CN109461678B - Wafer rotating speed detection device in megasonic cleaning - Google Patents

Wafer rotating speed detection device in megasonic cleaning Download PDF

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Publication number
CN109461678B
CN109461678B CN201811227971.4A CN201811227971A CN109461678B CN 109461678 B CN109461678 B CN 109461678B CN 201811227971 A CN201811227971 A CN 201811227971A CN 109461678 B CN109461678 B CN 109461678B
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wheel
fixedly connected
electric welding
vibration
mode
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CN109461678A (en
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黎三妹
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Nanjing Lishui Hi Tech Venture Capital Management Co Ltd
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Nanjing Lishui Hi Tech Venture Capital Management Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/64Devices characterised by the determination of the time taken to traverse a fixed distance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses a wafer rotating speed detection device in megasonic cleaning, which structurally comprises a water inlet end, a sealing door, a wafer rotating speed detection device, a detector shell, a locking piece and a supporting damp-proof plate, wherein the wafer rotating speed detection device is installed inside the detector shell in an embedding mode, the back of the locking piece is connected with the middle position of the positive end surface of the detector shell through a hinge, the inside of the locking piece is installed at the top end of the positive end surface of the sealing door in an embedding mode, the bottom end of the positive end surface of the sealing door is movably connected with the middle lower position of the positive end surface of the detector shell through the hinge, and the water inlet end is installed at the middle position of the right side of the positive end surface of the detector shell in an embedding mode. Therefore, the rotation state of the wafer in the megasonic cleaning process can be detected.

Description

Wafer rotating speed detection device in megasonic cleaning
Technical Field
The invention relates to the field of wafer cleaning, in particular to a wafer rotating speed detection device in megasonic cleaning.
Background
With the continuous development of integrated circuit manufacturing technology, the feature size of a chip is smaller and smaller, the number of interconnection layers is larger and larger, the diameter of a wafer is also increased, multilayer wiring is realized, the surface of the wafer must have extremely high flatness, smoothness and cleanliness, chemical mechanical polishing is the most effective wafer planarization technology at present, and is called as five key technologies of the most core of an IC manufacturing process together with photoetching, etching, ion implantation and film deposition.
Disclosure of Invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: wafer rotational speed detection device in megasonic cleaning, its structure is including intaking end, sealing door, wafer rotational speed detection device, detector shell, latch fitting, support damp proof board, wafer rotational speed detection device installs inside detector shell through the mode of embedding, the latch fitting back is connected with the positive terminal surface intermediate position of detector shell through the hinge, the inside mode through the embedding of latch fitting is installed on the positive terminal surface top of sealing door, lean on lower position swing joint together in the middle of hinge and the positive terminal surface of detector shell through the positive terminal surface bottom of sealing door, it installs at the positive terminal surface right side intermediate position of detector shell through the mode of embedding to intake the end, support damp proof board top and adopt the mode fixed connection of electric welding in detector shell bottom.
The wafer rotating speed detection device comprises a power supply alternating control mechanism, a ray identification mechanism, a rotating speed signal emission mechanism, a vibration frequency gate mechanism, a megasonic high-frequency output mechanism, a linkage mechanism, a double-connection brake mechanism and a display screen, a display screen is arranged right above the inner part of the shell of the detector, a power supply exchange mechanism is fixedly connected right below the display screen, the right side of the power supply exchange control mechanism is provided with a linkage mechanism and a double-connection braking mechanism, one end of the power supply exchange control mechanism is mechanically connected with one end of the linkage mechanism, which is far away from the double-connection braking mechanism, the ray identification mechanism is internally provided with a rotating speed signal emission mechanism, the bottom end of the vibration frequency gate mechanism is fixedly connected with the top end of the megasonic high-frequency output mechanism, the top end of the rotating speed signal transmitting mechanism is mechanically connected with one end of the double-connection braking mechanism, and the bottom end of the vibration frequency gate mechanism is fixedly connected with the bottom end inside the ray identification mechanism.
