CN1093570C - Electroplating and electrolyzing technology and equipment with moveable electrode - Google Patents
Electroplating and electrolyzing technology and equipment with moveable electrode Download PDFInfo
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- CN1093570C CN1093570C CN98104621A CN98104621A CN1093570C CN 1093570 C CN1093570 C CN 1093570C CN 98104621 A CN98104621 A CN 98104621A CN 98104621 A CN98104621 A CN 98104621A CN 1093570 C CN1093570 C CN 1093570C
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Abstract
The present invention relates to an electroplating and electrolyzing technology and equipment for moveable electrodes, which is a technology and equipment used for electroplating or electrolyzing metal. The existing electroplating (or electrolyzing) technology is carried out by immersing workpieces and electrodes in electroplating (or electrolyzing) liquid. Therefore, large workpieces need large equipment which corresponds to the large workpieces. An electrode (4) of the present invention can move; an electrode insulator (1) can prevent the electrode (4) and a workpiece (7) from short circuiting; the electroplating (or electrolyzing) liquid (8) is transmitted to the electrode insulator (1) through a pump (10) to make the electroplating (or electrolyzing) liquid filled between the electrode (4) and the workpiece (7) to form current for realizing electroplating or electrolysis. The present invention can use small equipment for the electroplating or electrolyzing the large workpieces.
Description
The present invention is a kind of method and apparatus that is used for plated metal, electrolytic metal.
Existing plating, electrolysis tech are electroplated need or electrolytic workpiece and electrode are immersed in electroplate liquid or the electrolytic solution and carry out.If electroplate or electrolysis large-scale workpiece (even part of large-scale workpiece), just must be with the large-scale plating or the electrolyzer that adapt with it.Thereby promptly having increased electric power and occupation area of equipment and cost of equipment greatly thereupon, the adaptability of prior art is restricted.Though Way by Brush Plating Technique can be electroplated large-scale and large-area workpiece, because the metal that brush plating is plated is not to derive from electrode, but derive from plating bath, thereby make galvanized cost higher, effect is lower.Because brush plating does not have electroplate liquid or circulation of elecrolyte to supply with, and can not effectively take away the heat and the accessory substance of generation, thereby difficulty is used for electrolysis.
The clear 63-153293 of Japanese Patent JB has provided the method for a parcel plating, its method is that a bell cavity configuration is set, a flaring cavity electrodes is set in bell cavity configuration, bell cavity is placed on the workpiece surface to form an annular seal space that holds electroplate liquid.This method is arranged on higher position with the reservoir of electroplate liquid, electroplate liquid in the reservoir relies on the deadweight of liquid to inject and be full of bell annular seal space by pipeline, from tubaeform cavity electrodes, the electroplate liquid extraction is returned to the elevated reservoir by pipeline with pump again, thereby realize the circulation of electroplate liquid, and between electrode and workpiece, connect power supply simultaneously, reach the purpose of parcel plating in bell annular seal space.Though this method can reach the purpose of parcel plating, there is following shortcoming:
1. the scope of application is restricted: the method that the clear 63-153293 of Japanese Patent JB provides comes down to be provided with a small-sized electrolytic plating pool on the galvanized workpiece of need, at the bottom of workpiece promptly is the pond.Because electroplating is to carry out in bell cavity, the edge that bell cavity contacts with workpiece must seal, otherwise electroplate liquid leaks and can't electroplate.Therefore, this method only is applicable to the local surfaces that the brilliance of electroplating parts is smooth, is unsuitable for electroplating the workpiece surface of coarse and non-flat shape, because the workpiece surface of coarse and non-flat shape sealing difficulty.
Carry out owing to electroplate in the bell chamber of sealing, after being full of electroplate liquid in the annular seal space, just can only carry out closed circulation, make annular seal space become the space and electroplate liquid can not be drawn back the elevated reservoir.Only a feed liquor switch is installed and is closed this switch on the pipeline of annular seal space conveying electroplate liquid at the elevated reservoir, an air inlet switch is installed and is opened this switch at the top of annular seal space, electroplate liquid just can be pumped back and be located at the elevated reservoir.Because electroplate liquid can produce buoyancy to bell cavity, bell cavity is lifted by buoyancy simultaneously, electroplate liquid runs off, and this just needs a device to come bell cavity is exerted pressure, to guarantee bell cavity edge effective seal.According to above-mentioned, the method that the clear 63-153293 of Japanese Patent JB provides is unsuitable for electrode is electroplated to move the method that covers on workpiece.Because, if come electroplating parts to move the method that covers with electrode, moving repeatedly at the uniform velocity done on the surface that electrode must cover workpiece, or do extremely of short duration---several seconds even several milliseconds of frequent the moving that clock stops, frequently move through electrode, cover workpiece repeatedly, just can make whole electrolytic coating comparatively even.But the method for the clear 63-153293 of Japanese Patent JB needs to disconnect electroplating power supply, the electrolytic solution of finding time before moving bell cavity, thereby bell cavity can not be electroplated in moving; Because the restriction of this method and structure, move once bell cavity must finish disconnect electroplating power supply, close the feed liquor switch, open the air inlet switch, with electroplate liquid draw back reservoir, remove pressurization to bell cavity, move bell cavity to the another location, pressurize for bell cavity, close the air inlet switch, open the feed liquor switch electroplate liquid is injected annular seal space, opens electroplating power supply totally 10 algorithms, obviously be unsuitable for bell cavity is frequently moved, thereby be unsuitable for the moving method that covers of electricity consumption Ghandler motion and carry out electroplating activity.Since this method is unsuitable for moving with electrode the method for covering and electroplates, electroplate large-scale workpiece so or carry out the just necessary bell cavity of shape and pressurization facility and seal approach greatly accordingly made accordingly of large-area electroplating, thereby increased expense greatly, made its difficulty be applied to electroplate large-scale workpiece or carry out large-area electroplating.As can be seen, the parcel plating method that the clear 63-153293 of Japanese Patent JB provides only is applicable to carries out the disposable electroplating activity of finishing to the part of specific batch workpiece in galvanized mode in the annular seal space, then need make the devices such as annular seal space that adapt with this workpiece to another batch workpiece and electroplate.
The method of the clear 63-153293 of Japanese Patent JB is owing to the edge of bell cavity when electroplating must contact and keep sealing with the surface of workpiece, thereby the periphery of workpiece surface must stay certain edge and bell cavity keeps in touch and seals, otherwise electroplate liquid will run off and can't electroplate.But so just can not electroplate out a full surface of workpiece, workpiece surface is used for just can't electroplating for the part of bell cavity contact, sealing, more can not electroplate all surfaces of three-dimensional workpiece certainly.
2. complex structure: the parcel plating method that adopts the clear 63-153293 of Japanese Patent JB to provide is electroplated, bell cavity must be arranged, the top of bell cavity must be the sealing with the non-leaking electroplate liquid, the edge of bell cavity bottom must adapt with the size and the shape of workpiece or plate surface.Because electroplate liquid is that power flows into annular seal space with the deadweight by a high position, this annular seal space is sealed to form by bell cavity and workpiece surface, thereby bell cavity bottom edge must be provided with flexible sealing.Because electroplate liquid will inevitably produce bigger buoyancy bell cavity is floated by being arranged on the annular seal space that the elevated reservoir injects low level, and the pressurization facility to bell cavity must be set, just can make bell cavity sealing.These are its baroque performances.
3: operation inconvenience: because bell cavity and workpiece have formed an annular seal space, after being full of electroplate liquid in the annular seal space, just can only carry out closed circulation, make annular seal space become the space and electroplate liquid can not be drawn back the elevated reservoir.And when once electroplate finish after, just electroplate liquid must be drawn back the elevated reservoir to make annular seal space become the space, so that electroplate next time.Can on the pipeline of annular seal space conveying electroplate liquid, a feed liquor switch be installed and close this switch at the elevated reservoir, an air inlet switch is installed and be opened this switch, electroplate liquid is evacuated to the elevated reservoir by pump at the top of annular seal space.Even like this, electroplate liquid can not all be drawn back reservoir by pump, and the surplus liquid in electroplate liquid between electrode and the workpiece and the pump line just can not be drawn back reservoir, and can only flow out from bell cavity.Like this, method according to the parcel plating of the clear 63-153293 of Japanese Patent JB, whenever move once bell cavity all must finish disconnect electroplating power supply, close the feed liquor switch, open the air inlet switch, with electroplate liquid draw back reservoir, remove pressurization to bell cavity, move bell cavity to the another location, pressurize for bell cavity, close the air inlet switch, open the feed liquor switch electroplate liquid is injected annular seal space, opens electroplating power supply totally 10 algorithms, brought inconvenience to operation.
The objective of the invention is to provide the moving workpiece that covers of a kind of simple in structure, applied widely, easy to operate, electricity consumption Ghandler motion to electroplate or electrolytic method and apparatus.
The object of the present invention is achieved like this: will electroplate or the combination of electrolytic electrode and an isolator, and make electrode can not touch workpiece and form short circuit.Electrode links to each other with electroplating power supply with flexible lead, and electrode can arbitrarily be moved.The other end of electroplating power supply is also linked to each other with workpiece with flexible lead.With mechanical force be used as power (preferably pump) constitute to electroplate (or electrolysis) liquid circulation supply equipment, the drain pipe of electroplating (or electrolysis) liquid circulation supply equipment is a flexible pipe, so that liquid outlet moves with electrode.Workpiece is placed on the work stage dish, connect electroplating power supply, electrode is positioned on the workpiece.Electroplate (or electrolysis) liquid circulation supply equipment and will electroplate (or electrolysis) liquid recycle stream and move between electrode and workpiece, continuously outflow from the bottom of electrode insulation body, conducting electric current between electrode and workpiece reaches plating or electrolytic purpose.Traveling electrode covers required plating or electrolytic position one by one, has just realized electroplating the purpose of large-scale workpiece.To need not electroplate or electrolytic position covers with insulant, can carry out parcel plating or electrolysis easily.
Because the present invention moves between electrode and workpiece plating (or electrolysis) liquid recycle stream, continuously outflow and the conducting electric current from the bottom of electrode insulation body, make electrode not need to place annular seal space, do not need tightness system and pressurizing device, feed liquor switch, air inlet switch, thus simple in structure, in light weight.
The present invention moves between electrode and workpiece owing to electroplating (or electrolysis) liquid recycle stream, flow out and the conducting electric current from the bottom of electrode insulation body, make electrode not need to place annular seal space, thereby can when traveling electrode, not interrupt the circulation of electroplating power supply and plating (or electrolysis) liquid and carry out non-stop run, and because simple in structure, in light weight, electrode can arbitrarily move, and can electroplate or electrolysis with the method for traveling electrode covering workpiece easily; Because cover the method for workpiece electroplates or electrolysis with traveling electrode, thereby it is applied widely, can electroplate or the workpiece on the coarse workpiece of electrolytic surface and some non-flat shape surfaces, can electroplate or the full surface of electrolysis workpiece and all surfaces of three-dimensional workpiece, can electroplate or large-area workpiece of electrolysis and large-scale workpiece with bantam.
The present invention is not because electrode needs to place annular seal space, do not need control or handle tightness system, pressurizing device, feed liquor switch and air inlet switch, and owing to simple in structure, in light weight, electrode can arbitrarily move, need not interrupt the circulation of electroplating power supply and plating (or electrolysis) liquid during traveling electrode and carry out non-stop run, thereby traveling electrode covers required plating or electrolytic position easily, and is easy and simple to handle.Owing to can electroplate or the electrolysis large-scale workpiece, the adaptability of bantam is increased in addition, save equipment funds, electric load and work-yard with bantam.
The present invention has 2 width of cloth accompanying drawings, and Fig. 1 is device structure of the present invention and technical schematic diagram, and Fig. 2 is the constitutional diagram of the electrode insulation body of electrode and another kind of form.
Below in conjunction with the description of drawings embodiments of the invention: as shown in Figure 1, electrode 4 is combined with electrode insulation body 1, electrode insulation body 1 can be made container-like, the many holes 3 that can flow through liquid are arranged at the bottom, electrode 4 can be a tabular metal, and 1 of electrode insulation body maintains a certain distance, and makes liquid can flow into the bottom of electrode insulation body 1 from the periphery of electrode 4.Also many holes can be arranged above the electrode 4, liquid can arrive the surface of workpiece 7 through the hole 3 of the orifice flow on the electrode 4 on electrode insulation body 1.Be connected with flexible lead 12 between electrode 4 and the electroplating power supply 11, so that electrode arbitrarily moves.Handle 5 is arranged on the electrode insulation body 1 move so that grip.Pump 10 and liquid-inlet pipe 9, drain pipe 2, reservoir 14 have been formed plating (or electrolysis) liquid circulation supply equipment.Down, electroplating power supply 11 usefulness flexible leads 12,13 are connected with workpiece 7 with electrode 4 in working order.Electroplate (or electrolysis) liquid 8 and deliver to drain pipe 2 by pump 10, flow in the electrode insulation body 1, arrive the surface of workpiece 7 again by the orifice flow on the electrode 4 through the hole 3 of electrode insulation body 1 bottom through liquid-inlet pipe 9.Electrode insulation body 1 and workpiece 7 are kept suitable distance, electroplate (or electrolysis) liquid and will be communicated between electrode 4 and the workpiece 7, the conducting electric current reaches and electroplates or electrolytic purpose.Electroplate (or electrolysis) liquid simultaneously and continuously outflow from the bottom of electrode insulation body 1 again, flow back in the reservoir 14 through work stage dish 6 then, flow in the electrode insulation body 1 through liquid-inlet pipe 9, pump 10, drain pipe 2 again, formed continuous circulation and supplied with.Gripping handle 5 covers the position (i.e. the position that does not cover with insulant) that needs to electroplate (or electrolysis) on workpiece 7 or the workpiece 7 one by one, can realize large-area or partial plating or electrolysis.
