm.
The number of the gold fingers 2 may be one, two or three, but not limited thereto, and may be more. In one embodiment, any two of the plurality of gold fingers 2 may be disposed in parallel, and the plurality of gold fingers 2 are distributed along a track. The trajectory may be a straight line, or may be a curved line. In another embodiment, at least two gold fingers 2 not parallel may exist in the plurality of gold fingers 2. For example, any two of the plurality of gold fingers 2 are not parallel, and the plurality of gold fingers 2 are radially distributed around a predetermined center. Because this disclosed embodiment can prevent that golden finger 2 from taking place the perk to can solve because the mutual problem of contact of two adjacent golden fingers 2 that golden finger 2 perk leads to, avoid the emergence of short circuit.
For example, as shown in fig. 2, step S12 may include step S121 and step S122, where:
step S121, forming a conductive material layer on the substrate.
The layer of conductive material may be formed by a vapor deposition technique. The vapor deposition technique may be vacuum evaporation, or may be sputter coating, of course. The layer of conductive material may be a layer of copper foil. Since the copper foil is an electrolytic material, the copper foil can be easily deposited on the substrate to form a thin layer. In other embodiments of the present disclosure, the conductive material layer may also be formed of other metal materials such as aluminum, which are easily deposited on the substrate, and will not be described in detail herein. Before the conductive material layer is formed, an adhesive film may be formed on the substrate in advance to enhance the bonding force between the conductive material layer and the substrate. The adhesive film may be prepared from a thermosetting resin adhesive, but not limited thereto, and may also be prepared from other adhesives. In addition, the embodiments of the present disclosure may be formed with a conductive material layer on both opposite surfaces of the substrate.
Step S122, etching the conductive material layer to form at least one gold finger on the substrate, where each gold finger includes a first finger section and a second finger section connected to each other, and a width of the second finger section is greater than a width of the first finger section.
For example, etching the conductive material layer to form the gold finger may include: coating photoresist on the conductive material layer; exposing the photoresist on the substrate by adopting a mask plate with a golden finger pattern; immersing the exposed substrate into a developing solution for developing, and removing the photoresist which does not generate polymerization reaction so as to expose the conductive material layer formed on the substrate; and etching the exposed conductive material layer, and removing the residual photoresist to form the gold finger. Wherein etching the exposed conductive material layer may include: the exposed conductive material layer is etched by a dry etching process or a wet etching process. In addition, in order to increase the strength of the gold finger, a layer of reinforcing material may be formed on the side of the gold finger away from the substrate. The reinforcing material may be polyimide or the like.
The mask plate can be also provided with a circuit pattern, so that the golden finger can be formed on the substrate and the circuit can be formed at the same time. The circuitry may be used to generate, amplify and process a variety of analog or digital signals. The gold finger may be connected to a wire. Wherein, the golden finger and the circuit can be integrally formed. The gold finger is connected with the external component, so that the circuit on the substrate can be connected with the external component.
In step S13, the substrate on which the gold finger is formed is cut along a predetermined track, and the predetermined track passes through the second finger section.
As shown in fig. 3, the substrate 1 formed with the gold finger 2 is cut along a predetermined track 3, a portion remaining after the second finger section 202 is cut is a second finger section remaining portion, and the second finger section remaining portion is connected to the first finger section 201 and can be used as a required gold finger. Wherein the predetermined track 3 passes through the second finger section 202. Because the width of the second finger section 202 is greater than the width of the first finger section 201, the bonding force between the second finger section 202 and the substrate 1 is greater than the bonding force between the first finger section 201 and the substrate 1, and the problem that the golden finger 2 is easy to tilt in the cutting process is solved. In one embodiment, the plurality of gold fingers 2 are disposed in parallel, and each gold finger 2 extends along a predetermined direction, the predetermined track 3 is perpendicular to the predetermined direction and passes through the second finger section 202 of each gold finger 2, and a distance between one end of the second finger section 202 of each gold finger 2 close to the first finger section 201 and the predetermined track 3 is 0.1-0.2mm, such as 0.1mm, 0.11mm, 0.14mm, 0.19mm, 0.2mm, and the like. In addition, the substrate 1 on which the gold fingers 2 are formed may be cut by a punching process according to the embodiment of the present disclosure, but the present disclosure is not limited thereto, and the substrate 1 on which the gold fingers 2 are formed may be cut by other means such as cutting.
The embodiment of the disclosure also provides a circuit board, and the circuit board is prepared by the preparation method of the circuit board in the embodiment. As shown in fig. 4, the circuit board may include a substrate 1 and at least one gold finger 2 disposed on the substrate 1, wherein:
each gold finger 2 comprises a first finger segment 201 and a second finger segment retention portion 203 connected to each other. The width of the second finger section reservation portion 203 is greater than the width of the first finger section 201, and the end face of one end of the second finger section reservation portion 203 far away from the first finger section 201 is located on a preset track.
The circuit board of the embodiment of the present disclosure, the terminal surface that the one end of first finger section 201 was kept away from to second finger section retention portion 203 is located predetermines the orbit, make this golden finger 2 accessible cut off and form along predetermineeing the orbit, because the width that second finger section retention portion 203 is greater than the width of first finger section 201, thereby increased the combination area who cuts off position and base plate 1, strengthened the cohesion with base plate 1, can prevent golden finger 2 from taking place the perk at the in-process that cuts, avoid short-circuit trouble to appear, the qualification rate of circuit board has been improved, and the economic benefits is good.
The components of the circuit board of the embodiments of the present disclosure are explained in detail below:
as shown in fig. 4, the substrate 1 may have a regular shape such as a circle or a rectangle, but is not limited thereto, and may have an irregular shape. The substrate 1 may be a flexible substrate, so that the circuit board is a flexible circuit board. The flexible substrate may be made of polyimide, so that the flexible substrate has good insulating property. Of course, the material of the flexible substrate may also be other materials such as polyester, and will not be described in detail herein. In other embodiments of the present disclosure, the substrate 1 may also be a ceramic substrate or the like, so that the circuit board has certain rigidity. The ceramic substrate may be an alumina ceramic substrate, an aluminum nitride ceramic substrate, or the like. In addition, the size of the substrate 1 is not particularly limited in the embodiments of the present disclosure.
As shown in fig. 4, the gold finger 2 may include a first finger segment 201 and a second finger segment retention portion 203. The first finger segment 201 and the second finger segment holder 203 are connected to each other. Wherein, the first finger segment 201 and the second finger segment retaining portion 203 can be integrally formed. The material of the first finger 201 may be the same as the material of the second finger-holding portion 203, or of course, may be different. In addition, the first finger section 201 and the second finger section reservation part 203 of each gold finger 2 may be distributed along the extending direction of each gold finger 2.
As shown in fig. 4, the first finger segment 201 or the second finger segment holding portion 203 in the embodiment of the present disclosure has a dimension perpendicular to the extending direction of the gold finger 2 and parallel to the substrate 1 as its width. The width of the second finger section reservation part 203 is larger than that of the first finger section 201, so that the bonding area of the second finger section reservation part 203 and the substrate 1 is larger than that of the first finger section 201 and the substrate 1, and the contact viscosity of the second finger section reservation part 203 and the substrate 1 is larger than that of the first finger section 201 and the substrate 1. The width of the first finger section 201 may be 0.005-0.015mm, such as 0.005mm, 0.008mm, 0.012mm, 0.014mm, 0.015mm, etc. The two sides of the first finger section 201 may be parallel to each other such that the width of the first finger section 201 is the same from one end of the first finger section 201 to the other. In other embodiments of the present disclosure, the two sides of the first finger section 201 are not parallel, and the distance between the two sides gradually increases from the end of the first finger section 201 away from the second finger section retention portion 203 to the other end. Further, the length of the first finger section 201 may be 0.5-1mm, such as 0.5mm, 0.6mm, 0.8mm, 0.9mm, 1mm, and the like.
As shown in fig. 4, the second finger section reservation portion 203 is a portion reserved after the second finger section 202 is cut off in the embodiment of the method for manufacturing the circuit board. The width of the second finger section retention portion 203 may be 0.01-0.02mm, such as 0.01mm, 0.012mm, 0.015mm, 0.016mm, 0.02mm, and the like. In one embodiment, the width of the second finger-segment retention portion 203 is the same from one end of the second finger-segment retention portion 203 to the other end. Specifically, two sides of the second finger-section holding portion 203 are parallel to each other. In another embodiment, the width of the second finger section retainer 203 gradually increases in a direction away from the first finger section 201. The projection of the second finger section retention portion 203 on the substrate 1 may be a trapezoid, and the long side of the trapezoid is an end of the second finger section retention portion 203 far away from the first finger section 201. Of course, the projection of the second finger-segment retaining portion 203 on the substrate 1 may also be funnel-shaped, and the wide mouth of the funnel is the end of the second finger-segment retaining portion 203 away from the first finger-segment 201. In other embodiments of the present disclosure, the width of the second finger section retainer 203 may also increase and then decrease or decrease and then increase in a direction away from the first finger section 201. When the width of the second finger section holding portion 203 is 0.01mm, the width of the first finger section 201 may not be 0.012mm, 0.014mm or 0.015mm, but may be less than 0.01 mm.
As shown in fig. 4, the number of the gold fingers 2 may be one, two or three, but not limited thereto, and may be more. In one embodiment, any two of the plurality of gold fingers 2 may be disposed in parallel, and the plurality of gold fingers 2 are distributed along a track. The trajectory may be a straight line, or may be a curved line. In another embodiment, at least two gold fingers 2 not parallel may exist in the plurality of gold fingers 2. For example, any two of the plurality of gold fingers 2 are not parallel, and the plurality of gold fingers 2 are radially distributed around a predetermined center.
The embodiment of the disclosure also provides a display panel. As shown in fig. 5, the display panel 9 includes the circuit board described in the above embodiment. The display panel 9 may further include a display device. The first finger section 201 of the circuit board may be connected to a display device. For example, the first finger section 201 is bound to a display device. The circuit board of the display panel 9 of the embodiment of the present disclosure is the same as the circuit board of the embodiment described above, and therefore, the same advantageous effects are obtained, and are not described herein again.
The display panel described above may include an AMOLED panel. Compared with an LCD panel, the AMOLED panel has the advantages of self-luminescence, high reaction speed, bending and the like. A Display Driver Integrated Circuit (DDIC) of the AMOLED panel may be bound to the AMOLED panel by a Chip On Film (Chip On Film) technology; after the binding of the DDIC is completed, a signal processing circuit that processes an output signal of the DDIC needs to be bound to the DDIC. The process includes two times of binding, which results in complex process, large occupied area of a Chip On Film (Chip On Film) and high power consumption. The disclosed embodiments may integrate a Display Driver Integrated Circuit (DDIC) and a signal processing circuit on one circuit board to reduce the number of times of binding. As shown in fig. 5, the circuit board may include a signal processing circuit 6 and a Display Driver Integrated Circuit (DDIC)7, and of course, may also include a power management chip 4 and a memory chip 5, but not limited thereto, and the present disclosure may also add components 8 having various functions on the substrate 1.
Moreover, although the steps of the methods of the present disclosure are depicted in the drawings in a particular order, this does not require or imply that the steps must be performed in this particular order, or that all of the depicted steps must be performed, to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (4)
1. A method for manufacturing a circuit board, comprising:
providing a substrate;
forming at least one golden finger on the substrate, wherein each golden finger comprises a first finger section and a second finger section which are connected with each other, and the width of the second finger section is larger than that of the first finger section;
and cutting off the substrate on which the golden finger is formed along a preset track, wherein the preset track penetrates through the second finger section.
2. The method for manufacturing a circuit board according to claim 1, wherein cutting the substrate on which the gold finger is formed along a predetermined track, the predetermined track passing through the second finger section, comprises:
and cutting off the substrate on which the golden finger is formed along a preset track by a punching process, wherein the preset track passes through the second finger section.
3. The method of claim 1, wherein forming at least one gold finger on the substrate comprises:
forming a conductive material layer on the substrate;
and etching the conductive material layer to form at least one gold finger on the substrate, wherein each gold finger comprises a first finger section and a second finger section which are connected with each other, and the width of the second finger section is greater than that of the first finger section.
4. The method for manufacturing a circuit board according to claim 1, wherein each of the gold fingers extends along a predetermined direction, the predetermined trace is perpendicular to the predetermined direction, and a distance between one end of the second finger section of each of the gold fingers close to the first finger section and the predetermined trace is 0.1-0.2 mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811401617.9A CN109511219B (en) | 2018-11-22 | 2018-11-22 | Display panel, circuit board and preparation method thereof |
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| CN201811401617.9A CN109511219B (en) | 2018-11-22 | 2018-11-22 | Display panel, circuit board and preparation method thereof |
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| CN109511219B true CN109511219B (en) | 2021-08-24 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM353599U (en) * | 2008-11-11 | 2009-03-21 | Inventec Appliances Corp | Conducting wire structure of a flexible printed circuit board |
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| JP6343449B2 (en) * | 2011-07-20 | 2018-06-13 | 株式会社カネカ | New conductive layer integrated FPC |
| US9439290B1 (en) * | 2015-08-04 | 2016-09-06 | Kinsus Interconnect Technology Corp. | Carrier board structure |
| CN205017686U (en) * | 2015-08-31 | 2016-02-03 | 昆山龙朋精密电子有限公司 | A inclined to one side golden finger of scour protection for flexible line way board |
| TWM537776U (en) * | 2016-11-01 | 2017-03-01 | Ichia Tech Inc | Structure of printed circuit board |
| CN207678070U (en) * | 2018-01-19 | 2018-07-31 | 昆山国显光电有限公司 | FPC golden fingers, flexible PCB and flexible display screen |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM353599U (en) * | 2008-11-11 | 2009-03-21 | Inventec Appliances Corp | Conducting wire structure of a flexible printed circuit board |
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