CN109500725A - A kind of fixed fixture for substrate grinding - Google Patents
A kind of fixed fixture for substrate grinding Download PDFInfo
- Publication number
- CN109500725A CN109500725A CN201910060503.0A CN201910060503A CN109500725A CN 109500725 A CN109500725 A CN 109500725A CN 201910060503 A CN201910060503 A CN 201910060503A CN 109500725 A CN109500725 A CN 109500725A
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- angle
- substrate
- load carrier
- substrate wafer
- pedestal
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention provides a kind of fixed fixtures for substrate grinding, are related to the technical field of substrate processing, and the fixed fixture for substrate grinding includes load carrier, pedestal and angle-adjusting mechanism；Load carrier is for placing substrate wafer, and load carrier is fixed on angle-adjusting mechanism；Angle-adjusting mechanism is for driving load carrier and substrate wafer to generate swing relative to pedestal.The setting of above-mentioned substrate angular adjustment apparatus can carry out processing reparation for different crystal plane directions；Compensation is micro-adjusted according to different super rule angles in the substrate wafer of the super rule of angle, regular specification is returned after being adjusted the substrate wafer of super rule downshift originally, improves substrate wafer value and epitaxial surface yield.The device can reduce the presence of artificial difference, and save trouble and labor, improve production efficiency；Quality and cost can also be taken into account simultaneously, reduces the scrappage of substrate wafer.
Description
Technical field
The present invention relates to substrate processing technique fields, more particularly, to a kind of fixed fixture for substrate grinding.
Background technique
Semiconductor material (semiconductor material) is that a kind of have semiconducting behavior (conductive capability is between leading
Between body and insulator), can be used to make the electronic material of semiconductor devices and integrated circuit.In third generation semiconductor material
Most commonly seen material is silicon carbide and gallium nitride, and wherein the manufacturing process of silicon carbide is complicated, need to be added through too long brilliant, crystal
Work, cut crystal, grinding, chamfering, copper are thrown, are polished, test package.And during crystal pro cessing, mainly with wafer defect, slightly
Rugosity, flatness etc. are set about, and the drift angle problem of crystal orientation is but often had ignored, and also bigger than normal to the permission of the deviation angle at present
(0.25 °), this also influences the extension parameter adjustment of final extension client and surface evenness indirectly.
In the prior art, by taking silicon carbide as an example, carborundum crystals can carry out crystal angle since crystal pro cessing with X-ray
Degree positioning, then end surface grinding is carried out, so that angle is met customer specifications, crystal pro cessing is completed to be that crystal bar will do it crystal bar cutting,
This is also the process stations for determining final wafer angle, and meeting elder generation X-ray confirms crystal bar lattice angle before cutting, and is pasted by crystal bar
On microscope carrier jig, and the micro-adjustment of angle is done, final chip is allow to meet demand angle.Currently, the micro-adjustment of angle in order to
Maintain to stablize and mainly use following two mode: 1. fixed operation persons do pretends industry surely；Therefore artificial difference is often had to exist；2.
Before cutting operation online, microscope carrier jig angle is finely tuned, chip is made to reach demand deviation.This is also required to be familiar with board engineering staff just may be used
Effective adjustment, and different crystal bars cuttings require to finely tune again every time, time-consuming and laborious and then influence production.
But both the above mode all cannot be considered in terms of quality and cost, easily leads to chip and is biased to abnormal and scraps.
Summary of the invention
It is existing in the prior art to improve the purpose of the present invention is to provide a kind of fixed fixture for substrate grinding
Wafer angle fine tuning cannot be considered in terms of quality and cost, easily lead to the technical issues of chip is biased to exception and is scrapped.
Provided by the present invention for the fixed fixture of substrate grinding, including load carrier, pedestal and angle-adjusting mechanism；
Load carrier is for placing substrate wafer, and load carrier is fixed on angle-adjusting mechanism；Angle-adjusting mechanism is used for
Load carrier and substrate wafer is driven to generate swing relative to pedestal.
Further, angle-adjusting mechanism includes worm gear, worm shaft and connecting shaft；Worm gear is threaded through in connecting shaft, and
Worm gear is fixedly connected with connecting shaft；Worm gear is matched with worm shaft；Worm shaft, which is able to carry out, to be rotated and reverse；Connecting shaft and worm screw
Axis is separately mounted on pedestal, and connecting shaft is connect with base rotation respectively with worm shaft.
Further, the indicator for dial being provided on pedestal and being matched with dial；Dial and connecting shaft are solid
Fixed connection；Indicator is fixedly connected with pedestal.
Further, angle-adjusting mechanism includes adjustment axis, fixing axle and the threaded hole being set on the base；On pedestal
It is provided with the groove for accommodating adjustment axis, threaded hole is connected to groove；Fixing axle is arranged in threaded hole；The outer wall of fixing axle
On be provided with corresponding threaded holes close external screw thread；And fixing axle can be abutted with the outer wall of adjustment axis；Adjust axis and carrying machine
Structure is fixedly connected, and adjusting axis being capable of axial-rotation.
Further, angle-adjusting mechanism includes rotation axis, engaging tooth, gear and the rotation of setting on the rotating shaft
Bar；The limiting slot for accommodating rotation axis is provided on pedestal；Rotation axis can axial-rotation, and rotation axis and load carrier are solid
Fixed connection；Gear is fixedly connected with rotating bar, and gear is matched with engaging tooth.
Further, load carrier includes supporting element and accommodating member；Accommodating member is fixed on angle-adjusting mechanism；Hold
It sets and is provided with accommodation groove on part, accommodation groove is for accommodating supporting element；Load plane is provided on supporting element, load plane is for putting
Set substrate wafer.
Further, supporting element and accommodation groove are cuboid or square；The side wall of supporting element and the side of accommodation groove
Wall abuts.
Further, supporting element is fixedly connected with accommodating member by bindiny mechanism.
Further, bindiny mechanism includes fixing bolt, the first bolt hole being arranged on supporting element and in accommodating member
On the second bolt hole；Fixing bolt is arranged in the first bolt hole and the second bolt hole, to enable supporting element and accommodating member fix
Connection.
Further, the material of supporting element is ceramics.
Substrate angular adjustment apparatus provided by the invention comprising load carrier, pedestal and angle-adjusting mechanism.Make
With in the process, staff carries out angle positioning to substrate wafer first, to confirm the deviation angle of substrate wafer；Then will
Substrate wafer fixed placement is on load carrier；Then according to the deviation angle confirmed, enable angle-adjusting mechanism swing so that
Load carrier and substrate wafer are generated relative to pedestal to be swung, i.e. angle between adjustment substrate wafer and horizontal plane, is somebody's turn to do with enabling
Angle and the deviation angle of substrate wafer compensate；Finally to the substrate wafer amount of being ground to.
It is repaired from the foregoing, it will be observed that the setting of above-mentioned substrate angular adjustment apparatus can carry out processing for different crystal plane directions
It is multiple；Compensation is micro-adjusted according to different super rule angles in the substrate wafer of the super rule of angle, makes the substrate of super rule downshift originally
Chip returns to regular specification after being adjusted, improve substrate wafer value and epitaxial surface yield.The device can reduce people
For the presence of difference, and save trouble and labor, improve production efficiency；Quality and cost can also be taken into account simultaneously, reduce substrate wafer
Scrappage.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structure diagram of the fixed fixture provided in an embodiment of the present invention for substrate grinding；
Fig. 2 is the main view for the fixed fixture for substrate grinding that first embodiment of the invention provides；
Fig. 3 is the structural schematic diagram for the fixed fixture for substrate grinding that first embodiment of the invention provides；
Fig. 4 is the structural schematic diagram for the fixed fixture for substrate grinding that second embodiment of the invention provides；
Fig. 5 is the structural schematic diagram for the fixed fixture for substrate grinding that third embodiment of the invention provides；
Fig. 6 is that substrate wafer provided in an embodiment of the present invention is placed on the main view on supporting element；
Fig. 7 is that substrate wafer provided in an embodiment of the present invention is placed on the top view on supporting element.
Icon: 1- load carrier；2- pedestal；3- angle-adjusting mechanism；4- substrate wafer；5- worm gear；6- worm shaft；7- connects
Spindle；8- dial；9- indicator；10- adjusts axis；11- fixing axle；12- rotation axis；13- engaging tooth；14- gear；15- turns
Lever；16- supporting element；17- accommodating member；18- load plane；19- fixing bolt；The first bolt hole of 20-；21- swing component；22-
Rotational handle.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that such as occur term " center ", "upper", "lower", "left", "right",
"vertical", "horizontal", "inner", "outside" etc., indicated by orientation or positional relationship be orientation based on the figure or position
Relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have
There is specific orientation, be constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, as occurred
Term " first ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Fig. 1 is the structure diagram of the fixed fixture provided in an embodiment of the present invention for substrate grinding；As shown in Figure 1, this
The fixed fixture for substrate grinding that embodiment provides, including load carrier 1, pedestal 2 and angle-adjusting mechanism 3；Carrying
Mechanism 1 is for placing substrate wafer 4, and load carrier 1 is fixed on angle-adjusting mechanism 3；Angle-adjusting mechanism 3 is used for
Load carrier 1 and substrate wafer 4 is driven to generate swing relative to pedestal 2.
Wherein, load carrier 1 can be to weld or be removably secured to connect with angle-adjusting mechanism 3.
Preferably, angle-adjusting mechanism 3 can digitisation, angle Adjustment precision be 0.01 °, can also carry out according to the actual situation
Adjustment.
The above-mentioned fixed fixture for substrate grinding can be applied to various sizes of monocrystalline silicon carbide, sapphire, gallium nitride
With the substrate materials such as monocrystalline silicon.
Fig. 2 is the main view for the fixed fixture for substrate grinding that first embodiment of the invention provides；Fig. 3 is this hair
The structural schematic diagram for the fixed fixture for substrate grinding that bright one embodiment provides；As shown in Figures 2 and 3, first
In a embodiment, angle-adjusting mechanism 3 includes worm gear 5, worm shaft 6 and connecting shaft 7；Worm gear 5 is threaded through in connecting shaft 7, and
Worm gear 5 is fixedly connected with connecting shaft 7；Worm gear 5 is matched with worm shaft 6；Worm shaft 6, which is able to carry out, to be rotated and reverse；Connecting shaft 7
It is separately mounted on pedestal 2 with worm shaft 6, and connecting shaft 7 and worm shaft 6 are rotatablely connected with pedestal 2 respectively.In use process
In, after staff has confirmed the deviation angle of substrate wafer 4, substrate wafer 4 is placed on load carrier 1；Then according to
The deviation angle confirmed, it is positive or rotate backward worm shaft 6 to drive worm gear 5 to rotate, to drive connecting shaft 7 and hold
Mounted mechanism 1 rotates；When the deviation angle compensation of the swing angle of load carrier 1 and substrate wafer 4, staff stops operating
Worm shaft 6；The amount of being ground to finally is carried out to substrate wafer 4.When needing to adjust offset angle, staff continues to rotate worm screw
Axis 6 is to adjust the swing angle of load carrier 1.
Specifically, being provided with dial 8 and the indicator matched with dial 89 on pedestal 2；Dial 8 and connecting shaft
7 are fixedly connected；Indicator 9 is fixedly connected with pedestal 2.In use, due to worm gear 5, connecting shaft 7, swing component 21 and
Dial 8 rotates synchronously, and rotational angle is identical, therefore when swing component 21 drives load carrier 1 to rotate, dial 8 turns therewith
Dynamic, the corresponding mark of indicator 9 is the angle of rotation.
