JPH02145793A - Copper or copper alloy material coated with tin or solder plating excellent in thermal peeling resistance - Google Patents
Copper or copper alloy material coated with tin or solder plating excellent in thermal peeling resistanceInfo
- Publication number
- JPH02145793A JPH02145793A JP30014288A JP30014288A JPH02145793A JP H02145793 A JPH02145793 A JP H02145793A JP 30014288 A JP30014288 A JP 30014288A JP 30014288 A JP30014288 A JP 30014288A JP H02145793 A JPH02145793 A JP H02145793A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- copper
- tin
- solder
- solder plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 67
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 39
- 239000010949 copper Substances 0.000 title claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 24
- 239000000956 alloy Substances 0.000 title claims description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 abstract description 11
- 230000001105 regulatory effect Effects 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 description 36
- 229910000765 intermetallic Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000010974 bronze Substances 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910001868 water Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- FAKFSJNVVCGEEI-UHFFFAOYSA-J tin(4+);disulfate Chemical compound [Sn+4].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O FAKFSJNVVCGEEI-UHFFFAOYSA-J 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は耐熱剥離性に優れた錫またははんだめっき被覆
銅または銅合金材料に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a tin or solder plating coated copper or copper alloy material having excellent heat-resistant peelability.
［従来の技術］
一般に、銅あるいは銅合金は、良好な導電性とバネ性、
加工性、耐食性、熱放散性及び強度を有していることか
ら、端子、コネクター及びリードフレーム等の電子部品
材料として広く使用されており、このような電子部品材
料として使用する場合には、はんだ付性を向上させる目
的で錫やはんだめっきを銅または銅合金基体（母材）に
被覆することが多い。[Prior Art] Generally, copper or copper alloy has good conductivity, good springiness,
Due to its workability, corrosion resistance, heat dissipation properties, and strength, it is widely used as a material for electronic components such as terminals, connectors, and lead frames. Copper or copper alloy substrates (base metals) are often coated with tin or solder plating to improve adhesion.
しかし、電子部品材料を電子機器に組み込んで使用した
場合、電子部品材料は電子機器の内部で１００〜１８０
℃程度の高温環境下にさらされる。このような環境下で
長時間使用した場合、錫またははんだめっきが母材から
剥離するという現象が発生する。上記のような剥離現象
が発生した場合、電子機器の回路障害、例えば、信号の
停止あるいは短絡等を引き起こし、電子機器とじての信
頼性を著しく低下させる。However, when the electronic component material is incorporated into an electronic device and used, the electronic component material has a 100 to 180
Exposure to high temperature environments around ℃. When used for a long time in such an environment, a phenomenon occurs in which the tin or solder plating peels off from the base material. When the above peeling phenomenon occurs, it causes a circuit failure of the electronic device, such as signal stoppage or short circuit, and significantly reduces the reliability of the electronic device.
そこで、熱剥離の防止法として、錫またはばんだめっぎ
被覆前に、下地めつきを施す方法が提案されている。Therefore, as a method for preventing thermal peeling, a method has been proposed in which undercoat plating is applied before coating with tin or bander plating.
すなわち、
■青化銅俗による銅下地めりき方法（特開昭５９−９３
８９８号公報）、
■亜鉛または亜鉛合金めっき方法（特開昭６０−１６９
５８９号公報）、
■ニッケルめっき方法
等である。Namely, ■ Copper undercoating method using bronze bronze method (Japanese Unexamined Patent Publication No. 1983-1993)
898 Publication), ■Zinc or zinc alloy plating method (Japanese Patent Application Laid-open No. 1698-169)
(No. 589 Publication), ■Nickel plating method, etc.
しかし、
■の方法は、銅下地めっきによって著しく低下する耐熱
！ｌ Ｍ温度性を改善したものであるが、錫またははん
だめっきの母材からの剥離を十分に防止することができ
ず、また、青化物を使用しているために公害対策が必要
となる。However, method ① significantly reduces heat resistance due to copper undercoating! Although it has improved temperature properties, it cannot sufficiently prevent the peeling of tin or solder plating from the base material, and since cyanide is used, pollution control measures are required.
■の方法は、錫またははんだめっきの母材からの＊Ｕａ
は防止できるが、亜鉛の拡散によってはんだ付性が低下
するという問題がある。The method of ■ is *Ua from the base material of tin or solder plating.
Although this can be prevented, there is a problem in that solderability deteriorates due to the diffusion of zinc.
さらに、■の方法は加工性が劣るという問題がある。Furthermore, method (2) has the problem of poor workability.
