CN211339712U - Coating structure for enhancing corrosion resistance of mobile phone plug connector - Google Patents

Coating structure for enhancing corrosion resistance of mobile phone plug connector Download PDF

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Publication number
CN211339712U
CN211339712U CN201922363638.2U CN201922363638U CN211339712U CN 211339712 U CN211339712 U CN 211339712U CN 201922363638 U CN201922363638 U CN 201922363638U CN 211339712 U CN211339712 U CN 211339712U
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cladding material
plating layer
thickness
silver
nickel
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郭春流
王韬
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Wuxi Micro Just Tech Co ltd
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Wuxi Micro Just Tech Co ltd
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Abstract

The utility model belongs to the technical field of the cell-phone accessory, concretely relates to reinforcing cell-phone plug connector corrosion resisting property's cladding material structure. The utility model discloses reinforcing cell-phone plug connector corrosion resisting property's cladding material structure, the connector includes the functional area part, and the functional area part is followed supreme copper plating layer, first silver-colored cladding material, first nickel tungsten cladding material, first gold cladding material, second nickel tungsten cladding material, second gold cladding material, second silver cladding material, rhodium alloy cladding material of having plated in proper order down, wherein, the copper plating layer plates on the substrate of functional area part, through the combination of above cladding material, can improve the hardness of cladding material, makes the cladding material have stand wear and tear, corrosion-resistant, the resistance to discoloration's characteristic, and the extension fills interface life soon, makes the cladding material resistant plug number of times of product increase, improves cladding material life and charge efficiency, reaches more practical purpose.

