CN216450837U - Electroplated layer for improving corrosion resistance of wiring port of electronic product - Google Patents
Electroplated layer for improving corrosion resistance of wiring port of electronic product Download PDFInfo
- Publication number
- CN216450837U CN216450837U CN202122963398.7U CN202122963398U CN216450837U CN 216450837 U CN216450837 U CN 216450837U CN 202122963398 U CN202122963398 U CN 202122963398U CN 216450837 U CN216450837 U CN 216450837U
- Authority
- CN
- China
- Prior art keywords
- layer
- corrosion
- electronic product
- electroplated
- resistant composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to the technical field of electroplating, in particular to an electroplated layer for improving the corrosion resistance of an electronic product wiring port, which comprises a nickel-tungsten layer electroplated on the surface of an electronic product wiring port substrate, wherein a first corrosion-resistant composite layer and a second corrosion-resistant composite layer are sequentially electroplated on one side of the nickel-tungsten layer, which is far away from the electronic product wiring port substrate, and a palladium-nickel layer is electroplated between the first corrosion-resistant composite layer and the second corrosion-resistant composite layer. The integral plating combination is not easy to fall off, corrosion resistant, wear resistant and long in service life.
Description
Technical Field
The utility model relates to the technical field of electroplating, in particular to an electroplated layer for improving the corrosion resistance of a wiring port of an electronic product.
Background
Along with the popularization of electronic products, the application of the electronic products is more and more extensive, the electronic interfaces are frequently plugged and unplugged in the using process of the electronic products, the electronic interfaces with higher plugging frequency have higher wearability, worn places are easily oxidized and corroded, poor electric contact often occurs, and in order to improve the wearability and the corrosion and oxidation resistance, the terminals of a plurality of electronic interfaces are electroplated with electroplating layers at present.
The electroplating coating in the prior art adopts limited coating thickness to prevent the problem that the coating is too thick and easy to fall off, and the structural design is not reasonable enough, so that the wear resistance and corrosion resistance of the coating are not enough, and the use requirement cannot be met.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model provides an electroplated layer for improving the corrosion resistance of a wiring port of an electronic product, which has the advantages of simple structure, reasonable design, good corrosion resistance and difficult shedding.
The technical scheme adopted by the utility model is as follows:
the utility model provides an electroplate layer for improving electronic product wiring mouth corrosion resisting property, includes the nickel tungsten layer of electroplating in electronic product wiring mouth substrate surface, one side that electronic product wiring mouth substrate was kept away from on nickel tungsten layer is electroplated in proper order and is provided with first corrosion-resistant composite bed and second corrosion-resistant composite bed, first corrosion-resistant composite bed with electroplate between the second corrosion-resistant composite bed and be provided with the palladium nickel layer.
The technical scheme is further improved in that the first corrosion-resistant composite layer and the second corrosion-resistant composite layer are respectively composed of a first gold-plated layer, a platinum-plated layer and a second gold-plated layer which are sequentially arranged.
The further improvement of the technical proposal is that the thicknesses of the first gold-plating layer and the second gold-plating layer are respectively set to be 0.025-0.5 um.
The further improvement of the technical proposal is that the thickness of the platinum plating layer is set to be 0.1-3 um.
The further improvement of the technical proposal is that the thickness of the nickel-tungsten layer is set to be 0.5-4 um.
The technical proposal is further improved in that the thickness of the palladium nickel layer is set to be 0.1-2.5 um.
The utility model has the following beneficial effects:
the utility model comprises a nickel-tungsten layer electroplated on the surface of a base material of a wiring port of an electronic product, wherein a first corrosion-resistant composite layer and a second corrosion-resistant composite layer are sequentially electroplated on one side of the nickel-tungsten layer, which is far away from the base material of the wiring port of the electronic product, and a palladium-nickel layer is electroplated between the first corrosion-resistant composite layer and the second corrosion-resistant composite layer.
Drawings
FIG. 1 is a schematic structural view of the present invention;
description of reference numerals: 1. the corrosion-resistant composite coating comprises a nickel-tungsten layer, 2 parts of a first corrosion-resistant composite layer, 21 parts of a first gold plating layer, 22 parts of a platinum plating layer, 23 parts of a second gold plating layer, 3 parts of a palladium-nickel layer and 4 parts of a second corrosion-resistant composite layer.
Detailed Description
The utility model will be further described with reference to the accompanying drawings.
As shown in fig. 1, the electroplated layer for improving corrosion resistance of the wiring port of the electronic product in the embodiment includes a nickel-tungsten layer 1 electroplated on the surface of the substrate of the wiring port of the electronic product, a first corrosion-resistant composite layer 2 and a second corrosion-resistant composite layer 4 are sequentially electroplated on one side of the nickel-tungsten layer 1 away from the substrate of the wiring port of the electronic product, and a palladium-nickel layer 3 is electroplated between the first corrosion-resistant composite layer 2 and the second corrosion-resistant composite layer 4, the utility model has simple structure and reasonable design, the hardness of the plated layer is improved by the arrangement of the nickel-tungsten layer 1, the plated layer has excellent corrosion resistance by the combined arrangement of the first corrosion-resistant composite layer 2 and the second corrosion-resistant composite layer 4, the porosity of the plated layer is reduced, the weldability, the ductility and the internal stress of the plated layer are improved, the overall stability of the electroplated layer is improved, and the occurrence of partial falling of the electroplated layer is effectively avoided, by adopting the integral plating combination, the coating is not easy to fall off, is corrosion-resistant and wear-resistant and has long service life.
