CN110396708A - Corrosion-resistant coating of silver combined coating - Google Patents
Corrosion-resistant coating of silver combined coating Download PDFInfo
- Publication number
- CN110396708A CN110396708A CN201910726259.7A CN201910726259A CN110396708A CN 110396708 A CN110396708 A CN 110396708A CN 201910726259 A CN201910726259 A CN 201910726259A CN 110396708 A CN110396708 A CN 110396708A
- Authority
- CN
- China
- Prior art keywords
- coating
- silver
- plating layer
- corrosion resistance
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 107
- 239000011248 coating agent Substances 0.000 title claims abstract description 104
- 238000005260 corrosion Methods 0.000 title claims abstract description 38
- 230000007797 corrosion Effects 0.000 title claims abstract description 38
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 34
- 239000004332 silver Substances 0.000 title claims abstract description 34
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052737 gold Inorganic materials 0.000 claims abstract description 33
- 239000010931 gold Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 27
- YPPQDPIIWDQYRY-UHFFFAOYSA-N [Ru].[Rh] Chemical compound [Ru].[Rh] YPPQDPIIWDQYRY-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000007747 plating Methods 0.000 claims description 77
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 abstract description 11
- 230000003647 oxidation Effects 0.000 abstract description 10
- 238000007254 oxidation reaction Methods 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 66
- 239000011247 coating layer Substances 0.000 description 7
- 239000002131 composite material Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
本发明涉及电镀技术领域，尤指一种银组合镀层的耐腐蚀性镀层，包括依次电镀于基材表面的用于调整基材表面平整度的基底镀层、用于提高基材导电性的第一银镀层、用于改善相邻镀层粘接性的第一金镀层和用于提高基材耐腐蚀性及耐磨性的铑钌镀层。由以上镀层组合的镀层结构具有较好的耐磨性、抗氧化、导电性以及腐蚀性，并且电镀镀层与基材材料之间的粘合性较好。
The present invention relates to the field of electroplating technology, and in particular to a corrosion-resistant coating of a silver combination coating, comprising a base coating for adjusting the surface flatness of a substrate, a first silver coating for improving the conductivity of the substrate, a first gold coating for improving the adhesion of adjacent coatings, and a rhodium-ruthenium coating for improving the corrosion resistance and wear resistance of the substrate. The coating structure composed of the above coatings has good wear resistance, oxidation resistance, conductivity and corrosion resistance, and the adhesion between the electroplated coating and the substrate material is good.
Description
技术领域technical field
本发明涉及电镀技术领域，尤指一种银组合镀层的耐腐蚀性镀层。The invention relates to the technical field of electroplating, in particular to a corrosion-resistant coating of a silver composite coating.
背景技术Background technique
随着电子产品的普及，电子产品的应用越来越广泛，电子产品在使用过程中，电子接口经常出现插拔，对于插拔频率较高的电子接口，其磨损性较大，磨损的地方容易被氧化和腐蚀，经常出现电接触不良，为了提高耐磨性和抗腐蚀氧化性，目前很多电子接口的端子都电镀有电镀镀层，电镀镀层中一般包含有一层耐磨层和抗氧化腐蚀层，由于镀层的厚度有限，否则厚度过大造成内应力较大，容易脱落；因此端子的耐磨性、抗腐蚀性不够；若镀层的厚度过厚，其导电性能将会降低；除此之外，有些电镀镀层忽略了与基底材料的结合性，电镀之后，电镀镀层与基材材料之间的粘合性较差，导致后期使用时电镀层脱落。With the popularization of electronic products, the application of electronic products is becoming more and more extensive. During the use of electronic products, electronic interfaces are often plugged and unplugged. For electronic interfaces with high plugging and unplugging frequencies, their wear and tear is relatively large, and the places of wear are easy to wear. It is oxidized and corroded, and poor electrical contact often occurs. In order to improve wear resistance and corrosion resistance, many terminals of electronic interfaces are currently electroplated with electroplating. Due to the limited thickness of the coating, otherwise the excessive thickness will cause large internal stress and easy to fall off; therefore, the wear resistance and corrosion resistance of the terminal are not enough; if the thickness of the coating is too thick, its electrical conductivity will be reduced; in addition, Some electroplating coatings ignore the bonding with the base material. After electroplating, the adhesion between the electroplating coating and the base material is poor, resulting in the electroplating layer falling off during later use.
发明内容SUMMARY OF THE INVENTION
为解决上述问题，本发明提供一种银组合镀层的耐腐蚀性镀层，该镀层具有较好的耐磨性、导电性以及腐蚀性，并且电镀镀层与基材材料之间的粘合性较好。In order to solve the above problems, the present invention provides a corrosion-resistant coating of a silver composite coating, the coating has good wear resistance, electrical conductivity and corrosion resistance, and the adhesion between the electroplating coating and the base material is good. .
为实现上述目的，本发明采用的技术方案是提供一种银组合镀层的耐腐蚀性镀层，包括依次电镀于基材表面的用于调整基材表面平整度的基底镀层、用于提高基材导电性的第一银镀层、用于改善相邻镀层粘接性的第一金镀层和用于提高基材耐腐蚀性及耐磨性的铑钌镀层。In order to achieve the above purpose, the technical solution adopted in the present invention is to provide a corrosion-resistant coating of a silver composite coating, including a base coating that is sequentially electroplated on the surface of the base material for adjusting the flatness of the surface of the base material, and used to improve the conductivity of the base material. A first silver plating layer for improved adhesion, a first gold plating layer for improving the adhesion of adjacent plating layers, and a rhodium ruthenium plating layer for improving the corrosion resistance and wear resistance of the substrate.
作为一种优选方案，所述基底镀层与第一银镀层之间设置有用于改善粘接性的预镀层。As a preferred solution, a pre-plating layer for improving adhesion is provided between the base plating layer and the first silver plating layer.
作为一种优选方案，所述预镀层的厚度为0.025至0.25微米。As a preferred solution, the thickness of the pre-plating layer is 0.025 to 0.25 microns.
作为一种优选方案，所述基底镀层为镍镀层，As a preferred solution, the base coating is a nickel coating,
作为一种优选方案，所述基底镀层的厚度为0.5至5微米。As a preferred solution, the thickness of the base plating layer is 0.5 to 5 microns.
作为一种优选方案，所述第一银镀层的厚度为0.5至6微米，。As a preferred solution, the thickness of the first silver plating layer is 0.5 to 6 microns.
作为一种优选方案，所述第一金镀层的厚度为0.025至0.5微米。As a preferred solution, the thickness of the first gold plating layer is 0.025 to 0.5 microns.
作为一种优选方案，所述铑钌镀层的厚度为0.25至4微米。As a preferred solution, the thickness of the rhodium-ruthenium coating is 0.25 to 4 microns.
作为一种优选方案，所述铑钌镀层的表面还镀有用于提高基材焊接性的第二金镀层。As a preferred solution, the surface of the rhodium-ruthenium plating layer is also plated with a second gold plating layer for improving the weldability of the substrate.
作为一种优选方案，所述第二金镀层的厚度为0.025至0.25微米。As a preferred solution, the thickness of the second gold plating layer is 0.025 to 0.25 microns.
本发明的有益效果在于：The beneficial effects of the present invention are:
本发明通过电子接口的基材表面上依次电镀有基底镀层、第一银镀层、第一金镀层和铑钌镀层，以上镀层组合的镀层结构具有较好的耐磨性、抗氧化、导电性以及腐蚀性，并且电镀镀层与基材材料之间的粘合性较好。In the present invention, the surface of the substrate through the electronic interface is electroplated with a base coating, a first silver coating, a first gold coating and a rhodium-ruthenium coating in sequence, and the coating structure combined with the above coating has better wear resistance, oxidation resistance, electrical conductivity and Corrosive, and the adhesion between the electroplated coating and the substrate material is good.
其中，由于镍金属的成本较低，基底镀层优选为镍镀层，目前的电子接口一般采用铜材料，在电子接口的表面电镀有镍镀层，一方面可以调整基材表面的平整度，镍与铜具有较好结合力，另一方面镍镀层还可以提高基材的硬度耐氧化性；第一银镀层由于其导电性能良好、成本便宜，可以在做电解测试的时候起到缓冲的作用，增加耐腐蚀时间；而设置在第一银镀层与铑钌镀层之间的第一金镀层可以提高第一银镀层与铑钌镀层的结合力；铑钌镀层用以提高电子接口表面的抗氧化腐蚀性，即使电子接口有部分磨损，仍然避免大面积的氧化或腐蚀，保证电接触性。Among them, due to the low cost of nickel metal, the base coating is preferably nickel coating. The current electronic interface is generally made of copper material, and the surface of the electronic interface is electroplated with nickel coating. On the one hand, the flatness of the substrate surface can be adjusted. It has good bonding force. On the other hand, the nickel coating can also improve the hardness and oxidation resistance of the substrate; the first silver coating, due to its good electrical conductivity and low cost, can play a buffering role in the electrolytic test and increase the resistance. Corrosion time; and the first gold coating disposed between the first silver coating and the rhodium-ruthenium coating can improve the bonding force between the first silver coating and the rhodium-ruthenium coating; the rhodium-ruthenium coating is used to improve the anti-oxidative corrosion of the surface of the electronic interface, Even if the electronic interface is partially worn, large-scale oxidation or corrosion is still avoided to ensure electrical contact.
附图说明Description of drawings
图1是本发明的结构示意图。Figure 1 is a schematic structural diagram of the present invention.
附图标号说明：1-基底镀层；2-预镀层；3-第一银镀层；4-第一金镀层；5-铑钌镀层；6-第二金镀层。Description of the reference numerals: 1-base coating; 2-pre-coating; 3-first silver coating; 4-first gold coating; 5-rhodium-ruthenium coating; 6-second gold coating.
具体实施方式Detailed ways
下面结合具体实施例和说明书附图对本发明予以详细说明。The present invention will be described in detail below with reference to specific embodiments and accompanying drawings.
请参阅图1所示，本发明关于一种银组合镀层的耐腐蚀性镀层，包括依次电镀于基材表面的用于调整基材表面平整度的基底镀层1、用于提高基材导电性的第一银镀层3、用于改善相邻镀层粘接性的第一金镀层4和用于提高基材耐腐蚀性及耐磨性的铑钌镀层5。Referring to FIG. 1, the present invention relates to a corrosion-resistant coating of a silver composite coating, including a base coating 1, which is sequentially electroplated on the surface of the base material for adjusting the surface flatness of the base material, and a base coating for improving the conductivity of the base material. The first silver plating layer 3, the first gold plating layer 4 for improving the adhesion of adjacent plating layers, and the rhodium-ruthenium plating layer 5 for improving the corrosion resistance and wear resistance of the substrate.
其中，所述基底镀层1为镍镀层，所述基底镀层1与第一银镀层3之间设置有用于改善粘接性的预镀层2，所述铑钌镀层5的表面还镀有用于提高基材焊接性的第二金镀层6，所述基底镀层1的厚度为0.5至5微米，所述预镀层2的厚度为0.025至0.25微米，所述第一银镀层3的厚度为0.5至6微米，所述第一金镀层4的厚度为0.025至0.5微米，所述铑钌镀层5的厚度为0.25至4微米，所述第二金镀层6的厚度为0.025至0.25微米。Wherein, the base plating layer 1 is a nickel plating layer, a pre-plating layer 2 for improving adhesion is arranged between the base plating layer 1 and the first silver plating layer 3, and the surface of the rhodium-ruthenium plating layer 5 is also plated The second gold plating layer 6 with weldability, the thickness of the base plating layer 1 is 0.5 to 5 microns, the thickness of the pre-plating layer 2 is 0.025 to 0.25 microns, and the thickness of the first silver plating layer 3 is 0.5 to 6 microns , the thickness of the first gold plating layer 4 is 0.025 to 0.5 microns, the thickness of the rhodium-ruthenium plating layer 5 is 0.25 to 4 microns, and the thickness of the second gold plating layer 6 is 0.025 to 0.25 microns.
本发明通过电子接口的基材表面上依次电镀有基底镀层1、预镀层2、第一银镀层3、第一金镀层4、铑钌镀层5和第二金镀层6，以上镀层组合的镀层结构具有较好的耐磨性、抗氧化、导电性以及腐蚀性，并且电镀镀层与基材材料之间的粘合性较好，便于电子接口的焊接。According to the present invention, the surface of the substrate through the electronic interface is electroplated with a base coating 1, a pre-plating layer 2, a first silver coating 3, a first gold coating 4, a rhodium-ruthenium coating 5 and a second gold coating 6. The coating structure of the combination of the above coating layers It has good wear resistance, oxidation resistance, electrical conductivity and corrosion resistance, and the adhesion between the electroplating layer and the substrate material is good, which is convenient for the welding of electronic interfaces.
其中，由于镍金属的成本较低，基底镀层1优选为镍镀层，目前的电子接口一般采用铜材料，在电子接口的表面电镀有镍镀层，一方面可以调整基材表面的平整度，镍与铜具有较好结合力，另一方面镍镀层还可以提高基材的硬度耐氧化性；而设置在基底镀层1与第一银镀层3之间的预镀层2用于提高基底镀层1与第一银镀层3的结合力，预镀层2的材料可以为金或银中的一种；第一银镀层3由于其导电性能良好、成本便宜，可以在做电解测试的时候起到缓冲的作用，增加耐腐蚀时间；而设置在第一银镀层3与铑钌镀层5之间的第一金镀层4可以提高第一银镀层3与铑钌镀层5的结合力；铑钌镀层5用以提高电子接口表面的抗氧化腐蚀性，即使电子接口有部分磨损，仍然避免大面积的氧化或腐蚀，保证电接触性；最外层的第二金镀层6具有较低的接触电阻、导电性能良好、易于焊接、耐腐蚀性强、并具有一定的耐磨性(指硬金)，因而在印制电路板、电接点等方面有着广泛的应用。Among them, due to the low cost of nickel metal, the base plating layer 1 is preferably a nickel plating layer. The current electronic interface is generally made of copper material, and the surface of the electronic interface is electroplated with a nickel plating layer. On the one hand, the flatness of the surface of the substrate can be adjusted. Copper has good bonding force. On the other hand, the nickel coating can also improve the hardness and oxidation resistance of the substrate; and the pre-plating layer 2 arranged between the base coating 1 and the first silver coating 3 is used to improve the base coating 1 and the first silver coating. The bonding force of the silver plating layer 3, the material of the pre-plating layer 2 can be one of gold or silver; the first silver plating layer 3 can play a buffering role in the electrolytic test due to its good electrical conductivity and low cost, increasing the Corrosion resistance time; and the first gold coating 4 arranged between the first silver coating 3 and the rhodium-ruthenium coating 5 can improve the binding force of the first silver coating 3 and the rhodium-ruthenium coating 5; the rhodium-ruthenium coating 5 is used to improve the electronic interface The surface is resistant to oxidation and corrosion, even if the electronic interface is partially worn, it still avoids large-scale oxidation or corrosion and ensures electrical contact; the outermost second gold plating layer 6 has low contact resistance, good electrical conductivity, and easy soldering. , strong corrosion resistance, and has a certain wear resistance (referring to hard gold), so it has a wide range of applications in printed circuit boards, electrical contacts, etc.
下面通过具体的实施例对本发明作进一步说明。The present invention will be further described below through specific embodiments.
实施例1Example 1
本实施例提供了一种耐磨、耐腐蚀性能良好的镀层，包括依次电镀于基材表面的镍镀层、第一银镀层3、第一金镀层4和铑钌镀层5。This embodiment provides a coating with good wear resistance and corrosion resistance, including a nickel coating, a first silver coating 3 , a first gold coating 4 and a rhodium-ruthenium coating 5 that are sequentially electroplated on the surface of the substrate.
以上镀层组合的镀层结构具有较好的耐磨性、抗氧化、导电性以及腐蚀性，并且电镀镀层与基材材料之间的粘合性较好。The coating structure of the above coating combination has good wear resistance, oxidation resistance, electrical conductivity and corrosion resistance, and the adhesion between the electroplating coating and the substrate material is good.
实施例2Example 2
在实施例1的基础上，本实施例提供了一种最薄的镀层，所述镀镍层的厚度为0.5微米，所述第一银镀层3的厚度为0.5微米，所述第一金镀层4的厚度为0.025微米，所述铑钌镀层5的厚度为0.25微米。On the basis of Embodiment 1, this embodiment provides the thinnest plating layer, the thickness of the nickel plating layer is 0.5 μm, the thickness of the first silver plating layer 3 is 0.5 μm, the thickness of the first gold plating layer is 0.5 μm, and the thickness of the first gold plating layer is 0.5 μm. The thickness of 4 is 0.025 microns, and the thickness of the rhodium-ruthenium plating layer 5 is 0.25 microns.
实施例3Example 3
在实施例1的基础上，本实施例提供了一种粘合性能最佳的耐腐蚀性镀层，在镀镍层与第一银镀层3之间设置有预镀层2。通过预镀层2增加了镀镍层与第一银镀层3之间的结合力，另外第一银镀层3与铑钌镀层5同样设置有第一镀金层来增加其两者的结合力。On the basis of Example 1, this example provides a corrosion-resistant coating with the best adhesion performance, and a pre-plating layer 2 is provided between the nickel-plating layer and the first silver-plating layer 3 . The pre-plating layer 2 increases the bonding force between the nickel plating layer and the first silver plating layer 3, and the first silver plating layer 3 and the rhodium-ruthenium plating layer 5 are also provided with a first gold plating layer to increase the bonding force between the two.
实施例4Example 4
在实施例1的基础上，本实施例提供了一种便于焊接的耐腐蚀性镀层，在铑钌镀层5的表面电镀有第二镀金层。由于金材质具有较低的接触电阻、导电性能良好、易于焊接、耐腐蚀性强、并具有一定的耐磨性(指硬金)，因而在印制电路板、电接点等方面有着广泛的应用。On the basis of Embodiment 1, this embodiment provides a corrosion-resistant coating that is convenient for welding, and the surface of the rhodium-ruthenium coating 5 is electroplated with a second gold-plated layer. Because gold material has low contact resistance, good electrical conductivity, easy welding, strong corrosion resistance, and certain wear resistance (referring to hard gold), it has a wide range of applications in printed circuit boards, electrical contacts, etc. .
实施例5Example 5
本实施例提供了一种多功能的镀层，包括依次电镀于基材表面的镍镀层、预镀层2、第一银镀层3、第一金镀层4、铑钌镀层5和第二金镀层6。以上镀层组合的镀层结构具有较好的耐磨性、抗氧化、导电性以及腐蚀性，并且电镀镀层与基材材料之间的粘合性较好，便于电子接口的焊接。This embodiment provides a multifunctional coating layer, including a nickel coating layer, a pre-plating layer 2, a first silver coating layer 3, a first gold coating layer 4, a rhodium-ruthenium coating layer 5 and a second gold coating layer 6 sequentially electroplated on the surface of the substrate. The coating structure of the above coating combination has good wear resistance, oxidation resistance, electrical conductivity and corrosion resistance, and the adhesion between the electroplating coating and the substrate material is good, which is convenient for the welding of electronic interfaces.
实施例6Example 6
在实施例5的基础上，本实施例提供了一种最厚的镀层，所述镍镀层的厚度为5微米，所述预镀层2的厚度为0.25微米，所述第一银镀层3的厚度为6微米，所述第一金镀层4的厚度为0.5微米，所述铑钌镀层5的厚度为4微米，所述第二金镀层6的厚度为0.25微米。On the basis of Example 5, this example provides the thickest plating layer, the thickness of the nickel plating layer is 5 microns, the thickness of the pre-plating layer 2 is 0.25 microns, and the thickness of the first silver plating layer 3 is 0.25 microns. The thickness of the first gold plating layer 4 is 0.5 μm, the thickness of the rhodium-ruthenium plating layer 5 is 4 μm, and the thickness of the second gold plating layer 6 is 0.25 μm.
以上实施方式仅仅是对本发明的优选实施方式进行描述，并非对本发明的范围进行限定，在不脱离本发明设计精神的前提下，本领域普通工程技术人员对本发明的技术方案作出的各种变形和改进，均应落入本发明的权利要求书确定的保护范围内。The above embodiments are only to describe the preferred embodiments of the present invention, and do not limit the scope of the present invention. On the premise of not departing from the design spirit of the present invention, various modifications and changes made by ordinary engineers and technicians in the art to the technical solutions of the present invention and Improvements should all fall within the protection scope determined by the claims of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910726259.7A CN110396708A (en) | 2019-08-07 | 2019-08-07 | Corrosion-resistant coating of silver combined coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910726259.7A CN110396708A (en) | 2019-08-07 | 2019-08-07 | Corrosion-resistant coating of silver combined coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110396708A true CN110396708A (en) | 2019-11-01 |
Family
ID=68327826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910726259.7A Pending CN110396708A (en) | 2019-08-07 | 2019-08-07 | Corrosion-resistant coating of silver combined coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110396708A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110820024A (en) * | 2019-12-25 | 2020-02-21 | 无锡华晶利达电子有限公司 | A coating structure for enhancing corrosion resistance of mobile phone connectors |
| CN113215570A (en) * | 2021-05-13 | 2021-08-06 | 东莞市川富电子有限公司 | Design method of electrolytic plating resistance of terminal |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6184392A (en) * | 1984-09-29 | 1986-04-28 | Iwasaki Mekki:Kk | Surface treatment |
| US20020192492A1 (en) * | 2001-05-11 | 2002-12-19 | Abys Joseph Anthony | Metal article coated with near-surface doped tin or tin alloy |
| US20040121626A1 (en) * | 2002-09-26 | 2004-06-24 | Fci Americas Technology, Inc. | Surface mounted electrical components and method for mounting and retaining same |
| CN104619883A (en) * | 2012-09-19 | 2015-05-13 | Jx日矿日石金属株式会社 | Surface-treated plated material and method for producing same, and electronic component |
| CN106048680A (en) * | 2016-07-22 | 2016-10-26 | 东莞普瑞得五金塑胶制品有限公司 | A special corrosion-resistant coating for mobile phone fast charging interface |
| CN106591904A (en) * | 2016-11-29 | 2017-04-26 | 维沃移动通信有限公司 | Electroplating coating, terminal and mobile terminal |
| CN206188898U (en) * | 2016-07-22 | 2017-05-24 | 东莞普瑞得五金塑胶制品有限公司 | A special corrosion-resistant coating for mobile phone fast charging interface |
| CN208501124U (en) * | 2018-04-16 | 2019-02-15 | 东莞普瑞得五金塑胶制品有限公司 | A kind of anti-corrosion electroplating layer with silver alloy coating |
| CN109913917A (en) * | 2019-04-10 | 2019-06-21 | 东莞市合航精密科技有限公司 | Corrosion-resistant plating layer for powering on mobile phone quick charging interface |
-
2019
- 2019-08-07 CN CN201910726259.7A patent/CN110396708A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6184392A (en) * | 1984-09-29 | 1986-04-28 | Iwasaki Mekki:Kk | Surface treatment |
| US20020192492A1 (en) * | 2001-05-11 | 2002-12-19 | Abys Joseph Anthony | Metal article coated with near-surface doped tin or tin alloy |
