CN1094099A - The tinned method of a kind of acidity - Google Patents
The tinned method of a kind of acidity Download PDFInfo
- Publication number
- CN1094099A CN1094099A CN 94102842 CN94102842A CN1094099A CN 1094099 A CN1094099 A CN 1094099A CN 94102842 CN94102842 CN 94102842 CN 94102842 A CN94102842 A CN 94102842A CN 1094099 A CN1094099 A CN 1094099A
- Authority
- CN
- China
- Prior art keywords
- acidity
- coating
- tinned
- tin
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses the tinned method of a kind of acidity, the component of the tin plating solution that it uses is: stannous sulfate 30～50g/l, sulfuric acid 140～200g/l, Vanadium Pentoxide in FLAKES 0.1～4g/l, benzylideneacetone 0.2～1.8g/l, formaldehyde 2～2ml/l, emulsifying agent 10～20g/l.The tin coating that adopts this tin plating solution to plate out has advantages such as good weldability, light, good stability, can be widely used in electrician and the electronic devices and components.
Description
The present invention relates to electric plating method, more particularly, the present invention relates to acid tinned method.
In recent years, along with developing rapidly of electronic industry, for the weldability of improving electronic devices and components and reduce cost, people attempt to plate the tin coating of good weldability on the lead-in wire of electronic devices and components.China China Machine Press 1989 publish " the electroplating technology handbook discloses the tinned method of a kind of acidity (seeing the 144th page of this book).This method adopts the plating bath of following component:
Stannous sulfate 35～48g/L, sulfuric acid 60～100g/L, phenol sulfonic acid 80～100g/L, phenol 6～10g/L, formaldehyde 0.5～1g/L, gelatin 2～3g/L, beta naphthal 0.5～1g/L.
Use the plating bath of this prescription to electroplate, although can obtain the coating of light on the plating piece surface, the weldability of coating is poor, and plating piece deposits 2～6 months in air after, coating just becomes grey black, and welding property is poorer.In addition, plating bath itself is also very unstable, places in air 1～2 month, and it is muddy that plating bath just becomes, and has a strong impact on the light and the weldability of coating.
The objective of the invention is to overcome shortcoming of the prior art, a kind of acid tin plating solution of stable performance is provided, adopt the tin coating of this formulations prepared from solutions to have good light, weldability and stability, and with low cost.
The present invention adopts the acid tin plating solution of following component:
Stannous sulfate 30～50g/L
Sulfuric acid 140～200g/L
Vanadium Pentoxide in FLAKES 0.1～4g/L
Benzylideneacetone 0.2～1.8g/L
Formaldehyde 2～20ml/L
Emulsifying agent 10～20g/L
The invention will be further described below by example.Wherein example 1 is a prior art, and remaining example is a content of the present invention.
Example 1:
Stannous sulfate 45g/L, sulfuric acid 100g/L, phenol sulfonic acid 85g/L, phenol 8g/L, formaldehyde 1g/L, gelatin 3g/L, beta naphthal 0.5g/L, 20 ℃ of temperature, current density 1A/dm
2
Example 2～example 5
The salient features of the tin coating that above-mentioned each example plates out (copper cash with diameter 0.7mm is an example) is shown in the following table.
As can be seen from the table, adopt the tin coating of the inventive method preparation compared with prior art to have the following advantages: the solderability of coating (wetting power) is good, zero friendship time is short, the coating brightness is good, coating is deposited after half a year still very bright in air, and its good solderability does not change.
Claims (1)
1, the tinned method of a kind of acidity, its technical characterictic is that it uses the plating bath of following component: stannous sulfate 30～50g/L, sulfuric acid 140～200g/L, Vanadium Pentoxide in FLAKES 0.1～4g/L, benzylideneacetone 0.2～1.8g/L, formaldehyde 2～20ml/L, emulsifying agent 10～20g/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94102842 CN1094099A (en) | 1994-03-24 | 1994-03-24 | The tinned method of a kind of acidity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 94102842 CN1094099A (en) | 1994-03-24 | 1994-03-24 | The tinned method of a kind of acidity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1094099A true CN1094099A (en) | 1994-10-26 |
Family
ID=5030818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 94102842 Pending CN1094099A (en) | 1994-03-24 | 1994-03-24 | The tinned method of a kind of acidity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1094099A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100370062C (en) * | 2005-03-24 | 2008-02-20 | 广东风华高新科技集团有限公司 | Composition for plating pure tin and electronic component employing the same |
| CN100587121C (en) * | 2005-02-28 | 2010-02-03 | 罗门哈斯电子材料有限公司 | Modified acid electrolytes |
| CN101595248B (en) * | 2006-12-29 | 2011-04-27 | 日进素材产业株式会社 | Sn-B plating solution and plating method using it |
| CN102995072A (en) * | 2012-10-30 | 2013-03-27 | 南通汇丰电子科技有限公司 | Tinning solution for copper-clad steel wire |
| CN103215622A (en) * | 2012-06-13 | 2013-07-24 | 安徽恒晶电缆集团有限公司 | Method for electrotinning copper conductor of wire or cable |
| CN105256346A (en) * | 2015-11-25 | 2016-01-20 | 武汉奥邦表面技术有限公司 | Cyanide-free quaternary alloy plating solution |
| CN106835210A (en) * | 2017-03-09 | 2017-06-13 | 昆明理工大学 | A kind of sulfate bright tin plating solution and preparation method thereof |
-
1994
- 1994-03-24 CN CN 94102842 patent/CN1094099A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100587121C (en) * | 2005-02-28 | 2010-02-03 | 罗门哈斯电子材料有限公司 | Modified acid electrolytes |
| CN100370062C (en) * | 2005-03-24 | 2008-02-20 | 广东风华高新科技集团有限公司 | Composition for plating pure tin and electronic component employing the same |
| CN101595248B (en) * | 2006-12-29 | 2011-04-27 | 日进素材产业株式会社 | Sn-B plating solution and plating method using it |
| CN103215622A (en) * | 2012-06-13 | 2013-07-24 | 安徽恒晶电缆集团有限公司 | Method for electrotinning copper conductor of wire or cable |
| CN102995072A (en) * | 2012-10-30 | 2013-03-27 | 南通汇丰电子科技有限公司 | Tinning solution for copper-clad steel wire |
| CN105256346A (en) * | 2015-11-25 | 2016-01-20 | 武汉奥邦表面技术有限公司 | Cyanide-free quaternary alloy plating solution |
| CN106835210A (en) * | 2017-03-09 | 2017-06-13 | 昆明理工大学 | A kind of sulfate bright tin plating solution and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101358361B (en) | Tin electrolysis applying liquid for electronic unit, applying method and electronic unit | |
| CN1335418A (en) | Electronic element, method for producing electronic element and circuit board | |
| JP2003293187A (en) | Copper or copper alloy subjected to plating and method for manufacturing the same | |
| JPH11350188A (en) | Material for electric and electronic parts, its production, and electric and electronic parts lising the same | |
| CN1094099A (en) | The tinned method of a kind of acidity | |
| ES8306194A1 (en) | Electroplating tin and tin alloys and baths therefor | |
| CN1165639C (en) | Sn-In alloy electroplating liquid and its preparing method | |
| JPH0855521A (en) | Conductive member and its manufacture | |
| JP4260826B2 (en) | Connector parts | |
| JP2011099128A (en) | Plated member and method for manufacturing the same | |
| JP2684631B2 (en) | Lead wire for capacitor | |
| JP2971035B2 (en) | Tin or tin alloy plated copper alloy for multi-pole terminals and multi-pole terminals | |
| CN1032040A (en) | The method for preparing composite tin-plating layer | |
| JP2851245B2 (en) | Sn alloy plating material | |
| JPS63114083A (en) | Lead frame for connector | |
| CN218826223U (en) | Copper bar with protective coating | |
| JPS61151914A (en) | Contactor | |
| CN1154183C (en) | Composite Ag-Sn LED lead frame | |
| CN113035553B (en) | Method for improving corrosion resistance and production efficiency of pin transformer | |
| CN102154669B (en) | Method for plating thick soft gold by utilizing plating thin golden cylinder | |
| JPH03188253A (en) | Tinned copper alloy material | |
| JP3628836B2 (en) | Sn or Sn alloy plated copper alloy material | |
| CN100402707C (en) | Alkaline Sn-Ag alloy plating solution and its plating method | |
| JPH02145793A (en) | Copper or copper alloy material coated with tin or solder plating excellent in thermal peeling resistance | |
| KR970065777A (en) | Manufacturing method of tin-lead alloy plating for electrical contacts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |