CN109508615A - Optical finger print identifies mould group and electronic device - Google Patents
Optical finger print identifies mould group and electronic device Download PDFInfo
- Publication number
- CN109508615A CN109508615A CN201710854175.2A CN201710854175A CN109508615A CN 109508615 A CN109508615 A CN 109508615A CN 201710854175 A CN201710854175 A CN 201710854175A CN 109508615 A CN109508615 A CN 109508615A
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- China
- Prior art keywords
- optical
- light
- mould group
- finger print
- fingerprint sensor
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
Abstract
The invention discloses a kind of optical finger prints to identify mould group.Optical finger print identifies that mould group includes circuit board, optical fingerprint sensor, light source and optical cement.Optical fingerprint sensor is located on circuit board.Optical fingerprint sensor includes upper surface, and optical cement is located on upper surface.The light of light source transmitting is blue green light.Optical cement is in blue-green.In addition, there is electronic device optical finger print to identify mould group the invention also discloses a kind of electronic device.The optical finger print identification mould group of embodiment of the present invention is provided with optical cement identical with the light color of light source sending in optical fingerprint sensor upper surface.The blue green light for allowing light source to issue in glaucous optical cement penetrates and absorbs the light of other colors, to reduce interference of the environment light to optical fingerprint sensor, optical finger print identification mould group is enable to collect clearly fingerprint.
Description
Technical field
The present invention relates to technical field of biometric identification, identify mould group and electronic device more particularly, to a kind of optical finger print.
Background technique
Use visible light as light source in the optical finger print identification mould group of the relevant technologies, vulnerable to the dry of external environmental light
It disturbs.When user is in outdoor application optical finger print identification mould group unlock electronic device, outdoor environment light mid-infrared light easily causes light
Fingerprint sensor saturation is learned, leading to not acquisition, clearly fingerprint image, fingerprint recognition effect are poor.
Summary of the invention
Embodiments of the present invention provide a kind of optical finger print identification mould group and electronic device.
A kind of optical finger print of embodiment of the present invention identifies mould group, comprising:
Circuit board；
Optical fingerprint sensor on the circuit board, the optical fingerprint sensor include upper surface；
Light source, the light that the light source issues are blue green light；With
Optical cement, the optical cement are located at the upper surface of the optical fingerprint sensor and in blue-greens.
The optical finger print identification mould group of embodiment of the present invention is provided in optical fingerprint sensor upper surface to be sent out with light source
The identical optical cement of light color out.The blue green light for allowing light source to issue in glaucous optical cement penetrates and absorbs other colors
Light so that optical finger print identification mould group is collected clearly to reduce interference of the environment light to optical fingerprint sensor
Fingerprint.
In some embodiments, the circuit board includes substrate and flexible circuit board, and the optical fingerprint sensor is set
It sets on the substrate, one end of the flexible circuit board connects the lower surface of the substrate.
In this way, flexible circuit board is light-weight and thickness is thin, space is saved, is conducive to optical finger print identification mould group miniaturization, together
When, substrate can be used as the supporter of support optical fingerprint sensor and the optical finger print identification other elements of mould group.
In some embodiments, the optical fingerprint sensor includes:
Photosensitive layer, the photosensitive layer are formed with induction zone；With
Optical layer on the photosensitive layer is set, and the optical layer covers the induction zone, the area of the optical layer
Greater than the area of the induction zone, the optical layer is formed with multiple lens, the photosensitive layer be located at the optical layer with it is described
Between substrate.
In this way, optical layer can make more light converge to photosensitive layer, optical finger print identification mould group is enable to collect more
More optical signal, more accurately to realize fingerprint recognition.
In some embodiments, the photosensitive layer includes multiple light-sensitive elements and connection line, the multiple photosensitive member
Part forms the induction zone, and the connection line connects the multiple light-sensitive element and the substrate.
In this way, light-sensitive element can incude the light converged from optical layer and optical signal is converted to electric signal to collect
Finger print information.
In some embodiments, the light source is located at the side of the optical fingerprint sensor, and the light source is configured
At transmitting light to the optical fingerprint sensor, the optical fingerprint sensor is configured to the light for emitting the light source
It is transmitted to the outside of the optical finger print identification mould group, and is received as described in the external reflection of optical finger print identification mould group
The light of light source transmitting.
In this way, light source is located at the side of optical fingerprint sensor, source emissioning light line to optical fingerprint sensor.
In some embodiments, the optical finger print identification mould group includes light guide, and the light guide is arranged described
The side of the light guide is arranged in the lower section of optical fingerprint sensor, the light source, and the light source is configured to emit light
It is transmitted to the optical fingerprint sensor through the light guide, the optical fingerprint sensor is configured to emit the light source
Light be transmitted to the outside of optical finger print identification mould group, and receive by the external reflection of optical finger print identification mould group
The light source transmitting light.
So, on the one hand, using the cooperation of light source and optical fingerprint sensor, optical finger print identification mould group may be implemented to refer to
Line identification function, on the other hand, the light conduction that can be emitted light source using light guide can make light to optical fingerprint sensor
The light that source issues uniformly is incident to optical fingerprint sensor.
In some embodiments, the light source is display screen, and the optical fingerprint sensor and the optical cement are located at
The lower section of the display screen.
In this way, using display screen as flat light source, without light source is in addition arranged, to reduce optical finger print identification
The size of mould group.
In some embodiments, the optical finger print identification mould group includes sealing, and the sealing encapsulates the optics and refers to
The side of the side of line sensor and the optical cement.
In this way, sealing can fix optical cement and optical fingerprint sensor, optical finger print identification mould group is avoided to be bonded
When shaking.
In some embodiments, the optical finger print identification mould group includes connecting line and sealing, and the optical finger print passes
Sensor is connected by the connecting line with the circuit board, and the sealing encapsulates the connecting line, the circuit board and the company
The junction of wiring, the optical fingerprint sensor and the junction of the connecting line and the side of the optical fingerprint sensor
Side.
In this way, sealing can protect the junction of connecting line, circuit board and connecting line, optical fingerprint sensor and connecting line
Junction.
A kind of electronic device of embodiment of the present invention, including optical finger print described in any of the above-described embodiment identify mould
Group.
In the electronic device of embodiment of the present invention, optical finger print identifies that mould group is arranged in optical fingerprint sensor upper surface
There is optical cement identical with the light color that light source issues.Therefore, the blue green light for allowing light source to issue in glaucous optical cement is saturating
The light of other colors is crossed and absorbed, to reduce interference of the environment light to optical fingerprint sensor, optical finger print is made to identify mould group
Clearly fingerprint can be collected.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partially will be from following
Description in become obvious, or the practice of embodiment through the invention is recognized.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of embodiments of the present invention are from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that in description, in which:
Fig. 1 is the structural schematic diagram for the optical finger print identification mould group that embodiment of the present invention provides；
Fig. 2 is the structural schematic diagram for the optical finger print identification mould group that another embodiment of the present invention provides；
Fig. 3 is the structural schematic diagram for the optical finger print identification mould group that a further embodiment of the present invention provides.
Main element symbol description:
Optical finger print identifies mould group 10, circuit board 12, substrate 122, solder joint 1222, flexible circuit board 124, optical finger print biography
Sensor 14, upper surface 141, photosensitive layer 142, induction zone 1422, non-inductive area 1424, optical layer 144, light source 16, optical cement 18,
Stiffening plate 11, light guide 13, sealing 15, connecting line 17, cover board 20.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
Needle ", instruction " counterclockwise " orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of retouching
It states the present invention and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific
Orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for retouching
Purpose is stated, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.By
This defines " first ", the feature of " second " can explicitly or implicitly include one or more feature.At this
In the description of invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Fig. 1-Fig. 3 is please referred to, embodiment of the present invention provides a kind of optical finger print identification mould group 10.Optical finger print identifies mould
Group 10 includes circuit board 12, optical fingerprint sensor 14, light source 16 and optical cement 18.Optical fingerprint sensor 14 is located at circuit board
On 12.Optical fingerprint sensor 14 includes upper surface 141, and optical cement 18 is located on the upper surface 141 of optical fingerprint sensor 14.
The light that light source 16 emits is blue green light.Optical cement 18 is in blue-green.
The optical finger print identification mould group 10 of embodiment of the present invention is provided in the upper surface of optical fingerprint sensor 14 141
Optical cement 18 identical with the light color that light source 16 issues.The blue green light for allowing light source 16 to issue in glaucous optical cement 18 is saturating
The light of other colors is crossed and absorbed, to reduce interference of the environment light to optical fingerprint sensor 14, optical finger print is made to identify mould
Group 10 can collect clearly fingerprint.
Specifically, when user is when outdoor application optical finger print identification mould group 10 unlocks electronic device, in outdoor environment light
Infrared light easily causes optical fingerprint sensor 14 to be saturated, interference fingerprint identification.In embodiments of the present invention, utilization and light source
The 16 light color identical optical cements 18 issued reduce interference of the environment light to optical fingerprint sensor 14.Due to coloured saturating
Bright object only penetrates light identical with itself color, and the light of other colors is then absorbed, therefore is in glaucous optical cement 18
The blue green light for allowing light source 16 to issue penetrates and absorbs the light of other colors.The light that light source 16 emits is blue green light, it is possible to understand that
For the wavelength for the light that light source 16 emits is in the wave-length coverage of 450-570nm.For example, wavelength can be 450nm, 570nm
Or any number between 450-570nm.Optical cement 18 be in blue-green, it can be understood as, optical cement 18 present color between
Between blue and green.Cmos sensor can be used in optical fingerprint sensor 14.
It is appreciated that the optical finger print identification mould group 10 of embodiment of the present invention can be applied to but be not limited to unlock, file
The application scenarios such as encryption, payment verification, authentication.
In some embodiments, circuit board 12 includes substrate 122 and flexible circuit board 124, optical fingerprint sensor 14
It is arranged on a substrate 122, the lower surface of one end connecting substrate 122 of flexible circuit board 124.
In this way, flexible circuit board 124 is light-weight and thickness is thin, space is saved, it is small-sized to be conducive to optical finger print identification mould group 10
Change, meanwhile, substrate 122 can be used as the support of support optical fingerprint sensor 14 and the optical finger print identification other elements of mould group 10
Object.
Specifically, substrate 122 can be used as hardboard, and substrate 122 and flexible circuit board 124 can be connected to by welding
Together.Flexible circuit board 124 can be connect with the external circuit of optical identification fingerprint mould group 10 or electronic device to carry out data biography
It is defeated.
In some embodiments, substrate 122 includes solder joint 1222, and substrate 122 passes through solder joint 1222 and flexible circuit board
124 connections.Substrate 122 and flexible circuit board 124 can be in communication with each other, so that substrate 122 can pass the optical finger print of acquisition
The electric signal transmission that sensor 14 obtains is to flexible circuit board 124.
In some embodiments, processor (not shown) is provided on flexible circuit board 124, processor can be used for locating
Manage the electric signal of optical fingerprint sensor 14.
Specifically, processor and interlock circuit structure has can be set in flexible circuit board 124, and processor processing includes fingerprint
The electric signal of information is to establish the model of fingerprint.
In some embodiments, optical fingerprint sensor 14 includes photosensitive layer 142 and the light being arranged on photosensitive layer 142
Learn layer 144.Photosensitive layer 142 is formed with induction zone 1422.Optical layer 144 covers induction zone 1422, and the area of optical layer 144 is greater than
The area of induction zone 1422.Optical layer 144 is formed with multiple lens.Photosensitive layer 142 is between optical layer 144 and substrate 122.
In this way, optical layer 144 can make more light converge to photosensitive layer 142, optical finger print is enable to identify mould group 10
More optical signals are collected, more accurately to realize fingerprint recognition.
Specifically, when optical finger print identification mould group 10 acquires fingerprint, finger acts on the dielectric surface of 144 top of optical layer
On, the light that finger reflects is converged to induction zone 1422 by multiple lens of optical layer 144, and induction zone 1422 is obtained
More light is to form finger print data.The area of optical layer 144 is greater than the area of induction zone 1422 conducive to the reflection of more fingers
Light be projected to induction zone 1422, increase the data volume of collected finger print information.Photosensitive layer 142 is configured to will be from optics
The light of 144 convergence of layer is converted to electric signal and exports electric signal, and the electric signal of output forms finger print information after processing.
In some embodiments, photosensitive layer 142 includes multiple light-sensitive element (not shown) and connection line (not shown).
Multiple light-sensitive elements form induction zone 1422, and connection line connects multiple light-sensitive elements and substrate 122.
In this way, light-sensitive element can incude the light converged from optical layer 144 and optical signal is converted to electric signal to adopt
Collect finger print information.
Specifically, multiple light-sensitive elements can convert optical signals into electric signal, when finger acts on optical finger print identification
When on the surface of mould group 10, the light reflected from finger convergence is projected to photosensitive layer 142, multiple light-sensitive elements by optical layer 144
Light of the induction with finger print information simultaneously converts optical signal into electric signal, and the finger print information that connection line will acquire is transferred to
Substrate 122.Substrate 122 can be connect by flexible circuit board 124 with external circuit, so that external circuit be made to realize fingerprint recognition
Function.
Further, photosensitive layer 142 includes substrate, and multiple light-sensitive elements and connection line are formed in substrate.Some
In example, substrate can be semiconductor base.Light-sensitive element and connection line can be formed in substrate by photoetching process.Multiple light
Quick element forms induction zone 1422 (area active area, AA), other regions form (the non-AA of non-inductive area 1424 in substrate
Area), non-inductive area is provided with connection line.Light-sensitive element is, for example, photodiode.
In the example of fig. 1 and 2, light shield layer, light be may be provided between the substrate of photosensitive layer 142 and each light-sensitive element
The incident ray that source 16 emits is emitted to optical layer 144 through the gap between multiple light shield layers and optical finger print identifies mould group 10
It is external.In this way, processor can handle the electric signal of light-sensitive element output directly to obtain the finger print information of finger.
In some embodiments, optical finger print identification mould group 10 includes stiffening plate 11, and stiffening plate 11 is arranged in flexible electrical
The lower surface of one end of road plate 124.
In this way, stiffening plate 11 can enhance the intensity of flexible circuit board 124.
It is appreciated that causing 124 stress of flexible circuit board to be easy to produce due to the flexible nature of flexible circuit board 124 and splitting
Seam, that is, be difficult to connecting substrate 122 and flexible circuit board 124 or the installation elements on flexible circuit board 124, therefore can will mend
The lower surface of flexible circuit board 124 is arranged in strong plate 11, so that the intensity foot of the flexible circuit board 124 in conjunction with stiffening plate 11
It is enough, and then facilitate connecting substrate 122 and flexible circuit board 124 or carry out the operation such as installation elements on flexible circuit board 124.
Stiffening plate 11 can be made of metal material, such as stainless steel.
In some embodiments, referring to Fig. 1, light source 16 is located at the side of optical fingerprint sensor 14.16 quilt of light source
Transmitting light is configured to optical fingerprint sensor 14.The light that optical fingerprint sensor 14 is configured to emit light source 16 passes
The outside of optical finger print identification mould group 10 is transported to, and receives and is emitted by the light source 16 of the external reflection of optical finger print identification mould group 10
Light.
In this way, light source 16 is located at the side of optical fingerprint sensor 14, light source 16 emits light to optical fingerprint sensor
14。
It is appreciated that light source 16 emits incident ray to photosensitive layer 142, incident ray passes through photosensitive layer 142 and optical layer
The region of the top of optical layer 144 is projected to after 144.When finger is applied to the position of face induction zone 1422, light source 16 is sent out
The light penetrated reflects to form reflection light on the rough strain line of finger surface fingerprint, and reflection light is through optical layer
The light-sensitive element of photosensitive layer 142, the incident ray and reflection light that light-sensitive element will be projected on light-sensitive element are projected to after 144
It is converted to electric signal and exports.It is formed through the processing circuit that connection line is connect with light-sensitive element on circuit board 12, handles
Circuit can filter off the electric signal of incident ray and handle the electric signal of reflection light to obtain the finger print information of finger.
Further, in one example, light source 16 can be LED light source.It is appreciated that LED light source is small in size and saves
Can be environmentally friendly, it is conducive to optical finger print identification mould group 10 and minimizes.
In some embodiments, referring to Fig. 2, optical finger print identification mould group 10 includes light guide 13.Light guide 13 is set
It sets in the lower section of optical fingerprint sensor 14.The side of light guide 13 is arranged in light source 16.Light source 16 is configured to emit light
Optical fingerprint sensor 14 is transmitted to through light guide 13.The light that optical fingerprint sensor 14 is configured to emit light source 16 passes
The outside of optical finger print identification mould group 10 is transported to, and receives and is emitted by the light source 16 of the external reflection of optical finger print identification mould group 10
Light.
So, on the one hand, using the cooperation of light source 16 and optical fingerprint sensor 14, optical finger print identifies that mould group 10 can be with
Realize fingerprint identification function, on the other hand, the light conduction that can be emitted light source 16 using light guide 13 to optical finger print is passed
Sensor 14, the light that light source 16 can be made to issue uniformly are incident to optical fingerprint sensor 14.
Specifically, light source 16 can be point source of light, and point source of light is converted to flat light source by light guide 13.Point source of light example
LED light source in this way.Light guide 13 is, for example, light guide plate.
In some embodiments, referring to Fig. 3, light source 16 is display screen.Optical fingerprint sensor 14 and optical cement 18
Positioned at the lower section of display screen.
In this way, using display screen as flat light source, without light source is in addition arranged, to reduce optical finger print identification
The size of mould group 10.Display screen can be touch display screen, and display screen may include OLED or AMOLED.
It is appreciated that display screen can be active hair when optical fingerprint sensor 14 is fitted in the lower surface of display screen
Light display screen (such as OLED or AMOLED), display screen can be used as light source 16 to the field emission light of the top of induction zone 1422,
So that finger is placed on when carrying out fingerprint recognition with the upper surface position of the display screen of 1422 face of induction zone, 1422 energy of induction zone
Receive enough light enough to form finger print information.
In some embodiments, optical finger print identification mould group 10 includes sealing 15.15 encapsulating optical fingerprint sensing of sealing
The side of device 14 and the side of optical cement 18.
In this way, sealing 15 can fix optical cement 18 and optical fingerprint sensor 14, optical finger print is avoided to identify mould group
10 shaking in fitting.
Specifically, optical finger print identification mould group 10 generally requires the lower surface for using optical cement 18 to be fitted in cover board 20 with shape
At optical finger print recognizer component and it is applied to electronic device.It is fitted to by the optical finger print identification mould group 10 for having optical cement 18
When the lower surface of cover board 20, the quality of optical cement 18 belongs to semi-cured state, causes to paste by optical cement 18 in this way than relatively soft
The optical finger print identification mould group 10 of conjunction is easy to shake, therefore utilizes the side of 15 encapsulating optical fingerprint sensor 14 of sealing and optics
The side of glue 18 can fix optical fingerprint sensor 14 and optical cement 18.Sealing 15 is configured to limit optical cement 18
Displacement.After the completion of fitting, then optical cement 18 is solidified.In addition, sealing 15 can be coloured and lighttight, therefore sealing
15 can play interception, prevent ambient light from entering in optical fingerprint sensor 14 and optical fingerprint sensor 14 is interfered to identify
Fingerprint.Sealing 15 includes the glue such as low temperature hot-setting adhesive, moisture-curable glue, is not specifically limited herein.
In addition, sealing 15 can be with the three of encapsulating optical glue 18 when optical cement 18 and optical fingerprint sensor 14 are rectangular
While or when four and optical fingerprint sensor 14 three while or when four.
In some embodiments, optical finger print identification mould group 10 includes connecting line 17.Optical fingerprint sensor 14 passes through
Connecting line 17 and circuit board 12 connect.Optical finger print identifies that mould group 10 includes sealing 15.Sealing 15 encapsulates connecting line 17, circuit board
12 with the junction of connecting line 17, optical fingerprint sensor 14 and the junction of connecting line 17 and the side of optical fingerprint sensor 14
Side.
In this way, sealing 15 can protect the junction of connecting line 17, circuit board 12 and connecting line 17, optical fingerprint sensor 14
With the junction of connecting line 17.
Specifically, lighttight sealing, the e.g. sealing of black may be selected in sealing 15.The sealing shaded effect of black
It is good, interference of the environment light to optical fingerprint sensor 14 is reduced, and then the accuracy of optical finger print identification mould group 10 can be improved.
It is appreciated that connecting line 17 can engage (wire bonding) technique connection optical fingerprint sensor 14 by routing
With circuit board 12.
A kind of electronic device of embodiment of the present invention, the optical finger print including any of the above-described embodiment identify mould group
10。
In the electronic device of embodiment of the present invention, optical finger print identifies mould group 10 in 14 upper surface of optical fingerprint sensor
It is provided with optical cement 18 identical with the light color that light source 16 issues.Therefore, light source 16 is allowed to send out in glaucous optical cement 18
The light that blue green light out penetrates and absorbs other colors makes light to reduce interference of the environment light to optical fingerprint sensor 14
Clearly fingerprint can be collected by learning fingerprint recognition mould group 10.