Preferably, be provided with swing component 21 and the mounting groove for accommodating swing component 21 on pedestal 2, swing component 21 respectively with
Connecting shaft 7 is fixedly connected with load carrier 1.Mounting groove is used to limit the moving range of swing component 21 and plays support to swing component 21
Effect, to enable load carrier 1 more stable in operation.
When contact of the swing component 21 with mounting groove, the contact surface of the two is arc.
Worm shaft 6 is provided with rotational handle 22 far from the side of turbine, and staff can hold rotational handle 22 to control
The rotation of worm shaft 6.
Fig. 4 is the structural schematic diagram for the fixed fixture for substrate grinding that second embodiment of the invention provides；Such as Fig. 4
Shown, in the second embodiment, angle-adjusting mechanism 3 includes adjustment axis 10, fixing axle 11 and the spiral shell being arranged on pedestal 2
Pit；The groove for accommodating adjustment axis 10 is provided on pedestal 2, threaded hole is connected to groove；Fixing axle 11 is arranged in screw thread
In hole；The external screw thread closed with corresponding threaded holes is provided on the outer wall of fixing axle 11；And fixing axle 11 can be with adjustment axis 10
Outer wall abuts；Adjustment axis 10 is fixedly connected with load carrier 1, and adjusting axis 10 being capable of axial-rotation.In use, it works
After personnel have confirmed the deviation angle of substrate wafer 4, substrate wafer 4 is placed on load carrier 1；Then according to what is confirmed
It is biased to angle axially rotation adjustment axis 10, so as to adjust the angle between substrate wafer 4 and horizontal plane, groove can be played at this time
The effect of limit, when the deviation angle compensation of the angle and substrate wafer 4, fixing axle 11 is screwed in threaded hole by staff
In, until fixing axle 11 is abutted with the inner wall of adjustment axis 10, makes to adjust axis 10 and pedestal 2 is relatively fixed；Finally to substrate wafer 4
Carry out the amount of being ground to.When needing to adjust offset angle, staff screws out fixing axle 11 from threaded hole, enables fixing axle 11
It separating with adjustment axis 10, after good angle to be adjusted, being abutted screwing fixing axle 11 with adjustment axis 10, adjust axis 10 with fixed.
Specifically, fixing axle 11 and threaded hole can be multiple, and multiple threaded holes can be separately positioned on the two of pedestal 2
Side and/or bottom surface.
When fixing axle 11 is arranged at bottom surface, the length of fixing axle 11 should be less than the length of the threaded hole matched, in this way
The bottom surface that can prevent fixing axle 11 protrusion and pedestal 2, influences other operations.
Adjusting may be provided with frosted layer on the outer wall of axis 10, is capable of increasing fixing axle 11 in this way and adjusts rubbing between axis 10
Power is wiped, so that it is more stable to enable adjustment axis 10 be arranged.
Fig. 5 is the structural schematic diagram for the fixed fixture for substrate grinding that third embodiment of the invention provides；Such as Fig. 5
Shown, in third embodiment, angle-adjusting mechanism 3 includes rotation axis 12, engaging tooth 13, the tooth being arranged in rotation axis 12
Wheel 14 and rotating bar 15；The limiting slot for accommodating rotation axis 12 is provided on pedestal 2；Rotation axis 12 can axial-rotation,
And rotation axis 12 is fixedly connected with load carrier 1；Gear 14 is fixedly connected with rotating bar 15, and gear 14 and engaging tooth 13 match
It closes.In use, after staff has confirmed the deviation angle of substrate wafer 4, substrate wafer 4 is placed on load carrier
On 1；Then rotating bar 15 is rotated, to rotate with moving gear 14, gear 14 is engaged with engaging tooth 13 to enable rotation axis 12 rotate；
Rotation axis 12 drives substrate wafer 4 to rotate synchronously, so as to adjust the angle between substrate wafer 4 and horizontal plane, limiting slot at this time
It can play the role of limit；When the deviation angle compensation of the angle and substrate wafer 4, the rotating bar that stops operating 15, thus
Rotation axis 12 is enabled to keep stablizing；The amount of being ground to finally is carried out to substrate wafer 4.
Specifically, rotating bar 15, engaging tooth 13 and gear 14 may be provided at the inside of pedestal 2, one end of rotating bar 15
It is fixedly connected with knob, the outside of pedestal 2 is arranged in knob；Angled mark is set on pedestal 2, and staff can be by that will revolve
Button turns to preset angle mark, to control the rotational angle of rotation axis 12.
Further, angle-adjusting mechanism 3 can also include encoder and display.Encoder can with connecting shaft 7 or
Person adjusts axis 10 or rotation axis 12 connects.Display is connect with encoder.In use, in connecting shaft 7 or adjustment
While axis 10 or rotation axis 12 rotate, angular displacement is converted into electric signal by encoder, and angular displacement information is shown aobvious
Show on device, to enable staff that can observe connecting shaft 7 in real time or adjust the angle of axis 10 or the rotation of rotation axis 12.
Angle is enabled to adjust more accurate.
During processing to substrate angle, following steps can be used:
Substrate wafer 4 is subjected to angle positioning, confirms the deviation angle of substrate wafer 4；
Substrate wafer 4 is fixed on the load carrier 1；
According to angle is biased to, the angle between load carrier 1 and horizontal plane is adjusted, by angle-adjusting mechanism 3 with complete
Angled compensation；
To 4 amount of being ground to of substrate wafer.
Specifically, carrying out angle positioning to substrate wafer 4 using X-ray.
Further, include: by the step that substrate wafer 4 is fixed on load carrier 1
Measure the flatness of substrate wafer 4；
It waxes to substrate wafer 4；
Substrate wafer 4 after waxing is placed on load carrier 1 and presses cooling.
If the thickness difference of substrate wafer 4 is big or patch is in uneven thickness to be likely to result in grinding inaccuracy, flatness
The step of measurement, can be avoided above situation；In addition, the step of waxing, can enable substrate wafer 4 be bonded with jig, thus
Substrate wafer 4 is enabled to be arranged during adjustment angle and grinding more stable.
Specifically, the wax thickness of waxing is less than 2um.
The waxing moment is thrown away using spin-drying type chip mounter to control wax.Spin-drying type chip mounter selection controllable rotating speed (±
It is uniform in order to wax 30rpm) with controllable temperature (± 2 DEG C).
5 flatnesses are carried out to substrate wafer 4 using amesdial to measure.
Further, include: before the step that substrate wafer 4 is fixed on load carrier 1
Cleaning drying is carried out to substrate wafer 4.
Specifically, carrying out cleaning drying to substrate wafer 4 using ultrasonic cleaner.
Substrate angular adjustment apparatus provided in this embodiment comprising: load carrier 1, pedestal 2 and angle-adjusting mechanism
3；Load carrier 1 is for placing substrate wafer 4, and load carrier 1 is fixed on angle-adjusting mechanism 3；Angle adjusts machine
Structure 3 is for driving load carrier 1 and substrate wafer 4 to generate swing relative to pedestal 2.In use, staff is first
Angle positioning is carried out to substrate wafer 4, to confirm the deviation angle of substrate wafer 4；Then 4 fixed placement of substrate wafer is existed
On load carrier 1；Then according to the deviation angle confirmed, angle-adjusting mechanism 3 is enabled to swing so that load carrier 1 and substrate are brilliant
Piece 4 generates swing, i.e. angle between adjustment substrate wafer 4 and horizontal plane relative to pedestal 2, to enable the angle and substrate wafer
4 deviation angle compensates；Finally to 4 amount of being ground to of substrate wafer.
It is repaired from the foregoing, it will be observed that the setting of above-mentioned substrate angular adjustment apparatus can carry out processing for different crystal plane directions
It is multiple；Compensation is micro-adjusted according to different super rule angles in the substrate wafer 4 of the super rule of angle, makes the substrate of super rule downshift originally
Chip 4 returns to regular specification after being adjusted, improve the value of substrate wafer 4 and epitaxial surface yield.The device can be reduced
The presence of artificial difference, and save trouble and labor, improve production efficiency；Quality and cost can also be taken into account simultaneously, and it is brilliant to reduce substrate
The scrappage of piece 4.
Fig. 6 is that substrate wafer provided in an embodiment of the present invention is placed on the main view on supporting element；
Fig. 7 is that substrate wafer provided in an embodiment of the present invention is placed on the top view on supporting element；Such as Fig. 1, Fig. 3-Fig. 7 institute
Show, on the basis of the above embodiments, further, load carrier 1 includes supporting element 16 and accommodating member 17；Accommodating member 17 is installed
It is fixed on angle-adjusting mechanism 3；Accommodation groove is provided on accommodating member 17, accommodation groove is for accommodating supporting element 16；Supporting element 16
On be provided with load plane 18, load plane 18 is for placing substrate wafer 4.
Wherein, the material of supporting element 16 can be stainless steel or cast iron etc..
Preferably, the material of supporting element 16 is ceramics.Within 3 μm, ceramic material can be avoided supporting element 16 and exists tolerance
Deformation occurs during heating.
Preferably, supporting element 16 is plane jig.The setting of plane jig can enable staff in adjustment offset angle
When it is more convenient.
As shown in Fig. 1, Fig. 3-Fig. 7, further, supporting element 16 and accommodation groove are cuboid or square；Support
The side wall of part 16 is abutted with the side wall of accommodation groove.
In the present embodiment, the setting of accommodation groove can enable supporting element 16 separate with accommodating member 17, when placing substrate wafer 4
Staff can be more convenient to operate.In addition, when supporting element 16 and accommodation groove are cuboid or square, support
Part 16 can be entirely capable of agreeing in accommodation groove, and this set can play the role of limit to supporting element 16, enable supporting element 16
It is more stable in operation.
On the basis of the above embodiments, further, supporting element 16 is fixedly connected with accommodating member 17 by bindiny mechanism.
Preferably, supporting element 16 and accommodating member 17 are removably secured connection by bindiny mechanism.
Specifically, bindiny mechanism can be fixed card buckle and fixed card slot；Fixed card buckle is arranged on supporting element 16, fixed
Card slot is arranged on accommodating member 17；Or fixed card buckle is arranged on accommodating member 17, fixed card slot is arranged on supporting element 16.?
In use process, after supporting element 16 is placed in holding tank by staff, fixed card buckle is fastened in fixed card slot, with
The two is enabled to be fixedly connected；When needing to take out supporting element 16, fixed card buckle is separated from card slot.
As shown in Fig. 1-Fig. 7, further, bindiny mechanism includes fixing bolt 19, be arranged on supporting element 16 first
Bolt hole 20 and the second bolt hole on accommodating member 17；Fixing bolt 19 is arranged in the first bolt hole 20 and the second bolt hole
In, to enable supporting element 16 be fixedly connected with accommodating member 17.In use, supporting element 16 is placed on holding tank by staff
In after, fixing bolt 19 is screwed in the first bolt hole 20 and the second bolt hole, to enable 17 bolt of supporting element 16 and accommodating member
Connection；When needing to take out supporting element 16, fixing bolt 19 is screwed out into the first bolt hole 20 and the second bolt hole.
In the present embodiment, in use, staff fixes supporting element 16 and accommodating member 17 by bindiny mechanism
Connection, can be improved the stability of the setting of supporting element 16 in this way, so that it is more stable to enable substrate wafer 4 be arranged.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of fixed fixture for substrate grinding characterized by comprising load carrier, pedestal and angle adjust machine
Structure；
The load carrier is for placing substrate wafer, and the load carrier is fixed on the angle-adjusting mechanism；
The angle-adjusting mechanism is for driving the load carrier and substrate wafer to generate swing relative to the pedestal.
2. the fixed fixture according to claim 1 for substrate grinding, which is characterized in that the angle-adjusting mechanism packet
Include worm gear, worm shaft and connecting shaft；
The worm gear is threaded through in the connecting shaft, and the worm gear is fixedly connected with the connecting shaft；The worm gear with it is described
Worm shaft matches；The worm shaft, which is able to carry out, to be rotated and reverse；
The connecting shaft and the worm shaft are separately mounted on the pedestal, and the connecting shaft and the worm shaft respectively with
The base rotation connection.
3. the fixed fixture according to claim 2 for substrate grinding, which is characterized in that be provided with quarter on the pedestal
Scale and the indicator matched with the dial；
The dial is fixedly connected with the connecting shaft；The indicator is fixedly connected with the base.
4. the fixed fixture according to claim 1 for substrate grinding, which is characterized in that the angle-adjusting mechanism packet
Include adjustment axis, the threaded hole of fixing axle and setting on the base；
The groove for accommodating the adjustment axis is provided on the pedestal, the threaded hole is connected to the groove；
The fixing axle is arranged in the threaded hole；It is provided on the outer wall of the fixing axle and corresponding threaded holes conjunction
External screw thread；And the fixing axle can be abutted with the outer wall of the adjustment axis；
The adjustment axis is fixedly connected with the load carrier, and the adjustment axis being capable of axial-rotation.
5. the fixed fixture according to claim 1 for substrate grinding, which is characterized in that the angle-adjusting mechanism packet
Include rotation axis, the engaging tooth being arranged in the rotation axis, gear and rotating bar；
The limiting slot for accommodating the rotation axis is provided on the pedestal；The rotation axis can axial-rotation, and it is described
Rotation axis is fixedly connected with the load carrier；The gear is fixedly connected with the rotating bar, and the gear is nibbled with described
Tooth is closed to match.
6. according to the fixed fixture described in claim 1 for substrate grinding, which is characterized in that the load carrier includes support
Part and accommodating member；
The accommodating member is fixed on the angle-adjusting mechanism；Accommodation groove, the accommodating are provided on the accommodating member
Slot is for accommodating the supporting element；
Load plane is provided on the supporting element, the load plane is for placing substrate wafer.
7. the fixed fixture according to claim 6 for substrate grinding, which is characterized in that the supporting element and the appearance
Setting slot is cuboid or square；
The side wall of the supporting element is abutted with the side wall of the accommodation groove.
8. according to right want 6 described in for substrate grind fixed fixture, which is characterized in that the supporting element and the accommodating
Part is fixedly connected by bindiny mechanism.
9. according to right want 8 described in for substrate grind fixed fixture, which is characterized in that the bindiny mechanism include fix
Bolt, the first bolt hole being arranged on the supporting element and second bolt hole on the accommodating member；
The fixing bolt is arranged in first bolt hole and second bolt hole, to enable the supporting element and the appearance
Part is set to be fixedly connected.
10. according to the described in any item fixed fixtures for substrate grinding of claim 6-9, which is characterized in that the support
The material of part is ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910060503.0A CN109500725A (en) | 2019-01-22 | 2019-01-22 | A kind of fixed fixture for substrate grinding |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910060503.0A CN109500725A (en) | 2019-01-22 | 2019-01-22 | A kind of fixed fixture for substrate grinding |
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| CN109500725A true CN109500725A (en) | 2019-03-22 |
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| CN201910060503.0A Pending CN109500725A (en) | 2019-01-22 | 2019-01-22 | A kind of fixed fixture for substrate grinding |
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