As the further optimization of this technical scheme, power traffic control mechanism is including fixed cover, first power cord, cross power joint, electric wire locating rack, second power cord, first drive belt, the mode fixed connection that first power cord head end adopted the electric welding keeps away from second power cord one end in the display screen bottom, first power cord end is installed inside fixed cover through the mode of embedding, first power cord one end is kept away from to the mode fixed connection that second power cord head end adopted the electric welding in the display screen bottom, the cross power joint inner ring is in the same place through first drive belt and link gear swing joint, the mode fixed connection that second power cord bottom adopted the electric welding is in megasonic high frequency output mechanism side.
As a further optimization of the technical scheme, the ray recognition mechanism comprises a cleaning pipe, a water level limiting pipe, a treatment liquid temporary storage tank, a transmission recognizer, a limiting frame, a treatment plate, a shaft lever, a rotating wheel and a supporting seat, wherein one end of the cleaning pipe, far away from the treatment liquid temporary storage tank, is installed at a position right below a detection machine shell, close to the water level limiting pipe in an embedding mode, one end of the water level limiting pipe, far away from the treatment liquid temporary storage tank, is installed at a position right above the detection machine shell, close to the cleaning pipe in an embedding mode, the top end of the shaft lever is installed at the axle center position of the bottom end of the rotating wheel in an embedding mode, the bottom end of the shaft lever penetrates through the limiting frame and is movably connected with the top end of the rotating speed signal transmission mechanism through a pin, the transmission recognizers are provided with two parts, the bottom ends of the transmission recognizers are fixedly connected, the top end of the supporting seat is fixedly connected to the middle position of the bottom end of the treatment fluid temporary storage box in an electric welding mode.
As a further optimization of the technical scheme, the rotating speed signal transmitting mechanism comprises a signal transmitting end, an arc-shaped clamping plate, a limiting clamping piece, a wafer and a tension spring, wherein the signal transmitting end is provided with two electric welding modes which are respectively fixedly connected to the left end and the right end of the arc-shaped clamping plate, the two ends of the tension spring are fixedly connected to the two ends inside the arc-shaped clamping plate through the electric welding modes, the two electric welding modes are respectively fixedly connected to the two ends of the bottom of the arc-shaped clamping plate through the limiting clamping piece, the wafer is installed inside the limiting clamping piece through an embedded mode, and the top end of the arc-shaped clamping plate is movably connected with the bottom.
As a further optimization of this technical scheme, shake gate mechanism frequently includes that logical water shell, manger plate arc board, distance are acted as go-between, shake the unbalanced wheel in chamber, vibrations spring, vibrations board, the logical water shell is kept away from and is shaken the mode fixed connection that the unbalanced wheel one end in chamber adopted the electric welding in handling liquid and hold the bottom half, manger plate arc board is equipped with two altogether and installs respectively through the pin and is close to the one end that the distance is acted as go-between at logical water shell, manger plate arc board is acted as go-between through the distance and shakes the unbalanced wheel fixed connection in chamber and be in the same place, the vibrations board is close to shake the unbalanced wheel one end in chamber and run through in the middle of vibrations spring and install through the mode of embedding and.
As a further optimization of the technical scheme, the megasonic high-frequency output mechanism comprises a megasonic high-frequency vibration rod, a sealing sleeve, a connecting rod and a host end, the megasonic high-frequency vibration rod, the sealing sleeve and the connecting rod are respectively provided with five parts and are fixedly connected to the top end of the host end through the bottom end of the connecting rod, the bottom end of the megasonic high-frequency vibration rod runs through the middle position inside the sealing sleeve and is installed on the top end of the connecting rod in an embedded mode, the bottom end of the host end is fixedly connected to the middle position inside the detector shell in an electric welding mode, and the end of the host end on the side is fixedly connected to the.
According to the technical scheme, the linkage mechanism comprises a small supporting rod, a triangular fixed pulley, a T-shaped limiting rod, a poking rod, a second fixed pulley, a second transmission belt, a bearing square wheel and a long supporting rod, wherein the triangular fixed pulley is movably connected with an inner ring of the cross power supply connector through the first transmission belt, the axis position of the triangular fixed pulley is mechanically connected with one end, away from the poking rod, of the small supporting rod through a pin, one end, away from the triangular fixed pulley, of the small supporting rod is mechanically connected with one end, close to the triangular fixed pulley, of the poking rod through a pin, the outer ring surface of the second fixed pulley is movably connected with the inner ring surface of the bearing square wheel through the second transmission belt, and the bearing square wheel is mechanically connected with the double-joint braking mechanism through the long supporting rod.
As a further optimization of the technical scheme, the duplex brake mechanism comprises a third transmission belt, a driven wheel, a wave exchange gear, a support rod, a cooperative transmission wheel and a hydrodynamic driving wheel, wherein one end of the support rod, which is far away from the driven wheel, is fixedly connected to the side surface of one end, which is close to the duplex brake mechanism, inside the detection machine shell in an electric welding manner, the outer annular surface of the driven wheel is movably connected with the inner shaft rod of the hydrodynamic driving wheel through the third transmission belt, one end, which is far away from the cooperative transmission wheel, of the wave exchange gear is meshed with one end, which is close to the cooperative transmission wheel, of the driven wheel, and one end, which is far away from the driven wheel.
Advantageous effects
The invention relates to a wafer rotating speed detection device in megasonic cleaning, which connects a treatment liquid with a water inlet end and controls the input of the treatment liquid, when the treatment liquid is injected into a shell of a detection machine, the flow rate of the treatment liquid is increased through a gradually-reduced outlet of the treatment liquid, when the treatment liquid impacts a hydrodynamic driving wheel, the hydrodynamic driving wheel discharges water flow through a self pressure relief groove, and rotates by utilizing the impact force of the hydrodynamic driving wheel, so that power is generated and is transmitted to move through a third transmission belt, when a poke rod is braked by a second fixed pulley, a small support rod is pulled to enable a triangular fixed pulley to rotate at a small angle, a cross power supply connector enables four end conductive interfaces to be respectively aligned to conductive circuits, power is transmitted to a ray identification mechanism and a ray identification mechanism, the ray identification mechanism is used as a transmission center to be connected with the ray identification mechanism and a co-action transmission wheel, and when the ray identification, the megasonic high-frequency vibration rod is connected with a power supply and does work to output high-frequency megasonic waves right below the wafer through a host end, the processing liquid is enabled to form impact force to wash the surface of the wafer, when the wafer rotates, the signal transmitting end is connected with the arc-shaped clamping plate through the connection of the signal transmitting end and synchronously rotates with the wafer, and transmits an identification signal to the upper end, the transmitting identifier is activated through the electrification of the processing plate, so that the ray is emitted to identify the signal transmitting end below, the rotating speed of the signal transmitting end is judged through the time difference of twice of the identification signal transmitting end, and data are transmitted to the display screen to be displayed on the panel.
Based on the prior art, the wafer rotation detection device mainly utilizes the mutual matching of the ray identification mechanism and the rotation speed signal emission mechanism, judges whether the wafer is in a rotation state or not by identifying the time difference of two times of the signal emission end, and can detect the rotation speed of the detector, thereby realizing the detection of the rotation state of the wafer in the megasonic cleaning process.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a wafer rotation speed detecting apparatus for megasonic cleaning according to the present invention.
FIG. 2 is a schematic diagram of an internal structure of the wafer rotation speed detecting apparatus for megasonic cleaning according to the present invention.
FIG. 3 is a schematic diagram of the detailed internal structure of the wafer rotation speed detecting apparatus for megasonic cleaning according to the present invention.
FIG. 4 is a schematic diagram of the internal detailed structure of the wafer rotation speed detecting apparatus in the megasonic cleaning according to the present invention.
Fig. 5 is a partially enlarged schematic view of fig. 4.
In the figure: a water inlet end-1, a sealing door-2, a wafer rotating speed detection device-3, a detector shell-4, a locking piece-5, a supporting damp-proof plate-6, a power supply exchange control mechanism-31, a ray identification mechanism-32, a rotating speed signal transmitting mechanism-33, a vibration frequency gate mechanism-34, a megasonic high-frequency output mechanism-35, a linkage mechanism-36, a double-connection brake mechanism-37, a display screen-38, a fixed sleeve-311, a first power line-312, a cross power supply joint-313, a wire positioning frame-314, a second power line-315, a first transmission belt-316, a cleaning pipe-321, a water level limiting pipe-322, a processing liquid temporary storage box-323, a transmitting identification device-324, a limiting frame-325, a processing plate-326, a processing liquid temporary storage box-323, shaft rod-327, rotating wheel-328, supporting seat-329, signal transmitting end-331, arc clamping plate-332, limit clamping piece-333, wafer-334, tension spring-335, water passing shell-341, water blocking arc plate-342, distance pull wire-343, vibration cavity unbalanced wheel-344, vibration spring-345, vibration plate-346, megasonic high-frequency vibration rod-351, sealing sleeve-352, connecting rod-353, main machine end-354, small supporting rod-361, triangular fixed pulley-362, T-shaped limit rod-363, poke rod-364, second fixed pulley-365, second transmission belt-366, bearing square wheel-367, long supporting rod-368, third transmission belt-371, driven wheel-372, wave exchanging gear-373, and wave exchanging gear, A supporting rod-374, a cooperative transmission wheel-375 and a water driving wheel-376.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Examples
Referring to fig. 1-5, the present invention provides a wafer rotation speed detecting device in megasonic cleaning, which comprises a water inlet 1, a sealing door 2, a wafer rotation speed detecting device 3, a detecting device housing 4, a locking member 5, and a supporting moisture-proof plate 6, the wafer rotating speed detection device 3 is arranged in the detector shell 4 in an embedded mode, the back of the locking piece 5 is connected with the middle position of the positive end face of the detector shell 4 through a hinge, the inside of the locking piece 5 is arranged at the top end of the positive end surface of the sealing door 2 in an embedding way, the bottom end of the positive end surface of the sealing door 2 is movably connected with the middle lower position of the positive end surface of the detector shell 4 through a hinge, the water inlet end 1 is arranged at the middle position of the right side of the positive end surface of the shell 4 of the detector in an embedding way, the top end of the supporting damp-proof plate 6 is fixedly connected to the bottom end of the detector shell 4 in an electric welding mode.
The wafer rotating speed detection device 3 comprises a power supply exchange mechanism 31, a ray identification mechanism 32, a rotating speed signal emission mechanism 33, a vibration frequency gate mechanism 34, a megasonic high-frequency output mechanism 35, a linkage mechanism 36, a double-joint brake mechanism 37 and a display screen 38, wherein the display screen 38 is installed right above the inner part of the detector shell 4, the power supply exchange mechanism 31 is fixedly connected right below the display screen 38, the right side of the power supply exchange mechanism 31 is provided with the linkage mechanism 36 and the double-joint brake mechanism 37, one end of the power supply exchange mechanism 31 is mechanically connected with one end of the linkage mechanism 36, which is far away from the double-joint brake mechanism 37, the rotating speed signal emission mechanism 33, the bottom end of the vibration frequency gate mechanism 34 and the top end of the megasonic high-frequency output mechanism 35 are fixedly connected together, the top end of the rotating speed signal emission mechanism 33 is mechanically connected with one end of the double-joint brake, the bottom end of the seismic gate mechanism 34 is fixedly connected with the bottom end of the interior of the ray identification mechanism 32.
Power traffic control mechanism 31 includes fixed cover 311, first power cord 312, cross power connection 313, electric wire locating rack 314, second power cord 315, first drive belt 316, the mode fixed connection that first power cord 312 head end adopted the electric welding keeps away from second power cord 315 one end in display screen 38 bottom, first power cord 312 end is installed inside fixed cover 311 through the mode of embedding, first power cord 312 one end is kept away from to the mode fixed connection that second power cord 315 head end adopted the electric welding in display screen 38 bottom, cross power connection 313 inner ring is in the same place through first drive belt 316 and link gear 36 swing joint, the mode fixed connection that second power cord 315 bottom adopted the electric welding is in megasonic high frequency output mechanism 35 side.
The ray identification mechanism 32 comprises a cleaning pipe 321, a water level limiting pipe 322, a treatment liquid temporary storage tank 323, an emission identifier 324, a limiting frame 325, a processing plate 326, a shaft lever 327, a rotating wheel 328 and a supporting seat 329, wherein one end of the cleaning pipe 321, which is far away from the treatment liquid temporary storage tank 323, is installed at a position right below the detection machine shell 4, which is close to the water level limiting pipe 322, in an embedded manner, one end of the water level limiting pipe 322, which is far away from the treatment liquid temporary storage tank 323, is installed at a position right above the detection machine shell 4, which is close to the cleaning pipe 321, the top end of the shaft lever 327 is installed at the bottom end axle center position of the rotating wheel 328 in an embedded manner, the bottom end of the shaft lever 327 penetrates through the limiting frame 325 and is movably connected with the top end of the rotating speed signal emission mechanism 33 through a pin, the emission identifier 324 is provided with two parts, the bottom end of the support 329 is fixedly connected to the bottom end inside the detector shell 4 in an electric welding mode, and the top end of the support 329 is fixedly connected to the middle position of the bottom end of the treatment solution temporary storage box 323 in an electric welding mode.
The rotating speed signal transmitting mechanism 33 comprises signal transmitting ends 331, arc-shaped clamping plates 332, limiting clamping pieces 333, wafers 334 and tension springs 335, wherein the signal transmitting ends 331 are provided with two parts and fixedly connected to the left end and the right end of the arc-shaped clamping plates 332 respectively in an electric welding mode, the two ends of each tension spring 335 are fixedly connected to the two ends inside the arc-shaped clamping plates 332 in an electric welding mode, the limiting clamping pieces 333 are provided with two parts and fixedly connected to the two ends of the bottoms of the arc-shaped clamping plates 332 respectively in an electric welding mode, the wafers 334 are installed inside the limiting clamping pieces 333 in an embedding mode, and the top ends of the arc-shaped clamping plates 332 are movably connected with the bottom ends of.
The seismic frequency gate mechanism 34 comprises a water passing shell 341, a water blocking arc plate 342, a distance pull wire 343, a seismic cavity unbalanced wheel 344, a seismic spring 345 and a seismic plate 346, wherein one end of the water passing shell 341, which is far away from the seismic cavity unbalanced wheel 344, is fixedly connected to the bottom end of the treatment fluid temporary storage tank 323 in an electric welding mode, two water blocking arc plates 342 are arranged, and are respectively installed at one end, which is close to the distance pull wire 343, of the water passing shell 341 through pins, the water blocking arc plate 342 is fixedly connected with the seismic cavity unbalanced wheel 344 through the distance pull wire 343, one end, which is close to the seismic cavity unbalanced wheel 344, of the seismic plate 346 penetrates through the middle of the seismic spring 345 and is installed at one end, which is close to the seismic cavity unbalanced wheel 344.
Megasonic high frequency output mechanism 35 includes megasonic high frequency vibration pole 351, seal cover 352, connecting rod 353, host computer end 354, megasonic high frequency vibration pole 351, seal cover 352, connecting rod 353 respectively are equipped with five and through connecting rod 353 bottom end fixed connection in host computer end 354 top, megasonic high frequency vibration pole 351 bottom is run through in the inside intermediate position of seal cover 352 and is installed on connecting rod 353 top through the mode of embedding, host computer end 354 bottom adopts the mode fixed connection of electric welding in the inside intermediate position of detection shell 4, host computer end 354 side adopts the mode fixed connection of electric welding in second power cord 315 bottom.
The linkage mechanism 36 comprises a small supporting rod 361, a triangular fixed pulley 362, a T-shaped limiting rod 363, a poking rod 364, a second fixed pulley 365, a second transmission belt 366, a bearing square wheel 367 and a long supporting rod 368, wherein the triangular fixed pulley 362 is movably connected with an inner ring of the cross-shaped power supply joint 313 through a first transmission belt 316, the axial center position of the triangular fixed pulley 362 is mechanically connected with one end, far away from the poking rod 364, of the small supporting rod 361 through a pin, one end, far away from the triangular fixed pulley 362, of the small supporting rod 361 is mechanically connected with one end, close to the triangular fixed pulley 362, of the poking rod 364 through a pin, the outer ring surface of the second fixed pulley 365 is movably connected with the inner ring surface of the bearing square wheel 367 through the second transmission belt 366, and the bearing square wheel 367 is mechanically connected with the double-joint brake mechanism 37.