Electronic device can be the terminals such as mobile phone, tablet computer, ATM machine, vehicular touch screen, fingerprint gate lock.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means to combine embodiment or show
Example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the invention.At this
In specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the tool of description
Body characteristics, structure, material or feature can be tied in an appropriate manner in any one or more embodiments or example
It closes.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three,
Unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant, and the scope of the present invention is defined by the claims and their equivalents.
Claims (10)
1. a kind of optical finger print identifies mould group characterized by comprising
Circuit board；
Optical fingerprint sensor on the circuit board, the optical fingerprint sensor include upper surface；
Light source, the light that the light source issues are blue green light；With
Optical cement, the optical cement are located at the upper surface of the optical fingerprint sensor and in blue-greens.
2. optical finger print as described in claim 1 identifies mould group, which is characterized in that the circuit board includes substrate and flexible electrical
Road plate, on the substrate, one end of the flexible circuit board connects under the substrate for the optical fingerprint sensor setting
Surface.
3. optical finger print as claimed in claim 2 identifies mould group, which is characterized in that the optical fingerprint sensor includes:
Photosensitive layer, the photosensitive layer are formed with induction zone；With
Optical layer on the photosensitive layer is set, and the optical layer covers the induction zone, and the area of the optical layer is greater than
The area of the induction zone, the optical layer are formed with multiple lens, and the photosensitive layer is located at the optical layer and the substrate
Between.
4. optical finger print as claimed in claim 3 identifies mould group, which is characterized in that the photosensitive layer includes multiple light-sensitive elements
And connection line, the multiple light-sensitive element form the induction zone, the connection line connect the multiple light-sensitive element and
The substrate.
5. optical finger print as described in claim 1 identifies mould group, which is characterized in that the light source is located at optical finger print biography
The side of sensor, the light source are configured to emit light to the optical fingerprint sensor, the optical fingerprint sensor quilt
It is configured to for the light that the light source emits to be transmitted to the outside of the optical finger print identification mould group, and receives and referred to by the optics
Line identifies the light of the light source transmitting of the external reflection of mould group.
6. optical finger print as described in claim 1 identifies mould group, which is characterized in that the optical finger print identification mould group includes leading
The lower section of the optical fingerprint sensor is arranged in light part, the light guide, and the side of the light guide is arranged in the light source,
The light source is configured to emit light and is transmitted to the optical fingerprint sensor, the optical finger print sensing through the light guide
Device is configured to for the light that the light source emits being transmitted to the outside of the optical finger print identification mould group, and receives by the light
Learn the light of the light source transmitting of the external reflection of fingerprint recognition mould group.
7. optical finger print as described in claim 1 identifies mould group, which is characterized in that the light source is display screen, the optics
Fingerprint sensor and the optical cement are located at the lower section of the display screen.
8. optical finger print as described in claim 1 identifies mould group, which is characterized in that the optical finger print identification mould group includes envelope
Glue, the sealing encapsulate the side of the optical fingerprint sensor and the side of the optical cement.
9. optical finger print as described in claim 1 identifies mould group, which is characterized in that the optical finger print identification mould group includes connecting
Wiring and sealing, the optical fingerprint sensor are connected by the connecting line with the circuit board, described in the sealing encapsulation
Connecting line, the circuit board and the junction of the connecting line, the junction of the optical fingerprint sensor and the connecting line
With the side of the optical fingerprint sensor.
10. a kind of electronic device, which is characterized in that identify mould group including the described in any item optical finger prints of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710854175.2A CN109508615A (en) | 2017-09-15 | 2017-09-15 | Optical finger print identifies mould group and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710854175.2A CN109508615A (en) | 2017-09-15 | 2017-09-15 | Optical finger print identifies mould group and electronic device |
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| CN109508615A true CN109508615A (en) | 2019-03-22 |
Family
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| CN201710854175.2A Withdrawn CN109508615A (en) | 2017-09-15 | 2017-09-15 | Optical finger print identifies mould group and electronic device |
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|---|---|---|---|---|
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