CN109456710B - 一种封装背板一体化材料及其制备方法 - Google Patents
一种封装背板一体化材料及其制备方法 Download PDFInfo
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Abstract
本发明提供了一种封装背板一体化材料及其制备方法。本发明的封装背板一体化材料,包含一体化成型的胶膜层和背板层,所述胶膜层不包含光引发剂,所述背板层包含光引发剂。本发明封装背板一体化材料的胶膜层和背板层一体成型,其与电池片的粘结性能好,反射率高,阻水性能好,抗风沙能力强。本发明的封装背板一体化材料的制备方法,通过共挤成型或淋膜工艺,节省了胶膜、背板单独加工的工序,降低了材料成本。
Description
技术领域
本发明属于太阳能电池技术领域,涉及一种封装背板一体化材料及其制备方法。
背景技术
常规的太阳能电池单玻组件结构为玻璃/胶膜/电池片/胶膜/光伏背板,光伏背板是光伏组件中及其重要的封装材料,对电池片起到支撑作用,同时直接与外界环境大面积接触,其优异的绝缘性、阻隔性和耐候性是保证光伏组件能够长期稳定使用的重要因素。
CN104638041A公开了一种太阳能电池组件,包括设置在最外层的背板、设置在中间层的电池片、以及设置在最内层的钢化玻璃;所述电池片的上端面通过EVA胶膜和背板胶合粘接,下端面通过EVA胶膜和钢化玻璃胶合粘接。该发明的太阳能电池组件中设置了上下两层的EVA胶膜,使太阳光更多的照射到电池片表面,提高了转换效率。但是,下层胶膜与背板的某些功能是重复的,一方面在某种程度上增加了组件成本,另一方面使制备工艺更加复杂。
CN107749428A公开了一种复合封装一体化功能性太阳能电池背板,所述光伏背板由外至内依次为耐候层,胶黏层,PET层,胶黏层,功能层,所述功能层包括一体成型的乳白层和透明层,其中乳白层为单层或多层结构,总厚度为20~200μm,包括改性无机填料3~20份,改性树脂70~92份,紫外吸收剂0.3~9份及抗氧剂0.3~8份,透明层与电池片贴合,采用单层或多层结构,总厚度为200~800μm,包括改性树脂90~98份,紫外吸收剂0.3~9份以及抗氧剂0.3~8份。该发明采用一体化功能层能够替代传统胶膜,不仅具有高耐候、高反射、高绝缘、低水透性能,同时保护组件25年使用寿命的同时对组件功率具有增益作用。但是同样,该太阳能电池背板含有上下两层胶黏层,下层胶膜与背板的某些功能是重复的,一方面在某种程度上增加了组件成本,另一方面使制备工艺更加复杂。
发明内容
针对现有技术的不足,本发明的目的在于提供一种封装背板一体化材料及其制备方法,封装背板一体化材料的胶膜层和背板层一体化成型,其与电池片的粘结性能好,反射率高,阻水性能好,抗风沙能力强,有更高的性价比。
本发明的目的之一在于提供一种封装背板一体化材料,为达此目的,本发明采用以下技术方案:
一种封装背板一体化材料,包含一体化成型的胶膜层和背板层,所述胶膜层不包含光引发剂,所述背板层包含光引发剂。
本发明的封装背板一体化材料,包含一体化成型的胶膜层和背板层,通过原料选择,背板层含光引发剂,经光辐射后发生固化,交联度在80%以上,在后续的层压反应中将不会继续反应,不会污染层压机等设备,起到背板的作用,使制得的封装背板一体化材料具有优良的耐候性和耐风沙性;胶膜层不含光引发剂,光辐射后不发生交联,仍然可以作为普通的胶膜层使用。本发明的封装背板一体化材料,兼具胶膜和背板的功能,反射率高,与电池片的粘结性好,具有优良的阻水性能、耐候性和耐风沙性能。
所述胶膜层包含树脂、交联剂、助交联剂、偶联剂和抗老化助剂,所述背板层包含树脂、填料、交联剂、助交联剂、偶联剂、抗老化助剂和光引发剂。
本发明中,按重量份计,所述胶膜层包含以下组分:
其中,胶膜层可以为透明胶膜,也可以为具有高反射功能的白色胶膜。例如,透明胶膜层中UV吸收剂的加入可以提高封装背板一体化材料的耐候性能;白色胶膜层中钛白粉的加入可以提高封装背板一体化材料的反射率,从而提高发电效率。
所述胶膜层中,所述树脂为POE树脂或EVA树脂。
优选地,所述交联剂为过氧化酯类交联剂、过氧化缩酮类交联剂和二氧基过氧化物中的一种或至少两种的混合物。
优选地,所述助交联剂为异氰酸酯类助交联剂、丙烯酸酯类助交联剂和氰酸酯类助交联剂中的一种或至少两种的混合物。
优选地,所述偶联剂为氨基类硅烷偶联剂、环氧基类硅烷偶联剂、乙氧基类硅烷偶联剂和甲基丙烯酸基类硅烷偶联剂中的一种或至少两种的混合物。
优选地,所述抗老化助剂为受阻胺类光稳定剂、受阻酚类抗氧剂、芳香胺类抗氧剂和亚磷酸酯类抗氧剂中的一种或至少两种的混合物。
优选地,所述UV吸收剂为水杨酸酯类吸收剂、二苯甲酮类吸收剂、苯并三唑类吸收剂、取代丙烯腈类吸收剂和三嗪类吸收剂中的一种或至少两种的混合物。
按重量份计,所述背板层包含以下组分:
所述背板层中,所述树脂为POE树脂、EVA树脂、聚乙烯醇缩丁醛、丙烯酸橡胶体、甲基丙烯酸甲酯、聚氨酯和聚乙烯(PE)中的一种。
优选地,所述填料为钛白粉、碳酸钙、硫酸钡、滑石粉、云母粉、蒙脱土中的一种或至少两种的混合物。背板层中,填料的加入可提高材料表面硬度及抗风沙能力,除了提高材料表面硬度及抗风沙能力,填料的添加还有其他功效,不同矿物粒子的功效不一样,比如添加粉状材料(例如钛白粉、碳酸钙、硫酸钡等),可以进一步提高整体材料的光反射率和耐磨性能,添加片状材料(例如滑石粉、云母粉、蒙脱土等),可以提高材料的阻水性能。
优选地,所述交联剂为过氧化酯类交联剂、过氧化缩酮类交联剂和二氧基过氧化物中的一种或至少两种的混合物;
优选地,所述助交联剂为异氰酸酯类助交联剂、丙烯酸酯类助交联剂和氰酸酯类助交联剂中的一种或至少两种的混合物;
优选地,所述偶联剂为氨基类硅烷偶联剂、环氧基类硅烷偶联剂、乙氧基类硅烷偶联剂和甲基丙烯酸基类硅烷偶联剂中的一种或至少两种的混合物;
优选地,所述抗老化助剂为受阻胺类光稳定剂、受阻酚类抗氧剂、芳香胺类抗氧剂和亚磷酸酯类抗氧剂中的一种或至少两种的混合物;
优选地,所述光引发剂为裂解型引发剂、阳离子型光引发剂、夺氢型光敏引发剂中的一种或至少两种的混合物。
本发明中,所述胶膜层的厚度为200~600μm,例如所述胶膜层的厚度为200μm、250μm、300μm、350μm、400μm、450μm、500μm、510μm、520μm、530μm、540μm、550μm、560μm、570μm、580μm、590μm、600μm。
优选地,所述背板层的厚度为50~400μm,例如所述背板层的厚度为50μm、100μm、150μm、200μm、250μm、300μm、350μm、400μm。
本发明的目的之二在于提供一种目的之一所述封装背板一体化材料的制备方法,通过共挤成型或淋膜成型,节省了胶膜、背板单独加工的工序,降低了材料成本,包括如下步骤:
将不包含光引发剂的胶膜层材料和包含有光引发剂的背板层材料共挤,得到具有胶膜层和背板层的挤出料,在靠近所述背板层的一侧进行光辐射,得到所述封装背板一体化材料;或者
将包含有光引发剂的背板层材料经挤出后进行光辐射,将不包含光引发剂的胶膜层材料挤出后淋膜在所述背板层材料上,得到所述封装背板一体化材料。
作为优选方案,所述封装背板一体化材料的制备方法,包括以下步骤:
1)以树脂、交联剂、助交联剂、偶联剂和抗老化助剂为原料,混合均匀后制备胶膜层材料,以树脂、填料、交联剂、助交联剂、偶联剂、抗老化助剂和光引发剂为原料,混合均匀后制备背板层材料;
2)将步骤1)制得的胶膜层材料和背板层材料置于挤出机中,共挤得到具有胶膜层和背板层的挤出料;
3)在步骤2)制得的挤出料靠近所述背板层的一侧进行光辐射,收卷得到所述封装背板一体化材料。
或者,所述制备方法包括以下步骤:
1’)以树脂、交联剂、助交联剂、偶联剂和抗老化助剂为原料,混合均匀后制备胶膜层材料,以树脂、填料、交联剂、助交联剂、偶联剂、抗老化助剂和光引发剂为原料,混合均匀后制备背板层材料;
2’)将步骤1’)制得的背板层材料置于挤出机中,挤出后进行光辐射,
3’)将步骤1’)制得的胶膜层材料置于另一台挤出机中,挤出后淋膜在已制备好的背板层上,收卷得到所述封装背板一体化材料。
步骤2)中,所述挤出机的螺杆的温度为75~120℃,例如挤出机的螺杆的温度为75℃、80℃、85℃、90℃、100℃、105℃、110℃、115℃、120℃;所述挤出机的挤出模头的温度为90~120℃,例如挤出机的挤出模头的温度为90℃、100℃、105℃、110℃、115℃、120℃。本发明的制备方法中,75~90℃的温度条件下就能达到较好的固化效果,交联度可达80%以上,能耗更低,提高了加工的效率。
步骤3)中,所述光辐射的时间为5~30s,例如光辐射的时间为5s、10s、15s、20s、25s、30s。
优选地,所述光辐射的波长不大于500nm。
作为本发明的优选方案,所述封装背板一体化材料的制备方法包括以下步骤:
1)按重量份计,以95~100份的树脂、0.5~1份的交联剂、0.5~1份的助交联剂、0.1~1份的偶联剂、0.1~1份抗老化助剂、0~10份的钛白粉和0~0.5份的UV吸收剂为原料,混合均匀后制备胶膜层材料,以60~90份的树脂、10~40份的填料、0.5~1份的交联剂、0.5~1份的助交联剂、0.1~1份的偶联剂、0.1~0.5份的抗老化助剂和1~2份的光引发剂为原料,混合均匀后制备背板层材料;
2)将步骤1)制得的胶膜层材料和背板层材料置于挤出机中,共挤得到具有胶膜层和背板层的挤出料,其中,所述挤出机的螺杆的温度为75~120℃,所述挤出机的挤出模头的温度为90~120℃;
3)在步骤2)制得的挤出料靠近所述背板层的一侧进行5~30s的光辐射,所述光辐射的波长不大于500nm,收卷得到所述封装背板一体化材料。
经挤出机挤出后的材料在一侧光辐射处理后,远离光辐射的一侧胶膜层材料未发生交联,起粘结作用;而靠近辐射的一侧背板层发生交联固化,交联度达85%以上,在后续的层压反应中不会继续反应,不会污染层压机等设备,起到背板作用。
或者,所述制备方法包括以下步骤:
1’)按重量份计,以95~100份的树脂、0.5~1份的交联剂、0.5~1份的助交联剂、0.1~1份的偶联剂、0.1~1份抗老化助剂、0~10份的钛白粉和0~0.5份的UV吸收剂为原料,混合均匀后制备胶膜层材料,以60~90份的树脂、10~40份的填料、0.5~1份的交联剂、0.5~1份的助交联剂、0.1~1份的偶联剂、0.1~0.5份的抗老化助剂和1~2份的光引发剂为原料,混合均匀后制备背板层材料;
