CN110401056A - Corrosion-resistant coating for electronic equipment interface - Google Patents
Corrosion-resistant coating for electronic equipment interface Download PDFInfo
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- CN110401056A CN110401056A CN201910726258.2A CN201910726258A CN110401056A CN 110401056 A CN110401056 A CN 110401056A CN 201910726258 A CN201910726258 A CN 201910726258A CN 110401056 A CN110401056 A CN 110401056A
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- 238000000576 coating method Methods 0.000 title claims abstract description 90
- 239000011248 coating agent Substances 0.000 title claims abstract description 78
- 238000005260 corrosion Methods 0.000 title claims abstract description 57
- 230000007797 corrosion Effects 0.000 title claims abstract description 55
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052709 silver Inorganic materials 0.000 claims abstract description 20
- 239000004332 silver Substances 0.000 claims abstract description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 claims abstract description 19
- 239000010931 gold Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 125
- 238000007747 plating Methods 0.000 claims description 26
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 14
- 239000011247 coating layer Substances 0.000 claims description 14
- 229910052707 ruthenium Inorganic materials 0.000 claims description 14
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000009713 electroplating Methods 0.000 abstract description 10
- 230000003647 oxidation Effects 0.000 abstract description 9
- 238000007254 oxidation reaction Methods 0.000 abstract description 9
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
本发明涉及电镀技术领域，尤指一种用于电子设备接口的耐腐蚀镀层，包括电镀于基材表面的基底镀层，基底镀层为用以提高基材耐腐蚀性能的镀镍钨层，镍钨镀层的表面依次电镀有用于改善相邻镀层粘接性的预镀层、用以提高基材耐腐蚀性能及导电性能的第一镀银层、用于改善相邻镀层粘接性的第二镀金层、用于提高基材耐腐蚀性及耐磨性的第三镀铑钌层和用于改善基材焊接性能的第四镀金层。由以上镀层组合的镀层结构具有较好的耐磨性、抗氧化、导电性以及腐蚀性，并且电镀镀层与基材材料之间的粘合性好，还改善了基材焊接性能。
The present invention relates to the field of electroplating technology, and in particular to a corrosion-resistant coating for an electronic device interface, comprising a base coating electroplated on the surface of a substrate, the base coating being a nickel-tungsten coating for improving the corrosion resistance of the substrate, the surface of the nickel-tungsten coating being electroplated with a pre-coating for improving the adhesion of adjacent coatings, a first silver coating for improving the corrosion resistance and electrical conductivity of the substrate, a second gold coating for improving the adhesion of adjacent coatings, a third rhodium-ruthenium coating for improving the corrosion resistance and wear resistance of the substrate, and a fourth gold coating for improving the welding performance of the substrate. The coating structure composed of the above coatings has good wear resistance, oxidation resistance, electrical conductivity and corrosion resistance, and the adhesion between the electroplated coating and the substrate material is good, and the welding performance of the substrate is also improved.
Description
技术领域technical field
本发明涉及电镀技术领域，尤指一种用于电子设备接口的耐腐蚀镀层。The invention relates to the technical field of electroplating, in particular to a corrosion-resistant coating for an interface of an electronic device.
背景技术Background technique
随着电子产品的普及，电子产品的应用越来越广泛，电子产品在使用过程中，电子接口经常出现插拔，对于插拔频率较高的电子接口，其磨损性较大，磨损的地方容易被氧化和腐蚀，经常出现电接触不良，为了提高耐磨性和抗腐蚀氧化性，目前很多电子接口的端子都电镀有电镀镀层，电镀镀层中一般包含有一层耐磨层和抗氧化腐蚀层，由于镀层的厚度有限，否则厚度过大造成内应力较大，容易脱落；因此端子的耐磨性、抗腐蚀性不够；若镀层的厚度过厚，其导电性能将会降低；除此之外，有些电镀镀层忽略了与基底材料的结合性，电镀之后，电镀镀层与基材材料之间的粘合性较差，导致后期使用时电镀层脱落，严重的话还会影响电子接口与线路板之间的焊接关系而致使电子接口脱落。With the popularization of electronic products, the application of electronic products is becoming more and more extensive. During the use of electronic products, the electronic interface is often plugged and unplugged. Being oxidized and corroded, poor electrical contact often occurs. In order to improve wear resistance and corrosion resistance, many electronic interface terminals are electroplated with electroplating coatings. Electroplating coatings generally include a wear-resistant layer and an anti-oxidation corrosion layer. Due to the limited thickness of the coating, otherwise the excessive thickness will cause large internal stress and easy to fall off; therefore, the wear resistance and corrosion resistance of the terminal are not enough; if the thickness of the coating is too thick, its electrical conductivity will be reduced; in addition, Some electroplating coatings ignore the combination with the base material. After electroplating, the adhesion between the electroplating coating and the base material is poor, which will cause the electroplating layer to fall off during later use. In severe cases, it will also affect the electronic interface and the circuit board. The soldering relationship caused the electronic interface to fall off.
发明内容Contents of the invention
为解决上述问题，本发明提供一种用于电子设备接口的耐腐蚀镀层，该镀层具有较好的耐磨性、抗氧化、导电性以及腐蚀性，并且电镀镀层与基材材料之间的粘合性和焊接性能较好。In order to solve the above problems, the present invention provides a corrosion-resistant coating for the interface of electronic equipment. The coating has good wear resistance, oxidation resistance, electrical conductivity and corrosion resistance, and the adhesion between the electroplating coating and the base material Good compatibility and welding performance.
为实现上述目的，本发明采用的技术方案是提供一种用于电子设备接口的耐腐蚀镀层，包括电镀于基材表面的基底镀层，所述基底镀层为用以提高基材耐腐蚀性能的镀镍钨层，所述镍钨镀层的表面依次电镀有用于改善相邻镀层粘接性的预镀层、用以提高基材耐腐蚀性能及导电性能的第一镀银层、用于改善相邻镀层粘接性的第二镀金层、用于提高基材耐腐蚀性及耐磨性的第三镀铑钌层和用于改善基材焊接性能的第四镀金层。In order to achieve the above object, the technical solution adopted by the present invention is to provide a corrosion-resistant coating for the interface of electronic equipment, including a base coating electroplated on the surface of the substrate, and the base coating is a coating for improving the corrosion resistance of the substrate. Nickel-tungsten layer, the surface of the nickel-tungsten coating is sequentially electroplated with a pre-plating layer for improving the adhesion of adjacent coatings, a first silver coating for improving the corrosion resistance and electrical conductivity of the substrate, and a first silver coating for improving the adhesion of adjacent coatings. The second gold-plated layer for adhesion, the third rhodium-ruthenium-plated layer for improving the corrosion resistance and wear resistance of the base material, and the fourth gold-plated layer for improving the welding performance of the base material.
作为一种优选方案，所述镀镍钨层的厚度为0.5至5微米。As a preferred solution, the nickel-tungsten-plated layer has a thickness of 0.5 to 5 microns.
作为一种优选方案，所述预镀层的厚度为0.025至0.25微米。As a preferred solution, the thickness of the pre-plating layer is 0.025 to 0.25 microns.
作为一种优选方案，所述第一镀银层的厚度为0.5至6微米。As a preferred solution, the thickness of the first silver plating layer is 0.5 to 6 microns.
作为一种优选方案，所述第二镀金层的厚度为0.025至0.5微米。As a preferred solution, the second gold-plated layer has a thickness of 0.025 to 0.5 microns.
作为一种优选方案，所述第三镀铑钌层的厚度为0.25至4微米。As a preferred solution, the third rhodium-plated ruthenium layer has a thickness of 0.25 to 4 microns.
作为一种优选方案，所述第四镀金层的厚度为0.025至0.25微米。As a preferred solution, the fourth gold-plated layer has a thickness of 0.025 to 0.25 microns.
作为一种优选方案，所述预镀层为镀金层或镀银层中的一种。As a preferred solution, the pre-plating layer is one of a gold-plated layer or a silver-plated layer.
本发明的有益效果在于：The beneficial effects of the present invention are:
本发明通过电子接口的基材表面上依次电镀有镀镍钨层、预镀层、第一镀银层、第二镀金层、第三镀铑钌层和第四镀金层，以上镀层组合的镀层结构具有较好的耐磨性、抗氧化、导电性以及腐蚀性，并且电镀镀层与基材材料之间的粘合性和焊接性能较好。In the present invention, a nickel-tungsten layer, a pre-plated layer, a first silver-plated layer, a second gold-plated layer, a third rhodium-ruthenium-plated layer and a fourth gold-plated layer are sequentially electroplated on the surface of the base material of the electronic interface, and the coating structure of the combination of the above coating layers It has good wear resistance, oxidation resistance, electrical conductivity and corrosion resistance, and the adhesion and welding performance between the electroplating coating and the base material are good.
其中，由于目前的电子接口一般采用铜材料，采用镀镍钨层作为基底镀层，可以和铜有较好的粘合，提高平整度；其次，镀镍钨层具有耐高温、耐腐蚀性能、抗氧化性，热膨胀系数低，可避免电子接口频繁插拔摩擦带来损伤或变形；另外镀镍钨层可以将电子接口的表面进行整平，提高平整度，增加电子接口表面的美观；而第一镀银层由于其导电性能良好、成本便宜，可以在做电解测试的时候起到缓冲的作用，增加耐腐蚀时间；除此之外，第三镀铑钌层具有高硬度、耐磨损、耐化学腐蚀的特性，用以提高电子接口表面的抗氧化腐蚀性，即使电子接口有部分磨损，仍然避免大面积的氧化或腐蚀，保证电接触性，使产品的镀层耐插拔次数增多，延长电子接口使用寿命，提高镀层使用寿命及充电效率，达到更实用的目的；通过镀镍钨层、第一镀银层与第三镀铑钌层这三个镀层，大大提高了镀层结构的耐腐蚀性能；Among them, since the current electronic interface generally uses copper materials, the nickel-plated tungsten layer is used as the base coating, which can have better adhesion with copper and improve the flatness; secondly, the nickel-plated tungsten layer has high temperature resistance, corrosion resistance, and anti-corrosion Oxidation and low coefficient of thermal expansion can avoid damage or deformation caused by frequent plugging and friction of electronic interfaces; in addition, nickel-tungsten plating can level the surface of electronic interfaces, improve flatness, and increase the appearance of electronic interface surfaces; and the first Because of its good conductivity and low cost, the silver-plated layer can play a buffer role in the electrolytic test and increase the corrosion resistance time; in addition, the third rhodium-plated ruthenium layer has high hardness, wear resistance, and corrosion resistance. The characteristics of chemical corrosion are used to improve the oxidation and corrosion resistance of the surface of the electronic interface. Even if the electronic interface is partially worn, it can still avoid large-scale oxidation or corrosion, ensure electrical contact, increase the plug-in resistance of the product's coating, and prolong the electronic life. The service life of the interface improves the service life and charging efficiency of the coating to achieve a more practical purpose; the corrosion resistance of the coating structure is greatly improved through the three coatings of nickel-tungsten coating, the first silver coating and the third rhodium-ruthenium coating ;
其次，预镀层与第二镀金层用以提高相邻镀层的结合力，由于金材料或银材料具有较好的延展性，因此可以减小相邻镀层连接处的内应力，进而提高粘合力；Secondly, the pre-plating layer and the second gold-plated layer are used to improve the bonding force of adjacent plating layers. Since gold or silver materials have good ductility, it can reduce the internal stress at the junction of adjacent plating layers, thereby improving the adhesion ;
最后，最外层的第四镀金层，由于金材料具有较低的接触电阻，并且其导电性能良好、易于焊接、耐腐蚀性强、并具有一定的耐磨性，因而可以提高电子接口的焊接性能和导电性能。Finally, the fourth gold-plated layer on the outermost layer, because the gold material has low contact resistance, good electrical conductivity, easy welding, strong corrosion resistance, and certain wear resistance, it can improve the soldering of electronic interfaces. performance and conductivity.
附图说明Description of drawings
图1是本发明的结构示意图。Fig. 1 is a schematic structural view of the present invention.
附图标号说明：1-镀镍钨层；2-预镀层；3-第一镀银层；4-第二镀金层；5-第三镀铑钌层；6-第四镀金层。Description of reference numerals: 1-nickel-tungsten plating layer; 2-pre-plating layer; 3-first silver plating layer; 4-second gold plating layer; 5-third rhodium-ruthenium plating layer; 6-fourth gold plating layer.
具体实施方式Detailed ways
下面结合具体实施例和说明书附图对本发明予以详细说明。The present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.
请参阅图1所示，本发明关于一种用于电子设备接口的耐腐蚀镀层，包括电镀于基材表面的基底镀层，所述基底镀层为用以提高基材耐腐蚀性能的镀镍钨层1，所述镀镍钨层1的表面依次电镀有用于改善相邻镀层粘接性的预镀层2、用以提高基材耐腐蚀性能及导电性能的第一镀银层3、用于改善相邻镀层粘接性的第二镀金层4、用于提高基材耐腐蚀性及耐磨性的第三镀铑钌层5和用于改善基材焊接性能的第四镀金层6；其中，所述镀镍钨层1的厚度为0.5至5微米，所述预镀层2的厚度为0.025至0.25微米，所述第一镀银层3的厚度为0.5至6微米，所述第二镀金层4的厚度为0.025至0.5微米，所述第三镀铑钌层5的厚度为0.25至4微米，所述第四镀金层6的厚度为0.025至0.25微米，所述预镀层2为镀金层或镀银层中的一种。Please refer to Fig. 1, the present invention relates to a corrosion-resistant coating for an interface of electronic equipment, including a base coating electroplated on the surface of a substrate, and the base coating is a nickel-tungsten coating for improving the corrosion resistance of the base material 1. The surface of the nickel-tungsten-plated layer 1 is sequentially electroplated with a pre-plating layer 2 for improving the adhesion of adjacent coating layers, a first silver-plated layer 3 for improving the corrosion resistance and electrical conductivity of the substrate, and a first silver-plated layer 3 for improving the phase Adjacent to the second gold-plated layer 4 of coating adhesion, the third rhodium-plated ruthenium layer 5 for improving the corrosion resistance and wear resistance of the base material and the fourth gold-plated layer 6 for improving the welding performance of the base material; wherein, the The thickness of the nickel-tungsten layer 1 is 0.5 to 5 microns, the thickness of the pre-plating layer 2 is 0.025 to 0.25 microns, the thickness of the first silver plating layer 3 is 0.5 to 6 microns, and the second gold plating layer 4 The thickness is 0.025 to 0.5 microns, the thickness of the third rhodium-plated ruthenium layer 5 is 0.25 to 4 microns, the thickness of the fourth gold-plated layer 6 is 0.025 to 0.25 microns, and the pre-plating layer 2 is a gold-plated layer or One of the silver layers.
本发明通过电子接口的基材表面上依次电镀有镀镍钨层1、预镀层2、第一镀银层3、第二镀金层4、第三镀铑钌层5和第四镀金层6。其中，由于目前的电子接口一般采用铜材料，采用镀镍钨层1作为基底镀层，可以和铜有较好的粘合，提高平整度；其次，镀镍钨层1具有耐高温、耐腐蚀性能、抗氧化性，热膨胀系数低，可避免电子接口频繁插拔摩擦带来损伤或变形；另外镀镍钨层1可以将电子接口的表面进行整平，提高平整度，增加电子接口表面的美观；而第一镀银层3由于其导电性能良好、成本便宜，可以在做电解测试的时候起到缓冲的作用，增加耐腐蚀时间；除此之外，第三镀铑钌层5具有高硬度、耐磨损、耐化学腐蚀的特性，用以提高电子接口表面的抗氧化腐蚀性，即使电子接口有部分磨损，仍然避免大面积的氧化或腐蚀，保证电接触性，使产品的镀层耐插拔次数增多，延长电子接口使用寿命，提高镀层使用寿命及充电效率，达到更实用的目的；通过镀镍钨层1、第一镀银层3与第三镀铑钌层5这三个镀层，大大提高了镀层结构的耐腐蚀性能；In the present invention, a nickel-tungsten-plated layer 1, a pre-plated layer 2, a first silver-plated layer 3, a second gold-plated layer 4, a third rhodium-ruthenium-plated layer 5 and a fourth gold-plated layer 6 are sequentially electroplated on the substrate surface of the electronic interface. Among them, since the current electronic interface generally uses copper material, the nickel-plated tungsten layer 1 is used as the base coating layer, which can have better adhesion with copper and improve the flatness; secondly, the nickel-plated tungsten layer 1 has high temperature resistance and corrosion resistance. , Oxidation resistance, low thermal expansion coefficient, which can avoid damage or deformation caused by frequent plugging and pulling friction of the electronic interface; in addition, the nickel-tungsten layer 1 can level the surface of the electronic interface, improve the flatness, and increase the appearance of the electronic interface surface; And the first silver-plated layer 3 can play a buffering effect when doing the electrolytic test because of its good electrical conductivity and low cost, so as to increase the corrosion resistance time; in addition, the third rhodium-plated ruthenium layer 5 has high hardness, Wear resistance