CN109379859A - The residual copper stake manufacture craft of back drill zero in PCB substrate - Google Patents
The residual copper stake manufacture craft of back drill zero in PCB substrate Download PDFInfo
- Publication number
- CN109379859A CN109379859A CN201811179635.7A CN201811179635A CN109379859A CN 109379859 A CN109379859 A CN 109379859A CN 201811179635 A CN201811179635 A CN 201811179635A CN 109379859 A CN109379859 A CN 109379859A
- Authority
- CN
- China
- Prior art keywords
- back drill
- pcb
- residual copper
- zero
- conductive film
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The residual copper stake manufacture craft of back drill zero that the invention proposes a kind of in PCB substrate, specific process step are as follows: prepare N layer circuit board, wherein N >=4, longitudinally preset A group disconnection layer in selected location, soluble material is placed on the upper and lower surface of disconnection layer in wherein A >=1；A step chinese raw materials is pressed as PCB semi-finished product；PCB semi-finished product are subjected to machine drilling；Macromolecule conductive film is coated boring in metapore；Dissolution soluble material takes off dissolvable on piece macromolecule conductive film；By being electroplated remaining macromolecule conductive film galvanic metallization；Graphic plating is carried out to semi-finished product in f step and takes off film etching.Existing design scheme is the via hole that single signal is transmitted by mechanical back drill, has the residual copper stake of certain length to have interference to the signal transmission of High-Speed PCB.This patent scheme is the Multifunctional perforated produced by chemical method, and zero residual copper stake can satisfy the signal transmission of High-Speed PCB.This method can both make back drill hole, can also make Multifunctional perforated, and same hole can transmit the signal of two or more networks.
Description
Technical field
The present invention relates to circuit substrates to optimize field, particularly relates to a kind of residual copper stake of back drill zero production in PCB substrate
Technique.
Background technique
With the development of data communication and multimedia service demand, user is increasingly unsatisfactory for carrying out ditch only by voice
Logical single communication mode is capable of providing wider type of business it is desirable to mobile communication system, such as internet access,
Image transmission, video on demand, data mutually pass, or even watch data or the multimedia services such as TV programme in real time.It also wishes simultaneously
Prestige can fit thus from current interpersonal Communication Development to the communication people and machine, even machine and machine
Forth generation mobile communication (4G) popularization and application for answering mobile data, mobile computing and mobile multimedia running to need are opened with 5G's
Hair.Requirement to printed wiring board increasingly minimizes, is highly integrated, multifunction, and low-loss and high transfer rate, telecommunications are set
The function of the high-end electronic products such as standby and computer peripheral equipment is more and more stronger, their size and weight are but constantly being reduced, this
Having can be just achieved by the integration and miniaturization of component and system substrate.
4G system transmission rate with higher and transmission quality, can carry a large amount of multimedia messages, traffic capacity
Geometry times grade is incremented by, therefore the PCB for matching 4G communication must at a high speed and large capacity is just able to satisfy this demand, therefore how in height
Transmission rate scene under ensure that signal is interference-free and loss, this needs to design new PCB back drill processing technology just to solve.
The extra copper of via hole of existing multilayer line inner cord signal transmission is removed in hole by back drill processing method
The useless copper in part.If not removing extra copper, after the frequency of circuit signal increases to certain altitude (usual 5G or more),
Extra copper facing is equivalent to that antenna is the same, generates signal radiation and interferes to other signals of surrounding, will affect when serious
To the normal work of line system, just the stub of internal layer cabling must be made as short as possible to reduce this influence, shorter influence is more
It is small, but the defect of mechanical back drill is cannot to completely remove useless copper.Its at least surplus residual copper (Stub) for having 2mil or more, is being transmitted
Noise jamming can be also generated when high speed signal in various degree, makes signal attenuation losses.
Summary of the invention
The present invention proposes a kind of residual copper stake manufacture craft of back drill zero in PCB substrate, solves in the prior art ask
Topic.
The technical scheme of the present invention is realized as follows:
The residual copper stake manufacture craft of back drill zero in PCB substrate, specific process step are as follows:
A. prepare N layer circuit board, wherein N >=4, preset A group disconnection layer in selected location, wherein A >=1, in disconnection layer
Placing on upper and lower surface can dissolve piece；
B. a step chinese raw materials is pressed as semi-finished product；
C. machine drilling is carried out in selected location；
D. macromolecule conductive film is coated in brill metapore；
E. dissolution soluble material takes off dissolvable on piece macromolecule conductive film；
F. by being directly electroplated remaining macromolecule conductive film galvanic metallization；
G. graphic plating carried out to semi-finished product in f step, take off dry film and etching.
As a preferred solution of the present invention, the solution tablet covering surface exceeds the aperture section that this position is drilled.
As a preferred solution of the present invention, the solution tablet is not alkaline-resisting material.
As a preferred solution of the present invention, the lysate is Alkaline solubilization liquid.
The utility model has the advantages that
The residual copper stake manufacture craft of back drill zero that the invention proposes a kind of in PCB substrate, specific process step are as follows: prepare
N layer circuit board, wherein N >=4, longitudinally preset A group disconnection layer in selected location, wherein A >=1, on the upper and lower surface of disconnection layer
Place solution tablet；A step chinese raw materials is pressed as semi-finished product；Machine drilling is carried out in selected location；It is coated boring in metapore
Macromolecule conductive film；Dissolution soluble material takes off dissolvable on piece macromolecule conductive film；By being directly electroplated remaining height
Molecule conductive film galvanic metallization；Semi-finished product in f step are carried out finally to take off film etching.Existing design scheme is carried on the back by machinery
The via hole for boring transmission single signal has the residual copper stake of certain length to have interference to the signal transmission of High-Speed PCB.This patent scheme is
The Multifunctional perforated produced by chemical method, zero residual copper stake can satisfy the signal transmission of High-Speed PCB.This method can both be made
Make back drill hole, Multifunctional perforated can also be made, same hole can transmit the signal of two or more networks.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is step b semi-finished product structure schematic diagram of the present invention；
Fig. 2 is step c schematic diagram of product structure of the present invention；
Fig. 3 is step d schematic diagram of product structure of the present invention；
Fig. 4 is step e schematic diagram of product structure of the present invention；
Fig. 5 is step f schematic diagram of product structure of the present invention.
In figure, conductive copper layer 1, solution tablet 2, back drill hole 3, macromolecule conductive film 4, tomography gap 5.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Product structure as Figure 1-Figure 5, circuit board are put into spy between two different network signal layers when being laminated
Different material disconnects two signals layers by the method for chemolysis in same via hole, to produce zero residual copper (ZERO-
STUB Multi net voting hole).
Structure difference: existing design scheme is the via hole that single signal is transmitted by mechanical back drill, there is the residual of certain length
Copper stake.This patent scheme is the Multifunctional perforated produced by chemical method.Zero residual copper stake (Zero-stub).
Feature difference:
Existing design scheme is the via hole that single signal is transmitted by mechanical back drill, has the residual copper stake of certain length to height
The signal transmission of fast PCB has interference.This patent scheme is the Multifunctional perforated produced by chemical method, zero residual copper stake (Zero-
Stub), it can satisfy the signal transmission of High-Speed PCB.
The same via hole of existing scheme can only transmit a signal, and single network signal is transmitted in same hole.This patent method was both
Back drill hole can be made, Multifunctional perforated can also be made, same hole can transmit the signal of two or more networks.With on-mechanical side
Method realizes the Multifunctional perforated Manufacturing Techniques of zero residual copper length on circuit boards.It is all to use special inert material or chemistry
Dissolving method realizes back drill Zero-stub or Multifunctional perforated function, belongs to the scope of this patent.
Traditional mechanical back drill aperture is D+8mil, i.e. the big 8mil of back drill boring ratio head drilling, and back drill has to MNCL layers
2mil or more remaining copper, this new technology process back drill, and back drill hole is big with first boring aperture etc., is passed using comparing after new technology back drill
System back is bored into the space length between hole and increases 8mil, and (such as Fig. 2) can increase cabling quantity, so that PCB space has been saved,
PCB layer number is reduced, increases PCB signal transmission capacity, while the residual copper stub of new technology processing back drill can control 0mil,
Residual copper interference signal is avoided, guarantees the integrality of network signal transmission.
This programme provides a kind of new back drilling method, and the back drill different with traditional back drill pore structure can be obtained using this programme
Pore structure.It is back drill hole section (NPTH), the aperture signal conduction hole (PTH) with the back drill pore structure that novel technical method makes.With new
Special material or soluble material disconnect MNCL layer, carry out carry on the back drilling function.
A) first step, in the MNCL layer that the corresponding back drill of at least 4 layers or more of printed circuit boards requires and MNCL-1 layers
The upper special material of core plate pressure after be pressed into semi-finished product.
B) second step, forms the disposable through-hole of design requirement by first time machine drilling, which is exactly finished product back
Desired aperture is bored, by new back drill technique requirement, back drill hole diameter is identical with transmission signal segment aperture.
The through-hole that second step bores is formed one layer to close macromolecule by no electrochemical reaction by c) third step on hole wall
Conductive film layer；
D) the 4th step takes off the macromolecule conductive film on special material (not alkaline-resisting) on the basis of third step, retains
Conductive film layer on FR4 hole wall,
E) the 5th step is electroplated by the 1st time, all via metals for boring third step.
F) the 6th step, by pattern transfer, graphic plating thickeies the copper thickness required to finished product, obtains PCB after taking off film etching
Line pattern.
The new back boring method of this programme narration can since back drill hole (NPTH) is more identical than the aperture in signal conduction hole
To realize 0 residual copper, more function holes function also may be implemented.
The new back boring method of this programme narration can guarantee the integrality of high speed transmission of signals.Pass through the method for chemistry
Rather than the method for power auger, avoiding problems the stake of residual copper, copper burr and consents caused by power auger, and it is dry to bring high speed signal
Disturbing keeps signal imperfect.
New technology be chemically rather than with the method for traditional power auger remove signal transmission hole in it is extra
Copper stake new technology removes the extra copper (STUB) of signal transmission hole for PCB, guarantees that the integrality of transmission signal and increase PCB are mono-
Position design capacity starts completely new approach.
1, maximum plate thickness: 10.0+/- 10%mm.
2, maximum board size: 24.0mm*36mm.
3, the smallest signal transmission hole aperture: 0.3mm.
4, the smallest back boring aperture: 0.2mm.
5, aspect ratio index: the corresponding different aspect ratio requirements in different back drill apertures.
With non-mechanical approach, the Multifunctional perforated Manufacturing Techniques of zero residual copper length are realized on circuit boards.It is all to chat above
The special inert material production back drill hole zero-stub method stated, and the similar chemical method production not referred to herein
Back drill hole zero-stub is the rights protection scope of the invention patent.
Embodiment 1
As shown in Figs. 1-5, the residual copper stake manufacture craft of back drill zero in PCB substrate, specific process step are as follows:
A. prepare 4 layer circuit boards, that is, be internally provided at least four layers of conductive copper layer 1, preset two groups of disconnections in selected location
Layer, placing on the upper and lower surface of disconnection layer can dissolve piece 2；
B. a step chinese raw materials is pressed as semi-finished product；
C. machine drilling is carried out in selected location form back drill hole 3；
D. coating macromolecule conductive film 4 in metapore is being bored；
E. coating dissolves for the lysate that can dissolve piece, solution tablet while taking away corresponding position in macromolecule conductive film
Macromolecule conductive film 4, formed tomography gap 5；
F. remaining macromolecule conductive film galvanic metallization is formed by metal layer by directly plating；
G. figure transfer carried out to semi-finished product in f step, graphic plating, take off film and etching.
Solution tablet covering surface exceeds the aperture section that this position is drilled.
Solution tablet is not alkaline-resisting material.
Lysate is Alkaline solubilization liquid.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (4)
1. the residual copper stake manufacture craft of back drill zero in PCB substrate, which is characterized in that specific process step are as follows:
A. prepare N layer circuit board, wherein N >=4, preset A group disconnection layer in selected location, wherein A >=1, above and below disconnection layer
Soluble material is placed on two sides；
B. a step chinese raw materials is pressed as PCB semi-finished product；
C. PCB semi-finished product are subjected to machine drilling；
D. macromolecule conductive film is coated in brill metapore；
E. dissolution soluble material takes off dissolvable on piece macromolecule conductive film；
F. by being electroplated remaining macromolecule conductive film galvanic metallization；
G. graphic plating is carried out to semi-finished product in f step, takes off film and etching.
2. the back drill zero residual copper stake manufacture craft according to claim 1 in PCB substrate, which is characterized in that it is described can
Solution tablet covering surface exceeds the aperture section that this position is drilled.
3. the back drill zero residual copper stake manufacture craft according to claim 1 in PCB substrate, which is characterized in that it is described can
Solution tablet is not alkaline-resisting material.
4. the back drill zero residual copper stake manufacture craft according to claim 3 in PCB substrate, which is characterized in that described molten
Solution liquid is Alkaline solubilization liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811179635.7A CN109379859A (en) | 2018-10-10 | 2018-10-10 | The residual copper stake manufacture craft of back drill zero in PCB substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811179635.7A CN109379859A (en) | 2018-10-10 | 2018-10-10 | The residual copper stake manufacture craft of back drill zero in PCB substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109379859A true CN109379859A (en) | 2019-02-22 |
Family
ID=65404029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811179635.7A Pending CN109379859A (en) | 2018-10-10 | 2018-10-10 | The residual copper stake manufacture craft of back drill zero in PCB substrate |
Country Status (1)
| Country | Link |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862718A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of method for processing through hole and PCB that hole wall layers of copper is disconnected in designated layer |
| CN109862719A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of PCB production method that realizing a hole Multi net voting and PCB |
| CN109862704A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of PCB production method and PCB containing buried via hole |
| CN109890149A (en) * | 2019-04-02 | 2019-06-14 | 生益电子股份有限公司 | A kind of production method and PCB of two-sided crimping PCB |
| CN111800943A (en) * | 2019-04-09 | 2020-10-20 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN112577409A (en) * | 2020-12-10 | 2021-03-30 | 广州添利电子科技有限公司 | PCB through hole tin layer thickness equipment and electrochemical timing electric quantity method testing method thereof |
| CN114531815A (en) * | 2022-01-24 | 2022-05-24 | 中航光电科技股份有限公司 | Single-hole double-signal double-sided back plate and manufacturing method thereof |
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| CN100587921C (en) * | 2005-03-04 | 2010-02-03 | 三米拉-惜爱公司 | Structures for utilizing plating protection layer and selectively partitioning through hole |
| CN105122958A (en) * | 2013-03-15 | 2015-12-02 | 桑米纳公司 | Simultaneous and selective wide gap partitioning of via structures using plating resist |
| CN106034377A (en) * | 2015-03-19 | 2016-10-19 | 马尔泰克技术有限公司 | Selective segment through hole electroplating technology and structure |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2003049511A1 (en) * | 2001-12-04 | 2003-06-12 | Teradyne, Inc. | High speed multi-layer printed circuit board via |
| CN100587921C (en) * | 2005-03-04 | 2010-02-03 | 三米拉-惜爱公司 | Structures for utilizing plating protection layer and selectively partitioning through hole |
| CN105122958A (en) * | 2013-03-15 | 2015-12-02 | 桑米纳公司 | Simultaneous and selective wide gap partitioning of via structures using plating resist |
| CN106034377A (en) * | 2015-03-19 | 2016-10-19 | 马尔泰克技术有限公司 | Selective segment through hole electroplating technology and structure |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862718A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of method for processing through hole and PCB that hole wall layers of copper is disconnected in designated layer |
| CN109862719A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of PCB production method that realizing a hole Multi net voting and PCB |
| CN109862704A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of PCB production method and PCB containing buried via hole |
| CN109890149A (en) * | 2019-04-02 | 2019-06-14 | 生益电子股份有限公司 | A kind of production method and PCB of two-sided crimping PCB |
| CN109862719B (en) * | 2019-04-02 | 2022-04-29 | 生益电子股份有限公司 | PCB manufacturing method for realizing one-hole multi-network and PCB |
| CN109890149B (en) * | 2019-04-02 | 2022-04-29 | 生益电子股份有限公司 | Manufacturing method of double-sided compression-joint PCB and PCB |
| CN111800943A (en) * | 2019-04-09 | 2020-10-20 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN112577409A (en) * | 2020-12-10 | 2021-03-30 | 广州添利电子科技有限公司 | PCB through hole tin layer thickness equipment and electrochemical timing electric quantity method testing method thereof |
| CN112577409B (en) * | 2020-12-10 | 2022-06-10 | 广州添利电子科技有限公司 | PCB through hole tin layer thickness equipment and electrochemical timing electric quantity method testing method thereof |
| CN114531815A (en) * | 2022-01-24 | 2022-05-24 | 中航光电科技股份有限公司 | Single-hole double-signal double-sided back plate and manufacturing method thereof |
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| PB01 | Publication | ||
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Application publication date: 20190222 |