CN109445222B - 一种显示面板及显示装置 - Google Patents

一种显示面板及显示装置 Download PDF

Info

Publication number
CN109445222B
CN109445222B CN201910002924.8A CN201910002924A CN109445222B CN 109445222 B CN109445222 B CN 109445222B CN 201910002924 A CN201910002924 A CN 201910002924A CN 109445222 B CN109445222 B CN 109445222B
Authority
CN
China
Prior art keywords
film
ink
protective film
substrate
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910002924.8A
Other languages
English (en)
Other versions
CN109445222A (zh
Inventor
李天龙
徐蓓
程前庚
石刚贵
邹传波
欧自立
李选刚
席行风
刘波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chongqing BOE Smart Electronics System Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chongqing BOE Smart Electronics System Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chongqing BOE Smart Electronics System Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201910002924.8A priority Critical patent/CN109445222B/zh
Publication of CN109445222A publication Critical patent/CN109445222A/zh
Priority to US16/674,071 priority patent/US11264297B2/en
Application granted granted Critical
Publication of CN109445222B publication Critical patent/CN109445222B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field
    • G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
    • G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on translational movement of particles in a fluid under the influence of an applied field
    • G02F1/1675—Constructional details
    • G02F1/1679—Gaskets; Spacers; Sealing of cells; Filling or closing of cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1251—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133311—Environmental protection, e.g. against dust or humidity
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • G02F2201/501—Blocking layers, e.g. against migration of ions
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

本发明涉及显示技术领域，公开一种显示面板及显示装置，显示面板包括叠层设置的基板、墨水薄膜以及保护膜，墨水薄膜在基板上的正投影覆盖保护膜在基板上的正投影，墨水薄膜的边缘涂布有密封胶，保护膜朝向墨水薄膜的一面全部贴合在墨水薄膜上，保证密封胶堆积在墨水薄膜未与保护膜相贴合的一侧，而不会渗入到保护膜与墨水薄膜相贴合的空间内，减少了气泡产生的可能，解决了显示面板涂胶时的气泡不良，提高了生产效率及产品良率；而由于墨水薄膜的尺寸不小于保护膜的尺寸，减小墨水薄膜的边缘用于涂布有密封胶的面积，增大了可视区，从而实现窄边化，提高了显示效果。