The dual-joint brake mechanism 37 comprises a third transmission belt 371, a driven wheel 372, an exchange wave gear 373, a support rod 374, a cooperative transmission wheel 375 and a water-driven driving wheel 376, wherein one end of the support rod 374, which is far away from the driven wheel 372, is fixedly connected to the side surface of one end, which is close to the dual-joint brake mechanism 37, inside the detection machine shell 4 in an electric welding mode, the outer annular surface of the driven wheel 372 is movably connected with the inner shaft rod of the water-driven driving wheel 376 through the third transmission belt 371, one end, which is far away from the cooperative transmission wheel 375, of the exchange wave gear 373 is meshed with one end, which is close to the cooperative transmission wheel 375, of the driven wheel 372, and one end, which is far away from.
The principle of the invention is as follows: the treatment fluid is communicated with the water inlet end 1 and input of the treatment fluid is controlled, when the treatment fluid is injected into the detector shell 4, the flow rate of the treatment fluid is increased through the gradually reduced outlet, when the treatment fluid impacts the hydrodynamic driving wheel 376, the hydrodynamic driving wheel 376 discharges water flow through the pressure relief groove of the hydrodynamic driving wheel 376, the hydrodynamic driving wheel rotates by utilizing impact force of the hydrodynamic driving wheel, power is generated and transmitted through the third transmission belt 371, when the poking rod 364 brakes through the second fixed pulley 365, the small supporting rod 361 is pulled to enable the triangular fixed pulley 362 to rotate at a small angle, the cross power connector 313 aligns the four-end conductive interfaces respectively, power is transmitted to the ray identification mechanism 32 and the megasonic high-frequency output mechanism 35 in a branch mode, the wave exchanging gear 373 serves as a transmission center to connect the driven wheel 372 and the cooperative transmission wheel 375, and during exchange motion, the vibration cavity unbalanced wheel 344 is driven by the shaft 327 to rotate at a, the megasonic high-frequency vibration rod 351 is connected with a power supply through the host end 354 and does work to output high-frequency megasonic waves, so that the processing liquid forms impact force to wash the surface of the wafer 334, when the wafer 334 rotates, the signal transmitting end 331 is connected with the arc-shaped clamp plate 332 through the signal transmitting end 331 to synchronously rotate with the wafer 334 and transmit an identification signal to the upper end, the transmitting identifier 324 is activated through the electrification of the processing plate 326, the lower signal transmitting end 331 is identified through rays, the rotating speed of the lower signal transmitting end 331 is judged through the time difference of identifying the signal transmitting end 331 twice, and data are transmitted to the display screen 38 to be displayed on the panel.
The wafer 334 of the present invention refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; the silicon wafer can be processed into various circuit element structures to become IC products with specific electrical functions, the original material of the wafer is silicon, the surface of the earth crust is provided with inexhaustible silicon dioxide, silicon dioxide ore is refined by an electric arc furnace, chlorinated by hydrochloric acid, and distilled to prepare high-purity polysilicon with the purity of 99.999999999 percent, the display 38 is also commonly called as a monitor, the display is I/O equipment belonging to a computer, namely input and output equipment, and the display is a display tool which displays certain electronic files on a screen through specific transmission equipment and then reflects the electronic files to human eyes.
The invention solves the problem that the groove body for cleaning the surface of the wafer is determined to be closed and not leaked in the megasonic cleaning process, and meanwhile, the wafer is in a chemical liquid soaking state and cannot be directly distinguished from the rotating state of the wafer, so that whether the wafer is in the rotating state in the megasonic cleaning process is difficult to detect.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (3)

1. Wafer rotational speed detection device in megasonic cleaning, its characterized in that: the structure of the device comprises a water inlet end (1), a sealing door (2), a wafer rotating speed detection device (3), a detector shell (4), a locking piece (5) and a supporting damp-proof plate (6), the wafer rotating speed detection device (3) is arranged in the detector shell (4) in an embedded mode, the back of the locking piece (5) is connected with the middle position of the positive end surface of the detector shell (4) through a hinge, the inside of the locking piece (5) is arranged at the top end of the positive end surface of the sealing door (2) in an embedding way, the bottom end of the positive end surface of the sealing door (2) is movably connected with the lower position in the middle of the positive end surface of the detector shell (4) through a hinge, the water inlet end (1) is arranged at the middle position of the right side of the positive end surface of the detector shell (4) in an embedding way, the top end of the supporting damp-proof plate (6) is fixedly connected to the bottom end of the detector shell (4) in an electric welding mode;
the wafer rotating speed detection device (3) comprises a power supply exchange mechanism (31), a ray identification mechanism (32), a rotating speed signal emission mechanism (33), a vibration frequency gate mechanism (34), a megasonic high-frequency output mechanism (35), a linkage mechanism (36), a double-joint brake mechanism (37) and a display screen (38), wherein the display screen (38) is installed right above the inside of the detector shell (4), the power supply exchange mechanism (31) is fixedly connected under the display screen (38), the right side of the power supply exchange mechanism (31) is provided with the linkage mechanism (36) and the double-joint brake mechanism (37), one end of the power supply exchange mechanism (31) is mechanically connected with one end of the linkage mechanism (36) far away from the double-joint brake mechanism (37), the rotating speed signal emission mechanism (33), the bottom end of the vibration frequency gate mechanism (34) and the top end of the megasonic high-frequency output mechanism (35) are fixedly connected together, and the ray identification mechanism (32) is installed inside, the top end of the rotating speed signal transmitting mechanism (33) is mechanically connected with one end of a double-connection braking mechanism (37), and the bottom end of the vibration frequency gate mechanism (34) is fixedly connected with the bottom end inside the ray identification mechanism (32);
the power supply exchange mechanism (31) comprises a fixed sleeve (311), a first power line (312), a cross power connector (313), a wire positioning frame (314), a second power line (315) and a first transmission belt (316), the head end of the first power line (312) is fixedly connected to one end of the bottom of the display screen (38) far away from the second power line (315) in an electric welding mode, the tail end of the first power wire (312) is arranged in the fixing sleeve (311) in an embedding way, the head end of the second power line (315) is fixedly connected to one end of the bottom of the display screen (38) far away from the first power line (312) in an electric welding mode, the inner ring of the cross power supply connector (313) is movably connected with the linkage mechanism (36) through a first transmission belt (316), the bottom end of the second power line (315) is fixedly connected to the side end of the megasonic high-frequency output mechanism (35) in an electric welding mode;
the ray identification mechanism (32) comprises a cleaning pipe (321), a water level limiting pipe (322), a treatment liquid temporary storage box (323), a transmission identifier (324), a limiting frame (325), a treatment plate (326), a shaft lever (327), a rotating wheel (328) and a supporting seat (329), one end of the cleaning pipe (321) far away from the treatment liquid temporary storage box (323) is installed at a position right below the detection machine shell (4) close to the water level limiting pipe (322) in an embedding mode, one end of the water level limiting pipe (322) far away from the treatment liquid temporary storage box (323) is installed at a position right above the detection machine shell (4) close to the cleaning pipe (321) in an embedding mode, the top end of the shaft lever (327) is installed at the axis position of the bottom end of the rotating wheel (328) in an embedding mode, the bottom end of the shaft lever (327) penetrates through the limiting frame (325) and is movably connected with the top end of the rotating speed signal transmission mechanism, the emission identifier (324) is provided with two emission identifiers, the bottom ends of the emission identifiers are fixedly connected to the left end and the right end of the bottom of the processing plate (326) respectively in an electric welding mode, the bottom end of the supporting seat (329) is fixedly connected to the bottom end inside the detector shell (4) in an electric welding mode, and the top end of the supporting seat (329) is fixedly connected to the middle position of the bottom end of the processing liquid temporary storage box (323) in an electric welding mode;
the rotating speed signal transmitting mechanism (33) comprises signal transmitting ends (331), arc-shaped clamping plates (332), limiting clamping pieces (333), wafers (334) and tension springs (335), wherein the signal transmitting ends (331) are provided with two limiting clamping pieces (333) which are fixedly connected to the left end and the right end of the arc-shaped clamping plates (332) respectively in an electric welding mode, the two ends of each tension spring (335) are fixedly connected to the two ends of the inside of each arc-shaped clamping plate (332) in the electric welding mode, the two limiting clamping pieces (333) are provided with two limiting clamping pieces which are fixedly connected to the two ends of the bottom of each arc-shaped clamping plate (332) respectively in the electric welding mode, the wafers (334) are installed inside the limiting clamping pieces (333) in an embedding mode, and the top ends of the arc; the linkage mechanism (36) comprises a small support rod (361), a triangular fixed pulley (362), a T-shaped limiting rod (363), a poke rod (364), a second fixed pulley (365), a second transmission belt (366), a bearing square wheel (367) and a long support rod (368), the triangular fixed pulley (362) is movably connected with an inner ring of the cross power supply joint (313) through a first transmission belt (316), the axis position of the triangular fixed pulley (362) is mechanically connected with one end, far away from the poke rod (364), of the small support rod (361) through a pin, one end, far away from the triangular fixed pulley (362), of the small support rod (361) is mechanically connected with one end, close to the triangular fixed pulley (362), of the poke rod (364) through a pin, the outer ring surface of the second fixed pulley (365) is movably connected with the inner ring surface of the bearing square wheel (367) through the second transmission belt (366), and the bearing square wheel (367) is mechanically connected with the double-joint brake mechanism (37) through the long support rod (368) (ii) a The double-joint brake mechanism (37) comprises a third transmission belt (371), a driven wheel (372), a wave exchange gear (373), a support rod (374), a cooperative transmission wheel (375) and a water driving wheel (376), wherein one end, far away from the driven wheel (372), of the support rod (374) is fixedly connected to the side face of one end, close to the double-joint brake mechanism (37), of the interior of the detection machine shell (4) in an electric welding mode, the outer annular face of the driven wheel (372) is movably connected with an inner shaft rod of the water driving wheel (376) through the third transmission belt (371), one end, far away from the cooperative transmission wheel (375), of the wave exchange gear (373) is meshed with one end, close to the cooperative transmission wheel (375), of the driven wheel (372) and one end, far away from the driven wheel (372), of the wave exchange gear (373) are meshed with.
2. The apparatus as claimed in claim 1, wherein: the vibration frequency gate mechanism (34) comprises a water passing shell (341), two water blocking arc plates (342), a fixed distance pull wire (343), a vibration cavity unbalanced wheel (344), a vibration spring (345) and a vibration plate (346), wherein one end, far away from the vibration cavity unbalanced wheel (344), of the water passing shell (341) is fixedly connected to the bottom end of the treatment fluid temporary storage box (323) in an electric welding mode, the two water blocking arc plates (342) are arranged in total and are respectively installed at one end, close to the fixed distance pull wire (343), of the water passing shell (341) through pins, the water blocking arc plates (342) are fixedly connected with the vibration cavity unbalanced wheel (344) through the fixed distance pull wire (343), one end, close to the vibration cavity unbalanced wheel (344), of the vibration plate (346) penetrates through the middle of the vibration spring (345) and is installed at one end, close to the vibration spring (345), of the vibration cavity unbalanced wheel (344) through an embedding mode.
3. The apparatus as claimed in claim 1 or 2, wherein: megasonic high frequency output mechanism (35) includes megasonic high frequency vibration pole (351), seal cover (352), connecting rod (353), host computer end (354), megasonic high frequency vibration pole (351), seal cover (352), connecting rod (353) respectively are equipped with five and through connecting rod (353) bottom fixed connection in host computer end (354) top, megasonic high frequency vibration pole (351) bottom is run through in seal cover (352) inside intermediate position and is installed on connecting rod (353) top through the mode of embedding, host computer end (354) bottom adopts the mode fixed connection of electric welding in the inside intermediate position of detection machine shell (4), host computer end (354) adopts the mode fixed connection in second power cord (315) bottom of electric welding.
CN201811227971.4A 2018-10-22 2018-10-22 Wafer rotating speed detection device in megasonic cleaning Expired - Fee Related CN109461678B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202290654U (en) * 2011-10-10 2012-07-04 北京七星华创电子股份有限公司 Mega sonic cleaning head and mega sonic cleaning system comprising same
CN104733349A (en) * 2013-12-24 2015-06-24 株式会社迪思科 Rotating device
CN106684021A (en) * 2016-12-23 2017-05-17 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Wafer rotating speed detection device in megasonic cleaning, cleaning system and working process thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202290654U (en) * 2011-10-10 2012-07-04 北京七星华创电子股份有限公司 Mega sonic cleaning head and mega sonic cleaning system comprising same
CN104733349A (en) * 2013-12-24 2015-06-24 株式会社迪思科 Rotating device
CN106684021A (en) * 2016-12-23 2017-05-17 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Wafer rotating speed detection device in megasonic cleaning, cleaning system and working process thereof

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