Description

Coating structure for enhancing corrosion resistance of mobile phone plug connector
Technical Field
The utility model belongs to the technical field of the cell-phone accessory, concretely relates to reinforcing cell-phone plug connector corrosion resisting property's cladding material structure.
Background
Along with the updating and upgrading of smart phones, the screen of the smart phone is continuously increased, the power consumption is increased, the charging of the smart phone is more and more frequent, most of the plating layers of the conventional charging interfaces of the smart phones adopt nickel plating on copper, palladium nickel/palladium and rhodium alloy plating layers, and rhodium alloy is adopted to enhance the corrosion resistance of products, the traditional plating layers have the advantages of less plugging and unplugging resistant times, short service life, unstable electroplating process, more abnormity, incapability of meeting the increasingly diversified demands of customers and harsh environmental protection requirements.
Disclosure of Invention
The utility model aims to solve the technical problem that to the not enough of above-mentioned prior art, a reinforcing cell-phone plug connector corrosion resisting property's cladding material structure is provided. The utility model discloses a cladding material structure reduces the injury of traditional high cyanogen silvering to the human body and reduces the pollution to the environment through adopting the non-cyanide silvering layer of environment-friendly, cancel the nickel cladding material, reduce human contact nickel layer, avoid arousing skin allergy, reduce electronic connector to the injury of people's health and strengthen the electric conductive property of electronic product, oxidation resistance and corrosion resistance, can increase resistant plug number of times and life, satisfy the diversified demand that satisfies the customer increase day by day, and harsh environmental protection requirement.
In order to solve the technical problem, the utility model discloses a technical scheme is: the utility model provides an reinforcing cell-phone plug connector corrosion resisting property's cladding material structure, the connector includes the functional area part, the functional area part is from supreme copper plating layer, first silver-colored cladding material, first nickel tungsten coating, first gold cladding material, second nickel tungsten coating, second gold cladding material, second silver cladding material and rhodium alloy cladding material of plating down in proper order, wherein, the copper plating layer is plated on the substrate of functional area part.
The base material of the functional area part is a copper base material.
The thickness of the copper plating layer is 0.4-5.5 mu m, the thickness of the first silver plating layer is 0.4-5.5 mu m, the thickness of the first nickel-tungsten plating layer is 0.4-5.5 mu m, the thickness of the first gold plating layer is 0.02-0.55 mu m, the thickness of the second nickel-tungsten plating layer is 0.4-5.5 mu m, the thickness of the second gold plating layer is 0.02-0.55 mu m, the thickness of the second silver plating layer is 0.4-5.5 mu m, and the thickness of the rhodium alloy plating layer is 0.4-5.5 mu m.
The cyanide content in the first silver plating layer and the second silver plating layer is zero, and the silver content in the plating layers is not less than 99.5%.
Compared with the prior art, the utility model has the advantages of it is following:
the utility model discloses a cladding material structure reduces the injury of traditional high cyanogen silvering to the human body and reduces the pollution to the environment through adopting the non-cyanide silvering layer of environment-friendly, cancel nickel cladding material, reduce human contact nickel layer, avoid arousing the skin allergy, reduce electronic connector to the injury of people's health and strengthen the electric conductive property of electronic product, oxidation resistance and corrosion resistance, can satisfy the harsh test demand of customer, middle cladding material through setting up corrosion resistance, oxidation resistance and wearability, the surface cladding material of corrosion resistance, can improve the corrosion resistance and the wearability of substrate, the protection substrate is not corroded, oxidation and long service life, reinforcing electroplating coating corrosion resistance.
Drawings
Fig. 1 is a schematic cross-sectional structure view of a mobile phone plug connector plating structure according to embodiment 1 of the present invention.
Description of reference numerals: 1-copper plating; 2-first silver plating; 3-first nickel-tungsten coating; 4-first gold plating; 5-second nickel-tungsten coating; 6-second gold plating; 7-second silver plating; 8-rhodium alloy plating; 9-functional area portion of the substrate.
Detailed Description
The following describes the embodiments of the present invention in detail with reference to the drawings and the technical solutions.
Example 1
As shown in fig. 1, a plating layer structure for enhancing corrosion resistance of a mobile phone plug connector, the connector includes a functional area portion, the plating layer of the functional area portion is sequentially a copper plating layer 1, a first silver plating layer 2, a first nickel-tungsten plating layer 3, a first gold plating layer 4, a second nickel-tungsten plating layer 5, a second gold plating layer 6, a second silver plating layer 7, and a rhodium alloy plating layer 8 from bottom to top, wherein the copper plating layer 1 is plated on a substrate 9 of the functional area portion.
The substrate 9 of the functional region portion is a copper substrate.
The thickness of the copper plating layer 1 is 1 μm, the thickness of the first silver plating layer 2 is 3 μm, the thickness of the first nickel-tungsten plating layer 3 is 1.25 μm, the thickness of the first gold plating layer 4 is 0.04 μm, the thickness of the second nickel-tungsten plating layer 5 is 1.25 μm, the thickness of the second gold plating layer 6 is 0.04 μm, the thickness of the second silver plating layer 7 is 1.25 μm, and the thickness of the rhodium alloy plating layer 8 is 2.0 μm.
The cyanide content in the first silver plating layer 2 and the second silver plating layer 7 is zero, and the silver content in the plating layers is 99.5%.
Example 2
The utility model provides an reinforcing cell-phone plug connector corrosion resisting property's cladding material structure, the connector includes the functional area part, the cladding material of functional area part is from supreme copper plating layer 1, first silver plating layer 2, first nickel tungsten cladding material 3, first gold cladding material 4, second nickel tungsten cladding material 5, second gold cladding material 6, second silver plating layer 7, rhodium alloy cladding material 8 of being in proper order down, wherein, copper plating layer 1 is plated on the substrate 9 of functional area part.
The substrate 9 of the functional region portion is a copper substrate.
The thickness of the copper plating layer 1 is 0.5 μm, the thickness of the first silver plating layer 2 is 2.5 μm, the thickness of the first nickel-tungsten plating layer 3 is 0.75 μm, the thickness of the first gold plating layer 4 is 0.06m, the thickness of the second nickel-tungsten plating layer 5 is 0.75 μm, the thickness of the second gold plating layer 6 is 0.03 μm, the thickness of the second silver plating layer 7 is 1 μm, and the thickness of the rhodium alloy plating layer 8 is 3.0 μm.
The cyanide content in the first silver plating layer 2 and the second silver plating layer 7 is zero, and the silver content in the plating layers is 99.5%.
Example 3
The utility model provides an reinforcing cell-phone plug connector corrosion resisting property's cladding material structure, the connector includes the functional area part, the cladding material of functional area part is from supreme copper plating layer 1, first silver plating layer 2, first nickel tungsten cladding material 3, first gold cladding material 4, second nickel tungsten cladding material 5, second gold cladding material 6, second silver plating layer 7, rhodium alloy cladding material 8 of being in proper order down, wherein, copper plating layer 1 is plated on the substrate 9 of functional area part.
The substrate 9 of the functional region portion is a copper substrate.
The thickness of the copper plating layer 1 is 0.5 μm, the thickness of the first silver plating layer 2 is 1.25 μm, the thickness of the first nickel-tungsten plating layer 3 is 0.4 μm, the thickness of the first gold plating layer 4 is 0.04 μm, the thickness of the second nickel-tungsten plating layer 5 is 0.5 μm, the thickness of the second gold plating layer 6 is 0.04 μm, the thickness of the second silver plating layer 7 is 0.75 μm, and the thickness of the rhodium alloy plating layer 8 is 5.5 μm.
The cyanide content in the first silver plating layer 2 and the second silver plating layer 7 is zero, and the silver content in the plating layers is 99.5%.
In the examples 1-3 of the present invention, the copper plating layer is used to increase the flatness of the substrate, the first silver plating layer uses a cyanide-free process, has no pollution to the environment and no harm to people, is used for increasing the ductility of products, has stable performance of the first nickel-tungsten plating layer, the coating is used for improving the wear resistance and corrosion resistance of the coating, the first gold coating is used for improving the binding force of a product, the second nickel-tungsten coating is used for improving the wear resistance and corrosion resistance of the coating, the second gold coating is used for improving the binding force of the product, the second silver coating is used for improving the conductivity of the product, the rhodium alloy coating is used for improving the hardness and corrosion resistance of the product, and the hardness of the coating is improved by the combination of the coatings, the plating layer can be wear-resistant, corrosion-resistant and tarnish-resistant, the service life of the quick charging interface is prolonged, the plugging and unplugging resistant times of the plating layer of the product are increased, the service life and the charging efficiency of the plating layer are improved, and the purpose of being more practical is achieved.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Any simple modification, change and equivalent changes made to the above embodiments according to the utility model all still belong to the protection scope of the technical scheme of the utility model.