and chemical corrosion resistance are used to improve the oxidation and corrosion resistance of the surface of the electronic interface. Even if the electronic interface is partially worn, it still avoids a large area of oxidation or corrosion, ensures electrical contact, and makes the coating of the product resistant to plugging and unplugging The number of times is increased to prolong the service life of the electronic interface, improve the service life and charging efficiency of the coating, and achieve a more practical purpose; through the three coatings of the nickel-tungsten layer 1, the first silver-plated layer 3 and the third rhodium-plated ruthenium layer 5, greatly Improve the corrosion resistance of the coating structure;
其次，预镀层2与第二镀金层4用以提高相邻镀层的结合力，由于金材料或银材料具有较好的延展性，因此可以减小相邻镀层连接处的内应力，进而提高粘合力；最后，最外层的第四镀金层6，由于金材料具有较低的接触电阻，并且其导电性能良好、易于焊接、耐腐蚀性强、并具有一定的耐磨性，因而可以提高电子接口的焊接性能和导电性能。Secondly, the pre-plating layer 2 and the second gold-plated layer 4 are used to improve the bonding force of adjacent plating layers. Since gold or silver materials have good ductility, the internal stress at the junction of adjacent plating layers can be reduced, thereby improving the adhesion. resultant force; finally, the fourth gold-plated layer 6 of the outermost layer, because the gold material has lower contact resistance, and its electrical conductivity is good, is easy to weld, and corrosion resistance is strong, and has certain wear resistance, thereby can improve Solderability and conductivity of electronic interfaces.
下面通过具体的实施例对本发明作进一步说明。The present invention will be further described below by specific examples.
实施例1Example 1
本实施例提供了一种用于电子设备接口的耐腐蚀镀层，包括依次电镀于基材表面的镀镍钨层1、镀金层、第一镀银层3、第二镀金层4、第三镀铑钌层5和第四镀金层6，所述镀镍钨层1的厚度为0.5微米，所述镀金层的厚度为0.025微米，所述第一镀银层3的厚度为0.5微米，所述第二镀金层4的厚度为0.025微米，所述第三镀铑钌层5的厚度为0.25微米，所述第四镀金层6的厚度为0.025微米。This embodiment provides a corrosion-resistant coating for an interface of an electronic device, comprising a nickel-tungsten coating layer 1, a gold coating layer, a first silver coating layer 3, a second gold coating layer 4, a third coating layer, and Rhodium ruthenium layer 5 and the fourth gold-plated layer 6, the thickness of described nickel-tungsten layer 1 is 0.5 micron, the thickness of described gold-plated layer is 0.025 micron, the thickness of described first silver-plated layer 3 is 0.5 micron, described The thickness of the second gold-plated layer 4 is 0.025 microns, the thickness of the third rhodium-plated ruthenium layer 5 is 0.25 microns, and the thickness of the fourth gold-plated layer 6 is 0.025 microns.
实施例2Example 2
本实施例提供了一种用于电子设备接口的耐腐蚀镀层，包括依次电镀于基材表面的镀镍钨层1、镀金层、第一镀银层3、第二镀金层4、第三镀铑钌层5和第四镀金层6，所述镀镍钨层1的厚度为5微米，所述镀金层的厚度为0.25微米，所述第一镀银层3的厚度为6微米，所述第二镀金层4的厚度为0.5微米，所述第三镀铑钌层5的厚度为4微米，所述第四镀金层6的厚度为0.25微米。This embodiment provides a corrosion-resistant coating for an interface of an electronic device, comprising a nickel-tungsten coating layer 1, a gold coating layer, a first silver coating layer 3, a second gold coating layer 4, a third coating layer, and Rhodium ruthenium layer 5 and the fourth gold-plated layer 6, the thickness of described nickel-tungsten layer 1 is 5 microns, the thickness of described gold-plated layer is 0.25 microns, the thickness of described first silver-plated layer 3 is 6 microns, described The thickness of the second gold-plated layer 4 is 0.5 microns, the thickness of the third rhodium-plated ruthenium layer 5 is 4 microns, and the thickness of the fourth gold-plated layer 6 is 0.25 microns.
实施例1和实施例2的预镀层2选用了镀金层，确保镀金层的结合力，增强耐磨性与防腐能力，相比于镀银层，成本虽然高，但是效果却更佳。另外，实施例1提供了一种超薄的耐腐蚀性镀层，而实施例2提供了一种超厚的耐腐蚀性镀层。The pre-plating layer 2 of embodiment 1 and embodiment 2 selects the gold-plated layer to ensure the bonding force of the gold-plated layer and enhance the wear resistance and anti-corrosion ability. Compared with the silver-plated layer, although the cost is high, the effect is better. Additionally, Example 1 provides an ultra-thin corrosion-resistant coating, while Example 2 provides an ultra-thick corrosion-resistant coating.
实施例3Example 3
本实施例提供了一种用于电子设备接口的耐腐蚀镀层，包括依次电镀于基材表面的镀镍钨层1、镀银层、第一镀银层3、第二镀金层4、第三镀铑钌层5和第四镀金层6，所述镀镍钨层1的厚度为0.5微米，所述镀银层的厚度为0.025微米，所述第一镀银层3的厚度为0.5微米，所述第二镀金层4的厚度为0.025微米，所述第三镀铑钌层5的厚度为0.25微米，所述第四镀金层6的厚度为0.025微米。This embodiment provides a corrosion-resistant coating for an interface of an electronic device, comprising a nickel-tungsten coating 1, a silver coating, a first silver coating 3, a second gold coating 4, a third Rhodium-plated ruthenium layer 5 and the fourth gold-plated layer 6, the thickness of described nickel-tungsten layer 1 is 0.5 micron, the thickness of described silver-plated layer is 0.025 micron, the thickness of described first silver-plated layer 3 is 0.5 micron, The thickness of the second gold-plated layer 4 is 0.025 microns, the thickness of the third rhodium-plated ruthenium layer 5 is 0.25 microns, and the thickness of the fourth gold-plated layer 6 is 0.025 microns.
实施例4Example 4
本实施例提供了一种用于电子设备接口的耐腐蚀镀层，包括依次电镀于基材表面的镀镍钨层1、镀银层、第一镀银层3、第二镀金层4、第三镀铑钌层5和第四镀金层6，所述镀镍钨层1的厚度为5微米，所述镀银层的厚度为0.25微米，所述第一镀银层3的厚度为6微米，所述第二镀金层4的厚度为0.5微米，所述第三镀铑钌层5的厚度为4微米，所述第四镀金层6的厚度为0.25微米。This embodiment provides a corrosion-resistant coating for an interface of an electronic device, comprising a nickel-tungsten coating 1, a silver coating, a first silver coating 3, a second gold coating 4, a third The rhodium-plated ruthenium layer 5 and the fourth gold-plated layer 6, the thickness of the nickel-tungsten layer 1 is 5 microns, the thickness of the silver-plated layer is 0.25 microns, and the thickness of the first silver-plated layer 3 is 6 microns, The thickness of the second gold-plated layer 4 is 0.5 microns, the thickness of the third rhodium-plated ruthenium layer 5 is 4 microns, and the thickness of the fourth gold-plated layer 6 is 0.25 microns.
实施例3和实施例4的预镀层2选用了镀银层，防止镀镍钨层置换银层，从而增强镀镍钨层与其他镀层之间结合力，并且银相较于金的成本更低。另外，实施例3提供了一种超薄、低成本的耐腐蚀性镀层，而实施例4提供了一种超厚、低成本的耐腐蚀性镀层。The pre-plating layer 2 of embodiment 3 and embodiment 4 selects the silver-plated layer to prevent the nickel-tungsten layer from replacing the silver layer, thereby enhancing the bonding force between the nickel-plated tungsten layer and other plating layers, and the cost of silver is lower than that of gold . In addition, Example 3 provides an ultra-thin, low-cost corrosion-resistant coating, while Example 4 provides an ultra-thick, low-cost corrosion-resistant coating.
以上实施方式仅仅是对本发明的优选实施方式进行描述，并非对本发明的范围进行限定，在不脱离本发明设计精神的前提下，本领域普通工程技术人员对本发明的技术方案作出的各种变形和改进，均应落入本发明的权利要求书确定的保护范围内。The above embodiments are only descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and modifications made by ordinary engineers and technicians in the field to the technical solutions of the present invention Improvements should all fall within the scope of protection determined by the claims of the present invention.
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Application publication date: 20191101 |