2’)将步骤1’)制得的背板层材料置于挤出机中,挤出后进行5~30s的光辐射,所述光辐射的波长不大于500nm;
3’)将步骤1’)制得的胶膜层材料置于另一台挤出机中,挤出后淋膜在已制备好的背板层上,其中,所述挤出机的螺杆的温度为75~120℃,所述挤出机的挤出模头的温度为90~120℃,收卷得到所述封装背板一体化材料。
与现有技术相比,本发明的有益效果为:
(1)本发明的封装背板一体化材料,胶膜层和背板层一体成型,与电池片的粘结性能好,胶膜层与玻璃的剥离力为118~159N/cm,反射率高继而具有高的发电效率,400-1100nm的整体反射率为91~92%,阻水性能好,水汽透过率为1.7~1.88g/m2·24h,抗风沙能力强,背板层落沙实验落沙165~178/L。
(2)本发明的封装背板一体化材料的制备方法,通过共挤成型,节省了胶膜、背板单独加工的工序,降低了材料成本。
附图说明
图1为本发明的封装背板一体化材料的结构示意图;
附图标记如下:
1-胶膜层;2-背板层。
具体实施方式
下面结合附图1,并通过具体实施方式来进一步说明本发明的技术方案。
如图1所示,本发明的封装背板一体化材料,包含胶膜层1和背板层2,胶膜层和背板层一体成型。
实施例1
本实施例的封装背板一体化材料,包含胶膜层和背板层,其中,
按重量份计,所述胶膜层包含以下组分:
按重量份计,所述背板层包含以下组分:
胶膜层的厚度为400μm,背板层的厚度为150μm。
本实施例的封装背板一体化材料的制备方法,包括以下步骤:
1)按上述配比分别制备胶膜层材料和背板层材料;
2)将步骤1)制得的胶膜层材料和背板层材料置于挤出机中,共挤得到具有胶膜层和背板层的挤出料,其中,所述挤出机的螺杆的温度为85℃,所述挤出机的挤出模头的温度为110℃;
3)在步骤2)制得的挤出料靠近所述背板层的一侧进行20s的光辐射,所述光辐射的波长不大于400nm,收卷得到所述封装背板一体化材料。
实施例2
本实施例的封装背板一体化材料,包含胶膜层和背板层,其中,
按重量份计,所述胶膜层包含以下组分:
按重量份计,所述背板层包含以下组分:
胶膜层的厚度为400μm,背板层的厚度为150μm。
本实施例的封装背板一体化材料的制备方法,包括以下步骤:
1)按上述配比分别制备胶膜层材料和背板层材料;
2)将步骤1)制得的胶膜层材料和背板层材料置于挤出机中,共挤得到具有胶膜层和背板层的挤出料,其中,所述挤出机的螺杆的温度为80℃,所述挤出机的挤出模头的温度为90℃;
3)在步骤2)制得的挤出料靠近所述背板层的一侧进行10s的光辐射,所述光辐射的波长不大于400nm,收卷得到所述封装背板一体化材料。
实施例3
本实施例的封装背板一体化材料,包含胶膜层和背板层,其中,
按重量份计,所述胶膜层包含以下组分:
按重量份计,所述背板层包含以下组分:
胶膜层的厚度为400μm,背板层的厚度为150μm。
本实施例的封装背板一体化材料的制备方法,包括以下步骤:
1)按上述配比分别制备胶膜层材料和背板层材料;
2)将步骤1)制得的背板层材料置于挤出机中,挤出后进行5~30s的光辐射,所述光辐射的波长不大于500nm;
3)在步骤1)制得的胶膜层材料置于另一台挤出机中,挤出后淋膜在已制备好的背板层上,其中,挤出机的螺杆的温度为120℃,挤出机的挤出模头的温度为100℃,收卷得到封装背板一体化材料。
实施例4
本实施例的封装背板一体化材料,包含胶膜层和背板层,其中,
按重量份计,所述胶膜层包含以下组分:
按重量份计,所述背板层包含以下组分:
胶膜层的厚度为400μm,背板层的厚度为150μm。
本实施例的封装背板一体化材料的制备方法,包括以下步骤:
1)按上述配比分别制备胶膜层材料和背板层材料;
2)将步骤1)制得的胶膜层材料和背板层材料置于挤出机中,共挤得到具有胶膜层和背板层的挤出料,其中,所述挤出机的螺杆的温度为85℃,所述挤出机的挤出模头的温度为100℃;
3)在步骤2)制得的挤出料靠近所述背板层的一侧进行20s的光辐射,所述光辐射的波长不大于400nm,收卷得到所述封装背板一体化材料。
实施例5
本实施例的封装背板一体化材料,包含胶膜层和背板层,其中,
按重量份计,所述胶膜层包含以下组分:
按重量份计,所述背板层包含以下组分:
胶膜层的厚度为400μm,背板层的厚度为150μm。
本实施例的封装背板一体化材料的制备方法,包括以下步骤:
1)按上述配比分别制备胶膜层材料和背板层材料;
2)将步骤1)制得的背板层材料置于挤出机中,挤出后进行20s的光辐射,所述光辐射的波长不大于500nm;
3)在步骤1)制得的胶膜层材料置于另一台挤出机中,挤出后淋膜在已制备好的背板层上,其中,挤出机的螺杆的温度为100℃,挤出机的挤出模头的温度为90℃,收卷得到封装背板一体化材料。
实施例6
本实施例的封装背板一体化材料,包含胶膜层和背板层,其中,
按重量份计,所述胶膜层包含以下组分:
按重量份计,所述背板层包含以下组分:
胶膜层的厚度为400μm,背板层的厚度为150μm。
本实施例的封装背板一体化材料的制备方法,包括以下步骤:
1)按上述配比分别制备胶膜层材料和背板层材料;
2)将步骤1)制得的胶膜层材料和背板层材料置于挤出机中,共挤得到具有胶膜层和背板层的挤出料,其中,所述挤出机的螺杆的温度为85℃,所述挤出机的挤出模头的温度为110℃;
3)在步骤2)制得的挤出料靠近所述背板层的一侧进行25s的光辐射,所述光辐射的波长不大于400nm,收卷得到所述封装背板一体化材料。
实施例7
本实施例的封装背板一体化材料,包含胶膜层和背板层,其中,
按重量份计,所述胶膜层包含以下组分:
按重量份计,所述背板层包含以下组分:
胶膜层的厚度为400μm,背板层的厚度为150μm。
本实施例的封装背板一体化材料的制备方法,包括以下步骤:
1)按上述配比分别制备胶膜层材料和背板层材料;
2)将步骤1)制得的胶膜层材料和背板层材料置于挤出机中,共挤得到具有胶膜层和背板层的挤出料,其中,所述挤出机的螺杆的温度为85℃,所述挤出机的挤出模头的温度为100℃;
3)在步骤2)制得的挤出料靠近所述背板层的一侧进行30s的光辐射,所述光辐射的波长不大于400nm,收卷得到所述封装背板一体化材料。
对比例1
本对比例的单玻组件结构为常规的结构,胶膜与背板分别采购现有市面上的成熟产品,胶膜为杭州福斯特光伏材料股份有限公司的EVA胶膜F806P(厚度500um),背板为赛伍的KPf背板205A(厚度300um)。模拟组件结构对胶膜+背板层压的整体性能进行表征。
对比例2
本对比例与实施例1的区别之处在于,胶膜为上海海优威新材料股份有限公司的白色EVA胶膜S201W(厚度500um),背板为赛伍的KPf背板205A(厚度300um)。其他原料及制备工艺均与实施例1的相同。
对比例3
本对比例与实施例1的区别之处在于,胶膜为赛伍的POE胶膜T22(厚度500um),背板为赛伍的KPf背板205A(厚度300um)。其他原料及制备工艺均与实施例1的相同。
对比例4
本对比例与实施例1的区别之处在于,胶膜为杭州福斯特光伏材料股份有限公司的EVA胶膜F806P(厚度500um),背板为中天光伏材料有限公司的KPO背板(厚度350um)。其他原料及制备工艺均与实施例1的相同。
将实施例1-7与对比例1-4制得的材料进行性能测试,实验结果如表1所示。
表1
由表1可以看出,相对与对比例,本发明的封装背板一体化材料,胶膜层和背板层一体成型,与电池片的粘结性能好,胶膜层与玻璃的剥离力为113~159N/cm,反射率高继而具有高的发电效率,400-1100nm的整体反射率为91~92%,阻水性能好,水汽透过率为1.7~1.88g/m2·24h,抗风沙能力强,背板层落沙实验落沙160~178/L。本发明的封装背板一体化材料的制备方法,通过共挤成型,节省了胶膜、背板单独加工的工序,降低了材料成本。
以上实施例仅用来说明本发明的详细方法,本发明并不局限于上述详细方法,即不意味着本发明必须依赖上述详细方法才能实施。所属技术领域的技术人员应该明了,对本发明的任何改进,对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等,均落在本发明的保护范围和公开范围之内。
Claims (9)
1.一种封装背板一体化材料,其特征在于,由一体化成型的胶膜层和背板层组成,所述胶膜层不包含光引发剂,所述背板层包含光引发剂;
按重量份计,所述背板层由以下组分组成:
按重量份计,所述胶膜层包含以下组分:
所述胶膜层中,所述树脂为POE树脂或EVA树脂;
所述交联剂为过氧化酯类交联剂和/或过氧化缩酮类交联剂;
所述助交联剂为异氰酸酯类助交联剂、丙烯酸酯类助交联剂和氰酸酯类助交联剂中的一种或至少两种的混合物;
所述抗老化助剂为受阻胺类光稳定剂、受阻酚类抗氧剂、芳香胺类抗氧剂和亚磷酸酯类抗氧剂中的一种或至少两种的混合物;
所述UV吸收剂为水杨酸酯类吸收剂、二苯甲酮类吸收剂、苯并三唑类吸收剂、取代丙烯腈类吸收剂和三嗪类吸收剂中的一种或至少两种的混合物;
所述背板层中,所述树脂为POE树脂或EVA树脂;
所述交联剂为过氧化酯类交联剂和/或过氧化缩酮类交联剂;
所述助交联剂为异氰酸酯类助交联剂、丙烯酸酯类助交联剂和氰酸酯类助交联剂中的一种或至少两种的混合物。
2.根据权利要求1所述的封装背板一体化材料,其特征在于,所述胶膜层中,所述偶联剂为氨基类硅烷偶联剂、环氧基类硅烷偶联剂、乙氧基类硅烷偶联剂和甲基丙烯酰氧基类硅烷偶联剂中的一种或至少两种的混合物。
3.根据权利要求1所述的封装背板一体化材料,其特征在于,所述背板层中,所述填料为钛白粉、碳酸钙、硫酸钡、滑石粉、云母粉、蒙脱土中的一种或至少两种的混合物;
所述偶联剂为氨基类硅烷偶联剂、环氧基类硅烷偶联剂、乙氧基类硅烷偶联剂和甲基丙烯酰氧基类硅烷偶联剂中的一种或至少两种的混合物;
所述抗老化助剂为受阻胺类光稳定剂、受阻酚类抗氧剂、芳香胺类抗氧剂和亚磷酸酯类抗氧剂中的一种或至少两种的混合物;
所述光引发剂为裂解型引发剂、阳离子型光引发剂和夺氢型光敏引发剂中的一种或至少两种的混合物。
4.根据权利要求1所述的封装背板一体化材料,其特征在于,所述胶膜层的厚度为200~600μm;
所述背板层的厚度为50~400μm。
5.一种如权利要求1-4任一项所述的封装背板一体化材料的制备方法,其特征在于,所述制备方法包括以下步骤:将不包含光引发剂的胶膜层材料和包含有光引发剂的背板层材料共挤,得到具有胶膜层和背板层的挤出料,在靠近所述背板层的一侧进行光辐射,得到所述封装背板一体化材料;或者
将包含有光引发剂的背板层材料经挤出后进行光辐射,将不包含光引发剂的胶膜层材料挤出后淋膜在所述背板层材料上,得到所述封装背板一体化材料。
6.根据权利要求5所述的制备方法,其特征在于,所述制备方法包括以下步骤:
1)以树脂、交联剂、助交联剂、偶联剂、抗老化助剂、钛白粉和UV吸收剂为原料,混合均匀后制备胶膜层材料,以树脂、填料、交联剂、助交联剂、偶联剂、抗老化助剂和光引发剂为原料,混合均匀后制备背板层材料;
2)将步骤1)制得的胶膜层材料和背板层材料置于挤出机中,共挤得到具有胶膜层和背板层的挤出料;
3)在步骤2)制得的挤出料靠近所述背板层的一侧进行光辐射,收卷得到所述封装背板一体化材料。
7.根据权利要求5所述的制备方法,其特征在于,所述制备方法包括以下步骤:
1’)以树脂、交联剂、助交联剂、偶联剂、抗老化助剂、钛白粉和UV吸收剂为原料,混合均匀后制备胶膜层材料,以树脂、填料、交联剂、助交联剂、偶联剂、抗老化助剂和光引发剂为原料,混合均匀后制备背板层材料;
2’)将步骤1’)制得的背板层材料置于挤出机中,挤出后进行光辐射;
3’)将步骤1’)制得的胶膜层材料置于另一台挤出机中,挤出后淋膜在已制备好的背板层上,收卷得到所述封装背板一体化材料。
8.根据权利要求5所述的制备方法,其特征在于,所述制备方法包括以下步骤:
1)按重量份计,以95~100份的树脂、0.5~1份的交联剂、0.5~1份的助交联剂、0.1~1份的偶联剂、0.1~1份抗老化助剂、0~10份的钛白粉和0~0.5份的UV吸收剂为原料,混合均匀后制备胶膜层材料,以60~90份的树脂、10~40份的填料、0.5~1份的交联剂、0.5~1份的助交联剂、0.1~1份的偶联剂、0.1~0.5份的抗老化助剂和1~2份的光引发剂为原料,混合均匀后制备背板层材料;
2)将步骤1)制得的胶膜层材料和背板层材料置于挤出机中,共挤得到具有胶膜层和背板层的挤出料,其中,所述挤出机的螺杆的温度为75~120℃,所述挤出机的挤出模头的温度为90~120℃;
3)在步骤2)制得的挤出料靠近所述背板层的一侧进行5~30s的光辐射,所述光辐射的波长不大于500nm,收卷得到所述封装背板一体化材料。
9.根据权利要求5所述的制备方法,其特征在于,所述制备方法包括以下步骤:
1’)按重量份计,以95~100份的树脂、0.5~1份的交联剂、0.5~1份的助交联剂、0.1~1份的偶联剂、0.1~1份抗老化助剂、0~10份的钛白粉和0~0.5份的UV吸收剂为原料,混合均匀后制备胶膜层材料,以60~90份的树脂、10~40份的填料、0.5~1份的交联剂、0.5~1份的助交联剂、0.1~1份的偶联剂、0.1~0.5份的抗老化助剂和1~2份的光引发剂为原料,混合均匀后制备背板层材料;
2’)将步骤1’)制得的背板层材料置于挤出机中,挤出后进行5~30s的光辐射,所述光辐射的波长不大于500nm;
3’)将步骤1’)制得的胶膜层材料置于另一台挤出机中,挤出后淋膜在已制备好的背板层上,其中,所述挤出机的螺杆的温度为75~120℃,所述挤出机的挤出模头的温度为90~120℃,收卷得到所述封装背板一体化材料。
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