本発明は、上記の問題点を解決し、公害対策が不要であ
り、また加工性と耐熱剥離性に優れた錫またははんだめ
っき被覆銅または銅合金材料を提イ共することを目的と
する。It is an object of the present invention to solve the above-mentioned problems and to provide a tin- or solder-plated copper or copper alloy material that does not require any pollution control measures and has excellent workability and heat peeling resistance.
［課凹を解決するための手段］
本発明の第１の要旨は、銅または銅合金基体上に、直接
または銅下地めっきを施した後、めつぎ中の炭素量が０
．１ｗｔ％以下の錫またははんだを被覆したことを特徴
とする耐熱剥離性に優れた錫またはばんだめフぎ被覆銅
または銅合金材料に存在する。[Means for solving problems] The first aspect of the present invention is that after plating a copper or copper alloy substrate directly or with a copper base plating, the amount of carbon in the plating is reduced to zero.
．． It exists in a tin or solder coated copper or copper alloy material that is characterized by being coated with 1 wt% or less of tin or solder and has excellent heat-resistant peelability.
本発明の第２の要旨は、銅または銅合金基体上に、直接
または銅下地めつきを施した後、めっき中の炭素量が０
．１％以下の錫またははんだめりぎを全体の錫またはば
んだめつきの被覆厚みの１０％以上の厚みで被覆して、
さらにその上に錫またははんだめっきを被覆したことを
特徴とする耐熱剥１ｌｉＩ！性に（量れた錫またはばん
だめ）き被覆銅または銅合金材料に存在する。The second aspect of the present invention is that after plating a copper or copper alloy substrate directly or with a copper undercoat, the amount of carbon in the plating is reduced to 0.
．． Coating with 1% or less of tin or solder to a thickness of 10% or more of the total coating thickness of tin or solder,
Heat-resistant peeling 1liI, which is further coated with tin or solder plating! present in naturally (metal tin or binder) coated copper or copper alloy materials.
［作 用コ
以下、本発明の作用を、本発明をなすに際して得た知見
とともに説明する。[Function] Hereinafter, the function of the present invention will be explained together with the findings obtained in making the present invention.
本発明者は、熱剥離の発生原因を調査した。その結果、
電子機器内に生じた高熱の影響を受け、母材と錫または
けんだめつぎどの間でＣｕとＳｎの相互拡散が進み、母
材側からε−Ｃｕ、Ｓｎおよびη−ＣｕａＳｎ５の金属
間化合物が形成されることを発見した。さらに調査を行
ったところ、この金属間化合物の形成の状態によって剥
離の発生は大きく支配されることを知見した。特に、端
子やコネクター材料に多く用いられる光沢のある錫また
ははんだめっきを被覆した場合に剥離現象が起こり易い
。The present inventor investigated the cause of thermal peeling. the result,
Under the influence of the high heat generated in electronic equipment, inter-diffusion of Cu and Sn progresses between the base material and the tin or cement joint, and intermetallic compounds of ε-Cu, Sn and η-CuaSn5 are formed from the base material side. discovered that it was formed. Further investigation revealed that the occurrence of peeling was largely controlled by the state of formation of this intermetallic compound. Peeling is particularly likely to occur when coated with shiny tin or solder plating, which is often used in terminal and connector materials.
すなわち、錫またははんだめっき被覆した銅または銅合
金材料においては、該材料に熱処理を施した場合、母材
側からε−ＣｕｓＳｎ、η−ＣＬＩ６Ｓｎｓの金属間化
合物が形成され、この形成の状態によって剥離が発生し
たり、剥離が発生するまでの時間が長くなったり、剥離
が発生しなかったりする。特に、銅下地めっきを施すと
Ｃｕ−３ｎの相互拡散反応が促進され、金属間化合物の
形成が大きくなり、短時間の加熱で剥離が発生する。し
たがって、めっき剥離防止には、熱影響を受けて形成さ
れる金属間化合物の成長を抑えることが有効であろうと
の知見を得た。In other words, when a copper or copper alloy material coated with tin or solder plating is subjected to heat treatment, intermetallic compounds of ε-CusSn and η-CLI6Sns are formed from the base material side, and the state of this formation causes peeling. may occur, the time required for peeling to occur may be longer, or peeling may not occur at all. In particular, when copper underplating is applied, the interdiffusion reaction of Cu-3n is promoted, the formation of intermetallic compounds becomes large, and peeling occurs even after short-term heating. Therefore, it was found that suppressing the growth of intermetallic compounds formed under the influence of heat would be effective in preventing plating peeling.
そこで、本発明者は、かかる成長を抑制する手段を鋭、
！探究したところ、銅または銅合金基体上に直接または
銅下地めっきを施した後、炭素量が０．１％以下の錫及
びはんだを被覆すれば、金属間化合物の形成を抑制する
ことを見出し本発明をなすにいたった。Therefore, the present inventor has developed a means to suppress such growth.
! As a result of research, we found that the formation of intermetallic compounds can be suppressed by coating tin and solder with a carbon content of 0.1% or less directly on a copper or copper alloy substrate or after plating with a copper base. He came up with an invention.
炭素量を規制することにより、Ｃｕ−５ｎ相互拡散反応
によって生成するε−Ｃｕ、Ｓｎの下層の近傍に発生す
る欠陥を減少させることができ、この結果、密着性が良
好となり、剥離が生じなくなる。By regulating the amount of carbon, it is possible to reduce defects that occur near the lower layer of ε-Cu and Sn produced by the Cu-5n interdiffusion reaction, resulting in good adhesion and no peeling. .
以下に本発明について詳しく説明する。The present invention will be explained in detail below.
錫またははんだめっき被覆は次のように行えばよい、す
なわち、銅または銅合金基体を常法によってアルカリ脱
脂−水洗一電解脱脂一水洗一酸処理一水洗する。水洗後
、直接または銅下地めっきを行った後、錫またははんだ
めっきを行う。錫めっきは、硫酸錫浴、ホウフッ化錫浴
、フェノールスルホン酸浴等のいずれの浴を用いて行っ
てもよい。はんだめっきは、有機酸浴、ホウフッ化浴等
のいずれの浴を用いて行ってもよい。The tin or solder plating may be applied as follows: the copper or copper alloy substrate is subjected to alkaline degreasing, water washing, electrolytic degreasing, water washing, acid treatment, and water washing in a conventional manner. After washing with water, tin or solder plating is performed either directly or after copper base plating. Tin plating may be performed using any bath such as a tin sulfate bath, a tin borofluoride bath, or a phenolsulfonic acid bath. Solder plating may be performed using any bath such as an organic acid bath or a borofluoride bath.
ただ、本発明では、錫またははんだめっぎは炭素量を０
．１ｗｔ％以下にする必要がある。めっきの炭素量を抑
えるためには、めっき液の光沢剤を減少させたり極めて
低い電流密度でめっきすればよい。However, in the present invention, tin or solder plating has a carbon content of 0.
．． It is necessary to keep it below 1wt%. In order to suppress the amount of carbon in plating, it is sufficient to reduce the amount of brightener in the plating solution or to perform plating at an extremely low current density.
なお、特に、光沢が必要な場合は、炭素量が０．１ｗｔ
％以下の錫またははんだめっきを、全体の錫またははん
だめっき被覆厚の１０％以上の厚みに設けた後、光沢の
錫またははんだめっきを行えばよい、全体の錫またはは
んだめっき厚は、特に限定する必要はないが、通常１〜
１０μｍに施す。In addition, especially when gloss is required, the amount of carbon should be 0.1wt.
% or less of tin or solder plating to a thickness of 10% or more of the total tin or solder plating thickness, and then apply bright tin or solder plating.The total tin or solder plating thickness is not particularly limited. Although it is not necessary to do so, it is usually 1~
Apply to 10 μm.
以下に錫またははんだめっき中の炭素量と厚みの限定理
由について述べる。The reason for limiting the carbon content and thickness in tin or solder plating will be described below.
通常銀またははんだめっきには炭素が０．２〜０．５ｗ
ｔ％程度入っている。この状態では耐熱剥離性は極めて
悪く、大気中、温度１５０℃で２４時間加熱すると剥離
が生じる。ｏ、ｉｉ〜０．２ｗｔ％では剥離発生までの
時間は若干延長されるが、１２５〜２５０時間程度の加
熱で剥離が生じる。０．１％ｗｔ以下では耐熱剥離性は
大きく改善される。Usually silver or solder plating contains 0.2 to 0.5w of carbon.
It contains about t%. In this state, heat-resistant peelability is extremely poor, and peeling occurs when heated in the air at a temperature of 150° C. for 24 hours. o, ii to 0.2 wt%, the time until peeling occurs is slightly extended, but peeling occurs after heating for about 125 to 250 hours. At 0.1%wt or less, heat-resistant peelability is greatly improved.
よって、めっきの炭素量を０．１ｗｔ％以下とした。Therefore, the carbon content of the plating was set to 0.1 wt% or less.
錫またははんだめっきを２層にする場合のＩｉ目の厚み
が全体の錫またはけんだめつきの厚みの１０％未満では
耐熱１１ ！！！ｉ性の効果は小さい。１０％以上で効
果があり、厚くするにしたがって効果はより大きくなる
。耐熱剥離性を改善するには１０％以上が必要である。When using two layers of tin or solder plating, if the thickness of the second layer is less than 10% of the total thickness of the tin or solder plating, the heat resistance is 11! ! ! The effect of i-ness is small. It is effective when the thickness is 10% or more, and the effect becomes greater as the thickness increases. 10% or more is required to improve heat-resistant peelability.
よって、１層目の厚みを１０％以上とした。Therefore, the thickness of the first layer was set to 10% or more.
なお、本発明における銅または銅合金基体はその形状に
は特に限定されず、例えば、線状体、板状体その他のも
のを用いることができる。Note that the shape of the copper or copper alloy substrate in the present invention is not particularly limited, and for example, a linear body, a plate-shaped body, or the like can be used.
［実施例］ 以下に本発明の実施例「ついて説明する。[Example] Examples of the present invention will be described below.
（実施例１）
厚さ０．３ｍｍ、幅５０ｍｍ、長さ１００ｍｍのりん青
銅（Ｓｎ：６％、Ｐｒｏ、０５％）を通常の前処理を行
い、第１表に示す条件でめっきの電流密度を変動させて
めつきの炭素量が０．０５〜０．１ｗｔ％になるように
それぞれ錫及びはんだめっきを５μｍ厚に施した。(Example 1) Phosphor bronze (Sn: 6%, Pro, 05%) with a thickness of 0.3 mm, a width of 50 mm, and a length of 100 mm was subjected to the usual pretreatment, and the plating current density was adjusted under the conditions shown in Table 1. Tin and solder plating was applied to a thickness of 5 μm by varying the amount of carbon so that the amount of carbon in the plating was 0.05 to 0.1 wt%.
（実施例２）
実施例１と同様に、めっきの炭素量が０．０５〜０．０
７ｗｔ％の錫およびはんだめっぎを０．５μｍ、１μｍ
、３μｍ厚に施し、さらに、その上に光沢の錫及びはん
だめっきを２μｍ４μｍ、４．５μｍ厚に施した。(Example 2) Similar to Example 1, the carbon content of the plating was 0.05 to 0.0.
7wt% tin and solder plating 0.5μm, 1μm
, to a thickness of 3 μm, and then glossy tin and solder plating was applied thereon to a thickness of 2 μm, 4 μm, and 4.5 μm.
（耐熱！ＩＩｌ！ｌｌ性の評価）
実施例１〜２で作製した試験片を大気中で温度１５０℃
で２４Ｈｒ、１２５Ｈｒ、２５０Ｈｒ。(Evaluation of heat resistance! IIl!ll property) The test pieces prepared in Examples 1 and 2 were heated in the air at a temperature of 150°C
24Hr, 125Hr, 250Hr.
５００Ｈｒ、１０００Ｈｒ加熱処理後、曲げ半径１ｍｍ
で９０°繰返し曲げを２回行いめっき！ＩＪ離の発生状
況を調査した。その結果を第２表に示す。第２表から明
らかなように、本発明の実施例を示すもの（Ｎｏ、１〜
Ｎｏ、１７）では、耐熱剥躊性の改善効果が認められた
。銅下地めっきを施したものは剥離発生までの時間が延
長された。特に、銅下地めつきを行わないもの（Ｎｏ、
１〜Ｎｏ、 ２． Ｎｏ、 ７〜Ｎｏ、 ９゜Ｎｏ、
１３．Ｎｏ、１５．Ｎｏ、１６）は温度１５０℃で１０
００Ｈｒ加熱してもｓｕｍは発生しなかりた。Bending radius 1mm after heat treatment for 500Hr and 1000Hr
Repeatedly bend 90 degrees twice and plate! We investigated the occurrence of IJ separation. The results are shown in Table 2. As is clear from Table 2, those showing examples of the present invention (No. 1 to
In No. 17), an improvement effect on heat peeling resistance was observed. The time until peeling occurred was extended for those coated with copper base plating. In particular, those that do not undergo copper underplating (No.
1~No, 2. No, 7~No, 9°No,
13. No, 15. No. 16) is 10 at a temperature of 150℃
Even after heating for 00 hours, no sum occurred.