| US20040121626A1 (en) * | 2002-09-26 | 2004-06-24 | Fci Americas Technology, Inc. | Surface mounted electrical components and method for mounting and retaining same |
| CN104619883A (en) * | 2012-09-19 | 2015-05-13 | Jx日矿日石金属株式会社 | Surface-treated plated material and method for producing same, and electronic component |
| CN106048680A (en) * | 2016-07-22 | 2016-10-26 | 东莞普瑞得五金塑胶制品有限公司 | A special corrosion-resistant coating for mobile phone fast charging interface |
| CN206188898U (en) * | 2016-07-22 | 2017-05-24 | 东莞普瑞得五金塑胶制品有限公司 | A special corrosion-resistant coating for mobile phone fast charging interface |
| CN106591904A (en) * | 2016-11-29 | 2017-04-26 | 维沃移动通信有限公司 | Electroplating coating, terminal and mobile terminal |
| CN208501124U (en) * | 2018-04-16 | 2019-02-15 | 东莞普瑞得五金塑胶制品有限公司 | A kind of anti-corrosion electroplating layer with silver alloy coating |
| CN109913917A (en) * | 2019-04-10 | 2019-06-21 | 东莞市合航精密科技有限公司 | Corrosion-resistant plating layer for powering on mobile phone quick charging interface |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110820024A (en) * | 2019-12-25 | 2020-02-21 | 无锡华晶利达电子有限公司 | A coating structure for enhancing corrosion resistance of mobile phone connectors |
| CN110820024B (en) * | 2019-12-25 | 2024-11-22 | 无锡华晶利达电子有限公司 | A coating structure for enhancing the corrosion resistance of mobile phone connectors |
| CN113215570A (en) * | 2021-05-13 | 2021-08-06 | 东莞市川富电子有限公司 | Design method of electrolytic plating resistance of terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210404121U (en) | A copper-based electroplating layer, terminal and electronic interface | |
| TW202211553A (en) | Conductive terminal | |
| CN208501124U (en) | A kind of anti-corrosion electroplating layer with silver alloy coating | |
| CN209607940U (en) | A corrosion-resistant electroplating, terminal and electronic interface | |
| CN100407503C (en) | Terminal and its electroplating method | |
| CN102055101B (en) | Electrical connector terminal | |
| CN107146964A (en) | A kind of galvanization coating and terminal, electrical interface, electronic equipment for terminal | |
| CN110396708A (en) | Corrosion-resistant coating of silver combined coating | |
| CN110829080B (en) | Conductive terminal | |
| CN207918991U (en) | Plug-resistant electroplating coating, terminal and electronic interface of a nickel alloy substrate | |
| CN110401056A (en) | Corrosion-resistant coating for electronic equipment interface | |
| CN102856694B (en) | Electric connector terminal | |
| CN206850073U (en) | A kind of electroplating coating for terminal and terminal, electronic interface, electronic equipment | |
| CN212659703U (en) | Conductive terminals and their corrosion-resistant layers and electrical connectors | |
| CN102055099A (en) | Electric connector terminal and electroplating method thereof | |
| CN221740477U (en) | Electroplating layer with reduced porosity and terminal thereof | |
| CN207925727U (en) | A kind of electroplating coating with nickel, palladium and terminal, electronic equipment | |
| CN221398104U (en) | Composite electroplated layer with copper as substrate | |
| CN215869877U (en) | High corrosion-resistant nickel-based composite coating and terminal | |
| CN210576587U (en) | A kind of electroplating layer for terminal surface, terminal and electronic interface | |
| CN210886265U (en) | A kind of electroplating coating for hand-held electronic equipment interface terminal | |
| CN217848381U (en) | Conductive terminal and electric connector | |
| CN216145790U (en) | Plug-resistant anti-hand-sweat coating, terminal and electronic equipment | |
| CN216427448U (en) | Plug-resistant anti-hand-sweat coating, terminal and electronic equipment | |
| CN210576588U (en) | Electroplating corrosion-resistant layer for terminal surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191101 |
|
| RJ01 | Rejection of invention patent application after publication |