In some embodiments, the first corrosion-resistant composite layer 2 and the second corrosion-resistant composite layer 4 are composed of a first gold-plating layer 21, a platinum-plating layer 22 and a second gold-plating layer 23, which are sequentially disposed, and the structure of this embodiment, the first gold-plating layer 21 and the second gold-plating layer 23, can effectively improve the corrosion resistance, the conductivity and the use strength of the plating layer, and the arrangement of the platinum-plating layer 22, which has good wear resistance and provides weldability, makes the plating layer structure stable, not easy to fall off and long in service life.
On the basis of the above embodiment, the thicknesses of the first gold-plating layer 21 and the second gold-plating layer 23 are respectively set to 0.025-0.5um, the thickness of the platinum-plating layer 22 is set to 0.1-3um, the thickness of the nickel-tungsten layer 1 is set to 0.5-4um, and the thickness of the palladium-nickel layer 3 is set to 0.1-2.5um, in this embodiment, the thickness setting range of each plating layer is specifically given, and in the above range, the overall thickness of the plating layer is in a reasonable range, so that the problems of large internal stress, easy falling, insufficient wear resistance and corrosion resistance and reduced conductivity of the plating layer are avoided while the corrosion resistance of the plating layer is effectively improved, and the problems of poor stability of the bonding property between the plating layer and the base material are also avoided.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. The electroplated layer is characterized by comprising a nickel-tungsten layer electroplated on the surface of a wiring port substrate of an electronic product, wherein a first corrosion-resistant composite layer and a second corrosion-resistant composite layer are sequentially electroplated on one side, away from the wiring port substrate of the electronic product, of the nickel-tungsten layer, and a palladium nickel layer is electroplated between the first corrosion-resistant composite layer and the second corrosion-resistant composite layer.
2. The electroplated layer for improving the corrosion resistance of the wiring port of the electronic product as claimed in claim 1, wherein the first corrosion-resistant composite layer and the second corrosion-resistant composite layer are composed of a first gold-plated layer, a platinum-plated layer and a second gold-plated layer which are sequentially arranged.
3. The plating layer for improving corrosion resistance of a wiring port of an electronic product as claimed in claim 2, wherein the first gold-plating layer and the second gold-plating layer are each set to a thickness of 0.025 to 0.5 μm.
4. The plating layer for improving corrosion resistance of a wiring opening of an electronic product as claimed in claim 2, wherein the thickness of the platinum plating layer is set to 0.1 to 3 μm.
5. The plating layer for improving corrosion resistance of a wiring port of an electronic product as claimed in claim 1, wherein the thickness of said nickel tungsten layer is set to 0.5-4 μm.
6. The plating layer for improving the corrosion resistance of a wiring port of an electronic product as claimed in claim 1, wherein the thickness of the palladium-nickel layer is set to 0.1-2.5 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122963398.7U CN216450837U (en) | 2021-11-30 | 2021-11-30 | Electroplated layer for improving corrosion resistance of wiring port of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122963398.7U CN216450837U (en) | 2021-11-30 | 2021-11-30 | Electroplated layer for improving corrosion resistance of wiring port of electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216450837U true CN216450837U (en) | 2022-05-06 |
Family
ID=81354814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122963398.7U Active CN216450837U (en) | 2021-11-30 | 2021-11-30 | Electroplated layer for improving corrosion resistance of wiring port of electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216450837U (en) |
-
2021
- 2021-11-30 CN CN202122963398.7U patent/CN216450837U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208501124U (en) | A kind of anticorrosion electroplated layer with silver alloy layers | |
| CN110829080B (en) | Conductive terminal | |
| CN210404121U (en) | Electroplated layer of copper bottom, terminal and electronic interface | |
| CN106048680A (en) | Special galvanical corrosion-resistant coating for fast charging interface of mobile phone | |
| TW202211553A (en) | Conductive terminal | |
| CN107146964A (en) | A kind of galvanization coating and terminal, electrical interface, electronic equipment for terminal | |
| CN206188898U (en) | Cell -phone fills corrosion resistant special cladding material of interface circular telegram soon | |
| CN206850073U (en) | A kind of galvanization coating and terminal, electrical interface, electronic equipment for terminal | |
| CN216450837U (en) | Electroplated layer for improving corrosion resistance of wiring port of electronic product | |
| CN210576587U (en) | Electroplated layer for terminal surface, terminal and electronic interface | |
| CN109853009A (en) | A kind of corrosion resistant coating of mobile phone fast charge interface energization | |
| CN208899010U (en) | A kind of copper bottom has galvanization coating, terminal and the electrical interface of silver alloy layers | |
| CN207925727U (en) | It is a kind of that there is nickel, the galvanization coating of palladium and terminal, electronic equipment | |
| CN110396708A (en) | A kind of corrosion resistance coating of silver combined plating | |
| CN209607940U (en) | A kind of erosion-resisting electroplated layer, terminal and electrical interface | |
| CN110401056A (en) | A kind of corrosion-resistant coating for electronic equipment interfaces | |
| CN208315821U (en) | A kind of galvanization coating, terminal and the electrical interface of the more coating in nickel bottom | |
| CN210576588U (en) | Electroplating corrosion-resistant layer for terminal surface | |
| JPS60234380A (en) | Substrate for solar cell | |
| CN215856392U (en) | Corrosion-resistant palladium-nickel combined coating | |
| CN215734352U (en) | Cell-phone mainboard upper cover electric conduction gold paper tinsel | |
| KR102075469B1 (en) | Connector and Manufacturing Method of it | |
| CN217215177U (en) | Electroplated corrosion-resistant layer for terminal surface | |
| CN217848381U (en) | Conductive terminal and electric connector | |
| CN213124789U (en) | Electric connector with coating structure and electronic product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |