CN1154183C - Composite Ag-Sn LED lead frame - Google Patents
Composite Ag-Sn LED lead frame Download PDFInfo
- Publication number
- CN1154183C CN1154183C CNB011066202A CN01106620A CN1154183C CN 1154183 C CN1154183 C CN 1154183C CN B011066202 A CNB011066202 A CN B011066202A CN 01106620 A CN01106620 A CN 01106620A CN 1154183 C CN1154183 C CN 1154183C
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- CN
- China
- Prior art keywords
- film
- thickness
- framework
- led lead
- muscle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 12
- 229910017980 Ag—Sn Inorganic materials 0.000 title claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 54
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 229910052802 copper Inorganic materials 0.000 claims description 36
- 239000010949 copper Substances 0.000 claims description 36
- 210000003205 muscle Anatomy 0.000 claims description 28
- 229910052759 nickel Inorganic materials 0.000 claims description 27
- 238000005516 engineering process Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 238000009827 uniform distribution Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 abstract description 5
- 239000004332 silver Substances 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Led Device Packages (AREA)
Abstract
The present invention discloses the structure of an LED lead frame, particularly a silver-tin composite LED lead frame. The structure has the main structural characteristics that a tin film is used for replacing a silver film used by the original frame at the lower part of a rib in the frame. The structure reduces production cost and enhances the welding property of an LED leading wire.
Description
The present invention relates to a kind of structure of LED lead frame, particularly a kind of compound LED lead frame of silver-colored tin that adopts.
The LED lead frame is intermediate products of making the LED light-emitting component, makes earlier to load onto luminous component at framework upper again behind the framework and promptly can be made into single LED light-emitting component, according to different purposes the LED optical element is used for different places.LED lead frame commonly used is to plate one deck silver again on the copper-plated basis of whole framework, because silver is noble metal, production cost is higher, and the welding performance of silver is relatively poor.
It is low to the purpose of this invention is to provide a kind of production cost, and good welding performance adopts the LED lead frame and the manufacture method thereof of silver-colored tin composite construction.
The object of the present invention is achieved like this: a kind of composite Ag-Sn LED lead frame, comprise technology limit 1, be uniform-distribution with LED lead-in wire 2 on the technology limit 1, on LED lead-in wire 2, be fixed with muscle 3 in the framework, outside whole frame body 8, be coated with copper film 4, being coated with nickel film 5 outside the copper film 4 of muscle 3 away from technology limit 1 one sides in framework, is silverskin 6 outside the nickel film 5, is coated with tin film 7 outside the copper film 4 in framework between muscle 3 and the technology limit 1.
A kind of method of making composite Ag-Sn LED lead frame, make frame body 8 by punching press, frame body 8 comprises muscle 3 and LED lead-in wire 2 in the framework, copper plating film 4 on frame body 8, the thickness of copper film 4 is the 0.5-1.5 micron, and muscle 3 is away from plated nickel film 5 outside the copper film 4 of technology limit 1 one sides in framework then, and the thickness of nickel film 5 is the 1.5-2.5 micron, nickel film 5 outer silver-plated films 6, the thickness of silverskin 6 is the 2.5-3.5 micron; Tin-plated coating film 7 outside the copper film 4 between muscle 3 and the technology limit 1 in framework again, the thickness of tin film 7 is the 3.5-4.5 micron.The thickness of copper film 4 is 1 micron, and the thickness of nickel film 5 is 2 microns, and the thickness of silverskin 6 is 3 microns, and the thickness of tin film 7 is 4 microns.
Composite Ag-Sn LED lead frame provided by the present invention because zinc-plated structure has been adopted in the muscle bottom in framework, has reduced production cost, and the welding performance of tin is better than silver, the welding of being more convenient for.
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is a structural representation of the present invention.
Fig. 2 is the enlarged drawing of the local A of Fig. 1.
The present invention adopts following structure: a kind of composite Ag-Sn LED lead frame, comprise technology limit 1, be uniform-distribution with LED lead-in wire 2 on the technology limit 1, on LED lead-in wire 2, be fixed with muscle 3 in the framework, outside whole frame body 8, be coated with copper film 4, being coated with nickel film 5 outside the copper film 4 of muscle 3 away from technology limit 1 one sides in framework, is silverskin 6 outside the nickel film 5, is coated with tin film 7 outside the copper film 4 in framework between muscle 3 and the technology limit 1.
Manufacture method of the present invention is: a kind of method of making composite Ag-Sn LED lead frame, make frame body 8 by punching press, frame body 8 comprises muscle 3 and LED lead-in wire 2 in the framework, copper plating film 4 on frame body 8, the thickness of copper film 4 is the 0.5-1.5 micron, and muscle 3 is away from plated nickel film 5 outside the copper film 4 of technology limit 1 one sides in framework then, and the thickness of nickel film 5 is the 1.5-2.5 micron, nickel film 5 outer silver-plated films 6, the thickness of silverskin 6 is the 2.5-3.5 micron; Tin-plated coating film 7 outside the copper film 4 between muscle 3 and the technology limit 1 in framework again, the thickness of tin film 7 is the 3.5-4.5 micron.The thickness that best coating film thickness of the present invention is a copper film 4 is 1 micron, and the thickness of nickel film 5 is 2 microns, and the thickness of silverskin 6 is 3 microns, and the thickness of tin film 7 is 4 microns.
Embodiment one: make frame body 8 by punching press, frame body 8 comprises muscle 3 and LED lead-in wire 2 in the framework, copper plating film 4 on frame body 8, the thickness of copper film 4 is 0.5 micron, then in framework muscle 3 away from plated nickel film 5 outside the copper film 4 of technology limit 1 one sides, the thickness of nickel film 5 is 1.5 microns, nickel film 5 outer silver-plated films 6, and the thickness of silverskin 6 is 2.5 microns; Tin-plated coating film 7 outside the copper film between muscle 3 and the technology limit 1 in framework again, the thickness of tin film 7 is 3.5 microns.
Embodiment two: make frame Na 8 by punching press, frame body 8 comprises muscle 3 and LED lead-in wire 2 in the framework, copper plating film 4 on frame body 8, the thickness of copper film 4 is 1.5 microns, then in framework muscle 3 away from plated nickel film 5 outside the copper film 4 of technology limit 1 one sides, the thickness of nickel film 5 is 2.5 microns, nickel film 5 outer silver-plated films 6, and the thickness of silverskin 6 is 3.5 microns; Tin-plated coating film 7 outside the copper film between muscle 3 and the technology limit 1 in framework again, the thickness of tin film 7 is 4.5 microns.
Embodiment three: make frame body 8 by punching press, frame body 8 comprises muscle 3 and LED lead-in wire 2 in the framework, copper plating film 4 on frame body 8, the thickness of copper film 4 is 1 micron, then in framework muscle 3 away from plated nickel film 5 outside the copper film 4 of technology limit 1 one sides, the thickness of nickel film 5 is 2 microns, nickel film 5 outer silver-plated films 6, and the thickness of silverskin 6 is 3 microns; Tin-plated coating film 7 outside the copper film between muscle 3 and the technology limit 1 in framework again, the thickness of tin film 7 is 4 microns.
Claims (3)
1, a kind of composite Ag-Sn LED lead frame, comprise technology limit (1), be uniform-distribution with LED lead-in wire (2) on the technology limit (1), on LED lead-in wire (2), be fixed with muscle in the framework (3), outside whole frame body (8), be coated with copper film (4), it is characterized in that: be coated with nickel film (5) outside the copper film (4) of muscle in framework (3) away from technology limit (1) one side, nickel film (5) is outer to be silverskin (6), is coated with tin film (7) outside the copper film (4) between muscle in framework (3) and technology limit (1).
2, a kind of method of making the described composite Ag-Sn LED lead frame of claim 1, it is characterized in that: make frame body (8) by punching press, frame body (8) comprises muscle in the framework (3) and LED lead-in wire (2), go up copper plating film (4) at frame body (8), the thickness of copper film (4) is the 0.5-1.5 micron, then in framework muscle (3) away from plated nickel film (5) outside the copper film (4) of technology limit (1) one side, the thickness of nickel film (5) is the 1.5-2.5 micron, the outer silver-plated film (6) of nickel film (5), the thickness of silverskin (6) is the 2.5-3.5 micron; Tin-plated coating film (7) outside the copper film (4) between muscle (3) and technology limit (1) in framework again, the thickness of tin film (7) is the 3.5-4.5 micron.
3, the method for manufacturing composite Ag-Sn LED lead frame according to claim 2 is characterized in that: the thickness of copper film (4) is 1 micron, and the thickness of nickel film (5) is 2 microns, and the thickness of silverskin (6) is 3 microns, and the thickness of tin film (7) is 4 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011066202A CN1154183C (en) | 2001-04-11 | 2001-04-11 | Composite Ag-Sn LED lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011066202A CN1154183C (en) | 2001-04-11 | 2001-04-11 | Composite Ag-Sn LED lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1312593A CN1312593A (en) | 2001-09-12 |
| CN1154183C true CN1154183C (en) | 2004-06-16 |
Family
ID=4655610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011066202A Expired - Fee Related CN1154183C (en) | 2001-04-11 | 2001-04-11 | Composite Ag-Sn LED lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1154183C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101344236B (en) * | 2008-09-03 | 2010-06-02 | 湖北匡通电子有限公司 | Short-pitch thin LED lead frame |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102347406B (en) * | 2011-09-30 | 2015-01-14 | 中国电子科技集团公司第四十五研究所 | Fixture for vertical LED (light emitting diode) lead frame |
-
2001
- 2001-04-11 CN CNB011066202A patent/CN1154183C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101344236B (en) * | 2008-09-03 | 2010-06-02 | 湖北匡通电子有限公司 | Short-pitch thin LED lead frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1312593A (en) | 2001-09-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HUBEI KUANGTONG ELECTRONIC CO., LTD. Free format text: FORMER OWNER: PENG HUIYIN Effective date: 20111213 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20111213 Address after: 443600, Hubei County, Zigui province Mao Ping Town East Road Patentee after: Hubei Kuangtong Electronic Co., Ltd. Address before: 443600 Yichang Kuang Tong Electronics Co., Ltd., No. 18, East Road, Xinxian County, Zigui, Hubei Patentee before: Peng Huiyin |
|
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 443600 Zigui City, Yichang province Mao Ping Town, East Road, building Patentee after: Hubei Kuangtong Electronic Co., Ltd. Address before: 443600, Hubei County, Zigui province Mao Ping Town East Road Patentee before: Hubei Kuangtong Electronic Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040616 Termination date: 20170411 |
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| CF01 | Termination of patent right due to non-payment of annual fee |