In Fig. 2, the electrode insulation body 1 of another kind of form is lower ending opening, upper end closed.Afterbody is a handle 5.Electrode 4 devices link to each other with electroplating power supply 11 with flexible lead 12 in electrode insulation body 1.2 mouthfuls of devices of drain pipe in electrode insulation body 1 electrode 4 below.When electroplate liquid or electrolytic solution fill, are communicated between electrode 4 and the workpiece 7, can the conducting electric current, reach and electroplate or electrolytic purpose.2 mouthfuls of drain pipes can certainly be arranged on the top of electrode 4 in the electrode insulation body 1, but need on electrode 4, aperture to be set, or leave the room, flow through so that electroplate (or electrolysis) liquid at the periphery of electrode 4.Device shown in Figure 2 is not only applicable to the workpiece water planar and electroplates or electrolysis, is applicable to plating or electrolysis on vertical surface and other profile yet.
Claims (4)
1. traveling electrode is electroplated electrolyzer, be a kind ofly to be used to electroplate or the equipment of electrolytic metal, mainly by electroplating power supply, electrode, electrode insulation body and electroplate liquid or circulation of elecrolyte feedway are formed, one end of electroplating power supply is connected with electrode, the other end is connected with workpiece, it is characterized in that electrode (4) and electrode insulation body (1) combination, be short-circuited between electrode and the workpiece avoiding, the top of electrode insulation body (1) can be the sealing also can be the structure of not sealing, the drain pipe of electroplate liquid or circulation of elecrolyte feedway (2) mouth can be entered in the electrode insulation body (1) by the position that the top of electrode insulation body (1) is not sealed, so that electroplate liquid or electrolytic solution are by in drain pipe (2) mouthful inflow electrode insulation body (1);
Electrode insulation body (1) only communicates with a pipeline, this pipeline only is used for carrying liquid in the electrode insulation body, electrode insulation body (1) is connected with the drain pipe (2) of electroplate liquid or circulation of elecrolyte feedway, and the liquid-inlet pipe (9) of electroplate liquid or circulation of elecrolyte feedway is connected with reservoir (14);
The reservoir of electroplate liquid or circulation of elecrolyte feedway (14) is arranged on the position that is lower than workpiece machining surface, so that the liquid level of electroplate liquid in the reservoir or electrolytic solution is lower than the finished surface of workpiece, liquid-inlet pipe (9) mouth is arranged in electroplate liquid or the electrolytic solution (8);
In the time of in working order, connect electroplating power supply between workpiece (7) and the electrode (4) and start electroplate liquid or electrolyte circulation means, the electroplate liquid or the electrolytic solution (8) that are lower than workpiece (7) surface constantly flow in the electrode insulation body (1) through liquid-inlet pipe (9), drain pipe (2), and be communicated between electrode (4) and the workpiece (7), conducting electric current between electrode and workpiece, bottom from electrode insulation body (1) continuously outflows again, is back in the reservoir (14);
Drain pipe (2) mouth is arranged on the top of electrode (4) in the electrode insulation body (1), after electroplate liquid or electrolytic solution flow into the electrode insulation body, flow between electrode and the workpiece the hole from electrode, or between the periphery inflow electrode and workpiece of electrode, and be communicated between electrode and the workpiece, make current lead-through;
Drain pipe (2) mouth is arranged on the below of electrode (4) in the electrode insulation body (1), and electroplate liquid or electrolytic solution flow directly between electrode and the workpiece, and fill, are communicated between electrode and the workpiece after flowing into electrode insulation body (1), make current lead-through.