比較例として示したもの（Ｎｏ、１８〜Ｎｏ。Those shown as comparative examples (No. 18 to No.
２３）は、従来のめつき方法であり、めっ包剥離が短時
間で発生した。23) was a conventional plating method, and peeling of the plating occurred in a short period of time.
なお、以上の実施例はリン青銅を用いて説明したが、こ
れに限らず、他の銅または銅合金についでも同様の効果
が得られることは確認されている。Although the above embodiments have been described using phosphor bronze, it has been confirmed that similar effects can be obtained with other coppers or copper alloys as well.
［発明の効果コ
以上説明したように、本発明に係る錫またははんだをめ
フぎ被覆銅または銅合金材料は、錫またははんだめっき
の耐熱剥離性が極めて優れており、端子、コネクター等
の電子部品材料として電子機器に組み込んで使用される
場合にその信頼性が同士する。[Effects of the Invention] As explained above, the tin or solder coated copper or copper alloy material according to the present invention has extremely excellent heat peeling resistance of tin or solder plating, and is suitable for use in electronic devices such as terminals and connectors. When incorporated into electronic equipment as a component material, its reliability is comparable.
めっき条件 光沢剤 石原楽品■、Ｉ％ガ品名Plating conditions brightener Ishihara Rakuhin ■, I%ga product name
Claims (3)
．１ｗｔ％以下の錫またははんだを被覆したことを特徴
とする耐熱剥離性に優れた錫またははんだめっき被覆銅
または銅合金材料。(1) The amount of carbon in the plating is 0 on the copper or copper alloy substrate.
．． A tin- or solder-plated copper or copper alloy material having excellent heat-resistant peelability, characterized in that it is coated with 1 wt% or less of tin or solder.
．１％以下の錫またははんだめっきを全体の錫またはは
んだめっきの被覆厚みの１０％以上の厚みで被覆して、
さらにその上に錫またははんだめっきを被覆したことを
特徴とする耐熱剥離性に優れた錫またははんだめっき被
覆銅または銅合金材料。(2) The amount of carbon in the plating is 0 on the copper or copper alloy substrate.
．． Covering 1% or less of tin or solder plating with a thickness of 10% or more of the total coating thickness of tin or solder plating,
A tin or solder plating coated copper or copper alloy material with excellent heat-resistant peelability, characterized in that the material is further coated with tin or solder plating.
ことを特徴とする請求項１または２に記載の耐熱剥離性
に優れた錫またははんだめっき被覆銅または銅合金材料
。(3) The tin- or solder-plated copper or copper alloy material with excellent heat-resistant peelability according to claim 1 or 2, characterized in that a copper base plating is applied on a copper or copper alloy substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30014288A JPH02145793A (en) | 1988-11-28 | 1988-11-28 | Copper or copper alloy material coated with tin or solder plating excellent in thermal peeling resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30014288A JPH02145793A (en) | 1988-11-28 | 1988-11-28 | Copper or copper alloy material coated with tin or solder plating excellent in thermal peeling resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02145793A true JPH02145793A (en) | 1990-06-05 |
Family
ID=17881248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30014288A Pending JPH02145793A (en) | 1988-11-28 | 1988-11-28 | Copper or copper alloy material coated with tin or solder plating excellent in thermal peeling resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02145793A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03197692A (en) * | 1989-12-26 | 1991-08-29 | Kobe Steel Ltd | Copper or copper alloy with bright tin plating |
| JP2004068026A (en) * | 2001-07-31 | 2004-03-04 | Kobe Steel Ltd | Conducting material for connecting parts and manufacturing method therefor |
| JP2007009304A (en) * | 2005-07-04 | 2007-01-18 | Dowa Holdings Co Ltd | Composite plated material, and method for producing the same |
-
1988
- 1988-11-28 JP JP30014288A patent/JPH02145793A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03197692A (en) * | 1989-12-26 | 1991-08-29 | Kobe Steel Ltd | Copper or copper alloy with bright tin plating |
| JP2004068026A (en) * | 2001-07-31 | 2004-03-04 | Kobe Steel Ltd | Conducting material for connecting parts and manufacturing method therefor |
| JP2007009304A (en) * | 2005-07-04 | 2007-01-18 | Dowa Holdings Co Ltd | Composite plated material, and method for producing the same |
| JP4704132B2 (en) * | 2005-07-04 | 2011-06-15 | Ｄｏｗａメタルテック株式会社 | Composite plating material and method for producing the same |
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