CN109471333B - 一种振镜矫正系统及方法 - Google Patents

一种振镜矫正系统及方法 Download PDF

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Publication number
CN109471333B
CN109471333B CN201710807754.1A CN201710807754A CN109471333B CN 109471333 B CN109471333 B CN 109471333B CN 201710807754 A CN201710807754 A CN 201710807754A CN 109471333 B CN109471333 B CN 109471333B
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China
Prior art keywords
galvanometer
light spot
scanning system
measuring device
field
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CN201710807754.1A
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English (en)
Chinese (zh)
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CN109471333A (zh
Inventor
唐江锋
刘志宇
朱振朋
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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Priority to CN201710807754.1A priority Critical patent/CN109471333B/zh
Priority to KR1020207010221A priority patent/KR102392452B1/ko
Priority to JP2020510520A priority patent/JP6967140B2/ja
Priority to PCT/CN2018/104693 priority patent/WO2019047938A1/zh
Priority to TW107131729A priority patent/TWI669578B/zh
Publication of CN109471333A publication Critical patent/CN109471333A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
CN201710807754.1A 2017-09-08 2017-09-08 一种振镜矫正系统及方法 Active CN109471333B (zh)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201710807754.1A CN109471333B (zh) 2017-09-08 2017-09-08 一种振镜矫正系统及方法
KR1020207010221A KR102392452B1 (ko) 2017-09-08 2018-09-07 갈바노미터 보정 시스템 및 방법
JP2020510520A JP6967140B2 (ja) 2017-09-08 2018-09-07 検流計補正システム及び方法
PCT/CN2018/104693 WO2019047938A1 (zh) 2017-09-08 2018-09-07 一种振镜矫正系统及方法
TW107131729A TWI669578B (zh) 2017-09-08 2018-09-10 一種振鏡矯正方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710807754.1A CN109471333B (zh) 2017-09-08 2017-09-08 一种振镜矫正系统及方法

Publications (2)

Publication Number Publication Date
CN109471333A CN109471333A (zh) 2019-03-15
CN109471333B true CN109471333B (zh) 2020-05-01

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JP (1) JP6967140B2 (ja)
KR (1) KR102392452B1 (ja)
CN (1) CN109471333B (ja)
TW (1) TWI669578B (ja)
WO (1) WO2019047938A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110487180B (zh) * 2019-08-12 2020-12-25 上海理工大学 一种用于扫描振镜式激光加工系统的热漂移测量方法
EP4056655A4 (en) * 2019-11-05 2023-11-15 NOK Corporation WATER-BASED SURFACE TREATMENT AGENT
CN110940490B (zh) * 2019-12-13 2021-05-04 湖南省鹰眼在线电子科技有限公司 一种激光加工设备的激光光斑扫描精度检测方法及装置
CN111290218B (zh) * 2020-01-20 2022-08-23 江苏迪盛智能科技有限公司 一种dmd模块化设计的安装调试机构及ldi设备
CN113369680B (zh) * 2020-02-25 2022-06-10 广东汉邦激光科技有限公司 激光校准装置和激光校准方法
CN112092361B (zh) * 2020-07-28 2022-06-07 湖南华曙高科技股份有限公司 一种用于制造三维物体的扫描单元的实时检测方法和系统
CN115717859B (zh) * 2022-11-16 2023-09-29 南京博视医疗科技有限公司 一种点扫描光学系统激光标定方法及其装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2630025B2 (ja) * 1990-06-21 1997-07-16 日本電気株式会社 レーザトリミング方法及び装置
JP2690466B2 (ja) * 1995-01-11 1997-12-10 住友電気工業株式会社 レーザビームスピンナ
JP2008279471A (ja) * 2007-05-08 2008-11-20 Sony Corp レーザ加工装置、レーザ加工方法、ｔｆｔ基板、及び、ｔｆｔ基板の欠陥修正方法
JP4297952B2 (ja) * 2007-05-28 2009-07-15 三菱電機株式会社 レーザ加工装置
JP5519123B2 (ja) * 2008-06-10 2014-06-11 株式会社片岡製作所 レーザ加工機
CN101513693A (zh) * 2009-03-17 2009-08-26 深圳市大族激光科技股份有限公司 一种振镜校正系统及其校正方法
KR20100116432A (ko) * 2009-04-22 2010-11-01 주식회사 필옵틱스 갈바노미터 보정 장치
CN102538663B (zh) * 2010-12-13 2014-03-12 中国科学院沈阳自动化研究所 一种二维位置跟踪测量装置及其测量方法
JP5943669B2 (ja) * 2012-03-26 2016-07-05 ビアメカニクス株式会社 ガルバノスキャナ及びレーザ加工装置
CN103913294B (zh) * 2014-03-20 2016-02-24 西安交通大学 一种用于激光振镜系统的十字线增量标定方法
CN105527796B (zh) * 2014-09-28 2018-03-13 上海微电子装备（集团）股份有限公司 龙门式设备和控制方法
CN104730708A (zh) * 2015-04-10 2015-06-24 长春理工大学 机载激光通信附面层效应光学补偿方法
CN106271122B (zh) * 2015-05-29 2019-01-18 上海微电子装备（集团）股份有限公司 一种激光封装设备的垂向控制装置及方法
CN106553338A (zh) * 2015-09-18 2017-04-05 广东汉邦激光科技有限公司 激光3d打印机及其振镜扫描校准系统及方法
CN106956430B (zh) * 2017-03-29 2019-07-30 深圳市大业激光成型技术有限公司 一种振镜扫描系统的校准装置及应用其的3d打印机系统

Also Published As

Publication number Publication date
JP6967140B2 (ja) 2021-11-17
KR102392452B1 (ko) 2022-04-29
TWI669578B (zh) 2019-08-21
JP2020536738A (ja) 2020-12-17
CN109471333A (zh) 2019-03-15
WO2019047938A1 (zh) 2019-03-14
TW201923473A (zh) 2019-06-16
KR20200046107A (ko) 2020-05-06

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