Claims (3)

1. The utility model provides an reinforcing cell-phone plug connector corrosion resisting property's cladding material structure, a serial communication port, the connector includes the functional area part, the functional area part is followed supreme copper plating layer (1), first silver-colored cladding material (2), first nickel tungsten coating (3), first gold plating layer (4), second nickel tungsten coating (5), second gold plating layer (6), second silver plating layer (7) and rhodium alloy cladding material (8) of having plated in proper order down, wherein, copper plating layer (1) is plated on substrate (9) of functional area part.
2. The plating structure for enhancing the corrosion resistance of mobile phone plug-in unit according to claim 1, wherein the base material (9) of the functional region part is a copper base material.
3. The plating structure for enhancing the corrosion resistance of the mobile phone plug connector according to claim 1, wherein the thickness of the copper plating layer (1) is 0.4 to 5.5 μm, the thickness of the first silver plating layer (2) is 0.4 to 5.5 μm, the thickness of the first nickel-tungsten plating layer (3) is 0.4 to 5.5 μm, the thickness of the first gold plating layer (4) is 0.02 to 0.55 μm, the thickness of the second nickel-tungsten plating layer (5) is 0.4 to 5.5 μm, the thickness of the second gold plating layer (6) is 0.02 to 0.55 μm, the thickness of the second silver plating layer (7) is 0.4 to 5.5 μm, and the thickness of the rhodium alloy plating layer (8) is 0.4 to 5.5 μm.
CN201922363638.2U 2019-12-25 2019-12-25 Coating structure for enhancing corrosion resistance of mobile phone plug connector Active CN211339712U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110820024A (en) * 2019-12-25 2020-02-21 无锡华晶利达电子有限公司 Coating structure for enhancing corrosion resistance of mobile phone plug connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110820024A (en) * 2019-12-25 2020-02-21 无锡华晶利达电子有限公司 Coating structure for enhancing corrosion resistance of mobile phone plug connector

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GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: A coating structure to enhance the corrosion resistance of mobile phone connectors

Effective date of registration: 20231115

Granted publication date: 20200825

Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi Huishan branch

Pledgor: WUXI MICRO JUST-TECH CO.,LTD.

Registration number: Y2023980065758