Description

一种显示面板及显示装置
技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板及显示装置。
背景技术
利用墨水薄膜的显示器件一般包括基板、墨水膜以及保护膜，广泛用于电子标签、广告牌、电子阅读器等方面的显示。保护膜能够阻止一部分水汽与墨水膜接触。
发明内容
本发明提供一种显示面板及显示装置，该显示面板通过减少保护膜的尺寸以实现墨水薄膜与密封胶直接接触，解决显示面板涂胶时的气泡不良并实现窄边化。
为达到上述目的，本发明提供以下技术方案：
一种显示面板，包括叠层设置的基板、墨水薄膜以及保护膜，所述墨水薄膜在所述基板上的正投影覆盖所述保护膜在所述基板上的正投影，所述墨水薄膜的边缘涂布有密封胶。
在上述显示面板中，通过减少保护膜的尺寸使得墨水薄膜在基板上的正投影覆盖保护膜在基板上的正投影，保护膜朝向墨水薄膜的一面全部贴合在墨水薄膜上，在将密封胶涂布于墨水薄膜的边缘时，能够保证密封胶堆积在墨水薄膜未与保护膜相贴合的一侧，而不会渗入到保护膜与墨水薄膜相贴合的空间内，减少了气泡产生的可能，解决了显示面板涂胶时的气泡不良，提高了生产效率及产品良率；而由于墨水薄膜的尺寸不小于保护膜的尺寸，减小了墨水薄膜的边缘用于涂布有密封胶的面积，增大了可视区，从而实现窄边化，提高了显示效果。
可选地，所述墨水薄膜在所述基板上的正投影与所述保护膜在所述基板上的正投影完全重合，所述密封胶覆盖所述墨水薄膜与所述保护膜的侧面。
可选地，所述墨水薄膜在所述基板上的正投影的面积大于所述保护膜在所述基板上的正投影的面积，所述密封胶覆盖所述墨水薄膜超出所述保护膜的部分。
可选地，所述密封胶至少部分覆盖所述基板超出所述保护膜的部分。
可选地，所述墨水薄膜具有用于显示的显示区以及包围所述显示区的边框区，所述保护膜在所述墨水薄膜的正投影覆盖所述边框区以及所述显示区。
可选地，所述保护膜在所述墨水薄膜的正投影的外边缘在所述边框区的外轮廓的沿着所述基板的延伸方向的方向。
可选地，所述保护膜在所述墨水薄膜的正投影外边缘与所述边框区的外轮廓相重合。
可选地，显示面板还包括驱动电路，所述驱动电路包括柔性电路板以及集成电路，所述柔性电路板与所述集成电路电连通，所述集成电路与所述基板电连接，所述基板与所述墨水薄膜通过银胶电连接，所述墨水薄膜根据所述集成电路发送的电信号形成所述边框区。
可选地，所述基板为薄膜晶体管基板，所述墨水薄膜为电子墨水薄膜。
另外，本发明还提供了一种显示装置，包括至少一个如上述任一项技术方案所述的显示面板。
在上述显示装置中，由于上述显示面板能够解决显示面板涂胶时容易产生气泡不良问题，并实现窄边化，获得更好的显示效果，因此，具有上述显示面板的显示装置的显示效果较好。
附图说明
图1为本发明提供的一种显示面板的结构示意图；
图2为图1中显示面板的B-B剖视结构示意图；
图3为本发明提供的一种显示面板的结构示意图；以及
图4为图3中显示面板的C-C剖视结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
利用墨水薄膜的显示器件一般包括基板、墨水膜以及保护膜，广泛用于电子标签、广告牌、电子阅读器等方面的显示。保护膜能够阻止一部分水汽与墨水膜接触。
如图1、图2、图3以及图4所示，本发明提供一种显示面板，显示面板包括显示面板1，显示面板1包括叠层设置的基板11、墨水薄膜12以及保护膜13，墨水薄膜12在基板11上的正投影覆盖保护膜13在基板11上的正投影，墨水薄膜12的边缘涂布有密封胶14。
在上述显示面板中，通过减少保护膜13的尺寸使得墨水薄膜12在基板11上的正投影覆盖保护膜13在基板11上的正投影，保护膜13朝向墨水薄膜12的一面全部贴合在墨水薄膜12上，在将密封胶14涂布于墨水薄膜12的边缘时，能够保证密封胶14堆积在墨水薄膜12未与保护膜13相贴合的一侧，而不会渗入到保护膜13与墨水薄膜12相贴合的空间内，减少了气泡产生的可能，解决了显示面板涂胶时的气泡不良，提高了生产效率及产品良率；而且由于墨水薄膜12的尺寸不小于保护膜13的尺寸，减小了墨水薄膜12的边缘用于涂布有密封胶14的面积，增大了可视区，从而实现窄边化，提高了显示效果。
在上述显示面板解决显示面板涂胶时的气泡不良并实现窄边化的基础上，为了保证保护膜13的尺寸能够满足其功能需求，如图1以及图2所示，一种可选实施方式中，墨水薄膜12在基板11上的正投影与保护膜13在基板11上的正投影完全重合，密封胶14覆盖墨水薄膜12与保护膜13的侧面。
在上述显示面板中，墨水薄膜12在基板11上的正投影与保护膜13在基板11上的正投影完全重合，即沿垂直于基板11的方向上，墨水薄膜12与保护膜13相平齐，此时，保护膜13的尺寸减小到刚好能够满足墨水薄膜12与密封胶14直接接触，密封胶14覆盖墨水薄膜12与保护膜13的侧面，能够防止水汽从侧面通过墨水薄膜12和保护层之间的缝隙进入到显示面板内部，此时的保护膜13的尺寸为满足显示面板解决显示面板涂胶时的气泡不良并实现窄边化这一功能的最大尺寸，保护膜13能够较好地实现其保护墨水薄膜12的功能需求。
而为了较大限度地减少显示面板涂胶时的气泡不良，如图3以及图4所示，一种可选实施方式中，墨水薄膜12在基板11上的正投影的面积大于保护膜13在基板11上的正投影的面积，密封胶14覆盖墨水薄膜12超出保护膜13的部分。
在上述显示面板中，墨水薄膜12在基板11上的正投影的面积大于保护膜13在基板11上的正投影的面积，即沿基板11的延伸方向，墨水薄膜12的尺寸大于保护膜13的尺寸，将密封胶14涂敷在墨水薄膜12超出保护膜13的部分，避免了密封胶14渗入到保护膜13与墨水薄膜12相贴合的空间内，减少了气泡产生的可能，从而较大限度地减少显示面板涂胶时的气泡不良，提高生产效率及产品良率，而此时墨水薄膜12上堆叠有较多的密封胶14，能够较好地防止水汽从侧面通过墨水薄膜12和保护膜13之间的缝隙进入到显示面板内部。
为了获得更好得密封效果，如图1、图2、图3以及图4所示，具体地，密封胶14至少部分覆盖基板11超出保护膜13的部分。
在上述显示面板中，通过在基板11超出保护膜13的部分上涂覆密封胶14能够防止水汽从侧面通过墨水薄膜12和保护层之间的缝隙、墨水薄膜12和基板11之间的缝隙到显示面板内部，能够更好地防止水汽从侧面通过墨水薄膜12和保护层之间的缝隙进入到显示面板内部。而由于此时保护膜13与墨水薄膜12相贴合的空间内没有密封胶14，故此时的显示面板能够用于显示的区域可以扩展到整个保护膜13的面积范围，增大了可视区，从而实现窄边化，提高了显示效果。
为了避免保护膜13尺寸的减少对显示面板的显示功能造成影响，如图1、图2、图3以及图4所示，一种优选实施方式中，墨水薄膜12具有用于显示的显示区以及包围显示区的边框区，边框区能够限定显示区的最大范围，保护膜13在墨水薄膜12的正投影覆盖边框区以及显示区。
在上述显示面板中，为了较大限度地减少显示面板涂胶时的气泡不良，保护膜13的尺寸可以从现有技术中比墨水薄膜12大，减少到与墨水薄膜12的尺寸一致，还可以继续减少，但是需要保证保护膜13在墨水薄膜12的正投影覆盖边框区以及显示区，以使得保护膜13尺寸的减少不会对显示面板的显示功能造成影响，保证显示面板的显示效果。
为了保证较好的显示效果，具体地，如图1以及图3所示，保护膜13在墨水薄膜12的正投影的外边缘在边框区的外轮廓沿着基板11的延伸方向的方向。
在上述显示面板中，保护膜13在墨水薄膜12的正投影的外边缘在边框区的外轮廓沿着基板11的延伸方向的方向，保证了无论边框区的尺寸范围如何变化，显示面板的显示区都不会受到影响，进而能够保证显示面板具有较好的显示效果。
为了最大限度地减少显示面板涂胶时的低泡不良，具体地，保护膜13在墨水薄膜12的正投影外边缘与边框区的外轮廓相重合。
在上述显示面板中，保护膜13在墨水薄膜12的正投影外边缘与边框区的外轮廓相重合，即沿基板11的延伸方向，保护膜13的尺寸与边框区和显示区的尺寸之和相等，保护膜13减少到能够不影响显示面板的显示区的最小尺寸，此时将密封胶14涂敷在墨水薄膜12超出保护膜13的部分，并且墨水薄膜12上堆叠有较多的密封胶14，一方面能够避免了密封胶14渗入到保护膜13与墨水薄膜12相贴合的空间内，减少了气泡产生的可能，从而最大限度地减少显示面板涂胶时的气泡不良，提高生产效率及产品良率，另一方向，能够较好地防止水汽从侧面通过墨水薄膜12和保护层之间的缝隙进入到显示面板内部，保证密封效果。
具体地，如图1以及图3所示，显示面板还包括驱动电路2，驱动电路2包括柔性电路板21以及集成电路22，柔性电路板21与集成电路22电连通，集成电路22与基板11电连接，基板11与墨水薄膜12通过银胶3电连接，墨水薄膜12根据集成电路22发送的电信号形成边框区。
在上述显示面板中，在柔性电路板21的折弯处涂敷紫外光固化胶以防止在使用过程中柔性电路板21撕裂情况的发生，在集成电路22周围的涂敷有室温硫化硅橡胶胶水23，用于保护集成电路22，根据设计的需求银胶3的数目可以为单数也可以为双数，柔性电路板21与系统电路相连接，柔性电路板21与集成电路22电连通，集成电路22向与之电连接的基板11发送电信号，基板11在接收到该电信号后通过其表面线路与点银胶之间的电连接控制墨水薄膜12，以在墨水薄膜12上形成边框区以及显示区，从而达到显示需要，而边框区以及显示区在墨水薄膜12上的位置由集成电路22内的程序控制。
一种优选实施方式中，基板11可以为薄膜晶体管基板，还可以为塑料基板，也可以为其他能够满足功能需要的基板，墨水薄膜12可以为电子墨水薄膜，还可以为电子粉流体墨水膜，也可以为其他能够满足显示功能需要的墨水膜。密封胶14为α-氰基丙烯酸正辛脂(EC)胶。EC胶作为一种强力密封胶，能够较好地起到封胶密封、阻止水气等作用，保证显示面板的密封效果。
另外，本发明还提供了一种显示装置，包括至少一个如上述任一项技术方案的显示面板。
在上述显示装置中，由于上述显示面板能够解决显示面板涂胶时容易产生气泡不良问题，并实现窄边化，获得更好的显示效果，因此，具有上述显示面板的显示装置的显示效果较好。
显然，本领域的技术人员可以对本发明实施例进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (5)

1.一种显示面板，其特征在于，包括叠层设置的基板、墨水薄膜以及保护膜，所述墨水薄膜在所述基板上的正投影的面积大于所述保护膜在所述基板上的正投影的面积，在所述显示面板存在驱动电路的一侧，密封胶覆盖所述墨水薄膜超出所述保护膜的部分；在所述显示面板不存在所述驱动电路的一侧，所述密封胶覆盖所述墨水薄膜超出所述保护膜的部分，以及覆盖所述基板超出所述保护膜的部分；其中，所述墨水薄膜的尺寸大于所述保护膜的尺寸；所述墨水薄膜具有用于显示的显示区以及包围所述显示区的边框区，所述保护膜在所述墨水薄膜的正投影覆盖所述边框区以及所述显示区，且所述保护膜在所述墨水薄膜的正投影外边缘与所述边框区的外轮廓相重合。
2.根据权利要求1所述的显示面板，其特征在于，所述保护膜在所述墨水薄膜的正投影的外边缘在所述边框区的外轮廓的沿着所述基板的延伸方向的方向。
3.根据权利要求2所述的显示面板，其特征在于，还包括驱动电路，所述驱动电路包括柔性电路板以及集成电路，所述柔性电路板与所述集成电路电连通，所述集成电路与所述基板电连接，所述基板与所述墨水薄膜电连接，所述墨水薄膜根据所述集成电路发送的电信号形成所述边框区。
4.根据权利要求1所述的显示面板，其特征在于，所述基板为薄膜晶体管基板，所述墨水薄膜为电子墨水薄膜。
5.一种显示装置，其特征在于，包括至少一个如权利要求1-4任一项所述的显示面板。
CN201910002924.8A 2019-01-02 2019-01-02 一种显示面板及显示装置 Active CN109445222B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910002924.8A CN109445222B (zh) 2019-01-02 2019-01-02 一种显示面板及显示装置
US16/674,071 US11264297B2 (en) 2019-01-02 2019-11-05 Display panel with thin ink film between substrate and protecting film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910002924.8A CN109445222B (zh) 2019-01-02 2019-01-02 一种显示面板及显示装置

Publications (2)

Publication Number Publication Date
CN109445222A CN109445222A (zh) 2019-03-08
CN109445222B true CN109445222B (zh) 2022-12-20

Family

ID=65540137

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910002924.8A Active CN109445222B (zh) 2019-01-02 2019-01-02 一种显示面板及显示装置

Country Status (2)

Country Link
US (1) US11264297B2 (zh)
CN (1) CN109445222B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209167760U (zh) * 2019-01-30 2019-07-26 京东方科技集团股份有限公司 显示模组及显示装置
CN110018598B (zh) * 2019-04-10 2024-03-26 武汉华星光电技术有限公司 显示面板及显示装置
CN111402757B (zh) * 2020-03-23 2022-02-18 重庆京东方智慧电子系统有限公司 显示模组、电子设备和显示模组的制造方法
CN211426997U (zh) * 2020-03-23 2020-09-04 京东方科技集团股份有限公司 显示模组和电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101872100A (zh) * 2010-06-18 2010-10-27 友达光电股份有限公司 电子墨水显示器及其制造方法
CN101989019A (zh) * 2009-08-06 2011-03-23 胜华科技股份有限公司 电子纸显示装置及其制作方法
CN103246121A (zh) * 2012-02-07 2013-08-14 元太科技工业股份有限公司 电子墨水显示装置
US9170467B2 (en) * 2005-10-18 2015-10-27 E Ink Corporation Color electro-optic displays, and processes for the production thereof
CN107577101A (zh) * 2017-08-21 2018-01-12 武汉天马微电子有限公司 电泳显示面板及电泳显示面板制作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW479213B (en) * 1999-07-22 2002-03-11 Seiko Epson Corp Liquid crystal apparatus, its manufacturing method, and electronic machine
US9759979B2 (en) * 2012-02-07 2017-09-12 E Ink Holdings Inc. Electronic ink display device with water-proof glue
TWI560510B (en) * 2012-03-27 2016-12-01 E Ink Holdings Inc Electronic ink display device and method for manufacturing the same
TWI505009B (zh) * 2013-09-16 2015-10-21 E Ink Holdings Inc 顯示模組的製造方法
US9664577B1 (en) * 2014-08-26 2017-05-30 Amazon Technologies, Inc. Force-sensitive resistor assemblies and methods

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9170467B2 (en) * 2005-10-18 2015-10-27 E Ink Corporation Color electro-optic displays, and processes for the production thereof
CN101989019A (zh) * 2009-08-06 2011-03-23 胜华科技股份有限公司 电子纸显示装置及其制作方法
CN101872100A (zh) * 2010-06-18 2010-10-27 友达光电股份有限公司 电子墨水显示器及其制造方法
CN103246121A (zh) * 2012-02-07 2013-08-14 元太科技工业股份有限公司 电子墨水显示装置
CN107577101A (zh) * 2017-08-21 2018-01-12 武汉天马微电子有限公司 电泳显示面板及电泳显示面板制作方法

Also Published As

Publication number Publication date
US20200211917A1 (en) 2020-07-02
CN109445222A (zh) 2019-03-08
US11264297B2 (en) 2022-03-01

Similar Documents

Publication Publication Date Title
CN109445222B (zh) 一种显示面板及显示装置
CN109994606B (zh) 柔性显示面板
CN104347678B (zh) 显示装置及其制造方法
CN110277018A (zh) 显示面板及其制备方法
CN106646983B (zh) 一种用于超窄显示屏边框的制作工艺
WO2019127782A1 (zh) 一种液晶面板及显示装置
EP2477060A1 (en) Display device
CN102637386B (zh) 显示装置
CN110649039A (zh) 柔性显示装置及制备方法
CN104199570A (zh) 触控屏的制作方法及触控屏
CN109873020B (zh) 贴合膜材、显示面板、显示装置、显示面板的制备方法
JP2016018002A (ja) 液晶表示装置の導電テープ取付構造、液晶表示装置及びその製造方法
CN110782792A (zh) 显示装置
US20210331445A1 (en) Adhesive Structure and Adhesive Method for Adhering Panel to System Frame
CN109459878A (zh) 显示面板及其制备方法
US9395759B2 (en) Protective window for display device and display device including the same
KR101162017B1 (ko) 표시 장치
CN209356819U (zh) 一种显示模组以及显示装置
CN200993707Y (zh) 液晶模组
CN111465973B (zh) 显示装置以及显示装置的制造方法
WO2014190638A1 (zh) 显示面板及具有该显示面板的显示装置
CN109061962B (zh) 显示面板及其制造方法、显示装置
TW201506714A (zh) 觸控裝置
CN110335543A (zh) 柔性显示面板及其制造方法、柔性显示装置
JP2007256770A (ja) 液晶パネルとその製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant