CN104882402B - A kind of substrate bearing device - Google Patents
A kind of substrate bearing device Download PDFInfo
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- CN104882402B CN104882402B CN201410070432.XA CN201410070432A CN104882402B CN 104882402 B CN104882402 B CN 104882402B CN 201410070432 A CN201410070432 A CN 201410070432A CN 104882402 B CN104882402 B CN 104882402B
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- wafer
- substrate
- adapter
- supporting platform
- vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention proposes a kind of substrate bearing device, it is characterised in that including：Wafer-supporting platform, for carrying substrates；Vacuum channels, inside the wafer-supporting platform, multiple vacuum channel orifices are provided with the vacuum channels, for adsorbing the substrate；Turntable, below wafer-supporting platform, for driving the wafer-supporting platform to drive the substrate rotation；Adapter, the adapter include the adapter top in wafer-supporting platform, and the adapter bottom inside turntable；Vacuum passage, inside the adapter, vacuum source is connected by the vacuum passage with vacuum channels；Bearing and bearing block, inside turntable, the outer ring of the bearing is fixed by the bearing block with wafer-supporting platform, the inner ring of the bearing is installed on the outside of adapter, the wafer-supporting platform is rotated by the bearing relative to the adapter, during so that the wafer-supporting platform rotating relative to the adapter, the adapter does not rotate and the vacuum passage does not twist.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, especially, is related to a kind of holding for compatible different specification size substrate
Carry and put.
Background technology
In semiconductor fabrication process, it usually needs thickness, grand defect, microdefect to substrates such as silicon chip, sheet glass etc. enter
Row detection.Corresponding just has the detection devices such as film thickness measuring, grand defects detection and microdefect detection, and either which kind of detection is set
It is standby, the carrier for fixed clamp substrate is required to, above-mentioned carrier is referred to as wafer-supporting platform.
Some detection devices such as equipment such as scatterometry, grand defects detection, needs to revolve substrate in detection process
Turn, and require the substrate of compatible a variety of different specification sizes, currently used substrate diameter size mainly has 200mm and 300mm.
Therefore, in the detection device with substrate rotary motion, how quickly, conveniently, reliably in the substrate of different specification size
Between switch over, be to be highly desirable to solve the problems, such as.
In the prior art, United States Patent (USP) US5797317 proposes holds piece using vacuum suction compatibility substrates of different size
Platform, by driving adsorbing mechanism to carry out X-Y motion, so as to realize the substrate clamping to different dimensions.Its shortcoming is desirable
Two drive mechanisms and motor are added, increases great amount of cost, and substrate edge region clamps, and clamps deformation accuracy
It is difficult to ensure that；Another shortcoming is that the tracheae of drive mechanism, the cabling of cable do not illustrate, if wafer-supporting platform needs to do to rotate
During motion, winding certainly will be produced to tracheae and cable and reversed.
United States Patent (USP) US6164633 proposes carries out vacuum suction using different independent vacuum passages to different regions
It is attached, so as to the substrate of compatible different specification.This obvious mode is only applicable to the occasion without rotary motion, if substrate
Need to be rotated, winding certainly will will be produced to pipeline and is reversed.
United States Patent (USP) US6954269B2, entitled " Ring like suction disc of compatible 200mm and 300mm silicon chips ", but patent is simultaneously
Not to how compatible two kinds of different size substrates do structure elaboration, one kind is probably：Match somebody with somebody different suctions for the substrate of two kinds of specifications
Disk, when switching over, whole wafer-supporting platform is changed, it is well known that the face shape requirement of sucker is all very high, processing
Somewhat expensive, this undoubtedly adds great amount of cost and seriously reduces efficiency.
The content of the invention
Present invention aims in the detection device with substrate rotary motion, there is provided a kind of compatible different size chi
The bearing structure of very little substrate, it can realize Automated condtrol with fairly simple structure, reach and be switched fast, enable a device to examine
The substrate of different specification size is surveyed, reduces cost, improves efficiency.
The present invention proposes a kind of substrate bearing device, it is characterised in that including：Wafer-supporting platform, for carrying substrates；Vacuum ditch
Groove, inside the wafer-supporting platform, multiple vacuum channel orifices are provided with the vacuum channels, for adsorbing the substrate；Rotation
Turntable, below wafer-supporting platform, for driving the wafer-supporting platform to drive the substrate rotation；Adapter, the adapter include
Adapter top in wafer-supporting platform, and the adapter bottom inside turntable；Vacuum passage, positioned at the adapter
Inside, vacuum source are connected by the vacuum passage with vacuum channels；Bearing and bearing block, inside turntable, the axle
The outer ring held is fixed by the bearing block with wafer-supporting platform, and the inner ring of the bearing is installed on the outside of adapter, the wafer-supporting platform
Rotated by the bearing relative to the adapter so that when the wafer-supporting platform rotates relative to the adapter, described turn
Joint does not rotate and the vacuum passage does not twist.
Wherein, the angle that the turntable rotates relative to adapter is more than or equal to 360 °.
Wherein, the vacuum channels are a series of concentric ring-shaped grooves, and vacuum channel orifices are inside the wafer-supporting platform
Formed and connected by radial direction through hole.
More preferably, the substrate bearing device also includes executing agency, is fixed on below wafer-supporting platform, the executing agency from
The distance at wafer-supporting platform center is less than the radius of max vacuum groove；Annular groove, positioned at the outside on the adapter top；Switching
Head pressure fluid channel, inside the adapter, fluid source passes through adapter pressure fluid channel and the annular groove
It is connected and fills fluid into the annular groove；Wafer-supporting platform pressure fluid channel, inside the wafer-supporting platform, the annular is recessed
Groove is connected by wafer-supporting platform pressure fluid channel with the executing agency；Wherein, the fluid source is by whether fill fluid to control
Make the executing agency and get through or cut off the radial direction through hole.
Wherein, the both sides of the annular groove also include o-ring groove, and the o-ring groove is used to install sealing ring,
To be sealed to the fluid in annular groove.
Wherein, the adapter pressure fluid channel also includes vertical passage and radial tubes, the vertical passage one with
Fluid source is connected, other end is connected by the radial tubes with the annular groove.
Wherein, in addition to the pinboard below the turntable, the bottom of the adapter is arranged on the switching
On plate.
Wherein, two pipe joints, vacuum passage and the adapter pressure fluid channel are also included inside the turntable
It is through to respectively from the adapter inside the pinboard by two pipe joints and to extending outside the pinboard.
Wherein, the fluid source controls whether to fill fluid by magnetic valve.
Wherein, the fluid is gas or liquid.
Wherein, in addition to sealing gasket, leakage current body at the mounting interface for preventing the executing agency.
The application method of above-mentioned substrate bearing device, comprises the following steps：
A）System sends substrate in order, and the substrate includes the first radius substrate and the second radius substrate, and described first
Radius is less than second radius, and distance of the executing agency apart from the wafer-supporting platform center is the first radius；
B）The substrate of the radius size of manipulator grasping system requirement is simultaneously sent to wafer-supporting platform, starts vacuum source；
C）If the substrate is the first radius substrate, the fluid source does not fill fluid, and the executing agency is to moving up simultaneously
The radial direction through hole is cut off, the wafer-supporting platform adsorbs the substrate of the first specification and positioned；
D）If the substrate is the second radius substrate, the fluid source fills fluid, and pressure fluid promotes the execution machine
Structure moves down and gets through the radial direction through hole, and the wafer-supporting platform adsorbs the substrate of the second specification and positioned.
The bogey single device of compatible different specification size substrate proposed by the present invention can compatible different size chi
Very little substrate, the switching automatically controlled between different specification size substrate is realized by magnetic valve, improves production efficiency.Z simultaneously
More than 360 ° rotations can be done to turntable Rz, can effectively avoid producing pipeline winding and reverse.
Brief description of the drawings
It can be obtained further by following detailed description of the invention and institute's accompanying drawings on the advantages and spirit of the present invention
Solution.
Fig. 1 is substrate detection device system structure diagram；
Fig. 2 is wafer-supporting platform internal mechanism sectional view of the present invention；
Fig. 3 is that adapter of the present invention controls source of the gas passage enlarged drawing；
Fig. 4 is adapter structure schematic diagram of the present invention；
Fig. 5 is wafer-supporting platform surface texture schematic diagram of the present invention；
Fig. 6 is wafer-supporting platform fundamental diagram of the present invention；
Fig. 7 is wafer-supporting platform workflow diagram of the present invention.
Embodiment
The specific embodiment that the invention will now be described in detail with reference to the accompanying drawings.
Embodiment 1：
Fig. 1 is substrate detection device system structure diagram, as shown in figure 1, measurement head 106 is installed on mechanical support 107
On, mechanical support 107 can have the different structure such as gantry or single arm support.Wafer-supporting platform 105 is fixed on Z axis turntable Rz platforms
On 104, and between Rz platforms 104 and measurement head 106.Rz platforms 104 are fixed on pinboard 103, and the bottom of pinboard 103 can have
X-Y-Z is to some adjusted in platform 102 or all.The structure type of mechanical support 107 and the quantity of X-Y-Z platforms 102 do not influence
The implementation of this programme.
As shown in Figures 2 and 3, two tracheaes 208 pass through pinboard 103 to the internal mechanism sectional view of wafer-supporting platform 105 of the present invention
It is connected with pipe joint 207, pipe joint 207 couples with adapter 204；The outer ring of bearing 201 is installed on bearing block 202, inner ring peace
Loaded on adapter 204, bearing block 202 is fixed with wafer-supporting platform 105, and adapter 204 is fixed with pinboard 103；Sealing ring 203 is used
Sealed in pressure air passage, prevent gas leakage；Cylinder 205 is fixed on wafer-supporting platform 105, and sealing gasket 206 is used to prevent
Gas leakage at cylinder mounting interface.
When substrate needs to be rotated, wafer-supporting platform 105 drives rotation, wafer-supporting platform 105 and bearing block 202 by Rz platforms 104
It will be rotated relative to adapter 204, adapter 204 will not rotate, thus be connected in the pipe joint on adapter and tracheae not
Can rotate, the Rz platforms anglec of rotation can be arbitrary value, and more than 360 ° when also will not to pipeline produce winding and reverse.
The internal structure of adapter 204 is as shown in figure 4, mainly by vacuum passage 301, pressure air passage 302, radial hole
303rd, annular groove 304 and o-ring groove 305 form.The exit of radial hole 303 is provided with annular groove 304, when wafer-supporting platform rotates,
Be always ensured that in annular groove filled with pressure air, accordingly, it is capable to ensure no matter wafer-supporting platform rotation how many angle, the pressure in wafer-supporting platform
Power air duct connects with the pressure air passage in adapter all the time.O-ring groove 305 is designed at the two of annular groove 304
Side, for installing sealing ring 203, pressure air is sealed.
Wafer-supporting platform surface texture of the present invention as shown in figure 5, the upper surface of wafer-supporting platform 105 has a series of annular concentric grooves,
Trench interiors are provided with vacuum channel orifices, and incorporated by reference to Fig. 2, vacuum channel orifices pass through radial direction through hole shape inside wafer-supporting platform 105
Into connection.Vacuum passage 301 is to the upper surface of wafer-supporting platform 105（That is sucker）Pump drainage air produces negative-pressure adsorption substrate, controls source of the gas
Passage realizes " logical " to different-diameter region, " disconnected ", so as to the upper surface of wafer-supporting platform 105 by controlling the action of cylinder（I.e.
Sucker）Different-diameter region carry out pump drainage vacuum, reach absorption different-diameter substrate purpose.
Wafer-supporting platform operation principle of the present invention is as shown in fig. 6, wafer-supporting platform measurement procedure is as shown in fig. 7, incorporated by reference to Fig. 6 and 7
System sends order and carries out a measurement, manipulator（The present invention is not shown）The specification substrate of grasping system requirement is simultaneously sent to
Wafer-supporting platform, while when electromagnetic switch valve 209 is " disconnected ", 205 spherical head of cylinder is cut off 200mm and led to exterior domain vacuum upwards
Road, wafer-supporting platform 105 are used to adsorb clamping 200mm diameter substrates and positioned；When electromagnetic switch valve 209 is "ON", pressure is empty
Gas pusher cylinder head moves down, and vacuum passage is opened beyond 200mm, and wafer-supporting platform is used to adsorb clamping 300mm diameter substrates simultaneously
Positioned, then substrate detection device system measures, and measurement finishes retrogressing piece.Thus it is clear that the control of electromagnetic switch valve and
The action of cylinder with upper piece it is synchronous carry out, i.e., when manipulator grasping system requirement specification substrate and be sent to wafer-supporting platform
In this period, system has had time enough to carry out the switching of magnetic valve and has completed the action of cylinder, the yield of equipment
It is entirely unaffected by.
Embodiment 2：
Alternatively, the cylinder 205 in Fig. 2 can also be substituted with hydraulic cylinder, specifically, except changing source of the gas into fluid supply
Outside, just the same when its structure is with using cylinder, the medium simply performed is different, and liquid has been changed into by gas.
The preferred embodiment of the simply present invention described in this specification, above example is only illustrating the present invention
Technical scheme rather than limitation of the present invention.All those skilled in the art pass through logic analysis, reasoning under this invention's idea
Or the limited available technical scheme of experiment, all should be within the scope of the present invention.
Claims (11)
- A kind of 1. substrate bearing device, it is characterised in that including：Wafer-supporting platform, for carrying substrates；Vacuum channels, inside the wafer-supporting platform, multiple vacuum channel orifices are provided with the vacuum channels, for adsorbing State substrate；Turntable, below wafer-supporting platform, for driving the wafer-supporting platform to drive the substrate rotation；Adapter, the adapter include the adapter top in wafer-supporting platform, and under the adapter inside turntable Portion；Vacuum passage, inside the adapter, vacuum source is connected by the vacuum passage with vacuum channels；Bearing and bearing block, inside turntable, the outer ring of the bearing is fixed by the bearing block with wafer-supporting platform, described The inner ring of bearing is installed on the outside of adapter, and the wafer-supporting platform is rotated by the bearing relative to the adapter so that institute When stating wafer-supporting platform and being rotated relative to the adapter, the adapter is not rotated and the vacuum passage is not turned round Turn；Executing agency, it is fixed on below wafer-supporting platform, the executing agency is from being less than max vacuum groove with a distance from wafer-supporting platform center Radius；Annular groove, positioned at the outside on the adapter top；Adapter pressure fluid channel, inside the adapter, fluid source by adapter pressure fluid channel with it is described Annular groove is connected and fills fluid into the annular groove；Wafer-supporting platform pressure fluid channel, inside the wafer-supporting platform, the annular groove passes through wafer-supporting platform pressure fluid channel It is connected with the executing agency；Wherein, the fluid source is by whether fill fluid to control the executing agency to get through or cut off radial direction through hole.
- 2. substrate bearing device as claimed in claim 1, it is characterised in that：The angle that the turntable rotates relative to adapter Degree is more than or equal to 360 °.
- 3. substrate bearing device as claimed in claim 1, it is characterised in that：The vacuum channels are a series of concentric annulars Groove, vacuum channel orifices are formed by radial direction through hole inside the wafer-supporting platform and connected.
- 4. substrate bearing device as claimed in claim 1, it is characterised in that：The both sides of the annular groove also include sealing ring Groove, the o-ring groove is used to install sealing ring, to be sealed to the fluid in annular groove.
- 5. substrate bearing device as claimed in claim 1, it is characterised in that：The adapter pressure fluid channel also includes vertical To passage and radial tubes, the vertical passage one is connected with fluid source, other end is recessed by the radial tubes and the annular Groove is connected.
- 6. substrate bearing device as claimed in claim 1, it is characterised in that：Also include the switching below the turntable Plate, the bottom of the adapter are arranged on the pinboard.
- 7. substrate bearing device as claimed in claim 6, it is characterised in that：Also connect inside the turntable including two pipes Head, vacuum passage and the adapter pressure fluid channel are through to described turn by two pipe joints from the adapter respectively Inside fishplate bar and to extending outside the pinboard.
- 8. substrate bearing device as claimed in claim 1, it is characterised in that：The fluid source is controlled whether by magnetic valve Fill fluid.
- 9. substrate bearing device as claimed in claim 1, it is characterised in that：The fluid is gas or liquid.
- 10. substrate bearing device as claimed in claim 1, it is characterised in that：Also include sealing gasket, for preventing the execution Leakage current body at the mounting interface of mechanism.
- 11. usage right requires the application method of the substrate bearing device described in one of 1-10, comprise the following steps：A) system sends substrate in order, and the substrate includes the first radius substrate and the second radius substrate, first radius Less than second radius, distance of the executing agency apart from the wafer-supporting platform center is the first radius；B) manipulator grasping system requirement radius size substrate and be sent to wafer-supporting platform, start vacuum source；C) if the substrate is the first radius substrate, the fluid source does not fill fluid, and the executing agency is to moving up and cut off The radial direction through hole, the wafer-supporting platform adsorb the substrate of the first specification and positioned；D) if the substrate is the second radius substrate, the fluid source fills fluid, and pressure fluid is promoted under the executing agency Move and get through the radial direction through hole, the wafer-supporting platform adsorbs the substrate of the second specification and positioned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410070432.XA CN104882402B (en) | 2014-02-28 | 2014-02-28 | A kind of substrate bearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410070432.XA CN104882402B (en) | 2014-02-28 | 2014-02-28 | A kind of substrate bearing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104882402A CN104882402A (en) | 2015-09-02 |
| CN104882402B true CN104882402B (en) | 2018-03-13 |
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| CN201410070432.XA Active CN104882402B (en) | 2014-02-28 | 2014-02-28 | A kind of substrate bearing device |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428296B (en) * | 2015-11-30 | 2018-06-01 | 北京中电科电子装备有限公司 | A kind of adsorbent equipment |
| CN106181766B (en) * | 2016-08-29 | 2018-12-25 | 杭州士兰集成电路有限公司 | Location structure and silicon wafer processing equipment |
| CN107363575B (en) * | 2017-08-16 | 2020-07-10 | 广东长盈精密技术有限公司 | Processing equipment |
| CN108217166B (en) * | 2018-01-15 | 2021-01-08 | 京东方科技集团股份有限公司 | UV curing transmission method and system |
| CN114179046B (en) * | 2021-11-30 | 2022-10-14 | 深圳市华腾半导体设备有限公司 | Electric conduction workbench capable of realizing free rotation |
| CN115070615A (en) * | 2022-06-29 | 2022-09-20 | 中国航发动力股份有限公司 | Vacuum chuck device and auxiliary processing method thereof |
| CN115431169B (en) * | 2022-08-24 | 2023-09-01 | 中国电子科技集团公司第十三研究所 | Vacuum connection conversion device, slide polishing method and polishing machine |
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| JPH0567551A (en) * | 1991-09-05 | 1993-03-19 | Canon Inc | Wafer chuck |
| JP2000306983A (en) * | 1999-04-22 | 2000-11-02 | Mtc:Kk | Substrate holding device |
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| CN102269310A (en) * | 2010-06-03 | 2011-12-07 | 北京中电科电子装备有限公司 | Rotating joint |
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| CN104882402A (en) | 2015-09-02 |
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