CN105033839A - Lithium niobate wafer grinding device with grinding pressure adjusting device and grinding method - Google Patents
Lithium niobate wafer grinding device with grinding pressure adjusting device and grinding method Download PDFInfo
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- CN105033839A CN105033839A CN201510276476.2A CN201510276476A CN105033839A CN 105033839 A CN105033839 A CN 105033839A CN 201510276476 A CN201510276476 A CN 201510276476A CN 105033839 A CN105033839 A CN 105033839A
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- grinding
- travel mechanism
- lithium niobate
- pressure adjusting
- screw
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Abstract
The invention discloses a lithium niobate wafer grinding device with a grinding pressure adjusting device and a grinding method. The grinding device comprises a three-dimensional space positioning device, a beam type force sensor and a grinding and clamping mechanism. The three-dimensional space positioning device is provided with the grinding and clamping mechanism through a force sensor, and two lithium niobate wafers clamped by the grinding and clamping mechanism are positioned at any point in the space. A clamping mechanism of the grinding and clamping mechanism is installed on a sliding block in the grinding pressure adjusting device in a sliding manner. A calibrated adjusting screw with a read head is adopted in the grinding pressure adjusting device, and adjustment of the pressure between the lithium niobate wafers and a grinding table is achieved in the grinding process. During grinding, the distances between contact points of the two lithium niobate wafers and a grinding machine and a main shaft of the grinding machine need to be equal. The lithium niobate wafer grinding device has the beneficial effects that the calibrated adjusting screw with the read head is adopted, and adjustment of the grinding pressure is visual and reliable; and during grinding, a positioning manner of the two lithium niobate wafers is adopted, and the grinding mass of the two lithium niobate wafers is the same.
Description
Technical field
The present invention relates to a kind of lapping device, belong to optical fiber lapping technical field, specifically, is a kind of lithium niobate crystal chip lapping device with grinding pressure adjusting device and Ginding process.
Background technology
At present in high-precision closed-loop optical fiber gyroscope manufacturing process, the direct docking mode of end face progressively becomes the main way that Y waveguide is coupled with polarization maintaining optical fibre wafer.For ease of grinding and coupling, tail optical fiber is general before the milling to be bonded on a slice lithium niobate crystal chip, and tail optical fiber and lithium niobate crystal chip together grind, polishing.If abrasive parameters control is improper during tail optical fiber grinding, fiber end face can produce a large amount of micro-crack, cause fiber end face roughness higher, insertion loss can be caused when light source power is less to raise, this is totally unfavorable to detection signal-to-noise ratio and raising Gyro Precision.The tail optical fiber identical in quality according to two pieces of end faces is coupled with Y waveguide, then can improve splitting ratio index, reduce non-heterogeneite phase shift, improves the precision of optical fibre gyro.Therefore, in the process of lapping and polishing tail optical fiber, it is desirable to ensure that the surface roughness of tail optical fiber end face is lower and two tail optical fiber material removal amounts are equal.According to Hertz contact theory, the cutting depth of single diamond abrasive grain is directly proportional to grinding pressure, and cutting depth is directly related with the surface roughness of tail optical fiber end face, and therefore, the adjustment of grinding pressure has a direct impact for the grinding effect tool of optical fiber.
The manufacturing procedure of existing fiber stub or bare fibre is: be placed on by grinding abrasive paper on abrasive disk, be arranged on grinding abrasive paper by fiber stub or bare fibre, grinder is driven by power set and grinds the fiber stub end face on abrasive disk or bare fibre end face.Existing grinder is a kind of is rely on the weight manually discharging respective quality to regulate the size of pressure, another mode carries out center pressurization by pneumatic means to fiber stub or bare fibre: these two kinds of pressuring methods all cannot the size of accurate adjustment pressure, not thorough for the influence research of grinding pressure to fiber stub or bare fibre grinding, grinding pressure may cause fiber end face grinding uneven improperly, is difficult to the requirement reaching low coupling loss.And for special angle require optical fiber lapping product due to manufacture lock pin precision not high causing cannot meet given index.
Summary of the invention
For the problems referred to above, the present invention proposes a kind of lithium niobate crystal chip lapping device with grinding pressure adjusting device and Ginding process.
The present invention, with the lithium niobate crystal chip lapping device of grinding pressure adjusting device, comprises three-dimensional fix device, beam type force snesor and grinding clamping device;
Described three-dimensional fix device is arranged on grinding plate, the slide block in three-dimensional fix device ZhongzZhou travel mechanism is installed grinding clamping device; Grinding clamping device; By three-dimensional fix device realize clamping device in grinding clamping device spatially in the location of any point, finally realize clamping device accommodate the location of lithium niobate crystal chip;
Described grinding clamping device comprises precision rotation platform, grinding pressure adjusting device and clamping device, and entirety is arranged in z-axis travel mechanism by force snesor; The round end of precision rotation platform is installed grinding pressure adjusting device, clamping device installed by grinding pressure adjusting device;
Above-mentioned grinding pressure adjusting device, comprises installing plate, guide rail, slide block, adjustment screw, regulating spring and contiguous block; Wherein, installing plate is fixedly mounted on the round end of precision rotation platform, and installing plate is provided with guide rail, and guide rail is provided with can along the slide block of slide; Guide rail lower end is provided with stop screw; Slide block is provided with positioning table, positioning table penetrates hole along lead rail axis to having adjustment screw; Slide block bottom is provided with contiguous block, contiguous block has and penetrates the coaxial adjustment screw connecting hole in hole with adjustment screw; The link of described adjustment screw penetrates Kong Houyu adjustment screw connecting hole threaded engagement through adjustment screw and connects; In adjustment screw, cover has regulating spring, and regulating spring is between adjustment screw nut and slide block;
The adjustable side of adjustment screw is provided with read head, adjustment screw can be driven to rotate by rotating read head, obtaining the numerical value corresponding with adjustment screw rotational angle by read head simultaneously, and then the corresponding relation of survey measurements head reading and grinding pressure can be obtained;
For the Ginding process of the above-mentioned optical fiber grinder with grinding pressure adjusting device, concrete steps are as follows:
Step 1: two pieces of lithium niobate crystal chips are arranged on clamping device, are fixedly clamped by clamping device; And follow according to grinding requirement, make the angle between optical fiber lithium niobate crystal chip face machined flat normal direction and grinder surface normal by adjustment precision rotation platform;
Step 2: the demarcation of grinding pressure adjusting device.
A, electronic scale is placed on the lower end of two pieces of light wafers.
The brushless servo motor that b, host computer control three-dimensional fix device ZhongzZhou travel mechanism by motion controller enters low-speed running state, and clamping device is moved downward; When force sensor measuring value reduces, stop the brushless servo motor running of z-axis travel mechanism.
The brushless servo motor that c, host computer control three-dimensional fix device ZhongZZhou travel mechanism by motion controller enters low-speed running state, controls grinding clamping device and moves downward, slide block in grinding pressure adjusting device is separated with stop screw.
D, rotate read head to different read text scale, obtain and show measured value with corresponding electronic scale corresponding to each read text scale.
E, control host computer control the brushless servo motor running of three-dimensional fix device ZhongzZhou travel mechanism by motion controller, grinding pressure adjusting device is raised, make lithium niobate crystal chip depart from electronic scale, now, in grinding pressure adjusting device, slide block contacts with stop screw; Subsequently, repeat step b ~ d, obtain read head and rotate the many groups electronic scale measured value to same read text scale.
Many groups electronic scale measured value under f, same read text scale is averaged, and obtains the grinding pressure value that read head is corresponding under each read text scale, completes demarcation.
Step 3: host computer controls three-dimensional fix device by motion controller, makes on clamping device two pieces of lithium niobate crystal chips move to above grinder; Meanwhile, grinding abrasive paper is placed on grinder;
Step 4: the brushless servo motor that host computer controls three-dimensional fix device ZhongzZhou travel mechanism by motion controller enters low-speed running state, grinding clamping device is moved downward, reduces to force sensor measuring value; Now, the brushless servo motor that host computer controls three-dimensional fix device ZhongzZhou travel mechanism by motion controller shuts down.
Step 5: the brushless servo motor that host computer controls three-dimensional fix device ZhongzZhou travel mechanism by motion controller enters low-speed running, controls grinding clamping device and moves downward, slide block in grinding pressure adjusting device is separated with stop screw.
Step 6: according to grinding requirement, choose grinding pressure; Subsequently, according to the corresponding relation of the read head reading obtained in step 2 and grinding pressure value, rotate the read text scale corresponding to adjustment screw to read head by read head.
Step 7: setting grinder parameter, comprises milling time, grinder internal gear and the speed of mainshaft; Subsequently, grinder is opened.
Step 8: when after arrival milling time, close grinder.
Step 9: host computer controls the brushless servo motor running of three-dimensional fix device ZhongzZhou travel mechanism by motion controller, makes grinding pressure adjusting device be raised to lithium niobate crystal chip and departs from grinder.
The invention has the advantages that:
1, the present invention is with the optical fiber grinder of grinding pressure adjusting device and Ginding process, and use the adjustment screw of calibrated tape reading head, the reading corresponding to read head is calibrated grinding pressure, makes the adjustment of grinding pressure intuitive and reliable;
2, the present invention is with the optical fiber grinder of grinding pressure adjusting device and Ginding process, grind at the same time on the basis of two pieces of lithium niobate crystal chips, set the initial position method of two pieces of lithium niobate crystal chips on grinder, the identical of two grinding tracks can be ensured, and then ensure that the Grinding Quality of two lithium niobate crystal chips is equal.
Accompanying drawing explanation
Fig. 1 is the lithium niobate crystal chip lapping device overall structure schematic diagram of the present invention with grinding pressure adjusting device;
Fig. 2 is that the present invention is with grinding clamping mechanism structure schematic diagram in the lithium niobate crystal chip lapping device of grinding pressure adjusting device;
Fig. 3 is grinding pressure adjusting device structural representation in grinding clamping device;
Fig. 4 is grinding pressure adjusting device structural blast figure in grinding clamping device;
Fig. 5 is clamping device overall structure schematic diagram in optical fiber of the present invention and lithium niobate crystal chip Pneumatic Pressure grinding mechanism;
Fig. 6 is left pedestal right side schematic view in clamping device;
Fig. 7 be in clamping device in schematic diagram on the left of left pedestal;
Fig. 8 is schematic diagram on the left of Right socle in clamping device;
Fig. 9 is Right socle right side schematic view in clamping device;
Figure 10 is lithium niobate crystal chip set-up mode schematic diagram on left pedestal in clamping device;
Figure 11 is lithium niobate crystal chip set-up mode schematic diagram on Right socle in clamping device;
Figure 12 is optical fiber lithium niobate crystal chip method of clamping schematic diagram on left pedestal in clamping device;
Figure 13 is mounting means schematic diagram between left pedestal and Right socle in clamping device;
Figure 14 is for locking mechanism structure schematic diagram that left pedestal and Right socle are locked in clamping device.
In figure:
1-three-dimensional fix device 2-beam type force snesor 3-grinds clamping device
4-grinding plate 5-grinder 101-x axle travel mechanism
102-y axle travel mechanism 103-z axle travel mechanism 104-pillar
301-precision rotation platform 302-grinding pressure adjusting device 303-clamping device
302a-installing plate 302b-guide rail 302c-slide block
302d-adjustment screw 302e-regulating spring 302f-contiguous block
The left pedestal of 302g-read head 302h-positioning table 303a-
303b-Right socle 303c-pedestal installed part 303d-retaining mechanism
A-locating piece b-clamp c-loading blocks
D-fiber orientation groove e-wafer orientation groove f-rectangular protrusions
G-rectangular recessed h-optical fiber i-lithium niobate crystal chip
J-locating shoulder k-limiting stand
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in further details.
The present invention, with the lithium niobate crystal chip lapping device of grinding pressure adjusting device, as shown in Figure 1, comprises three-dimensional fix device 1, beam type force snesor 2 and grinding clamping device 3.
Described three-dimensional fix device 1 is arranged on grinding plate 4, adopts door type design, comprises Liang Tao x-axis travel mechanism 101, a set of y-axis travel mechanism 102, a set of z-axis travel mechanism 103 and two pillars 104.X-axis travel mechanism 101, y-axis travel mechanism 102 are identical with in z-axis travel mechanism 103 structure, are made up of erecting bed, slide rail, slide unit, ball-screw and drive motors.Wherein, erecting bed is provided with two slide rails be parallel to each other.In ball-screw, screw rod and two slide rails be arranged in parallel, and screw rod two ends are arranged on erecting bed by support member, and are connected by bearing with between installed part; Screw rod one end is coaxially connected with drive motors output shaft, by drive motors drive screw turns.Slide unit is arranged on two slide rails, is supported by two slide rails; In slide unit and ball-screw, nut is fixed, and slide unit can be driven together to move along screw axial by nut by rotating screw bolt.
The Liang Tao x-axis travel mechanism 101 of said structure is arranged in parallel on grinding plate 4; Two pillars 104 are vertically arranged, and bottom is arranged on the slide unit in Liang Tao x-axis travel mechanism 101 respectively.Y-axis travel mechanism 102 two ends are fixedly mounted on two pillar 104 tops respectively, are supported by pillar 104.Z axis travel mechanism 103 axis and y-axis travel mechanism 102 axes normal are arranged, and erecting bed is fixed on the slide unit in y-axis travel mechanism 102 by adaptor.Slide unit in Z axis travel mechanism 103 is provided with keyset, is used for grinding clamping device 3 is installed.Thus, send control command by host computer to motion controller, drive Liang Tao x-axis travel mechanism 101 to be synchronized with the movement by motion controller, can realize grinding the movement of clamping device 3 along x-axis; Drive y-axis travel mechanism 102 to move, can realize grinding the movement of clamping device 3 along y-axis; Drive z-axis travel mechanism 103 to move, realize the movement of grinding clamping device 3 along z-axis.
In above-mentioned Liang Tao x-axis travel mechanism 101, any one puts, and is also provided with encoder and grating scale in y-axis travel mechanism 102 and in z-axis travel mechanism 103.Wherein, in encoder and ball-screw, the end of screw rod is coaxially fixed.In grating scale, scale grating is fixedly mounted on erecting bed, and grating reading head is arranged on the nut in ball-screw.Realize the measurement along the displacement on x, y, z axle of the measurement of ball screw turns angle and pneumatic means respectively by encoder and grating scale, and measurement structural feedback is used for realizing to host computer, and feed back to host computer.
Thus, by said mechanism three-dimensional fix device 1 can realize grinding clamping device 3 spatially in the accurate location of any point, the optical fiber lithium niobate crystal chip finally realized clamped by optical fiber lithium niobate crystal chip clamping device arrives the initial abrasion site preset and the Fine Feed realized in process of lapping.
Described grinding clamping device 3 comprises precision rotation platform 301, grinding pressure adjusting device 302 and clamping device 303, and as shown in Figure 2, the overall beam type force snesor 2 that passes through is connected with the keyset in Z axis travel mechanism 103; The round end of precision rotation platform 301 is installed grinding pressure adjusting device 302, grinding pressure adjusting device 302 is installed clamping device 303, by precision rotation platform 301 and grinding pressure adjusting device 302, the grinding angle and the grinding pressure that realize the optical fiber lithium niobate crystal chip clamped by clamping device 303 respectively regulate.
Above-mentioned precision rotation platform 301 is fixed with the power induction end of beam type force snesor 2, and the stiff end of beam type force snesor 2 is fixed on the keyset in Z axis travel mechanism 103, realizes the installation between grinding clamping device 3 and three-dimensional fix device 1.When optical fiber lithium niobate crystal chip contact grinder 5, the capable gravity being only the grinding clamping device 3 that its power induction end carries of force sensor measuring; When optical fiber lithium niobate crystal chip contact grinder 5, can be subject to the upward pressure that grinder 5 applies, this pressure can offset the gravity of part grinding clamping device 3, and the measured value of force snesor is reduced.Thus, when force sensor measuring value reduces, show that optical fiber lithium niobate crystal chip has contacted grinder 5.
Above-mentioned grinding pressure adjusting device 302, as shown in Figure 3, Figure 4, comprises installing plate 302a, guide rail 302b, slide block 302c, adjustment screw 302d, regulating spring 302e and contiguous block 302f.Wherein, installing plate 302a is fixedly mounted on the round end of precision rotation platform 301, installing plate 302a is provided with guide rail 302b, guide rail 302b is provided with the slide block 302c that can slide along guide rail 302b; Guide rail 302b lower end is provided with stop screw, by the movement that stop screw restriction slide block 302c is downward, and when lithium niobate crystal chip does not contact with abrasive disk, slide block 302c contacts with stop screw, the support force provided for slide block 302c and clamping device 303 by stop screw balances; When lithium niobate crystal chip contacts with abrasive disk, slide block 302c is separated with stop screw, and the support force provided for slide block 302c and clamping device 303 by lithium niobate crystal chip balances, and now support force is grinding pressure.Slide block 302c is provided with positioning table 302h, on positioning table 302h, along guide rail 302b, axially having adjustment screw penetrates hole, and positioning table 302h bottom also has clamping device installing hole.Slide block 302c bottom is provided with contiguous block 302f, contiguous block 302f has and penetrates the coaxial adjustment screw connecting hole in hole with adjustment screw.The link of described adjustment screw 302d penetrates Kong Houyu adjustment screw connecting hole threaded engagement through adjustment screw and connects.On adjustment screw 302d, cover has regulating spring 302e, and regulating spring 302e is between adjustment screw 302d nut and slide block 302c.
By said structure grinding pressure adjusting device 302, when lithium niobate crystal chip does not contact with abrasive disk, by clockwise or be rotated counterclockwise adjustment screw 302d, change the decrement of regulating spring 302e, and then change regulating spring 302e to the pressure of slide block 302c, realize the adjustment of grinding pressure.