2. traveling electrode according to claim 1 is electroplated electrolyzer, it is characterized in that the many holes that can flow through liquid are arranged at the bottom of electrode insulation body (1).
3. traveling electrode according to claim 1 is electroplated electrolyzer, it is characterized in that on the electrode (4) many holes that are used to flow through electroplate liquid or electrolytic solution being arranged.
4. traveling electrode is electroplated electrolysis tech, it is the method for a kind of plating or electrolytic metal, it is characterized in that the electric current between electrode (4) and the workpiece (7) is that electroplate liquid or the electrolytic solution that circulates comes conducting, what stop electroplate liquid or electrolytic solution circulates then that the electric current between the electrode (4) and workpiece (7) disconnects
Workpiece (7) is to be placed on outside electroplate liquid or the electrolytic solution in plating or electrolytic process, rather than be immersed in electroplate liquid or the electrolytic solution, the liquid level of electroplate liquid in the reservoir or electrolytic solution (8) is lower than the finished surface of workpiece (7), electroplate liquid or electrolytic solution (8) are carried by mechanical force, through liquid-inlet pipe (9), drain pipe (2) flows in the electrode insulation body (1), constantly flow between electrode (4) and the workpiece (7) from the top of electrode (4) or the below of electrode (4), and be communicated between electrode and the workpiece and the conducting electric current, electroplate liquid or electrolytic solution continuously outflow from the bottom of electrode insulation body (1), electroplate liquid that continuously outflows from the bottom of electrode insulation body or electrolytic solution flow back to the reservoir (14) by the deadweight of liquid, full cycle is a successive, under the working order of traveling electrode, do not need to interrupt the circulation of electroplate liquid or electrolytic solution yet
Electroplate or be to move that covering workpiece (7) is electroplated or electrolytic during the electrolysis workpiece, electroplate or do not need to interrupt the circulation of electroplating power supply and electroplate liquid or electrolytic solution during electrolysis in traveling electrode with electrode (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98104621A CN1093570C (en) | 1998-01-08 | 1998-01-08 | Electroplating and electrolyzing technology and equipment with moveable electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98104621A CN1093570C (en) | 1998-01-08 | 1998-01-08 | Electroplating and electrolyzing technology and equipment with moveable electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1214377A CN1214377A (en) | 1999-04-21 |
| CN1093570C true CN1093570C (en) | 2002-10-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98104621A Expired - Fee Related CN1093570C (en) | 1998-01-08 | 1998-01-08 | Electroplating and electrolyzing technology and equipment with moveable electrode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1093570C (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102492975A (en) * | 2011-12-30 | 2012-06-13 | 中国科学院力学研究所 | Apparatus for growing ceramic coating by electrolyte injection discharge and method thereof |
| CN104264200B (en) * | 2014-10-29 | 2017-07-04 | 中国人民解放军装甲兵工程学院 | Micro arc oxidation treatment device and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63153293A (en) * | 1986-12-17 | 1988-06-25 | Chugoku Denka Kogyo Kk | Surface treatment of work |
| CN1111293A (en) * | 1994-05-06 | 1995-11-08 | 荆瑞年 | Cyanogen-free electroplating machine |
-
1998
- 1998-01-08 CN CN98104621A patent/CN1093570C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63153293A (en) * | 1986-12-17 | 1988-06-25 | Chugoku Denka Kogyo Kk | Surface treatment of work |
| CN1111293A (en) * | 1994-05-06 | 1995-11-08 | 荆瑞年 | Cyanogen-free electroplating machine |
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| Publication number | Publication date |
|---|---|
| CN1214377A (en) | 1999-04-21 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| C14 | Grant of patent or utility model | ||
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| IP01 | Partial invalidation of patent right |
Decision date of declaring invalidation: 20051031 Decision number of declaring invalidation: 7873 Case number: 4W00982 Conclusion of examination: On the basis of the revised claim submitted by the patent owner, claim No. 98104621.5 of the invention patent No. 3 is invalid, and the rights requirements 1 and 2 shall be maintained. Decision date: 20051031 Denomination of invention: Mobile electrode electroplating electrolysis technology and equipment Granted publication date: 20021030 Int.cl.7: C25D5/04 Patentee: Lu Xuhui Review decision number: Number 7873rd |
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| C19 | Lapse of patent right due to non-payment of the annual fee | ||
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