CN213211752U - Tin whisker-preventing tin-plating copper strip - Google Patents
Tin whisker-preventing tin-plating copper strip Download PDFInfo
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- CN213211752U CN213211752U CN202022770680.9U CN202022770680U CN213211752U CN 213211752 U CN213211752 U CN 213211752U CN 202022770680 U CN202022770680 U CN 202022770680U CN 213211752 U CN213211752 U CN 213211752U
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Abstract
The utility model relates to the technical field of copper strips, in particular to a tin whisker-resistant tin-plated copper strip, which comprises an alloy copper strip formed by extrusion of a ternary alloy copper wire and a tin-plated layer plated on the surface of the alloy copper strip; the alloy copper strip comprises an upper micro-bump and a lower micro-bump, wherein the upper micro-bump is extruded on two sides of the upper surface, the lower micro-bump is extruded on two sides of the lower surface, and the upper micro-bump and the lower micro-bump are arranged oppositely; the tin coating is formed by coating the upper micro-bump and the lower micro-bump; the utility model discloses a copper line extrusion of ternary alloy, the alloy copper strips through ternary alloy extrusion formation to plate on the surface and be equipped with the tin coating, can effectively play anti-tin palpus, especially in the copper strips use, anti-tin palpus is effectual, long service life.
Description
Technical Field
The utility model relates to a copper strips technical field especially relates to a prevent tin palpus tinning copper strips.
Background
The tin plating of the copper strip is widely applied to the production of wires, cables and enameled wires, the tin plating layer is bright silvery white, the weldability and the decoration of copper can be improved, the conductivity is not influenced, and the copper strip can be used in the electronic industry. The tin plating on the surface of the copper strip can greatly improve the corrosion resistance of the copper strip and lead the copper conductor to have the brazing performance, is a basic material in the electronic industry, and is suitable for producing leads of electronic components and jumper wires of circuit boards of the whole machine. With the continuous development of electronic component equipment towards miniaturization, micro-molding and high integration, the electronic packaging technology is developed towards automation and high efficiency, and the performance requirements on products such as tinned copper strips are higher and higher.
When the tin-plated copper strip is applied to electronic elements or electronic packaging, tin whisker phenomenon can occur after a long time, and the tin whisker grows from the surface of a tin coating spontaneously to form a slender tin crystal which has great influence on the use of the electronic elements or electronic packaging, so that the copper strip material is required to be further improved aiming at the tin whisker phenomenon.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides an adopt copper line extrusion of ternary alloy, through the alloy copper strips that ternary alloy extrusion formed to plate on the surface and be equipped with the tin coating, can effectively play anti-tin palpus, especially in the copper strips use, anti-tin palpus is effectual, long service life's anti-tin palpus tin-plated copper strips.
The utility model adopts the technical proposal that: a tin whisker-resistant tin-plated copper strip comprises an alloy copper strip formed by extrusion molding of a ternary alloy copper wire and a tin plating layer plated on the surface of the alloy copper strip; the alloy copper strip comprises an upper micro-bump and a lower micro-bump, wherein the upper micro-bump is extruded on two sides of the upper surface, the lower micro-bump is extruded on two sides of the lower surface, and the upper micro-bump and the lower micro-bump are arranged oppositely; the tin coating coats the upper micro-bump and the lower micro-bump.
The scheme is further improved in that the ternary alloy copper wire is an alloy copper wire of tin, nickel and copper.
The further improvement of the scheme is that the thickness of the alloy copper strip is 0.02 mm-1.0 mm.
The scheme is further improved in that the two sides of the alloy copper strip are integrally extruded to form round corner surfaces.
The scheme is further improved in that the fillet surface is communicated with the upper micro-bump and the lower micro-bump.
The scheme is further improved in that the tin plating layer is a silver-tin mixed layer.
The further improvement of the scheme is that the thickness of the tin plating layer is 0.4-5.0 μm.
The further improvement of the scheme is that the surface of the tinning layer is coated with an antioxidation layer, and the antioxidation layer comprises a galvanizing layer and a chromium plating layer which are sequentially arranged from inside to outside.
The further improvement of the scheme is that the tin-plated layer protrudes outwards to form an outer convex ring, the zinc-plated layer is provided with an inner convex ring, and the inner convex ring and the outer convex ring are arranged at intervals.
The further improvement of the proposal is that the thickness of the galvanized layer is 0.5-2.0 μm; the thickness of the chromium plating layer is 0.6-1.2 μm.
The utility model has the advantages that:
compare traditional tinned copper strips, the utility model discloses a ternary alloy's copper line extrusion, alloy copper strips through ternary alloy extrusion formation to plate on the surface and be equipped with the tin coating, can effectively play anti-tin palpus, especially in the copper strips use, anti-tin palpus is effectual, long service life. Specifically, the method comprises an alloy copper strip formed by extrusion molding of a ternary alloy copper wire and a tin coating plated on the surface of the alloy copper strip; the alloy copper strip comprises an upper micro-bump and a lower micro-bump, wherein the upper micro-bump is extruded on two sides of the upper surface, the lower micro-bump is extruded on two sides of the lower surface, and the upper micro-bump and the lower micro-bump are arranged oppositely; the tin coating coats the upper micro-bump and the lower micro-bump. The upper micro-bump and the lower micro-bump are arranged, so that the welding of the alloy copper strip is more convenient, the tin whisker phenomenon is effectively prevented, and the structure is practical and reliable.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is an enlarged schematic view of a point a in fig. 1.
Description of reference numerals: the alloy copper strip 100, the tin-plated layer 110, the lower micro-bump 120, the fillet surface 130, the antioxidation layer 140, the zinc-plated layer 141, the chromium-plated layer 142, the outer convex ring 143 and the inner convex ring 144.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
As shown in fig. 1-2, a tin whisker resistant tin-plated copper strip includes an alloy copper strip 100 formed by extrusion molding of a ternary alloy copper wire, and a tin-plated layer 110 plated on the surface of the alloy copper strip 100; the alloy copper strip 100 comprises an upper micro-bump 110 formed by extrusion molding on two sides of the upper surface, and a lower micro-bump 120 formed by extrusion molding on two sides of the lower surface, wherein the upper micro-bump 110 and the lower micro-bump 120 are arranged oppositely; the tin-plated layer 110 covers the upper micro-bump 110 and the lower micro-bump 120.
The ternary alloy copper wire is an alloy copper wire of tin, nickel and copper, and the alloy of tin, nickel and copper is adopted, so that the adhesion effect is better when the surface is plated with tin, the integration of the tin and the nickel is better, and the tin whisker phenomenon is effectively prevented.
The thickness of the alloy copper strip 100 is 0.02 mm-1.0 mm, and the alloy copper strip is selected according to the use environment, is convenient to use, and has a simple and reliable structure.
The rounded surface 130 is connected to the upper micro bumps 110 and the lower micro bumps 120, so as to support and improve the protection effect, and improve the tin whisker prevention effect.
The tin-plated layer 110 is a silver-tin mixed layer, and the silver-tin mixing is adopted, so that the adhesion effect of the tin-plated layer 110 is improved, and the tin whisker phenomenon is prevented.
The tin-plated layer 110 has a thickness of 0.4 to 5.0. mu.m, preferably 0.5 to 2.0. mu.m, and can sufficiently improve the adhesion effect and the tin whisker prevention effect.
The tin-plated layer 110 is coated with an antioxidation layer 140 on the surface, wherein the antioxidation layer 140 comprises a zinc-plated layer 141 and a chromium-plated layer 142 which are arranged in sequence from inside to outside; in a further improvement, an outer convex ring 143 protrudes outwards from the tin-plated layer 110, the zinc-plated layer 141 is provided with an inner convex ring 144, and the inner convex ring 144 and the outer convex ring 143 are arranged at intervals; the thickness of the zinc coating 141 is 0.5-2.0 μm; the inner convex ring 144 is integrally formed on the galvanized layer 141, and has the matching of the outer convex ring 143 and the inner convex ring 144, so that the contact area of the two is increased, and the stability can be effectively improved.
The thickness of the chromium coating 142 is 0.6-1.2 μm; preferably 0.8 to 2.0. mu.m, and can sufficiently exert a protective effect without causing interference with the conductor.
The utility model discloses a copper line extrusion of ternary alloy, alloy copper strips 100 through the extrusion of ternary alloy formation to plate on the surface and be equipped with tin coating 110, can effectively play anti-tin palpus, especially in the copper strips use, anti-tin palpus is effectual, long service life. Specifically, the alloy copper strip comprises an alloy copper strip 100 formed by extrusion molding of a ternary alloy copper wire and a tin coating 110 plated on the surface of the alloy copper strip 100; the alloy copper strip 100 comprises an upper micro-bump 110 formed by extrusion molding on two sides of the upper surface, and a lower micro-bump 120 formed by extrusion molding on two sides of the lower surface, wherein the upper micro-bump 110 and the lower micro-bump 120 are arranged oppositely; the tin-plated layer 110 covers the upper micro-bump 110 and the lower micro-bump 120. The upper micro-bump 110 and the lower micro-bump 120 are arranged, so that the alloy copper strip 100 is more convenient to weld and use, the tin whisker phenomenon is effectively prevented, and the structure is practical and reliable.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a prevent tin palpus tin-plating copper strips which characterized in that: the alloy copper strip is formed by extruding a ternary alloy copper wire, and a tin coating is plated on the surface of the alloy copper strip; the alloy copper strip comprises an upper micro-bump and a lower micro-bump, wherein the upper micro-bump is extruded on two sides of the upper surface, the lower micro-bump is extruded on two sides of the lower surface, and the upper micro-bump and the lower micro-bump are arranged oppositely; the tin coating coats the upper micro-bump and the lower micro-bump.
2. The tin whisker resistant tin-plated copper strip of claim 1, characterized in that: the ternary alloy copper wire is an alloy copper wire of tin, nickel and copper.
3. The tin whisker resistant tin-plated copper strip of claim 1, characterized in that: the thickness of the alloy copper strip is 0.02 mm-1.0 mm.
4. The tin whisker resistant tin-plated copper strip of claim 1, characterized in that: and fillet surfaces are integrally extruded and formed on the two sides of the alloy copper strip.
5. The tin whisker resistant tin-plated copper strip of claim 4, wherein: the fillet surface is communicated with the upper micro-bump and the lower micro-bump.
6. The tin whisker resistant tin-plated copper strip of claim 1, characterized in that: the tin coating is a silver-tin mixed layer.
7. The tin whisker resistant tin-plated copper strip of claim 1, characterized in that: the thickness of the tin plating layer is 0.4-5.0 μm.
8. The tin whisker resistant tin-plated copper strip of claim 1, characterized in that: the tin-plated layer is coated with an antioxidation layer, and the antioxidation layer comprises a zinc-plated layer and a chromium-plated layer which are sequentially arranged from inside to outside.
9. The tin whisker resistant tin-plated copper strip of claim 8, wherein: the tin-plated layer is provided with an outward convex ring in a protruding mode, the zinc-plated layer is provided with an inward convex ring, and the inward convex ring and the outward convex ring are arranged at intervals.
10. The tin whisker resistant tin-plated copper strip of claim 9, wherein: the thickness of the galvanized layer is 0.5-2.0 μm; the thickness of the chromium plating layer is 0.6-1.2 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022770680.9U CN213211752U (en) | 2020-11-25 | 2020-11-25 | Tin whisker-preventing tin-plating copper strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022770680.9U CN213211752U (en) | 2020-11-25 | 2020-11-25 | Tin whisker-preventing tin-plating copper strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213211752U true CN213211752U (en) | 2021-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022770680.9U Active CN213211752U (en) | 2020-11-25 | 2020-11-25 | Tin whisker-preventing tin-plating copper strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213211752U (en) |
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