The internal diameter designing regulating spring 302e in the present invention is greater than the diameter of adjustment screw 302d, and regulating spring 302e two ends coordinate with the circular orientation shoulder that slide block 302c designs respectively at adjustment screw 302d adjustable side, realize regulating spring 302e radial location, make zerofriction force between regulating spring 302e and adjustment screw 302d, when ensure that turning adjusting screw 302d, the power that lithium niobate crystal chip is changed is completely from the pressure of regulating spring 302e.
Be convenient to the adjustment of grinding pressure, the present invention is provided with read head 302g on the adjustable side of adjustment screw 302d, adjustment screw 302d can be driven to rotate by rotating read head 302g, obtain the numerical value corresponding with adjustment screw 302d rotational angle by read head 302g simultaneously, and then the corresponding relation of survey measurements head 302g reading and grinding pressure can be obtained; Make the reading by the gage outfit on adjustment adjustment screw 302d in process of lapping, corresponding grinding pressure value can be obtained.
Described clamping device 303 comprises left pedestal 303a, Right socle 303b, pedestal installed part 303c and retaining mechanism 303d, as shown in Figure 5.
Wherein, left pedestal 303a and Right socle 303b is symmetrical set, and is locating piece a, one rectangular block shape structure that clamp b and loading blocks c is formed, is made up of AISI321 stainless steel of annealing.
As shown in Figure 6, Figure 7, in left pedestal 303a, locating piece a, as non-deformed unit, right flank is designed with rectangular protrusions f, be used for coordinating with the rectangular recessed g that locating piece a left surface in Right socle 303b designs, realize the location between left pedestal 303a and Right socle 303b.Clamp b is as deformation unit, and trailing flank top connects with the leading flank top of locating piece a, and makes clamp b trailing flank and locating piece a leading flank have gap.There is bottom clamp b the loading blocks c being only communicated with clamp b leading flank cavity is set, be used for arranging loading blocks c.Loading blocks c as non-deformed unit, with locating piece a leading flank bottom connection bottom trailing flank.The right flank of above-mentioned locating piece a is designed with the fiber orientation groove d of through locating piece a upper and lower side, is used for arranging optical fiber h; The side of fiber orientation groove d communicates with locating piece a leading flank, then form hierarchic structure in the front side edge position of locating piece a right flank; Meanwhile, also have wafer orientation groove e in one end of fiber orientation groove d, be positioned at the bottom of locating piece a, be used for arranging wafer i, as shown in Figure 10.
As shown in Figure 8, Figure 9, in Right socle 303b, locating piece a, as non-deformed unit, left surface is designed with recessed structures g, coordinates with the raised structures f on left pedestal 303a.Clamp b is as deformation unit, and trailing flank top connects with the leading flank top of locating piece a, makes clamp b trailing flank and locating piece a leading flank have gap.There is bottom clamp b the only through loading blocks c stepping up block leading flank cavity be set, be used for arranging loading blocks c, loading blocks c as non-deformed unit, with locating piece a leading flank bottom connection bottom trailing flank.The right flank of above-mentioned locating piece a is designed with the fiber orientation groove d being communicated with locating piece a upper and lower side, is used for arranging optical fiber h; The side of fiber orientation groove d communicates with locating piece a leading flank, then form hierarchic structure in the front side edge position of locating piece a right flank; Meanwhile, also have wafer orientation groove e in one end of optical fiber h locating slot d, be positioned at the bottom of locating piece a, be used for arranging wafer i, as shown in figure 11.
In the left pedestal 303a of said structure and Right socle 303b, loading blocks c has left-hand thread hole and the right-hand thread hole of through loading blocks c front and back sides, with pinching screw threaded engagement, by tightening pinching screw, pinching screw end is contacted, as shown in figure 12 with clamp b lower front through screw hole; Owing to only there being top to be connected between clamp b with locating piece a, and between leave gap, thus, by tightening pinching screw, promote clamp b bottom backward by pinching screw, and then by clamp b trailing flank, wafer i be clamped in wafer orientation groove e.On above-mentioned left pedestal and Right socle, near locating piece a and clamp b joint, have the manhole of through locating piece a and clamp b left and right side simultaneously, locating piece a and clamp b joint is made to form domes, power can be passed to the circular arc shaped portion of arch form when arch is stressed, spread out equably towards periphery, effectively can reduce locating piece a and clamp b joint by force intensity, make clamping device 303 step up position can repeatedly use, and the phenomenon of stress concentrations and locating piece a and clamp b joint Strength Failure can not be produced.
Left pedestal 303a is connected with the positioning table 302h in grinding pressure adjusting device 302 by pedestal installed part 303c with Right socle 303b, as shown in Figure 5, pedestal installed part 303c comprises left base assistant installed part and Right socle installed part, for having the platy structure of connecting hole, be individually fixed in locating piece a upper surface in left pedestal 303a and Right socle 303b, integrative-structure can be made with locating piece a; Connecting hole on left pedestal installed part and Right socle installed part is symmetrical, and all corresponding with the clamping device connecting hole on positioning table 302h.As shown in figure 13, left pedestal 303a coordinates relative positioning by rectangular protrusions f with Right socle 303b rectangular recessed g, now left pedestal 303a and Right socle 303b is fixed as one through the screw that locating piece a in locating piece a and Right socle 303b in left pedestal 303a offers by bolt, now left pedestal 303a right flank and Right socle 303b left surface are fitted, form overall base; Subsequently, by bolt through the installing hole on left base assistant installed part and Right socle installed part, integrated model is fixed on positioning table 302h.
Described retaining mechanism 303d has 2, is respectively left pedestal retaining mechanism and Right socle retaining mechanism, is used for the pinching screw realized in left pedestal 303a and Right socle 303b respectively to lock.2 retaining mechanism 303d are U-shaped structure, and as shown in figure 14, on two sides, correspondence position has through hole and screwed hole, and bending position is as screw positioning port, inwall circumference are designed with screw locating shoulder j, are used for locking screw.Thus, by pinching screw through after screw positioning port, locate after the nut of screw and screw locating shoulder j are fitted; Subsequently, by pinching screw through after the through hole on a side, be connected with the screwed hole matching thread on another side, by tightening pinching screw, retaining mechanism 303d two sides spacing is reduced, and then dog screw mouth bore is reduced, pinching screw clamping the most at last.Just can be realized the rotation of pinching screw by rotation lock mechanism 303d, be convenient to the precession of pinching screw.
Because optical fiber h Mohs' hardness is 7, lithium niobate crystal chip i Mohs' hardness is 5, both belong to hard brittle material, and in left pedestal 303a and Right socle 303b, manually tighten pinching screw when being clamped by lithium niobate crystal chip i, when pinching screw excessive screwing, be easy to cause lithium niobate crystal chip i to damage.Therefore need accurately to control screw precession distance, and in the present invention, side is designed with limited block k in left pedestal retaining mechanism and Right socle retaining mechanism; Simultaneously, after need ensureing that the pinching screw screwed hole screwed on loading blocks c makes end be passed by screwed hole in left pedestal 303a and Right socle 303b, when contacting with clamp b leading flank, by the further left pedestal retaining mechanism of turn 45 ° left, limited block k contacts with left pedestal 303a left surface, and now the wafer i on left pedestal 303a clamps by loading blocks c trailing flank; By further turn Right socle retaining mechanism 45 ° to the right, limited block k contacts with Right socle 303b right flank, and now the wafer i on Right socle 303b clamps by loading blocks c trailing flank, as shown in figure 14.
For the Ginding process of the lithium niobate crystal chip lapping device with grinding pressure adjusting device of said structure, concrete steps are as follows:
Step 1: two pieces of lithium niobate crystal chip i are arranged on clamping device 303, are fixedly clamped by clamping device 303;
Step 2: the demarcation of grinding pressure adjusting device 302, and by adjustment precision turntable.Optical fiber lithium niobate crystal chip need ensure that fiber axis grinds to form 15 degree to fiber end face normal direction, meets grinding requirement, effectively can reduce back-reflection when being coupled with Y waveguide;
From Hooke's law, in the decrement of regulating spring 302e and process of lapping, to be applied to the power of lithium niobate crystal chip i proportional for grinding table.For directly regulating grinding pressure value, the corresponding relation of read head 302g reading and grinding pressure demarcated by the electronic scale that use measurement sensistivity is 0.02g; Be specially:
A, electronic scale is placed on the lower end of two pieces of light wafer i;
The brushless servo motor that b, host computer control three-dimensional fix device 1 ZhongzZhou travel mechanism 103 by motion controller enters low-speed running state, and clamping device 303 is moved downward; When force sensor measuring value reduces 0.5g, stop the brushless servo motor running of z-axis travel mechanism 103 immediately;
The brushless servo motor that c, host computer control three-dimensional fix device 1 ZhongZZhou travel mechanism 103 by motion controller enters low-speed running state, control grinding clamping device 3 and move downward 5mm, slide block 302c in grinding pressure adjusting device 302 is separated with stop screw;
D, rotate read head 302g to different read text scale, obtain and show measured value with corresponding electronic scale corresponding to each read text scale;
E: control host computer controls three-dimensional fix device 1 ZhongzZhou travel mechanism 103 brushless servo motor running by motion controller, grinding pressure adjusting device 302 is raised, lithium niobate crystal chip i is made to depart from electronic scale, now, in grinding pressure adjusting device 302, slide block 302c contacts with stop screw; Subsequently, repeat step b ~ d, obtain read head 302g and rotate the many groups electronic scale measured value to same read text scale;
Many groups electronic scale measured value under f, same read text scale is averaged, and can obtain the grinding pressure value that read head 302g is corresponding under each read text scale, complete demarcation.
Step 3: host computer controls the position in three-dimensional fix device 1x, y direction by motion controller, ensure that the central point of the central point of the optical fiber h bonding with two pieces of lithium niobate crystal chip i phases and grinder 5 main shaft is apart from equal, the identical of two grinding tracks can be ensured, and then ensure that the Grinding Quality of two lithium niobate crystal chip i is equal.
Step 4: the brushless servo motor that host computer controls three-dimensional fix device 1 ZhongzZhou travel mechanism 103 by motion controller enters low-speed running state, grinding clamping device 3 is moved downward, reduces to force sensor measuring value; Now, the brushless servo motor that host computer controls three-dimensional fix device 1 ZhongZZhou travel mechanism 103 by motion controller shuts down.
Step 5: the brushless servo motor that host computer controls three-dimensional fix device 1 ZhongZZhou travel mechanism 103 by motion controller enters low-speed running, control grinding clamping device 3 and move downward 5mm, slide block 302c in grinding pressure adjusting device 302 is separated with stop screw;
Step 6: according to grinding requirement, choose grinding pressure; Subsequently, according to the corresponding relation of the read head 302g reading obtained in step 2 and grinding pressure value, rotate the read text scale corresponding to adjustment screw 302d to read head 302g by read head 302g;
Step 7: setting grinder 5 parameter, comprises milling time, grinder 5 internal gear and the speed of mainshaft; Subsequently, grinder 5 is opened;
Step 8: when after arrival milling time, close grinder 5.
Step 9: host computer controls the brushless servo motor running of three-dimensional fix device 1 ZhongzZhou travel mechanism 103 by motion controller, makes grinding pressure adjusting device 302 be raised to lithium niobate crystal chip i and departs from grinder 5.
Claims (6)
1. with a lithium niobate crystal chip lapping device for grinding pressure adjusting device, it is characterized in that: comprise three-dimensional fix device, beam type force snesor and grinding clamping device;
Described three-dimensional fix device is arranged on grinding plate, the slide block in three-dimensional fix device ZhongzZhou travel mechanism is installed grinding clamping device; Grinding clamping device; By three-dimensional fix device realize clamping device in grinding clamping device spatially in the location of any point, finally realize clamping device accommodate the location of lithium niobate crystal chip;
Described grinding clamping device comprises precision rotation platform, grinding pressure adjusting device and clamping device, and entirety is arranged in z-axis travel mechanism by force snesor; The round end of precision rotation platform is installed grinding pressure adjusting device, clamping device installed by grinding pressure adjusting device;
Above-mentioned grinding pressure adjusting device, comprises installing plate, guide rail, slide block, adjustment screw, regulating spring and contiguous block; Wherein, installing plate is fixedly mounted on the round end of precision rotation platform, and installing plate is provided with guide rail, and guide rail is provided with can along the slide block of slide; Guide rail lower end is provided with stop screw; Slide block is provided with positioning table, positioning table penetrates hole along lead rail axis to having adjustment screw; Slide block bottom is provided with contiguous block, contiguous block has and penetrates the coaxial adjustment screw connecting hole in hole with adjustment screw; The link of described adjustment screw penetrates Kong Houyu adjustment screw connecting hole threaded engagement through adjustment screw and connects; In adjustment screw, cover has regulating spring, and regulating spring is between adjustment screw nut and slide block;
The adjustable side of adjustment screw is provided with read head, adjustment screw can be driven to rotate by rotating read head, obtaining the numerical value corresponding with adjustment screw rotational angle by read head simultaneously, and then the corresponding relation of survey measurements head reading and grinding pressure can be obtained.
2. a kind of lithium niobate crystal chip lapping device with grinding pressure adjusting device as claimed in claim 1, it is characterized in that: described three-dimensional fix device adopts door type design, comprises Liang Tao x-axis travel mechanism, a set of y-axis travel mechanism, a set of z-axis travel mechanism and two pillars; X-axis travel mechanism, y-axis travel mechanism are identical with in z-axis travel mechanism structure, are made up of erecting bed, slide rail, slide unit, ball-screw and drive motors; Wherein, erecting bed is provided with two slide rails be parallel to each other; In ball-screw, screw rod and two slide rails be arranged in parallel, and screw rod two ends are arranged on erecting bed by support member, and are connected by bearing with between installed part; Screw rod one end is coaxially connected with drive motors output shaft, by drive motors drive screw turns; Slide block is arranged on two slide rails, is supported by two slide rails; In slide block and ball-screw, nut is fixed; Above-mentioned Liang Tao x-axis travel mechanism is arranged in parallel; Two pillars are vertically arranged, and bottom is arranged on the slide block in Liang Tao x-axis travel mechanism respectively; Y-axis travel mechanism two ends are fixedly mounted on two pillar tops respectively, are supported by pillar; Z-axis travel mechanism axis and y-axis travel mechanism axes normal are arranged, and erecting bed is fixed on the slide unit in y-axis travel mechanism by adaptor.
3. a kind of lithium niobate crystal chip lapping device with grinding pressure adjusting device as claimed in claim 2, it is characterized in that: in described Liang Tao x-axis travel mechanism, any one puts, and is also provided with encoder and grating scale in y-axis travel mechanism and in z-axis travel mechanism; Wherein, in encoder and ball-screw, the end of screw rod is coaxially fixed; In grating scale, scale grating is fixedly mounted on erecting bed, and grating reading head is arranged on the nut in ball-screw.
4. a kind of lithium niobate crystal chip lapping device with grinding pressure adjusting device as claimed in claim 1, is characterized in that: described force snesor adopts beam type force snesor.
5., for the Ginding process of a kind of lithium niobate crystal chip lapping device with grinding pressure adjusting device as claimed in claim 1, concrete steps are as follows:
Step 1: two panels lithium niobate crystal chip is arranged on clamping device, is fixedly clamped by clamping device; And follow according to grinding requirement, make the angle between optical fiber lithium niobate crystal chip face machined flat normal direction and grinder surface normal by adjustment precision rotation platform;
Step 2: the demarcation of grinding pressure adjusting device;
A, electronic scale is placed on the lower end of two pieces of light wafers;
The brushless servo motor that b, host computer control three-dimensional fix device ZhongzZhou travel mechanism by motion controller enters low-speed running state, and clamping device is moved downward; When force sensor measuring value reduces, stop the brushless servo motor running of z-axis travel mechanism;
The brushless servo motor that c, host computer control three-dimensional fix device ZhongZZhou travel mechanism by motion controller enters low-speed running state, controls grinding clamping device and moves downward, slide block in grinding pressure adjusting device is separated with stop screw;
D, rotate read head to different read text scale, obtain and show measured value with corresponding electronic scale corresponding to each read text scale;
E, control host computer control the brushless servo motor running of three-dimensional fix device ZhongzZhou travel mechanism by motion controller, grinding pressure adjusting device is raised, make lithium niobate crystal chip depart from electronic scale, now, in grinding pressure adjusting device, slide block contacts with stop screw; Subsequently, repeat step b ~ d, obtain read head and rotate the many groups electronic scale measured value to same read text scale;
Many groups electronic scale measured value under f, same read text scale is averaged, and obtains the grinding pressure value that read head is corresponding under each read text scale, completes demarcation;
Step 3: host computer controls three-dimensional fix device by motion controller, makes on clamping device two pieces of lithium niobate crystal chips move to above grinder; Meanwhile, grinding abrasive paper is placed on grinder;
Step 4: the brushless servo motor that host computer controls three-dimensional fix device ZhongzZhou travel mechanism by motion controller enters low-speed running state, grinding clamping device is moved downward, reduces to force sensor measuring value; Now, the brushless servo motor that host computer controls three-dimensional fix device ZhongzZhou travel mechanism by motion controller shuts down;
Step 5: the brushless servo motor that host computer controls three-dimensional fix device ZhongzZhou travel mechanism by motion controller enters low-speed running, controls grinding clamping device and moves downward, slide block in grinding pressure adjusting device is separated with stop screw;
Step 6: according to grinding requirement, choose grinding pressure; Subsequently, according to the corresponding relation of the read head reading obtained in step 2 and grinding pressure value, rotate the read text scale corresponding to adjustment screw to read head by read head;
Step 7: setting grinder parameter, comprises milling time, grinder internal gear and the speed of mainshaft; Subsequently, grinder is opened;
Step 8: when after arrival milling time, close grinder;
Step 9: host computer controls the brushless servo motor running of three-dimensional fix device ZhongzZhou travel mechanism by motion controller, makes grinding pressure adjusting device be raised to lithium niobate crystal chip and departs from grinder.
6. as claimed in claim 5 with the optical fiber lapping method of grinding pressure adjusting device, it is characterized in that: need to make the contact point of two pieces of lithium niobate crystal chips and grinder in described step 3 to grinder main shaft apart from equal.
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